FEATURES
Low Offset Voltage: 100 V max
Low Drift: 2 V/ⴗC max
Wide Gain Range: 1 to 10,000
High Common-Mode Rejection: 115 dB min
High Bandwidth (G = 1000): 200 kHz typ
Gain Equation Accuracy: 0.5% max
Single Resistor Gain Set
Input Overvoltage Protection
Low Cost
Available in Die Form
APPLICATIONS
Differential Amplifier
Strain Gage Amplifier
Thermocouple Amplifier
RTD Amplifier
Programmable Gain Instrumentation Amplifier
Medical Instrumentation
Data Acquisition Systems
FUNCTIONAL BLOCK DIAGRAM
8-Lead PDIP and CERDIP
RG
–IN
+IN
1
1
2
3
4
V–
8
RG
2
7
V+
6
OUT
5
REFERENCE
3
+IN
–IN
FOR SOL CONNECT SENSE TO OUTPUT
–
1
RG
R
G
G = = + 1
1
8
RG
2
2
+
V
OUT
(+IN) – (–IN)
Figure 1. Basic Circuit Connections
NC
RG
NC
–IN
+IN
NC
V–
NC
V+
7
4
V–
50k⍀
()
16-Lead SOIC
1
2
1
3
4
5
6
7
8
NC = NO CONNECT
6
5
REFERENCE
R
G
OUT
16
NC
15
RG
2
14
NC
13
V+
12
SENSE
11
OUT
10
REFERENCE
9
NC
GENERAL DESCRIPTION
The AMP02 is the first precision instrumentation amplifier
available in an 8-lead package. Gain of the AMP02 is set by a
single external resistor and can range from 1 to 10,000. No
gain set resistor is required for unity gain. The AMP02 includes
an input protection network that allows the inputs to be taken
60 V beyond either supply rail without damaging the device.
Laser trimming reduces the input offset voltage to under 100 µV.
Output offset voltage is below 4 mV, and gain accuracy is better
than 0.5% for a gain of 1000. ADI’s proprietary thin-film resistor process keeps the gain temperature coefficient under 50 ppm/°C.
REV. E
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
Due to the AMP02’s design, its bandwidth remains very high
over a wide range of gain. Slew rate is over 4 V/µs, making the
AMP02 ideal for fast data acquisition systems.
A reference pin is provided to allow the output to be referenced
to an external dc level. This pin may be used for offset correction or level shifting as required. In the 8-lead package, sense is
internally connected to the output.
For an instrumentation amplifier with the highest precision,
consult the AMP01 data sheet.
Input voltage range guaranteed by common-mode rejection test.
2
Guaranteed by design.
3
Gain tempco does not include the effects of external component drift.
Specifications subject to change without notice.
S
SY
TA = 25°C5656mA
–40°C ≤ TA ≤ +85°C5656mA
±4.5±18± 4.5±18V
ABSOLUTE MAXIMUM RATINGS
1, 2
Supply Voltage±18 V
Common-Mode Input Voltage [(V–) – 60 V] to [(V+) + 60 V]
Differential Input Voltage[(V–) – 60 V] to [(V+) + 60 V]
Output Short-Circuit DurationContinuous
Operating Temperature Range–40°C to +85°C
Storage Temperature Range–65°C to +150°C
Function Temperature Range–65°C to +150°C
Lead Temperature (Soldering, 10 sec)300°C
AMP02EP100 µV4 mV–40°C to +85°C8-Lead Plastic DIP
AMP02FP200 µV8 mV–40°C to +85°C8-Lead Plastic DIP
AMP02AZ/883C200 µV10 mV–55°C to +125°C8-Lead CERDIP
AMP02FS200 µV8 mV–40°C to +85°C16-Lead SOIC
AMP02GBCDie
AMP02FS-REEL 200 µV8 mV–40°C to +85°C16-Lead SOIC
max @ TemperaturePackage
OOS
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
3
θJA is specified for worst case mounting conditions, i.e., θJA is specified for
device in socket for P-DIP package; θJA is specified for device soldered to
printed circuit board for SOIC package.
–IN+IN
RG1R
G2
Figure 2. Simplified Schematic
REV. E
–3–
25k⍀
25k⍀
25k⍀
25k⍀
V+
SENSE
OUT
REFERENCE
V–
AMP02
8
1
DIE SIZE 0.103 inch ⴛ 0.116 inch, 11,948 sq. mils
(2.62 mm ⴛ 2.95 mm, 7.73 sq. mm)
NOTE: PINS 1 and 8 are KELVIN CONNECTED
Die Characteristics
1. RG
1
2. –IN
3. +IN
4. V–
5. REFERENCE
6. OUT
7. V+
8. RG
2
9. SENSE
CONNECT SUBSTRATE TO V–
WAFER TEST LIMITS*
(@ VS = ⴞ15 V, VCM = 0 V, TA = 25ⴗC, unless otherwise noted.)
AMP02 GBC
ParameterSymbolConditionsLimitsUnit
Input Offset VoltageV
Output Offset VoltageV
IOS
OOS
= ±4.8 V to ±18 V
V
S
200µV max
8mV max
G = 1000110
Power SupplyPSRG = 100110dB
RejectionG = 1095
G = 175
Input Bias CurrentI
Input Offset CurrentI
B
OS
20nA max
10nA max
Input Voltage RangeIVRGuaranteed by CMR Tests± 11V min
= ±11 V
V
CM
G = 1000110
Common-ModeCMRG = 100110dB
RejectionG = 1095
G = 175
50 kΩ
Gain Equation Accuracy
Output Voltage SwingV
Supply CurrentI
*Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not
guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
OUT
SY
G =
RL = 1 kΩ±12V min
+1, G =1000
R
G
0.7% max
6mA max
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AMP02 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. E–4–
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