The APL5325 is a P-channel low dropout linear regulator
which needs only one input voltage from 3 to 6V, and
delivers current up to 300mA to set output voltage. It also
can work with low ESR ceramic capacitors and is ideal for
using in the battery-powered applications such as notebook computers and cellular phones. Typical dropout voltage is only 300mV at 300mA loading.
Current limit with current foldback and thermal shutdown
functions protect the device against c urrent over-loads
and over temperature. The APL5325 is available in a SOT23-5 package.
Pin Configuration
SHDN 1
GND 2
VIN 3
SOT-23-5
5 SET
4 VOUT
•Notebook and Personal Computers
Simplified Application Circuit
V
IN
C
IN
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
B: SOT-23-5
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
APL5325 B :
25RXXXXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol Parameter Rating Unit
V
IN
V
SHDN
P
D
T
J
T
STG
T
SDR
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VIN Supply Voltage (VIN to GND) -0.3 ~ 6.5 V
SHDN Input Voltage (SHDN to GND) -0.3 ~ 6.5 V
Power Dissipation Internally Limited W
Junction Temperature -40 ~ 150
Storage Temperature -65 ~ 150
Maximum Lead Soldering Temperature, 10 Seconds 260
o
C
o
C
o
C
Thermal Characteristics
Symbol Parameter Typical Value Unit
θJA
θJC
Thermal Resistance-Junction to Ambient
Thermal Resistance-Junction to Case
Note 2 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.