SNR = 62.5 dBFS @ fIN up to 70 MHz @ 200 MSPS
ENOB of 10.2 @ f
SFDR = −77 dBc @ f
Excellent linearity
DNL = ±0.15 LSB typical
INL = ±0.5 LSB typical
LVDS at 200 MSPS (ANSI-644 levels)
700 MHz full power analog bandwidth
On-chip reference, no external decoupling required
Integrated input buffer and track-and-hold amplifier
Low power dissipation
373 mW @ 200 MSPS (LVDS SDR mode)
328 mW @ 200 MSPS (LVDS DDR mode)
Programmable input voltage range
1.0 V to 1.5 V, 1.25 V nominal
1.8 V analog and digital supply operation
Selectable output data format (offset binary, twos
Wireless and wired broadband communications
Cable reverse path
Communications test equipment
Radar and satellite subsystems
Power amplifier linearization
GENERAL DESCRIPTION
The AD9230-11 is an 11-bit monolithic sampling analog-todigital converter (ADC) optimized for high performance,
low power, and ease of use. The product operates at up to a
200 MSPS conversion rate and is optimized for outstanding
dynamic performance in wideband carrier and broadband
systems. All necessary functions, including a track-and-hold
(T/H) amplifier and voltage reference, are included on the
chip to provide a complete signal conversion solution.
The ADC requires a 1.8 V analog voltage supply and a
differential clock for full performance operation. The digital
outputs are LVDS (ANSI-644) compatible and support twos
complement, offset binary format, or Gray code. A data clock
output is available for proper output data timing.
Fabricated on an advanced CMOS process, the AD9230-11 is
available in a 56-lead lead frame chip scale package, specified
over the industrial temperature range (−40°C to +85°C).
PRODUCT HIGHLIGHTS
1. High Performance. Maintains 62.5 dBFS SNR
@ 200 MSPS with a 70 MHz input.
2. Low Power. Consumes only 373 mW @ 200 MSPS.
3. Ease of Use. LVDS output data and output clock signal
allow interface to current FPGA technology. The on-chip
reference and sample-and-hold provide flexibility in
system design. Use of a single 1.8 V supply simplifies
system power supply design.
4. Serial Port Control. Standard serial port interface (SPI)
supports various product functions, such as data formatting,
disabling the clock duty cycle stabilizer, power-down, gain
adjust, and output test pattern generation.
5. Pin-Compatible Family. 10-bit and 12-bit pin-compatible
family offered as AD9211 and AD9230.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.
MAX
Table 1.
1
Parameter
Temp Min Typ Max Unit
RESOLUTION 11 Bits
ACCURACY
No Missing Codes Full Guaranteed
Offset Error 25°C 4.2 mV
Full −12 +12 mV
Gain Error 25°C 0.89 % FS
Full −2.2 +4.3 % FS
Differential Nonlinearity (DNL) 25°C ±0.15 LSB
Full −0.4 +0.4 LSB
Integral Nonlinearity (INL) 25°C ±0.5 LSB
Full −0.5 +0.5 LSB
TEMPERATURE DRIFT
Offset Error Full ±9 μV/°C
Gain Error Full 0.019 %/°C
ANALOG INPUTS (VIN+, VIN−)
Differential Input Voltage Range
2
Full 0.98 1.25 1.5 V p-p
Input Common-Mode Voltage Full 1.4 V
Input Resistance (Differential) Full 4.3 kΩ
Input Capacitance 25°C 2 pF
POWER SUPPLY
AVDD Full 1.7 1.8 1.9 V
DRVDD Full 1.7 1.8 1.9 V
Supply Currents
3
I
Full 152 164 mA
AVDD
I
DRVDD
I
DRVDD
3
/SDR Mode
3
/DDR Mode
4
Full 55 58 mA
5
Full 36 mA
Power Dissipation3 Full
SDR Mode
DDR Mode
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and an explanation of how these tests were
completed.
2
The input range is programmable through the SPI, and the range specified reflects the nominal values of each setting. See the section. Memory Map
3
I
and I
AVDD
4
Single data rate mode; this is the default mode of the AD9230-11.
5
Double data rate mode; user-programmable feature. See the section.
4
Full 373 400 mW
5
Full 338 mW
are measured with a −1 dBFS, 10.3 MHz sine input at rated sample rate.
DRVDD
Memory Map
Rev. 0 | Page 3 of 28
AD9230-11
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 2.
Parameter2 Temp Min Typ Max Unit
SNR
fIN = 10 MHz 25°C 62.4 62.9 dB
Full 62.2 dB
fIN = 70 MHz 25°C 62.2 62.5 dB
Full 62.0 dB
fIN = 170 MHz 25°C 61.8 dB
SINAD
fIN = 10 MHz 25°C 62.3 62.8 dB
Full 62.1 dB
fIN = 70 MHz 25°C 62.0 62.3 dB
Full 61.8 dB
fIN = 170 MHz 25°C 61.5 dB
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 10 MHz 25°C 10.3 Bits
fIN = 70 MHz 25°C 10.2 Bits
fIN = 170 MHz 25°C 10.1 Bits
WORST HARMONIC (SECOND OR THIRD)
fIN = 10 MHz 25°C −86 −77 dBc
Full −77 dBc
fIN = 70 MHz 25°C −79 −77 dBc
Full −76 dBc
fIN = 170 MHz 25°C −76 dBc
WORST OTHER (SFDR EXCLUDING SECOND AND THIRD)
fIN = 10 MHz 25°C −88 −84 dBc
Full −79 dBc
fIN = 70 MHz 25°C −84 −82 dBc
Full −81 dBc
fIN = 170 MHz 25°C −82 dBc
ANALOG INPUT BANDWIDTH 25°C 700 MHz
1
All ac specifications tested by driving CLK+ and CLK− differentially.
2
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and an explanation of how these tests were
completed.
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.1
MAX
Rev. 0 | Page 4 of 28
AD9230-11
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 3.
Parameter1 Temp Min Typ Max Unit
CLOCK INPUTS
Logic Compliance Full CMOS/LVDS/LVPECL
Internal Common-Mode Bias Full 1.2 V
Differential Input Voltage Full 0.2 6 V p-p
Input Voltage Range Full AGND − 0.3 AVDD + 1.6 V
Input Common-Mode Range Full 1.1 AVDD V
High Level Input Voltage (VIH) Full 1.2 3.6 V
Low Level Input Voltage (VIL) Full 0 0.8 V
High Level Input Current (IIH) Full −10 +10 μA
Low Level Input Current (IIL) Full −10 +10 μA
Input Resistance (Differential) Full 16 20 24 kΩ
Input Capacitance Full 4 pF
LOGIC INPUTS
Logic 1 Voltage Full 0.8 × AVDD V
Logic 0 Voltage Full 0.2 × AVDD V
Logic 1 Input Current (SDIO) Full 0 μA
Logic 0 Input Current (SDIO) Full −60 μA
Logic 1 Input Current (SCLK, PWDN, CSB, RESET) Full 55 μA
Logic 0 Input Current (SCLK, PWDN, CSB, RESET) Full 0 μA
Input Capacitance 25°C 4 pF
LOGIC OUTPUTS2
VOD Differential Output Voltage Full 247 454 mV
VOS Output Offset Voltage Full 1.125 1.375 V
Output Coding Twos complement, gray code, or offset binary (default)
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and an explanation of how these tests were
completed.
2
LVDS R
TERMINATION
= 100 Ω.
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.
MAX
Rev. 0 | Page 5 of 28
AD9230-11
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 4.
Parameter Temp Min Typ Max Unit
CONVERSION RATE
Maximum Conversion Rate Full 200
Minimum Conversion RateFull
PULSE WIDTH
CLK+ Pulse Width High (tCH)Full 2.25 2.5 ns
CLK+ Pulse Width Low (tCL) Full 2.25 2.5 ns
OUTPUT (LVDS, SDR MODE)
1
Data Propagation Delay (tPD) Full 3.8 ns
Rise Time (tR) (20% to 80%) 25°C 0.2 ns
Fall Time (tF) (20% to 80%) 25°C 0.2 ns
DCO Propagation Delay (t
Data to DCO Skew (t
CPD
) Full −0.3 0.1 0.5 ns
SKEW
Latency Full 6 Cycles
OUTPUT (LVDS, DDR MODE)
2
Data Propagation Delay (tPD) Full 3.8 ns
Rise Time (tR) (20% to 80%) 25°C 0.2 ns
Fall Time (tF) (20% to 80%) 25°C 0.2 ns
DCO Propagation Delay (t
Data to DCO Skew (t
CPD
) Full −0.5 0.1 0.3 ns
SKEW
Latency Full 6 Cycles
APERTURE UNCERTAINTY (JITTER, tJ) 25°C 0.2 ps rms
1
See Figure 2.
2
See Figure 3.
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.
AVDD to AGND −0.3 V to +2.0 V
DRVDD to DRGND −0.3 V to +2.0 V
AGND to DRGND −0.3 V to +0.3 V
AVDD to DRVDD −2.0 V to +2.0 V
D0+/D0− through D10+/D10−
to DRGND
DCO+/DCO− to DRGND −0.3 V to DRVDD + 0.3 V
OR+/OR− to DGND −0.3 V to DRVDD + 0.3 V
CLK+ to AGND −0.3 V to +3.9 V
CLK− to AGND −0.3 V to +3.9 V
VIN+ to AGND −0.3 V to AVDD + 0.2 V
VIN− to AGND −0.3 V to AVDD + 0.2 V
SDIO/DCS to DGND −0.3 V to DRVDD + 0.3 V
PWDN to AGND −0.3 V to +3.9 V
CSB to AGND −0.3 V to +3.9 V
SCLK/DFS to AGND −0.3 V to +3.9 V
Environmental
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature
(Soldering, 10 sec)
Junction Temperature 150°C
−0.3 V to DRVDD + 0.3 V
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane
for the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6.
Package Type θJA θ
56-Lead LFCSP (CP-56-2) 30.4 2.9 °C/W
Unit
JC
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, metal that is in direct contact with the package leads
reduces the θ
.
JA
ESD CAUTION
Rev. 0 | Page 8 of 28
AD9230-11
2
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
D1–
D1+
55
56
DCO+
DNC
DNC
D0– (LSB)
D0+ (LSB)
52
53
54
50
51
CLK–
AVDD
DRVDD
DRGND
DCO–
48
49
CLK+
AVDD
44
43
45
46
47
1D2–
2D2+
3D3–
4D3+
5D4–
6D4+
7DRVDD
8DRGND
9D5–
10D5+
11D6–
12D6+
13D7–
14D7+
NOTES
1. DNC = DO NOT CONNECT.
. PIN 0 (EXPOSED PADDLE) = AGND.