Compensates cables to 200 meters for wideband video
All resolutions through UXGA
Fast rise and fall times
8 ns with 2 V step @ 200 meters of UTP cable
37 dB peak gain at 100 MHz
Two frequency response gain adjustment pins
High frequency peaking adjustment (V
Broadband flat gain adjustment (V
Pole location adjustment pin (V
POLE
)
Compensates for variations between cables
Can be optimized for either UTP or coaxial cable
DC output offset adjust (V
OFFSET
)
Low output offset voltage: 24 mV
Compensates both RGB and YPbPr
Two on-chip comparators with hysteresis
Can be used for common-mode sync extraction
Available in 40-lead, 6 mm × 6 mm LFCSP
APPLICATIONS
Keyboard-video-mouse (KVM)
Digital signage
RGB video over UTP cables
Professional video projection and distribution
HD video
Security video
GENERAL DESCRIPTION
The AD8124 is a triple, high speed, differential receiver and
equalizer that compensates for the transmission losses of UTP
and coaxial cables up to 200 meters in length. Various gain stages
are summed together to best approximate the inverse frequency
response of the cable. Logic circuitry inside the AD8124 controls
the gain functions of the individual stages so that the lowest
noise can be achieved at short-to-medium cable lengths. This
technique optimizes its performance for low noise, short-tomedium range applications, while at the same time provides
the high gain bandwidth required for longer cable equalization
(up to 200 meters). Each channel features a high impedance
differential input that is ideal for interfacing directly with the cable.
GAIN
)
PEAK
)
AD8124
FUNCTIONAL BLOCK DIAGRAM
PEAKVPOLEVOFFSETVGAIN
AD8124
–IN
R
+IN
R
–IN
G
+IN
G
–
IN
B
+IN
B
–IN
CMP1
+IN
CMP1
–IN
CMP2
+IN
CMP2
Figure 1.
The AD8124 has three control pins for optimal cable
compensation, as well as an output offset adjust pin. Two
voltage-controlled pins are used to compensate for different
cable lengths; the V
peaking and the V
pin controls the amount of high frequency
PEAK
pin adjusts the broadband flat gain, which
GAIN
compensates for the low frequency flat cable loss.
For added flexibility, an optional pole adjustment pin, V
allows movement of the pole locations, allowing for the
compensation of different gauges and types of cable as well
as variations between different cables and/or equalizers. The
V
pin allows the dc voltage at the output to be adjusted,
OFFSET
adding flexibility for dc-coupled systems.
The AD8124 is available in a 6 mm × 6 mm, 40-lead LFCSP
and is rated to operate over the extended temperature range of
−40°C to +85°C.
OUT
OUT
OUT
OUT
OUT
R
G
B
CMP1
CMP2
POLE
09601-001
,
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
TA = 25°C, VS = ±5 V, RL = 150 Ω, Belden Cable (BL-7987R), V
Figure 16, unless otherwise noted.
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit
DYNAMIC PERFORMANCE
10% to 90% Rise/Fall Time V
Settling Time to 2% V
–3 dB Large Signal Bandwidth V
V
= 2 V step, 200 meters Cat-5 8 ns
OUT
= 2 V step, 200 meters Cat-5 47 ns
OUT
= 2 V p-p, <10 meters Cat-5 110 MHz
OUT
= 2 V p-p, 200 meters Cat-5 52 MHz
OUT
Integrated Output Voltage Noise 200 meter setting, integrated to 160 MHz 4 mV rms
INPUT DC PERFORMANCE
Input Voltage Range −IN and +IN ±3.0 V
Maximum Differential Voltage Swing 4 V p-p
Voltage Gain ΔVO/ΔVI, V
Common-Mode Rejection Ratio (CMRR) At dc, V
At dc, V
At 1 MHz, V
GAIN
= V
PEAK
= 1.15 V, V
PEAK
PEAK
Input Resistance Common mode 4.4 MΩ
Differential 3.7 MΩ
Input Capacitance Common mode 1.0 pF
Differential 0.5 pF
Input Bias Current 2.4 μA
V
Pin Current 30 μA
OFFSET
V
Pin Current 0.5 μA
GAIN
V
Pin Current 0.4 μA
PEAK
V
Pin Current 0.4 μA
POLE
ADJUSTMENT PINS
V
Input Voltage Range Relative to GND 0 to 1.5 V
PEAK
V
Input Voltage Range Relative to GND 0 to 1.5 V
POLE
V
Input Voltage Range Relative to GND 0 to 1.5 V
GAIN
V
to OUT Gain OUT/V
OFFSET
Maximum Flat Gain V
GAIN
, range limited by output swing 1 V/V
OFFSET
= 1.5 V 1.9 dB
OUTPUT CHARACTERISTICS
Output Voltage Swing 150 Ω load −3.75 to +3.69 V
1 kΩ load −3.66 to +3.69 V
Output Offset Voltage Referred to output, V
Referred to output, V
= 1.5 V
V
POLE
Output Offset Voltage Drift Referred to output 33 μV/°C
POWER SUPPLY
Operating Voltage Range ±4.5 ±5.5 V
Positive Quiescent Supply Current 132 mA
Negative Quiescent Supply Current 126 mA
Supply Current Drift, ICC/IEE 80 μA/°C
Positive Power Supply Rejection Ratio DC, referred to output −51 dB
Negative Power Supply Rejection Ratio DC, referred to output −63 dB
Power Down, VIH (Minimum) Minimum Logic 1 voltage 1.1 V
Power Down, VIL (Maximum) Maximum Logic 0 voltage 0.8 V
Positive Supply Current, Powered Down V
Negative Supply Current, Powered Down V
PEAK
PEAK
= V
= V
GAIN
GAIN
= V
= V
OFFSET
= 0 V, V
PEAK
, V
GAIN
, and V
are set to recommended settings shown in
POLE
set for 0 meters of cable 1 V/V
= V
GAIN
= 1.15 V, V
POLE
POLE
= 0 V −86 dB
POLE
= 1.4 V, V
GAIN
GAIN
= V
PEAK
= 1.15 V, V
PEAK
= 1.4 V, V
GAIN
= 1.5 V −65 dB
POLE
= 1.5 V −50 dB
POLE
= V
= 0 V 24 mV
POLE
= 1.4 V,
GAIN
37 mV
= 0 V 1.1 μA
= 0 V 0.7 μA
Rev. 0 | Page 3 of 16
AD8124
Parameter Test Conditions/Comments Min Typ Max Unit
COMPARATORS
Output Voltage Levels VOH/V
Hysteresis V
Propagation Delay t
Rise/Fall Times t
OL
HYST
PD, LH/tPD, HL
RISE/tFALL
Output Resistance 0.03 Ω
OPERATING TEMPERATURE RANGE −40 +85 °C
3.33/0.043 V
70 mV
17.5/10.0 ns
9.3/9.3 ns
Rev. 0 | Page 4 of 16
AD8124
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage 11 V
Power Dissipation See Figure 2
Input Voltage (Any Input) VS− − 0.3 V to VS+ + 0.3 V
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions; that is, θJA is
specified for the device soldered in a circuit board in still air.
voltage difference between the associated power supply and the
output voltage. The total power dissipation due to load currents
is then obtained by taking the sum of the individual power
dissipations. RMS output voltages must be used when dealing
with ac signals.
Airflow reduces θ
. In addition, more metal directly in contact
JA
with the package leads from metal traces, through holes, ground,
and power planes reduces the θ
. The exposed paddle on the
JA
underside of the package must be soldered to a pad on the PCB
surface that is thermally connected to a solid plane (usually the
ground plane) to achieve the specified θ
.
JA
Figure 2 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 40-lead LFCSP
(29°C/W) on a JEDEC standard 4-layer board with the underside
paddle soldered to a pad that is thermally connected to a PCB
plane. θ
values are approximations.
JA
7
6
5
Table 3. Thermal Resistance with the Underside Pad
Connected to the Plane
Package Type/PCB Type θJA Unit
40-Lead LFCSP/4-Layer 29 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8124 package
is limited by the associated rise in junction temperature (T
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the AD8124. Exceeding a junction temperature
of 175°C for an extended time can result in changes in the
silicon devices, potentially causing failure.
The power dissipated in the package (P
) is the sum of the
D
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
quiescent current (I
). The power dissipation due to each load
S
) times the
S
current is calculated by multiplying the load current by the
) on
J
4
3
2
MAXIMUM POWER DISSIPATION (W)
1
0
–40–20020406080
AMBIENT TEMPERATURE (°C)
Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
09601-003
Rev. 0 | Page 5 of 16
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