ANALOG DEVICES AD9239 Service Manual

Quad, 12-Bit, 170 MSPS/210 MSPS/250 MSPS
A
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FEATURES

4 ADCs in 1 package Coded serial digital outputs with ECC per channel On-chip temperature sensor
−95 dB channel-to-channel crosstalk SNR = 65 dBFS with AIN = 85 MHz at 250 MSPS SFDR = 77 dBc with AIN = 85 MHz at 250 MSPS Excellent linearity
DNL = ±0.3 LSB (typical)
INL = ±0.7 LSB (typical) 780 MHz full power analog bandwidth Power dissipation = 380 mW per channel at 250 MSPS
1.25 V p-p input voltage range, adjustable up to 1.5 V p-p
1.8 V supply operation Clock duty cycle stabilizer Serial port interface features
Power-down modes
Digital test pattern enable
Programmable header
Programmable pin functions (PGMx, PDWN)

APPLICATIONS

Communication receivers Cable head end equipment/M-CMTS Broadband radios Wireless infrastructure transceivers Radar/military-aerospace subsystems Test equipment
Serial Output 1.8 V ADC
AD9239

FUNCTIONAL BLOCK DIAGRAM

VDD PDWN DRVDD DRGND
AD9239
VIN + A DOUT + A
VIN – A
VCM A
VIN + B
VIN – B
VCM B
VIN + C DOUT + C
VIN – C
VCM C
VIN + D
VIN – D
VCM D
RBIAS
TEMPOUT
BUF
BUF
BUF
BUF
REFERENCE
SCLK SDI/
SHA
SHA
SHA
SHA
SDIO
PIPELINE
PIPELINE
PIPELINE
PIPELINE
SERIAL
PORT
ADC
ADC
ADC
ADC
SDO CSB
Figure 1.
12
12
12
12
DATA RATE MULTIPLIER
CLK+ CLK–
CML DRIVERS
DATA SERIALIZE R, ENCODER, AND
CHANNEL A
CHANNEL B
CHANNEL C
CHANNEL D
DOUT – A
DOUT + B
DOUT – B
DOUT – C
DOUT + D
DOUT – D
PGM3
PGM2
PGM1
PGM0
RESET
06980-001

GENERAL DESCRIPTION

The AD9239 is a quad, 12-bit, 250 MSPS analog-to-digital converter (ADC) with an on-chip temperature sensor and a high speed serial interface. It is designed to support digitizing high frequency, wide dynamic range signals with an input bandwidth up to 780 MHz. The output data are serialized and presented in packet format, consisting of channel-specific information, coded samples, and error correction code.
The ADC requires a single 1.8 V power supply and the input clock may be driven differentially with a sine wave, LVPECL, TTL, or LVDS. A clock duty cycle stabilizer allows high performance at full speed with a wide range of clock duty cycles. The on-chip reference eliminates the need for external decoupling and can be adjusted by means of SPI control.
Various power-down and standby modes are supported. The ADC typically consumes 145 mW per channel with the digital link still in operation when standby operation is enabled.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
Fabricated on an advanced CMOS process, the AD9239 is avail­able in a Pb-free/RoHS-compliant, 72-lead LFCSP package. It is specified over the industrial temperature range of −40°C to +85°C.

PRODUCT HIGHLIGHTS

1. Four ADCs are contained in a small, space-saving package.
2. An on-chip PLL allows users to provide a single ADC
sampling clock, and the PLL distributes and multiplies up to produce the corresponding data rate clock.
3. Coded data rate supports up to 4.0 Gbps per channel.
Coding includes scrambling to ensure proper dc common mode, embedded clock, and error correction.
4. The AD9239 operates from a single 1.8 V power supply.
5. Flexible synchronization schemes and programmable
mode pins.
6. On-chip temperature sensor.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved.
AD9239
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TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
AC Specifications .......................................................................... 4
Digital Specifications ................................................................... 5
Switching Specifications .............................................................. 6
Timing Diagram ........................................................................... 7
Absolute Maximum Ratings ............................................................ 8
Thermal Resistance ...................................................................... 8
ESD Caution .................................................................................. 8
Pin Configuration and Function Description .............................. 9
Typical Performance Characteristics ........................................... 11
Equivalent Circuits ......................................................................... 17
Theory of Operation ...................................................................... 19
Analog Input Considerations ................................................... 19
Clock Input Considerations ...................................................... 21
Serial Port Interface (SPI) .............................................................. 31
Hardware Interface ..................................................................... 31
Memory Map .................................................................................. 33
Reading the Memory Map Table .............................................. 33
Reserved Locations .................................................................... 33
Default Values ............................................................................. 33
Logic Levels ................................................................................. 33
Outline Dimensions ....................................................................... 38
Ordering Guide .......................................................................... 38

REVISION HISTORY

10/08—Revision 0: Initial Version
Rev. 0 | Page 2 of 40
AD9239
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SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T otherwise noted.
Table 1.
AD9239BCPZ-170 AD9239BCPZ-210 AD9239BCPZ-250 Parameter
1
Temp Min Typ Max Min Typ Max Min Typ Max Unit
RESOLUTION 12 12 Bits ACCURACY
No Missing Codes Full Guaranteed Guaranteed Guaranteed
Offset Error 25°C −2 ±12 −2 ±12 −2 ±12 mV
Offset Matching 25°C 4 12 4 12 4 12 mV
Gain Error 25°C −2.8 +1 +4.7 −2.8 +1 +4.7 −2.8 +1 +4.7 % FS
Gain Matching 25°C 0.9 2.7 0.9 2.7 0.9 2.7 % FS
Differential Nonlinearity (DNL) Full ±0.28 ±0.6 ±0.28 ±0.6 ±0.3 ±0.6 LSB
Integral Nonlinearity (INL) Full ±0.45 ±0.9 ±0.7 ±1.3 ±0.7 ±1.3 LSB
ANALOG INPUTS
Differential Input Voltage Range
Common-Mode Voltage Full 1.4 1.4 1.4 V
Input Capacitance 25°C 2 2 2 pF
Input Resistance Full 4.3 4.3
Analog Bandwidth, Full Power Full 780 780 780 MHz
Voltage Common Mode (VCMx)
Voltage Output Full 1.4 1.44 1.5 1.4 1.44 1.5 1.4 1.44 1.5 V
Current Drive Full 1 1 1 mA
Temperature Sensor Output −1.12 −1.12 −1.12 mV/°C
Voltage Output Full 739 737 734 mV
Current Drive Full 10 10 10 µA
POWER SUPPLY
AVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
DRVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
I
Full 535 570 610 650 725 775 mA
AVDD
I
Full 98 105 111 120 123 133 mA
DRVDD
Total Power Dissipation
(Including Output Drivers) Power-Down Dissipation Full 3 3 3 mW Standby Dissipation
2
Full 152 173 195 mW
CROSSTALK Full −95 −95 −95 dB
Overrange Condition
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and details on how these tests were completed.
2
AVDD/DRVDD, with link established.
3
Overrange condition is specified with 6 dB above the full-scale input range.
3
Full −90 −90 −90 dB
= −40°C, T
MIN
2
Full 1.25 1.25 1.25 V p-p
= +85°C, 1.25 V p-p differential input, AIN = −1.0 dBFS, DCS enabled, unless
MAX
4.3
kΩ
Full 1.139 1.215 1.298 1.386 1.526 1.634 W
Rev. 0 | Page 3 of 40
AD9239
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AC SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T otherwise noted.
Table 2.
AD9239BCPZ-170 AD9239BCPZ-210 AD9239BCPZ-250 Parameter
1
Temp Min Typ Max Min Typ Max Min Typ Max Unit
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 9.7 MHz 25°C 64.5 dB fIN = 84.3 MHz Full 63.5 64.5 63.2 64.2 63.1 64.1 dB fIN = 170.3 MHz 25°C 63.9 dB fIN = 240.3 MHz 25°C 64.1 63.2 63.3 dB
SIGNAL-TO-NOISE RATIO (SINAD)
fIN = 9.7 MHz 25°C 64.2 dB fIN = 84.3 MHz Full 63.3 64.4 62.8 63.9 62.8 63.8 dB fIN = 170.3 MHz 25°C 63.1 dB fIN = 240.3 MHz 25°C 63.9 63 63.1 dB
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 9.7 MHz 25°C 10.4 Bits fIN = 84.3 MHz Full 10.2 10.4 10.1 10.3
fIN = 170.3 MHz 25°C 10.2 Bits fIN = 240.3 MHz 25°C 10.3 10.2 10.2 Bits
WORST HARMONIC (SECOND)
fIN = 9.7 MHz 25°C 90 dBc fIN = 84.3 MHz Full 87.5 78.6 86 77 86 74.5 dBc fIN = 170.3 MHz 25°C 76 dBc fIN = 240.3 MHz 25°C 82 80 82 dBc
WORST HARMONIC (THIRD)
fIN = 9.7 MHz 25°C 78 dBc fIN = 84.3 MHz Full 79 74 76 72.6 76 72.5 dBc fIN = 170.3 MHz 25°C 74 dBc fIN = 240.3 MHz 25°C 84 77 80 dBc
WORST OTHER (EXCLUDING SECOND OR THIRD)
fIN = 9.7 MHz 25°C 85 dBc fIN = 84.3 MHz Full 96 86 90 83.7 94 83.6 dBc fIN = 170.3 MHz 25°C 85 dBc fIN = 240.3 MHz 25°C 88 88 85 dBc
TWO-TONE INTERMOD DISTORTION (IMD)
f
= 140.2 MHz, f
IN1
= 141.3 MHz,
IN2
AIN1 and AIN2 = −7.0 dBFS
f
= 170.2 MHz, f
IN1
= 171.3 MHz,
IN2
AIN1 and AIN2 = −7.0 dBFS
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and details on how these tests were completed.
2
Tested at 210 MSPS and 250 MSPS only.
MIN
2
= −40°C, T
= +85°C, 1.25 V p-p differential input, AIN = −1.0 dBFS, DCS enabled, unless
MAX
10.1
10.3 Bits
4
25°C 78 77 76 dBc
25°C 77 76 dBc
Rev. 0 | Page 4 of 40
AD9239
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DIGITAL SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T otherwise noted.
Table 3.
AD9239BCPZ-170 AD9239BCPZ-210 AD9239BCPZ-250 Parameter
CLOCK INPUTS (CLK+, CLK–)
LOGIC INPUTS (PDWN, CSB, SDI/
LOGIC OUTPUTS (SDO)
DIGITAL OUTPUTS
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and details on how these tests were completed.
2
Specified for 13 SDI/SDIO pins sharing the same connection.
1
Logic Compliance Full LVPECL/LVDS/CMOS LVPECL/LVDS/CMOS LVPECL/LVDS/CMOS Differential Input Voltage Full 0.2 6 0.2 6 0.2 6 V p-p Input Voltage Range Full AVDD −
Internal Common-Mode Bias Full 1.2 1.2 1.2 V Input Common-Mode Voltage Full 1.1 AVDD 1.1 AVDD 1.1 AVDD V High Level Input Voltage (VIH) Full 1.2 3.6 1.2 3.6 1.2 3.6 V Low Level Input Voltage (VIL) Full 0 0.8 0 0.8 0 0.8 V High Level Input Current (IIH) Full −10 +10 −10 +10 −10 +10 µA Low Level Input Current (IIL) Full −10 +10 −10 +10 −10 +10 µA Differential Input Resistance 25°C 16 20 24 16 20 24 16 20 24 kΩ Input Capacitance 25°C 4 4 4 pF
2
SDIO, SCLK, RESET, PGMx) Logic 1 Voltage Full 0.8 ×
Logic 0 Voltage Full 0.2 ×
Logic 1 Input Current (CSB) Full 0 0 0 µA Logic 0 Input Current (CSB) Full −60 −60 −60 µA Logic 1 Input Current
(SCLK, PDWN, SDI/SDIO,
RESET, PGMx) Logic 0 Input Current
(SCLK, PDWN, SDI/SDIO,
RESET, PGMx) Input Resistance 25°C 30 30 30 kΩ Input Capacitance 25°C 4 4 4 pF
Logic 1 Voltage Full 1.2 AVDD +
Logic 0 Voltage Full 0 0.3 0 0.3 0 0.3 V
(DOUT + x, DOUT − x) Logic Compliance Current
Differential Output Voltage Full 0.8 0.8 0.8 V Common-Mode Level Full DRVDD/2 DRVDD/2 DRVDD/2 V
= −40°C, T
MIN
Temp Min Typ Max Min Typ Max Min Typ Max Unit
0.3
AVDD
Full 55 55 55 µA
Full 0 0 0 µA
= +85°C, 1.25 V p-p differential input, AIN = −1.0 dBFS, DCS enabled, unless
MAX
AVDD +
1.6
0.8 ×
AVDD
0.3
Current mode logic
AVDD −
0.3
AVDD
0.2 ×
1.2 AVDD +
AVDD +
1.6
0.8 ×
AVDD
0.3
Current mode logic
AVDD −
0.3
AVDD
0.2 ×
1.2 AVDD +
AVDD +
V
mode logic
1.6
V
V
AVDD
V
0.3
Rev. 0 | Page 5 of 40
AD9239
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SWITCHING SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T otherwise noted.
Table 4.
AD9239BCPZ-170 AD9239BCPZ-210 AD9239BCPZ-250 Parameter
CLOCK
DATA OUTPUT PARAMETERS
TERMINATION CHARACTERISTICS
APERTURE
OUT-OF-RANGE RECOVERY TIME 25°C 1 1 1 CLK cycles
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and details on how these tests were completed.
2
Receiver dependent.
3
See the section. Digital Start-Up Sequence
1
Clock Rate Full 170 100 210 100 250 100 MSPS Clock Pulse Width High (tEH) Full 2.65 2.9 2.15 2.4 1.8 2.0 ns Clock Pulse Width Low (tEL) Full 2.65 2.9 2.15 2.4 1.8 2.0 ns
Data Output Period or UI
(DOUT + x, DOUT − x) Data Output Duty Cycle 25°C 50 50 50 % Data Valid Time 25°C 0.8 0.8 0.8 UI PLL Lock Time (t Wake-Up Time (Standby) 25°C 250 250 250 ns Wake-Up Time (Power-Down) Pipeline Latency Full 40 40 40 CLK cycles Data Rate per Channel (NRZ) 25°C 2.72 3.36 4.0 Gbps Deterministic Jitter 25°C 10 10 10 ps max Random Jitter 25°C 6 6 6 ps rms Channel-to-Channel Bit Skew 25°C 0 0 0 sec Channel-to-Channel Packet Skew Output Rise/Fall Time 25°C 50 50 50 ps
Differential Termination Resistance 25°C 100 100 100
Aperture Delay (tA) 25°C 1.2 1.2 1.2 ns Aperture Uncertainty (Jitter) 25°C 0.2 0.2 0.2 ps rms
) 25°C 4 4 4 µs
LOCK
2
= −40°C, T
MIN
Temp Min Typ Max Min Typ Max Min Typ Max Unit
Full 1/(16 × f
25°C 50 50 50 s
3
25°C +1 +1 +1 CLK cycles
= +85°C, 1.25 V p-p differential input, AIN = –1.0 dBFS, DCS enabled, unless
MAX
) 1/(16 × f
CLK
) 1/(16 × f
CLK
) sec
CLK
Rev. 0 | Page 6 of 40
AD9239
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TIMING DIAGRAM

SAMPLE
N + 1
N
ANALOG
INPUT SIGNAL
RATE CLOCK
SAMPLE
N – 40
N – 39
N – 38
N – 37
SAMPLE
RATE CLOCK
SERIAL
DATA OUT
SERIAL CODED SAMPLES: N – 40, N – 39, N – 38, N – 37 ...
... ... ...
8-BIT HEADER
CHANNEL ID
Figure 2. Timing Diagram
...
DATA PACKET 1
(64 BITS)
48-BIT ADC
DATA-WORD
...
...... ...
8-BIT ERROR
CORRECTION
06980-002
Table 1. Packet Protocol
Bits[64:57] Bits[56:45] Bits[44:33] Bits[32:21] Bits[20:9] Bits[8:1]
Header Data 1 Data 2 Data 3 Data 4 ECC
(8 bits MSB first) (12 bits MSB first) (12 bits MSB first) (12 bits MSB first) (12 bits MSB first) (8 bits MSB first)
Rev. 0 | Page 7 of 40
AD9239
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ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V DRVDD to DRGND −0.3 V to +2.0 V AGND to DRGND −0.3 V to +0.3 V AVDD to DRVDD −2.0 V to +2.0 V DOUT ± x to DRGND −0.3 V to DRVDD + 0.3 V SDO, SDI/SDIO, CLK± , VIN ± x,
VCMx, TEMPOUT, RBIAS to AGND
SCLK, CSB, PGMx, RESET,
PDWN to AGND
Environmental
Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature
(Soldering 10 sec)
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
−0.3 V to AVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
300°C

THERMAL RESISTANCE

The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package.
Table 6. Thermal Resistance
Package Type θJA θJB θJC Unit
72-Lead LFCSP (CP-72-3) 16.2 7.9 0.6 °C/W
Typical θJA, θJB, and θJC values are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θ
. In addition, metal in direct contact with the package leads
JA
from metal traces and through holes, ground, and power planes reduces the θ
.
JA

ESD CAUTION

Rev. 0 | Page 8 of 40
AD9239
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PIN CONFIGURATION AND FUNCTION DESCRIPTION

NC
AVDD
VCM C
AVDD
VIN – C
VIN + C
AVDD
AVDD
AVDDNCAVDD
AVDD
AVDD
VIN + B
VIN – B
AVDD
VCM B
AVDD
NC
TEMPOUT
RBIAS
AVDD
NC NC
AVDD
VCM D
AVDD VIN – D VIN + D
AVDD
AVDD
AVDD
AVDD
CLK–
7271706968676665646362616059585756
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17CLK+ 18AVDD
PIN 1 INDICAT OR
PIN 0 = EPAD = AGND
AD9239
TOP VIEW
(Not to Scale)
55
54
NC
53
PGM0
52
PGM1
51
PGM2
50
PGM3
49
NC
48
AVDD
47
VCM A
46
AVDD
45
VIN – A
44
VIN + A
43
AVDD
42
AVDD
41
AVDD
40
CSB
39
SCLK
38
SDI/SDIO
37
SDO
192021222324252627282930313233
NC
AVDD
AVDD
RESET
DRVDD
DRGND
DOUT – D
DOUT – C
DOUT + D
DOUT + C
NOTES
1. NC = NO CONNECT .
2. THE EXPO SED PADDLE MUST BE SOLDERED T O THE GRO UND PLANE FOR THE L FCSP PACKAGE. SOLDERING THE EXPOSED PADDLE TO THE CUSTOMER BOARD INCREASES T HE RELIABIL ITY OF THE SOL DER JOINTS, MAXIMIZ ING THE THERMAL CAPABILITY O F THE PACKAGE.
DOUT + B
DOUT – B
34
35PDWN
36NC
DRVDD
DRGND
DOUT – A
DOUT + A
06980-004
Figure 3. Pin Configuration
Table 7. Pin Function Descriptions
Pin No. Mnemonic Description
0 AGND Analog Ground (Exposed Paddle). 23, 34 DRGND Digital Output Driver Ground. 4, 7, 9, 12, 13, 14,
AVDD 1.8 V Analog Supply. 15, 18, 20, 21, 41, 42, 43, 46, 48, 55, 57, 60, 61, 62, 64, 65, 66, 69, 71
24, 33 DRVDD 1.8 V Digital Output Driver Supply. 2 TEMPOUT Output Voltage to Monitor Temperature. 3 RBIAS External Resistor to Set the Internal ADC Core Bias Current. 8 VCM D Common-Mode Output Voltage Reference (0.5 × AVDD). 10 VIN − D ADC D Analog Complement. 11 VIN + D ADC D Analog True. 16 CLK− Input Clock Complement. 17 CLK+ Input Clock True. 22 RESET Digital Output Timing Reset. 25 DOUT + D ADC D True Digital Output. 26 DOUT − D ADC D Complement Digital Output. 27 DOUT + C ADC C True Digital Output. 28 DOUT − C ADC C Complement Digital Output. 29 DOUT + B ADC B True Digital Output. 30 DOUT − B ADC B Complement Digital Output. 31 DOUT + A ADC A True Digital Output. 32 DOUT − A ADC A Complement Digital Output. 35 PDWN Power-Down.
Rev. 0 | Page 9 of 40
AD9239
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Pin No. Mnemonic Description
37 SDO Serial Data Output. Used for 4-wire SPI interface. 38 SDI/SDIO Serial Data Input/Serial Data IO for 3-Wire SPI Interface. 39 SCLK Serial Clock. 40 CSB Chip Select Bar. 44 VIN + A ADC A Analog Input True. 45 VIN − A ADC A Analog Input Complement. 47 VCM A Common-Mode Output Voltage Reference (0.5 × AVDD). 50 PGM3 Optional Pin to be Programmed by Customer. 51 PGM2 Optional Pin to be Programmed by Customer. 52 PGM1 Optional Pin to be Programmed by Customer. 53 PGM0 Optional Pin to be Programmed by Customer. 56 VCM B Common-Mode Output Voltage Reference (0.5 × AVDD). 58 VIN − B ADC B Analog Input Complement. 59 VIN + B ADC B Analog Input True. 67 VIN + C ADC C Analog Input True. 68 VIN − C ADC C Analog Input Complement. 70 VCM C Common-Mode Output Voltage Reference (0.5 × AVDD). 1, 5, 6, 19, 36,
49, 54, 63, 72
NC No Connection.
Rev. 0 | Page 10 of 40
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TYPICAL PERFORMANCE CHARACTERISTICS

0
AIN = –1.0dBF S SNR = 64.88dB ENOB = 10.49 BI TS
–20
SFDR = 77.57d Bc
–20
0
AIN = –1.0dBFS SNR = 63.13dB ENOB = 10.19 BI TS SFDR = 76.07dBc
–40
–60
–80
AMPLITUDE (dBFS)
–100
–120
0 10 20304050607080
FREQUENCY (MHz)
Figure 4. Single-Tone 32k FFT with fIN = 84.3 MHz, f
0
AIN = –1.0dBF S SNR = 63.95dB ENOB = 10.33 BI TS
–20
SFDR = 78.90dBc
–40
–60
–80
AMPLITUDE (dBFS)
–100
= 170 MSPS
SAMPLE
–40
–60
–80
AMPLITUDE (dBFS)
–100
–120
020406080100
06980-059
Figure 7. Single-Tone 32k FFT with fIN = 240.3 MHz, f
0
–20
–40
–60
–80
AMPLITUDE (dBFS)
–100
FREQUENCY (MHz)
= 210 MSPS
SAMPLE
AIN = –1.0dBF S SNR = 64.62dB ENOB = 10.44 BI TS SFDR = 75.48d Bc
06980-062
–120
0 10 20304050607080
FREQUENCY (MHz)
Figure 5. Single-Tone 32k FFT with fIN = 240.3 MHz, f
0
AIN = –1.0dBFS SNR = 64.65dB ENOB = 10.44 BI TS
–20
SFDR = 77.54d Bc
–40
–60
–80
AMPLITUDE (dBFS)
–100
–120
0 20 40 60 80 100
FREQUENCY (MHz)
Figure 6. Single-Tone 32k FFT with fIN = 84.3 MHz, f
SAMPLE
SAMPLE
= 170 MSPS
= 210 MSPS
–120
06980-060
0 20 40 60 80 100 120
Figure 8. Single-Tone 32k FFT with fIN = 10.3 MHz, f
0
AIN = –1.0dBFS SNR = 64.50dB ENOB = 10.42 BI TS
–20
SFDR = 77.97dBc
–40
–60
–80
AMPLITUDE (dBFS)
–100
–120
06980-061
0 20 40 60 80 100 120
Figure 9. Single-Tone 32k FFT with fIN = 84.3 MHz, f
FREQUENCY (MHz)
FREQUENCY (MHz)
SAMPLE
SAMPLE
06980-063
= 250 MSPS
06980-064
= 250 MSPS
Rev. 0 | Page 11 of 40
AD9239
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0
–20
–40
–60
–80
AMPLITUDE (dBFS)
–100
–120
0 20 40 60 80 100 120
FREQUENCY (MHz)
Figure 10. Single-Tone 32k FFT with fIN = 171.3 MHz, f
0
–20
–40
–60
–80
AMPLITUDE (dBFS)
–100
–120
0 20 40 60 80 100 120
FREQUENCY (MHz)
Figure 11. Single-Tone 32k FFT with fIN = 240.3 MHz, f
AIN = –1.0dBFS SNR = 63.90dB ENOB = 10.32 BI TS SFDR = 73.10d Bc
= 250 MSPS
SAMPLE
AIN = –1.0dBFS SNR = 63.41dB ENOB = 10.24 BI TS SFDR = 77.49dBc
= 250 MSPS
SAMPLE
90
88
86
84
82
80
78
SFDR (dBFS)
76
74
72
70
06980-065
170MSPS
210MSPS
50 70 90 110 130 150 170 190 210 230 250
ENCODE (MSPS)
250MSPS
06980-068
Figure 13. SFDR vs. Encode, fIN = 84.3 MHz
100
90
80
70
60
50
40
SNR/SFDR (dB)
30
20
10
0
–90 –80 –70 –60 –50 –40 –30 –20 –10 0
06980-066
Figure 14. SNR/SFDR vs. Analog Input Level, fIN = 84.3 MHz, f
SFDR (dBFS)
SNR (dBFS)
SFDR (dB)
ANALOG INPUT LEVEL (dBFS)
SNR (dB)
SAMPLE
06980-069
= 170 MSPS
70
69
68
170MSPS
250MSPS
210MSPS
ENCODE (MSPS)
06980-067
Figure 15. SNR/SFDR vs. Analog Input Level, fIN = 84.3 MHz, f
67
66
65
64
SNR (dBFS)
63
62
61
60
50 70 90 110 130 150 170 190 210 230 250
Figure 12. SNR vs. Encode, fIN = 84.3 MHz
Rev. 0 | Page 12 of 40
100
90
80
70
60
50
40
SNR/SFDR (dB)
30
20
10
0
–90 –80 –70 –60 –50 –40 –30 –20 –10 0
SFDR (dBFS)
SNR (dBFS)
SFDR (dB)
SNR (dB)
ANALOG INPUT LEVEL (dBFS)
SAMPLE
06980-070
= 210 MSPS
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