ANALOG DEVICES AD9230-11 Service Manual

11-Bit, 200 MSPS,
A

FEATURES

SNR = 62.5 dBFS @ fIN up to 70 MHz @ 200 MSPS ENOB of 10.2 @ f SFDR = −77 dBc @ f Excellent linearity
DNL = ±0.15 LSB typical
INL = ±0.5 LSB typical LVDS at 200 MSPS (ANSI-644 levels) 700 MHz full power analog bandwidth On-chip reference, no external decoupling required Integrated input buffer and track-and-hold amplifier Low power dissipation
373 mW @ 200 MSPS (LVDS SDR mode)
328 mW @ 200 MSPS (LVDS DDR mode) Programmable input voltage range
1.0 V to 1.5 V, 1.25 V nominal
1.8 V analog and digital supply operation Selectable output data format (offset binary, twos
complement, gray code) Clock duty cycle stabilizer Integrated data capture clock
up to 70 MHz @ 200 MSPS (−1.0 dBFS)
IN
up to 70 MHz @ 200 MSPS (−1.0 dBFS)
IN
1.8 V Analog-to-Digital Converter AD9230-11

FUNCTIONAL BLOCK DIAGRAM

REFERENCE
CML
VIN+
VIN–
CLK+
CLK–
TRACK-AND-HO LD
CLOCK
MANAGEM ENT
RESET
AGNDPWDNRBIAS
12 11
ADC 12-BIT CORE
SERIAL PORT
SCLK SDIO CSB
Figure 1.
VDD
AD9230-11
OUTPUT
STAGING
LVDS
DRVDD
DRGND
D10 TO D0
OR+
OR–
DCO+
DCO–
07101-001

APPLICATIONS

Wireless and wired broadband communications Cable reverse path Communications test equipment Radar and satellite subsystems Power amplifier linearization

GENERAL DESCRIPTION

The AD9230-11 is an 11-bit monolithic sampling analog-to­digital converter (ADC) optimized for high performance, low power, and ease of use. The product operates at up to a 200 MSPS conversion rate and is optimized for outstanding dynamic performance in wideband carrier and broadband systems. All necessary functions, including a track-and-hold (T/H) amplifier and voltage reference, are included on the chip to provide a complete signal conversion solution.
The ADC requires a 1.8 V analog voltage supply and a differential clock for full performance operation. The digital outputs are LVDS (ANSI-644) compatible and support twos complement, offset binary format, or Gray code. A data clock output is available for proper output data timing.
Fabricated on an advanced CMOS process, the AD9230-11 is available in a 56-lead lead frame chip scale package, specified over the industrial temperature range (−40°C to +85°C).

PRODUCT HIGHLIGHTS

1. High Performance. Maintains 62.5 dBFS SNR
@ 200 MSPS with a 70 MHz input.
2. Low Power. Consumes only 373 mW @ 200 MSPS.
3. Ease of Use. LVDS output data and output clock signal
allow interface to current FPGA technology. The on-chip reference and sample-and-hold provide flexibility in system design. Use of a single 1.8 V supply simplifies system power supply design.
4. Serial Port Control. Standard serial port interface (SPI)
supports various product functions, such as data formatting, disabling the clock duty cycle stabilizer, power-down, gain adjust, and output test pattern generation.
5. Pin-Compatible Family. 10-bit and 12-bit pin-compatible
family offered as AD9211 and AD9230.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved.
AD9230-11

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
DC Specifications ......................................................................... 3
AC Specifications .......................................................................... 4
Digital Specifications ................................................................... 5
Switching Specifications .............................................................. 6
Timing Diagrams .......................................................................... 7
Absolute Maximum Ratings ............................................................ 8
Thermal Resistance ...................................................................... 8
ESD Caution .................................................................................. 8
Pin Configurations and Function Descriptions ........................... 9
Typical Performance Characteristics ........................................... 13
Equivalent Circuits ......................................................................... 15
Theory of Operation ...................................................................... 16
Analog Input and Voltage Reference ....................................... 16
Clock Input Considerations ...................................................... 17
Power Dissipation and Power-Down Mode ........................... 18
Digital Outputs ........................................................................... 18
Timing ......................................................................................... 19
RBIAS ........................................................................................... 19
Configuration Using the SPI ..................................................... 19
Hardware Interface ..................................................................... 20
Configuration Without the SPI ................................................ 20
Memory Map .................................................................................. 22
Reading the Memory Map Table .............................................. 22
Reserved Locations .................................................................... 22
Default Values ............................................................................. 22
Logic Levels ................................................................................. 22
Transfer Register Map ................................................................ 22
Outline Dimensions ....................................................................... 25
Ordering Guide .......................................................................... 25

REVISION HISTORY

10/08—Revision 0: Initial Version
Rev. 0 | Page 2 of 28
AD9230-11

SPECIFICATIONS

DC SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.
MAX
Table 1.
1
Parameter
Temp Min Typ Max Unit
RESOLUTION 11 Bits ACCURACY
No Missing Codes Full Guaranteed Offset Error 25°C 4.2 mV Full −12 +12 mV Gain Error 25°C 0.89 % FS Full −2.2 +4.3 % FS Differential Nonlinearity (DNL) 25°C ±0.15 LSB Full −0.4 +0.4 LSB Integral Nonlinearity (INL) 25°C ±0.5 LSB Full −0.5 +0.5 LSB
TEMPERATURE DRIFT
Offset Error Full ±9 μV/°C Gain Error Full 0.019 %/°C
ANALOG INPUTS (VIN+, VIN−)
Differential Input Voltage Range
2
Full 0.98 1.25 1.5 V p-p
Input Common-Mode Voltage Full 1.4 V Input Resistance (Differential) Full 4.3 kΩ Input Capacitance 25°C 2 pF
POWER SUPPLY
AVDD Full 1.7 1.8 1.9 V DRVDD Full 1.7 1.8 1.9 V Supply Currents
3
I
Full 152 164 mA
AVDD
I
DRVDD
I
DRVDD
3
/SDR Mode
3
/DDR Mode
4
Full 55 58 mA
5
Full 36 mA
Power Dissipation3 Full
SDR Mode DDR Mode
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and an explanation of how these tests were
completed.
2
The input range is programmable through the SPI, and the range specified reflects the nominal values of each setting. See the section. Memory Map
3
I
and I
AVDD
4
Single data rate mode; this is the default mode of the AD9230-11.
5
Double data rate mode; user-programmable feature. See the section.
4
Full 373 400 mW
5
Full 338 mW
are measured with a −1 dBFS, 10.3 MHz sine input at rated sample rate.
DRVDD
Memory Map
Rev. 0 | Page 3 of 28
AD9230-11

AC SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 2.
Parameter2 Temp Min Typ Max Unit
SNR
fIN = 10 MHz 25°C 62.4 62.9 dB Full 62.2 dB fIN = 70 MHz 25°C 62.2 62.5 dB Full 62.0 dB fIN = 170 MHz 25°C 61.8 dB
SINAD
fIN = 10 MHz 25°C 62.3 62.8 dB Full 62.1 dB fIN = 70 MHz 25°C 62.0 62.3 dB Full 61.8 dB fIN = 170 MHz 25°C 61.5 dB
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 10 MHz 25°C 10.3 Bits fIN = 70 MHz 25°C 10.2 Bits fIN = 170 MHz 25°C 10.1 Bits
WORST HARMONIC (SECOND OR THIRD)
fIN = 10 MHz 25°C −86 −77 dBc Full −77 dBc fIN = 70 MHz 25°C −79 −77 dBc Full −76 dBc fIN = 170 MHz 25°C −76 dBc
WORST OTHER (SFDR EXCLUDING SECOND AND THIRD)
fIN = 10 MHz 25°C −88 −84 dBc Full −79 dBc fIN = 70 MHz 25°C −84 −82 dBc Full −81 dBc fIN = 170 MHz 25°C −82 dBc
ANALOG INPUT BANDWIDTH 25°C 700 MHz
1
All ac specifications tested by driving CLK+ and CLK− differentially.
2
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and an explanation of how these tests were
completed.
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.1
MAX
Rev. 0 | Page 4 of 28
AD9230-11

DIGITAL SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 3.
Parameter1 Temp Min Typ Max Unit
CLOCK INPUTS
Logic Compliance Full CMOS/LVDS/LVPECL Internal Common-Mode Bias Full 1.2 V Differential Input Voltage Full 0.2 6 V p-p Input Voltage Range Full AGND − 0.3 AVDD + 1.6 V Input Common-Mode Range Full 1.1 AVDD V High Level Input Voltage (VIH) Full 1.2 3.6 V Low Level Input Voltage (VIL) Full 0 0.8 V High Level Input Current (IIH) Full −10 +10 μA Low Level Input Current (IIL) Full −10 +10 μA Input Resistance (Differential) Full 16 20 24 kΩ Input Capacitance Full 4 pF
LOGIC INPUTS
Logic 1 Voltage Full 0.8 × AVDD V Logic 0 Voltage Full 0.2 × AVDD V Logic 1 Input Current (SDIO) Full 0 μA Logic 0 Input Current (SDIO) Full −60 μA Logic 1 Input Current (SCLK, PWDN, CSB, RESET) Full 55 μA Logic 0 Input Current (SCLK, PWDN, CSB, RESET) Full 0 μA Input Capacitance 25°C 4 pF
LOGIC OUTPUTS2
VOD Differential Output Voltage Full 247 454 mV VOS Output Offset Voltage Full 1.125 1.375 V Output Coding Twos complement, gray code, or offset binary (default)
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and an explanation of how these tests were
completed.
2
LVDS R
TERMINATION
= 100 Ω.
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.
MAX
Rev. 0 | Page 5 of 28
AD9230-11

SWITCHING SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 4.
Parameter Temp Min Typ Max Unit
CONVERSION RATE
Maximum Conversion Rate Full 200 Minimum Conversion Rate Full
PULSE WIDTH
CLK+ Pulse Width High (tCH) Full 2.25 2.5 ns CLK+ Pulse Width Low (tCL) Full 2.25 2.5 ns
OUTPUT (LVDS, SDR MODE)
1
Data Propagation Delay (tPD) Full 3.8 ns Rise Time (tR) (20% to 80%) 25°C 0.2 ns Fall Time (tF) (20% to 80%) 25°C 0.2 ns DCO Propagation Delay (t Data to DCO Skew (t
CPD
) Full −0.3 0.1 0.5 ns
SKEW
Latency Full 6 Cycles
OUTPUT (LVDS, DDR MODE)
2
Data Propagation Delay (tPD) Full 3.8 ns Rise Time (tR) (20% to 80%) 25°C 0.2 ns Fall Time (tF) (20% to 80%) 25°C 0.2 ns DCO Propagation Delay (t Data to DCO Skew (t
CPD
) Full −0.5 0.1 0.3 ns
SKEW
Latency Full 6 Cycles
APERTURE UNCERTAINTY (JITTER, tJ) 25°C 0.2 ps rms
1
See Figure 2.
2
See Figure 3.
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.
MAX
40 MSPS
MSPS
) Full 3.9 ns
) Full 3.9 ns
Rev. 0 | Page 6 of 28
AD9230-11

TIMING DIAGRAMS

VIN
CLK+
CLK–
DCO+
DCO–
Dx+
Dx–
VIN
N – 1
t
CH
N – 1
t
A
N
N + 3
N + 1
t
CL
t
CPD
1/
f
S
t
SKEW
t
PD
N – 6 N – 5 N – 4 N – 3 N – 2
N + 2
N + 4
N + 5
07101-002
Figure 2. Single Data Rate Mode
t
A
N
N + 3
N + 1
N + 2
N + 4
N + 5
t
CLK+
CLK–
DCO+
DCO–
D5+
D5–
D4/D10+
D4/D10–
t
CH
CL
t
CPD
1/
f
S
t
SKEW
t
PD
D5
N – 7NODATAD5N – 6NODATAD5N – 5NODATAD5N – 4NODATAD5N – 3NODATA
D10
N – 7D4N – 6
6 MSBs
5 LSBs
D10
N – 6D4N – 5
D10
N – 5D4N – 4
D10
N – 4D4N – 3
D10
N – 3D4N – 2
07101-003
Figure 3. Double Data Rate Mode
Rev. 0 | Page 7 of 28
AD9230-11

ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V DRVDD to DRGND −0.3 V to +2.0 V AGND to DRGND −0.3 V to +0.3 V AVDD to DRVDD −2.0 V to +2.0 V D0+/D0− through D10+/D10−
to DRGND DCO+/DCO− to DRGND −0.3 V to DRVDD + 0.3 V OR+/OR− to DGND −0.3 V to DRVDD + 0.3 V CLK+ to AGND −0.3 V to +3.9 V CLK− to AGND −0.3 V to +3.9 V VIN+ to AGND −0.3 V to AVDD + 0.2 V VIN− to AGND −0.3 V to AVDD + 0.2 V SDIO/DCS to DGND −0.3 V to DRVDD + 0.3 V PWDN to AGND −0.3 V to +3.9 V CSB to AGND −0.3 V to +3.9 V SCLK/DFS to AGND −0.3 V to +3.9 V
Environmental
Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature
(Soldering, 10 sec) Junction Temperature 150°C
−0.3 V to DRVDD + 0.3 V
300°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package.
Table 6.
Package Type θJA θ
56-Lead LFCSP (CP-56-2) 30.4 2.9 °C/W
Unit
JC
Typical θJA and θJC are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θ
JA
. In addition, metal that is in direct contact with the package leads reduces the θ
.
JA

ESD CAUTION

Rev. 0 | Page 8 of 28
AD9230-11
2

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

D1–
D1+
55
56
DCO+
DNC
DNC
D0– (LSB)
D0+ (LSB)
52
53
54
50
51
CLK–
AVDD
DRVDD
DRGND
DCO–
48
49
CLK+
AVDD
44
43
45
46
47
1D2– 2D2+ 3D3– 4D3+ 5D4– 6D4+ 7DRVDD 8DRGND
9D5– 10D5+ 11D6– 12D6+ 13D7– 14D7+
NOTES
1. DNC = DO NOT CONNECT. . PIN 0 (EXPOSED PADDLE) = AGND.
PIN 1 INDICATO R
16
15
D8–
D8+
AD9230-11
TOP VIEW
(Not to Scale)
17
19
20
18
D9–
D9+
(MSB) D10–
(MSB) D10+
42 AVDD 41 AVDD 40 CML 39 AVDD 38 AVDD 37 AVDD 36 VIN– 35 VIN+ 34 AVDD 33 AVDD 32 AVDD 31 RBIAS 30 AVDD 29 PWDN
21
22
23
24
25
26
27
28
OR–
OR+
DRGND
CSB
RESET
DRVDD
SDIO/DCS
SCLK/DFS
7101-004
Figure 4. Single Data Rate Mode Pin Configuration
Table 7. Single Data Rate Mode Pin Function Descriptions
Pin No. Mnemonic Description
30, 32 to 34, 37 to 39, 41 to
AVDD 1.8 V Analog Supply.
43, 46 7, 24, 47 DRVDD 1.8 V Digital Output Supply. 0 AGND 8, 23, 48 DRGND
1
Analog Ground. The exposed paddle should be connected to the analog ground.
1
Digital Output Ground.
35 VIN+ Analog Input (True). 36 VIN− Analog Input (Complement). 40 CML
Common-Mode Output Pin. Enabled through the SPI, this pin provides a reference for the
optimized internal bias voltage for VIN+/VIN−. 44 CLK+ Clock Input (True). 45 CLK− Clock Input (Complement). 31 RBIAS Set Pin for Chip Bias Current. Place 1% 10 kΩ resistor terminated to ground. Nominally 0.5 V. 28 RESET CMOS-Compatible Chip Reset (Active Low). 25 SDIO/DCS
Serial Port Interface (SPI) Data Input/Output (Serial Port Mode). Duty Cycle Stabilizer Select
(External Pin Mode). 26 SCLK/DFS Serial Port Interface Clock (Serial Port Mode). Data Format Select Pin (External Pin Mode). 27 CSB Serial Port Chip Select (Active Low). 29 PWDN Chip Power-Down. 49 DCO− Data Clock Output (Complement). 50 DCO+ Data Clock Output Input (True). 51, 52 DNC Do No Connect. 53 D0− (LSB) D0 Complement Output Bit (LSB). 54 D0+ (LSB) D0 True Output Bit (LSB). 55 D1− D1 Complement Output Bit. 56 D1+ D1 True Output Bit. 1 D2− D2 Complement Output Bit. 2 D2+ D2 True Output Bit.
Rev. 0 | Page 9 of 28
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