TITLE:
Product Specification for HS-W1
Contents
1 Appearance ...................................................................................................................... 3
2 Product dimensions & ID ................................................................................................ 4
3 Electrical section ............................................................................................................. 5
3.1 Physical Characteristics ..................................................................................................................................................... 5
3.2 Hardware Description ........................................................................................................................................................ 5
3.3 Functionality ...................................................................................................................................................................... 5
3.4 ASSEMBLY REQUIREMENTS ....................................................................................................................................... 6
3.4.1 Electrical Specifications ............................................................................................................................................ 6
3.5 Tone MMI ......................................................................................................................................................................... 7
3.6 RF ...................................................................................................................................................................................... 7
4 Acoustic ........................................................................................................................... 8
4.1 Audio Performance – General Information ....................................................................................................................... 8
4.2 Audio Performance ............................................................................................................................................................ 9
4.2.1 Summary of key audio parameters ............................................................................................................................ 9
4.2.2 Max allowed SPL @ ERP ....................................................................................................................................... 10
4.2.3 Receive THD ........................................................................................................................................................... 10
4.2.4 Idle receive noise (dBA) ......................................................................................................................................... 11
4.2.5 Send path ................................................................................................................................................................. 11
4.2.6 SLR ......................................................................................................................................................................... 11
4.2.7 Send mask ............................................................................................................................................................... 11
4.2.8 Send THD ............................................................................................................................................................... 13
4.2.9 Idle send noise ......................................................................................................................................................... 13
4.2.10 cho performance .................................................................................................................................................... 14
5 Reliability ....................................................................................................................... 15
本文件為美律實業股份有限公司專有之財產,非經書面許可,不准透露或使用本資料,亦不准複印,複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
TITLE:
Product Specification for HS-W1
Change history
本文件為美律實業股份有限公司專有之財產,非經書面許可,不准透露或使用本資料,亦不准複印,複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
TITLE:
Product Specification for HS-W1
1 APPEARANCE
本文件為美律實業股份有限公司專有之財產,非經書面許可,不准透露或使用本資料,亦不准複印,複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
TITLE:
Product Specification for HS-W1
Headset
1. HEADBAND
2. R_HEADBAND_COVER
3. L_Headband_COVER
4. HEADBAND_FOAM
5. L_SLIDE_HOLDER_F
6. L_SLIDE_HOLDER_B
7. L_SLIDE_HOLDER_RING
8. L_EARCUP_HOLDER_F
9. L_EARCUP_HOLDER_B
10. L_EARCUP_HOLDER_RING
11. MIC_BOOM_F
12. MIC_BOOM_B
13. MIC_BOOM_LEDLENS
14. MIC_BOOM_COVER
15. L_ASUS_LOGO
16. MIC_FOAM_F
17. MIC_FOAM_B
18. L_EARCUP
19. L_EARCUP_COVER
20. L_EARCUP_FOAM
21. R_SLIDE_HOLDER_F
22. R_SLIDE_HOLDER_B
23. R_SLIDE_HOLDER_RING
24. R_EARCUP_HOLDER_F
25. R_EARCUP_HOLDER_B
26. R_EARCUP_HOLDER_RING
27. R_EARCUP_HOLDER_B_COVER
28. R_EARCUP_HOLDER_COVER
29. R_ASUS_LOGO
30. POWER_LEDLENS
31. POWER_KEY
32. R_EARCUP
33. R_EARCUP_COVER
34. R_EARCUP_FOAM
35. Dongle_UPPER_HOUSING
36. Dongle_BOTTOM_HOUSING
2 PRODUCT DIMENSIONS & ID
本文件為美律實業股份有限公司專有之財產,非經書面許可,不准透露或使用本資料,亦不准複印,複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
TITLE:
Product Specification for HS-W1
3 ELECTRICAL SECTION
3.1 Physical Characteristics
1. Indicator Lights: Provides a visual cue regarding the status of the headset
2. Power ON/OFF switch: Push button to turns headset on and off
3. Volume Control Buttons: Adjusts the speaker (receiver) volume
4. Micro-USB power connector: Allows connection to PC USB only for charging.
5. Boom Switch: Swim down to enable MIC.
3.2 Hardware Description
The Headphones contains a 2.4G module, battery, and acoustic transducers for audio
communication via the RF link to a PC or NB. A LED provides visual feedback to the users
and others about the status of the headphones. There are two user interface regions, left and
right sides, to operate all control features of the headphones, rotating boom switch, volume up
and down.
3.3 Functionality
RIGHT SIDE
Volume Control: Increase and decrease volume buttons. (volume mute a bit,pop up noise,
reset way)
Power On/Off&Pairing mode&HW reset : multi-function button
Press 2 sec Power On/Off
Press 5 sec enter pairing mode
Press 10 sec HW Reset
LED: Indicate the status of headset.
Power LED: Dual Color LED, RED and GREEN.
Green LED flash slowly in no-pairing mode.
Green LED turns on constant and turns off after 3min. when handset pairs success.
Green LED flash quickly when handset is pairing.
Red LED turns on constant when handset is charging.
本文件為美律實業股份有限公司專有之財產,非經書面許可,不准透露或使用本資料,亦不准複印,複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
TITLE:
Product Specification for HS-W1
100mA (min.), 250mA (max) Note the max current is the maximum
current allowed by the device during loss of charge control. This
loss of charge control constitutes a single fault condition of the
device. The device shall limit the current by some means to this
max limit.
LEFT SIDE
.
Red LED turns off when battery finishes charging.
Red LED flash slowly when handset is on low-battery mode.
Red LED flash quickly when handset is error charging(Charge Suspend for temperature,
Timer Fault, Input power overvoltage, Battery short).
Boom Switch: Rotate boom down to enable the MIC and pick up skype-in
RED LED: RED LED turns on when MIC enabled.
3.4 ASSEMBLY REQUIREMENTS
3.4.1 Electrical Specifications
3.4.2 Battery Specifications (For Reference Only)
3.4.3 Input requirements
本文件為美律實業股份有限公司專有之財產,非經書面許可,不准透露或使用本資料,亦不准複印,複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.