No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidenta l, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel ’s copyrights to reproduce Intel’s Soware
only in its unmodied and binary form, (with the accompanying documentation, the
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to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
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(d) e Soware may contain the soware and other intellectual property of third party
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license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the
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OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware
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ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN
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EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will
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Licensee’s specic rights may vary from country to country.
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 33
3.3 ASRock Live Update & APP Shop 36
3.3.1 UI Overview 36
3.3.2 Apps 37
3.3.3 BIOS & Drivers 40
3.3.4 Setting 41
Chapter 4 UEFI SETUP UTILITY 42
4.1 Introduction 42
4.2 EZ Mode 43
4.3 Advanced Mode 44
4.3.1 UEFI Menu Bar 44
4.3.2 Navigation Keys 45
4.4 Main Screen 46
4.5 OC Tweaker Screen 47
4.6 Advanced Screen 61
4.6.1 CPU Conguration 62
4.6.2 Chipset Conguration 64
4.6.3 Storage Conguration 67
4.6.4 Super IO Conguration 68
4.6.5 ACPI Conguration 69
4.6.6 USB Conguration 70
4.6.7 Trusted Computing 71
4.7 Tools 73
4.8 Hardware Health Event Monitoring Screen 75
4.9 Security Screen 78
4.10 Boot Screen 79
4.11 Exit Screen 82
Chapter 1 Introduction
ank you for purchasing ASRock B660M-HDV motherboard, a reliable
motherboard produced under ASRock ’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock ’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specication s and the BIOS soware might be updated, the
content of this doc umentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version w ill be available on
ASRock’s website without further notice. If you require technical support related to
this motherboard, plea se visit our website for spec ic infor mation about the model
you are using. You may nd the latest VGA cards and CPU support li st on ASRock’s
website a s well. ASRock website http://www.asrock.com.
1.1 Package Contents
ASRock B660M-HDV Motherboard (Micro ATX Form Factor)
•
ASRock B660M-HDV Quick Installation Guide
•
ASRock B660M-HDV Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
3 x Screws for M.2 Sockets (Optiona l)
•
1 x I/O Panel Shield
•
B660M-HDV
English
1
1.2 Specications
Platform
CPU
Chipset
Memory
•
•
•
•
•
•
•
•
•
•
•
* Supports DDR4 3200 natively.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
•
•
Micro ATX Form Factor
Solid Capacitor design
Supports 12th Gen Intel® CoreTM Processors (LGA1700)
Digi Power design
6 Power Phase design
Supports Intel® Hybrid Technology
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® B660
Dual Channel DDR4 Memory Technology
2 x DDR4 DIMM Slots
Supports DDR4 non-ECC, un-buered memory up to
5066+(OC)*
Supports ECC UDIMM memory modules (operate in non-
ECC mo de)
Max. capacity of system memor y: 64GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
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2
Expansion
Slot
Graphics
1 x PCIe Gen4x16 Slot*
•
* Supports NVMe SSD as boot disks
2 x PCIe Gen3x1 Slots
•
1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe
•
WiFi module
* Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
Intel® Xe Graphics Architecture (Gen 12)
•
ree graphics output options: D-Sub, HDMI and
•
DisplayPort 1.4
Supports HDMI 2.1 TMDS Compatible with max. resolution
•
up to 4K x 2K (4096x2160) @ 60Hz
Audio
LAN
Rear Panel
I/O
Supports DisplayPort 1.4 with DSC (compressed) max.
•
resolution up to 8K (7680x4320) @ 60Hz / 5K (5120x3200) @
120Hz
Supports D-Sub with max. resolution up to 1920x1200 @
•
60Hz
Supports HDCP 2.3 with HDMI 2.1 TMDS Compatible and
•
DisplayPort 1.4 Ports
7.1 CH HD Audio (Realtek ALC897/887 Audio Codec)
•
Supports Surge Protection
•
Gigabit LAN 10/100/100 0 Mb/s
•
Giga PHY Intel® I219V
•
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports UEFI PXE
•
2 x Antenna Mounting Points
•
1 x PS/2 Mouse/Keyboard Port
•
1 x D-Sub Port
•
1 x HDMI Port
•
1 x DisplayPort 1.4
•
3 x USB 3.2 Gen1 Type-A Ports (Supports ESD Protection)
•
1 x USB 3.2 Gen1 Type-C Port (Supports ESD Protection)
•
2 x USB 2.0 Ports (Supports ESD Protection)
•
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
•
B660M-HDV
Storage
4 x SATA3 6.0 Gb/s Connectors*
•
* If M2_2 is occupied by a SATA-type M.2 device, SATA3_3
will be disabled.
1 x Hyper M.2 Socket (M2_1, Key M), supports type
•
2260/2280 PCIe Gen4x4 (64 Gb/s) mode**
1 x Ultra M.2 Socket (M2_ 2, Key M), supports type
Please realize that there is a certain risk involved with overcl ocking, including
adjusting the setting in the BIOS, applying Untie d Overclocking Technology, or using
third-party overclocking tools. Overclocking may aect your system’s stability, or
even cause damage to the components and devices of your system . It should be done
at your own risk and expen se. We are not responsible for possible damage caused by
overclocking.
•
FCC, CE
•
ErP/EuP Ready (ErP/EuP ready power supply is required)
** Function of the Audio Ports in 7.1-channel Conguration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
B660M-HDV
English
9
Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
English
10
2.1 Installing the CPU
1. Before you insert the 1700-Pin CPU into the socket, please check if the PnP cap
is on the socket, if the CPU surface is unclean, or if there are any bent pins in the
socket. Do not force to insert the CPU into the socket if above situation i s found.
Other wise, the CPU wil l be seriously damaged.
2. Unplug all power c ables before ins talling the CPU.
1
B660M-HDV
A
B
23
English
11
4
76
5
English
12
Please save and replace the cover if the processor is removed. e cover mus t be
placed if you wish to return the motherboard for aer service.
2.2 Installing the CPU Fan and Heatsink
12
B660M-HDV
CPU_FAN
English
13
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identical (the same
brand, speed, size and chip-ty pe) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memory Technology w ith only one memor y
module installed.
3. It is not allowed to install a DDR, DDR2 or DDR 3 memory modul e into a DDR4
slot; otherwi se, this motherboard and DIMM may be damaged .
e DIMM only ts in one correct orientation. It will cause permanent dam age to
the mothe rboard and the DIMM if you force the DIMM into the slot at incorrect
orientation.
English
14
B660M-HDV
1
2
3
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15
2.4 Expansion Slots (PCI Express Slots)
ere are 3 PCI Express slots on the motherboard.
Before installing an expansion c ard, ple ase make sure that the power supply is
switched o or the power cord is unplug ged. Please read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you star t
the installation.
PCIe slots:
PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
English
16
2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“O pen”.
Clear CMOS Jumper
(CLR MOS1)
(see p.6, No. 12)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
B660M-HDV
If you clear the CMOS, the case open may be detected. Please adjust the BIOS option
“Clear Status” to cl ear the record of prev ious chassis intrusion status.
English
17
2.6 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
System Panel Header
(9-p in PA NE L1)
(see p.6, No. 11)
PWRBTN (Power Swi tch):
Connec t to the power switch on the chassis f ront panel. You may congure the way to
turn o your system using the power sw itch.
RESET (Reset Sw itch):
Connec t to the reset switch on the cha ssis front panel. Pre ss the reset switch to restar t
the computer if the computer f reezes and fails to per form a normal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassi s front panel. e LED is on when
the system is operating. e LED keeps blinking whe n the system is in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powe red o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis f ront panel. e LED is on
when the hard drive is reading or writing data.
e front panel design may dier by chassis . A front panel module mainly consists
of power switch, reset switch, power LED, hard drive activity LED, speaker and etc.
When connecting your cha ssis front panel module to this header, make sure the wire
assig nments and the pin assignments are matched correctly.
1
PLED+
PLED-
HDLED-
HDLED+
PWRBTN#
GND
RESET#
GND
GND
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
English
18
B660M-HDV
SPEAKER
Chassis Intrusion and
Speaker Header
(7-pi n SPK_C I1)
(see p.6, No. 13)
Serial ATA3 Connectors
Ver ti cal:
(SATA3_0:
see p.6, No. 8)
(SATA3_1:
see p.6, No. 7)
Right Angle:
(SATA3_2:
see p.6, No. 9)(Upper)
(SATA3_3:
see p.6, No. 9)(Lower)
USB 2.0 Headers
(9-pin USB3_4)
(see p.6, No. 16)
(4-pin USB5)
(see p.6, No. 15)
DUMMY
+5V
1
SIGNAL
SATA3_2SATA3_1
USB_PWR
1
USB_PWR
1
USB_PWR
DUMMY
GND
DUMMY
P-
P+
P+
P-
P+0
P-0
GND
GND
DUMMY
GND
Please connect the
chassis intrusion and the
chassis speaker to this
header.
ese four SATA3
connectors support SATA
data cables for internal
SATA3_0SATA3_3
storage devices with up to
6.0 Gb/s data transfer rate.
* If M2_2 is occupied by
a SATA-type M.2 device,
SATA3_3 will be disabled.
ere are two USB
2.0 headers on this
motherboard.
USB 3.2 Gen1 Header
(19-pin F_USB3_1_2)
(see p.6, No. 6)
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
GND
IntA_PA_SSTX-
IntA_PA_SSTX+
GND
IntA_PA_D-
IntA_PA_D+
VbusVbus
IntA_PB_SSRX-
IntA_PB_SSRX+
GND
IntA_PB_SSTX-
IntA_PB_SSTX+
GND
IntA_PB_D-
IntA_PB_D+
Dummy
1
ere is one header on
this motherboard. is
USB 3.2 Gen1 header can
support two ports.
English
19
Front Panel Audio Header
4 3 2 1
GND
FAN_SPEED_CONTROL
(9-pin HD_AUDIO1)
(see p.6, No. 18)
1. High Denition Audio supports Ja ck Sensing, but the panel wire on the chassi s
must support HDA to function corre ctly. Plea se follow the instructions in our
manual and chas sis manual to install your system.
2. If you use an AC’97 audio panel , please install it to the f ront panel audio header b y
the steps below:
A. Connect Mic_ IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2 _R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to
connec t them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adjust “Recording Volume”.
1
GND
PRESENCE#
MIC2_R
MIC2_L
MIC_RET
J_SENSE
OUT2_R
OUT_RET
OUT2_L
is header is for
connecting audio devices
to the front audio panel.
English
20
Chassis/Water Pump Fan
Connectors
(4-pin CHA_FAN1/WP)
(see p.6, No. 4)
(4-pin CHA_FAN2/WP)
(see p.6, No. 14)
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.6, No. 2)
FAN_SPEED_CONTROL
CHA_FAN_SPEED
FAN_VOLTAGE
FAN_VOLTAGE
CHA_FAN_SPEED
FAN_SPEED_CONTROL
1 2 3 4
CPU_FAN_SPEED
+12V
GND
1234
is motherboard
provides two 4-Pin water
cooling
connectors. If you plan to
GND
connect a 3-Pin
water cooler fan, please
connect it to Pin 1-3.
is motherboard pro-
vides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
chassis
fan
chassis
B660M-HDV
8 5
SPI_DQ3
CPU/Water Pump Fan
Connector
(4-pin CPU_FAN2/WP)
(see p.6, No. 19)
ATX Power Connector
(24-pin AT XPWR 1)
(see p.6, No. 5)
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.6, No. 1)
FAN_SPEED_CONTROL
CPU_FAN_SPEED
FAN_VOLTAGE
GND
12
1
4
is motherboard
4
provides a 4-Pin water
3
2
cooling CPU fan
1
connector. If you plan
to connect a 3-Pin CPU
water cooler fan, please
connect it to Pin 1-3.
24
is motherboard pro-
vides a 24-pin ATX power
connector. To use a 20-pin
ATX power supply, please
plug it along Pin 1 and Pin
13
13.
is motherboard pro-
vides a 8-pin ATX 12V
power connector. To use a
1
4-pin ATX power supply,
please plug it along Pin 1
and Pin 5.
*Warning: Please make
sure that the power cable
connected is for the CPU
and not the graphics
card. Do not plug the
PCIe power cable to this
connec tor.
SPI TPM Header
(13 -pi n SPI_TPM _ J1)
(see p.6, No. 10)
1
SPI_PWR
SPI_CS0
SPI_DQ2
Dummy
CLK
RSMRST#
SPI_MISO
SPI_MOSI
RST#
TPM_PIRQ
SPI_TPM_CS#
GND
is connector supports SPI
Trusted Platform Module (TPM)
system, which can securely
store keys, digital certicates,
passwords, and data. A TPM
system also helps enhance
network security, protects digital
identities, and ensures platform
integr it y.
English
21
Serial Port Header
(9-pin C OM 1)
(see p.6, No. 17)
1
RRXD1
DDTR#1
TTXD1
DDCD#1
DDSR#1
CCTS#1
RRTS#1
GND
is COM1 header
supports a serial port
module.
RRI#1
English
22
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