FEATURES
Fully Buffered Inputs and Outputs
Fast Channel Switching: 10 ns
High Speed
> 750 MHz Bandwidth (–3 dB)
750 V/s Slew Rate
Fast Settling Time of 14 ns to 0.1%
Low Power: 3.8 mA (AD8180), 6.8 mA (AD8182)
Excellent Video Specifications (R
Gain Flatness of 0.1 dB Beyond 100 MHz
0.02% Differential Gain Error
0.02ⴗ Differential Phase Error
Low Glitch: < 35 mV
Low All-Hostile Crosstalk of –80 dB @ 5 MHz
High “OFF” Isolation of –90 dB @ 5 MHz
Low Cost
Fast Output Disable Feature for Connecting Multiple Devices
APPLICATIONS
Pixel Switching for “Picture-In-Picture”
Switching in LCD and Plasma Displays
Video Switchers and Routers
≥ 1 k⍀)
L
10 ns Switching Multiplexers
AD8180/AD8182*
FUNCTIONAL BLOCK DIAGRAM
Table I. Truth Table
PRODUCT DESCRIPTION
The AD8180 (single) and AD8182 (dual) are high speed 2-to-1
multiplexers. They offer –3 dB signal bandwidth greater than
750 MHz along with slew rate of 750 V/µs. With better than
80 dB of crosstalk and isolation, they are useful in many high
speed applications. The differential gain and differential phase
error of 0.02% and 0.02°, along with 0.1 dB flatness beyond
100 MHz make the AD8180 and AD8182 ideal for professional
video multiplexing. They offer 10 ns switching time making
them an excellent choice for pixel switching (picture-in-picture)
while consuming less than 3.8 mA (per 2:1 mux) on ±5 V sup-
ply voltages.
Both devices offer a high speed disable feature allowing the
output to be configured into a high impedance state. This allows multiple outputs to be connected together for cascading
stages while the “OFF” channels do not load the output bus.
They operate on voltage supplies of ±5 V and are offered in 8-
and 14-lead plastic DIP and SOIC packages.
*Protected under U.S. Patent Number 5,955,908.
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
–3 dB Bandwidth (Small Signal)4AD8180RVIN = 50 mV rms, R
–3 dB Bandwidth (Small Signal)4AD8182RVIN = 50 mV rms, R
–3 dB Bandwidth (Large Signal)AD8180RVIN = 1 V rms, R
–3 dB Bandwidth (Large SiAD8182RVIN = 1 V rms, R
0.1 dB Bandwidth
0.1 dB Bandwidth
4, 5
4, 5
AD8180RVIN = 50 mV rms, R
VIN = 50 mV rms, R
AD8182RVIN = 50 mV rms, R
= 5 kΩ750930MHz
L
= 5 kΩ640780MHz
L
= 5 kΩ120150MHz
L
= 5 kΩ110135MHz
L
= 5 kΩ, RS = 0 Ω100MHz
L
= 1 kΩ–5 kΩ, RS = 150 Ω210MHz
L
= 1 kΩ–5 kΩ, RS = 125 Ω210MHz
L
Slew Rate2 V Step750V/µs
Settling Time to 0.1%2 V Step14ns
DISTORTION/NOISE PERFORMANCE
Differential Gainƒ = 3.58 MHz, R
Differential Phaseƒ = 3.58 MHz, R
All Hostile Crosstalk
All Hostile Crosstalk
OFF Isolation
OFF Isolation
6
6
7
7
AD8180Rƒ = 5 MHz, R
ƒ = 30 MHz, R
AD8182Rƒ = 5 MHz, R
ƒ = 30 MHz, R
AD8180Rƒ = 5 MHz, R
AD8182Rƒ = 5 MHz, R
= 1 kΩ0.020.04%
L
= 1 kΩ0.020.04Degrees
L
= 1 kΩ–80dB
L
= 1 kΩ–65dB
L
= 1 kΩ–78dB
L
= 1 kΩ–63dB
L
= 30 Ω–89dB
L
= 30 Ω–93dB
L
Voltage Noiseƒ = 10 kHz–30 MHz4.5nV/√Hz
Total Harmonic DistortionƒC = 10 MHz, VO = 2 V p-p, R
DC/TRANSFER CHARACTERISTICS
Voltage Gain
8
V
= ±1 V, RL = 2 kΩ0.982V/V
IN
V
= ±1 V, RL = 10 kΩ0.9860.993V/V
IN
= 1 kΩ–78dBc
L
Input Offset Voltage112mV
T
MIN
to T
MAX
15mV
Input Offset Voltage MatchingChannel-to-Channel0.54mV
Input Offset Drift11µV/°C
Input Bias Current 15 µA
T
MIN
to T
MAX
7µA
Input Bias Current Drift12nA/°C
INPUT CHARACTERISTICS
Input Resistance12.2MΩ
Input CapacitanceChannel Enabled (R Package)1.5pF
Channel Disabled (R Package)1.5pF
Input Voltage Range±3.3V
OUTPUT CHARACTERISTICS
Output Voltage SwingR
= 500 Ω
L
9
±3.0±3.1V
Short Circuit Current30mA
Output ResistanceEnabled27Ω
Disabled110MΩ
Output CapacitanceDisabled (R Package)1.7pF
POWER SUPPLY
Operating Range±4±6V
Power Supply Rejection Ratio+PSRR+VS = +4.5 V to +5.5 V, –VS = –5 V5457dB
Power Supply Rejection Ratio–PSRR–VS = –4.5 V to –5.5 V, +VS = +5 V4551dB
Quiescent CurrentAll Channels “ON”3.8/6.84.5/8mA
T
MIN
to T
MAX
4.75/8.5mA
All Channels “OFF”1.3/22/3mA
T
MIN
to T
MAX
2/3mA
AD8182, One Channel “ON”4mA
OPERATING TEMPERATURE RANGE–40+85°C
REV. B–2–
NOTES
WARNING!
ESD SENSITIVE DEVICE
AD8180/AD8182
1
ENABLE pin is grounded. IN0 = +1 V dc, IN1 = –1 V dc. SELECT input is driven with 0 V to +5 V pulse. Measure transition time from 50% of the SELECT input value
(+2.5 V) and 10% (or 90%) of the total output voltage transition from IN0 channel voltage (+1 V) to IN1 (–1 V), or vice versa.
2
ENABLE pin is driven with 0 V to +5 V pulse (with 3 ns edges). State of SELECT input determines which channel is activated (i.e., if SELECT = Logic 0, IN0 is selected). Set
IN0 = +1 V dc, IN1 = –1 V dc, and measure transition time from 50% of ENABLE pulse (+2.5 V) to 90% of the total output voltage change. In Figure 5, ∆t
time,
3
All inputs are grounded. SELECT input is driven with 0 V to +5 V pulse. The outputs are monitored. Speeding the edges of the SELECT pulse increases the glitch magnitude
due to coupling via the ground plane. Removing the SELECT input termination will lower glitch, as does increasing R
4
Decreasing RL lowers the bandwidth slightly. Increasing CL lowers the bandwidth considerably (see Figure 19).
5
A resistor (RS) placed in series with the mux inputs serves to optimize 0.1 dB flatness, but is not required. Increasing output capacitance will increase peaking and reduce bandwidth (see Figure 20.)
6
Select input which is not being driven (i.e., if SELECT is Logic 1, input activated is IN1); drive all other inputs with V
R
7
Mux is disabled (i.e., ENABLE = Logic 1) and all inputs are driven simultaneously with VIN = 0.446 V rms. Output is monitored at ƒ = 5 and 30 MHz. RL = 30 Ω to simulate
R
ance determines the crosstalk.
8
Voltage gain decreases for lower values of R
(i.e., the voltage gain is approximately 0.97 V/V (3% gain error) for R
9
Larger values of RL provide wider output voltage swings, as well as better gain accuracy. See Note 8.
= 0.707 V rms and monitor output at ƒ = 5 and 30 MHz.
= 1 kΩ (see Figure 13).
L
of one enabled mux within a system (see Figure 14). In this mode the output impedance is very high (typ 10 MΩ), and the signal couples across the package; the load imped-
ON
. The resistive divider formed by the mux enabled output resistance (27 Ω) and R
Output Short Circuit Duration . . . . . Observe Power Derating Curves
Storage Temperature Range
S
2.0
8-LEAD PLASTIC DIP PACKAGE
TJ = +1508C
1.5
N and R Package . . . . . . . . . . . . . . . . . . . . . . –65°C to +125°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air: 8-Lead Plastic DIP Package: θJA = 90°C/W;
8-Lead SOIC Package: θ
14-Lead SOIC Package: θJA = 120°C/W, where P
= 155°C/W; 14-Lead Plastic Package: θJA = 75°C/W;
JA
= (TJ–T
D
)/θ
.
A
JA
ORDERING GUIDE
TemperaturePackagePackage
ModelRangeDescriptionOption
1.0
0.5
MAXIMUM POWER DISSIPATION – Watts
0
–5090–40 –30 –20 –10 0 10 20 3050 60 70 8040
8-LEAD SOIC PACKAGE
AMBIENT TEMPERATURE – 8C
Figure 2. AD8180 Maximum Power Dissipation vs.
Temperature
AD8180AN–40°C to +85°C 8-Lead Plastic DIPN-8
AD8180AR–40°C to +85°C 8-Lead SOICSO-8
AD8180AR-REEL–40°C to +85°C 13" Reel SOICSO-8
AD8180AR-REEL7 –40°C to +85°C 7" Reel SOICSO-8
AD8182AN–40°C to +85°C 14-Lead Plastic DIPN-14
AD8182AR–40°C to +85°C 14-Lead Narrow SOIC R-14
AD8182AR-REEL–40°C to +85°C 13" Reel SOICR-14
The maximum power that can be safely dissipated by the
14-LEAD SOIC
1.0
AD8180 and AD8182 is limited by the associated rise in junction temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass transition
temperature of the plastic, approximately +150°C. Exceeding
this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the
package. Exceeding a junction temperature of +175°C for an
MAXIMUM POWER DISSIPATION – Watts
0.5
–5090–40
–30 –20 –10 0 10 20 30 40 50 6080
AMBIENT TEMPERATURE – 8C
Figure 3. AD8182 Maximum Power Dissipation vs.
Temperature
extended period can result in device failure.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8180/AD8182 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. B
–3–
70
AD8180/AD8182–Typical Performance Curves
–7
0
–1
–2
–3
–4
–5
–6
VIN = 50mV rms
RL = 5kV
RS = 0V
1
NORMALIZED OUTPUT – dB
8180R
8182R
1M10M100M1G
FREQUENCY – Hz
500mV
/DIV
5ns/DIV
Figure 4. Channel Switching Characteristics
DUT OUT
250mV
/DIV
10ns/DIV
Figure 5. Enable and Disable Switching Characteristics
50mV
/DIV
25ns/DIV
Figure 6. Channel Switching Transient (Glitch)
–4–
Figure 7. Small Signal Frequency Response
VIN = 50mV rms
R
= 5kV
L
= 0V
R
S
1.0
0.8
0.6
0.4
0.2
0.0
NORMALIZED FLATNESS – dB
–0.2
–0.4
1M10M100M1G
FREQUENCY – Hz
8180R
8182R
Figure 8. Gain Flatness vs. Frequency
3
RL = 1kV
0
–3
–6
–9
–12
–15
–18
INPUT/OUTPUT LEVEL – dBV
–21
–24
–27
1M1G10M100M
VIN = 1.0V rms
VIN = 0.5V rms
VIN = 0.25V rms
VIN = 125mV rms
VIN = 62.5mV rms
FREQUENCY – Hz
Figure 9. Large Signal Frequency Response
REV. B
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