AMP04
REV. B
–5–
Parameter Symbol Conditions Limit Unit
G = 1000 80 dB min
Power Supply Rejection PSRR 4.0 V ≤ V
S
≤ 12 V
G = 1 85 dB min
G = 10 95 dB min
G = 100 95 dB min
G = 1000 95 dB min
GAIN (G = 100 K/R
GAIN
)
Gain Equation Accuracy G = 1 to 100 0.75 % max
OUTPUT
Output Voltage Swing High V
OH
RL = 2 kΩ 4.0 V min
Output Voltage Swing Low V
OL
RL = 2 kΩ 2.5 mV max
POWER SUPPLY
Supply Current I
SY
VS = ±15 900 µA max
700 µA max
NOTE
Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard
product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±18 V
Common-Mode Input Voltage
2
. . . . . . . . . . . . . . . . . . . ± 18 V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Output Short-Circuit Duration to GND . . . . . . . . . . Indefinite
Storage Temperature Range
Z Package . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +175°C
P, S Package . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range
AMP04A . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
AMP04E, F . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature Range
Z Package . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +175°C
P, S Package . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300°C
Package Type
JA
3
JC
Unit
8-Lead Cerdip (Z) 148 16 °C/W
8-Lead Plastic DIP (P) 103 43 °C/W
8-Lead SOIC (S) 158 43 °C/W
NOTES
1
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
For supply voltages less than ± 18 V, the absolute maximum input voltage is
equal to the supply voltage.
3
θJA is specified for the worst case conditions, i.e., θJA is specified for device in
socket for cerdip, P-DIP, and LCC packages; θJA is specified for device
soldered in circuit board for SOIC package.
ORDERING GUIDE
Temperature VOS @ 5 V Package Package
Model Range TA = 25C Description Option
AMP04EP XIND 150 µV Plastic DIP N-8
AMP04ES XIND 150 µV SOIC SO-8
AMP04ES-REEL7 XIND 150 µV SOIC SO-8
AMP04FP XIND 300 µV Plastic DIP N-8
AMP04FS XIND 300 µV SOIC SO-8
AMP04FS-REEL XIND 150 µV SOIC SO-8
AMP04FS-REEL7 XIND 150 µV SOIC SO-8
AMP04GBC 25°C 300 µV
DICE CHARACTERISTICS
R
GAIN
1
R
GAIN
8
7 V+
6 V
OUT
5 REF
–IN 2
+IN 3
V– 4
AMP04 Die Size 0.075 × 0.99 inch, 7,425 sq. mils.
Substrate (Die Backside) Is Connected to V+.
Transistor Count, 81.