600 fA/√Hz @ 100 kHz
Low Input Bias Current: 750 nA Max
Low Distortion
–90 dB SFDR @ 1 MHz
–65 dB SFDR @ 5 MHz
Wide Supply Range: 3 V to 12 V
Small Packaging: SOT-23-8, SC70-5, and SOIC-8
APPLICATIONS
Battery-Powered Instrumentation
Filters
A/D Drivers
Level Shifting
Buffering
High Density PC Boards
Photo Multipliers
PRODUCT DESCRIPTION
The AD8038 (single) and AD8039 (dual) amplifiers are high
speed (350 MHz) voltage feedback amplifiers with an exceptionally low quiescent current of 1.0 mA/amplifier typical (1.5 mA max).
The AD8038 single amplifier in the SOIC-8 package has a disable feature. Despite being low power and low cost, the amplifier
provides excellent overall performance. Additionally, it offers
ahigh slew rate of 425 V/µs and low input offset voltage of
3mVmax.
ADI’s proprietary XFCB process allows low noise operation
(8 nV/√Hz and 600 fA/√Hz) at extremely low quiescent currents.
Given a wide supply voltage range (3 V to 12 V), wide bandwidth, and small packaging, the AD8038 and AD8039 amplifiers
are designed to work in a variety of applications where power and
space are at a premium.
The AD8038 and AD8039 amplifiers have a wide input commonmode range of 1 V from either rail and will swing within 1 V of
each rail on the output. These amplifiers are optimized for driving
CONNECTION DIAGRAMS
SOIC-8 (R)
SC70-5 (KS)
AD8038
V
1
OUT
2
–V
S
3
+IN
+–
+V
5
S
–IN
4
SOIC-8 (R) and SOT-23-8 (RT)
V
OUT1
–IN1
+IN1
–V
AD8039
1
2
3
4
S
8
+V
S
7
V
OUT2
6
–IN2
5
+IN2
capacitive loads up to 15 pF. If driving larger capacitive loads,
a small series resistor is needed to avoid excessive peaking or
overshoot.
The AD8039 amplifier is the only dual, low power, high
speed
amplifier available in a tiny SOT-23-8 package, and the single
AD8038 is available in both a SOIC-8 and an SC70-5 package.
These amps are rated to work over the industrial temperature
range of –40°C to +85°C.
24
G = +10
21
18
15
G = +5
12
9
G = +2
GAIN – dB
6
3
G = +1
0
–3
–6
0.11000110100
FREQUENCY – MHz
REV. F
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Figure 1. Small Signal Frequency Response for
Various Gains, V
Operating Temperature Range . . . . . . . . . . . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . . 300°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8038/AD8039
package is limited by the associated rise in junction temperature
) on the die. The plastic encapsulating the die will locally reach
(T
J
the junction temperature. At approximately 150°C, which is the
glass transition temperature, the plastic will change its properties.
Even temporarily exceeding this temperature limit may change the
stresses that the package exerts on the die, permanently shifting the
parametric performance of the AD8038/AD8039. Exceeding a
junction temperature of 175°C for an extended period of time can
result in changes in the silicon devices, potentially causing failure.
The still-air thermal properties of the package and PCB (
ambient temperature (T
) determine the junction temperature of the die. The junction
(P
D
), and total power dissipated in the package
A
),
JA
temperature can be calculated as follows:
TT P
=+ ×
ADAJ
θ
()
J
The power dissipated in the package (PD) is the sum of the quiescent
power dissipation and the power dissipated in the package due to the
load drive for all outputs. The quiescent power is the voltage between
the supply pins (V
ing the load (R
/2 ⫻ I
is V
S
in the load (V
) multiplied by the quiescent current (IS). Assum-
S
) is referenced to midsupply, then the total drive power
L
some of which is dissipated in the package and some
OUT,
⫻ I
OUT
). The difference between the total drive
OUT
power and the load power is the drive power dissipated in the package.
= quiescent power + (total drive power – load power)
P
D
PVI V/V/R– V/R
=×
[]
DSS S OUTLOUTL
+
[]
×
2
()
()
2
[]
ORDERING GUIDE
2.0
1.5
SOIC-8
1.0
0.5
MAXIMUM POWER DISSIPATION – W
0
–55
SOT-23-8
SC70-5
–255356595125
AMBIENT TEMPERATURE – ⴗC
Figure 2. Maximum Power Dissipation vs.
Temperature for a 4-Layer Board
RMS output voltages should be considered. If RL is referenced to VS–,as
⫻ I
in single-supply operation, then the total drive power is V
S
OUT
.
If the rms signal levels are indeterminate, consider the worst case,
when V
= VS /4 for RL to midsupply:
OUT
PVI V/4 /R
=×
()
DSS S2L
+
()
In single-supply operation with RL referenced to VS–, worst case is
= VS /2.
V
OUT
Airflow will increase heat dissipation, effectively reducing
. Also,
JA
more metal directly in contact with the package leads from metal
traces, through-holes, ground, and power planes will reduce the
.
JA
Care must be taken to minimize parasitic capacitances at the input
leads of high speed op amps as discussed in the board layout section.
Figure 2 shows the maximum safe power dissipation in the package
versus the ambient temperature for the SOIC-8 (125°C/W), SC70-5
(210°C/W), and SOT-23-8 (160°C/W) package on a JEDEC standard
4-layer board.
values are approximations.
JA
OUTPUT SHORT CIRCUIT
Shorting the output to ground or drawing excessive current from
the AD8038/AD8039 will likely cause a catastrophic failure.
ModelTemperature RangePackage DescriptionPackage OutlineBranding Information
AD8038AR–40°C to +85°C8-Lead SOICR-8
AD8038AR-REEL–40°C to +85°C8-Lead SOICR-8
AD8038AR-REEL7–40°C to +85°C8-Lead SOICR-8
AD8038AKS-R2–40°C to +85°C5-Lead SC70KS-5HUA
AD8038AKS-REEL–40°C to +85°C5-Lead SC70KS-5HUA
AD8038AKS-REEL7–40°C to +85°C5-Lead SC70KS-5HUA
AD8039AR–40°C to +85°C8-Lead SOICR-8
AD8039AR-REEL–40°C to +85°C8-Lead SOICR-8
AD8039AR-REEL7–40°C to +85°C8-Lead SOICR-8
AD8039ART-R2–40°C to +85°C8-Lead SOT-23RT-8HYA
AD8039ART-REEL–40°C to +85°C8-Lead SOT-23RT-8HYA
AD8039ART-REEL7–40°C to +85°C8-Lead SOT-23RT-8HYA
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8038/AD8039 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–4–
REV. F
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