Asus B1A Service Manual A6

B1A Hardware Technical Specification (Rev. 1.0)

Hardware Specifications

Get to know more about the B1 Series Notebook
with a detailed look at the hardware specifications.

ach item has its individual usage for you to understand the hardware

side of the notebook’s architecture.

E

Chapter

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B1A Hardware Technical Specification (Rev. 1.0)

Revision History:

DATE VERSION DESCRIPTION SECTION REMARK

Feb 2001 1.0 Initial Specification

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B1A Hardware Technical Specification (Rev. 1.0)

1. MARKETING SPEC. ..........................................................................................................................6

2. CHIPSET LIST.................................................................................................................................. 11

2.1. CPU......................................................................................................................................... 11

2.2. CHIPSET (TWISTER)-----NORTH-BRIDGE+GRAPHICS CHIP ......................................................12

2.3. DRAM MEMORY ....................................................................................................................12

2.3.1. EXPANSION MEMORY......................................................................................................12

2.4. BIOS ROM...............................................................................................................................13

2.5. SOUTH BRIDGE(VT8231)-----SOUTH-BRIDGE+SUPER I/O.........................................................13

2.6. CARDBUS CONTROLLER(OZ711E1)...........................................................................................13

2.7. EMBEDDED CONTROLLER(NS591) ............................................................................................14

2.9. AUDIO CODEC ‘97(CS4299)...................................................................................................14

2.10. AUDIO AMPLIFIER................................................................................................................... 15

3. KEY PARTS LIST ..............................................................................................................................16

3.1. DISPLAY ................................................................................................................................... 17

3.2. HARD DISK DRIVE ...................................................................................................................17

3.3. CD-ROM DRIVE......................................................................................................................18

3.4. DVD-ROM DRIVE .................................................................................................................. 18

3.5. TOUCH PAD ..............................................................................................................................18

3.6. KEYBOARD ..............................................................................................................................19

3.7. BATTERY..................................................................................................................................19

3.7.1. Main Battery.......................................................................................................................19

3.7.2. RTC Backup Battery ........................................................................................................... 19

3.8. AC/DC ADAPTER(ADP-60DB)----DELTA..............................................................................20

4. SYSTEM...........................................................................................................................................21

4.1. SYSTEM DIAGRAM................................................................................ 錯誤! 尚未定義書籤。

4.2. MAIN COMPONENTS BLOCK DIAGRAMS .......................................................................................21

4.3. SYSTEM RESOURCE ....................................................................................................................22

4.3.1. IRQ Map ............................................................................................................................. 22

4.3.2. PCI INT map.......................................................................................................................22

4.3.3. PCI bus master map ...........................................................................................................22

4.3.4. IDSEL .................................................................................................................................23

5. I/O PORT PIN ASSIGNMENT ..........................................................................................................24

5.1. CRT .........................................................................................................................................24

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B1A Hardware Technical Specification (Rev. 1.0)

5.2.

HARD DISK PIN ASSIGNMENT ......................................................................................................25

5.3. LCD PIN ASSIGNMENT ...............................................................................................................26

5.4. INTERNAL KEYBOARD PIN ASSIGNMENT .......................................................................................26

5.5. INTERNAL TOUCH PAD PIN ASSIGNMENT .....................................................................................27

5.6. BATTERY PIN ASSIGNMENT(JP29/JP28)......................................................................................28

5.7. DC IN JACK PIN ASSIGNMENT.....................................................................................................28

5.8. AUDIO JACK..............................................................................................................................28

5.8.1. HEADPHONE JACK..........................................................................................................28

5.8.2. MICROPHONE JACK........................................................................................................29

5.9. INVERTER PIN ASSIGNMENT ........................................................................................................ 29

5.10. LAN CONNECTOR PIN ASSIGNMENT...........................................................................................29

5.11. MODEM CONNECTOR PIN ASSIGNMENT......................................................................................29

6. POWER MANAGEMENT ................................................................................................................. 30

6.1. SYSTEM POWER PLAN ................................................................................................................. 30

6.2. POWER MANAGEMENT MODE .....................................................................................................30

6.2.1. Full-On mode......................................................................................................................30

6.2.2. Doze mode ..........................................................................................................................30

6.2.3. Stand by mode.....................................................................................................................30

6.2.4. Suspend to RAM mode (STR)..............................................................................................31

6.2.5. Suspend to disk mode (STD)............................................................................................... 31

6.2.6. Mechanical off mode (MOFF)............................................................................................31

6.3. PMU MODE TRANSITION EVENT .................................................................................................32

6.3.1. Lid switch............................................................................................................................33

6.3.2. Power button ......................................................................................................................33

6.4. DEVICE POWER MANAGEMENT................................................................................................... 34

6.4.1. Device PM control during STR mode.................................................................................35

6.4.2. Device PM control during STD mode.................................................................................36

7. MODULE SPECIFICATION............................................................................................................37

7.1. OVERALL SYSTEM ...................................................................................................................... 37

7.1.1. Board Assembly ..................................................................................................................37

7.1.2. Modules .............................................................................................................................. 37

7.2. MAIN BOARD ............................................................................................................................. 38

7.2.1. Main system module spec .............................................................................. 38

7.2.2. DC/DC spec...........................................................................................................39

7.2.3. Charger Spec........................................................................................................39

7.3. INVERTER BOARD ...................................................................................................................... 40

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B1A Hardware Technical Specification (Rev. 1.0)

7.4.

ADAPTER SPEC(DELTA-----ADP-60DB)...................................................................................40

7.4.1. Input....................................................................................................................................40

7.4.2. Output.................................................................................................................................40

7.4.3. Protection ...........................................................................................................................41

7.5. BATTERY SPEC ...........................................................................................................................41

MODEM SPEC. .........................................................................................................................................42

8. MISCELLANEOUS...........................................................................................................................43

8.1. INDICATORS ..............................................................................................................................43

8.2. POWER CORD LIST .....................................................................................................................44

8.3. SAFETY/ EMI APPLIANCE:.........................................................................................................44

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B1A Hardware Technical Specification (Rev. 1.0)

1. Marketing spec.

B1A Specification

Product Family B1A
Dimension 329X269X32mm(WXDXH)
Weight ~3.3Kg(Total system)
Color Silver
CPU Type Intel PIII w/256K/

Celeron w/128K

Speed PIII:700Mhz~1GMHz

Celeron:600~800MHz

Package Intel uPGA2 socketable
L2 Cache YES
Size 128 or 256 KB
Type PBSRAM
Memory Type SDRAM
Expansion Memory 256MB(Max.) SO-DIMM x 2 Slots
LCD Size 15.0” 15.0"
Resolution XGA SXGA+
Panel Type TFT TFT
Contrast Control None
Brightness Control Hot-key Control
HDD type 2.5" /9.5mm
Ultra DMA/33 or 66 YES with SMART supported
Size 10/20/30 GB
CD-ROM/DVD/CD-RW

(5.25” 12.7mm)
Chip Set VIA

North Bridge

(Including Graphics
chip)

South Bridge

(Including Super I/O
controller)

KBC NS87591(National

ROM 256k X 8

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24X CD-ROM/ 8X DVD/

4X CD-RW

Twister

VT8231

Semiconductor)

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B1A Hardware Technical Specification (Rev. 1.0)

Graphic Accelerator

(S3 Savage4 exists in
Twister chip)

3D Single cycle 128-bit 3D

S3 Savage4

architecture

Controller S3 Savage4
Package

(Twister)

552 balls(35X35mm)

(Twister)

AGP Support 4X AGP
Video Memory Share Memory Architecture
TV(CHRONTEL 7009) YES , one S-Video port
PCMCIA O2Micro
Slot Type Type II x 2 or Type III X1
Controller OZ711E1
Card Bus Yes
ZV port Yes
Sound System

(Sound chip exists in
South Bridge VT8231)

Compatibility Hardware Sound Blaster Pro
FM synthesizer Yes
Speaker Stereo
PC99 Yes
Audio Amplifier Philips TDA8552TS

(2 X1.4W)

Mic Mono
Modem + LAN

(Using Mini-PCI Combo

Modem + LAN(Combo Card)
Card solution)
Modem(Combo Card) ESS Z2

Controller N/A(Depends on vendors)
Spec 56K
Jack RJ11
ACPI Yes
V.90 Yes
Wake-up on ring Yes
LAN(On Combo Card) ESS Z2
Jack RJ 45
Wake on LAN Yes
Controller N/A(Depends on vendors)
Internal Keyboard

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B1A Hardware Technical Specification (Rev. 1.0)

Vendor JME Color = Slate Gray

2

Key 88 Keys(W/Z MS-Windows

function keys)

Function Key 12 Function Keys
Hot Key Function 11 Hot Keys
Suspend To RAM Fn + F1 Suspend Switch
Programmable App2 Fn + F3
Programmable App3 Fn + F4
Brightness Up Fn + F5
Brightness Down Fn + F6
LCD only Fn + F7
LCD/CRT Switch Fn + F8
TV only Fn + F9
PC Speaker Mute Fn + F10 Mute/Un-Mute
PC Speaker Volume Fn + F11 Volume Up
PC Speaker Volume Fn + F12 Volume Down
Instant Keys
E-mail Direct button
Internet Browser Direct button
M-Mode

(Special function
for longer battery life)

Direct button

Programmable App1 Direct button
Status Indication LEDs (Machine Base** x6)

Power Status* Yes (Green when Power on.

Flash (1Hz) when in SUSPEND

mode. Off when power off.)

Battery Charge

Status

Yes ( ON: orange when

charging, Blinking: when battery

low.; OFF: when battery is

absent or fully charged.)

HDD/CD-ROM LED Yes (green while accessing)
Caps Lock LED Yes (green)
Number Lock LED Yes (green)
Scroll Lock LED Yes (green)
Audio Mute lndicator Yes(green)
M-Mode Indicator Yes(green)
Pointing Device

Built-In Touch Pad(Synaptics)

Glide Pad Yes
Right Button Yes
Left Button Yes

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B1A Hardware Technical Specification (Rev. 1.0)

Scroll up button Yes
Scroll down button Yes
Function Control
Power On Button Yes
Lid Switch Yes
Sound Volume Yes (Uses VR)
I/O Port
CRT Yes (15p D-sub)
PS/2 Mouse and/or

Yes (Y-Cable)

K/B

IrDA Port SIR/FIR Support X1
Fax/Modem Yes X1
COM port Yes X1
LAN JACK Yes X1
Line Out Jack Yes/Stereo X1
Mic In Jack Yes/Mono X1
S/PDIF Jack Yes X1
USB port Yes 2 Ports.
LPT port Yes X1
S-Video Port Yes X1
IEEE-1394 Port Yes X1(On daughter

Board)

DC-In Yes X1
Heat Solution
Heat Sink Yes

FAN Support Yes
AC Adaptor Yes
Input AC 90-270V 47/63Hz
Output DC 19V , 3.1A, ~60W
Battery Pack 9 Cells

Type Li-ION(5400mAH/~60W)
1st Battery Li-Ion
2nd Battery Yes
Charging time Smart Battery Charger
Machine ON ~2.5Hrs(85% up) (estimative value)
Machine OFF ~2 Hrs(85% up) (estimative value)
Battery Life Li-ION (1800mAH)
Estimative value ~2.5 Hrs. Depends on testing

environment/AP

Power Management Insyde
Suspend/Resume Yes

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B1A Hardware Technical Specification (Rev. 1.0)

LCD Close/Open Yes
Hibernation (S2D) Yes
Thermal Control Yes
ACPI Yes
Security
Password Yes, BIOS booting user

password protection

Finger-Print security

(Option)

Option

Security Lock Kensington Lock Hole
S/W
Install OS ME/2000/XP
Flash BIOS Yes 2M(256KX8)
Drivers
CDROM Driver Yes
PCMCIA Driver Yes
AUDIO Driver Yes
VIA chipsets Driver

Yes

(4-in-1 Driver)

Glide Pad Driver Yes
Modem+LAN Driver

Yes

(Combo Card)

LOGO
Microsoft PC99 Yes
Winkey Yes

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B1A Hardware Technical Specification (Rev. 1.0)

2. Chipset List

Chipset Summary Table.

Function B1A HW ACPI/PC98

CPU Intel PIII/ Celeron Not required

SRAM (L2 Cache) Pipeline Burst SRAM (On-die)

PIII(256KB)/Celeron(128KB)

Core Logic

Twister YES

(N/B+VGA)

MEMORY SDRAM Not required

BIOS ROM 2M(256KX8) Not required

Not required

Core Logic

VT8231 YES

(S/B+SIO+Audio+

S/FIR)
PCMCIA O2Micro OZ711E1 YES

AUDIO CODEC Crystal CS4299 YES

AUDIO AMPLIFIER Philips TDA8552TS Not required

KB CONTROLLER NS87591 YES

IEEE-1394 On Daughter Board YES

LAN+MODEM
(Combo Card)

N/A
(Depends on vendors)

YES

2.1. CPU

Processor compatibility:
Type :
Processor frequency:
Construction method:
Supply voltage:
Function feature:

Intel Pentium III CPU
Pentium III (256K)/ Celeron (128K) L2 cache
PIII: 700/~1GhzMHz; Ce: 600~800 MHz

μ-PGA2

Core:1.6V~1.7V /1.35

1. Integrated L2 cache (128k/256k)

2. Integrated thermal 1 diode

3. Low-power GTL+ processor system bus

4. 0.18u process technology

5. High performance with lower power consumption.

6. Speedstep Technology support

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B1A Hardware Technical Specification (Rev. 1.0)

2.2. CHIPSET (Twister)-----North-Bridge+Graphics Chip

Function:

Vendor:
Parts Number:
Package:

1. High performance SMA North Bridge:Integrated
VIA Apollo Pro133A and S3 Savage4 in a single
Chip.

2. 64-bit advanced memory controller supporting
PC100/PC133 SDRAM and VCM.

3. 66/100/133Mhz CPU Front Side Bus(FBS).

4. Integrated Savage4 2D/3D Video Accelerator.

5. Optimized share memory Architecture(SMA)
For Video Memory.

6. Full internal AGP 4X performance.

7. High quality DVD video playback.

8. Integrated 2-channel 110Mhz LVDS interface.

9. ACPI 1.0 and PCI Bus Power Management 1.1
Compliant.

10. 2.5V Core and Mixed 3.3V/5V Tolerant and GTL+
I/O.

VIA
Twister
35X35mm PBGA package with 552 balls

2.3. DRAM MEMORY

2.3.1. EXPANSION MEMORY

Number of sockets:
Bus:
Refresh rate:
Supply voltage:
Functional features:

Hardware features:

Two 144 pin SO-DIMM sockets
64-bit data path
4K refresh cycles/ 64ms

3. 3V

1. Synchronous operations (positive edges of clocks)

2. Pipeline architecture

3. Auto refresh and self refresh

4. Programmable Mode Register

5. LVTTL compatible inputs and outputs

6. Burst stop function
Easy removable and exchangeable for user.

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B1A Hardware Technical Specification (Rev. 1.0)

2.4. BIOS ROM

ROM Type:
Package:
Supply voltage:
Erase/program:
Serviceability:

256K x 8 CMOS Flash Memory
PLCC 32-Lead
5V
10,000 erase/program cycles minimum
End user refreshable design (software re-flash)

2.5. South Bridge(VT8231)-----South-Bridge+Super I/O

Function:

Vendor:
Parts Number:
Package:

1. Integrated Super I/O (FDC,LPT,COM and FIR).

2. Integrated SoundBlaster Pro/Multi-channel.

3. UltraDMA-33/66/100 Master Mode EIDE

controller.

4. 4 ports USB controller ,RTC ,Serial IRQ ,SMBus

support.

5. Plug and Play ,ACPI ,Power Management Support.

6. Temperature, voltage, and FAN speed monitoring.

7. ACPI v1.0 Compliant

8. APM v1.2 Compliant

9. 0.30um, 3.3V, Low Power CMOS Process.

VIA
VT8231
27X27 mm 376 pin BGA

2.6. CardBus Controller(OZ711E1)

Function:

Hardware features:

1. Using a Smart Cardsensing technology OZ711E1

Can dynamically reconfigure its internal
functionality to support either a PC card or a ISO
7816-1,-2,-3, compliant smart card.

2. Integrated Card Bus Controller.

3. Support Ultra Zoomed Video mode.

4. ACPI-PCI Bus Power Management Interface Spec.

Rev 1.1 Compliant.

5. Compliant with PCI spec. v2.2, PC Card standard

7.0 and JEIDA 4.1.

6. Support 2 PCMCIA 1.0 and JEIDA 4.2 R2 cards or

2 CardBus cards or a passive Type II PC Card
smart card holder.

7. Reads and Writes to all ISO 7816-1,-2,-3 smart

Cards.

Vendor:

Parts Number:
Package:

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O2Micro
OZ711E1B
208 pin Mini-BGA

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B1A Hardware Technical Specification (Rev. 1.0)

2.7. Embedded Controller(NS87591)

Function features:

1. Follow LPC interface Spec. Rev. 1.0.

2. PC01 Rev 0.3, and ACPI 1.0b Compliant.

3. 16-bit RISC core, with 2 Mbyte address space, and
running at up to 20Mhz.

4. Share BIOS flash memory(internal and/or external).

5. Y2K-compliant RTC.

6. 84 GPIO ports with a variety of wake-up events.

7. Extremely low current consumption in Idle mode.

8. JTAG-based debugger interface.

9. Built-in ADC(A-to-D Converter)—10 bit resolution.

10. Built-in DAC(D-to-A Converter)---8-bit resolution.

11. CompactRISC CR16B 16-bit embedded RISC
Processor core.

Vendor:

Parts Number:
Package:

National Semiconductor
NS87591
128-pin LQFP package

2.9. AUDIO Codec ‘97(CS4299)

Function features:

1. Fully Compliant AC97 Compliant.

2. 20-bit Stereo Digital to Analog Converters.

3. 18-bit Stereo Analog to Digital Converters.

4. High-quality pseudo-Differential CD input.

5. Meets or exceeds the Microsoft PC99 Audio

Performance requirements.

6. S/PDIF digital audio output.

7. CrystalClear 3D Stereo Enhancement.

Vendor:

Parts Number:
Package:

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Crystal
CS4299
48-pin TQFP

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