No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware
only in its unmodied and binary form, (with the accompanying documentation, the
“Soware”) for Licensee’s personal use only, and not commercial use, in connection with
Intel-based products for which the Soware has been provided, subject to the following
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to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party
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(e) Intel has no obligation to provide any support, technical assistance or updates for the
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DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of
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ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN
IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
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the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation,
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EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will
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or the foreign government from where it is shipping requires an export license, or other
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the event the Soware is exported from the U.S.A. or re-exported from a foreign destination by Licensee, Licensee will ensure that the distribution and export/re-export or import
of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S.
Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will
be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws
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Licensee’s specic rights may vary from country to country.
CE Warning
is device complies with directive 2014/53/EU issued by the Commision of the European
Community.
is equipment complies with EU radiation exposure limits set forth for an uncontrolled
environment.
is equipment should be installed and operated with minimum distance 20cm between
the radiator & your body.
Operations in the 5.15-5.35GHz band are restricted to indoor usage only.
Radio transmit power per transceiver type
FunctionFrequencyMaximum Output Power (EIRP)
2400-2483.5 MHz18.5 + / -1.5 dbm
5150-5250 MHz21.5 + / -1.5 dbm
WiFi
Bluetooth2400-2483.5 MHz8.5 + / -1.5 dbm
5250-5350 MHz
5470-5725 MHz
18.5 + / -1.5 dbm (no TPC)
21.5 + / -1.5 dbm (TPC)
25.5 + / -1.5 dbm (no TPC)
28.5 + / -1.5 dbm (TPC)
Motherboard Layout
B560M-ITX/ac
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1
No. Description
1ATX 12V Power Connector (ATX12V1)
2CPU Fan Connector (CPU_FAN1)
3Chassis/Waterpump Fan Connector (CHA_FAN1/WP)
4Addressable LED Header (ADDR_LED1)
52 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
6ATX Power Connector (ATXPWR1)
7Front Panel Type C USB 3.2 Gen1 Header (USB31_TC_1)
8USB 3.2 Gen1 Header (USB3_3_4)
9SATA3 Connector (SATA3_1)
10 SATA3 Connector (SATA3_0)
11 SATA3 Connector (SATA3_3)
12 SATA3 Connector (SATA3_2)
13 System Panel Header (PANEL1)
14 USB 2.0 Header (USB_3_4)
15 Clear CMOS Jumper (CLRMOS1)
16 Chassis Speaker Header (SPEAKER1)
17 Chassis Fan Connector (CHA_FAN2)
18 Chassis Intrusion Header (CI1)
19 Front Panel Audio Header (HD_AUDIO1)
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2
I/O Panel
B560M-ITX/ac
3
1
2
4
10578
96
No. DescriptionNo. Description
1PS/2 Mouse/Keyboard Port 6Antenna Ports
2LAN RJ-45 Port* 7USB 2.0 Ports (USB12)
3Line In (Light Blue)**8USB 3.2 Gen1 Ports (USB3_12)
4Front Speaker (Lime)**9DisplayPort 1.4
5Microphone (Pink)**10HDMI Port
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.
** Function of the Au dio Ports in 7.1-channel Con guration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
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3
WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz Antennas
WiFi-802.11ac + BT Module
is motherboard comes with an exclusive WiFi 802.11 a/b/g/n/ac + BT v4.2
module (pre-installed on the rear I/O panel) that oers support for WiFi 802.11 a/b/
g/n/ac connectivity standards and Bluetooth v4.2. WiFi + BT module is an easy-touse wireless local area network (WLAN) adapter to support WiFi + BT. Bluetooth
v4.2 standard features Smart Ready technology that adds a whole new class of
functionality into the mobile devices. BT 4.2 also includes Low Energy Technology
and ensures extraordinary low power consumption for PCs.
* e transmission speed may vary according to the environment.
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4
WiFi Antennas Installation Guide
B560M-ITX/ac
Step 1
Prepare the WiFi 2.4/5 GHz Antennas that come
with the package.
Step 2
Connect the two WiFi 2.4/5 GHz Antennas to
the antenna connectors. Turn the antenna clockwise until it is securely connected.
Step 3
Set the WiFi 2.4/5 GHz Antenna as shown in the
illustration.
*You may need to adjust the direction of
the antenna for a stronger signal.
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5
Chapter 1 Introduction
ank you for purchasing ASRock B560M-ITX/ac motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website without further notice. If you require technical support related to
this motherboard, please vi sit our website for s pecic information about the model
you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s
website a s well. ASRock website http://www.a srock.com.
1.1 Package Contents
ASRock B560M-ITX/ac Motherboard (Mini-ITX Form Factor)
•
ASRock B560M-ITX/ac Quick Installation Guide
•
ASRock B560M-ITX/ac Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
1 x I/O Panel Shield
•
2 x ASRock WiFi 2.4/5 GHz Antennas (Optional)
•
1 x Screw for M.2 Socket (Optional)
•
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6
1.2 Specications
Platform
CPU
Chipset
Memory
•
•
•
•
•
•
•
•
•
•
•
* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 3200;
CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933; CoreTM
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
•
•
B560M-ITX/ac
Mini-ITX Form Factor
Solid Capacitor design
Supports 10th Gen Intel® CoreTM Processors and 11th Gen
Intel® CoreTM Processors (LGA1200)
Digi Power design
6 Power Phase design
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® B560
Dual Channel DDR4 Memory Technology
2 x DDR4 DIMM Slots
11th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4600+(OC)*
10th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4400+(OC)*
Supports ECC UDIMM memory modules (operate in nonECC mode)
Max. capacity of system memory: 64GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
11th Gen Intel® CoreTM Processors
1 x PCI Express 4.0 x16 Slot*
•
10th Gen Intel® CoreTM Processors
1 x PCI Express 3.0 x16 Slot*
•
* Supports NVMe SSD as boot disks
1 x Vertical M.2 Socket (Key E) with the bundled WiFi-
•
802.11ac module (on the rear I/O)
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7
Graphics
Intel® UHD Graphics Built-in Visuals and the VGA outputs
•
can be supported only with processors which are GPU
integrated.
11th Gen Intel® CoreTM Processors support Intel® Xe Graphics
•
Architecture (Gen 12). 10th Gen Intel® CoreTM Processors
support Gen 9 Graphics
Graphics, Media & Compute: Microso DirectX 12, OpenGL
•
4.5, Intel® Built In Visuals, Intel® Quick Sync Video, Hybrid /
Switchable Graphics, OpenCL 2.1
Display & Content Security: Rec. 2020 (Wide Color Gamut),
•
Microso PlayReady 3.0, UHD/HDR Blu-ray Disc
Dual graphics output: support HDMI and DisplayPort 1.4
•
ports by independent display controllers
Supports HDMI 2.0 with max. resolution up to 4K x 2K
•
(4096x2160) @ 60Hz
Supports DisplayPort 1.4 with max. resolution up to 4K x 2K
•
(4096x2304) @ 60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
•
HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
Supports HDCP 2.3 with HDMI 2.0 and DisplayPort 1.4
•
Ports
Supports 4K Ultra HD (UHD) playback with HDMI 2.0 and
•
DisplayPort 1.4 Ports
* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen
Intel® CoreTM Processors support HDMI 1.4.
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8
Audio
LAN
7.1 CH HD Audio (Realtek ALC897 Audio Codec)
•
Supports Surge Protection
•
Gigabit LAN 10/100/1000 Mb/s
•
Giga PHY Intel® I219V
•
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports PXE
•
Wireless
LAN
Rear Panel
I/O
Storage
B560M-ITX/ac
Intel® 802.11ac WiFi Module
•
Supports IEEE 802.11a/b/g/n/ac
•
Supports Dual-Band (2.4/5 GHz)
•
Supports high speed wireless connections up to 433Mbps
•
Supports Bluetooth 4.2 / 3.0 + High speed class II
•
2 x Antenna Ports
•
1 x PS/2 Mouse/Keyboard Port
•
1 x HDMI Port
•
1 x DisplayPort 1.4
•
2 x USB 3.2 Gen1 Ports (Supports ESD Protection)
•
2 x USB 2.0 Ports (Supports ESD Protection)
•
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
•
4 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage
•
Technology 18, NCQ, AHCI and Hot Plug*
* If M2_1 is occupied by a SATA-type M.2 device, SATA3_0 will
be disabled.
1 x Hyper M.2 Socket (M2_1), supports M Key type 2280 M.2
•
SATA3 6.0 Gb/s module and M.2 PCI Express module up to
Gen4 x4 (64 Gb/s) (with 11th Gen Intel® CoreTM Processors) or
* e CPU Fan Connector supports the CPU fan of maximum
1A (12W) fan power.
1 x Chassis Fan Connector (4-pin)
•
* e Chassis Fan Connector supports the chassis fan of maximum 1A (12W) fan power.
1 x Chassis/Water Pump Fan Connector (4-pin) (Smart Fan
•
Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CHA_FAN1/WP can auto detect if 3-pin or 4-pin fan is in use.
1 x 24 pin ATX Power Connector
•
1 x 8 pin 12V Power Connector
•
1 x Front Panel Audio Connector
•
1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
•
ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
•
(Supports ESD Protection)
1 x Front Panel Type C USB 3.2 Gen1 Header (Supports ESD
•
Protection)
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10
BIOS
Feature
Hardware
Monitor
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 6.0 Compliant wake up events
•
SMBIOS 2.7 Support
•
CPU, CPU GT, VCCSA, DRAM, VPPM, VCCIN AUX, VC-
•
CIO, VCCST Voltage Multi-adjustment
Fan Tachometer: CPU, Chassis, Chassis/Water Pump Fans
•
Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
•
ture): CPU, Chassis, Chassis/Water Pump Fans
Fan Multi-Speed Control: CPU, Chassis, Chassis/Water
•
Pump Fans
CASE OPEN detection
•
Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, VCCSA
Please realize that the re is a certain risk involved with overclocking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using
third-party overclocking tool s. Overclocking may aect your system’s stability, or
even cause damage to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for possible damage caused by
overclocking.
•
FCC, CE
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
B560M-ITX/ac
11
English
Chapter 2 Installation
is is a Mini-ITX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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12
2.1 Installing the CPU
1. Before you insert the 120 0-Pin CPU into the socket, please check if the PnP ca p
is on the socket, if the CPU sur face is unclean, or if there are any b ent pins in the
socket. Do not force to insert the CPU into the socket if above situation is found.
Other wise, the CPU will be seriously d amaged.
2. Unplug all power cables be fore installing the CPU.
1
B560M-ITX/ac
A
B
2
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13
3
5
4
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14
Please save and replace the cover if the processor i s removed. e cover must be
placed if you wish to return the motherboard for aer service.
B560M-ITX/ac
15
English
2.2 Installing the CPU Fan and Heatsink
12
English
16
CPU_FAN
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identical (the same
brand, speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memor y Technology with only one memory
module installed.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, this motherboard and DIMM may be damaged.
e DIMM only ts in one correct orientation. It will cause permanent damage to
the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect
orientation.
B560M-ITX/ac
17
English
1
2
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18
3
2.4 Expansion Slots (PCI Express Slot)
ere is 1 PCI Express slot slot on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and make necessary hardware settings for the card before you start
the installation.
PCIe slots:
11th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
10th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
B560M-ITX/ac
19
English
2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“Open”.
Clear CMOS Jumper
(CLRMOS1)
(see p.1, No. 15)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
English
20
If you clear the CMOS, the case open may be detec ted. Please adjust the BIOS option
“Clear Status” to clear the record of previou s chassis intrusion status.
2.6 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
B560M-ITX/ac
System Panel Header
(9-pin PANEL1)
(see p.1, No. 13)
PWRBTN (Power Switch):
Connec t to the power switch on the chassi s front panel. You may congure the way to
turn o your system using the power switch.
RESET (Reset Switch):
Connec t to the reset switch on the chassis front panel. Press the reset sw itch to restart
the computer if the compute r freezes and fails to perform a normal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when
the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive activity LED on the chassis front panel. e LED is on
when the hard drive i s reading or writing data.
e front panel design may dier by chassis. A front panel module mainly consists
of power switch, reset switch, power LED, hard dr ive activity LED, speak er and etc.
When connecting your chassis front panel module to this head er, make sure the wire
assig nments and the pin assig nments are matched correctly.
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
21
English
1
Serial ATA3 Connectors
(SATA3_0:
see p.1, No. 10)
(SATA3_1:
see p.1, No. 9)
(SATA3_2:
see p.1, No. 12)
(SATA3_3:
see p.1, No. 11)
SATA3_1
SATA3_3
ese four SATA3
connectors support SATA
data cables for internal
SATA3_0
storage devices with up to
6.0 Gb/s data transfer rate.
SATA3_2
* If M2_1 is occupied by
a SATA-type M.2 device,
SATA3_0 will be disabled.
English
USB 2.0 Header
(9-pin USB_3_4)
(see p.1, No. 14)
USB 3.2 Gen1 Header
(19-pin USB3_3_4)
(see p.1, No. 8)
Front Panel Type C USB
3.2 Gen1 Header
(20-pin USB31_TC_1)
(see p.1, No. 7)
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.1, No. 19)
MIC 2_L
MIC 2_R
OUT 2_R
J_S ENS
Vbus
IntA _PA_S SRX-
IntA _PA_S SRX+
GND
IntA _PA_S STX-
IntA _PA_S STX+
GND
IntA _PA_D -
IntA _PA_D +
USB Type-C Cable
E
OUT 2_L
VbusVbus
IntA _PB_ SSRX -
IntA _PB_ SSRX +
GND
IntA _PB_ SSTX -
IntA _PB_ SSTX +
GND
IntA _PB_ D-
IntA _PB_ D+
Dumm y
1
MIC _RE T
OUT _RE T
ere is one USB2.0
header on this
motherboard. is USB
2.0 header can support
two ports.
ere is one header on
this motherboard. is
USB 3.2 Gen1 header can
support two ports.
ere is one Front
Panel Type C USB 3.2
Gen1 Header on this
motherboard. is header
is used for connecting a
USB 3.2 Gen1 module for
additional USB 3.2 Gen1
ports.
is header is for
connecting audio devices
GND
PRE SEN CE #
to the front audio panel.
22
GND
GND
1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis
must support HDA to function correctly. Please follow the instructions in our
manual and chassis manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio heade r by
the steps below:
A. Connect Mic_IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to
connect them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adju st “Recording Volume”.
B560M-ITX/ac
Chassis Speaker Header
(4-pin SPEAKER1)
(see p.1, No. 16)
Chassis/Water Pump Fan
Connector
(4-pin CHA_FAN1/WP)
(see p.1, No. 3)
Chassis Fan Connector
(4-pin CHA_FAN2)
(see p.1, No. 17)
DUM MY
1
+5V
FAN _VO LT AGE
CHA _FA N_S PE ED
FAN _SP EED _C ONT ROL
1 2 3 4
+12 V
CHA _FA N_S PEE D
4 3 2 1
SPE AKE R
DUM MY
FAN _SP EED _CO NTR OL
Please connect the chassis
speaker to this header.
is motherboard
provides a 4-Pin water
cooling
chassis
fan
connector. If you plan to
connect a 3-Pin
chassis
water cooler fan, please
connect it to Pin 1-3.
Please connect fan cables
to the fan connector and
match the black wire to
the ground pin.
English
23
CPU Fan Connector
8 5
(4-pin CPU_FAN1)
(see p.1, No. 2)
FAN_ SP EED _CO NT ROL
CPU _FA N_S PEE D
+12 V
GND
4 3 2 1
is motherboard provides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
English
24
ATX Power Connector
(24-pin ATXPWR1)
(see p.1, No. 6)
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.1, No. 1)
Addressable LED Header
(3-pin ADDR_LED1)
(see p.1, No. 4)
12
24
1
13
4
1
DO_ ADD R
VOU T
GND
is motherboard provides a 24-pin ATX power
connector.
is motherboard
provides a 8-pin ATX 12V
1
power connector. To use a
4-pin ATX power supply,
please plug it along Pin 1
and Pin 5.
*Warning: Please make
sure that the power cable
connected is for the CPU
and not the graphics
card. Do not plug the
PCIe power cable to this
connector.
is header is used to connect
Addressable
LED extension cable
which allows users to choose
from various LED lighting
eects.
Caution: Never install the
Addressable LED cable in the
wrong orientation; otherwise,
the cable may be damaged.
* Please refer to page 30 for
further instructions on this
header.
B560M-ITX/ac
Chassis Intrusion Header
(2-pin CI1)
(see p.1, No. 18)
1
Sig nal
GND
is motherboard
supports CASE OPEN
detection feature that
detects if the chassis cove
has been removed. is
feature requires a chassis
with chassis intrusion
detection design.
25
English
2.7 M.2_SSD (NGFF) Module Installation Guide
The M.2, also known as the Next Generation Form Factor (NGFF), is a small size and
versatile card edge connector that aims to replace mPCIe and mSATA. e Hy per M.2
Socket (M2_1) supports M Key type 2280 M.2 SATA3 6.0 Gb/s module and M.2 PCI
Express module up to Gen4 x4 (64 Gb/s) (with 11th Gen Intel® CoreTM Processors) or Gen3
x4 (32 Gb/s) (with 10th Gen Intel® CoreTM Processors).
* Please be noted that if M2_1 is occupied by a SATA-type M.2 device, SATA3_0 will be
disabled.
Installing the M.2_SSD (NGFF) Module
Step 1
Prepare a M.2_SSD (NGFF) module
and the screw.
Step 2
Depending on the PCB type and
length of your M.2_SSD (NGFF)
module, nd the corresponding nut
location to be used.
English
26
No.1
Nut LocationA
PCB Length8cm
Module TypeType 2280
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