Analog Devices AD8180AN, AD8180-EB, AD8182AR-REEL7, AD8182AR-REEL, AD8182AR Datasheet

...
750 MHz, 3.8 mA
1 2 3 4
8 7 6 5
AD8180
IN0
–V
S
OUT
ENABLE
SELECT
GND
IN1
+V
S
DECODER
+1
+1
1 2 3 4
14 13 12 11
AD8182
–V
S
OUT A
ENABLE A
SELECT A
5 6
7
10
9
8
SELECT B
OUT B ENABLE B
DECODER
+1
+1
DECODER
+1
+1
IN0 A
GND
IN1 A
+V
S
IN1 B
GND
IN0 B
500mV
/DIV
5ns/DIV
a
FEATURES Fully Buffered Inputs and Outputs Fast Channel Switching: 10 ns High Speed
> 750 MHz Bandwidth (–3 dB) 750 V/s Slew Rate
Fast Settling Time of 14 ns to 0.1% Low Power: 3.8 mA (AD8180), 6.8 mA (AD8182) Excellent Video Specifications (R
Gain Flatness of 0.1 dB Beyond 100 MHz
0.02% Differential Gain Error
0.02 Differential Phase Error Low Glitch: < 35 mV Low All-Hostile Crosstalk of –80 dB @ 5 MHz High “OFF” Isolation of –90 dB @ 5 MHz Low Cost Fast Output Disable Feature for Connecting Multiple Devices
APPLICATIONS Pixel Switching for “Picture-In-Picture” Switching in LCD and Plasma Displays Video Switchers and Routers
1 k)
L
10 ns Switching Multiplexers

FUNCTIONAL BLOCK DIAGRAM

Table I. Truth Table

PRODUCT DESCRIPTION

The AD8180 (single) and AD8182 (dual) are high speed 2-to-1 multiplexers. They offer –3 dB signal bandwidth greater than
750 MHz along with slew rate of 750 V/µs. With better than
80 dB of crosstalk and isolation, they are useful in many high speed applications. The differential gain and differential phase
error of 0.02% and 0.02°, along with 0.1 dB flatness beyond
100 MHz make the AD8180 and AD8182 ideal for professional video multiplexing. They offer 10 ns switching time making them an excellent choice for pixel switching (picture-in-picture)
while consuming less than 3.8 mA (per 2:1 mux) on ±5 V sup-
ply voltages.
Both devices offer a high speed disable feature allowing the output to be configured into a high impedance state. This al­lows multiple outputs to be connected together for cascading stages while the “OFF” channels do not load the output bus.
They operate on voltage supplies of ±5 V and are offered in 8-
and 14-lead plastic DIP and SOIC packages.
*Protected under U.S. Patent Number 5,955,908.
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
SELECT ENABLE OUTPUT
00 IN0 10 IN1 0 1 High Z 1 1 High Z
Figure 1. AD8180/AD8182 Switching Characteristics
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2000
AD8180/AD8182–SPECIFICATIONS
(@ TA = +25C, VS = 5 V, RL = 2 k unless otherwise noted)
Parameter Conditions Min Typ Max Units
AD8180A/AD8182A
SWITCHING CHARACTERISTICS
Channel Switching Time
50% Logic to 10% Output Settling IN0 = +1 V, IN1 = –1 V; R 50% Logic to 90% Output Settling IN0 = +1 V, IN1 = –1 V; R 50% Logic to 99.9% Output Settling IN0 = +1 V, IN1 = –1 V; R ENABLE to Channel ON Time
50% Logic to 90% Output Settling IN0 = +1 V, –1 V or IN1 = –1 V, +1 V; R ENABLE to Channel OFF Time
50% Logic to 90% Output Settling IN0 = +1 V, –1 V or IN1 = –1 V, +1 V; R Channel Switching Transient (Glitch)
1
2
2
3
Channel-to-Channel
L
L
SEL = 0 or 1
L
SEL = 0 or 1
All Inputs Are Grounded, R
= 1 k 5ns = 1 k 10 ns = 1 k 14 ns
= 1 k 10.5 ns
L
= 1 k 11 ns
= 1 kΩ±25 /±35 mV
L
L
DIGITAL INPUTS
Logic “1” Voltage SEL and ENABLE Inputs 2.0 V Logic “0” Voltage SEL and ENABLE Inputs 0.8 V Logic “1” Input Current SEL, ENABLE = +4 V 10 200 nA Logic “0” Input Current SEL, ENABLE = +0.4 V 2 3 µA
DYNAMIC PERFORMANCE
–3 dB Bandwidth (Small Signal)4AD8180R VIN = 50 mV rms, R
–3 dB Bandwidth (Small Signal)4AD8182R VIN = 50 mV rms, R
–3 dB Bandwidth (Large Signal) AD8180R VIN = 1 V rms, R
–3 dB Bandwidth (Large Si AD8182R VIN = 1 V rms, R
0.1 dB Bandwidth
0.1 dB Bandwidth
4, 5
4, 5
AD8180R VIN = 50 mV rms, R
VIN = 50 mV rms, R
AD8182R VIN = 50 mV rms, R
= 5 k 750 930 MHz
L
= 5 k 640 780 MHz
L
= 5 k 120 150 MHz
L
= 5 k 110 135 MHz
L
= 5 k, RS = 0 100 MHz
L
= 1 k–5 k, RS = 150 210 MHz
L
= 1 k–5 k, RS = 125 210 MHz
L
Slew Rate 2 V Step 750 V/µs
Settling Time to 0.1% 2 V Step 14 ns
DISTORTION/NOISE PERFORMANCE
Differential Gain ƒ = 3.58 MHz, R Differential Phase ƒ = 3.58 MHz, R All Hostile Crosstalk
All Hostile Crosstalk
OFF Isolation
OFF Isolation
6
6
7
7
AD8180R ƒ = 5 MHz, R
ƒ = 30 MHz, R
AD8182R ƒ = 5 MHz, R
ƒ = 30 MHz, R AD8180R ƒ = 5 MHz, R AD8182R ƒ = 5 MHz, R
= 1 k 0.02 0.04 %
L
= 1 k 0.02 0.04 Degrees
L
= 1 k –80 dB
L
= 1 k –65 dB
L
= 1 k –78 dB
L
= 1 k –63 dB
L
= 30 –89 dB
L
= 30 –93 dB
L
Voltage Noise ƒ = 10 kHz–30 MHz 4.5 nV/Hz
Total Harmonic Distortion ƒC = 10 MHz, VO = 2 V p-p, R
DC/TRANSFER CHARACTERISTICS
Voltage Gain
8
V
= ±1 V, RL = 2 k 0.982 V/V
IN
V
= ±1 V, RL = 10 k 0.986 0.993 V/V
IN
= 1 k –78 dBc
L
Input Offset Voltage 112mV
T
MIN
to T
MAX
15 mV
Input Offset Voltage Matching Channel-to-Channel 0.5 4 mV
Input Offset Drift 11 µV/°C Input Bias Current 15 µA
T
MIN
to T
MAX
7 µA
Input Bias Current Drift 12 nA/°C
INPUT CHARACTERISTICS
Input Resistance 1 2.2 M
Input Capacitance Channel Enabled (R Package) 1.5 pF
Channel Disabled (R Package) 1.5 pF
Input Voltage Range ±3.3 V
OUTPUT CHARACTERISTICS
Output Voltage Swing R
= 500
L
9
±3.0 ±3.1 V
Short Circuit Current 30 mA
Output Resistance Enabled 27
Disabled 1 10 M
Output Capacitance Disabled (R Package) 1.7 pF
POWER SUPPLY
Operating Range ±4 ±6V
Power Supply Rejection Ratio +PSRR +VS = +4.5 V to +5.5 V, –VS = –5 V 54 57 dB
Power Supply Rejection Ratio –PSRR –VS = –4.5 V to –5.5 V, +VS = +5 V 45 51 dB
Quiescent Current All Channels “ON” 3.8/6.8 4.5/8 mA
T
MIN
to T
MAX
4.75/8.5 mA All Channels “OFF” 1.3/2 2/3 mA T
MIN
to T
MAX
2/3 mA
AD8182, One Channel “ON” 4 mA
OPERATING TEMPERATURE RANGE –40 +85 °C
REV. B–2–
NOTES
WARNING!
ESD SENSITIVE DEVICE
AD8180/AD8182
1
ENABLE pin is grounded. IN0 = +1 V dc, IN1 = –1 V dc. SELECT input is driven with 0 V to +5 V pulse. Measure transition time from 50% of the SELECT input value (+2.5 V) and 10% (or 90%) of the total output voltage transition from IN0 channel voltage (+1 V) to IN1 (–1 V), or vice versa.
2
ENABLE pin is driven with 0 V to +5 V pulse (with 3 ns edges). State of SELECT input determines which channel is activated (i.e., if SELECT = Logic 0, IN0 is selected). Set IN0 = +1 V dc, IN1 = –1 V dc, and measure transition time from 50% of ENABLE pulse (+2.5 V) to 90% of the total output voltage change. In Figure 5, ∆t time,
3
All inputs are grounded. SELECT input is driven with 0 V to +5 V pulse. The outputs are monitored. Speeding the edges of the SELECT pulse increases the glitch magnitude due to coupling via the ground plane. Removing the SELECT input termination will lower glitch, as does increasing R
4
Decreasing RL lowers the bandwidth slightly. Increasing CL lowers the bandwidth considerably (see Figure 19).
5
A resistor (RS) placed in series with the mux inputs serves to optimize 0.1 dB flatness, but is not required. Increasing output capacitance will increase peaking and reduce band­width (see Figure 20.)
6
Select input which is not being driven (i.e., if SELECT is Logic 1, input activated is IN1); drive all other inputs with V R
7
Mux is disabled (i.e., ENABLE = Logic 1) and all inputs are driven simultaneously with VIN = 0.446 V rms. Output is monitored at ƒ = 5 and 30 MHz. RL = 30 to simulate R ance determines the crosstalk.
8
Voltage gain decreases for lower values of R (i.e., the voltage gain is approximately 0.97 V/V (3% gain error) for R
9
Larger values of RL provide wider output voltage swings, as well as better gain accuracy. See Note 8.
Specifications subject to change without notice.

ABSOLUTE MAXIMUM RATINGS

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Internal Power Dissipation
is the enable time.
∆tON
.
L
= 0.707 V rms and monitor output at ƒ = 5 and 30 MHz.
= 1 k (see Figure 13).
L
of one enabled mux within a system (see Figure 14). In this mode the output impedance is very high (typ 10 M), and the signal couples across the package; the load imped-
ON
. The resistive divider formed by the mux enabled output resistance (27 ) and R
L
1
2
AD8180 8-Lead Plastic DIP (N) . . . . . . . . . . . . . . . . 1.3 Watts
AD8180 8-Lead Small Outline (R) . . . . . . . . . . . . . . 0.9 Watts
= 1 k).
L
While the AD8180 and AD8182 are internally short circuit protected, this may not be sufficient to guarantee that the maxi-
mum junction temperature (+150°C) is not exceeded under all
conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves shown in Figures 2 and 3.
IN
causes a gain which decreases as RL decreases
L
AD8182 14-Lead Plastic DIP (N) . . . . . . . . . . . . . . . 1.6 Watts
AD8182 14-Lead Small Outline (R) . . . . . . . . . . . . . 1.0 Watts
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±V
Output Short Circuit Duration . . . . . Observe Power Derating Curves
Storage Temperature Range
S
2.0 8-LEAD PLASTIC DIP PACKAGE
TJ = +1508C
1.5
N and R Package . . . . . . . . . . . . . . . . . . . . . . –65°C to +125°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2
Specification is for device in free air: 8-Lead Plastic DIP Package: θJA = 90°C/W;
8-Lead SOIC Package: θ 14-Lead SOIC Package: θJA = 120°C/W, where P
= 155°C/W; 14-Lead Plastic Package: θJA = 75°C/W;
JA
= (TJ–T
D
)/θ
.
A
JA

ORDERING GUIDE

Temperature Package Package
Model Range Description Option
1.0
0.5
MAXIMUM POWER DISSIPATION – Watts
0 –50 90–40 –30 –20 –10 0 10 20 30 50 60 70 8040
8-LEAD SOIC PACKAGE
AMBIENT TEMPERATURE – 8C
Figure 2. AD8180 Maximum Power Dissipation vs. Temperature
AD8180AN –40°C to +85°C 8-Lead Plastic DIP N-8 AD8180AR –40°C to +85°C 8-Lead SOIC SO-8 AD8180AR-REEL –40°C to +85°C 13" Reel SOIC SO-8 AD8180AR-REEL7 –40°C to +85°C 7" Reel SOIC SO-8 AD8182AN –40°C to +85°C 14-Lead Plastic DIP N-14 AD8182AR –40°C to +85°C 14-Lead Narrow SOIC R-14 AD8182AR-REEL –40°C to +85°C 13" Reel SOIC R-14
2.5
2.0
TJ = +1508C
14-LEAD PLASTIC DIP PACKAGE
AD8182AR-REEL7 –40°C to +85°C 7" Reel SOIC R-14
AD8180-EB Evaluation Board AD8182-EB Evaluation Board
1.5
is the disable
OFF

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the
14-LEAD SOIC
1.0
AD8180 and AD8182 is limited by the associated rise in junc­tion temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition
temperature of the plastic, approximately +150°C. Exceeding
this limit temporarily may cause a shift in parametric perfor­mance due to a change in the stresses exerted on the die by the
package. Exceeding a junction temperature of +175°C for an
MAXIMUM POWER DISSIPATION – Watts
0.5
–50 90–40
–30 –20 –10 0 10 20 30 40 50 60 80
AMBIENT TEMPERATURE – 8C
Figure 3. AD8182 Maximum Power Dissipation vs. Temperature
extended period can result in device failure.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8180/AD8182 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
REV. B
–3–
70
AD8180/AD8182–Typical Performance Curves
–7
0
–1
–2
–3
–4
–5
–6
VIN = 50mV rms RL = 5kV RS = 0V
1
NORMALIZED OUTPUT – dB
8180R
8182R
1M 10M 100M 1G
FREQUENCY – Hz
500mV
/DIV
5ns/DIV
Figure 4. Channel Switching Characteristics
DUT OUT
250mV
/DIV
10ns/DIV
Figure 5. Enable and Disable Switching Characteristics
50mV
/DIV
25ns/DIV
Figure 6. Channel Switching Transient (Glitch)
–4–
Figure 7. Small Signal Frequency Response
VIN = 50mV rms R
= 5kV
L
= 0V
R
S
1.0
0.8
0.6
0.4
0.2
0.0
NORMALIZED FLATNESS – dB
–0.2
–0.4
1M 10M 100M 1G
FREQUENCY – Hz
8180R
8182R
Figure 8. Gain Flatness vs. Frequency
3
RL = 1kV
0
–3
–6 –9
–12 –15 –18
INPUT/OUTPUT LEVEL – dBV
–21 –24 –27
1M 1G10M 100M
VIN = 1.0V rms
VIN = 0.5V rms
VIN = 0.25V rms
VIN = 125mV rms
VIN = 62.5mV rms
FREQUENCY – Hz
Figure 9. Large Signal Frequency Response
REV. B
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