ANALOG DEVICES TMP05 Service Manual

±0.5°C Accurate PWM
V

FEATURES

Modulated serial digital output, proportional to
temperature ±0.5°C typical accuracy at 25°C ±1.0°C accuracy from 0°C to 70°C Two grades available Operation from −40°C to +150°C Operation from 3 V to 5.5 V Power consumption 70 μW maximum at 3.3 V CMOS-/TTL-compatible output on TMP05 Flexible open-drain output on TMP06 Small, low cost, 5-lead SC-70 and SOT-23 packages

APPLICATIONS

Isolated sensors Environmental control systems Computer thermal monitoring Thermal protection Industrial process control Power-system monitors
Temperature Sensor in 5-Lead SC-70
TMP05/TMP06

FUNCTIONAL BLOCK DIAGRAM

DD
5
TMP05/TMP06
TEMPERATURE
CONV/I N
2
SENSOR
REFERENCE
CLK AND
TIMING
GENERATION
Σ-Δ
CORE
4
GND
Figure 1.
AVE RAG IN G
BLOCK/
COUNTER
OUTPUT
CONTROL
1
3
OUT
FUNC
03340-001

GENERAL DESCRIPTION

The TMP05/TMP06 are monolithic temperature sensors that generate a modulated serial digital output (PWM), which varies in direct proportion to the temperature of the devices. The high period (T while the low period (T high temperature accuracy of ±1°C from 0°C to 70°C with excellent transducer linearity. The digital output of the TMP05/ TMP06 is CMOS-/TTL-compatible and is easily interfaced to the serial inputs of most popular microprocessors. The flexible open-drain output of the TMP06 is capable of sinking 5 mA.
The TMP05/TMP06 are specified for operation at supply voltages from 3 V to 5.5 V. Operating at 3.3 V, the supply current is typically 370 µA. The TMP05/TMP06 are rated for operation over the –40°C to +150°C temperature range. It is not recom­mended to operate these devices at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the devices. They are packaged in low cost, low area SC-70 and SOT-23 packages.
The TMP05/TMP06 have three modes of operation: continu­ously converting mode, daisy-chain mode, and one shot mode.
) of the PWM remains static over all temperatures,
H
) varies. The B Grade version offers a
L
A three-state FUNC input determines the mode in which the TMP05/TMP06 operate.
The CONV/IN input pin is used to determine the rate at which the TMP05/TMP06 measure temperature in continuously converting mode and one shot mode. In daisy-chain mode, the CONV/IN pin operates as the input to the daisy chain.

PRODUCT HIGHLIGHTS

1. The TMP05/TMP06 have an on-chip temperature sensor
that allows an accurate measurement of the ambient temperature. The measurable temperature range is –40°C to +150°C.
2. Supply voltage is 3 V to 5.5 V.
3. Space-saving 5-lead SOT-23 and SC-70 packages.
4. Temperature accuracy is typically ±0.5°C. Each part needs
a decoupling capacitor to achieve this accuracy.
5. Temperature resolution of 0.025°C.
6. The TMP05/TMP06 feature a one shot mode that reduces
the average power consumption to 102 µW at 1 SPS.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved.
TMP05/TMP06
TABLE OF CONTENTS
Features.............................................................................................. 1
Converter Details ....................................................................... 13
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
TMP05A/TMP06A Specifications ............................................. 3
TMP05B/TMP06B Specifications .............................................. 5
Timing Characteristics ................................................................ 7
Absolute Maximum Ratings............................................................ 8
ESD Caution.................................................................................. 8
Pin Configuration and Function Descriptions............................. 9
Typical Performance Characteristics ........................................... 10
Theory of Operation ...................................................................... 13
Circuit Information.................................................................... 13
Functional Description.............................................................. 13
Operating Modes........................................................................ 13
TMP05 Output ........................................................................... 16
TMP06 Output ........................................................................... 16
Application Hints ........................................................................... 17
Thermal Response Time ........................................................... 17
Self-Heating Effects.................................................................... 17
Supply Decoupling..................................................................... 17
Layout Considerations............................................................... 18
Temperature Monitoring........................................................... 18
Daisy-Chain Application........................................................... 18
Continuously Converting Application.................................... 24
Outline Dimensions....................................................................... 26
Ordering Guide .......................................................................... 26

REVISION HISTORY

4/06—Rev. A to Rev. B
Changes to Table 1............................................................................ 3
Changes to Table 2............................................................................ 5
Changes to Table 8.......................................................................... 14
Changes to Table 9.......................................................................... 15
10/05—Rev. 0 to Rev. A
Changes to Specifications Table...................................................... 3
Changes to Absolute Maximum Ratings....................................... 8
Changes to Figure 4.......................................................................... 8
Changes to Figure 7........................................................................ 10
Changes to Figure 15...................................................................... 11
Deleted Figure 18............................................................................ 12
Changes to One Shot Mode Section ............................................ 14
Changes to Figure 20...................................................................... 14
Changes to Daisy-Chain Mode Section ...................................... 15
Changes to Figure 23...................................................................... 15
Changes to Equation 5 and Equation 7 ....................................... 17
Added Layout Considerations Section........................................ 18
Updated Outline Dimensions....................................................... 26
Changes to Ordering Guide.......................................................... 26
8/04—Revision 0: Initial Version
Rev. B | Page 2 of 28
TMP05/TMP06

SPECIFICATIONS

TMP05A/TMP06A SPECIFICATIONS

All A grade specifications apply for −40°C to +150°C, VDD decoupling capacitor is a 0.1 µF multilayer ceramic, TA = T V
= 3.0 V to 5.5 V, unless otherwise noted.
DD
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
TEMPERATURE SENSOR AND ADC
Nominal Conversion Rate (One Shot Mode) See Table 7
Accuracy @ VDD = 3.0 V to 5.5 V ±2 °C TA = 0°C to 70°C, VDD = 3.0 V to 5.5 V ±3 °C TA = –40°C to +100°C, VDD = 3.0 V to 5.5 V ±4 °C TA = –40°C to +125°C, VDD = 3.0 V to 5.5 V ±5
1
°C TA = –40°C to +150°C, VDD = 3.0 V to 5.5 V Temperature Resolution 0.025 °C/5 μs Step size for every 5 μs on TL TH Pulse Width 40 ms TA = 25°C, nominal conversion rate TL Pulse Width 76 ms TA = 25°C, nominal conversion rate
Quarter Period Conversion Rate
(All Operating Modes) See Tab le 7 Accuracy
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL TH Pulse Width 10 ms TA = 25°C, QI conversion rate TL Pulse Width 19 ms TA = 25°C, QP conversion rate
Double High/Quarter Low Conversion Rate
(All Operating Modes) See Tab le 7 Accuracy
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL TH Pulse Width 80 ms TA = 25°C, DH/QL conversion rate TL Pulse Width 19 ms TA = 25°C, DH/QL conversion rate
Long-Term Drift 0.081 °C Drift over 10 years, if part is operated at 55°C Temperature Hysteresis 0.0023 °C Temperature cycle = 25°C to 100°C to 25°C
SUPPLIES
Supply Voltage 3 5.5 V Supply Current
Normal Mode2
@ 3.3 V 370 600 μA Nominal conversion rate
@ 5.0 V 425 650 μA Nominal conversion rate Quiescent2
@ 3.3 V 3 12 μA Device not converting, output is high
@ 5.0 V 5.5 20 μA Device not converting, output is high One Shot Mode @ 1 SPS 30.9 μA
Average current @ V
DD
nominal conversion rate @ 25°C
37.38 μA
Average current @ V
DD
nominal conversion rate @ 25°C
Power Dissipation 803.33 μW
= 3.3 V, continuously converting at
V
DD
nominal conversion rates @ 25°C
1 SPS 101.9 μW
Average power dissipated for V one shot mode @ 25°C
186.9 μW
Average power dissipated for V one shot mode @ 25°C
MIN
= 3.3 V,
= 5.0 V,
to T
DD
DD
,
MAX
= 3.3 V,
= 5.0 V,
Rev. B | Page 3 of 28
TMP05/TMP06
Parameter Min Typ Max Unit Test Conditions/Comments
TMP05 OUTPUT (PUSH-PULL)
Output High Voltage (VOH) VDD − 0.3 V IOH = 800 μA Output Low Voltage (VOL) 0.4 V IOL = 800 μA Output High Current (I Pin Capacitance 10 pF Rise Time (tLH)5 50 ns Fal l Time (tHL)
5
RON Resistance (Low Output) 55 Ω Supply and temperature dependent
TMP06 OUTPUT (OPEN DRAIN)3
Output Low Voltage (VOL) 0.4 V IOL = 1.6 mA Output Low Voltage (VOL) 1.2 V IOL = 5.0 mA Pin Capacitance 10 pF High Output Leakage Current (IOH) 0.1 5 μA PWM Device Turn-On Time 20 ms Fal l Time (tHL)6 30 ns RON Resistance (Low Output) 55 Ω Supply and temperature dependent
DIGITAL INPUTS3
Input Current ±1 μA VIN = 0 V to VDD Input Low Voltage (VIL) 0.3 × VDD V Input High Voltage (VIH) 0.7 × VDD V Pin Capacitance 3 10 pF
1
It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
2
Normal mode current relates to current during TL. TMP05/TMP06 are not converting during TH, so quiescent current relates to current during TH.
3
Guaranteed by design and characterization, not production tested.
4
It is advisable to restrict the current being pulled from the TMP05 output because any excess currents going through the die cause self-heating. As a consequence,
false temperature readings can occur.
5
Test load circuit is 100 pF to GND.
6
Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
OUT
3
4
)
2 mA Typ VOH = 3.17 V with VDD = 3.3 V
50 ns
= 5.5 V
OUT
Rev. B | Page 4 of 28
TMP05/TMP06

TMP05B/TMP06B SPECIFICATIONS

All B grade specifications apply for –40°C to +150°C; VDD decoupling capacitor is a 0.1 µF multilayer ceramic; TA = T V
= 3 V to 5.5 V, unless otherwise noted.
DD
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
TEMPERATURE SENSOR AND ADC
Nominal Conversion Rate (One Shot Mode) See Table 7
Accuracy1
@ VDD = 3.3 V (±5%) ±0.2 ±1 °C TA = 0°C to 70°C, VDD = 3.135 V to 3.465 V
@ VDD = 5 V (±10%) ±0.4 −1/+1.5 °C TA = 0°C to 70°C, VDD = 4.5 V to 5.5 V
@ VDD = 3.3 V (±10%) and 5 V (±10%) ±1.5 °C
±2 °C
±2.5 °C
±4.5
2
°C
= –40°C to +70°C, VDD = 3.0 V to 3.6 V,
T
A
= 4.5 V to 5.5 V
V
DD
= –40°C to +100°C, VDD = 3.0 V to 3.6 V,
T
A
= 4.5 V to 5.5 V
V
DD
= –40°C to +125°C, VDD = 3.0 V to 3.6 V,
T
A
V
= 4.5 V to 5.5 V
DD
= –40°C to +150°C, VDD = 3.0 V to 3.6 V,
T
A
= 4.5 V to 5.5 V
V
DD
Temperature Resolution 0.025 °C/5 μs Step size for every 5 μs on TL TH Pulse Width 40 ms TA = 25°C, nominal conversion rate TL Pulse Width 76 ms TA = 25°C, nominal conversion rate
Quarter Period Conversion Rate
See
Table 7
(All Operating Modes)
Accuracy
1
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5.0 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL TH Pulse Width 10 ms TA = 25°C, QP conversion rate TL Pulse Width 19 ms TA = 25°C, QP conversion rate
Double High/Quarter Low Conversion Rate
See
Table 7
(All Operating Modes) Accuracy
1
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL TH Pulse Width 80 ms TA = 25°C, DH/QL conversion rate TL Pulse Width 19 ms TA = 25°C, DH/QL conversion rate
Long-Term Drift
0.081 °C Drift over 10 years, if part is operated at 55°C
Temperature Hysteresis 0.0023 °C Temperature cycle = 25°C to 100°C to 25°C
SUPPLIES
Supply Voltage 3 5.5 V Supply Current
Normal Mode3
@ 3.3 V 370 600 μA Nominal conversion rate
@ 5.0 V 425 650 μA Nominal conversion rate Quiescent
3
@ 3.3 V 3 12 μA Device not converting, output is high
@ 5.0 V 5.5 20 μA Device not converting, output is high One Shot Mode @ 1 SPS 30.9 μA
Average current @ V nominal conversion rate @ 25°C
37.38 μA
Average current @ V nominal conversion rate @ 25°C
to T
MIN
= 3.3 V,
DD
= 5.0 V,
DD
MAX
,
Rev. B | Page 5 of 28
TMP05/TMP06
Parameter Min Typ Max Unit Test Conditions/Comments
Power Dissipation 803.33 μW
1 SPS 101.9 μW
186.9 μW
TMP05 OUTPUT (PUSH-PULL)
4
Output High Voltage (VOH) VDD − 0.3 V IOH = 800 μA Output Low Voltage (VOL) 0.4 V IOL = 800 μA Output High Current (I
OUT
5
)
2 mA Typical VOH = 3.17 V with VDD = 3.3 V Pin Capacitance 10 pF Rise Time (tLH)6 50 ns Fall Time (tHL)6 50 ns RON Resistance (Low Output) 55 Ω Supply and temperature dependent
TMP06 OUTPUT (OPEN DRAIN)4
Output Low Voltage (VOL) 0.4 V IOL = 1.6 mA Output Low Voltage (VOL) 1.2 V IOL = 5.0 mA Pin Capacitance 10 pF High Output Leakage Current (IOH) 0.1 5 μA PWM Device Turn-On Time 20 ms Fall Time (tHL)
7
30 ns RON Resistance (Low Output) 55 Ω Supply and temperature dependent
DIGITAL INPUTS
4
Input Current ±1 μA VIN = 0 V to VDD Input Low Voltage (VIL) 0.3 × VDD V Input High Voltage (VIH) 0.7 × VDD V Pin Capacitance 3 10 pF
1
The accuracy specifications for 3.0 V to 3.6 V and 4.5 V to 5.5 V supply ranges are specified to 3-Σ performance.
2
It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
3
Normal mode current relates to current during TL. TMP05/TMP06 are not converting during TH, so quiescent current relates to current during TH.
4
Guaranteed by design and characterization, not production tested.
5
It is advisable to restrict the current being pulled from the TMP05 output because any excess currents going through the die cause self-heating. As a consequence,
false temperature readings can occur.
6
Test load circuit is 100 pF to GND.
7
Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
= 3.3 V, continuously converting at
V
DD
nominal conversion rates @ 25°C Average power dissipated for V
one shot mode @ 25°C Average power dissipated for V
one shot mode @ 25°C
= 5.5 V
OUT
= 3.3 V,
DD
= 5.0 V,
DD
Rev. B | Page 6 of 28
TMP05/TMP06

TIMING CHARACTERISTICS

TA = T
Table 3.
Parameter Limit Unit Comments
TH 40 ms typ PWM high time @ 25°C under nominal conversion rate TL 76 ms typ PWM low time @ 25°C under nominal conversion rate
1
t
3
1
t
4
2
t
4
t5 25 μs max Daisy-chain start pulse width
1
Test load circuit is 100 pF to GND.
2
Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
to T
MIN
, VDD = 3.0 V to 5.5 V, unless otherwise noted. Guaranteed by design and characterization, not production tested.
MAX
50 ns typ TMP05 output rise time
50 ns typ TMP05 output fall time
30 ns typ TMP06 output fall time
T
H
T
L
t
3
90%10%
t
4
90% 10%
03340-002
Figure 2. PWM Output Nominal Timing Diagram (25°C)
START PULS E
t
5
03340-003
Figure 3. Daisy-Chain Start Timing
Rev. B | Page 7 of 28
TMP05/TMP06

ABSOLUTE MAXIMUM RATINGS

Table 4.
Parameter Rating
VDD to GND –0.3 V to +7 V Digital Input Voltage to GND –0.3 V to VDD + 0.3 V Maximum Output Current (OUT) ±10 mA Operating Temperature Range
1
–40°C to +150°C Storage Temperature Range –65°C to +160°C Maximum Junction Temperature, TJ max 150°C 5-Lead SOT-23 (RJ-5)
Power Dissipation
2
W
= (TJ max – T
MAX
A
3
)/θJA
Thermal Impedance4
θJA, Junction-to-Ambient (Still Air) 240°C/W
5-Lead SC-70 (KS-5)
Power Dissipation2 W
= (TJ max – T
MAX
A
3
)/θJA
Thermal Impedance4
θJA, Junction-to-Ambient 534.7°C/W θJC, Junction-to-Case 172.3°C/W
IR Reflow Soldering
Peak Temperature 220°C (0°C/5°C) Time at Peak Temperature 10 sec to 20 sec Ramp-Up Rate 2°C/s to 3°C/s Ramp-Down Rate −6°C/s Time 25°C to Peak Temperature 6 minutes max
IR Reflow Soldering (Pb-Free Package)
Peak Temperature 260°C (0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec max Ramp-Down Rate –6°C/sec max Time 25°C to Peak Temperature 8 minutes max
1
It is not recommended to operate the device at temperatures above 125°C
for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond this limit affects device reliability.
2
SOT-23 values relate to the package being used on a 2-layer PCB and SC-70
values relate to the package being used on a 4-layer PCB. See Figure 4 for a plot of maximum power dissipation vs. ambient temperature (T
3
TA = ambient temperature.
4
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled PCB mounted components.
).
A
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
MAXIMUM POWER DISSIPATION (W)
0.1
0
–40
–30
–20
–10
0
10
20
TEMPERATURE (°C)
SOT-23
SC-70
90
80
70
60
50
40
30
100
110
120
130
140
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
03340-0-040
150

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. B | Page 8 of 28
TMP05/TMP06

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

OUT
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 OUT
Digital Output. Pulse-width modulated (PWM) output gives a square wave whose ratio of high-to-low period is proportional to temperature.
2 CONV/IN
Digital Input. In continuously converting and one shot operating modes, a high, low, or float input determines the temperature measurement rate. In daisy-chain operating mode, this pin is the input pin for the PWM signal from the previous part on the daisy chain.
3 FUNC
Digital Input. A high, low, or float input on this pin gives three different modes of operation. For details, see the
Operating Modes section. 4 GND Analog and Digital Ground. 5 VDD
Positive Supply Voltage, 3.0 V to 5.5 V. Using a decoupling capacitor of 0.1 μF as close as possible to this pin is
strongly recommended.
1
TMP05/
CONV/I N
FUNC
Figure 5. Pin Configuration
TMP06
2
TOP VIEW
(Not to Scale)
3
5
V
DD
GND
4
03340-005
Rev. B | Page 9 of 28
TMP05/TMP06

TYPICAL PERFORMANCE CHARACTERISTICS

10
9
8
7
6
5
4
3
OUTPUT FREQUENCY (Hz)
2
VDD = 3.3V AND 5V
1
OUT PIN L OADED WIT H 10k
0
–50 –30 –10 10 30 50 70 90 110 130 150
TEMPERATURE ( °C)
03340-020
VDD = 3.3V AND 5V C
LOAD
0
VO LTAG E (V )
1V/DIV
= 100pF
0
TIME (ns)
100ns/DIV
03340-023
Figure 6. PWM Output Frequency vs. Temperature
8.57
8.56
8.55
8.54
8.53
8.52
OUTPUT FREQUENCY (Hz)
8.51
OUT PIN LOADED WITH 10k AMBIENT TEMPERATURE = 25°C
8.50
3.0
3.3 3.6 3.9 4.2 4.5 4. 8 5.1 5.4
SUPPLY VOLTAGE (V)
Figure 7. PWM Output Frequency vs. Supply Voltage
140
VDD = 3.3V AND 5V OUT PIN L OADED WIT H 10k
120
TL TIME
100
80
60
TIME (ms)
40
T
TIME
H
Figure 9. TMP05 Output Rise Time at 25°C
VDD = 3.3V AND 5V C
= 100pF
LOAD
0
VO LTAG E (V )
1V/DIV
0
03340-041
TIME (ns)
100ns/DIV
03340-024
Figure 10. TMP05 Output Fall Time at 25°C
VDD = 3.3V AND 5V R
= 1k
PULLUP
R
= 10k
LOAD
C
= 100pF
LOAD
0
VO LTAG E (V )
20
0
–50 –30 –10 10 30 50 70 90 110 130 150
Figure 8. T
TEMPERATURE ( °C)
and TL Times vs. Temperature
H
03340-022
Rev. B | Page 10 of 28
1V/DIV
0
TIME (ns)
Figure 11. TMP06 Output Fall Time at 25°C
100ns/DIV
03340-025
TMP05/TMP06
2000
VDD = 3.3V AND 5V
1800
1600
1400
1200
1000
TIME (ns)
800
600
400
200
0
0 10000900080007000600050004000300020001000
CAPACTIVE L OAD (pF)
RISE TIME
FAL L T IM E
Figure 12. TMP05 Output Rise and Fall Times vs. Capacitive Load
03340-026
1.25
1.00
CONTINUOUS MODE OPERATION
0.75 NOMINAL CONVERSION RATE
0.50
0.25
0
–0.25
–0.50
TEMPERATURE ERROR (° C)
–0.75
–1.00
–1.25
–40
–20 0 20 40 60 80 100 120 140
Figure 15. Output Accuracy vs. Temperature
5V
3.3V
TEMPERATURE (°C)
03340-042
250
VDD = 3.3V AND 5V
200
150
100
I
= 0.5mA
OUTPUT LOW VOLTAGE (mV)
50
0 –50 –25 0 25 50 75 100 125 150
LOAD
TEMPERATURE ( °C)
I
LOAD
I
LOAD
= 1mA
= 5mA
Figure 13. TMP06 Output Low Voltage vs. Temperature
35
VDD = 3.3V AND 5V
30
350
VDD = 3.3V AND 5V CONTINUOUS MODE OPERATION NOMINAL CONVERSION RATE
300
NO LOAD ON OUT PIN
250
200
150
100
SUPPLY CURRENT (µA)
50
0 –50 –25 0 25 50 75 100 125 150
03340-027
TEMPERATURE ( °C)
03340-030
Figure 16. Supply Current vs. Temperature
255
AMBIENT TEMPERATURE = 25°C CONTINUOUS MODE OPERATION
250
NOMINAL CONVERSION RATE NO LOAD ON O UT PIN
245
240
25
SINK CURRENT (mA)
20
15
–50 –25 0 25 50 75 100 125 150
TEMPERATURE ( °C)
Figure 14. TMP06 Open Drain Sink Current vs. Temperature
03340-028
Rev. B | Page 11 of 28
SUPPLY CURRENT (µA)
235
230
225
220
215
2.7 5.75.45. 14.84. 54.23. 93.63. 33.0
SUPPLY VOLTAGE (V)
Figure 17. Supply Current vs. Supply Voltage
03340-031
TMP05/TMP06
140
120
100
80
FINAL TEMPERATURE = 120° C
1.25
VDD = 3.3V AND 5V AMBIENT TEMPERATURE = 25°C
1.00
0.75
60
TEMPERATURE (°C)
40
20
0
0 10203040506070
TEMPERATURE OF ENVIRONMENT (30°C) CHANGED HERE
TIME ( Seconds)
Figure 18. Response to Thermal Shock
03340-033
0.50
TEMPERATURE ERROR (°C)
0.25
0
0 5 10 15 20 25 30
LOAD CURRENT (mA)
Figure 19. TMP05 Temperature Error vs. Load Current
03340-034
Rev. B | Page 12 of 28
TMP05/TMP06

THEORY OF OPERATION

CIRCUIT INFORMATION

The TMP05/TMP06 are monolithic temperature sensors that generate a modulated serial digital output that varies in direct proportion with the temperature of each device. An on-board sensor generates a voltage precisely proportional to absolute temperature, which is compared to an internal voltage reference and is input to a precision digital modulator. The ratiometric encoding format of the serial digital output is independent of the clock drift errors common to most serial modulation techniques such as voltage-to-frequency converters. Overall accuracy for the A grade is ±2°C from 0°C to +70°C with excellent transducer linearity. B grade accuracy is ±1°C from 0°C to 70°C. The digital output of the TMP05 is CMOS-/TTL­compatible and is easily interfaced to the serial inputs of most popular microprocessors. The open-drain output of the TMP06 is capable of sinking 5 mA.
The on-board temperature sensor has excellent accuracy and linearity over the entire rated temperature range without correction or calibration by the user.
The sensor output is digitized by a first-order Σ-∆ modulator, also known as the charge balance type analog-to-digital converter. This type of converter utilizes time-domain over­sampling and a high accuracy comparator to deliver 12 bits of effective accuracy in an extremely compact circuit.

CONVERTER DETAILS

The Σ-∆ modulator consists of an input sampler, a summing network, an integrator, a comparator, and a 1-bit DAC. Similar to the voltage-to-frequency converter, this architecture creates, in effect, a negative feedback loop whose intent is to minimize the integrator output by changing the duty cycle of the comparator output in response to input voltage changes. The comparator samples the output of the integrator at a much higher rate than the input sampling frequency, which is called oversampling. Oversampling spreads the quantization noise over a much wider band than that of the input signal, improving overall noise performance and increasing accuracy.
Σ-Δ MODULATOR
VOLTAGE REF
AND VPTAT
CLOCK
GENERATOR
INTEGRATOR
+
Figure 20. First-Order Σ-∆ Modulator
1-BIT
DAC
COMPARATOR
+
DIGITAL
FILTER
TMP05/T MP06
OUT
(SINGLE-BIT)
3340-006
The modulated output of the comparator is encoded using a circuit technique that results in a serial digital signal with a mark-space ratio format. This format is easily decoded by any microprocessor into either °C or °F values, and is readily transmitted or modulated over a single wire. More importantly, this encoding method neatly avoids major error sources common to other modulation techniques because it is clock­independent.

FUNCTIONAL DESCRIPTION

The output of the TMP05/TMP06 is a square wave with a typical period of 116 ms at 25°C (CONV/IN pin is left floating). The high period, T
, is constant, while the low period, TL, varies
H
with measured temperature. The output format for the nominal conversion rate is readily decoded by the user as follows:
Temperature (°C) = 421 − (751 × (T
)) (1)
H/TL
T
H
Figure 21. TMP05/TMP06 Output Format
T
L
The time periods TH (high period) and TL (low period) are values easily read by a microprocessor timer/counter port, with the above calculations performed in software. Because both periods are obtained consecutively using the same clock, performing the division indicated in Equation 1 results in a ratiometric value independent of the exact frequency or drift of the TMP05/TMP06 originating clock or the user’s counting clock.

OPERATING MODES

The user can program the TMP05/TMP06 to operate in three different modes by configuring the FUNC pin on power-up as either low, floating, or high.
Table 6. Operating Modes
FUNC Pin Operating Mode
Low One shot Floating Continuously converting High Daisy-chain
Continuously Converting Mode
In continuously converting mode, the TMP05/TMP06 continu­ously output a square wave representing temperature. The frequency at which this square wave is output is determined by the state of the CONV/IN pin on power-up. Any change to the state of the CONV/IN pin after power-up is not reflected in the parts until the TMP05/TMP06 are powered down and back up.
03340-007
Rev. B | Page 13 of 28
TMP05/TMP06
One Shot Mode
In one shot mode, the TMP05/TMP06 output one square wave representing temperature when requested by the microcon­troller. The microcontroller pulls the OUT pin low and then releases it to indicate to the TMP05/TMP06 that an output is required. The time between the OUT pin going low to the time it is released should be greater than 20 ns. Internal hysteresis in the OUT pin prevents the TMP05/TMP06 from recognizing that the pulse is going low (if it is less than 20 ns). The temperature measurement is output when the OUT line is released by the microcontroller (see
µCONTROLLERPULLS DOWN OUT LINE HERE
TEMP MEASUREMENT
T
>20ns
H
Figure 22).
µCONTROLLER RELEASES OUT LINE HERE
T
L
Conversion Rate
In continuously converting and one shot modes, the state of the CONV/IN pin on power-up determines the rate at which the TMP05/TMP06 measure temperature. The available conversion rates are shown in
Tabl e 7 .
Table 7. Conversion Rates
CONV/IN Pin Conversion Rate TH/TL (25°C)
Low
Quarter period
/4, TL/4)
(T
H
10/19 (ms)
Floating Nominal 40/76 (ms) High
Double high (T
Quarter low (T
x 2)
H
L
/4)
80/19 (ms)
The TMP05 (push-pull output) advantage when using the high state conversion rate (double high/quarter low) is lower power consumption. However, the trade-off is loss of resolution on the low time. Depending on the state of the CONV/IN pin, two different temperature equations must be used.
T
0
Figure 22. TMP05/TMP06 One Shot OUT Pin Signal
TIME
03340-019
In the TMP05 one shot mode only, an internal resistor is switched in series with the pull-up MOSFET. The TMP05 OUT pin has a push-pull output configuration (see
Figure 23). Therefore, it needs a series resistor to limit the current drawn on this pin when the user pulls it low to start a temperature conversion. This series resistance prevents any short circuit from V
to GND, and, as a result, protects the TMP05 from
DD
short-circuit damage.
V+
5k
OUT
TMP05
Figure 23. TMP05 One Shot Mode OUT Pin Configuration
03340-016
The advantages of the one shot mode include lower average power consumption, and the microcontroller knowing that the first low-to-high transition occurs after the microcontroller releases the OUT pin.
The temperature equation for the low and floating states’ conversion rates is
Temperature (°C) = 421 − (751 × (T
)) (2)
H/TL
Table 8. Conversion Times Using Equation 2
Temperature (°C) TL (ms) Cycle Time (ms)
–40 65.2 105 –30 66.6 107 –20 68.1 108 –10 69.7 110 0 71.4 111 10 73.1 113 20 74.9 115 25 75.9 116 30 76.8 117 40 78.8 119 50 81 121 60 83.2 123 70 85.6 126 80 88.1 128 90 90.8 131 100 93.6 134 110 96.6 137 120 99.8 140 130 103.2 143 140 106.9 147 150 110.8 151
Rev. B | Page 14 of 28
TMP05/TMP06
T
The temperature equation for the high state conversion rate is
Temperature (°C) = 421 − (93.875 × (T
)) (3)
H/TL
Table 9. Conversion Times Using Equation 3
Temperature (°C) TL (ms) Cycle Time (ms)
–40 16.3 96.2 –30 16.7 96.6 –20 17 97.03 –10 17.4 97.42 0 17.8 97.84 10 18.3 98.27 20 18.7 98.73 25 19 98.96 30 19.2 99.21 40 19.7 99.71 50 20.2 100.24 60 20.8 100.8 70 21.4 101.4 80 22 102.02 90 22.7 102.69 100 23.4 103.4 110 24.1 104.15 120 25 104.95 130 25.8 105.81 140 26.7 106.73 150 27.7 107.71
Daisy-Chain Mode
Setting the FUNC pin to a high state allows multiple TMP05/ TMP06s to be connected together and, therefore, allows one input line of the microcontroller to be the sole receiver of all temperature measurements. In this mode, the CONV/IN pin operates as the input of the daisy chain. In addition, conversions take place at the nominal conversion rate of T
= 40 ms/76 ms at 25°C.
H/TL
Therefore, the temperature equation for the daisy-chain mode of operation is
Temperature (°C) = 421 − (751 × (T
OUT
CONV/IN
TMP05/
MICRO
TMP06
#1
IN
CONV/IN
OUT
TMP05/
TMP06
#2
OUT
Figure 24. Daisy-Chain Structure
)) (4)
HTL
CONV/IN
TMP05/
TMP06
#3
OUT
CONV/I N
TMP05/ TMP06
#N
OUT
03340-009
A second microcontroller line is needed to generate the conver­sion start pulse on the CONV/IN pin. The pulse width of the start pulse should be less than 25 µs but greater than 20 ns. The start pulse on the CONV/IN pin lets the first TMP05/TMP06 part know that it should now start a conversion and output its own temperature. Once the part has output its own temperature, it outputs a start pulse for the next part on the daisy-chain link. The pulse width of the start pulse from each TMP05/TMP06 part is typically 17 µs.
Figure 25 shows the start pulse on the CONV/IN pin of the first device on the daisy chain.
Figure 26 shows the PWM output by
this first part.
Before the start pulse reaches a TMP05/TMP06 part in the daisy chain, the device acts as a buffer for the previous tempera­ture measurement signals. Each part monitors the PWM signal for the start pulse from the previous part. Once the part detects the start pulse, it initiates a conversion and inserts the result at the end of the daisy-chain PWM signal. It then inserts a start pulse for the next part in the link. The final signal input to the microcontroller should look like
Figure 27. The input signal on Pin 2 (IN) of the first daisy-chain device must remain low until the last device has output its start pulse.
If the input on Pin 2 (IN) goes high and remains high, the TMP05/TMP06 part powers down between 0.3 sec and 1.2 sec later. The part, therefore, requires another start pulse to generate another temperature measurement. Note that to reduce power dissipation through the part, it is recommended to keep Pin 2 (IN) at a high state when the part is not converting. If the IN pin is at 0 V, the OUT pin is at 0 V (because it is acting as a buffer when not converting), and is drawing current through either the pull-up MOSFET (TMP05) or the pull-up resistor (TMP06).
MUST GO HIGH ONLY AFTER START PULSE HAS BEEN OUTPUT BY LAST TMP05/T MP06 ON DAIS Y CHAIN.
START PULSE
TIME
CONVERSION STARTS ON THIS EDGE
TIME
START PULSE
17µs
3340-017
03340-010
>20ns
AND
>20ns
<25µs
0
Figure 25. Start Pulse at CONV/IN Pin of First
TMP05/TMP06 Device on Daisy Chain
#1 TEMP MEASUREM ENT
T
0
Figure 26. Daisy-Chain Temperature Measurement
and Start Pulse Output from First TMP05/TMP06
Rev. B | Page 15 of 28
TMP05/TMP06
#1 TEMP MEASUREMENT #2 TEMP MEASUREMENT #N TEMP MEASUREMENT
START
PULSE
T
0
Figure 27. Daisy-Chain Signal at Input to the Microcontroller

TMP05 OUTPUT

The TMP05 has a push-pull CMOS output (Figure 28) and provides rail-to-rail output drive for logic interfaces. The rise and fall times of the TMP05 output are closely matched so that errors caused by capacitive loading are minimized. If load capacitance is large (for example, when driving a long cable), an external buffer could improve accuracy.
An internal resistor is connected in series with the pull-up MOSFET when the TMP05 is operating in one shot mode.
V+
OUT
TMP05
Figure 28. TMP05 Digital Output Structure
03340-011
TIME
03340-008

TMP06 OUTPUT

The TMP06 has an open-drain output. Because the output source current is set by the pull-up resistor, output capacitance should be minimized in TMP06 applications. Otherwise, unequal rise and fall times skew the pulse width and introduce measurement errors.
OUT
TMP06
Figure 29. TMP06 Digital Output Structure
03340-012
Rev. B | Page 16 of 28
TMP05/TMP06

APPLICATION HINTS

THERMAL RESPONSE TIME

The time required for a temperature sensor to settle to a specified accuracy is a function of the sensor’s thermal mass and the thermal conductivity between the sensor and the object being sensed. Thermal mass is often considered equivalent to capacitance. Thermal conductivity is commonly specified using the symbol Q and can be thought of as thermal resistance. It is usually specified in units of degrees per watt of power transferred across the thermal joint. Thus, the time required for the TMP05/ TMP06 to settle to the desired accuracy is dependent on the package selected, the thermal contact established in that particular application, and the equivalent power of the heat source. In most applications, the settling time is probably best determined empirically.

SELF-HEATING EFFECTS

The temperature measurement accuracy of the TMP05/TMP06 can be degraded in some applications due to self-heating. Errors are introduced from the quiescent dissipation and power dissipated when converting, that is, during T temperature errors depends on the thermal conductivity of the TMP05/TMP06 package, the mounting technique, and the effects of airflow. Static dissipation in the TMP05/TMP06 is typically 10 µW operating at 3.3 V with no load. In the 5-lead SC-70 package mounted in free air, this accounts for a temperature increase due to self-heating of
T = P
× θJA = 10 µW × 534.7°C/W = 0.0053°C (5)
DISS
In addition, power is dissipated by the digital output, which is capable of sinking 800 µA continuously (TMP05). Under an 800 µA load, the output can dissipate
= (0.4 V)(0.8 mA)((TL)/TH + TL)) (6)
P
DISS
. The magnitude of these
L

SUPPLY DECOUPLING

The TMP05/TMP06 should be decoupled with a 0.1 µF ceramic capacitor between V if the TMP05/TMP06 are mounted remotely from the power supply. Precision analog products such as the TMP05/TMP06 require a well filtered power source. Because the parts operate from a single supply, simply tapping into the digital logic power supply could appear to be a convenient option. Unfortunately, the logic supply is often a switch-mode design, which generates noise in the 20 kHz to 1 MHz range. In addition, fast logic gates can generate glitches hundreds of mV in amplitude due to wiring resistance and inductance.
If possible, the TMP05/TMP06 should be powered directly from the system power supply. This arrangement, shown in Figure 30, isolates the analog section from the logic switching transients. Even if a separate power supply trace is not available, generous supply bypassing reduces supply-line-induced errors. Local supply bypassing consisting of a 0.1 µF ceramic capacitor is critical for the temperature accuracy specifications to be achieved. This decoupling capacitor must be placed as close as possible to the TMP05/TMP06 V decoupling capacitor is Phicomp’s 100 nF, 50 V X74.
It is important to keep the capacitor package size as small as possible because ESL (equivalent series inductance) increases with increasing package size. Reducing the capacitive value below 100 nF increases the ESR (equivalent series resistance). Using a capacitor with an ESL of 1 nH and an ESR of 80 mΩ is recommended.
TTL/CMOS
LOGIC
CIRCUITS
and GND. This is particularly important
DD
pin. A recommended
DD
TMP05/
0.1µF
TMP06
For example, with T
= 80 ms and TH = 40 ms, the power
L
dissipation due to the digital output is approximately 0.21 mW. In a free-standing SC-70 package, this accounts for a tempera­ture increase due to self-heating of
T = P
× θJA = 0.21 mW × 534.7°C/W = 0.112°C (7)
DISS
This temperature increase directly adds to that from the quiescent dissipation and affects the accuracy of the TMP05/ TMP06 relative to the true ambient temperature.
It is recommended that current dissipated through the device be kept to a minimum because it has a proportional effect on the temperature error.
Rev. B | Page 17 of 28
POWER SUPPLY
Figure 30. Use Separate Traces to Reduce Power Supply Noise
03340-013
TMP05/TMP06
T
S

LAYOUT CONSIDERATIONS

Digital boards can be electrically noisy environments and glitches are common on many of the signals in the system. The likelihood of glitches causing problems to the TMP05/ TMP06 OUT pin is very minute. The typical impedance of the TMP05/TMP06 OUT pin when driving low is 55 Ω. When driving high, the TMP05 OUT pin is similar. This low imped­ance makes it very difficult for a glitch to break the V thresholds. There is a slight risk that a sizeable glitch could cause problems. A glitch can only cause problems when the OUT pin is low during a temperature measurement. If a glitch occurs that is large enough to fool the master into believing that the temperature measurement is over, the temperature read would not be the actual temperature. In most cases, the master spots a temperature value that is erroneous and can request another temperature measurement for confirmation. One area that can cause problems is if this very large glitch occurs near the end of the low period of the mark-space waveform, and the temperature read back is so close to the expectant temperature that the master does not question it.
One layout method that helps in reducing the possibility of a glitch is to run ground tracks on either side of the OUT line. Use a wide OUT track to minimize inductance and reduce noise pickup. A 10 mil track minimum width and spacing is recommended.
Figure 31 shows how glitch protection traces
could be laid out.
GND
OUT
GND
Figure 31. Use Separate Traces to Reduce Power Supply Noise
IL
10 MIL
10 MIL
10 MIL
10 MIL
10 MIL
and VIH
03340-043
nearby heat source, the thermal impedance between the heat source and the TMP05/TMP06 must be considered. Often, a thermocouple or other temperature sensor is used to measure the temperature of the source, while the TMP05/TMP06 temperature is monitored by measuring T
and TL. Once the
H
thermal impedance is determined, the temperature of the heat source can be inferred from the TMP05/TMP06 output.
One example of using the TMP05/TMP06’s unique properties is in monitoring a high power dissipation microprocessor. Each TMP05/TMP06 part, in a surface-mounted package, is mounted directly beneath the microprocessor’s pin grid array (PGA) package. In a typical application, the TMP05/TMP06 output is connected to an ASIC, where the pulse width is measured. The TMP05/TMP06 pulse output provides a significant advantage in this application because it produces a linear temperature output while needing only one I/O pin and without requiring an ADC.

DAISY-CHAIN APPLICATION

This section provides an example of how to connect two TMP05s in daisy-chain mode to a standard 8052 microcon­troller core. The core processing engine is the 8052. Figure 31 shows how to interface to the 8052 core device. The Example 1
ADuC812 to two daisy-chained TMP05s. This code can also be
used with the 8052 core.
IMER T0 TART S
TEMP_HIGH0
ADuC812 is the microcontroller used and the
TMP05 Program Code
section shows how to communicate from the
ADuC831 or any microprocessor running on an
TEMPSEGMENT = 1 TEMPSEGMENT = 2 TEMPSEGMENT = 3
TEMP_HIGH2TEMP_HIGH1
INTO
INTO INTO
Another method that helps reduce the possibility of a glitch is to use a 50 ns glitch filter on the OUT line. The glitch filter eliminates any possibility of a glitch getting through to the master or being passed along a daisy chain.

TEMPERATURE MONITORING

The TMP05/TMP06 are ideal for monitoring the thermal environment within electronic equipment. For example, the surface-mounted package accurately reflects the exact thermal conditions that affect nearby integrated circuits.
The TMP05/TMP06 measure and convert the temperature at the surface of their own semiconductor chip. When the
Figure 32. Reference Diagram for Software Variables
in the
Figure 32 is a diagram of the input waveform into the ADuC812 from the TMP05 daisy chain. It illustrates how the code’s variables are assigned and it should be referenced when reading the TMP05 Program Code Example 1. Application notes showing the TMP05 working with other types of microcontrollers are available from Analog Devices at
Figure 33 shows how the three devices are hardwired together. Figure 34 to Figure 36 are flow charts for this program.
TEMP_LOW0 TEMP_LOW1
TMP05 Program Code Example 1
www.analog.com.
03340-035
TMP05/TMP06 are used to measure the temperature of a
Rev. B | Page 18 of 28
TMP05/TMP06
START PULSE
V
DD
0.1µF
0.1µF
V
DD
TMP05 (U1)
V
OUT
DD
CONV/IN
FUNC
GND
TMP05 (U2)
V
OUT
DD
CONV/IN
GND F UNC
V
DD
V
DD
T
H
T
0
(U1)
T
(U1)
L
TIME
START
PULSE
ADuC812
P3.7
P3.2/INTO
T
(U1)
H
T
0
T
(U2)
H
T
(U1)
L
TIME
START PULSE
(U2)
T
L
03340-014
Figure 33. Typical Daisy-Chain Application Circuit
Rev. B | Page 19 of 28
TMP05/TMP06
DECLARE VARIABLES
SET-UP UART
INITIALIZE TIMERS
ENABLE TIMER
INTERRUPTS
SEND START
PULSE
START TIMER 0
SET-UP EDGE
TRIGGERED
(H-L) INTO
ENABLE INTO
INTERRUPT
ENABLE GLO BAL
INTERRUPTS
WAIT F OR
INTERRUPT
PROCESS
INTERRUPTS
WAIT FOR END
OF MEASUREM ENT
Figure 35.
CONVERT VARIABLES
TO FLOATS
CALCULATE
TEMPERATURE
FROM U1
TEMP U1 =
421 – (751 × ( TEMP_HI GH0/
(TEMP_LOW0 – (TEMP_HIGH1)))
CALCULATE
TEMPERATURE
FROM U2
TEMP U2 =
421 – (751 × ( TEMP_HI GH1/
(TEMP_LOW1 – (TEMP_HIGH2)))
SEND TEMPERATURE
RESULTS
OUT OF UART
03340-038
ADuC812 Temperature Calculation Routine Flowchart
Figure 34.
CALCULATE
TEMPERATURE
AND SEND
FROM UART
03340-036
ADuC812 Main Routine Flowchart
Rev. B | Page 20 of 28
TMP05/TMP06
ENTER INTERRUPT
ROUTI NE
NO
CHECK IF TIMER 1
IS RUNNING
YES
START TIMER 1
COPY TIMER 1 VALUES
INTO A REGISTER
RESET TIMER 1
IS TEMPSEGMENT
= 1
YE S
CALCULATE
TEMP_HIGH0
RESET TIM ER 0
TO ZERO
NO
IS TEMPSEGMENT
= 2
YES
CALCULATE
TEMP_LOW0
USING TIMER 1
VAL UES
CALCULATE
TEMP_HIGH1
USING TIMER 0
VAL UES
RESET TIMER 0
TO ZERO
Figure 36.
NO
IS TEMPSEGMENT
= 3
CALCULATE
TEMP_LOW1
CALCULATE
TEMP_HIGH2
USING TI MER 0
VAL UES
ADuC812 Interrupt Routine Flowchart
YE S
NO
INCREMENT
TEMPSEGMENT
EXIT INT ERRUPT
ROUTINE
TMP05 Program Code Example 1
//============================================================================================= // Description : This program reads the temperature from 2 daisy-chained TMP05 parts.
// // This code runs on any standard 8052 part running at 11.0592MHz. // If an alternative core frequency is used, the only change required is an // adjustment of the baud rate timings. // // P3.2 = Daisy-chain output connected to INT0. // P3.7 = Conversion control. // Timer0 is used in gate mode to measure the high time. // Timer1 is triggered on a high-to-low transition of INT0 and is used to measure // the low time. //=============================================================================================
03340-037
Rev. B | Page 21 of 28
TMP05/TMP06
#include <stdio.h> #include <ADuC812.h> //ADuC812 SFR definitions void delay(int); sbit Daisy_Start_Pulse = 0xB7; //Daisy_Start_Pulse = P3.7 sbit P3_4 = 0xB4; long temp_high0,temp_low0,temp_high1,temp_low1,temp_high2,th,tl; //Global variables to allow //access during ISR.
//See int timer0_count=0,timer1_count=0,tempsegment=0;
void int0 () interrupt 0 //INT0 Interrupt Service Routine { if (TR1 == 1) { th = TH1; tl = TL1; th = TH1; //To avoid misreading timer TL1 = 0; TH1 = 0; } TR1=1; //Start timer1 running, if not running Already
if (tempsegment == 1) { temp_high0 = (TH0*0x100+TL0)+(timer0_count*65536); //Convert to integer TH0=0x00; //Reset count TL0=0x00; timer0_count=0; } if (tempsegment == 2) { temp_low0 = (th*0x100+tl)+(timer1_count*65536); //Convert to integer temp_high1 = (TH0*0x100+TL0)+(timer0_count*65536); //Convert to integer TH0=0x00; //Reset count TL0=0x00; timer0_count=0; timer1_count=0; } if (tempsegment == 3) { temp_low1 = (th*0x100+tl)+(timer1_count*65536); //Convert to integer temp_high2 = (TH0*0x100+TL0)+(timer0_count*65536); TH0=0x00; //Reset count TL0=0x00; timer0_count=0; timer1_count=0; }
tempsegment++; }
void timer0 () interrupt 1 { timer0_count++; //Keep a record of timer0 overflows } void timer1 () interrupt 3 { timer1_count++; //Keep a record of timer1 overflows
Figure 32.
Rev. B | Page 22 of 28
TMP05/TMP06
} void main(void) { double temp1=0,temp2=0; double T1,T2,T3,T4,T5;
// Initialization TMOD = 0x19; // Timer1 in 16-bit counter mode // Timer0 in 16-bit counter mode // with gate on INT0. Timer0 only counts when INTO pin // is high. ET0 = 1; // Enable timer0 interrupts ET1 = 1; // Enable timer1 interrupts tempsegment = 1; // Initialize segment
Daisy_Start_Pulse = 0; // Pull P3.7 low
// Start Pulse Daisy_Start_Pulse = 1; Daisy_Start_Pulse = 0; //Toggle P3.7 to give start pulse // Set T0 to count the high period TR0 = 1; // Start timer0 running IT0 = 1; // Interrupt0 edge triggered
EX0 = 1; // Enable interrupt EA = 1; // Enable global interrupts for(;;) { if (tempsegment == 4) break; }
//CONFIGURE UART SCON = 0x52 ; // 8-bit, no parity, 1 stop bit TMOD = 0x20 ; // Configure timer1.. TH1 = 0xFD ; // ..for 9600baud.. TR1 = 1; // ..(assuming 11.0592MHz crystal)
//Convert variables to floats for calculation T1= temp_high0; T2= temp_low0; T3= temp_high1; T4= temp_low1; T5= temp_high2;
temp1=421-(751*(T1/(T2-T3))); temp2=421-(751*(T3/(T4-T5))); printf("Temp1 = %f\nTemp2 = %f\n",temp1,temp2); //Sends temperature result out UART
while (1); // END of program
}
// Delay routine void delay(int length) { while (length >=0) length--; }
Rev. B | Page 23 of 28
TMP05/TMP06

CONTINUOUSLY CONVERTING APPLICATION

This section provides an example of how to connect one TMP05 in continuously converting mode to a microchip PIC16F876 microcontroller. to the PIC16F876.
Figure 37 shows how to interface
FIRST TEMP
MEASUREMENT
SECOND TEMP
MEASUREMENT
TMP05 Program Code Example 2 shows how to
The
T
0
TIME
communicate from the microchip device to the TMP05. This code can also be used with other PICs by changing the include file for the part.
PIC16F876
PA. 0
TMP05
OUT
CONV/IN
Figure 37. Typical Continuously Converting Application Circuit
3.3V
V
DD
0.1µF
GNDFUNC
TMP05 Program Code Example 2
//============================================================================================= // // Description : This program reads the temperature from a TMP05 part set up in continuously
// converting mode. // This code was written for a PIC16F876, but can be easily configured to function with other
// PICs by simply changing the include file for the part. // // Fosc = 4MHz // Compiled under CCS C compiler IDE version 3.4 // PWM output from TMP05 connected to PortA.0 of PIC16F876 // //============================================================================================ #include <16F876.h> // Insert header file for the particular PIC being used #device adc=8 #use delay(clock=4000000) #fuses NOWDT,XT, PUT, NOPROTECT, BROWNOUT, LVP
//_______________________________Wait for high function_____________________________________ void wait_for_high() { while(input(PIN_A0)) ; /* while high, wait for low */ while(!input(PIN_A0)); /* wait for high */ } //______________________________Wait for low function_______________________________________ void wait_for_low() { while(input(PIN_A0)); /* wait for high */ } //_______________________________Main begins here____________________________________________ void main(){ long int high_time,low_time,temp;
setup_adc_ports(NO_ANALOGS); setup_adc(ADC_OFF); setup_spi(FALSE);
setup_timer_1 ( T1_INTERNAL | T1_DIV_BY_2); //Sets up timer to overflow after 131.07ms
03340-039
Rev. B | Page 24 of 28
TMP05/TMP06
do{ wait_for_high(); set_timer1(0); //Reset timer wait_for_low(); high_time = get_timer1(); set_timer1(0); //Reset timer wait_for_high(); low_time = get_timer1();
temp = 421 – ((751 * high_time)/low_time)); //Temperature equation for the high state
//Temperature value stored in temp as a long int }while (TRUE); }
//conversion rate.
Rev. B | Page 25 of 28
TMP05/TMP06

OUTLINE DIMENSIONS

2.20
2.00
1.80
1.35
1.25
1.15
PIN 1
1.00
0.90
0.70
0
.
1
0
A
M
X
0.10 COPLANARITY
123
0.30
0.15
COMPLIANT TO JEDEC STANDARDS MO-203-AA
45
0.65 BSC
2.40
2.10
1.80
1.10
0.80
SEATING PLANE
0.40
0.10
0.22
0.08
0.46
0.36
0.26
Figure 38. 5-Lead Thin Shrink Small Outline Transistor Package [SC-70]
(KS-5)
Dimensions shown in millimeters
1.60 BSC
PIN 1
1.30
1.15
0.90
0.15 MAX
Figure 39. 5-Lead Small Outline Transistor Package [SOT-23]
2.90 BSC
5
123
COMPLIANT TO JEDEC STANDARDS MO-178-AA
1.90
BSC
0.50
0.30
4
0.95 BSC
2.80 BSC
1.45 MAX
SEATING PLANE
0.22
0.08
10°
5° 0°
(RJ-5)
Dimensions shown in millimeters
0.60
0.45
0.30

ORDERING GUIDE

Minimum
Model
Quantities/Reel
TMP05AKS-500RL7 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8A TMP05AKS-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8A TMP05AKS-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8A TMP05AKSZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8C TMP05AKSZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8C TMP05AKSZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8C TMP05ART-500RL7 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8A TMP05ART-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8A TMP05ART-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8A TMP05ARTZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8C TMP05ARTZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8C TMP05ARTZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8C TMP05BKS-500RL7 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8B TMP05BKS-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8B TMP05BKS-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8B TMP05BKSZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8D TMP05BKSZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8D TMP05BKSZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8D TMP05BRT-500RL7 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8B TMP05BRT-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8B TMP05BRT-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8B TMP05BRTZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8D TMP05BRTZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8D TMP05BRTZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8D
Temperature
1
Range
Temperature Accuracy
2
Package Description
Package Option
Branding
Rev. B | Page 26 of 28
TMP05/TMP06
Minimum
Model
Quantities/Reel
TMP06AKS-500RL7 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9A TMP06AKS-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9A TMP06AKS-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9A TMP06AKSZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9C TMP06AKSZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9C TMP06AKSZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9C TMP06ART-500RL7 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9A TMP06ART-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9A TMP06ART-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9A TMP06ARTZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9C TMP06ARTZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9C TMP06ARTZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9C TMP06BKS-500RL7 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9B TMP06BKS-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9B TMP06BKS-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9B TMP06BKSZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9D TMP06BKSZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9D TMP06BKSZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9D TMP06BRT-500RL7 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9B TMP06BRT-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9B TMP06BRT-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9B TMP06BRTZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9D TMP06BRTZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9D TMP06BRTZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9D
1
It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
2
A-grade and B-grade temperature accuracy is over the 0°C to 70°C temperature range.
3
Z = Pb-free part.
Temperature
1
Range
Temperature Accuracy
2
Package Description
Package Option
Branding
Rev. B | Page 27 of 28
TMP05/TMP06
NOTES
©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D03340-0-4/06(B)
Rev. B | Page 28 of 28
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