ANALOG DEVICES ADA4310-1 Service Manual

Low Cost, Dual, High Current Output
A
B

FEATURES

High speed
−3 dB bandwidth: 190 MHz, G = +5 Slew rate: 820 V/μs, R
Wide output swing
20.4 V p-p differential, R High output current Low distortion
−95 dBc typical at 1 MHz, V
−69 dBc typical at 10 MHz, V Power management and shutdown
Control inputs CMOS level compatible Shutdown quiescent current 0.65 mA/amplifier Adjustable low quiescent current: 3.9 mA to 7.6 mA per amp

APPLICATIONS

Home networking line drivers Twisted pair line drivers Power line communications Video line drivers ARB line drivers I/Q channel amplifiers
= 50 Ω
LOAD
of 100 Ω from 12 V supply
LOAD
= 2 V p-p, G = +5, R
OUT
= 2 V p-p, G = +5, R
OUT
LOAD
LOAD
= 50 Ω
= 50 Ω
Line Driver with Shutdown
ADA4310-1

PIN CONFIGURATIONS

+V
1
S
2
NC
3
OUT A
–IN A
4
+IN A
5
NC = NO CONNECT
Figure 1. Thermally Enhanced, 10-Lead MINI_SO_EP
OUT
16
1NC 2−IN A
3+IN A
4GND
NC = NO CONNECT
5
NC
Figure 2. Thermally Enhanced, 4 mm × 4 mm 16-Lead LFCSP_VQ
OUT B
10
9
–IN B
8
+IN B
PD1
7
PD0
6
S
OUT
NC
+V
14
13
15
12 NC 11 IN B
10 +IN B
9PD1
8
7
6
S
NC
–V
PD0
06027-001
06027-002

GENERAL DESCRIPTION

The ADA4310-1 is comprised of two high speed, current feedback operational amplifiers. The high output current, high bandwidth, and fast slew rate make it an excellent choice for broadband applications requiring high linearity performance while driving low impedance loads.
The ADA4310-1 incorporates a power management function that provides shutdown capabilities and/or the ability to optimize the amplifiers quiescent current. The CMOS­compatible, power-down control pins (PD1 and PD0) enable the ADA4310-1 to operate in four different modes: full power, medium power, low power, and complete power down. In the power-down mode, quiescent current drops to only
0.65 mA/amplifier, while the amplifier output goes to a high impedance state.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
The ADA4310-1 is available in a thermally enhanced, 10-lead MSOP with an exposed paddle for improved thermal conduction and in a thermally enhanced, 4 mm × 4 mm 16-lead LFCSP. The ADA4310-1 is rated to work in the extended industrial temperature range of −40°C to +85°C.
1/2
1
V
MID
V
CC
1
=
V
MID
Figure 3. Typical PLC Driver Application
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved.
ADA4310-1
1/2
ADA4310-1
V
EE
2
06027-003
ADA4310-1

TABLE OF CONTENTS

Features.............................................................................................. 1
Theory of Operation ...................................................................... 10
Applications....................................................................................... 1
Pin Configurations ........................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 7

REVISION HISTORY

10/06—Revision 0: Initial Version
Application Information................................................................ 11
Feedback Resistor Selection...................................................... 11
Power Control Modes of Operation ........................................ 11
Exposed Thermal Pad Connections ........................................ 11
Power Line Application............................................................. 11
Board Layout............................................................................... 12
Power Supply Bypassing............................................................ 12
Outline Dimensions....................................................................... 13
Ordering Guide .......................................................................... 13
Rev. 0 | Page 2 of 16
ADA4310-1

SPECIFICATIONS

VS = 12 V, ±6 V (@ TA = 25°C, G = +5, RL = 100 Ω, unless otherwise noted).
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit
DYNAMIC PERFORMANCE
−3 dB Bandwidth G = +5, V PD1 = 0, PD0 = 1 140 MHz PD1 = 1, PD0 = 0 100 MHz Slew Rate G = +5, V PD1 = 0, PD0 = 1 790 V/μs PD1 = 1, PD0 = 0 750 V/μs
NOISE/DISTORTION PERFORMANCE
Distortion (Worst Harmonic) fC = 1 MHz, V
PD1 = 0, PD0 = 0 −95 dBc
PD1 = 0, PD0 = 1 −88 dBc PD1 = 1, PD0 = 0 −77 dBc f
= 10 MHz, V
C
PD1 = 0, PD0 = 0 −69 dBc PD1 = 0, PD0 = 1 −57 dBc PD1 = 1, PD0 = 0 −47 dBc f
= 20 MHz, V
C
PD1 = 0, PD0 = 0 −50 dBc PD1 = 0, PD0 = 1 −42 dBc PD1 = 1, PD0 = 0 −35 dBc Input Voltage Noise f = 100 kHz 2.85 nV/√Hz Input Current Noise f = 100 kHz 21.8 pA/√Hz
DC PERFORMANCE
Input Offset Voltage 1 mV Input Bias Current
Noninverting Input −2 μA
Inverting Input 6 μA Open-Loop Transimpedance R R
LOAD
LOAD
Common-Mode Rejection −62 dB
INPUT CHARACTERISTICS
Input Resistance f < 100 kHz 500
OUTPUT CHARACTERISTICS
Single-Ended +Swing R Single-Ended −Swing R Single-Ended +Swing R Single-Ended −Swing R Differential Swing R
LOAD
LOAD
LOAD
LOAD
LOAD
POWER SUPPLY
Operating Range (Dual Supply) ±2.5 ±6 V Operating Range (Single Supply) +5 +12 V Supply Current PD1 = 0, PD0 = 0 7.6 mA/amp PD1 = 0, PD0 = 1 5.6 mA/amp PD1 = 1, PD0 = 0 3.9 mA/amp PD1 = 1, PD0 = 1 0.65 mA/amp
= 0.1 V p-p, PD1 = 0, PD0 = 0 190 MHz
OUT
= 2 V p-p, R
OUT
= 2 V p-p, R
OUT
OUT
OUT
= 2 V p-p, R
= 2 V p-p, R
= 50 Ω, PD1 = 0, PD0 = 0 820 V/μs
LOAD
= 50 Ω
LOAD
= 50 Ω
LOAD
= 50 Ω
LOAD
= 50 Ω 14 MΩ = 100 Ω 35
= 50 Ω +5.08 VP = 50 Ω −5.12 VP = 100 Ω +5.14 VP = 100 Ω −5.17 VP = 100 Ω 20.4 V p-p
Rev. 0 | Page 3 of 16
ADA4310-1
Parameter Test Conditions/Comments Min Typ Max Unit
POWER DOWN PINS
PD1, PD0 Threshold Referenced to GND 1.5 V PD1, PD0 = 0 Pin Bias Current PD1 or PD0 = 0 V −0.2 μA PD1, PD0 = 1 Pin Bias Current PD1 or PD0 = 3 V 70 μA Enable/Disable Time 0.04/2 μs Power Supply Rejection Ratio Positive/Negative −70/−60 dB
Rev. 0 | Page 4 of 16
ADA4310-1

ABSOLUTE MAXIMUM RATINGS

Table 2.
Parameter Rating
Supply Voltage
10-Lead MINI_SO_EP 12 V 16-Lead LFCSP_VQ ±6V
Power Dissipation (T
JMAX
− TA)/θ
JA
Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering 10 sec) 300°C Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is specified for device soldered in circuit board for surface-mount packages.
Table 3.
Package Type θJA Unit
10-Lead MINI_SO_EP 44 °C/W 16-Lead LFCSP_VQ 63 °C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4310-1 is limited by the associated rise in junction temperature (T
) on
J
the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit can change the stresses that the package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a junction temperature of 150°C for an extended period can result in changes in silicon devices, potentially causing degradation or loss of functionality.
Figure 4 shows the maximum safe power dissipation in the package vs. the ambient temperature for the 10-lead MINI_SO_EP (44°C/W) and for the 16-lead LFCSP_VQ (63°C/W) on a JEDEC standard 4-layer board. θ
values are
JA
approximations.
5.0
4.5
4.0
3.5
3.0
2.5 LFCSP_VQ-16
2.0
1.5
1.0
MAXIMUM POW ER DISSIP ATION (W )
0.5
0
–35 –15 5 25 45 65 85
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
MINI_SO_E P-10
AMBIENT TEMPERATURE (°C)
06027-016

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 5 of 16
ADA4310-1
A
B

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

+V
NC
OUT A
–IN A
+IN A
S
1
2
3
4
5
NC = NO CONNECT
10
9
8
7
6
OUT B
–IN B
+IN B
PD1
PD0
06027-001
Figure 5. 10-Lead MSOP Pin Configuration
Table 4. 10-Lead MSOP Pin Function Description
Pin No. Mnemonic Description
1 +VS Positive Power Supply Input 2 NC No Connection 3 OUT A Amplifier A Output 4 −IN A Amplifier A Inverting Input 5 +IN A Amplifier A Noninverting Input 6 PD0 Power Dissipation Control 7 PD1 Power Dissipation Control 8 +IN B Amplifier B Noninverting Input 9 −IN B Amplifier B Inverting Input 10 OUT B Amplifier B Output 11 (Exposed
Paddle)
GND
Ground (Electrical Connection Required)
S
OUT
OUT
NC
+V
14
13
16
15
1NC 2−IN A
3+IN A
4GND
NC = NO CONNECT
5
6
NC
NC
12 NC 11 IN B
10 +IN B
9PD1
8
7
S
–V
PD0
06027-002
Figure 6. 16-Lead LFCSP Pin Configuration
Table 5. 16-Lead LFCSP Pin Function Description
Pin No. Mnemonic Description
1, 5, 6, 12, 15 NC No Connection 2 −IN A Amplifier A Inverting Input 3 +IN A Amplifier A Noninverting Input 4 GND Ground 7 −VS Negative Power Supply Input 8 PD0 Power Dissipation Control 9 PD1 Power Dissipation Control 10 +IN B Amplifier B Noninverting Input 11 −IN B Amplifier B Inverting Input 13 OUT B Amplifier B Output 14 +VS Positive Power Supply Input 16 OUT A Amplifier A Output 17 (Exposed
GND Ground
Paddle)
Rev. 0 | Page 6 of 16
ADA4310-1

TYPICAL PERFORMANCE CHARACTERISTICS

12
V
= 100mV p-p
OUT
R
= 50
L
9
6
3
0
–3
–6
–9
NORMALIZED G AIN (d B)
–12
–15
–18
PD1, PD0 = 0, 0
1
G = +10
G = +20
10 100 1000
FREQUENCY (MHz)
G = +2
G = +5
Figure 7. Small Signal Frequency Response for Various Closed-Loop Gains
23
V
= 100mV p-p
OUT
G = +5
20
R
= 50
L
17
14
11
8
5
GAIN (dB)
2
–1
–4
–7
–10
1
PD1, PD0 = 0, 1
PD1, PD0 = 1, 0
10 100 1000
FREQUENCY (MHz)
PD1, PD0 = 0, 0
Figure 8. Small Signal Frequency Response for Various Modes
100000
10000
1000
100
MAGNITUDE (kΩ)
R
10
1
= 100
L
–45
–90
–135
–180
–225
06027-022
06027-021
PHASE (Degrees)
20
V
= 2V p-p
OUT
= 50
R
L
–30
G = +5
HARMONIC DISTO RTION (dBc)
–40
–50
–60
–70
–80
–90
–100
–110
–120
0.1
PD1, PD0 = 1, 0
PD1, PD0 = 0, 1
PD1, PD0 = 0, 0
1 10 100
FREQUENCY (MHz)
Figure 10. Harmonic Distortion vs. Frequency
100
10
VOLTAGE NOISE (nV/√Hz)
1
10 100 1k 10k 100k 1M 10M 100M 1G
FREQUENCY (Hz)
Figure 11. Voltage Noise vs. Frequency
0.20 G = +5
R
= 50
L
0.15
10ns/DIV
0.10
0.05
0
OUTPUT (V)
–0.05
–0.10
–0.15
HD2 HD3
06027-023
06027-012
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
FREQUENCY ( MHz)
Figure 9. Open-Loop Transimpedance Gain and Phase vs. Frequency
–270
–0.20
06027-013
06027-020
Figure 12. Small Signal Transient Response
Rev. 0 | Page 7 of 16
ADA4310-1
0
PD1, PD0 = (0, 0) R
= 100
L
–10
–20
–30
–40
40
PD1, PD0 = (1,1)
–60
–80
–50
COMMON-MO DE REJECTIO N (dB)
–60
–70
0.01 0. 1 1 10 100 1000
FREQUE NCY (MHz )
Figure 13. Common-Mode Rejection(CMR) vs. Frequency
0
G = +5 PD1, PD0 = (0, 0)
–10
= 100
R
L
–20
–30
–40
–50
–60
POWER SUPPLY REJECTI ON (dB)
–70
–80
0.01 0. 1 1 10 100 1000
+PSR
–PSR
FREQUE NCY (MHz )
Figure 14. Power Supply Rejection(PSR) vs. Frequency
100
PD1, PD0 = (0, 0)
10
FEEDTHROUG H (dB)
–100
–120
1 10 100 1000
6027-007
FREQUENCY (MHz )
06027-010
Figure 16. Off-Isolation vs. Frequency
1000
PD1, PD0 = (1,1)
100
10
1
0.1
OUTPUT IMPEDANCE (kΩ)
0.01
0.001
0.01 0. 1 1 10 100 1000
06027-006
FREQUENCY (MHz)
06027-008
Figure 17. Output Impedance vs. Frequency (Disabled)
2.5 10ns/DIV
V
2.0
1.5
OUT
V
, V
PD0
PD1
1
OUTPUT IMPEDANCE (Ω)
0.1
1.0
VOLTAGE (V)
0.5
0
0.01
0.1 1 10 100 1000
FREQUENCY (MHz )
Figure 15. Closed-Loop Output Impedance vs. Frequency
6027-009
–0.5
Figure 18. Power-Down Turn On/Turn Off
06027-011
Rev. 0 | Page 8 of 16
ADA4310-1
0
–20
–40
–60
–80
CROSSTAL K (dB)
–100
–120
0.1 1 10 100 1000
FREQUENCY (MHz)
06027-014
Figure 19. Crosstalk
Rev. 0 | Page 9 of 16
ADA4310-1

THEORY OF OPERATION

The ADA4310-1 is a current feedback amplifier with high output current capability. With a current feedback amplifier, the current into the inverting input is the feedback signal, and the open-loop behavior is that of a transimpedance, dV
/dIIN or TZ.
O
The open-loop transimpedance is analogous to the open-loop voltage gain of a voltage feedback amplifier. simplified model of a current feedback amplifier. Because R proportional to 1/g where g
is the transconductance of the input stage. Basic
m
, the equivalent voltage gain is just TZ × gm,
m
Figure 20 shows a
IN
is
analysis of the follower with gain circuit yields
()
V
O
×=
G
V
IN
Z
()
sT
Z
RRGsT
+×+
FIN
where:
R
F
G
R
IN
+= 1
R
G
501≈=
g
m
Because G × R
<< RF for low gains, a current feedback
IN
amplifier has relatively constant bandwidth vs. gain, the 3 dB point being set when |T
| = RF.
Z
Of course, for a real amplifier there are additional poles that contribute excess phase, and there is a value for R
below which
F
the amplifier is unstable. Tolerance for peaking and desired flatness determines the optimum R
R
G
R
N
V
IN
Figure 20. Simplified Block Diagram
in each application.
F
R
F
R
IN
T
Z
I
IN
V
OUT
06027-017
Rev. 0 | Page 10 of 16
ADA4310-1

APPLICATION INFORMATION

FEEDBACK RESISTOR SELECTION

The feedback resistor has a direct impact on the closed-loop bandwidth and stability of the current feedback op amp. Reducing the resistance below the recommended value can make the amplifier response peak and even become unstable. Increasing the size of the feedback resistor beyond the recom­mended value reduces the closed-loop bandwidth.
Tabl e 6 provides a convenient reference for quickly determining the feedback and gain resistor values, and the corresponding bandwidth, for common gain configurations. The recommended value of feedback resistor for the ADA4310-1 is 499 Ω.
Table 6. Recommended Values and Frequency Performance
Gain RF (Ω) RG (Ω) −3 dB SS BW (MHz)
+2 499 499 230 +5 499 124 190 +5 1k 249 125 +10 499 55.4 160 +20 499 26.1 115
1
Conditions: VS = ±6 V, TA = 25°C, RL = 50 Ω, PD1, PD0 = 0,0.

POWER CONTROL MODES OF OPERATION

The ADA4310-1 features four power modes: full power, ¾ power, ½ power, and shutdown. The power modes are controlled by two logic pins, PD0 and PD1. The power-down control pins are compatible with standard 3 V and 5 V CMOS logic.
Tabl e 7 shows the various power modes and associated logic states. In the power-down mode, the output of the amplifier goes into a high-impedance state.
Table 7. Power Modes
PD1 PD0 Power Mode
Total Supply Current (mA)
Output Impedance
Low Low Full Power 15.2 Low Low High ¾ Power 11.2 Low High Low ½ Power 7.8 Low High High Power Down 1.3 High

EXPOSED THERMAL PAD CONNECTIONS

The exposed thermal pad on the 10-lead MSOP package is both the reference for the PD pins and the only electrical connection for the negative supply voltage. Therefore, in the 10-lead MSOP package, the ADA4310-1 can only be used on a single supply. The exposed thermal pad MUST be connected to ground. Failure to do so will render the part inoperable.
1
A requirement for both packages is that the thermal pad be connected to a solid plane with low thermal resistance, ensuring adequate heat transfer away from the die and into the board.

POWER LINE APPLICATION

Applications (that is, powerline AV modems) requiring greater than 10 dBm peak power should consider using an external line driver, such as the ADA4310-1. interface between the TxDAC® output and ADA4310-1 biased for single-supply operation. The TxDAC’s peak-to-peak differ­ential output voltage swing should be limited to 2 V p-p, with the ADA4310-1’s gain configured to realize the additional voltage gain required by the application. A low-pass filter should be considered to filter the DAC images inherent in the signal reconstruction process. In addition, dc blocking capacitors are required to level-shift the TxDAC’s output signal to the common-mode level of the ADA4310-1 (that is, AVDD/2).
0.1µF
R
SET
O
I F E R
REFADJ
TxDAC
0dB T O –7.5dB
Figure 21. TxDAC Output Directly via Center-Tap Transformer
E L B A S
I D x T
IOUTP+
IOUTP–
Figure 21 shows an example
OPTIONAL
LCLPF
AVDD/2
1/2
ADA4310-1
1/2
ADA4310-1
06027-019
The 4 mm × 4 mm 16-lead LFCSP package has dedicated pins for both the positive and negative supplies, and it can be used in either single supply or dual supply applications. There is no electrical connection for the exposed thermal pad. Although the pad could theoretically be connected to any potential, it is still typically connected to ground.
Rev. 0 | Page 11 of 16
ADA4310-1

BOARD LAYOUT

As is the case with all high speed applications, careful attention to printed circuit board layout details prevents associated board parasitics from becoming problematic. Proper RF design technique is mandatory. The PCB should have a ground plane covering all unused portions of the component side of the board to provide a low impedance return path. Removing the ground plane on all layers from the area near the input and output pins reduces stray capacitance, particularly in the area of the inverting inputs. Signal lines connecting the feedback and gain resistors should be as short as possible to minimize the inductance and stray capacitance associated with these traces. Termination resistors and loads should be located as close as possible to their respective inputs and outputs. Input and output traces should be kept as far apart as possible to minimize coupling (crosstalk) though the board. Wherever there are complementary signals, a symmetrical layout should be provided to the extent possible to maximize balanced performance. When running differential signals over a long distance, the traces on the PCB should be close. This reduces the radiated energy and makes the circuit less susceptible to RF interference. Adherence to stripline design techniques for long signal traces (greater than about 1 inch) is recommended.

POWER SUPPLY BYPASSING

The ADA4310-1 operates on supplies, from +5 V to ±6 V. The ADA4310-1 circuit should be powered with a well-regulated power supply. Careful attention must be paid to decoupling the power supply. High quality capacitors with low equivalent series resistance (ESR), such as multilayer ceramic capacitors (MLCCs), should be used to minimize supply voltage ripple and power dissipation. In addition, 0.1 µF MLCC decoupling capacitors should be located no more than ⅛-inch away from each of the power supply pins. A large, usually tantalum, 10 µF capacitor is required to provide good decoupling for lower frequency signals and to supply current for fast, large signal changes at the ADA4310-1 outputs. Bypassing capacitors should be laid out in such a manner to keep return currents away from the inputs of the amplifiers. This minimizes any voltage drops that can develop due to ground currents flowing through the ground plane. A large ground plane also provides a low impedance path for the return currents.
For more information on high speed board layout, go to
www.analog.com and A Practical Guide to High-Speed Printed-
Circuit-Board Layout.
Rev. 0 | Page 12 of 16
ADA4310-1

OUTLINE DIMENSIONS

3.00 BSC
3.00 BSC
PIN 1
0.95
0.85
0.75
0.15
0.00
6
10
TOP
4.90 BSC
VIEW
1
5
1.10 MAX
SEATING PLANE
BOTTOM VIEW
0.23
0.08
0.50 BSC
0.33
0.17
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA-T
EXPOSED PAD
2.50
0.75
8° 0°
SQ
0.80
0.60
0.40
Figure 22. 10-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP]
(RH-10)
Dimensions shown in millimeters
PIN 1
INDICATOR
1.00
0.85
0.80
12° MAX
SEATING PLANE
4.00
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
0.35
0.30
0.25
3.75
BSC SQ
0.20 REF
0.60 MAX
0.65 BSC
0.05 MAX
0.02 NOM
COPLANARITY
0.75
0.60
0.50
0.08
0.60 MAX
(BOTTOM VIEW)
13
12
EXPOSED
9
8
PAD
16
5
1.95 BSC
PIN 1 INDICATOR
1
.
2
5
2
Q
S
0
1
.
2
5
9
.
1
4
0.25 MIN
COMPLIANT TO JEDEC STANDARDS MO-220-VG GC
010606-0
Figure 23. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-4)
Dimensions shown in millimeters

ORDERING GUIDE

Temperature
Model
Package
Package Description
ADA4310-1ARHZ-RL1 −40°C to +85°C 10-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] RH-10 0L ADA4310-1ARHZ-R71 −40°C to +85°C 10-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] RH-10 0L ADA4310-1ARHZ1 −40°C to +85°C 10-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] RH-10 0L ADA4310-1ACPZ-RL1 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4 ADA4310-1ACPZ-R21 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4 ADA4310-1ACPZ-R71 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4
1
Z = Pb-free part.
Rev. 0 | Page 13 of 16
Package Option
Branding
ADA4310-1
NOTES
Rev. 0 | Page 14 of 16
ADA4310-1
NOTES
Rev. 0 | Page 15 of 16
ADA4310-1
NOTES
©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06027-0-10/06(0)
Rev. 0 | Page 16 of 16
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