Analog Devices AD9975 Datasheet

Broadband Modem
a
FEATURES Low Cost, 3.3 V-CMOS, Mixed Signal, Front End
Converter for Broadband Modems
10-Bit D/A Converter (TxDAC+
50 MSPS Input Word Rate 2 Interpolating Low-Pass Transmit Filter 100 MSPS DAC Output Update Rate Wide (21 MHz) Transmit Bandwidth Power-Down Modes
10-Bit, 50 MSPS A/D Converter
Fourth Order LPF with Selectable Cutoff Frequency
Dual Mode Programmable Gain Amplifier Internal Clock Multiplier (PLL) Two Auxiliary Clock Outputs 48-Lead LQFP Package
APPLICATIONS Powerline Networking Home Phone Networking
®
)
TXEN
RXEN
TXCLK
RXCLK
ADIO[9:0]
AGC [2:0]
SPORT
Mixed-Signal Front End
AD9975

FUNCTIONAL BLOCK DIAGRAM

AD9975
10 10
10
3
3
REGISTER
CONTROL
ADC
K
CLK-GEN
PGA
LPF
TxDAC+
PGA
TX+
TX–
CLK1
CLK2
OSCIN
XTAL
RX+
RX–

GENERAL DESCRIPTION

The AD9975 is a single-supply, broadband modem, mixed signal, front end (MxFE™) IC. The device contains a transmit path interpolation filter and DAC and a receive path PGA, LPF, and ADC required for a variety of broadband modem applications. Also on-chip is a PLL clock multiplier that pro­vides all required clocks from a single crystal or clock input.
The TxDAC+ uses a digital 2× interpolation low-pass filter to oversample the transmit data and ease the complexity of analog reconstruction filtering. The transmit path bandwidth is 21 MHz when sampled at 100 MSPS. The 10-bit DAC provides differen­tial current outputs. The DAC full-scale current can be adjusted from 2 to 20 mA by a single resistor, providing 20 dB of additional gain range.
The receive path consists of a PGA, LPF, and ADC. The program­mable gain amplifier (PGA) has two modes of operation. One mode allows programming through the serial port and provides a gain range from –6 dB to +36 dB in 2 dB steps. The other mode allows the gain to be controlled through an asynchronous 3-pin port and offers a gain range from 0 dB to 48 dB in 8 dB steps with the use of an external gain stage. The receive path LPF cutoff frequency can be selected to either 12 MHz or 26 MHz.
TxDAC+ is a registered trademark and MxFE is a trademark of Analog Devices, Inc.
The filter cutoff frequency can also be tuned or bypassed where filter requirements differ. The 10-bit ADC uses a multistage differential pipeline architecture to achieve excellent dynamic performance with low power consumption.
The digital transmit and receive ports are multiplexed onto a 10-bit databus and have individual TX/RX clocks and TX/RX enable lines. This interface connects directly to Homelug 1.0 PHY/MAC chips from Intellon and Conexant.
The AD9975 is available in a space-saving 48-lead LQFP pack­age. The device is specified over the commercial (–40°C to +85°C) temperature range.
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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2002
AD9975–SPECIFICATIONS
(VS = 3.3 V 10%, F R
= 4.02 k, 100 DAC Load.)
SET
= 50 MHz, F
OSCIN
= 100 MHz, Gain = –6 dB,
DAC
Test
Parameter Temp Level Min Typ Max Unit
OSC IN CHARACTERISTICS
Frequency Range Full I 10 50 MHz Duty Cycle 25°CII 40 50 60 % Input Capacitance 25°C III 3 pF Input Impedance 25°C III 100 MΩ
CLOCK OUTPUT CHARACTERISTICS
CLKA Jitter (F
Derived from PLL) 25°CII 14 ps rms
CLKA
CLKA Duty Cycle 25°C III 50 ± 5%
TX CHARACTERISTICS
2× Interpolation Filter Characteristics
TX Path Latency, 2× Interpolation Full II 30 F
DAC
Cycles Pass-Band Flatness 0 MHz to 20.7 MHz Full II 0.8 dB Stop-Band Rejection @ 29.3 MHz Full II 35 dB
TxDAC
Resolution Full II 10 Bits Conversion Rate Full II 10 100 MHz Full-Scale Output Current Full II 2 10 20 mA Voltage Compliance Range (TX+ or TX– AVSS) Full II –0.5 +1.5 V Gain Error 25°CII –5.5 ±2+5.0 %FS Output Offset 25°CII 0 2 TBD µA Differential Nonlinearity 25°C III 0.5 LSB Integral Nonlinearity 25°CII 1 LSB Output Capacitance 25°C III 5 pF Phase Noise @ 1 kHz Offset, 10 MHz Signal 25°C III –100 dBc/Hz Signal-to-Noise and Distortion (SINAD)
5 MHz Analog Out (20 MHz BW) 25°CII –60.6 dB
Wideband SFDR (to Nyquist, 50 MHz max) 25°C III
5 MHz Analog Out 25°C III –76.2 dBc
Narrowband SFDR (3 MHz Window)
5 MHz Analog Out 25°C III –77.9 dBc IMD (f1 = 6.25 MHz, f2 = 7.8125 MHz) 25°C III –77 dBFS
RX PATH CHARACTERISTICS (LFP Bypassed)
Resolution N/A N/A 10 Bits Conversion Rate Full II 10 50 MHz Pipeline Delay, ADC Clock Cycles N/A N/A 5.5 Cycles Dynamic Performance (A
@ F
= 50 MHz, RX LPF Bypassed
OSCIN
= –0.5 dBFS, f = 5 MHz)
IN
Signal-to-Noise and Distortion Ratio (SINAD) Full III –56.6 dB Effective Number of Bits (ENOB) Full III 9.1 Bits Signal-to-Noise Ratio (SNR) Full III –59.2 dB Total Harmonic Distortion (THD) Full III –60.1 dB Spurious-Free Dynamic Range (SFDR) Full III –66 dB
RX PATH GAIN/OFFSET
Minimum Programmable Gain 25°CI 6 dB Maximum Programmable Gain
Narrow Band Rx LPF or Rx LPF Bypassed 25°CI +36 dB
Wideband Rx LPF
25°CI +30 dB Gain Step Size 25°CI 2 dB Gain Step Accuracy 25°CII ± 0.4 dB Gain Range Error Full II ± 1.0 dB Absolute Gain Error, PGA Gain = 0 dB Full II ± 0.8 dB
RX PATH INPUT CHARACTERISTICS
Input Voltage Range (Gain = –6 dB) Full III 4 Vppd Input Capacitance 25°C III 4 pF Differential Input Resistance 25°C III 270 Input Bandwidth (–3 dB) (Rx LPF Bypassed) 25°C III 50 MHz Input Referred Noise (at +36 dB Gain with Filter) 25ºC III 16 µV rms Input Referred Noise (at –6 dB Gain with Filter) 25ºC III 684 µV rms Common-Mode Rejection 25ºC III 40 dB
REV. 0–2–
AD9975
Test
Parameter Temp Level Min Typ Max Unit
RX PATH LPF (Low Cutoff Frequency)
Cutoff Frequency Full III 12 MHz Cutoff Frequency Variation Full III ± 7% Attenuation @ 22 MHz Full III 20 dB Pass-Band Ripple Full II ± 1.0 dB Group Delay Variation Full II 30 ns Settling Time (to 1% FS, Min to Max Gain Change) 25°CII 150 ns Total Harmonic Distortion at Max Gain (THD) Full I –61 dBc
RX PATH LPF (High Cutoff Frequency)
Cutoff Frequency Full III 26 MHz Cutoff Frequency Variation Full III ± 7% Attenuation @ 35 MHz Full III 20 dB Pass-Band Ripple Full II ± 1.2 dB Group Delay Variation Full II 15 ns Settling Time (to 1% FS, Min to Max Gain Change) 25°CII 80 ns Total Harmonic Distortion at Max Gain (THD) Full I –61 dBc
RX PATH DIGITAL HPF
Latency (ADC Clock Source Cycles) 1 Cycle Roll-Off in Stop Band 6 dB/Octave –3 dB Frequency f
POWER-DOWN/DISABLE TIMING
Power-Down Delay (Active-to-Power-Down)
DAC 25°CII 200 ns Interpolator 25°CII 200 ns
Power-Up Delay (Power-Down-to-Active)
DAC 25°CII 10 µs PLL 25°CII 10 µs ADC 25°CII 1000 µs PGA 25°CII 1 µs LPF 25°CII 1 µs Interpolator 25°CII 200 ns
Minimum RESET Pulsewidth Low (tRL) Full III 5 f
ADIO PORT INTERFACE
Maximum Input Word Rate 25°CI 100 MHz TX-Data Setup Time (t TX-Hold Hold Time (t RX-Data Valid Time(t
)25°CII 3.0 ns
SU
)25°CII 0 ns
HD
)25°CII 3.0 ns
VT
RX-Data Hold Time (tHT)25°CII 1.5 ns
/400 Hz
ADC
OSCIN
Cycles
REV. 0
–3–
AD9975
SPECIFICATIONS
(continued)
Test
Parameter Temp Level Min Typ Max Unit
SERIAL CONTROL BUS
Maximum SCLK Frequency (f Clock Pulsewidth High (t Clock Pulsewidth Low (t
PWH
PWL
) Full II 25 MHz
SCLK
) Full II 18 ns
) Full II 18 ns Clock Rise/Fall Time Full II 10 µs Data/Chip-Select Setup Time (t
) Full II 25 ns
DS
Data Hold Time (tDH) Full II 0 ns Data Valid Time (tDV) Full II 20 ns
CMOS LOGIC INPUTS
Logic “1” Voltage 25°CII
V
– 0.7 V
DRVDD
Logic “0” Voltage 25°CII 0.4 V Logic “1” Current 25°CII 12 µA Logic “0” Current 25°CII 12 µA Input Capacitance 25°C III 3 pF
CMOS LOGIC OUTPUTS (1 mA Load)
Logic “1” Voltage Full II
V
– 0.6 V
DRVDD
Logic “0” Voltage 25°CII 0.4 V Digital Output Rise/Fall Time Full II 1.5 2.5 ns
POWER SUPPLY
All Blocks Powered Up
I Digital Supply Current (I Clock Supply Current (I Analog Supply Current (I
(Total Supply Current) 25°CI 210 227 mA
S_TOTAL
+ I
DRVDD
)25°C III 5.5 mA
CLKVDD
)25°C III 182 mA
AVDD
)25°C III 22.5 mA
DVDD
Power Consumption of Functional Blocks
Rx LPF 25°C III 110 mA ADC and SPGA 25°C III 55 mA Rx Reference 25°C III 2 mA Interpolator 25°C III 20 mA DAC 25°C III 18 mA PLL-A 25°C III 22
All Blocks Powered Down
I Digital Supply Current (I Clock Supply Current (I Analog Supply Current (I
Specifications subject to change without notice.
(Total Supply Current) 25°CI 21 27 mA
S_TOTAL
+ I
DRVDD
)25°C III 0 mA
CLKVDD
)25°C III 11 mA
AVDD
)25°C III 10 mA
DVDD

ABSOLUTE MAXIMUM RATINGS*

Power Supply (VS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.9 V
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 5 mA
Digital Inputs . . . . . . . . . . . . . . . . –0.3 V to DRVDD + 0.3 V
Analog Inputs . . . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
Operating Temperature . . . . . . . . . . . . . . . . . . –40°C to +85°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . . . 300°C
*Absolute Maximum Ratings are limiting values to be applied individually and
beyond which the serviceability of the circuit may be impaired. Functional operability under any of these conditions is not necessarily implied. Exposure to absolute maximum rating conditions for extended periods of time may affect device reliability.

EXPLANATION OF TEST LEVELS

I. Devices are 100% production tested at 25°C and guaranteed
by design and characterization testing for the commercial operating temperature range (–40°C to +85°C).
II. Parameter is guaranteed by design and/or characterization
testing.
III. Parameter is a typical value only.
THERMAL CHARACTERISTICS Thermal Resistance
48-Lead LQFP
= 57ºC/W
θ
JA
= 28ºC/W
θ
JC
REV. 0–4–
WARNING!
ESD SENSITIVE DEVICE

ORDERING GUIDE

Model Temperature Range Package Description Package Option
AD9975ABST –40ºC to +85ºC 48-Lead LQFP ST-48 AD9975ABSTEB –40ºC to +85ºC AD9975 EVAL Board AD9975ABSTRL –40ºC to +85ºC AD9975ABST Reel
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD9975 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
AD9975

PIN FUNCTION DESCRIPTION

Pin No. Mnemonic Function
1OSC IN Crystal Oscillator Inverter Input 2 SENABLE Serial Bus Enable Input 3 SCLK Serial Bus Clock Input 4 SDATA Serial Bus Data I/O 5, 38, 47 AVDD Analog 3.3 V Power Supply 6, 9, 39, 42, AVSS Analog Ground
43, 46 7Tx+ Transmit DAC + Output 8 Tx– Transmit DAC – Output 10 FS ADJ DAC Full-Scale Output Current
Adjust with External Resistor 11 REFIO DAC Band Gap Decoupling Node 12 CLKVDD Power Supply for CLKOUT1 13 DVSS Digital Ground 14 DVDD Digital 3.3 V Power Supply 15–17 AGC[2:0] AGC Control Inputs 18 CLKOUT1 Auxiliary Clock Output 19–28 ADIO[9:0] Digital Data I/O Port 29 RXEN ADIO Direction Control Input 30 TXEN TX Path Enable 31 TXCLK ADIO Sample Clock Input 32 RXCLK ADIO Request Clock Input 33 CLKOUT2 Auxiliary Clock Output 34 RXBOOST/ External Gain Control Output/
SDO Serial Data Output 35 DRVDD Digital I/O 3.3 V Power Supply 36 DRVSS Digital I/O Ground 37 RESET Reset Input 40, 41 REFB, REFT ADC Reference Decoupling Node 44 Rx+ Receive Path + Input 45 Rx– Receive Path – Input 48 XTAL Crystal Oscillator Inverter Output
OSC IN
SENABLE
SCLK
SDATA
AV DD
AVSS
TX+
TX–
AVSS
FS ADJ
REFIO
CLKVDD

PIN CONFIGURATION

XTAL47AV DD46AVSS45RX–44RX+43AVSS42AVSS41REFT40REFB39AVSS38AV DD37RESET
48
1
2
3
4
5
6
7
8
9
10
11
12
13
14
DVSS
DVD D
AD9975
48-PIN LQFP
TOP VIEW
(Not to Scale)
15
AGC216AGC117AGC0
18
19
ADIO920ADIO821ADIO722ADIO623ADIO524ADIO4
CLKOUT1
36
DRVSS
35
DRVDD
34
RXBOOST/SDO
33
CLKOUT2
32
RXCLK
31
TXCLK
30
TXEN
29
RXEN
28
ADIO0
27
ADIO1
26
ADIO2
25
ADIO3
REV. 0
–5–
AD9975
DEFINITIONS OF SPECIFICATIONS Clock Jitter
The clock jitter is a measure of the intrinsic jitter of the PLL generated clocks. It is a measure of the jitter from one rising edge of the clock with respect to another edge of the clock nine cycles later.
Differential Nonlinearity Error (DNL, No Missing Codes)
An ideal converter exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. Guaranteed no missing codes to 10-bit resolution indicate that all 1024 codes, respectively, must be present over all operating ranges.

Integral Nonlinearity Error (INL)

Linearity error refers to the deviation of each individual code from a line drawn from “negative full scale” through “positive full scale.” The point used as negative full scale occurs 1/2 LSB before the first code transition. Positive full scale is defined as a level 1 1/2 LSB beyond the last code transition. The deviation is measured from the middle of each particular code to the true straight line.

Phase Noise

Single-sideband phase noise power density is specified relative to the carrier (dBc/Hz) at a given frequency offset (1 kHz) from the carrier. Phase noise can be measured directly on a generated single tone with a spectrum analyzer that supports noise marker measurements. It detects the relative power between the carrier and the offset (1 kHz) sideband noise and takes the resolution bandwidth (rbw) into account by subtracting 10 log(rbw). It also adds a correction factor that compensates for the implementation of the resolution bandwidth, log display, and detector characteristic.

Output Compliance Range

The range of allowable voltage at the output of a current-output DAC. Operation beyond the maximum compliance limits may cause either output stage saturation, resulting in nonlinear per­formance, or breakdown.

Spurious-Free Dynamic Range (SFDR)

The difference, in dB, between the rms amplitude of the DAC’s output signal (or ADC’s input signal) and the peak spurious signal over the specified bandwidth (Nyquist bandwidth, unless otherwise noted).

Pipeline Delay (Latency)

The number of clock cycles between conversion initiation and the associated output data being made available.

Offset Error

First transition should occur for an analog value 1/2 LSB above negative full scale. Offset error is defined as the deviation of the actual transition from that point.

Gain Error

The first code transition should occur at an analog value 1/2 LSB above negative full scale. The last transition should occur for an analog value 1 1/2 LSB below the nominal full scale. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference between first and last code transitions.

Input Referred Noise

The rms output noise is measured using histogram techniques. The ADC output code’s standard deviation is calculated in LSB and converted to an equivalent voltage. This results in a noise figure that can directly be referred to the RX input of the AD9975.

Signal-to-Noise and Distortion Ratio (SINAD)

SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in decibels.

Effective Number of Bits (ENOB)

For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula,
N SINAD dB= (–.)/.176 602
it is possible to get a measure of performance expressed as N, the effective number of bits.

Signal-to-Noise Ratio (SNR)

SNR is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding harmonics and dc. The value for SNR is expressed in decibels.

Total Harmonic Distortion (THD)

THD is the ratio of the rms sum of the first six harmonic com­ponents to the rms value of the measured input signal and is expressed as a percentage or in decibels.

Power Supply Rejection

Power supply rejection specifies the converter’s maximum full-scale change when the supplies are varied from nominal to minimum and maximum specified voltages.
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