Low Voltage Temperature Sensors
FEATURES
Low voltage operation (2.7 V to 5.5 V)
Calibrated directly in °C
10 mV/°C scale factor (20 mV/°C on TMP37)
±2°C accuracy over temperature (typ)
±0.5°C linearity (typ)
Stable with large capacitive loads
Specified −40°C to +125°C, operation to +150°C
Less than 50 µA quiescent current
Shutdown current 0.5 µA max
Low self-heating
APPLICATIONS
Environmental control systems
Thermal protection
Industrial process control
Fire alarms
Power system monitors
CPU thermal management
GENERAL DESCRIPTION
The TMP35, TMP36, and TMP37 are low voltage, precision,
centigrade temperature sensors. They provide a voltage output
that is linearly proportional to the Celsius (centigrade) temperature. The TMP35/TMP36/TMP37 do not require any external
calibration to provide typical accuracies of ±1°C at +25°C and
±2°C over the −40°C to +125°C temperature range.
The low output impedance of the TMP35/TMP36/TMP37 and
its linear output and precise calibration simplify interfacing to
temperature control circuitry and A/D converters. All three
devices are intended for single-supply operation from 2.7 V to
5.5 V maximum. The supply current runs well below 50 µA,
providing very low self-heating—less than 0.1°C in still air. In
addition, a shutdown function is provided to cut the supply
current to less than 0.5 µA.
The TMP35 is functionally compatible with the LM35/LM45
and provides a 250 mV output at 25°C. The TMP35 reads
temperatures from 10°C to 125°C. The TMP36 is specified from
−40°C to +125°C, provides a 750 mV output at 25°C, and
operates to 125°C from a single 2.7 V supply. The TMP36 is
functionally compatible with the LM50. Both the TMP35 and
TMP36 have an output scale factor of 10 mV/°C. The TMP37 is
intended for applications over the range 5°C to 100°C and
TMP35/TMP36/TMP37
FUNCTIONAL BLOCK DIAGRAM
VS (2.7V TO 5.5V)
SHUTDOWN
PIN CONFIGURATIONS
V
1
OUT
+V
2
S
3
NC
NC = NO CONNECT
1
V
OUT
2
NC
3
NC
4
GND
NC = NO CONNECT
PIN 1, +V
provides an output scale factor of 20 mV/°C. The TMP37
provides a 500 mV output at 25°C. Operation extends to 150°C
with reduced accuracy for all devices when operating from a
5 V supply.
The TMP35/TMP36/TMP37 are available in low cost 3-lead
TO-92, SOIC-8, and 5-lead SOT-23 surface-mount packages.
TMP35/
TMP36/
TMP37
Figure 1.
GND
5
TOP VIEW
(Not to Scale)
4
SHUTDOWN
Figure 2. RT-5 (SOT-23)
8
+V
S
7
TOP VIEW
(Not to Scale)
NC
6
NC
SHUTDOWN
5
Figure 3. RN-8 (SOIC )
2
1 3
BOTTOM VIEW
(Not to Scale)
; PIN 2, V
S
; PIN 3, GND
OUT
Figure 4. TO-92
V
OUT
00337-004
00337-001
00337-002
00337-003
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved.
www.analog.com
TMP35/TMP36/TMP37
TABLE OF CONTENTS
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Typical Performance Characteristics ............................................. 5
Functional Description .................................................................... 8
Applications....................................................................................... 9
Shutdown Operation.................................................................... 9
Mounting Considerations ........................................................... 9
Thermal Environment Effects .................................................... 9
Basic Temperature Sensor Connections.................................. 10
Fahrenheit Thermometers ........................................................ 10
Average and Differential Temperature Measurement........... 12
REVISION HISTORY
3/05—Rev. C to Rev. D
Updated Format..................................................................Universal
Changes to Specifications................................................................ 3
Additions to Absolute Maximum Ratings..................................... 4
Updated Outline Dimensions....................................................... 19
Changes to Ordering Guide.......................................................... 19
Microprocessor Interrupt Generator....................................... 13
Thermocouple Signal Conditioning with Cold-Junction
Compensation
Using TMP3x Sensors in Remote Locations .......................... 15
Temperature to 4–20 mA Loop Transmitter .......................... 15
Temperature to Frequency Converter ..................................... 16
Driving Long Cables or Heavy Capacitive Loads.................. 17
Commentary on Long-Term Stability..................................... 17
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 19
10/02—Rev. B to Rev. C
Deleted text from Commentary on Long-Term Stability section
........................................................................................................... 13
Update OUTLINE DIMENSIONS............................................... 14
9/01—Rev. A to Rev. B
............................................................................. 14
Rev. D | Page 2 of 20
TMP35/TMP36/TMP37
SPECIFICATIONS
VS = 2.7 V to 5.5 V, –40°C ≤ TA ≤ +125°C, unless otherwise noted.
Table 1.
Parameter
ACCURACY
TMP35/TMP36/TMP37F TA = 25°C ±1 ±2 °C
TMP35/TMP36/TMP37G TA = 25°C ±1 ±3 °C
TMP35/TMP36/TMP37F Over rated temperature ±2 ±3 °C
TMP35/TMP36/TMP37G Over rated temperature ±2 ±4 °C
Scale Factor, TMP35 10°C ≤ TA ≤ +125°C 10 mV/°C
Scale Factor, TMP36 –40°C ≤ TA ≤+125°C 10 mV/°C
Scale Factor, TMP37 5°C ≤ TA ≤ 85°C 20 mV/°C
5°C ≤ TA ≤ 100°C 20 mV/°C
3.0 V ≤ VS ≤ 5.5 V
Load Regulation 0 µA ≤ IL ≤ 50 µA
–40°C ≤ TA ≤ +105°C 6 20 m°C/µA
–105°C ≤ TA ≤ +125°C 25 60 m°C/µA
Power Supply Rejection Ratio PSRR TA = 25°C 30 100 m°C/V
3.0 V ≤ VS ≤ 5.5 V 50 m°C/V
Linearity 0.5 °C
Long-Term Stability TA = 150°C for 1 kHz 0.4 °C
SHUTDOWN
Logic High Input Voltage V
Logic Low Input Voltage V
OUTPUT
TMP35 Output Voltage TA = 25°C 250 mV
TMP36 Output Voltage TA = 25°C 750 mV
TMP37 Output Voltage TA = 25°C 500 mV
Output Voltage Range 100 2000 mV
Output Load Current I
Short-Circuit Current I
Capacitive Load Driving C
Device Turn-On Time Output within ±1°C 100 kΩ||100 pF load2 0.5 1 ms
POWER SUPPLY
Supply Range V
Supply Current ISY (ON) Unloaded 50 µA
Supply Current (Shutdown) ISY (OFF) Unloaded 0.01 0.5 µA
1
Does not consider errors caused by self-heating.
2
Guaranteed but not tested.
1
Symbol Conditions Min Typ Max Unit
IH
IL
L
SC
L
S
VS = 2.7 V 1.8 V
VS = 5.5 V 400 mV
0 50 µA
Note 2 250 µA
No oscillations
2
1000 10000 pF
2.7 5.5 V
Rev. D | Page 3 of 20
TMP35/TMP36/TMP37
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage 7 V
Shutdown Pin
Output Pin
Operating Temperature Range
Die Junction Temperature 175°C
Storage Temperature Range
IR Reflow Soldering
Peak Temperature 220°C (0°C/5°C)
Time at Peak Temperature 10 s to 20 s
Ramp-up Rate 3°C/s max
Ramp-down Rate
Time 25°C to Peak Temperature 6 mins max
IR Reflow Soldering—Pb-free
Package
Peak Temperature 260°C (0°C)
Time at Peak Temperature 20 s to 40 s
Ramp-up Rate 3°C/s max
Ramp-down Rate
Time 25°C to Peak Temperature 8 min max
1
Digital inputs are protected; however, permanent damage might occur
on unprotected units from high energy electrostatic fields. Keep units in
conductive foam or packaging at all times until ready to use. Use proper
antistatic handling procedures.
2
Remove power before inserting or removing units from their sockets.
1, 2
Rating
SHUTDOWN
GND ≤
GND ≤ V
OUT
≤ V
−55°C to +150°C
−65°C to +160°C
−6°C/s max
−6°C/s max
S
≤ V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
S
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Package Type
θ
JA
θ
JC
Unit
1
TO-92 (T9 Suffix) 162 120 °C/W
SOIC-8 (S Suffix) 158 43 °C/W
SOT-23 (RT Suffix) 300 180 °C/W
1
θJA is specified for device in socket (worst-case conditions).
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. D | Page 4 of 20
TMP35/TMP36/TMP37
TYPICAL PERFORMANCE CHARACTERISTICS
50
0.4
40
30
20
LOAD REG (m°C/µA)
10
0
–50
0 50 100 150
TEMPERATURE (°C)
Figure 5. Load Regulation vs. Temperature (m°C/µA)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
OUTPUT VOLTAGE (V)
0.4
0.2
a. TMP35
b. TMP36
c. TMP37
= 3V
V
S
0
–50 –25 0 25 50 75 100 125
TEMPERATURE (°C)
Figure 6. Output Voltage vs. Temperature
5
4
3
a
2
1
0
–1
–2
ACCURACY ERROR (°C)
–3
–4
–5
0 20 40 60 80 100 120 140
a. MAXIMUM LIMIT (G GRADE)
b. TYPICAL ACCURACY ERROR
c. MINIMUM LIMIT (G GRADE)
b
c
TEMPERATURE (°C)
Figure 7. Accuracy Error vs. Temperature
V+ = 3V TO 5.5V, NO LOAD
0.3
0.2
0.1
POWER SUPPLY REJECTION (°C/V)
00337-005
0
–50 125–25 0 25 50 75 100
TEMPERATURE (°C)
00337-009
Figure 8. Power Supply Rejection vs. Temperature
100.000
c
b
a
00337-007
31.600
10.000
3.160
1.000
0.320
0.100
POWER SUPPLY REJECTION (°C/V)
0.032
0.010
20 100k100 1k 10k
FREQUENCY (Hz)
00337-010
Figure 9. Power Supply Rejection vs. Frequency
5
MINIMUM SUPPLY VOLTAGE REQUIRED TO MEET
DATA SHEET SPECIFICATION
4
NO LOAD
3
b
00337-008
2
1
MINIMUM SUPPLY VOLTAGE (V)
a. TMP35/TMP36
b. TMP37
0
–50 125–25 0 25 50 75 100
TEMPERATURE (°C)
a
00337-011
Figure 10. Minimum Supply Voltage vs. Temperature
Rev. D | Page 5 of 20
TMP35/TMP36/TMP37
60
a. V+ = 5V
50
40
30
SUPPLY CURRENT (µA)
20
b. V+ = 3V
NO LOAD
400
300
s)
µ
a
b
200
RESPONSE TIME (
100
= V+ AND SHUTDOWN PINS
HIGH TO LOW (3V TO 0V)
= V+ AND SHUTDOWN PINS
LOW TO HIGH (0V TO 3V)
V
SETTLES WITHIN ±1°C
OUT
10
–50 125–25 0 25 50 75 100
TEMPERATURE (°C)
Figure 11. Supply Current vs. Temperature
50
TA = 25°C, NO LOAD
40
30
20
SUPPLY CURRENT (µA)
10
0
07123 456
SUPPLY VOLTAGE (V)
Figure 12. Supply Current vs. Supply Voltage
50
a. V+ = 5V
b. V+ = 3V
40
NO LOAD
30
20
SUPPLY CURRENT (nA)
10
0
–50 125–25
25 50 75
0
TEMPERATURE (°C)
a
100
Figure 13. Supply Current vs. Temperature (Shutdown = 0 V)
00337-012
Figure 14. V
0
–50 125–25 0 25 50 75
Response Time for V+ Power-Up/Power-Down vs. Temperature
OUT
TEMPERATURE (°C)
100
00337-015
400
= SHUTDOWN PIN
HIGH TO LOW (3V TO 0V)
300
s)
µ
200
RESPONSE TIME (
8
00337-013
100
0
–50 125–25 0 25 50 75
Figure 15. V
Response Time for Shutdown Pin vs. Temperature
OUT
TEMPERATURE (°C)
= SHUTDOWN PIN
LOW TO HIGH (0V TO 3V)
V
SETTLES WITHIN ±1°C
OUT
100
00337-016
1.0
0.8
0.6
0.4
0.2
0
1.0
0.8
OUTPUT VOLTAGE (V)
0.6
0.4
b
00337-014
0.2
0
–50 2500 10050 150 200 300 350 400 450
Figure 16. V
OUT
TA = 25°C
V+ = 3V
SHUTDOWN =
SIGNAL
TA = 25°C
V+ AND SHUTDOWN =
SIGNAL
TIME (µs)
Response Time to Shutdown and V+ Pins vs. Time
00337-017
Rev. D | Page 6 of 20
TMP35/TMP36/TMP37
110
100
90
80
70
60
50
40
30
PERCENT OF CHANGE (%)
20
10
0
0
140
120
100
80
60
TIME CONSTANT (s)
40
20
0
0 100 200 300 400 500 600
Figure 18. Thermal Response Time Constant in Forced Air
110
100
90
80
70
60
50
CHANGE (%)
40
30
20
10
0
0
Figure 19. Thermal Response Time in Stirred Oil Bath
a
b
a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" × 0.4" Cu PCB
100
c
200 300 400 500 600
TIME (s)
VIN = 3V, 5V
Figure 17. Thermal Response Time in Still Air
a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" × 0.4" Cu PCB
VIN = 3V, 5V
b
c
a
AIR VELOCITY (FPM)
a
c
b
a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" × 0.4" Cu PCB
10
VIN = 3V, 5V
20 30 40 50 60
TIME (s)
700
00337-034
00337-018
00337-035
100
90
VOLT/DIVISION
10
0%
10mV
TIME/DIVISION
1ms
Figure 20. Temperature Sensor Wideband Output Noise Voltage;
Gain = 100, BW = 157 kHz
2400
2200
2000
1800
1600
1400
1200
1000
800
600
400
VOLTAGE NOISE DENSITY (nV/ Hz)
a. TMP35/TMP36
b. TMP37
200
0
10 10k100 1k
FREQUENCY (Hz)
b
a
Figure 21. Voltage Noise Spectral Density vs. Frequency
00337-019
00337-020
Rev. D | Page 7 of 20
TMP35/TMP36/TMP37
FUNCTIONAL DESCRIPTION
An equivalent circuit for the TMP3x family of micropower,
centigrade temperature sensors is shown in Figure 22. The core
of the temperature sensor is a band gap core, which is comprised
of transistors Q1 and Q2, biased by Q3 to approximately 8 µA.
The band gap core operates both Q1 and Q2 at the same
collector current level; however, since the emitter area of Q1 is
10 times that of Q2, Q1’s V
following relationship:
⎛
⎜
×=∆
VV ln
BE
T
⎜
⎝
Resistors R1 and R2 are used to scale this result to produce
the output voltage transfer characteristic of each temperature
sensor and, simultaneously, R2 and R3 are used to scale Q1’s V
as an offset term in V
between the three temperature sensors’ output characteristics.
The output voltage of the temperature sensor is available at the
emitter of Q4, which buffers the band gap core and provides
load current drive. Q4’s current gain, working with the available
base current drive from the previous stage, sets the short-circuit
current limit of these devices to 250 µA.
and Q2’s VBE are not equal by the
BE
⎞
A
E,Q1
⎟
⎟
A
E,Q2
⎠
. Table 3 summarizes the differences
OUT
V
S
SHDN
25µA
3X
2X
Q2
Q4
10X
V
OUT
BE
6X
GND
Figure 22. Temperature Sensor Simplified Equivalent Circuit
1X
R1
Q1
R3
R2
7.5µA
Q3
2X
00337-006
Table 3. TMP3x Output Characteristics
Sensor
Offset
Voltage (V)
Output Voltage
Scaling (mV/°C)
Output Voltage
@ 25°C (mV)
TMP35 0 10 250
TMP36 0.5 10 750
TMP37 0 20 500
Rev. D | Page 8 of 20
TMP35/TMP36/TMP37
APPLICATIONS
SHUTDOWN OPERATION
All TMP3x devices include a shutdown capability, which
reduces the power supply drain to less than 0.5 µA maximum.
This feature, available only in the SOIC-8 and the SOT-23
packages, is TTL/CMOS level-compatible, provided that the
temperature sensor supply voltage is equal in magnitude to the
logic supply voltage. Internal to the TMP3x at the
pin, a pull-up current source to V
the
SHUTDOWN
pin to be driven from an open-collector/drain
is connected. This permits
IN
driver. A logic low, or zero-volt condition on the
SHUTDOWN
SHUTDOWN
pin is required to turn off the output stage. During shutdown,
the output of the temperature sensors becomes a high impedance state where the potential of the output pin would then be
determined by external circuitry. If the shutdown feature is not
used, it is recommended that the
to V
(Pin 8 on the SOIC-8; Pin 2 on the SOT-23).
IN
SHUTDOWN
pin be connected
The shutdown response time of these temperature sensors is
shown in Figure 14, Figure 15, and Figure 16.
MOUNTING CONSIDERATIONS
If the TMP3x temperature sensors are thermally attached and
protected; they can be used in any temperature measurement
application where the maximum temperature range of the
medium is between −40 °C and +125°C. Properly cemented or
glued to the surface of the medium, these sensors are within
0.01°C of the surface temperature. Caution should be exercised,
especially with TO-92 packages, because the leads and any
wiring to the device can act as heat pipes, introducing errors if
the surrounding air-surface interface is not isothermal. Avoiding
this condition is easily achieved by dabbing the leads of the
temperature sensor and the hookup wires with a bead of
thermally conductive epoxy. This ensures that the TMP3x die
temperature is not affected by the surrounding air temperature.
Because plastic IC packaging technology is used, excessive
mechanical stress should be avoided when fastening the device
with a clamp or a screw-on heat tab. Thermally conductive
epoxy or glue, which must be electrically nonconductive, is
recommended under typical mounting conditions.
These temperature sensors, as well as any associated circuitry,
should be kept insulated and dry to avoid leakage and corrosion.
In wet or corrosive environments, any electrically isolated metal
or ceramic well can be used to shield the temperature sensors.
Condensation at very cold temperatures can cause errors and
should be avoided by sealing the device, using electrically nonconductive epoxy paints or dip or any one of the many printed
circuit board coatings and varnishes.
THERMAL ENVIRONMENT EFFECTS
The thermal environment in which the TMP3x sensors are used
determines two important characteristics: self-heating effects
and thermal response time. Figure 23 illustrates a thermal model
of the TMP3x temperature sensors, which is useful in
understanding these characteristics.
T
C
P
D
CH
Figure 23. Thermal Circuit Model
In the TO-92 package, the thermal resistance junction-to-case,
θ
, is 120°C/W. The thermal resistance case-to-ambient, CA, is
JC
the difference between θ
characteristics of the thermal connection. The temperature
sensor’s power dissipation, P
across the device and its total supply current, including any
current delivered to the load. The rise in die temperature above
the medium’s ambient temperature is given by
= PD × (θJC + θCA) + T
T
J
Thus, the die temperature rise of a TMP35 SOT-23 package
mounted into a socket in still air at 25°C and driven from a 5 V
supply is less than 0.04°C.
The transient response of the TMP3x sensors to a step change
in the temperature is determined by the thermal resistances and
the thermal capacities of the die, C
thermal capacity C
varies with the measurement medium since
C
it includes anything in direct contact with the package. In all
practical cases, the thermal capacity of C
in the thermal response time of the sensor and can be represented
by a single-pole RC time constant response. Figure 17 and
Figure 19 show the thermal response time of the TMP3x
sensors under various conditions. The thermal time constant
of a temperature sensor is defined as the time required for the
sensor to reach 63.2% of the final value for a step change in the
temperature. For example, the thermal time constant of a
TMP35 SOIC package sensor mounted onto a 0.5" by 0.3" PCB
is less than 50 sec in air, whereas in a stirred oil bath, the time
constant is less than 3 sec.
θ
J
JC
and θJC, and is determined by the
JA
, is the product of the total voltage
D
A
T
C
C
, and the case, CC. The
CH
θ
C
CA
is the limiting factor
C
T
A
00337-021
Rev. D | Page 9 of 20
TMP35/TMP36/TMP37
BASIC TEMPERATURE SENSOR CONNECTIONS
Figure 24 illustrates the basic circuit configuration for the
TMP3x family of temperature sensors. The table in Figure 24
shows the pin assignments of the temperature sensors for the
three package types. For the SOT-23, Pin 3 is labeled as NC, as
are Pins 2, 3, 6, and 7 on the SOIC-8 package. It is recommended
that no electrical connections be made to these pins. If the
shutdown feature is not needed on the SOT-23 or the SOIC-8
package, the
SHUTDOWN
SHDN
pin should be connected to VS.
2.7V < VS< 5.5V
0.1µF
V
S
TMP3x
GND
V
OUT
FAHRENHEIT THERMOMETERS
Although the TMP3x temperature sensors are centigrade
temperature sensors, a few components can be used to convert
the output voltage and transfer characteristics to directly read
Fahrenheit temperatures. Figure 25 shows an example of a
simple Fahrenheit thermometer using either the TMP35 or the
TMP37. This circuit can be used to sense temperatures from
41°F to 257°F with an output transfer characteristic of 1 mV/°F
using the TMP35, and from 41°F to 212°F using the TMP37
with an output characteristic of 2 mV/°F. This particular
approach does not lend itself to the TMP36 because of its
inherent 0.5 V output offset. The circuit is constructed with an
AD589, a 1.23 V voltage reference, and four resistors whose
values for each sensor are shown in the table in Figure 25. The
scaling of the output resistance levels is to ensure minimum
output loading on the temperature sensors. A generalized
expression for the circuit’s transfer equation is given by
PIN ASSIGNMENTS
GND
V
SHDN
OUT
00337-022
PACKAGE
SOIC-8 8 4 1 5
SOT-23-5 2 5 1 4
TO-92 1 3 2 NA
Figure 24. Basic Temperature Sensor Circuit Configuration
V
S
Note the 0.1 µF bypass capacitor on the input. This capacitor
should be a ceramic type, have very short leads (surface-mount
is preferable), and be located as close as possible in physical
proximity to the temperature sensor supply pin. Since these
temperature sensors operate on very little supply current and
could be exposed to very hostile electrical environments, it is
important to minimize the effects of radio frequency interference
(RFI) on these devices. The effect of RFI on these temperature
sensors in specific and analog ICs in general is manifested as
abnormal dc shifts in the output voltage due to the rectification
of the high frequency ambient noise by the IC. When the
devices are operated in the presence of high frequency radiated
or conducted noise, a large value tantalum capacitor (±2.2 µF)
placed across the 0.1 µF ceramic might offer additional noise
immunity.
V
OUT
⎛
⎜
=
⎜
⎝
⎞
R1
⎟
()
TMP35
⎟
R2R1
+
⎠
⎛
⎜
+
⎜
⎝
⎞
R3
⎟
()
AD589
⎟
R4R3
+
⎠
where:
TMP35 is the output voltage of the TMP35 or the TMP37 at the
measurement temperature, T
.
M
AD589 is the output voltage of the reference = 1.23 V.
The output voltage of this circuit is not referenced to the
circuit’s common ground. If this output voltage were applied
directly to the input of an ADC, the ADC’s common ground
should be adjusted accordingly.
V
AD589
1.23V
S
V
TMP35/
TMP37
GND
S
V
OUT
R1
+
R2
V
OUT
R3
–
R4
0.1µF
Rev. D | Page 10 of 20
PIN ASSIGNMENTS
SENSOR
TMP35
TMP37 2mV/°F 45.3 10 10 182
Figure 25. TMP35/TMP37 Fahrenheit Thermometers
TCV
R1 (kΩ)
OUT
1mV/°F 45.3 10 10 374
R2 (kΩ) R3 (kΩ) R4 (kΩ)
00337-023
TMP35/TMP36/TMP37
0
The same circuit principles can be applied to the TMP36, but
because of the TMP36’s inherent offset, the circuit uses two less
resistors as shown in Figure 26. In this circuit, the output
voltage transfer characteristic is 1 mV/°F but is referenced to
the circuit’s common ground; however, there is a 58 mV (58°F)
offset in the output voltage. For example, the output voltage of
the circuit would read 18 mV were the TMP36 placed in −40°F
ambient environment and 315 mV at 257°F.
V
S
V
S
V
GND
OUT
R1
45.3kΩ
R2
10kΩ
V
@ –40°F = 18mV
OUT
V
@ +257°F = 315mV
OUT
V
@ 1mV/°F–58°F
OUT
+3V
00337-024
.1µF
TMP36
Figure 26. TMP36 Fahrenheit Thermometer Version 1
At the expense of additional circuitry, the offset produced by
the circuit in Figure 26 can be avoided by using the circuit in
Figure 27. In this circuit, the output of the TMP36 is conditioned
by a single supply, micropower op amp, the OP193. Although
the entire circuit operates from a single 3 V supply, the output
voltage of the circuit reads the temperature directly, with a
transfer characteristic of 1 mV/°F, without offset. This is accomplished through an ADM660, which is a supply voltage inverter.
The 3 V supply is inverted and applied to the P193’s V-terminal.
Thus, for a temperature range between −40°F and +257°F, the
output of the circuit reads –40 mV to +257 mV. A general
expression for the circuit’s transfer equation is given by
⎛
R6
⎞
⎜
⎟
⎜
⎟
R6R5
+
⎝
⎠
⎛
OUT
⎜
=
⎜
⎝
V
⎞
R4
⎟
()
1
TMP36
+
⎟
R3
⎠
−
V
R4
⎛
⎜
R3
⎝
⎞
⎛
⎞
S
⎟
⎜
⎟
2
⎠
⎠
⎝
10µF/0.1µF
R1
50kΩ
+
R2
50kΩ
V
S
GND
ELEMENT
V
OUT
TMP36
R2
R4
R5
R6
258.6kΩ
10kΩ
47.7kΩ
10kΩ
+
TMP36
10µF
C1
NC
+
10µF
R3
2
–
R5
R6
8
1
2
ADM660
4
3
3
+
5
6
7
8
OP193
4
+
–3V
10µF
NC
R4
0.1µF
V
@ 1mV/°F
OUT
6
–40°F ≤ T
≤ +257°F
A
00337-025
Figure 27. TMP36 Fahrenheit Thermometer Version 2
Rev. D | Page 11 of 20
TMP35/TMP36/TMP37
<
AVERAGE AND DIFFERENTIAL TEMPERATURE MEASUREMENT
In many commercial and industrial environments, temperature
sensors often measure the average temperature in a building, or
the difference in temperature between two locations on a factory
floor or in an industrial process. The circuits in Figure 28 and
Figure 29 demonstrate an inexpensive approach to average and
differential temperature measurement. In Figure 28, an OP193
sums the outputs of three temperature sensors to produce an
output voltage scaled by 10 mV/°C that represents the average
temperature at three locations. The circuit can be extended to as
many temperature sensors as required as long as the circuit’s
transfer equation is maintained. In this application, it is recommended that one temperature sensor type be used throughout
the circuit; otherwise, the output voltage of the circuit cannot
produce an accurate reading of the various ambient conditions.
The circuit in Figure 29 illustrates how a pair of TMP3x sensors
used with an OP193 configured as a difference amplifier can
read the difference in temperature between two locations. In
these applications, it is always possible that one temperature
sensor is reading a temperature below that of the other sensor.
To accommodate this condition, the output of the OP193 is
offset to a voltage at one-half the supply via R5 and R6. Thus,
the output voltage of the circuit is measured relative to this
point, as shown in the figure. Using the TMP36, the output
voltage of the circuit is scaled by 10 mV/°C. To minimize the
error in the difference between the two measured temperatures,
a common, readily available thin-film resistor network is used
for R1 to R4.
0.1µF
TMP3x
TMP3x
TMP3x
2.7V
VS< 5.5V
0.1µF
V
TEMP(AVG)
@ 10mV/°C FOR TMP35/TMP36
@ 20mV/°C FOR TMP35/TMP36
1
R5
100kΩ
R6
7.5kΩ
= 1 (TMP3x1 + TMP3x2 + TMP3x3)
3
R1
300kΩ
R2
300kΩ
R3
300kΩ
7.5kΩ
7
2
–
OP193
3
+
4
FOR R1 = R2 = R3 = R;
V
TEMP(AVG)
R1
R5 =
R4
3
R4 = R6
Figure 28. Configuring Multiple Sensors for
Average Temperature Measurements
2.7V < VS< 5.5V
1
TMP36
@ T1
R8
25kΩ
R1
00337-026
1
R2
0.1µF
TMP36
0°≤ TA≤ 125°C
0.1µF
7
2
–
1µF
R6
100kΩ
3
OP193
+
1
R3
@ T2
NOTE:
1
R1–R4, CADDOCK T914–100k–100, OR EQUIVALENT.
R9
25kΩ
CENTERED AT
1
R4
R5
100kΩ
6
4
= T2 – T1 @ 10mV/°C
V
OUT
CENTERED AT
Figure 29. Configuring Multiple Sensors for
Differential Temperature Measurements
V
R7
100kΩ
V
2
S
OUT
00337-027
Rev. D | Page 12 of 20
TMP35/TMP36/TMP37
(
0
MICROPROCESSOR INTERRUPT GENERATOR
These inexpensive temperature sensors can be used with a
voltage reference and an analog comparator to configure an
interrupt generator for microprocessor applications. With the
popularity of fast 486 and Pentium® laptop computers, the need
to indicate a microprocessor overtemperature condition has
grown tremendously. The circuit in Figure 30 demonstrates one
way to generate an interrupt using a TMP35, a CMP402 analog
comparator, and a REF191, a 2 V precision voltage reference.
The circuit is designed to produce a logic high interrupt signal
if the microprocessor temperature exceeds 80°C. This 80°C trip
point was arbitrarily chosen (final value set by the microprocessor
thermal reference design) and is set using an R3–R4 voltage
divider of the REF191’s output voltage. Since the output of the
TMP35 is scaled by 10 mV/°C, the voltage at the CMP402’s
inverting terminal is set to 0.8 V.
3.3V
Since temperature is a slowly moving quantity, the possibility
for comparator chatter exists. To avoid this condition, hysteresis
is used around the comparator. In this application, a hysteresis
of 5°C about the trip point was arbitrarily chosen; the ultimate
value for hysteresis should be determined by the end application.
The output logic voltage swing of the comparator with R1 and
R2 determine the amount of comparator hysteresis. Using a 3.3 V
supply, the output logic voltage swing of the CMP402 is 2.6 V;
therefore, for a hysteresis of 5°C (50 mV @ 10 mV/°C), R1 is set
to 20 kΩ, and R2 is set to 1 MΩ. An expression for this circuit’s
hysteresis is given by
R1
⎛
V
V
⎜
⎟
R2
⎝
⎠
CMP402SWINGLOGICHYS
,
⎞
=
)
Because this circuit is probably used in close proximity to high
speed digital circuits, R1 is split into equal values and a 1000 pF
is used to form a low-pass filter on the output of the TMP35.
Furthermore, to prevent high frequency noise from contaminating the comparator trip point, a 0.1 µF capacitor is used
across R4.
.1µF
V
TMP35
GND
R2
1MΩ
S
V
OUT
R5
100kΩ
REF191
3
R1A
10kΩ
0.1µF
2
6
+
4
1µF
1
C1 = CMP402
4
C
L
1000pF
R3
16kΩ
R1B
10kΩ
R4
10kΩ
6
–
CMP402
5
+
13
V
REF
0.1µF
0.1µF
3
4
2
14
<80°C
INTERRUPT
>80°C
00337-028
Figure 30. Pentium Overtemperature Interrupt Generator
Rev. D | Page 13 of 20
TMP35/TMP36/TMP37
THERMOCOUPLE SIGNAL CONDITIONING WITH
COLD-JUNCTION COMPENSATION
The circuit in Figure 31 conditions the output of a Type K
thermocouple, while providing cold-junction compensation for
temperatures between 0°C and 250°C. The circuit operates from
single 3.3 V to 5.5 V supplies and is designed to produce an
output voltage transfer characteristic of 10 mV/°C.
A Type K thermocouple exhibits a Seebeck coefficient of
approximately 41 µV/°C; therefore, at the cold junction, the
TMP35, with a temperature coefficient of 10 mV/°C, is used
with R1 and R2 to introduce an opposing cold-junction
temperature coefficient of –41 µV/°C. This prevents the
isothermal, cold-junction connection between the circuit’s
V
S
V
OUT
GND
CU
CU
TYPE K
THERMOCOUPLE
0.1µF
CHROMEL
ALUMEL
0°C ≤ T ≤ 250°C
+
–
TMP35
COLD
JUNCTION
ISOTHERMAL
BLOCK
Figure 31. Single-Supply, Type K Thermocouple Signal Conditioning Circuit with Cold-Junction Compensation
1
R1
24.9kΩ
1
R2
102Ω
PCB tracks and the thermocouple’s wires from introducing an
error in the measured temperature. This compensation works
extremely well for circuit ambient temperatures in the range of
20°C to 50°C. Over a 250°C measurement temperature range,
the thermocouple produces an output voltage change of
10.151 mV. Since the required circuit’s output full-scale voltage
is 2.5 V, the gain of the circuit is set to 246.3. Choosing R4 equal
to 4.99 kΩ sets R5 equal to 1.22 MΩ. Since the closest 1% value
for R5 is 1.21 MΩ, a 50 kΩ potentiometer is used with R5 for
fine trim of the full-scale output voltage. Although the OP193 is
a superior single-supply, micropower operational amplifier, its
output stage is not rail-to-rail; as such, the 0°C output voltage
level is 0.1 V. If this circuit is digitized by a single-supply ADC,
the ADC’s common should be adjusted to 0.1 V accordingly.
< 5.5V
3.3V < V
S
P1
R3
R4
10MΩ
4.99kΩ
5%
0.1µF
7
2
–
OP193
3
+
4
NOTE:
1
ALL RESISTORS 1% UNLESS OTHERWISE NOTED.
R5
1.21MΩ
6
50kΩ
1
V
OUT
0V – 2.5V
R6
100kΩ
5%
00337-029
Rev. D | Page 14 of 20
TMP35/TMP36/TMP37
USING TMP3x SENSORS IN REMOTE LOCATIONS
In many industrial environments, sensors are required to
operate in the presence of high ambient noise. These noise
sources take on many forms, for example, SCR transients,
relays, radio transmitters, arc welders, and ac motors. They can
also be used at considerable distances from the signal conditioning circuitry. These high noise environments are very
typically in the form of electric fields, so the voltage output of
the temperature sensor can be susceptible to contamination
from these noise sources.
Figure 32 illustrates a way to convert the output voltage of a
TMP3x sensor into a current to be transmitted down a long
twisted-pair shielded cable to a ground referenced receiver. The
temperature sensors are not capable of high output current
operation; thus, a standard PNP transistor is used to boost the
output current drive of the circuit. As shown in the table in
Figure 32, the values of R2 and R3 were chosen to produce an
arbitrary full-scale output current of 2 mA. Lower values for the
full-scale current are not recommended. The minimum-scale
output current produced by the circuit could be contaminated
by nearby ambient magnetic fields operating in the vicinity of
the circuit/cable pair. Because the circuit uses an external
transistor, the minimum recommended operating voltage for
this circuit is 5 V. To minimize the effects of EMI (or RFI), both
the circuit and the temperature sensor supply pins are bypassed
with good quality, ceramic capacitors.
R1
4.7kΩ
2N2907
0.1µF
0.01µF
SENSOR R2 R3
TMP35 634 634
TMP36 887 887
TMP37 1k 1k
Figure 32. Remote, 2-Wire Boosted Output Current Temperature Sensor
V
TMP3x
S
GND
V
OUT
R2
TWISTED PAIR
BELDEN TYPE 9502
OR EQUIVALENT
5V
V
OUT
R3
00337-030
TEMPERATURE TO 4–20 mA LOOP TRANSMITTER
In many process control applications, 2-wire transmitters are
used to convey analog signals through noisy ambient environments. These current transmitters use a zero-scale signal current
of 4 mA, which can be used to power the transmitter’s signal
conditioning circuitry. The full-scale output signal in these
transmitters is 20 mA.
Figure 33 illustrates a circuit that transmits temperature information in this fashion. Using a TMP3x as the temperature sensor,
the output current is linearly proportional to the temperature of
the medium. The entire circuit operates from the 3 V output of
the REF193. The REF193 requires no external trimming because
of the REF193’s tight initial output voltage tolerance and the low
supply current of TMP3x, the OP193 and the REF193. The entire
circuit consumes less than 3 mA from a total budget of 4 mA.
The OP193 regulates the output current to satisfy the current
summation at the noninverting node of the OP193. A generalized
expression for the KCL equation at the OP193’s Pin 3 is given by
×
I
OUT
⎛
1
⎞
⎛
⎜
×
=
⎟
⎜
⎜
R7
⎠
⎝
⎝
R3TMP3x
R1
For each of the three temperature sensors, the table below
illustrates the values for each of the components, P1, P2, and
R1–R4.
Table 4. Circuit Element Values for Loop Transmitter
Sensor
TMP35 97.6 5 1.58 M 100 k 140 56.2
TMP36 97.6 5 931 k 50 k 97.6 47
TMP37 97.6 5 10.5 k 500 84.5 8.45
R1(kΩ) P1(kΩ) R2(Ω) P2(Ω) R3(kΩ) R4(kΩ)
The 4 mA offset trim is provided by P2, and P1 provides the
circuit’s full-scale gain trim at 20 mA. These two trims do not
interact because the noninverting input of the OP193 is held at
a virtual ground. The zero-scale and full-scale output currents
of the circuit are adjusted according to the operating temperature
range of each temperature sensor. The Schottky diode, D1, is
required in this circuit to prevent loop supply power-on
transients from pulling the noninverting input of the OP193
more than 300 mV below its inverting input. Without this
diode, such transients could cause phase reversal of the
operational amplifier and possible latch-up of the transmitter.
The loop supply voltage compliance of the circuit is limited by
the maximum applied input voltage to the REF193; it is from
9 V to 18 V.
×
R3V
R2
⎞
⎟
⎟
⎠
REF
+
Rev. D | Page 15 of 20
TMP35/TMP36/TMP37
3V
6
REF193
2
1
R2
1
P2
V
S
1
GND
R1
V
OUT
TMP3x
NOTE:
1
SEE TEXT FOR VALUES.
20mA
ADJUST
4mA
ADJUST
3
1
P1
1
R3
2
D1
R4
D1: HP5082-2810
Figure 33. Temperature to 4–20 mA Loop Transmitter
TEMPERATURE-TO-FREQUENCY CONVERTER
Another common method of transmitting analog information
from a remote location is to convert a voltage to an equivalent
value in the frequency domain. This is readily done with any of
the low cost, monolithic voltage-to-frequency converters (VFCs)
available. These VFCs feature a robust, open-collector output
transistor for easy interfacing to digital circuitry. The digital
signal produced by the VFC is less susceptible to contamination
from external noise sources and line voltage drops because the
only important information is the frequency of the digital signal. When the conversions between temperature and frequency
are done accurately, the temperature data from the sensors can
be reliably transmitted.
The circuit in Figure 34 illustrates a method by which the
outputs of these temperature sensors can be converted to a
frequency using the AD654. The output signal of the AD654 is
a square wave that is proportional to the dc input voltage across
Pins 4 and 3. The transfer equation of the circuit is given by
f
OUT
⎛
−
⎜
=
⎜
⎝
VV
⎞
OFFSETTPM
⎟
⎟
××
)(10
CR
TT
⎠
–
OP193
+
1
+
7
4
1µF
0.1µF
4
R5
100kΩ
R6
100kΩ
100Ω
V
LOOP
9V TO 18V
Q1
2N1711
R7
I
L
V
OUT
R
L
250Ω
00337-032
5V
1
C
T
6
8
7
AD654
5
2
NB: ATTA (min),
NOTE:
1
RT AND CT– SEE TABLE
T
1.7nF
1.8nF
2.1nF
R
PU
5kΩ
1
f
OUT
f
= 0Hz
OUT
00337-031
10µF/0.1µF
TMP3x
P2
100kΩ
V
S
V
GND
1
R
T
5V
R
OFF1
470Ω
SENSOR R
TMP35
TMP36
TMP37
0.1µF
4
OUT
3
R1
P1
f
OUT
OFFSET
R
OFF2
10Ω
(R1 + P1) C
T
11.8kΩ + 500Ω
16.2kΩ + 500Ω
18.2kΩ + 1kΩ
Figure 34. Temperature-to-Frequency Converter
Rev. D | Page 16 of 20
TMP35/TMP36/TMP37
An offset trim network (f
circuit to set f
at 0 Hz when the temperature sensor’s mini-
OUT
mum output voltage is reached. Potentiometer P1 is required to
calibrate the absolute accuracy of the AD654. The table in
Figure 34 illustrates the circuit element values for each of the
three sensors. The nominal offset voltage required for 0 Hz
output from the TMP35 is 50 mV; for the TMP36 and TMP37,
the offset voltage required is 100 mV. For the circuit values
shown, the output frequency transfer characteristic of the
circuit was set at 50 Hz/°C in all cases. At the receiving end, a
frequency-to-voltage converter (FVC) can be used to convert
the frequency back to a dc voltage for further processing. One
such FVC is the AD650.
For complete information on the AD650 and AD654, consult
the individual data sheets for those devices.
DRIVING LONG CABLES OR HEAVY CAPACITIVE LOADS
Although the TMP3x family of temperature sensors can drive
capacitive loads up to 10,000 pF without oscillation, output
voltage transient response times can be improved by using a
small resistor in series with the output of the temperature
sensor, as shown in Figure 35. As an added benefit, this resistor
forms a low-pass filter with the cable’s capacitance, which helps
to reduce bandwidth noise. Since the temperature sensor is
likely to be used in environments where the ambient noise level
can be very high, this resistor helps to prevent rectification by
the devices of the high frequency noise. The combination of this
resistor and the supply bypass capacitor offers the best protection.
V
OFFSET ) is included with this
OUT
S
COMMENTARY ON LONG-TERM STABILITY
The concept of long-term stability has been used for many years
to describe by what amount an IC’s parameter shifts during its
lifetime. This is a concept that has been typically applied to both
voltage references and monolithic temperature sensors. Unfortunately, integrated circuits cannot be evaluated at room
temperature (25°C) for 10 years or so to determine this shift.
As a result, manufacturers very typically perform accelerated
lifetime testing of integrated circuits by operating ICs at elevated
temperatures (between 125°C and 150°C) over a shorter period
of time (typically, between 500 and 1,000 hours).
As a result of this operation, the lifetime of an integrated circuit
is significantly accelerated due to the increase in rates of reaction
within the semiconductor material.
V
750Ω
0.1µF
Figure 35. Driving Long Cables or Heavy Capacitive Loads
TMP3x
GND
OUT
LONG CABLE OR
HEAVY CAPACITIVE
LOADS
00337-033
Rev. D | Page 17 of 20
TMP35/TMP36/TMP37
OUTLINE DIMENSIONS
2.90 BSC
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
0.25 (0.0098)
0.10 (0.0040)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
85
1.27 (0.0500)
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-012AA
BSC
6.20 (0.2440)
5.80 (0.2284)
41
1.75 (0.0688)
1.35 (0.0532)
0.51 (0.0201)
0.31 (0.0122)
0.25 (0.0098)
0.17 (0.0067)
0.50 (0.0196)
0.25 (0.0099)
8°
1.27 (0.0500)
0°
0.40 (0.0157)
Figure 36. 8-Lead Standard Small Outline Package [SOIC]
Narrow Body (RN-8)
Dimensions shown in millimeters and (inches)
0.210 (5.33)
0.170 (4.32)
0.205 (5.21)
0.175 (4.45)
0.135 (3.43)
MIN
0.050 (1.27)
MAX
0.500 (12.70) MIN
SEATING
PLANE
× 45°
0.019 (0.482)
0.016 (0.407)
SQ
4 5
0.50
0.30
3
2.80 BSC
0.95 BSC
1.45 MAX
SEATING
PLANE
0.22
0.08
1.60 BSC
1.30
1.15
0.90
0.15MAX
1
2
PIN 1
1.90
BSC
COMPLIANT TO JEDEC STANDARDS MO-178AA
Figure 37. 5-Lead Plastic Surface-Mount Package [SOT-23]
(RT-5)
Dimensions shown in millimeters
0.165 (4.19)
0.055 (1.40)
0.045 (1.15)
0.105 (2.66)
0.095 (2.42)
0.115 (2.92)
0.080 (2.03)
0.125 (3.18)
3
2
1
BOTTOM VIEW
0.115 (2.92)
0.080 (2.03)
10°
5°
0°
0.60
0.45
0.30
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS TO-226-AA
Figure 38. 3-Pin Plastic Header-Style Package [TO-92]
Dimensions shown in inches and (millimeters)
Rev. D | Page 18 of 20
TMP35/TMP36/TMP37
ORDERING GUIDE
Accuracy at
Model
25°C (°C max)
TMP35FS ±2.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP35FS-REEL ±2.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP35GRT-REEL7 ±3.0 10°C to 125°C 5-Lead Plastic Surface-Mount Package (SOT-23) RT-5 T5G
TMP35GS ±3.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP35GS-REEL ±3.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP35GT9 ±3.0 10°C to 125°C 3-Pin Plastic Header-Style Package (TO-92) TO-92
TMP36FS ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP36FS-REEL ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP36FSZ1 ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP36FSZ-REEL1 ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP36GRT-REEL7 ±3.0 −40°C to +125°C 5-Lead Plastic Surface-Mount Package (SOT-23) RT-5 T6G
TMP36GRTZ-REEL71±3.0 −40°C to +125°C 5-Lead Plastic Surface-Mount Package (SOT-23) RT-5 T6G
TMP36GS ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP36GS-REEL ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP36GS-REEL7 ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP36GSZ
TMP36GSZ-REEL
TMP36GSZ-REEL7
1
±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
1
±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
1
±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP36GT9 ±3.0 −40°C to +125°C 3-Pin Plastic Header-Style Package (TO-92) TO-92
TMP36CSURF DIE
TMP37FS ±2.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP37FS-REEL ±2.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP37FT9 ±2.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) TO-92
TMP37FT9-REEL ±2.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) TO-92
TMP37GRT-REEL7 ±3.0 5°C to 100°C 5-Lead Plastic Surface-Mount Package (SOT-23) RT-5 T7G
TMP37GS ±3.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP37GS-REEL ±3.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP37GSZ
TMP37GSZ-REEL
1
±3.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC) RN-8
1
±3.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC) RN-8
TMP37GT9 ±3.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) TO-92
TMP37GT9-REEL ±3.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) TO-3
1
Z = Pb-free part.
Linear Operating
Temperature Range
Package Description
Package
Option
Branding
Rev. D | Page 19 of 20
TMP35/TMP36/TMP37
NOTES
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00337–0–3/05(D)
Rev. D | Page 20 of 20
Loading...