Asrock B560M-HDV R2.0 Quick Installation Guide

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B560M-HDV R2.0

Motherboard Layout

Intel

B560

ATXP WR 1

HDLED RESET

PLED PWRBTN

PANEL1

RoHS

CPU_FAN1

PCIE1

SPK_CI1

PCIE2

DDR 4_B1 (6 4 bit, 28 8-pin m odule )

DDR 4_A1 (6 4 bit, 28 8-pin m odule )

ATX12V1

SATA3_1

SATA3_0

F_USB 3_1_2

CLRMOS1

HD_AUDIO1

M2_ 2

Top:

RJ-45

HDM I1

CPU_FAN2/WP

USB 2.0 T: USB1 B: USB2

CHA_FAN1/WP

PCIE3

Top:

LINE I N

Cent er:

FRON T

Bott om:

MIC IN

VGA 1

USB 3.2 G en1

T: USB3_1

B: USB3 _2

PS2

Keyb oard

/Mou se

SPI_TPM_J1

USB3_4

M2_ 1

DVI 1

USB 3.2 G en1

T: USB3_3

B: USB3 _4

BIOS ROM

CHA_FAN2/WP

USB5_6

COM1

CMOS

Battery

SATA3_2

SATA3_3

LAN

AUDIO CODEC

B5 6 0M - H DV

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No. Description

1 ATX 12V Power Connector (ATX12V1)

2 CPU Fan Connector (CPU_FAN1)

3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)

4 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)

5 ATX Power Connector (ATXPWR1)

6 USB 3.2 Gen1 Header (F_USB3_1_2)

7 SATA3 Connector (SATA3_1)

8 SATA3 Connector (SATA3_0)

9 SATA3 Connector (SATA3_2)(Upper)

10 SATA3 Connector (SATA3_3)(Lower)

11 SPI TPM Header (SPI_TPM_J1)

12 System Panel Header (PANEL1)

13 Clear CMOS Jumper (CLRMOS1)

14 Chassis Intrusion and Speaker Header (SPK_CI1)

15 Chassis/Water Pump Fan Connector (CHA_FAN2/WP)

16 USB 2.0 Header (USB5_6)

17 USB 2.0 Header (USB3_4)

18 COM Port Header (COM1)

19 Front Panel Audio Header (HD_AUDIO1)

20 CPU/Water Pump Fan Connector (CPU_FAN2/WP)

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B560M-HDV R2.0

I/O Panel

2 3

No. Description No. Description

1 D-Sub Port 7 USB 3.2 Gen1 Ports (USB3_3_4)

2 PS/2 Mouse/Keyboard Port 8 USB 2.0 Ports (USB1_2)

3 LAN RJ-45 Port* 9 USB 3.2 Gen1 Ports (USB3_1_2)

4 Line In (Light Blue)** 10 DVI-D Port

5 Front Speaker (Lime)** 11 HDMI Port

6 Microphone (Pink)**

* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.

ACT/LINK LED

SPEED LED

LAN Por t

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection

679

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** Function of the Audio Ports in 7.1-channel Conguration:

Port Function

Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out

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B560M-HDV R2.0

Chapter 1 Introduction

ank you for purchasing ASRock B560M-HDV R2.0 motherboard, a reliable motherboard produced under ASRock’s consistently stringent quality control. It delivers excellent performance with robust design conforming to ASRock’s commitment to quality and endurance.

Becau se the motherboard specications and the BIOS soware might be updated, the content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s website without further notice. If you require technical support related to this motherboard, please vi sit our website for s pecic information about the model you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock website http://www.asrock.com.

1.1 Package Contents

ASRock B560M-HDV R2.0 Motherboard (Micro ATX Form Factor)

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ASRock B560M-HDV R2.0 Quick Installation Guide

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ASRock B560M-HDV R2.0 Support CD

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2 x Serial ATA (SATA) Data Cables (Optional)

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2 x Screws for M.2 Sockets (Optional)

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1 x I/O Panel Shield

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1.2 Specications

Platform

CPU

Chipset

Memory

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* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 2933; CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666. * 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933; CoreTM (i5/i3), Pentium® and Celeron® support DDR4 up to 2666. * Please refer to Memory Support List on ASRock's website for more information. (http://www.asrock.com/)

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Micro ATX Form Factor Solid Capacitor design

Suppor ts 10 Intel® CoreTM Processors (LGA1200) Digi Power design 6 Power Phase design Supports Intel® Turbo Boost Max 3.0 Technology

Intel® B560

Dual Channel DDR4 Memory Technology 2 x DDR4 DIMM Slots

Gen Intel® CoreTM Processors support DDR4 non-ECC,

11 un-buered memory up to 5000+(OC)* 10th Gen Intel® CoreTM Processors support DDR4 non-ECC, un-buered memory up to 4600+(OC)*

Supports ECC UDIMM memory modules (operate in nonECC mode) Max. capacity of system memory: 64GB Supports Intel® Extreme Memory Prole (XMP) 2.0

Gen Intel® CoreTM Processors and 11th Gen

Expansion Slot

11th Gen Intel® CoreTM Processors

1 x PCI Express 4.0 x16 Slot*

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10th Gen Intel® CoreTM Processors

1 x PCI Express 3.0 x16 Slot*

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* Supports NVMe SSD as boot disks

2 x PCI Express 3.0 x1 Slots

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B560M-HDV R2.0

Graphics

Audio

Intel® UHD Graphics Built-in Visuals and the VGA outputs

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can be supported only with processors which are GPU integrated.

Gen Intel® CoreTM Processors support Intel® Xe Graphics

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Architecture (Gen 12). 10th Gen Intel® CoreTM Processors support Gen 9 Graphics ree graphics output options: D-Sub, DVI-D and HDMI

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Supports Triple Monitor

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Supports HDMI 2.0 with max. resolution up to 4K x 2K

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(4096x2160) @ 60Hz Supports DVI-D with max. resolution up to 1920x1200 @

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60Hz Supports D-Sub with max. resolution up to 1920x1200 @

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60Hz Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

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HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant HDMI monitor is required) Supports HDCP 2.3 with DVI-D and HDMI 2.0 Ports

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Supports 4K Ultra HD (UHD) playback with HDMI 2.0 Port

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* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen Intel® CoreTM Processors support HDMI 1.4.

7.1 CH HD Audio (Realtek ALC897 Audio Codec)

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Supports Surge Protection

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LAN

Gigabit LAN 10/100/1000 Mb/s

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Giga PHY Intel® I219V

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Supports Wake-On-LAN

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Supports Lightning/ESD Protection

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Supports Energy Ecient Ethernet 802.3az

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Supports PXE

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Rear Panel I/O

Storage

Connector

1 x PS/2 Mouse/Keyboard Port

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1 x D-Sub Port

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1 x DVI-D Port

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1 x HDMI Port

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2 x USB 2.0 Ports (Supports ESD Protection)

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4 x USB 3.2 Gen1 Ports (Supports ESD Protection)

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1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

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LED) HD Audio Jacks: Line in / Front Speaker / Microphone

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4 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage

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Technology 18, NCQ, AHCI and Hot Plug 1 x Hyper M.2 Socket (M2_1), supports M Key type

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2260/2280 M.2 PCI Express module up to Gen4x4 (64 Gb/s) (Only supported with 11 1 x Ultra M.2 Socket (M2_2), supports M Key type

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2260/2280 M.2 SATA3 6.0 Gb/s module and M.2 PCI

Express module up to Gen3 x4 (32 Gb/s)* * Supports Intel® OptaneTM Tech nolo gy (M 2_ 2) * Supports NVMe SSD as boot disks * Supports ASRock U.2 Kit

1 x COM Port Header

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1 x SPI TPM Header

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1 x Chassis Intrusion and Speaker Header

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1 x CPU Fan Connector (4-pin)

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* e CPU Fan Connector supports the CPU fan of maximum 1A (12W) fan power.

1 x CPU/Water Pump Fan Connector (4-pin) (Smart Fan

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Speed Control) * e CPU/Water Pump Fan supports the water cooler fan of maximum 2A (24W) fan power.

2 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan

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Speed Control) * e Chassis/Water Pump Fan supports the water cooler fan of maximum 2A (24W) fan power. * CPU_FAN2/WP, CHA_FAN1/WP and CHA_FAN2/WP can auto detect if 3-pin or 4-pin fan is in use.

Gen Intel® Core™ Processors)*

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B560M-HDV R2.0

BIOS Feature

Hardware Monitor

1 x 24 pin ATX Power Connector

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1 x 8 pin 12V Power Connector

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1 x Front Panel Audio Connector

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2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports

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ESD Protection) 1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)

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(Supports ESD Protection)

AMI UEFI Legal BIOS with multilingual GUI support

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ACPI 6.0 Compliant wake up events

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SMBIOS 2.7 Support

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CPU Core/Cache, GT, DRAM, VPPM, VCCIN_AUX,

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VCCST, VCCSA Voltage Multi-adjustment

Fan Tachometer: CPU, CPU/Water Pump, Chassis/Water

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Pump Fans Quiet Fan (Auto adjust chassis fan speed by CPU tempera-

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ture): CPU, CPU/Water Pump, Chassis/Water Pump Fans Fan Multi-Speed Control: CPU, CPU/Water Pump, Chassis/

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Water Pump Fans CASE OPEN detection

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Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,

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VPPM, VCCIN_AUX, VCCSA, VCCST, ATX_5VSB

Microso® Windows® 10 64-bit

Certications

* For detailed product information, please visit our website: http://www.asrock .com

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FCC, CE

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ErP/EuP Ready (ErP/EuP ready power supply is required)

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Please realize that the re is a certain risk involved with overclocking, including adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using third-party overclocking tool s. Overclocking may aect your system’s stability, or even cause damage to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for possible damage caused by overclocking.

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B560M-HDV R2.0

Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard, study the conguration of your chassis to ensure that the motherboard ts into it.

Pre-installation Precautions

Take note of the following precautions before you install motherboard components or change any motherboard settings.

Make sure to unplug the power cord before installing or removing the motherboard

•

components. Failure to do so may cause physical injuries and damages to motherboard components. In order to avoid damage from static electricity to the motherboard’s components,

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NEVER place your motherboard directly on a carpet. Also remember to use a grounded wrist strap or touch a safety grounded object before you handle the components. Hold components by the edges and do not touch the ICs.

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Whenever you uninstall any components, place them on a grounded anti-static pad or

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in the bag that comes with the components. When placing screws to secure the motherboard to the chassis, please do not over-

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tighten the screws! Doing so may damage the motherboard.

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2.1 Installing the CPU

1. Before you insert the 1200-Pin CPU into the socket, please check if the PnP cap is on the socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU will be seriously damaged.

2. Unplug all power cables before in stalling the CPU.

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B560M-HDV R2.0

English

Please save and replace the cover if the processor i s removed. e cover must be placed if you wish to return the motherboard for aer service.

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B560M-HDV R2.0

2.2 Installing the CPU Fan and Heatsink

1 2

CPU_FAN

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2.3 Installing Memory Modules (DIMM)

is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots, and supports Dual Channel Memory Technology.

1. For dual channel conguration , you always need to in stall identical (the same

brand, speed , size and chip-type) DDR4 DIMM pairs.

2. It is unable to activate Du al Channel Memory Technology with only one memory

module installed.

3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4

slot; otherwise, this motherboard and DIMM may be damaged.

e DIMM only ts in one correct orientation. It will cause permanent damage to the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect orientation.

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B560M-HDV R2.0

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2.4 Expansion Slots (PCI Express Slots)

ere are 3 PCI Express slots on the motherboard.

Before installing an ex pansion card, please make sure that the power supply is switched o or the power cord is unplugged. Plea se read the documentation of the expan sion card and make necessary hardware settings for the card before you start the installation.

PCIe slots:

Gen Intel® CoreTM Processors:

PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards. PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards. PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

Gen Intel® CoreTM Processors:

PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards. PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards. PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

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B560M-HDV R2.0

2.5 Jumpers Setup

e illustration shows how jumpers are setup. When the jumper cap is placed on the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is

“Open”.

Clear CMOS Jumper (CLRMO S1) (see p.1, No. 13)

CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system parameters to default setup, please turn o the computer and unplug the power cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to short the pins on CLRMOS1 for 5 seconds. However, please do not clear the CMOS right aer you update the BIOS. If you need to clear the CMOS when you just nish updating the BIOS, you must boot up the system rst, and then shut it down before you do the clear-CMOS action. Please be noted that the password, date, time, and user default prole will be cleared only if the CMOS battery is removed. Please remember toremove the jumper cap aer clearing the CMOS.

2-pin Jumper

If you clear the CMOS, the case open may be detec ted. Please adjust the BIOS option “Clear Status” to clear the record of previou s chassis intrusion status.

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2.6 Onboard Headers and Connectors

Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these headers and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard.

System Panel Header (9-pi n PANEL1) (see p.1, No. 12)

PWRBTN (Power Switch):

Connec t to the power switch on the chassi s front panel. You may congure the way to turn o your system using the power switch.

RESET (Reset Switch): Connec t to the reset switch on the chassis front panel. Press the reset sw itch to restart the computer if the compute r freezes and fails to perform a normal restart.

PLED (Syste m Power LED): Connec t to the power status indicator on the chassis front panel. e LED i s on when the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep state. e LED is o when the system is in S4 sleep state or powered o (S5).

HDLED (Ha rd Drive Activity LED): Connec t to the hard drive activity LED on the chassis front panel. e LED is on when the hard drive i s reading or writing data.

e front panel design may dier by chassis. A front panel module mainly consists of power switch, reset switch, power LED, hard dr ive activity LED, speak er and etc. When connecting your chassis front panel module to this head er, make sure the wire assig nments and the pin assig nments are matched correctly.

PLED+

PLED-

HDLED-

HDLED+

PWRBTN#

GND

RESET#

GND

Connect the power switch, reset switch and system status indicator on the chassis to this header according to the pin assignments below. Note the positive and negative pins before connecting the cables.

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B560M-HDV R2.0

Chassis Intrusion and

DUMMY

GND

P+

P-

USB_PWR

P+

P-

USB_PWR

+5V

DUMMY

SIGNAL

GND

DUMMY

SPEAKER

DUMMY

Speaker Header (7-pi n SPK_CI1) (see p.1, No. 14)

Please connect the chassis intrusion and the chassis speaker to this header.

Serial ATA3 Connectors Ver tica l: (SATA3_0: see p.1, No. 8) (SATA3_1: see p.1, No. 7) Right Angle: (SATA3_2: see p.1, No. 9)(Upper) (SATA3_3: see p.1, No. 10)(Lower)

USB 2.0 Headers (9-pin USB3_4) (see p.1, No. 17) (9-pin USB5_6) (see p.1, No. 16)

USB 3.2 Gen1 Header (19-pin F_USB3_1_2) (see p.1, No. 6)

SATA3_1

SATA3_2

IntA_PA_SSRX-

IntA_PA_SSRX+

IntA_PA_SSTX-

IntA_PA_SSTX+

IntA_PA_D-

IntA_PA_D+

Vbus

GND

SATA3_0

SATA3_3

VbusVbus

IntA_PB_SSRX-

IntA_PB_SSRX+

GND

IntA_PB_SSTX-

IntA_PB_SSTX+

GND

IntA_PB_D-

IntA_PB_D+

Dummy

ese four SATA3 connectors support SATA data cables for internal storage devices with up to

6.0 Gb/s data transfer rate.

ere are two USB

2.0 headers on this motherboard. Each USB

2.0 header can support two ports.

ere is one header on this motherboard. is USB 3.2 Gen1 header can support two ports.

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Front Panel Audio Header

J_SENSE

OUT2_L

MIC_RET

PRESENCE#

GND

OUT2_R

MIC2_R

MIC2_L

OUT_RET

GND

FAN_SPEED_CONTROL

1 2 3 4

(9-pin HD_ AUDIO1) (see p.1, No. 19)

1. High Denition Audio support s Jack Sensing, but the panel wire on the chassis

must support HDA to function correctly. Please follow the instructions in our manual and chassis manual to install your system.

2. If you use an AC’97 audio panel , please install it to the front panel audio header by

the steps below: A. Connect Mic_IN (MIC) to MIC2_ L. B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L. C. Connect Ground (GND) to Ground (GND). D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to connect them for the AC’97 audio panel. E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and adjust “Recording Volume”.

is header is for connecting audio devices to the front audio panel.

Chassis/Water Pump Fan Connectors (4-pin CHA_FAN1/WP) (see p.1, No. 4) (4-pin CHA_FAN2/WP) (see p.1, No. 15)

CPU Fan Connector (4-pin CPU_FAN1) (see p.1, No. 2)

FAN_VOLTAGE

FAN_SPEED

1 2 3 4

CPU_FAN_SPEED

FAN_SPEED_CONTR

+12V

GND

is motherboard provides two 4-Pin water cooling

chassis

fan connectors. If you plan to connect a 3-Pin

chassis water cooler fan, please connect it to Pin 1-3.

is motherboard provides a 4-Pin CPU fan (Quiet Fan) connector. If you plan to connect a 3-Pin CPU fan, please connect it to Pin 1-3.

English

B560M-HDV R2.0

CPU/Water Pump Fan

8 5

SPI_DQ3

Connector (4-pin CPU_FAN2/WP) (see p.1, No. 20)

N_SPEED_CONTROL

FAN_SPEED

FAN_VOLTAGE

GND

is motherboard provides a 4-Pin water cooling CPU fan connector. If you plan to connect a 3-Pin CPU water cooler fan, please connect it to Pin 1-3.

ATX Power Connector (24-pin ATXPWR1) (see p.1, No. 5)

ATX 12V Power Connector (8-pin ATX12V1) (see p.1, No. 1)

SPI TPM Header (13 -pi n SPI_TPM _J1) (see p.1, No. 11)

+3.3V

SPI_CS0

SPI_DQ2

Dummy

CLK

RSMRST#

SPI_MISO

SPI_MOSI

RST#

TPM_PIRQ

SPI_TPM_CS#

GND

is motherboard provides a 24-pin ATX power connector. To use a 20-pin ATX power supply, please plug it along Pin 1 and Pin

13.

is motherboard provides a 8-pin ATX 12V power connector. To use a 4-pin ATX power supply, please plug it along Pin 1 and Pin 5.

*Warning: Please make

sure that the power cable

connected is for the CPU

and not the graphics

card. Do not plug the

PCIe power cable to this

connector.

is connector supports SPI Trusted Platform Module (TPM) system, which can securely store keys, digital certicates, passwords, and data. A TPM system also helps enhance network security, protects digital identities, and ensures platform integrity.

English

Serial Port Header

(9-pin COM1) (see p.1, No. 18)

RRXD1

DDTR#1

TTXD1

DDCD#1

DDSR#1

CCTS#1

RRTS#1

GND

is COM1 header supports a serial port module.

RRI#1

English

B560M-HDV R2.0

2.7 M.2_SSD (NGFF) Module Installation Guide

e M.2, also known as the Next Generation Form Factor (NGFF), is a small size and versatile card edge connector that aims to replace mPCIe and mSATA. e Hyper M.2 Socket (M2_1) supports M Key type 2260/2280 M.2 PCI Express module up to Gen4x4 (64 Gb/s) (Only supported with 11th Gen Intel® Core™ Processors). e Ultra M.2 Socket (M2_2), supports M Key type 2260/2280 M.2 SATA3 6.0 Gb/s module and M.2 PCI Express module up to Gen3 x4 (32 Gb/s).

Installing the M.2_SSD (NGFF) Module

Step 1

Prepare a M.2_SSD (NGFF) module and the screw.

Step 2

Depending on the PCB type and length of your M.2_SSD (NGFF) module, nd the corresponding nut location to be used.

No. 1 2

Nut Location A B

PCB Length 6cm 8cm

Module Type Type2260 Ty pe 2 280

English

Step 3

Move the stando based on the module type and length.

e stando is placed at the nut location B by default. Skip Step 3 and 4 and go straight to Step 5 if you are going to use the default nut. Otherwise, release the stando by hand.

Step 4

Peel o the yellow protective lm on the nut to be used. Hand tighten the

stando into the desired nut location on the motherboard.

Step 5

Align and gently insert the M.2 (NGFF) SSD module into the M.2 slot. Please be aware that the M.2 (NGFF) SSD module only ts in one

orientation.

Step 6

Tighten the screw with a screwdriver to secure the module into place. Please do not overtighten the screw as

NUT1NUT2B

this might damage the module.

English

B560M-HDV R2.0

M.2_SSD (NGFF) Module Support List (M2_1)

Vendor Interface P/N

ADATA PCIe3 x4 ASX7000NP-128GT-C ADATA PCIe3 x4 ASX8000NP-256GM-C ADATA PCIe3 x4 ASX7000NP-256GT-C ADATA PCIe3 x4 ASX8000NP-512GM-C ADATA PCIe3 x4 ASX7000NP-512GT-C Apacer PCIe3 x4 AP240GZ280 Corsair PCIe3 x4 CSSD-F240GBMP500 Intel PCIe3 x4 SSDPEKKF256G7 Intel PCIe3 x4 SSDPEKKF512G7 Kingston PCIe3 x4 SKC1000/480G Kingston PCIe2 x4 SH2280S3/480G OCZ PCIe3 x4 RVD400-M2280-512G (NVME) PATR IOT PCIe3 x4 PH240GPM280SSDR NVME Plextor PCIe3 x4 PX-128M8PeG Plextor PCIe3 x4 PX-1TM8PeG Plextor PCIe3 x4 PX-256M8PeG Plextor PCIe3 x4 PX-512M8Pe G Plextor PCIe PX-G256M6e Plextor PCIe PX-G512M6e Samsung PCIe3 x4 SM961 MZVPW128HEGM (NVM) Samsung PCIe3 x4 PM961 MZVLW128HEGR (NVME) Samsung PCIe3 x4 960 EVO (MZ-V6E250) (NVME) Samsung PCIe3 x4 960 EVO (MZ-V6E250BW) (NVME) Samsung PCIe3 x4 SM951 (NVME) Samsung PCIe3 x4 SM951 (MZHPV256HDGL) Samsung PCIe3 x4 SM951 (MZHPV512HDGL) Samsung PCIe3 x4 SM951 (NVME) Samsung PCIe x4 XP941-512G (MZHPU512HCGL) SanDisk PCIe SD6PP4M-128G SanDisk PCIe SD6PP4M-256G TEAM PCIe3 x4 TM8FP2240G0C101 TEAM PCIe3 x4 TM8FP2480GC110 WD PCIe3 x4 WDS256G1X0C-00ENX0 (NVME) WD PCIe3 x4 WDS512G1X0C-00ENX0 (NVME)

For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for details: http://www.asrock.com

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Asrock B560M-HDV R2.0 Quick Installation Guide

Specifications and Main Features

Frequently Asked Questions

User Manual