ANALOG DEVICES TMP 36 GSZ Datasheet

Page 1
Low Voltage Temperature Sensors
TMP35/TMP36/TMP37
+V
S
(2.7V TO 5.5V)
V
OUT
SHUTDOWN
TMP35/ TMP36/ TMP37
00337-001
1
2
3
5
4
TOP VIEW
(Not to Scale)
NC = NO CONNECT
V
OUT
SHUT
DOWN
GND
NC
+V
S
00337-002
1 2 3 4
8 7 6 5
TOP VIEW
(Not to Scale)
NC = NO CONNECT
V
OUT
SHUTDOWN
NC
NC
+V
S
NC NC
GND
00337-003
1 3
2
BOTTOM VIEW
(Not to Scale)
PIN 1, +VS; PIN 2, V
OUT
; PIN 3, GND
00337-004
Data Sheet

FEATURES

Low voltage operation (2.7 V to 5.5 V) Calibrated directly in °C 10 mV/°C scale factor (20 mV/°C on TMP37) ±2°C accuracy over temperature (typ) ±0.5°C linearity (typ) Stable with large capacitive loads Specified −40°C to +125°C, operation to +150°C Less than 50 µA quiescent current Shutdown current 0.5 µA max Low self-heating Qualified for automotive applications

APPLICATIONS

Environmental control systems Thermal protection Industrial process control Fire alarms Power system monitors CPU thermal management

FUNCTIONAL BLOCK DIAGRAM

Figure 1.

PIN CONFIGURATIONS

Figure 2. RJ-5 (SOT-23)

GENERAL DESCRIPTION

The TMP35/TMP36/TMP37 are low voltage, precision centi­grade temperature sensors. They provide a voltage output that is linearly proportional to the Celsius (centigrade) temperature. The TMP35/TMP36/TMP37 do not require any external calibration to provide typical accuracies of ±1°C at +25°C and ±2°C over the −40°C to +125°C temperature range.
The low output impedance of the TMP35/TMP36/TMP37 and its linear output and precise calibration simplify interfacing to temperature control circuitry and ADCs. All three devices are intended for single-supply operation from 2.7 V to 5.5 V maxi­mum. The supply current runs well below 50 µA, providing very low self-heating—less than 0.1°C in still air. In addition, a shutdown function is provided to cut the supply current to less than 0.5 µA.
The TMP35 is functionally compatible with the LM35/LM45 and provides a 250 mV output at 25°C. The TMP35 reads temperatures from 10°C to 125°C. The TMP36 is specified from
−40°C to +125°C, provides a 750 mV output at 25°C, and operates to 125°C from a single 2.7 V supply. The TMP36 is functionally compatible with the LM50. Both the TMP35 and
TMP36 have an output scale factor of 10 mV/°C.
Figure 3. R-8 (SOIC_N)
Figure 4. T-3 (TO-92)
The TMP37 is intended for applications over the range of 5°C to 100°C and provides an output scale factor of 20 mV/°C. The
TMP37 provides a 500 mV output at 25°C. Operation extends
to 150°C with reduced accuracy for all devices when operating from a 5 V supply.
The TMP35/TMP36/TMP37 are available in low cost 3-lead TO-92, 8-lead SOIC_N, and 5-lead SOT-23 surface-mount packages.
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Rev. H
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Page 2
TMP35/TMP36/TMP37 Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Pin Configurations ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Typical Performance Characteristics ............................................. 5
Functional Description .................................................................... 8
Applications Information ................................................................ 9
Shutdown Operation .................................................................... 9
Mounting Considerations ........................................................... 9
Thermal Environment Effects .................................................... 9
Basic Temperature Sensor Connections .................................. 10
Fahrenheit Thermometers ........................................................ 10
Average and Differential Temperature Measurement ........... 12
Microprocessor Interrupt Generator ....................................... 13
Thermocouple Signal Conditioning with Cold-Junction
Compensation ............................................................................. 14
Using TMP35/TMP36/TMP37 Sensors in Remote
Locations ..................................................................................... 15
Temperature to 4–20 mA Loop Transmitter .......................... 15
Temperature-to-Frequency Converter .................................... 16
Driving Long Cables or Heavy Capacitive Loads .................. 17
Commentary on Long-Term Stability ..................................... 17
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 19
Automotive Products ................................................................. 19

REVISION HISTORY

5/15—Rev. G to Rev. H
Changed TMP3x to TMP35/TMP36/TMP37 ............ Throughout
Changes to Figure 28 ...................................................................... 12
Changes to Ordering Guide .......................................................... 19
11/13—Rev. F to Rev. G
Change to Table 1, Long-Term Stability Parameter ..................... 3
Change to Caption for Figure 38 .................................................. 18
Changes to Ordering Guide .......................................................... 19
11/10—Rev. E to Rev. F
Changes to Features .......................................................................... 1
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 19
Added Automotive Products Section........................................... 20
8/08—Rev. D to Rev. E
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 19
3/05—Rev. C to Rev. D
Updated Format .................................................................. Universal
Changes to Specifications ................................................................ 3
Additions to Absolute Maximum Ratings ..................................... 4
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 19
10/02—Rev. B to Rev. C
Changes to Specifications ................................................................. 3
Deleted Text from Commentary on Long-Te rm Stability
Section .............................................................................................. 13
Updated Outline Dimensions ....................................................... 14
9/01—Rev. A to Rev. B
Edits to Specifications ....................................................................... 2
Addition of New Figure 1 ................................................................. 2
Deletion of Wafer Test Limits Section ............................................ 3
6/97—Rev. 0 to Rev. A
3/96—Revision 0: Initial Version
Rev. H | Page 2 of 19
Page 3
Data Sheet TMP35/TMP36/TMP37
Parameter1
Symbol
Test Conditions/Comments
Min
Typ
Max
Unit
Scale Factor, TMP36
−40°C ≤ TA ≤ +125°C
10 mV/°C
Output Voltage Range
100 2000
mV

SPECIFICATIONS

VS = 2.7 V to 5.5 V, −40°C ≤ TA ≤ +125°C, unless otherwise noted.
Table 1.
ACCURACY
TMP35/TMP36/TMP37 (F Grade) TA = 25°C ±1 ±2 °C TMP35/TMP36/TMP37 (G Grade) TA = 25°C ±1 ±3 °C TMP35/TMP36/TMP37 (F Grade) Over rated temperature ±2 ±3 °C TMP35/TMP36/TMP37 (G Grade) Over rated temperature ±2 ±4 °C
Scale Factor, TMP35 10°C ≤ TA ≤ 125°C 10 mV/°C
Scale Factor, TMP37 5°C ≤ TA ≤ 85°C 20 mV/°C 5°C ≤ TA ≤ 100°C 20 mV/°C
3.0 V ≤ VS ≤ 5.5 V Load Regulation 0 µA ≤ IL ≤ 50 µA
−40°C ≤ TA ≤ +105°C 6 20 m°C/µA
−105°C ≤ TA ≤ +125°C 25 60 m°C/µA Power Supply Rejection Ratio PSRR TA = 25°C 30 100 m°C/V
3.0 V ≤ VS ≤ 5.5 V 50 m°C/V Linearity 0.5 °C Long-Term Stability TA = 150°C for 1000 hours 0.4 °C
SHUTDOWN
Logic High Input Voltage VIH VS = 2.7 V 1.8 V Logic Low Input Voltage VIL VS = 5.5 V 400 mV
OUTPUT
TMP35 Output Voltage TA = 25°C 250 mV TMP36 Output Voltage TA = 25°C 750 mV TMP37 Output Voltage TA = 25°C 500 mV
Output Load Current IL 0 50 µA Short-Circuit Current ISC Note 2 250 µA Capacitive Load Driving CL Device Turn-On Time
POWER SUPPLY
Supply Range VS 2.7 5.5 V Supply Current ISY (ON) Unloaded 50 µA Supply Current (Shutdown) ISY (OFF) Unloaded 0.01 0.5 µA
1
Does not consider errors caused by self-heating.
2
Guaranteed but not tested.
No oscillations Output within ±1°C, 100 kΩ||100 pF load
2
1000 10000 pF
2
0.5 1 ms
Rev. H | Page 3 of 19
Page 4
TMP35/TMP36/TMP37 Data Sheet
Shutdown Pin
GND ≤
≤ +VS
Peak Temperature
220°C (0°C/5°C)
IR Reflow Soldering—Pb-Free Package

ABSOLUTE MAXIMUM RATINGS

Table 2.
Parameter
Supply Voltage 7 V
Output Pin GND ≤ V Operating Temperature Range −55°C to +150°C Die Junction Temperature 175°C Storage Temperature Range −65°C to +160°C IR Reflow Soldering
Time at Peak Temperature Range 10 sec to 20 sec Ramp-Up Rate 3°C/sec Ramp-Down Rate −6°C/sec Time 25°C to Peak Temperature 6 min
Peak Temperature 260°C (0°C) Time at Peak Temperature Range 20 sec to 40 sec Ramp-Up Rate 3°C/sec Ramp-Down Rate −6°C/sec Time 25°C to Peak Temperature 8 min
1
Digital inputs are protected; however, permanent damage can occur on
unprotected units from high energy electrostatic fields. Keep units in conductive foam or packaging at all times until ready to use. Use proper antistatic handling procedures.
2
Remove power before inserting or removing units from their sockets.
1, 2
Rating
SHUTDOWN
≤ +VS
OUT
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device in socket.
Table 3. Thermal Resistance
Package Type θJA θJC Unit
TO-92 (T-3-1) 162 120 °C/W SOIC_N (R-8) 158 43 °C/W SOT-23 (RJ-5) 300 180 °C/W

ESD CAUTION

Rev. H | Page 4 of 19
Page 5
Data Sheet TMP35/TMP36/TMP37
TEMPERATURE (°C)
–50
LOAD REGUL ATION (m° C/µA)
0 50 100
150
50
30
20
10
0
40
00337-005
TEMPERATURE (°C)
1.4
0
1.2
1.0
0.8
0.6
0.4
0.2
1.6
1.8
2.0
–50
–25 0
25 50
75 100 125
OUTPUT VOLTAGE (V)
a
b
c
a. TMP35 b. TMP36 c. TMP37 +V
S
= 3V
00337-007
a. MAXIMUM LIMIT (G GRADE) b. TYPICAL ACCURACY ERROR c. MINIMUM LIMIT (G GRADE)
TEMPERATURE (°C)
2
–5
1
0
–1 –2
–3 –4
3
4
5
0 20 40 60 80 100 120 140
a
b
c
ACCURACY ERROR (°C)
00337-008
TEMPERATURE (°C)
0.4
0.3
0
–50 125
–25
0
25
50
75
100
0.2
0.1
POWER SUPPLY REJECTION (°C/V)
+V
S
= 3V TO 5.5V, NO LOAD
00337-009
FREQUENCY (Hz)
100.000
0.010 20
100k100
1k
10k
31.600
10.000
3.160
1.000
0.320
0.100
0.032
POWER SUPPLY REJECTION (
°
C/V)
00337-010
TEMPERATURE (
°C)
4
3
0
2
1
5
50 125
25 0 25 50 75
100
MINIMUM SUPPLY VOLTAGE (V)
b
a
MINIMUM SUPPLY VOLTAGE REQUIRED TO MEET DATA SHEET SPECIFICATION
NO LOAD
a. TMP35/TMP36 b. TMP37
00337-011

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 5. Load Regulation vs. Temperature (m°C/µA)
Figure 6. Output Voltage vs. Temperature
Figure 8. Power Supply Rejection vs. Temperature
Figure 9. Power Supply Rejection vs. Frequency
Figure 7. Accuracy Error vs. Temperatu re
Figure 10. Minimum Supply Voltage vs. Temperature
Rev. H | Page 5 of 19
Page 6
TMP35/TMP36/TMP37 Data Sheet
SUPPLY CURRENT ( µA)
TEMPERATURE (°C)
50
40
10
30
20
60
–50 125–25 0 25 50 75 100
NO LOAD
b
a
a. +VS = 5V b. +V
S
= 3V
00337-012
SUPPLY VOLTAGE (V)
40
30
0
20
10
50
0 71 2 3 4 5
6
SUPPLY CURRENT (µA)
TA = 25°C, NO LOAD
8
00337-013
TEMPERATURE (°C)
40
30
0
20
10
50
50 12525
0
25 50 75
100
a. +VS= 5V b. +VS= 3V
NO LOAD
a
b
SUPPLY CURRENT ( nA)
00337-014
TEMPERATURE (°C)
400
300
0
200
100
–50
125–25 0 25 50 75
100
= +V
S
AND SHUTDOWN PINS LOW TO HIGH (0V TO 3V) V
OUT
SETTLES WITHIN ±1°C
= +VS AND SHUTDOWN PINS HIGH TO LOW (3V TO 0V)
RESPONSE TIME (µs)
00337-015
TEMPERATURE (°C)
400
300
0
200
100
–50 125–25
0 25 50 75
100
= SHUTDOWN P IN HIGH TO LOW (3V TO 0V)
= SHUTDOWN P IN LOW TO HIGH (0V TO 3V) V
OUT
SETTLES WITHIN ±1°C
RESPONSE TIME (µs)
00337-016
TIME (µs)
0
1.0
0.8
0.6
0.4
0.2
50 2500 10050 150 200 300 350 400 450
OUTPUT VOLTAGE (V)
0
1.0
0.8
0.6
0.4
0.2
TA = 25°C +V
S
= 3V SHUTDOWN = SIGNAL
TA = 25°C +V
S
AND SHUTDOWN =
SIGNAL
00337-017
Figure 11. Supply Current vs. Temperature
Figure 12. Supply Current vs. Supply Voltage
Figure 14. V
Figure 15. V
Response Time for +VS Power-Up/Power-Down vs.
OUT
Temperature
Response Time for
OUT
SHUTDOWN
Pin vs. Temperature
Figure 13. Supply Current vs. Temperature (Shutdown = 0 V)
Figure 16. V
Response Time to
OUT
SHUTDOWN
Pin and +VS Pin vs. Time
Rev. H | Page 6 of 19
Page 7
Data Sheet TMP35/TMP36/TMP37
TIME (s)
70
0
60 50 40 30 20 10
80
90
100
110
0
100
200 300 400
500 600
a
b
c
+VS = 3V, 5V
CHANGE (%)
a. TMP35 SO IC SOLDERE D TO 0.5" × 0.3" Cu PCB b. TMP 36 SOIC SOL DE RE D TO 0.6" × 0.4" Cu PCB c. TMP35 TO-92 IN SOCKE T SOLDERED TO 1" × 0.4" Cu PCB
00337-034
AIR VELOCITY (FPM)
0
60
40
20
80
140
100
120
0 100 200 300 400 500 600
TIME CONS TANT (s)
a
b
c
a. TMP35 SO IC SOLDERE D TO 0.5" × 0.3" Cu PCB b. TMP 36 S O IC SOLDERE D TO 0.6" × 0.4" Cu PCB c. TMP35 T O-92 IN SOCKET SOLDERED TO 1" × 0.4" Cu PCB
+V
S
= 3V, 5V
700
00337-018
TIME (s)
70
0
60 50 40 30 20 10
80
90
100
110
0
10
20 30 40 50 60
a
b
c
CHANGE (%)
+VS = 3V, 5V
a. TMP35 SO IC SOLDERE D TO 0.5" × 0.3" Cu PCB b. TMP 36 SOIC SOL DE RE D TO 0.6" × 0.4" Cu PCB c. TMP35 TO-92 IN SOCKE T SOLDERED TO 1" × 0.4" Cu PCB
00337-035
10
0%
100
90
1ms
10mV
TIME/DIVISION
VOLT/DIVISION
00337-019
a
b
FREQUENCY (Hz)
2400
1000
0
10 10k100
1k
2200 2000
1600
1800
1400 1200
800 600 400 200
a. TMP35/TMP36 b. TMP37
VOLTAGE NOISE DENSITY (nV/ Hz)
00337-020
Figure 17. Thermal Response Time in Still Air
Figure 18. Thermal Response Time Constant in Forced Air
Figure 20. Temperature Sensor Wideband Output Noise Voltage;
Gain = 100, BW = 157 kHz
Figure 21. Voltage Noise Spectral Density vs. Frequency
Figure 19. Thermal Response Time in Stirred Oil Bath
Rev. H | Page 7 of 19
Page 8
TMP35/TMP36/TMP37 Data Sheet
 
 
×=
E,Q2
E,Q1
T
BE
A
A
VV ln
SHUTDOWN
V
OUT
+V
S
3X
25µA
2X
Q2 1X
R1
R2
R3
7.5µA
Q3
2X
GND
Q4
Q1
10X
6X
00337-006

FUNCTIONAL DESCRIPTION

An equivalent circuit for the TMP35/TMP36/TMP37 micropower, centigrade temperature sensors is shown in Figure 22. The core of the temperature sensor is a band gap core that comprises transistors Q1 and Q2, biased by Q3 to approximately 8 µA. The band gap core operates both Q1 and Q2 at the same collector current level; however, because the emitter area of Q1 is 10 times that of Q2, the V by the following relationship:
Resistors R1 and R2 are used to scale this result to produce the output voltage transfer characteristic of each temperature sensor and, simultaneously, R2 and R3 are used to scale the V Q1 as an offset term in V in the output characteristics of the three temperature sensors.
The output voltage of the temperature sensor is available at the emitter of Q4, which buffers the band gap core and provides load current drive. The current gain of Q4, working with the available base current drive from the previous stage, sets the short-circuit current limit of these devices to 250 µA.
of Q1 and the VBE of Q2 are not equal
BE
. Tab le 4 summarizes the differences
OUT
of
BE
Figure 22. Temperature Sensor Simplifi ed Equivalent Circuit
Table 4. TMP35/TMP36/TMP37 Output Characteristics
Sensor
Offset Voltage (V)
Output Voltage Scaling (mV/°C)
Output Voltage at 25°C (mV)
TMP35 0 10 250 TMP36 0.5 10 750 TMP37 0 20 500
Rev. H | Page 8 of 19
Page 9
Data Sheet TMP35/TMP36/TMP37
T
J
θ
JC
T
C
θ
CA
C
CH
C
C
P
D
T
A
00337-021

APPLICATIONS INFORMATION

SHUTDOWN OPERATION

All TMP35/TMP36/TMP37 devices include a shutdown capability, which reduces the power supply drain to less than
0.5 µA maximum. This feature, available only in the SOIC_N and the SOT-23 packages, is TTL/CMOS level-compatible, provided that the temperature sensor supply voltage is equal in magnitude to the logic supply voltage. Internal to the TMP35/
TMP36/TMP37 at the
source to +V
is connected. This allows the
S
SHUTDOWN
pin, a pull-up current
SHUTDOWN
pin to be driven from an open-collector/drain driver. A logic low, or zero-volt condition, on the
SHUTDOWN
pin is required to turn off the output stage. During shutdown, the output of the temperature sensors becomes high impedance where the potential of the output pin is then determined by external circuitry. If the shutdown feature is not used, it is recommended that the
SHUTDOWN
pin be connected to +VS (Pin 8 on the
SOIC_N; Pin 2 on the SOT-23).
The shutdown response time of these temperature sensors is shown in Figure 14, Figure 15, and Figure 16.

MOUNTING CONSIDERATIONS

If the TMP35/TMP36/TMP37 temperature sensors are thermally attached and protected, they can be used in any temperature measurement application where the maximum temperature range of the medium is between −40°C and +125°C. Properly cemented or glued to the surface of the medium, these sensors are within 0.01°C of the surface temperature. Caution should be exercised, especially with T-3 packages, because the leads and any wiring to the device can act as heat pipes, introducing errors if the surrounding air-surface interface is not isothermal. Avoiding this condition is easily achieved by dabbing the leads of the temper-ature sensor and the hookup wires with a bead of thermally conductive epoxy. This ensures that the TMP35/TMP36/
TMP37 die temperature is not affected by the surrounding air
temperature. Because plastic IC packaging technology is used, excessive mechanical stress should be avoided when fastening the device with a clamp or a screw-on heat tab. Thermally conductive epoxy or glue, which must be electrically nonconductive, is recommended under typical mounting conditions.
These temperature sensors, as well as any associated circuitry, should be kept insulated and dry to avoid leakage and corrosion. In wet or corrosive environments, any electrically isolated metal or ceramic well can be used to shield the temperature sensors. Condensation at very cold temperatures can cause errors and should be avoided by sealing the device, using electrically non­conductive epoxy paints or dip or any one of the many printed circuit board coatings and varnishes.

THERMAL ENVIRONMENT EFFECTS

The thermal environment in which the TMP35/TMP36/TMP37 sensors are used determines two important characteristics: self­heating effects and thermal response time. Figure 23 illustrates a thermal model of the TMP35/TMP36/TMP37 temperature sensors, which is useful in under-standing these characteristics.
Figure 23. Thermal Circuit Model
In the T-3 package, the thermal resistance junction-to-case, θJC, is 120°C/W. The thermal resistance case-to-ambient, C difference between θ
and θJC, and is determined by the char-
JA
acteristics of the thermal connection. The power dissipation of the temperature sensor, P
, is the product of the total voltage
D
across the device and its total supply current, including any current delivered to the load. The rise in die temperature above the ambient temperature of the medium is given by
T
= PD × (θJC + θCA) + TA
J
Thus, the die temperature rise of a TMP35 SOT-23 package mounted into a socket in still air at 25°C and driven from a 5 V supply is less than 0.04°C.
The transient response of the TMP35/TMP36/TMP37 sensors to a step change in the temperature is determined by the thermal resistances and the thermal capacities of the die, C and the case, C
. The thermal capacity of CC varies with the
C
measurement medium because it includes anything in direct contact with the package. In all practical cases, the thermal capacity of C
is the limiting factor in the thermal response time
C
of the sensor and can be represented by a single-pole RC time constant response. Figure 17 and Figure 19 show the thermal response time of the TMP35/TMP36/TMP37 sensors under various conditions. The thermal time constant of a temperature sensor is defined as the time required for the sensor to reach
63.2% of the final value for a step change in the temperature. For example, the thermal time constant of a TMP35 SOIC package sensor mounted onto a 0.5" × 0.3" PCB is less than 50 sec in air, whereas in a stirred oil bath, the time constant is less than 3 sec.
, is the
A
,
CH
Rev. H | Page 9 of 19
Page 10
TMP35/TMP36/TMP37 Data Sheet
2.7V < +V
S
< 5.5V
V
OUT
0.1µF
+V
S
GND
PACKAGE
+V
S
GND
V
OUT
SOIC_N 8
4 1
5
SOT-23
2 5 1
4
TO-92 1
3 2 NA
PIN ASSIGNMENTS
SHUTDOWN
TMP3x
00337-022
SHUTDOWN
( )
( )
AD589
R4R3
R3
TMP35
R2R1
R1
V
OUT
 
 
+
+
 
 
+
=
SENSOR
TCV
OUT
R1 (kΩ)
TMP35
1mV/°F 45.3 10 10
374
TMP37 2mV/°F 45.3 10
10 182
R2 (kΩ) R3 (kΩ)
R4 (kΩ)
TMP35/ TMP37
GND
R1
R2
R3
R4
AD589
1.23V
0.1µF
V
OUT
+V
S
V
OUT
+V
S
+
00337-023

BASIC TEMPERATURE SENSOR CONNECTIONS

Figure 24 illustrates the basic circuit configuration for the
TMP35/TMP36/TMP37 temperature sensors. The table in
Figure 24 shows the pin assignments of the temperature sensors for the three package types. For the SOT-23, Pin 3 is labeled NC, as are Pin 2, Pin 3, Pin 6, and Pin 7 on the SOIC_N package. It is recommended that no electrical connections be made to these pins. If the shutdown feature is not needed on the SOT-23 or on the SOIC_N package, the connected to +V
.
S
SHUTDOWN
pin should be

FAHRENHEIT THERMOMETERS

Although the TMP35/TMP36/TMP37 temperature sensors are centigrade temperature sensors, a few components can be used to convert the output voltage and transfer characteristics to directly read Fahrenheit temperatures. Figure 25 shows an example of a simple Fahrenheit thermometer using either the
TMP35 or the TMP37. Using the TMP35, this circuit can be
used to sense temperatures from 41°F to 257°F with an output transfer characteristic of 1 mV/°F; using the TMP37, this circuit can be used to sense temperatures from 41°F to 212°F with an output transfer characteristic of 2 mV/°F. This particular approach does not lend itself to the TMP36 because of its inherent 0.5 V output offset. The circuit is constructed with an
AD589, a 1.23 V voltage reference, and four resistors whose
values for each sensor are shown in the table in Figure 25. The scaling of the output resistance levels ensures minimum output loading on the temp-erature sensors. A generalized expression for the transfer equation of the circuit is given by
Figure 24. Basic Temperature Sensor Circuit Configuration
Note the 0.1 µF bypass capacitor on the input. This capacitor should be a ceramic type, have very short leads (surface-mount is preferable), and be located as close as possible in physical proximity to the temperature sensor supply pin. Because these temperature sensors operate on very little supply current and may be exposed to very hostile electrical environments, it is important to minimize the effects of radio frequency interference (RFI) on these devices. The effect of RFI on these temperature sensors specifically and on analog ICs in general is manifested as abnormal dc shifts in the output voltage due to the rectification of the high frequency ambient noise by the IC. When the devices are operated in the presence of high frequency radiated or conducted noise, a large value tantalum capacitor (±2.2 µF) placed across the 0.1 µF ceramic capacitor may offer additional noise immunity.
where: TMP35 is the output voltage of the TMP35 or the TMP37 at the measurement temperature, T
.
M
AD589 is the output voltage of the reference, that is, 1.23 V.
The output voltage of this circuit is not referenced to the circ u it’s common ground. If this output voltage were applied directly to the input of an ADC, the ADC common ground should be adjusted accordingly.
Rev. H | Page 10 of 19
Figure 25. TMP35/TMP37 Fahrenheit Thermometers
Page 11
Data Sheet TMP35/TMP36/TMP37
TMP36
GND
0.1µF
V
OUT
+V
S
R1
45.3kΩ
R2
10kΩ
+V
S
V
OUT
@ 40°F = 18mV
V
OUT
@ +257°F = 315mV
00337-024
V
OUT
@ 1mV/°F 58°F
( )
 
 
  
 
 
 
+
 
 
+
=
2
1
S
OUT
V
R3
R4
TMP36
R3
R4
R6R5
R6
V
ELEMENT
R3 R4 R5 R6
VALUE
V
OUT
R1
50kΩ
+V
S
ADM660
TMP36
OP193
R2
50kΩ
R3
R4
+3V
C1
10µF
R5
0.1µF
10µF
–3V
10µF/0.1µF
GND
NC
10µF
NC
R6
1
2
3
4
5
6
7
2
3
4
6
7
8
258.6kΩ
10kΩ
47.7kΩ
10kΩ
+
+
+
+
+
V
OUT
@ 1mV/°F
40°F ≤ T
A
≤ +257°F
00337-025
The same circuit principles can be applied to the TMP36, but because of the inherent offset of the TMP36, the circuit uses only two resistors, as shown in Figure 26. In this circuit, the output voltage transfer characteristic is 1 mV/°F but is referenced to the common ground of the circuit; however, there is a 58 mV (58°F) offset in the output voltage. For example, the output voltage of the circuit reads 18 mV if the TMP36 is placed in a
−40°F ambient environment and 315 mV at +257°F.
At the expense of additional circuitry, the offset produced by the circuit in Figure 26 can be avoided by using the circuit in Figure 27. In this circuit, the output of the TMP36 is conditioned by a single-supply, micropower op amp, the OP193. Although the entire circuit operates from a single 3 V supply, the output voltage of the circuit reads the temperature directly, with a transfer characteristic of 1 mV/°F, without offset. This is accom­plished through an ADM660, which is a supply voltage inverter. The 3 V supply is inverted and applied to the V− terminal of the
OP193. Thus, for a temperature range between −40°F and +257°F,
the output of the circuit reads −40 mV to +257 mV. A general expression for the transfer equation of the circuit is given by
Figure 26. TMP36 Fahrenheit Thermometer Version 1
Figure 27. TMP36 Fahrenheit Thermometer Version 2
Rev. H | Page 11 of 19
Page 12
TMP35/TMP36/TMP37 Data Sheet
OP193
0.1µF
2
3
4
6
7
V
TEMP(AVG)
@ 10mV/°C FO R TMP35/TM P 36 @ 20mV/°C FO R TMP37
2.7V < +V
S
< 5.5V
FOR R1 = R2 = R3 = R; V
TEMP(AVG)
= 1 (TMP3x1 + TMP3x2 + TMP3x3)
3
R1
300kΩ
R2
300kΩ
R3
300kΩ
R4
7.5kΩ
R1
3
R4 = R6
R6
7.5kΩ
R5
100kΩ
R5 =
TMP3x
TMP3x
TMP3x
+
00337-026
TMP36
@ T1
0.1µF
0.1µF
2
3
4
6
7
OP193
1µF
V
OUT
R3
1
R4
1
R2
1
R1
1
2.7V < +VS < 5.5V
TMP36
@ T2
R5
100kΩ
R6
100kΩ
V
OUT
= T2 – T1 @ 10mV/°C
V
S
2
NOTE:
1
R1–R4, CADDOCK T914–100k–100, OR EQUIVALENT.
0.1µF
R7
100kΩ
R8
25kΩ
R9
25kΩ
0°C ≤ T
A
≤ 125°C
CENTERED AT
CENTERED AT
+
00337-027

AVERAGE AND DIFFERENTIAL TEMPERATURE MEASUREMENT

In many commercial and industrial environments, temperature sensors often measure the average temperature in a building, or the difference in temperature between two locations on a factory floor or in an industrial process. The circuits in Figure 28 and Figure 29 demonstrate an inexpensive approach to average and differential temperature measurement.
In Figure 28, an OP193 sums the outputs of three temperature sensors to produce an output voltage scaled by 10 mV/°C that represents the average temperature at three locations. The circuit can be extended to include as many temperature sensors as required as long as the transfer equation of the circuit is maintained. In this application, it is recommended that one temperature sensor type be used throughout the circuit; otherwise, the output voltage of the circuit cannot produce an accurate reading of the various ambient conditions.
The circuit in Figure 29 illustrates how a pair of TMP35/TMP36/
TMP37 sensors used with an OP193 configured as a difference
amplifier can read the difference in temperature between two locations. In these applications, it is always possible that one temperature sensor is reading a temperature below that of the other sensor. To accommodate this condition, the output of the
OP193 is offset to a voltage at one-half the supply via R5 and
R6. Thus, the output voltage of the circuit is measured relative to this point, as shown in Figure 29. Using the TMP36, the output voltage of the circuit is scaled by 10 mV/°C. To minimize the error in the difference between the two measured temperatures, a common, readily available thin-film resistor network is used for R1 to R4.
Figure 28. Configuring Multiple Sensors for
Average Temperature Measurements
Rev. H | Page 12 of 19
Figure 29. Configuring Multiple Sensors for
Differential Temperature Measurements
Page 13
Data Sheet TMP35/TMP36/TMP37
( )
CMP402SWINGLOGICHYS
V
R2
R1
V
,
 
  
=
R2
1MΩ
3
4
V
OUT
+V
S
TMP35
0.1µF
GND
0.1µF
CMP402
INTERRUPT
<80°C
>80°C
REF191
R1A
10kΩ
R1B
10kΩ
3.3V
2
6
C
L
1000pF
R3
16kΩ
1µF
R4
10kΩ
V
REF
0.1µF
0.1µF
C1 = CMP402
4
1
2
4
3
14
13
5
6
R5
100kΩ
+
+
00337-028

MICROPROCESSOR INTERRUPT GENERATOR

These inexpensive temperature sensors can be used with a voltage reference and an analog comparator to configure an interrupt generator for microprocessor applications. With the popularity of fast microprocessors, the need to indicate a microprocessor overtemperature condition has grown tremendously. The circuit in Figure 30 demonstrates one way to generate an interrupt using a TMP35, a CMP402 analog comparator, and a REF191, a 2 V precision voltage reference.
The circuit is designed to produce a logic high interrupt signal if the microprocessor temperature exceeds 80°C. This 80°C trip point was arbitrarily chosen (final value set by the microprocessor thermal reference design) and is set using an R3 to R4 voltage divider of the REF191 output voltage. Because the output of the
TMP35 is scaled by 10 mV/°C, the voltage at the inverting
terminal of the CMP402 is set to 0.8 V.
Because temperature is a slowly moving quantity, the possibility for comparator chatter exists. To avoid this condition, hysteresis is used around the comparator. In this application, a hysteresis of 5°C about the trip point was arbitrarily chosen; the ultimate value for hysteresis should be determined by the end application. The output logic voltage swing of the comparator with R1 and R2 determines the amount of comparator hysteresis. Using a
3.3 V supply, the output logic voltage swing of the CMP402 is
2.6 V; therefore, for a hysteresis of 5°C (50 mV at 10 mV/°C), R1 is set to 20 kΩ, and R2 is set to 1 MΩ. An expression for the hysteresis of this circuit is given by
Because this circuit is probably used in close proximity to high speed digital circuits, R1 is split into equal values and a 1000 pF capacitor is used to form a low-pass filter on the output of the
TMP35. Furthermore, to prevent high frequency noise from
contaminating the comparator trip point, a 0.1 µF capacitor is used across R4.
Figure 30. Microprocessor Overtemperature Interrupt Generator
Rev. H | Page 13 of 19
Page 14
TMP35/TMP36/TMP37 Data Sheet
V
OUT
+V
S
TMP35
0.1µF
GND
OP193
0.1µF
R1
1
24.9kΩ
R4
4.99kΩ
R5
1
1.21MΩ
TYPE K THERMO­COUPLE
CU
CU
R2
1
102Ω
V
OUT
0V TO 2.5V
R6
100kΩ
5%
R3
10MΩ
5%
3.3V < +V
S
< 5.5V
COLD
JUNCTION
CHROMEL
ALUMEL
ISOTHERMAL
BLOCK
0°C ≤ T
A
≤ 250°C
7
6
4
3
2
P1
50kΩ
+
+
NOTE:
1
ALL RESIS TORS 1% UNLES S OTHERWIS E NOTED.
00337-029

THERMOCOUPLE SIGNAL CONDITIONING WITH COLD-JUNCTION COMPENSATION

The circuit in Figure 31 conditions the output of a Type K thermocouple, while providing cold-junction compensation for temperatures between 0°C and 250°C. The circuit operates from a single 3.3 V to 5.5 V supply and is designed to produce an output voltage transfer characteristic of 10 mV/°C.
A Type K thermocouple exhibits a Seebeck coefficient of approximately 41 µV/°C; therefore, at the cold junction, the
TMP35, with a temperature coefficient of 10 mV/°C, is used
with R1 and R2 to introduce an opposing cold-junction temp­erature coefficient of −41 µV/°C. This prevents the isothermal, cold-junction connection between the PCB tracks of the circuit
and the wires of the thermocouple from introducing an error in the measured temperature. This compensation works extremely well for circuit ambient temperatures in the range of 20°C to 50°C. Over a 250°C measurement temperature range, the thermocouple produces an output voltage change of 10.151 m V. Because the required output full-scale voltage of the circuit is 2.5 V, the gain of the circuit is set to 246.3. Choosing R4 equal to 4.99 kΩ sets R5 equal to 1.22 MΩ. Because the closest 1% value for R5 is
1.21 MΩ, a 50 kΩ potentiometer is used with R5 for fine trim of the full-scale output voltage. Although the OP193 is a superior single-supply, micropower operational amplifier, its output stage is not rail-to-rail; therefore, the 0°C output voltage level is 0.1 V. If this circuit is digitized by a single-supply ADC, the ADC common should be adjusted to 0.1 V accordingly.
Figure 31. Single-Supply, Type K Thermocouple Signal Conditioning Circuit with Cold-Junction Compensation
Rev. H | Page 14 of 19
Page 15
Data Sheet TMP35/TMP36/TMP37
TWISTED PAIR BELDEN TYPE 9502 OR EQUIVALENT
TMP3x
R2
R1
4.7kΩ
V
OUT
0.1µF
2N2907
0.01µF
GND
+V
S
5V
R3
V
OUT
SENSOR
R2 R3
TMP35 634
634
TMP36 887
887
TMP37 1k 1k
00337-030
 
 
×
+
×
×
  
=
R2
R3V
R1
R3TMP3x
R7
1
I
REF
OUT

USING TMP35/TMP36/TMP37 SENSORS IN REMOTE LOCATIONS

In many industrial environments, sensors are required to operate in the presence of high ambient noise. These noise sources take many forms, for example, SCR transients, relays, radio transmitters, arc welders, and ac motors. They can also be used at considerable distances from the signal conditioning circuitry. These high noise environments are typically in the form of electric fields, so the voltage output of the temperature sensor can be susceptible to contamination from these noise sources.
Figure 32 illustrates a way to convert the output voltage of a
TMP35/TMP36/TMP37 sensor into a current to be transmitted
down a long twisted pair shielded cable to a ground referenced receiver. The temperature sensors are not capable of high output current operation; thus, a standard PNP transistor is used to boost the output current drive of the circuit. As shown in the table in Figure 32, the values of R2 and R3 were chosen to produce an arbitrary full-scale output current of 2 mA. Lower values for the full-scale current are not recommended. The minimum-scale output current produced by the circuit could be contaminated by ambient magnetic fields operating in the near vicinity of the circuit/cable pair. Because the circuit uses an external transistor, the minimum recommended operating voltage for this circuit is 5 V. To minimize the effects of EMI (or RFI), both the circuit and the temperature sensor supply pins are bypassed with good quality ceramic capacitors.

TEMPERATURE TO 4–20 mA LOOP TRANSMITTER

In many process control applications, 2-wire transmitters are used to convey analog signals through noisy ambient environ­ments. These current transmitters use a zero-scale signal current of 4 mA, which can be used to power the signal conditioning circuitry of the transmitter. The full-scale output signal in these transmitters is 20 mA.
Figure 33 illustrates a circuit that transmits temperature inform­ation in this fashion. Using a TMP35/TMP36/TMP37 as the temperature sensor, the output current is linearly proportional to the temperature of the medium. The entire circuit operates from the 3 V output of the REF193. The REF193 requires no external trimming because of its tight initial output voltage tolerance and the low supply current of the TMP35/TMP36/
TMP37, the OP193, and the REF193. The entire circuit consumes
less than 3 mA from a total budget of 4 mA. The OP193 regulates the output current to satisfy the current summation at the noninverting node of the OP193. A generalized expression for the KCL equation at Pin 3 of the OP193 is given by
For each temperature sensor, Tabl e 5 provides the values for the components P1, P2, and R1 to R4.
Table 5. Circuit Element Values for Loop Transmitter
Sensor R1 P1 R2 P2 R3 R4
TMP35 97.6 kΩ 5 kΩ 1.58 MΩ 100 kΩ 140 kΩ 56.2 kΩ TMP36 97.6 kΩ 5 kΩ 931 kΩ 50 kΩ 97.6 kΩ 47 kΩ TMP37 97.6 kΩ 5 kΩ 10.5 kΩ 500 Ω 84.5 kΩ 8.45 kΩ
Figure 32. Remote, 2-Wire Boosted Output Current Temperature Sensor
The 4 mA offset trim is provided by P2, and P1 provides the full-scale gain trim of the circuit at 20 mA. These two trims do not interact because the noninverting input of the OP193 is held at a virtual ground. The zero-scale and full-scale output currents of the circuit are adjusted according to the operating temperature range of each temperature sensor. The Schottky diode, D1, is required in this circuit to prevent loop supply power-on transients from pulling the noninverting input of the
OP193 more than 300 mV below its inverting input. Without
this diode, such transients can cause phase reversal of the operational amplifier and possible latch-up of the transmitter. The loop supply voltage compliance of the circuit is limited by the maximum applied input voltage to the REF193; it is from 9 V to 18 V.
Rev. H | Page 15 of 19
Page 16
TMP35/TMP36/TMP37 Data Sheet
V
3V
6
REF193
2
1
R2
1
P2
P1
20mA
R3
4mA ADJUST
2
1
1
3
D1
R4
D1: HP5082-2810
+V
S
GND
R1
V
OUT
TMP3x
NOTE:
1
SEE TEXT FOR VALUES.
1
ADJUST
Figure 33. Temperature to 4–20 mA Loop Transmitter

TEMPERATURE-TO-FREQUENCY CONVERTER

Another common method of transmitting analog information from a remote location is to convert a voltage to an equivalent value in the frequency domain. This is readily done with any of the low cost, monolithic voltage-to-frequency converters (VFCs) available. These VFCs feature a robust, open-collector output transistor for easy interfacing to digital circuitry. The digital signal produced by the VFC is less susceptible to contamination from external noise sources and line voltage drops because the only important information is the frequency of the digital sig­nal. When the conversions between temperature and frequency are done accurately, the temperature data from the sensors can be reliably transmitted.
The circuit in Figure 34 illustrates a method by which the outputs of these temperature sensors can be converted to a frequency using the AD654. The output signal of the AD654 is a square wave that is proportional to the dc input voltage across Pin 4 and Pin 3. The transfer equation of the circuit is given by
f
OUT
 
 
VV
OFFSETTPM
 
CR
)(10
TT
OP193
+
1
+
7
4
1µF
0.1µF
6
10µF/0.1µF
4
R5 100k
R6
100k
100
R7
Q1 2N1711
I
L
TMP3x
P2
100k
5
+V
S
V
GND
1
R
T
5V
R
OFF1
470
SENSOR R
TMP35
TMP36
TMP37
V
LOOP
9V TO 18V
V
OUT
R
L
250
0.1µF
4
OUT
3
R1
P1
f
OUT
OFFSET
R
OFF2
10
(R1 + P1) C
T
11.8k + 500
16.2k + 500
18.2k + 1k
00337-032
1
C
T
6
8
7
AD654
5
2
NB: ATTA (MIN),
NOTE:
1
RT AND CT – SEE TABLE
T
1.7nF
1.8nF
2.1nF
R
PU
5k
1
f
OUT
f
= 0Hz
OUT
0337-031
Figure 34. Temperature-to-Frequency Converter
Rev. H | Page 16 of 19
Page 17
Data Sheet TMP35/TMP36/TMP37
TMP3x
0.1µF
GND
+V
S
750Ω
LONG CABLE OR HEAVY CAPACITIVE LOADS
V
OUT
00337-033
An offset trim network (f circuit to set f
to 0 Hz when the minimum output voltage of
OUT
the temperature sensor is reached. Potentiometer P1 is required to calibrate the absolute accuracy of the AD654. The table in Figure 34 illustrates the circuit element values for each of the three sensors. The nominal offset voltage required for 0 Hz output from the TMP35 is 50 mV; for the TMP36 and TMP37, the offset voltage required is 100 mV. For the circuit values shown, the output frequency transfer characteristic of the circuit was set at 50 Hz/°C in all cases. At the receiving end, a frequency-to-voltage converter (FVC) can be used to convert the frequency back to a dc voltage for further processing. One such FVC is the AD650.
For complete information about the AD650 and the AD654, consult the individual data sheets for those devices.

DRIVING LONG CABLES OR HEAVY CAPACITIVE LOADS

Although the TMP35/TMP36/TMP37 temperature sensors can drive capacitive loads up to 10,000 pF without oscillation, output voltage transient response times can be improved by using a small resistor in series with the output of the temperature sensor, as shown in Figure 35. As an added benefit, this resistor forms a low-pass filter with the cable capacitance, which helps to reduce bandwidth noise. Because the temperature sensor is likely to be used in environments where the ambient noise level can be very high, this resistor helps to prevent rectification by the devices of the high frequency noise. The combination of this resistor and the supply bypass capacitor offers the best protection.
OFFSET ) is included with this
OUT

COMMENTARY ON LONG-TERM STABILITY

The concept of long-term stability has been used for many years to describe the amount of parameter shift that occurs during the lifetime of an IC. This is a concept that has been typically applied to both voltage references and monolithic temperature sensors. Unfortunately, integrated circuits cannot be evaluated at room temperature (25°C) for 10 years or more to determine this shift. As a result, manufacturers very typically perform accelerated lifetime testing of integrated circuits by operating ICs at elevated temperatures (between 125°C and 150°C) over a shorter period of time (typically, between 500 and 1000 hours).
As a result of this operation, the lifetime of an integrated circuit is significantly accelerated due to the increase in rates of reaction within the semiconductor material.
Figure 35. Driving Long Cables or Heavy Capacitive Loads
Rev. H | Page 17 of 19
Page 18
TMP35/TMP36/TMP37 Data Sheet
CO
N
TR
O
LL
IN
G
DI
ME
NSION
S A
RE
I
N M
IL
L
IM
E
TE
RS
;
IN
CH
D
IM
EN
S
IO
NS
(I
N PA
RE
N
TH
ES
E
S)
AR
E
RO
U
ND
ED
-
OF
F MILLIMETER EQUIVALEN
TS FOR
REFERENCE ON
LYA
ND A
RE NO
T AP
PRO
PRIATE FOR USE IN DESIGN.
CO
MP
L
IA
N
T TO JEDEC STANDARDS MS-012
-
AA
01
2407
-A
0.
25
(
0.
00
9
8)
0.
1
7 (
0
.0
06
7
)
1
.2
7
(0
.
05
00
)
0.40 (0.0157)
0.50 (0.01
96
)
0.25 (0.0
0
99
)
4
8° 0
°
1.
7
5 (
0.
0
68
8)
1
.3
5
(0.0532)
SE
A
TI
N
G
P
L
AN
E
0.
2
5 (
0
.0098)
0.
10
(
0.
00
4
0)
4
1
8 5
5.
00
(0
.
19
68
)
4.
8
0(0.1890)
4.00 (
0
.1
57
4
)
3.80 (
0.
1
49
7)
1.
27
(
0.
05
0
0)
B
SC
6.20 (0.2441)
5.
80
(
0.
2
28
4)
0
.5
1
(0
.
02
01
)
0.31 (0.0122)
C
O
PL
AN
A
RI
TY
0.10
COMPLIANT TO JEDEC STANDARDS MO-178-AA
10°
5° 0°
SEATING PLANE
1.90 BSC
0.95 BSC
0.60
BSC
5
1 2 3
4
3.00
2.90
2.80
3.00
2.80
2.60
1.70
1.60
1.50
1.30
1.15
0.90
0.15 MAX
0.05 MIN
1.45 MAX
0.95 MIN
0.20 MAX
0.08 MIN
0.50 MAX
0.35 MIN
0.55
0.45
0.35
11-01-2010-A

OUTLINE DIMENSIONS

Figure 36. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
Figure 37. 5-Lead Small Outline Transistor Package [SOT-23]
(RJ-5)
Dimensions shown in millimeters
Rev. H | Page 18 of 19
Page 19
Data Sheet TMP35/TMP36/TMP37
042208-A
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHES E S ) ARE ROUNDED-OFF EQUIVAL E NTS FOR REFERENCE ONLY AND ARE NOT AP P ROPRIATE F OR USE IN DESIGN.
COMPLI ANT TO JEDEC STANDARDS TO-226-AA
0.020 (0.51)
0.017 (0.43)
0.014 (0.36)
0.1150 (2.92)
0.0975 (2.48)
0.0800 (2.03)
0.165 (4.19)
0.145 (3.68)
0.125 (3.18)
1
2
3
BOTTOM VIEW
FRONT VIEW
0.0220 (0.56)
0.0185 (0.47)
0.0150 (0.38)
0.105 (2.68)
0.100 (2.54)
0.095 (2.42)
0.055 (1.40)
0.050 (1.27)
0.045 (1.15)
SEATING PLANE
0.500 (12.70) MIN
0.205 (5.21)
0.190 (4.83)
0.175 (4.45)
0.210 (5.33)
0.190 (4.83)
0.170 (4.32)
TMP36GRTZ-REEL7
±3.0
−40°C to +125°C
5-Lead Small Outline Transistor Package (SOT-23)
RJ-5
#T6G
©1996–2015 Analog Devices, Inc. All rights reserved. Trademarks and
Figure 38. 3-Pin Plastic Header-Style Package [TO-92]
(T-3-1)
Dimensions shown in inches and (millimeters)

ORDERING GUIDE

Accuracy at 25°C (°C max)
Model
1, 2
TMP35FSZ-REEL ±2.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 TMP35GRTZ-REEL7 ±3.0 10°C to 125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 #T11 TMP35GT9Z ±3.0 10°C to 125°C 3-Pin Plastic Header-Style Package (TO-92) T-3-1 ADW75001Z-0REEL7 ±3.0 −40°C to +125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 #T6G TMP36FS ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 TMP36FS-REEL ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 TMP36FSZ ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 TMP36FSZ-REEL ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 TMP36GRT-REEL7 ±3.0 −40°C to +125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 T6G
TMP36GSZ ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 TMP36GSZ-REEL ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 TMP36GSZ-REEL7 ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 TMP36GT9 ±3.0 −40°C to +125°C 3-Pin Plastic Header-Style Package (TO-92) T-3-1 TMP36GT9Z ±3.0 −40°C to +125°C 3-Pin Plastic Header-Style Package (TO-92) T-3-1 TMP36-PT7 −40°C to +125°C Chips or Die TMP37FT9Z ±2.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3-1 TMP37GRTZ-REEL7 ±3.0 5°C to 100°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 #T12
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
Linear Operating Temperature Range
Package Description
Package Option
Branding

AUTOMOTIVE PRODUCTS

The ADW75001Z-0REEL7 model is available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models.
registered trademarks are the property of their respective owners. D00337-0-5/15(H)
Rev. H | Page 19 of 19
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Analog Devices Inc.: TMP36FSZ TMP35GT9Z TMP36GSZ-REEL TMP36GT9Z TMP37FT9Z TMP36GT9 TMP36GSZ-REEL7
TMP36GRTZ-REEL7 TMP35GRTZ-REEL7 TMP36FS TMP37GRTZ-REEL7 TMP36-PT7 TMP36GSZ TMP36FSZ­REEL TMP36FS-REEL TMP36GRT-REEL7 TMP35FSZ-REEL
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