ANALOG DEVICES AD8128 Service Manual

CAT-5 Receiver with
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FEATURES

Tuned to compensate for Category-5 (CAT-5) cable losses
Up to 100 meters @ 120 MHz
2 voltage-controlled frequency response adjustment pins
High frequency peaking adjustment
Broadband gain adjustment 2700 V/μs slew rate Low output noise
1.5 mV rms integrated noise (1 GHz) @ 100 meters zed bandwidth
equali
DC output offset adjust
Low offset voltage error: 7 mV typ Equalized pass-band ripple ±1 dB to 70 MHz Input: differential or single ended Supply current: 24 mA on ±5 V Small 8-lead 3 mm × 3 mm LFCSP

APPLICATIONS

Keyboard-video-mouse (KVM) RGB video over unshielded twisted pair (UTP) cable receivers Professional video projection and distribution Security video
Adjustable Line Equalization
AD8128

FUNCTIONAL BLOCK DIAGRAM

V
OFFSET
AD8128
V
OUT
05699-001
HPF
V
IN+
V
PEAK
V
HPF
LPF
GAIN
Figure 1.
V
IN–

GENERAL DESCRIPTION

The AD8128 is a high speed, differential receiver/equalizer that compensates for the transmission losses of unshielded twisted pair (UTP) CAT-5 cables. Various frequency dependent gain stages are summed together to best approximate the inverse frequency response of CAT-5/CAT-5e cable. An equalized bandwidth of 120 MHz can be achieved for 100 meters of cable.
The AD8128 can be used as a standalone receiver/equalizer or in con
junction with the AD8143, triple differential receiver, to provide a complete low cost solution for receiving RGB over UTP cable in such applications as KVM.
The AD8128 has three control pins for optimal CAT-5/CAT-5e co
mpensation. The equalized cable length is directly proportional to the voltage applied to the V amount of high frequency peaking. V gain from 0 dB to 3 dB, compensating for the resistive cable loss. V
allows the output to be shifted by ±2.5 V, adding
OFFSET
flexibility for dc-coupled systems.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
pin, which controls the
PEAK
adjusts the broadband
GAIN
Low integrated output noise and offset voltage adjust make the AD8128 a
n excellent choice for dc-coupled wideband RGB­over-CAT-5 applications. For systems where the UTP cable is longer than 100 meters, two AD8128s can be cascaded to compensate for up to 200 meters of CAT-5/CAT-5e.
The AD8128 is available in a 3 mm × 3 mm 8-lead LFCSP and
ted to operate over the extended temperature range of
is ra
−40°C to +85°C.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved.
AD8128
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TABLE OF CONTENTS

Features .............................................................................................. 1
Theory of Operation .........................................................................9
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Typical Performance Characteristics ............................................. 6
Test Cir c ui t .................................................................................... 8

REVISION HISTORY

10/05—Revision 0: Initial Version
Input Common-Mode Voltage Range Considerations ............9
Applications..................................................................................... 10
KVM Applications ..................................................................... 10
DC Control Pins......................................................................... 10
Cascaded Applications............................................................... 11
Exposed Pad (EP)....................................................................... 11
Layout and Power Supply Decoupling Considerations......... 11
Evaluation Boards ...................................................................... 11
Outline Dimensions ....................................................................... 12
Ordering Guide .......................................................................... 12
Rev. 0 | Page 2 of 12
AD8128
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SPECIFICATIONS

TA = 25°C, VS = ±5 V, RL = 150 Ω, Belden Cable, V
Table 1.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
–3 dB Large Signal Bandwidth V ±1 dB Equalized Bandwidth Flatness V Rise/Fall Time V Rise/Fall Time V Settling Time to 2% V Settling Time to 2% V Integrated Output Voltage Noise V
DC PERFORMANCE
Input Bias Current 15.5 24 μA V
Pin Current 1.7 8.2 μA
OFFSET
V
Pin Current 2 3.4 μA
GAIN
V
Pin Current 4.2 6.8 μA
PEAK
INPUT CHARACTERISTICS
Input Differential Voltage ±2.8 V Input Common-Mode Voltage ±3.0 V Input Resistance Common mode 380 kΩ Differential 675 kΩ Input Capacitance 1.7 pF Common-Mode Rejection Ratio (CMRR) 200 kHz, ΔV
ADJUSTMENT PINS
V
Input Voltage Relative to ground 0 1 V
PEAK
Maximum Peak Gain @ 120 MHz, V V
Input Relative to ground 0 1 V
GAIN
Maximum Broadband Gain V V
Input Range Relative to ground ±2.5 V
OFFSET
V
to V
OFFSET
OUT
Gain
OUTPUT CHARACTERISTICS
Output Voltage Swing −2.55 +2.7 V Output Offset Voltage V Output Offset Voltage Drift −5.5 μV/°C Short-Circuit Output Current 100 mA
POWER SUPPLY
Operating Voltage Range ±4.5 ±5.5 V Quiescent Supply Current, ICC/I Supply Current Drift, ICC/I
EE
EE
+Power Supply Rejection Ratio (PSRR) RTO −48 −59 dB
−Power Supply Rejection Ratio (PSRR) RTO −48 −61 dB
TEMPERATURE RANGE −40 +85 °C
= 0 V, V
OFFSET
= 2 V p-p, 100 meter CAT-5 120 MHz
OUT
= 2 V p-p 70 MHz
OUT
= 2 V step, 50 meter CAT-5 2 ns
OUT
= 2 V step, 100 meter CAT-5 3.6 ns
OUT
= 2 V step, 50 meter CAT-5 26 ns
OUT
= 2 V step, 100 meter CAT-5 36.4 ns
OUT
= 0.9 V, V
PEAK
= 1 V 3 dB
GAIN
= 0 V, RTO −10.9 +7 +18.7 mV
OFFSET
and V
GAIN
= 225 mV, BW = 1 GHz 1.5 mV rms
GAIN
/ΔV
OUT
IN, cm
= 1 V 20 dB
PEAK
set to optimized settings (see Figure 4), unless otherwise noted.
PEAK
−63 −74 dB
1 V/V
@ ±5 V +24/−21 +31/−27 mA +86/−77 μA/°C
Rev. 0 | Page 3 of 12
AD8128
A
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ABSOLUTE MAXIMUM RATINGS

Table 2.
Parameter Rating
Supply Voltage ±5.5 V Input Voltage ±V V V
PEAK
OFFSET
and V
Control Pins −3 V to +V
GAIN
Control Pins ±V
S
S
S
Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +125°C Lead Temperature (Soldering 10 sec) 300°C Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type θ
JA
8-Lead LFCSP 77 14 °C/W

Maximum Power Dissipation

θ
JC
Unit
The power dissipated in the package (P quiescent power dissipation and the power dissipated in the package due to the load drive for the output. The quiescent power is the voltage between the supply pins (V quiescent current (I drive depends upon the particular application. For each output, the power due to load drive is calculated by multiplying the load current by the associated voltage drop across the
Airflow increases heat dissipation, effectively reducing θ more metal directly in contact with the package leads from metal traces, through-holes, ground, and power planes reduces the θ
. The exposed paddle on the underside of the package
JA
must be soldered to a pad on the PCB surface, which is thermally connected to a copper plane to achieve the specified θ
Figure 2 shows the maximum safe power dissipation in the
ackage vs. the ambient temperature for the 8-lead LFCSP
p (48.5°C/W) on a JEDEC standard 4-layer board with the underside paddle soldered to a pad that is thermally connected to a PCB plane. Extra thermal relief is required for operation at high supply voltages.
3.0
2.5
TION (W)
2.0
1.5
The maximum safe power dissipation in the AD8128 package is limited by the associated rise in junction temperature (T
) on
J
1.0
the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even
0.5
MAXIMUM POWER DISSIP
temporarily exceeding this temperature limit can change the stresses that the package exerts on the die, permanently shifting the parametric performance of the AD8128. Exceeding a junction temperature of 150°C for an extended period can
0
–30–40 –10–20 1003020 5040 7060 9080 110100 130120
Figure 2. Maximum Power Dissipation vs. Temperature
result in changes in the silicon devices potentially causing failure.
). The power dissipated due to the load
S
AMBIENT T EMPERATURE (°C)
) is the sum of the
D
) times the
S
. Also,
JA
.
JA
05699-020

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 4 of 12
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