temperature
±0.5°C typical accuracy at 25°C
±1.0°C accuracy from 0°C to 70°C
Two grades available
Operation from −40°C to +150°C
Operation from 3 V to 5.5 V
Power consumption 70 μW maximum at 3.3 V
CMOS-/TTL-compatible output on TMP05
Flexible open-drain output on TMP06
Small, low cost, 5-lead SC-70 and SOT-23 packages
APPLICATIONS
Isolated sensors
Environmental control systems
Computer thermal monitoring
Thermal protection
Industrial process control
Power-system monitors
Temperature Sensor in 5-Lead SC-70
TMP05/TMP06
FUNCTIONAL BLOCK DIAGRAM
DD
5
TMP05/TMP06
TEMPERATURE
CONV/I N
2
SENSOR
REFERENCE
CLK AND
TIMING
GENERATION
Σ-Δ
CORE
4
GND
Figure 1.
AVE RAG IN G
BLOCK/
COUNTER
OUTPUT
CONTROL
1
3
OUT
FUNC
03340-001
GENERAL DESCRIPTION
The TMP05/TMP06 are monolithic temperature sensors that
generate a modulated serial digital output (PWM), which varies
in direct proportion to the temperature of the devices. The high
period (T
while the low period (T
high temperature accuracy of ±1°C from 0°C to 70°C with
excellent transducer linearity. The digital output of the TMP05/
TMP06 is CMOS-/TTL-compatible and is easily interfaced to
the serial inputs of most popular microprocessors. The flexible
open-drain output of the TMP06 is capable of sinking 5 mA.
The TMP05/TMP06 are specified for operation at supply voltages
from 3 V to 5.5 V. Operating at 3.3 V, the supply current is
typically 370 µA. The TMP05/TMP06 are rated for operation
over the –40°C to +150°C temperature range. It is not recommended to operate these devices at temperatures above 125°C
for more than a total of 5% (5,000 hours) of the lifetime of the
devices. They are packaged in low cost, low area SC-70 and
SOT-23 packages.
The TMP05/TMP06 have three modes of operation: continuously converting mode, daisy-chain mode, and one shot mode.
) of the PWM remains static over all temperatures,
H
) varies. The B Grade version offers a
L
A three-state FUNC input determines the mode in which the
TMP05/TMP06 operate.
The CONV/IN input pin is used to determine the rate at which
the TMP05/TMP06 measure temperature in continuously
converting mode and one shot mode. In daisy-chain mode, the
CONV/IN pin operates as the input to the daisy chain.
PRODUCT HIGHLIGHTS
1. The TMP05/TMP06 have an on-chip temperature sensor
that allows an accurate measurement of the ambient
temperature. The measurable temperature range is
–40°C to +150°C.
2. Supply voltage is 3 V to 5.5 V.
3. Space-saving 5-lead SOT-23 and SC-70 packages.
4. Temperature accuracy is typically ±0.5°C. Each part needs
a decoupling capacitor to achieve this accuracy.
5. Temperature resolution of 0.025°C.
6. The TMP05/TMP06 feature a one shot mode that reduces
the average power consumption to 102 µW at 1 SPS.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice.
No license is granted by implication or otherwise under any patent or patent rights of Analog
Devices. Trademarks and registered trademarks are the property of their respective owners.
Changes to Ordering Guide.......................................................... 26
8/04—Revision 0: Initial Version
Rev. B | Page 2 of 28
TMP05/TMP06
SPECIFICATIONS
TMP05A/TMP06A SPECIFICATIONS
All A grade specifications apply for −40°C to +150°C, VDD decoupling capacitor is a 0.1 µF multilayer ceramic, TA = T
V
= 3.0 V to 5.5 V, unless otherwise noted.
DD
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
TEMPERATURE SENSOR AND ADC
Nominal Conversion Rate (One Shot Mode) See Table 7
Accuracy @ VDD = 3.0 V to 5.5 V ±2 °C TA = 0°C to 70°C, VDD = 3.0 V to 5.5 V
±3 °C TA = –40°C to +100°C, VDD = 3.0 V to 5.5 V
±4 °C TA = –40°C to +125°C, VDD = 3.0 V to 5.5 V
±5
1
°C TA = –40°C to +150°C, VDD = 3.0 V to 5.5 V
Temperature Resolution 0.025 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 40 ms TA = 25°C, nominal conversion rate
TL Pulse Width 76 ms TA = 25°C, nominal conversion rate
Quarter Period Conversion Rate
(All Operating Modes) See Tab le 7
Accuracy
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C
Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 10 ms TA = 25°C, QI conversion rate
TL Pulse Width 19 ms TA = 25°C, QP conversion rate
Double High/Quarter Low Conversion Rate
(All Operating Modes) See Tab le 7
Accuracy
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C
Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 80 ms TA = 25°C, DH/QL conversion rate
TL Pulse Width 19 ms TA = 25°C, DH/QL conversion rate
Long-Term Drift 0.081 °C Drift over 10 years, if part is operated at 55°C
Temperature Hysteresis 0.0023 °C Temperature cycle = 25°C to 100°C to 25°C
SUPPLIES
Supply Voltage 3 5.5 V
Supply Current
Normal Mode2
@ 3.3 V 370 600 μA Nominal conversion rate
@ 5.0 V 425 650 μA Nominal conversion rate
Quiescent2
@ 3.3 V 3 12 μA Device not converting, output is high
@ 5.0 V 5.5 20 μA Device not converting, output is high
One Shot Mode @ 1 SPS 30.9 μA
Average current @ V
DD
nominal conversion rate @ 25°C
37.38 μA
Average current @ V
DD
nominal conversion rate @ 25°C
Power Dissipation 803.33 μW
= 3.3 V, continuously converting at
V
DD
nominal conversion rates @ 25°C
1 SPS 101.9 μW
Average power dissipated for V
one shot mode @ 25°C
186.9 μW
Average power dissipated for V
one shot mode @ 25°C
MIN
= 3.3 V,
= 5.0 V,
to T
DD
DD
,
MAX
= 3.3 V,
= 5.0 V,
Rev. B | Page 3 of 28
TMP05/TMP06
Parameter Min Typ Max Unit Test Conditions/Comments
TMP05 OUTPUT (PUSH-PULL)
Output High Voltage (VOH) VDD − 0.3 V IOH = 800 μA
Output Low Voltage (VOL) 0.4 V IOL = 800 μA
Output High Current (I
Pin Capacitance 10 pF
Rise Time (tLH)5 50 ns
Fal l Time (tHL)
5
RON Resistance (Low Output) 55 Ω Supply and temperature dependent
TMP06 OUTPUT (OPEN DRAIN)3
Output Low Voltage (VOL) 0.4 V IOL = 1.6 mA
Output Low Voltage (VOL) 1.2 V IOL = 5.0 mA
Pin Capacitance 10 pF
High Output Leakage Current (IOH) 0.1 5 μA PWM
Device Turn-On Time 20 ms
Fal l Time (tHL)6 30 ns
RON Resistance (Low Output) 55 Ω Supply and temperature dependent
DIGITAL INPUTS3
Input Current ±1 μA VIN = 0 V to VDD
Input Low Voltage (VIL) 0.3 × VDD V
Input High Voltage (VIH) 0.7 × VDD V
Pin Capacitance 3 10 pF
1
It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
2
Normal mode current relates to current during TL. TMP05/TMP06 are not converting during TH, so quiescent current relates to current during TH.
3
Guaranteed by design and characterization, not production tested.
4
It is advisable to restrict the current being pulled from the TMP05 output because any excess currents going through the die cause self-heating. As a consequence,
false temperature readings can occur.
5
Test load circuit is 100 pF to GND.
6
Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
OUT
3
4
)
2 mA Typ VOH = 3.17 V with VDD = 3.3 V
50 ns
= 5.5 V
OUT
Rev. B | Page 4 of 28
TMP05/TMP06
TMP05B/TMP06B SPECIFICATIONS
All B grade specifications apply for –40°C to +150°C; VDD decoupling capacitor is a 0.1 µF multilayer ceramic; TA = T
V
= 3 V to 5.5 V, unless otherwise noted.
DD
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
TEMPERATURE SENSOR AND ADC
Nominal Conversion Rate (One Shot Mode) See Table 7
Accuracy1
@ VDD = 3.3 V (±5%) ±0.2 ±1 °C TA = 0°C to 70°C, VDD = 3.135 V to 3.465 V
@ VDD = 5 V (±10%) ±0.4 −1/+1.5 °C TA = 0°C to 70°C, VDD = 4.5 V to 5.5 V
@ VDD = 3.3 V (±10%) and 5 V (±10%) ±1.5 °C
±2 °C
±2.5 °C
±4.5
2
°C
= –40°C to +70°C, VDD = 3.0 V to 3.6 V,
T
A
= 4.5 V to 5.5 V
V
DD
= –40°C to +100°C, VDD = 3.0 V to 3.6 V,
T
A
= 4.5 V to 5.5 V
V
DD
= –40°C to +125°C, VDD = 3.0 V to 3.6 V,
T
A
V
= 4.5 V to 5.5 V
DD
= –40°C to +150°C, VDD = 3.0 V to 3.6 V,
T
A
= 4.5 V to 5.5 V
V
DD
Temperature Resolution 0.025 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 40 ms TA = 25°C, nominal conversion rate
TL Pulse Width 76 ms TA = 25°C, nominal conversion rate
Quarter Period Conversion Rate
See
Table 7
(All Operating Modes)
Accuracy
1
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5.0 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C
Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 10 ms TA = 25°C, QP conversion rate
TL Pulse Width 19 ms TA = 25°C, QP conversion rate
Double High/Quarter Low Conversion Rate
See
Table 7
(All Operating Modes)
Accuracy
1
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C
Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 80 ms TA = 25°C, DH/QL conversion rate
TL Pulse Width 19 ms TA = 25°C, DH/QL conversion rate
Long-Term Drift
0.081 °C Drift over 10 years, if part is operated at 55°C
Temperature Hysteresis 0.0023 °C Temperature cycle = 25°C to 100°C to 25°C
SUPPLIES
Supply Voltage 3 5.5 V
Supply Current
Normal Mode3
@ 3.3 V 370 600 μA Nominal conversion rate
@ 5.0 V 425 650 μA Nominal conversion rate
Quiescent
3
@ 3.3 V 3 12 μA Device not converting, output is high
@ 5.0 V 5.5 20 μA Device not converting, output is high
One Shot Mode @ 1 SPS 30.9 μA
Average current @ V
nominal conversion rate @ 25°C
37.38 μA
Average current @ V
nominal conversion rate @ 25°C
to T
MIN
= 3.3 V,
DD
= 5.0 V,
DD
MAX
,
Rev. B | Page 5 of 28
TMP05/TMP06
Parameter Min Typ Max Unit Test Conditions/Comments
Power Dissipation 803.33 μW
1 SPS 101.9 μW
186.9 μW
TMP05 OUTPUT (PUSH-PULL)
4
Output High Voltage (VOH) VDD − 0.3 V IOH = 800 μA
Output Low Voltage (VOL) 0.4 V IOL = 800 μA
Output High Current (I
OUT
5
)
2 mA Typical VOH = 3.17 V with VDD = 3.3 V
Pin Capacitance 10 pF
Rise Time (tLH)6 50 ns
Fall Time (tHL)6 50 ns
RON Resistance (Low Output) 55 Ω Supply and temperature dependent
TMP06 OUTPUT (OPEN DRAIN)4
Output Low Voltage (VOL) 0.4 V IOL = 1.6 mA
Output Low Voltage (VOL) 1.2 V IOL = 5.0 mA
Pin Capacitance 10 pF
High Output Leakage Current (IOH) 0.1 5 μA PWM
Device Turn-On Time 20 ms
Fall Time (tHL)
7
30 ns
RON Resistance (Low Output) 55 Ω Supply and temperature dependent
DIGITAL INPUTS
4
Input Current ±1 μA VIN = 0 V to VDD
Input Low Voltage (VIL) 0.3 × VDD V
Input High Voltage (VIH) 0.7 × VDD V
Pin Capacitance 3 10 pF
1
The accuracy specifications for 3.0 V to 3.6 V and 4.5 V to 5.5 V supply ranges are specified to 3-Σ performance.
2
It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
3
Normal mode current relates to current during TL. TMP05/TMP06 are not converting during TH, so quiescent current relates to current during TH.
4
Guaranteed by design and characterization, not production tested.
5
It is advisable to restrict the current being pulled from the TMP05 output because any excess currents going through the die cause self-heating. As a consequence,
false temperature readings can occur.
6
Test load circuit is 100 pF to GND.
7
Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
= 3.3 V, continuously converting at
V
DD
nominal conversion rates @ 25°C
Average power dissipated for V
one shot mode @ 25°C
Average power dissipated for V
one shot mode @ 25°C
= 5.5 V
OUT
= 3.3 V,
DD
= 5.0 V,
DD
Rev. B | Page 6 of 28
TMP05/TMP06
TIMING CHARACTERISTICS
TA = T
Table 3.
Parameter Limit Unit Comments
TH 40 ms typ PWM high time @ 25°C under nominal conversion rate
TL 76 ms typ PWM low time @ 25°C under nominal conversion rate
1
t
3
1
t
4
2
t
4
t5 25 μs max Daisy-chain start pulse width
1
Test load circuit is 100 pF to GND.
2
Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
to T
MIN
, VDD = 3.0 V to 5.5 V, unless otherwise noted. Guaranteed by design and characterization, not production tested.
Peak Temperature 220°C (0°C/5°C)
Time at Peak Temperature 10 sec to 20 sec
Ramp-Up Rate 2°C/s to 3°C/s
Ramp-Down Rate −6°C/s
Time 25°C to Peak Temperature 6 minutes max
IR Reflow Soldering (Pb-Free Package)
Peak Temperature 260°C (0°C)
Time at Peak Temperature 20 sec to 40 sec
Ramp-Up Rate 3°C/sec max
Ramp-Down Rate –6°C/sec max
Time 25°C to Peak Temperature 8 minutes max
1
It is not recommended to operate the device at temperatures above 125°C
for more than a total of 5% (5,000 hours) of the lifetime of the device. Any
exposure beyond this limit affects device reliability.
2
SOT-23 values relate to the package being used on a 2-layer PCB and SC-70
values relate to the package being used on a 4-layer PCB. See Figure 4 for a
plot of maximum power dissipation vs. ambient temperature (T
3
TA = ambient temperature.
4
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled PCB
mounted components.
).
A
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
MAXIMUM POWER DISSIPATION (W)
0.1
0
–40
–30
–20
–10
0
10
20
TEMPERATURE (°C)
SOT-23
SC-70
90
80
70
60
50
40
30
100
110
120
130
140
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
03340-0-040
150
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 8 of 28
TMP05/TMP06
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
OUT
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 OUT
Digital Output. Pulse-width modulated (PWM) output gives a square wave whose ratio of high-to-low period is
proportional to temperature.
2 CONV/IN
Digital Input. In continuously converting and one shot operating modes, a high, low, or float input determines the
temperature measurement rate. In daisy-chain operating mode, this pin is the input pin for the PWM signal from
the previous part on the daisy chain.
3 FUNC
Digital Input. A high, low, or float input on this pin gives three different modes of operation. For details, see the
Operating Modes section.
4 GND Analog and Digital Ground.
5 VDD
Positive Supply Voltage, 3.0 V to 5.5 V. Using a decoupling capacitor of 0.1 μF as close as possible to this pin is
strongly recommended.
1
TMP05/
CONV/I N
FUNC
Figure 5. Pin Configuration
TMP06
2
TOP VIEW
(Not to Scale)
3
5
V
DD
GND
4
03340-005
Rev. B | Page 9 of 28
TMP05/TMP06
TYPICAL PERFORMANCE CHARACTERISTICS
10
9
8
7
6
5
4
3
OUTPUT FREQUENCY (Hz)
2
VDD = 3.3V AND 5V
1
OUT PIN L OADED WIT H 10kΩ
0
–50 –30 –10 1030507090 110 130 150
TEMPERATURE ( °C)
03340-020
VDD = 3.3V AND 5V
C
LOAD
0
VO LTAG E (V )
1V/DIV
= 100pF
0
TIME (ns)
100ns/DIV
03340-023
Figure 6. PWM Output Frequency vs. Temperature
8.57
8.56
8.55
8.54
8.53
8.52
OUTPUT FREQUENCY (Hz)
8.51
OUT PIN LOADED WITH 10kΩ
AMBIENT TEMPERATURE = 25°C
8.50
3.0
3.33.63.94.24.54. 85.15.4
SUPPLY VOLTAGE (V)
Figure 7. PWM Output Frequency vs. Supply Voltage
140
VDD = 3.3V AND 5V
OUT PIN L OADED WIT H 10kΩ
120
TL TIME
100
80
60
TIME (ms)
40
T
TIME
H
Figure 9. TMP05 Output Rise Time at 25°C
VDD = 3.3V AND 5V
C
= 100pF
LOAD
0
VO LTAG E (V )
1V/DIV
0
03340-041
TIME (ns)
100ns/DIV
03340-024
Figure 10. TMP05 Output Fall Time at 25°C
VDD = 3.3V AND 5V
R
= 1kΩ
PULLUP
R
= 10kΩ
LOAD
C
= 100pF
LOAD
0
VO LTAG E (V )
20
0
–50 –30 –10 1030507090 110 130 150
Figure 8. T
TEMPERATURE ( °C)
and TL Times vs. Temperature
H
03340-022
Rev. B | Page 10 of 28
1V/DIV
0
TIME (ns)
Figure 11. TMP06 Output Fall Time at 25°C
100ns/DIV
03340-025
TMP05/TMP06
2000
VDD = 3.3V AND 5V
1800
1600
1400
1200
1000
TIME (ns)
800
600
400
200
0
010000900080007000600050004000300020001000
CAPACTIVE L OAD (pF)
RISE TIME
FAL L T IM E
Figure 12. TMP05 Output Rise and Fall Times vs. Capacitive Load
03340-026
1.25
1.00
CONTINUOUS MODE OPERATION
0.75
NOMINAL CONVERSION RATE
0.50
0.25
0
–0.25
–0.50
TEMPERATURE ERROR (° C)
–0.75
–1.00
–1.25
–40
–20020406080100 120 140
Figure 15. Output Accuracy vs. Temperature
5V
3.3V
TEMPERATURE (°C)
03340-042
250
VDD = 3.3V AND 5V
200
150
100
I
= 0.5mA
OUTPUT LOW VOLTAGE (mV)
50
0
–50–250255075100125150
LOAD
TEMPERATURE ( °C)
I
LOAD
I
LOAD
= 1mA
= 5mA
Figure 13. TMP06 Output Low Voltage vs. Temperature
AMBIENT TEMPERATURE = 25°C
CONTINUOUS MODE OPERATION
250
NOMINAL CONVERSION RATE
NO LOAD ON O UT PIN
245
240
25
SINK CURRENT (mA)
20
15
–50–250255075100125150
TEMPERATURE ( °C)
Figure 14. TMP06 Open Drain Sink Current vs. Temperature
03340-028
Rev. B | Page 11 of 28
SUPPLY CURRENT (µA)
235
230
225
220
215
2.75.75.45. 14.84. 54.23. 93.63. 33.0
SUPPLY VOLTAGE (V)
Figure 17. Supply Current vs. Supply Voltage
03340-031
TMP05/TMP06
140
120
100
80
FINAL TEMPERATURE = 120° C
1.25
VDD = 3.3V AND 5V
AMBIENT TEMPERATURE = 25°C
1.00
0.75
60
TEMPERATURE (°C)
40
20
0
0 10203040506070
TEMPERATURE OF
ENVIRONMENT (30°C)
CHANGED HERE
TIME ( Seconds)
Figure 18. Response to Thermal Shock
03340-033
0.50
TEMPERATURE ERROR (°C)
0.25
0
051015202530
LOAD CURRENT (mA)
Figure 19. TMP05 Temperature Error vs. Load Current
03340-034
Rev. B | Page 12 of 28
TMP05/TMP06
THEORY OF OPERATION
CIRCUIT INFORMATION
The TMP05/TMP06 are monolithic temperature sensors that
generate a modulated serial digital output that varies in direct
proportion with the temperature of each device. An on-board
sensor generates a voltage precisely proportional to absolute
temperature, which is compared to an internal voltage reference
and is input to a precision digital modulator. The ratiometric
encoding format of the serial digital output is independent of
the clock drift errors common to most serial modulation
techniques such as voltage-to-frequency converters. Overall
accuracy for the A grade is ±2°C from 0°C to +70°C with
excellent transducer linearity. B grade accuracy is ±1°C from
0°C to 70°C. The digital output of the TMP05 is CMOS-/TTLcompatible and is easily interfaced to the serial inputs of most
popular microprocessors. The open-drain output of the TMP06
is capable of sinking 5 mA.
The on-board temperature sensor has excellent accuracy and
linearity over the entire rated temperature range without
correction or calibration by the user.
The sensor output is digitized by a first-order Σ-∆ modulator,
also known as the charge balance type analog-to-digital
converter. This type of converter utilizes time-domain oversampling and a high accuracy comparator to deliver 12 bits of
effective accuracy in an extremely compact circuit.
CONVERTER DETAILS
The Σ-∆ modulator consists of an input sampler, a summing
network, an integrator, a comparator, and a 1-bit DAC. Similar
to the voltage-to-frequency converter, this architecture creates,
in effect, a negative feedback loop whose intent is to minimize
the integrator output by changing the duty cycle of the
comparator output in response to input voltage changes. The
comparator samples the output of the integrator at a much
higher rate than the input sampling frequency, which is called
oversampling. Oversampling spreads the quantization noise
over a much wider band than that of the input signal, improving
overall noise performance and increasing accuracy.
Σ-Δ MODULATOR
VOLTAGE REF
AND VPTAT
CLOCK
GENERATOR
INTEGRATOR
+
–
Figure 20. First-Order Σ-∆ Modulator
1-BIT
DAC
COMPARATOR
+
–
DIGITAL
FILTER
TMP05/T MP06
OUT
(SINGLE-BIT)
3340-006
The modulated output of the comparator is encoded using a
circuit technique that results in a serial digital signal with a
mark-space ratio format. This format is easily decoded by any
microprocessor into either °C or °F values, and is readily
transmitted or modulated over a single wire. More importantly,
this encoding method neatly avoids major error sources
common to other modulation techniques because it is clockindependent.
FUNCTIONAL DESCRIPTION
The output of the TMP05/TMP06 is a square wave with a
typical period of 116 ms at 25°C (CONV/IN pin is left floating).
The high period, T
, is constant, while the low period, TL, varies
H
with measured temperature. The output format for the nominal
conversion rate is readily decoded by the user as follows:
Temperature (°C) = 421 − (751 × (T
)) (1)
H/TL
T
H
Figure 21. TMP05/TMP06 Output Format
T
L
The time periods TH (high period) and TL (low period) are
values easily read by a microprocessor timer/counter port, with
the above calculations performed in software. Because both
periods are obtained consecutively using the same clock,
performing the division indicated in Equation 1 results in a
ratiometric value independent of the exact frequency or drift of
the TMP05/TMP06 originating clock or the user’s counting clock.
OPERATING MODES
The user can program the TMP05/TMP06 to operate in three
different modes by configuring the FUNC pin on power-up as
either low, floating, or high.
Table 6. Operating Modes
FUNC Pin Operating Mode
Low One shot
Floating Continuously converting
High Daisy-chain
Continuously Converting Mode
In continuously converting mode, the TMP05/TMP06 continuously output a square wave representing temperature. The
frequency at which this square wave is output is determined by
the state of the CONV/IN pin on power-up. Any change to the
state of the CONV/IN pin after power-up is not reflected in the
parts until the TMP05/TMP06 are powered down and back up.
03340-007
Rev. B | Page 13 of 28
TMP05/TMP06
One Shot Mode
In one shot mode, the TMP05/TMP06 output one square wave
representing temperature when requested by the microcontroller. The microcontroller pulls the OUT pin low and then
releases it to indicate to the TMP05/TMP06 that an output is
required. The time between the OUT pin going low to the time
it is released should be greater than 20 ns. Internal hysteresis in
the OUT pin prevents the TMP05/TMP06 from recognizing
that the pulse is going low (if it is less than 20 ns). The
temperature measurement is output when the OUT line is
released by the microcontroller (see
µCONTROLLERPULLS DOWN
OUT LINE HERE
TEMP MEASUREMENT
T
>20ns
H
Figure 22).
µCONTROLLER RELEASES
OUT LINE HERE
T
L
Conversion Rate
In continuously converting and one shot modes, the state of the
CONV/IN pin on power-up determines the rate at which the
TMP05/TMP06 measure temperature. The available conversion
rates are shown in
Tabl e 7 .
Table 7. Conversion Rates
CONV/IN Pin Conversion Rate TH/TL (25°C)
Low
Quarter period
/4, TL/4)
(T
H
10/19 (ms)
Floating Nominal 40/76 (ms)
High
Double high (T
Quarter low (T
x 2)
H
L
/4)
80/19 (ms)
The TMP05 (push-pull output) advantage when using the high
state conversion rate (double high/quarter low) is lower power
consumption. However, the trade-off is loss of resolution on the
low time. Depending on the state of the CONV/IN pin, two
different temperature equations must be used.
T
0
Figure 22. TMP05/TMP06 One Shot OUT Pin Signal
TIME
03340-019
In the TMP05 one shot mode only, an internal resistor is
switched in series with the pull-up MOSFET. The TMP05 OUT
pin has a push-pull output configuration (see
Figure 23).
Therefore, it needs a series resistor to limit the current drawn
on this pin when the user pulls it low to start a temperature
conversion. This series resistance prevents any short circuit
from V
to GND, and, as a result, protects the TMP05 from
DD
short-circuit damage.
V+
5kΩ
OUT
TMP05
Figure 23. TMP05 One Shot Mode OUT Pin Configuration
03340-016
The advantages of the one shot mode include lower average
power consumption, and the microcontroller knowing that the
first low-to-high transition occurs after the microcontroller
releases the OUT pin.
The temperature equation for the low and floating states’
conversion rates is
Setting the FUNC pin to a high state allows multiple TMP05/
TMP06s to be connected together and, therefore, allows one input
line of the microcontroller to be the sole receiver of all temperature
measurements. In this mode, the CONV/IN pin operates as the
input of the daisy chain. In addition, conversions take place at
the nominal conversion rate of T
= 40 ms/76 ms at 25°C.
H/TL
Therefore, the temperature equation for the daisy-chain mode
of operation is
Temperature (°C) = 421 − (751 × (T
OUT
CONV/IN
TMP05/
MICRO
TMP06
#1
IN
CONV/IN
OUT
TMP05/
TMP06
#2
OUT
Figure 24. Daisy-Chain Structure
)) (4)
HTL
CONV/IN
TMP05/
TMP06
#3
OUT
CONV/I N
TMP05/
TMP06
#N
OUT
03340-009
A second microcontroller line is needed to generate the conversion start pulse on the CONV/IN pin. The pulse width of the
start pulse should be less than 25 µs but greater than 20 ns. The
start pulse on the CONV/IN pin lets the first TMP05/TMP06
part know that it should now start a conversion and output its
own temperature. Once the part has output its own temperature,
it outputs a start pulse for the next part on the daisy-chain link.
The pulse width of the start pulse from each TMP05/TMP06 part
is typically 17 µs.
Figure 25 shows the start pulse on the CONV/IN pin of the first
device on the daisy chain.
Figure 26 shows the PWM output by
this first part.
Before the start pulse reaches a TMP05/TMP06 part in the
daisy chain, the device acts as a buffer for the previous temperature measurement signals. Each part monitors the PWM signal
for the start pulse from the previous part. Once the part detects
the start pulse, it initiates a conversion and inserts the result at
the end of the daisy-chain PWM signal. It then inserts a start
pulse for the next part in the link. The final signal input to the
microcontroller should look like
Figure 27. The input signal on
Pin 2 (IN) of the first daisy-chain device must remain low until
the last device has output its start pulse.
If the input on Pin 2 (IN) goes high and remains high, the
TMP05/TMP06 part powers down between 0.3 sec and 1.2 sec
later. The part, therefore, requires another start pulse to generate
another temperature measurement. Note that to reduce power
dissipation through the part, it is recommended to keep Pin 2
(IN) at a high state when the part is not converting. If the IN pin
is at 0 V, the OUT pin is at 0 V (because it is acting as a buffer
when not converting), and is drawing current through either the
pull-up MOSFET (TMP05) or the pull-up resistor (TMP06).
MUST GO HIGH ONLY
AFTER START PULSE HAS
BEEN OUTPUT BY LAST
TMP05/T MP06 ON DAIS Y CHAIN.
Figure 27. Daisy-Chain Signal at Input to the Microcontroller
TMP05 OUTPUT
The TMP05 has a push-pull CMOS output (Figure 28) and
provides rail-to-rail output drive for logic interfaces. The rise
and fall times of the TMP05 output are closely matched so that
errors caused by capacitive loading are minimized. If load
capacitance is large (for example, when driving a long cable),
an external buffer could improve accuracy.
An internal resistor is connected in series with the pull-up
MOSFET when the TMP05 is operating in one shot mode.
V+
OUT
TMP05
Figure 28. TMP05 Digital Output Structure
03340-011
TIME
03340-008
TMP06 OUTPUT
The TMP06 has an open-drain output. Because the output
source current is set by the pull-up resistor, output capacitance
should be minimized in TMP06 applications. Otherwise,
unequal rise and fall times skew the pulse width and introduce
measurement errors.
OUT
TMP06
Figure 29. TMP06 Digital Output Structure
03340-012
Rev. B | Page 16 of 28
TMP05/TMP06
APPLICATION HINTS
THERMAL RESPONSE TIME
The time required for a temperature sensor to settle to a
specified accuracy is a function of the sensor’s thermal mass
and the thermal conductivity between the sensor and the object
being sensed. Thermal mass is often considered equivalent to
capacitance. Thermal conductivity is commonly specified using
the symbol Q and can be thought of as thermal resistance. It is
usually specified in units of degrees per watt of power transferred
across the thermal joint. Thus, the time required for the TMP05/
TMP06 to settle to the desired accuracy is dependent on the
package selected, the thermal contact established in that
particular application, and the equivalent power of the heat
source. In most applications, the settling time is probably best
determined empirically.
SELF-HEATING EFFECTS
The temperature measurement accuracy of the TMP05/TMP06
can be degraded in some applications due to self-heating. Errors
are introduced from the quiescent dissipation and power dissipated
when converting, that is, during T
temperature errors depends on the thermal conductivity of the
TMP05/TMP06 package, the mounting technique, and the
effects of airflow. Static dissipation in the TMP05/TMP06 is
typically 10 µW operating at 3.3 V with no load. In the 5-lead
SC-70 package mounted in free air, this accounts for a
temperature increase due to self-heating of
T = P
× θJA = 10 µW × 534.7°C/W = 0.0053°C (5)
DISS
In addition, power is dissipated by the digital output, which is
capable of sinking 800 µA continuously (TMP05). Under an
800 µA load, the output can dissipate
= (0.4 V)(0.8 mA)((TL)/TH + TL)) (6)
P
DISS
. The magnitude of these
L
SUPPLY DECOUPLING
The TMP05/TMP06 should be decoupled with a 0.1 µF ceramic
capacitor between V
if the TMP05/TMP06 are mounted remotely from the power
supply. Precision analog products such as the TMP05/TMP06
require a well filtered power source. Because the parts operate
from a single supply, simply tapping into the digital logic power
supply could appear to be a convenient option. Unfortunately,
the logic supply is often a switch-mode design, which generates
noise in the 20 kHz to 1 MHz range. In addition, fast logic gates
can generate glitches hundreds of mV in amplitude due to
wiring resistance and inductance.
If possible, the TMP05/TMP06 should be powered directly
from the system power supply. This arrangement, shown in
Figure 30, isolates the analog section from the logic switching
transients. Even if a separate power supply trace is not available,
generous supply bypassing reduces supply-line-induced errors.
Local supply bypassing consisting of a 0.1 µF ceramic capacitor
is critical for the temperature accuracy specifications to be
achieved. This decoupling capacitor must be placed as close as
possible to the TMP05/TMP06 V
decoupling capacitor is Phicomp’s 100 nF, 50 V X74.
It is important to keep the capacitor package size as small as
possible because ESL (equivalent series inductance) increases
with increasing package size. Reducing the capacitive value
below 100 nF increases the ESR (equivalent series resistance).
Using a capacitor with an ESL of 1 nH and an ESR of 80 mΩ is
recommended.
TTL/CMOS
LOGIC
CIRCUITS
and GND. This is particularly important
DD
pin. A recommended
DD
TMP05/
0.1µF
TMP06
For example, with T
= 80 ms and TH = 40 ms, the power
L
dissipation due to the digital output is approximately 0.21 mW.
In a free-standing SC-70 package, this accounts for a temperature increase due to self-heating of
T = P
× θJA = 0.21 mW × 534.7°C/W = 0.112°C (7)
DISS
This temperature increase directly adds to that from the
quiescent dissipation and affects the accuracy of the TMP05/
TMP06 relative to the true ambient temperature.
It is recommended that current dissipated through the device be
kept to a minimum because it has a proportional effect on the
temperature error.
Rev. B | Page 17 of 28
POWER
SUPPLY
Figure 30. Use Separate Traces to Reduce Power Supply Noise
03340-013
TMP05/TMP06
T
S
LAYOUT CONSIDERATIONS
Digital boards can be electrically noisy environments and
glitches are common on many of the signals in the system.
The likelihood of glitches causing problems to the TMP05/
TMP06 OUT pin is very minute. The typical impedance of the
TMP05/TMP06 OUT pin when driving low is 55 Ω. When
driving high, the TMP05 OUT pin is similar. This low impedance makes it very difficult for a glitch to break the V
thresholds. There is a slight risk that a sizeable glitch could
cause problems. A glitch can only cause problems when the
OUT pin is low during a temperature measurement. If a glitch
occurs that is large enough to fool the master into believing that
the temperature measurement is over, the temperature read
would not be the actual temperature. In most cases, the master
spots a temperature value that is erroneous and can request
another temperature measurement for confirmation. One area
that can cause problems is if this very large glitch occurs near
the end of the low period of the mark-space waveform, and the
temperature read back is so close to the expectant temperature
that the master does not question it.
One layout method that helps in reducing the possibility of a
glitch is to run ground tracks on either side of the OUT line.
Use a wide OUT track to minimize inductance and reduce noise
pickup. A 10 mil track minimum width and spacing is
recommended.
Figure 31 shows how glitch protection traces
could be laid out.
GND
OUT
GND
Figure 31. Use Separate Traces to Reduce Power Supply Noise
IL
10 MIL
10 MIL
10 MIL
10 MIL
10 MIL
and VIH
03340-043
nearby heat source, the thermal impedance between the heat
source and the TMP05/TMP06 must be considered. Often, a
thermocouple or other temperature sensor is used to measure
the temperature of the source, while the TMP05/TMP06
temperature is monitored by measuring T
and TL. Once the
H
thermal impedance is determined, the temperature of the heat
source can be inferred from the TMP05/TMP06 output.
One example of using the TMP05/TMP06’s unique properties is
in monitoring a high power dissipation microprocessor. Each
TMP05/TMP06 part, in a surface-mounted package, is
mounted directly beneath the microprocessor’s pin grid array
(PGA) package. In a typical application, the TMP05/TMP06
output is connected to an ASIC, where the pulse width is
measured. The TMP05/TMP06 pulse output provides a
significant advantage in this application because it produces a
linear temperature output while needing only one I/O pin and
without requiring an ADC.
DAISY-CHAIN APPLICATION
This section provides an example of how to connect two
TMP05s in daisy-chain mode to a standard 8052 microcontroller core. The
core processing engine is the 8052. Figure 31 shows how to
interface to the 8052 core device. The
Example 1
ADuC812 to two daisy-chained TMP05s. This code can also be
used with the
8052 core.
IMER T0
TART S
TEMP_HIGH0
ADuC812 is the microcontroller used and the
TMP05 Program Code
section shows how to communicate from the
ADuC831 or any microprocessor running on an
TEMPSEGMENT = 1 TEMPSEGMENT = 2 TEMPSEGMENT = 3
TEMP_HIGH2TEMP_HIGH1
INTO
INTOINTO
Another method that helps reduce the possibility of a glitch is to
use a 50 ns glitch filter on the OUT line. The glitch filter
eliminates any possibility of a glitch getting through to the
master or being passed along a daisy chain.
TEMPERATURE MONITORING
The TMP05/TMP06 are ideal for monitoring the thermal
environment within electronic equipment. For example, the
surface-mounted package accurately reflects the exact thermal
conditions that affect nearby integrated circuits.
The TMP05/TMP06 measure and convert the temperature at
the surface of their own semiconductor chip. When the
Figure 32. Reference Diagram for Software Variables
in the
Figure 32 is a diagram of the input waveform into the ADuC812
from the TMP05 daisy chain. It illustrates how the code’s variables
are assigned and it should be referenced when reading the
TMP05 Program Code Example 1. Application notes showing
the TMP05 working with other types of microcontrollers are
available from Analog Devices at
Figure 33 shows how the three devices are hardwired together.
Figure 34 to Figure 36 are flow charts for this program.
TEMP_LOW0TEMP_LOW1
TMP05 Program Code Example 1
www.analog.com.
03340-035
TMP05/TMP06 are used to measure the temperature of a
//=============================================================================================
// Description : This program reads the temperature from 2 daisy-chained TMP05 parts.
//
// This code runs on any standard 8052 part running at 11.0592MHz.
// If an alternative core frequency is used, the only change required is an
// adjustment of the baud rate timings.
//
// P3.2 = Daisy-chain output connected to INT0.
// P3.7 = Conversion control.
// Timer0 is used in gate mode to measure the high time.
// Timer1 is triggered on a high-to-low transition of INT0 and is used to measure
// the low time.
//=============================================================================================
03340-037
Rev. B | Page 21 of 28
TMP05/TMP06
#include <stdio.h>
#include <ADuC812.h> //ADuC812 SFR definitions
void delay(int);
sbit Daisy_Start_Pulse = 0xB7; //Daisy_Start_Pulse = P3.7
sbit P3_4 = 0xB4;
long temp_high0,temp_low0,temp_high1,temp_low1,temp_high2,th,tl; //Global variables to allow
//access during ISR.
//See
int timer0_count=0,timer1_count=0,tempsegment=0;
if (tempsegment == 1)
{
temp_high0 = (TH0*0x100+TL0)+(timer0_count*65536); //Convert to integer
TH0=0x00; //Reset count
TL0=0x00;
timer0_count=0;
}
if (tempsegment == 2)
{
temp_low0 = (th*0x100+tl)+(timer1_count*65536); //Convert to integer
temp_high1 = (TH0*0x100+TL0)+(timer0_count*65536); //Convert to integer
TH0=0x00; //Reset count
TL0=0x00;
timer0_count=0;
timer1_count=0;
}
if (tempsegment == 3)
{
temp_low1 = (th*0x100+tl)+(timer1_count*65536); //Convert to integer
temp_high2 = (TH0*0x100+TL0)+(timer0_count*65536);
TH0=0x00; //Reset count
TL0=0x00;
timer0_count=0;
timer1_count=0;
}
tempsegment++;
}
void timer0 () interrupt 1
{
timer0_count++; //Keep a record of timer0 overflows
}
void timer1 () interrupt 3
{
timer1_count++; //Keep a record of timer1 overflows
This section provides an example of how to connect one
TMP05 in continuously converting mode to a microchip
PIC16F876 microcontroller.
to the PIC16F876.
Figure 37 shows how to interface
FIRST TEMP
MEASUREMENT
SECOND TEMP
MEASUREMENT
TMP05 Program Code Example 2 shows how to
The
T
0
TIME
communicate from the microchip device to the TMP05. This
code can also be used with other PICs by changing the include
file for the part.
//=============================================================================================
//
// Description : This program reads the temperature from a TMP05 part set up in continuously
// converting mode.
// This code was written for a PIC16F876, but can be easily configured to function with other
// PICs by simply changing the include file for the part.
//
// Fosc = 4MHz
// Compiled under CCS C compiler IDE version 3.4
// PWM output from TMP05 connected to PortA.0 of PIC16F876
//
//============================================================================================
#include <16F876.h> // Insert header file for the particular PIC being used
#device adc=8
#use delay(clock=4000000)
#fuses NOWDT,XT, PUT, NOPROTECT, BROWNOUT, LVP
//_______________________________Wait for high function_____________________________________
void wait_for_high() {
while(input(PIN_A0)) ; /* while high, wait for low */
while(!input(PIN_A0)); /* wait for high */
}
//______________________________Wait for low function_______________________________________
void wait_for_low() {
while(input(PIN_A0)); /* wait for high */
}
//_______________________________Main begins here____________________________________________
void main(){
long int high_time,low_time,temp;
temp = 421 – ((751 * high_time)/low_time)); //Temperature equation for the high state
//Temperature value stored in temp as a long int
}while (TRUE);
}
//conversion rate.
Rev. B | Page 25 of 28
TMP05/TMP06
OUTLINE DIMENSIONS
2.20
2.00
1.80
1.35
1.25
1.15
PIN 1
1.00
0.90
0.70
0
.
1
0
A
M
X
0.10 COPLANARITY
123
0.30
0.15
COMPLIANT TO JEDEC STANDARDS MO-203-AA
45
0.65 BSC
2.40
2.10
1.80
1.10
0.80
SEATING
PLANE
0.40
0.10
0.22
0.08
0.46
0.36
0.26
Figure 38. 5-Lead Thin Shrink Small Outline Transistor Package [SC-70]
(KS-5)
Dimensions shown in millimeters
1.60 BSC
PIN 1
1.30
1.15
0.90
0.15 MAX
Figure 39. 5-Lead Small Outline Transistor Package [SOT-23]
2.90 BSC
5
123
COMPLIANT TO JEDEC STANDARDS MO-178-AA
1.90
BSC
0.50
0.30
4
0.95 BSC
2.80 BSC
1.45 MAX
SEATING
PLANE
0.22
0.08
10°
5°
0°
(RJ-5)
Dimensions shown in millimeters
0.60
0.45
0.30
ORDERING GUIDE
Minimum
Model
Quantities/Reel
TMP05AKS-500RL7 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8A
TMP05AKS-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8A
TMP05AKS-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8A
TMP05AKSZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8C
TMP05AKSZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8C
TMP05AKSZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8C
TMP05ART-500RL7 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8A
TMP05ART-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8A
TMP05ART-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8A
TMP05ARTZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8C
TMP05ARTZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8C
TMP05ARTZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8C
TMP05BKS-500RL7 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8B
TMP05BKS-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8B
TMP05BKS-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8B
TMP05BKSZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8D
TMP05BKSZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8D
TMP05BKSZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8D
TMP05BRT-500RL7 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8B
TMP05BRT-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8B
TMP05BRT-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8B
TMP05BRTZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8D
TMP05BRTZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8D
TMP05BRTZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8D
Temperature
1
Range
Temperature
Accuracy
2
Package
Description
Package
Option
Branding
Rev. B | Page 26 of 28
TMP05/TMP06
Minimum
Model
Quantities/Reel
TMP06AKS-500RL7 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9A
TMP06AKS-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9A
TMP06AKS-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9A
TMP06AKSZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9C
TMP06AKSZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9C
TMP06AKSZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9C
TMP06ART-500RL7 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9A
TMP06ART-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9A
TMP06ART-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9A
TMP06ARTZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9C
TMP06ARTZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9C
TMP06ARTZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9C
TMP06BKS-500RL7 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9B
TMP06BKS-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9B
TMP06BKS-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9B
TMP06BKSZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9D
TMP06BKSZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9D
TMP06BKSZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9D
TMP06BRT-500RL7 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9B
TMP06BRT-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9B
TMP06BRT-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9B
TMP06BRTZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9D
TMP06BRTZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9D
TMP06BRTZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9D
1
It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
2
A-grade and B-grade temperature accuracy is over the 0°C to 70°C temperature range.