The AD8033/AD8034 FastFET amplifiers are voltage feedback
amplifiers with FET inputs, offering ease of use and excellent
performance. The AD8033 is a single amplifier and the
AD8034 is a dual amplifier. The AD8033/AD8034 FastFET
op amps in ADI’s proprietary XFCB process offer significant
performance improvements over other low cost FET amps, such as
low noise (11 nV/
bandwidth and 80 V/µs slew rate).
With a wide supply voltage range from 5 V to 24 V and fully
operational on a single supply, the AD8033/AD8034 amplifiers
will work in more applications than similarly priced FET
input amps.
outputs for added versatility.
Despite their low cost, the amplifiers provide excellent overall
performance. They offer high common-mode rejection of
–100 dB, low input offset voltage of 2 mV max, and low noise
of 11 nV/
The
quiescent
√
AD8033/AD8034
40 mA of load current.
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
√
Hz and 0.6 fA/√Hz) and high speed (80 MHz
In addition, the
Hz.
AD8033/AD8034
have rail-to-rail
amplifiers only draw 3.3 mA/amplifier of
current while having the capability of delivering up to
Figure 1. Small Signal Frequency Response
The AD8033 is available in small packages: SOIC-8 and SC70.
The AD8034 is also available in small packages: SOIC-8 and
SOT-23-8. They are rated to work over the industrial temperature
range of –40°C to +85°C without a premium over commercial
grade products.
(TA = 25ⴗC, VS = ⴞ5 V, RL = 1 k⍀, Gain = +2, unless otherwise noted.)
ParameterConditionsMinTypMaxUnit
DYNAMIC PERFORMANCE
–3 dB BandwidthG = +1, VO = 0.2 V p-p6580MHz
G = +2, V
G = +2, V
= 0.2 V p-p30MHz
O
= 2 V p-p21MHz
O
Input Overdrive Recovery Time–6 V to +6 V Input135ns
Output Overdrive Recovery Time–3 V to +3 V Input, G = +2135ns
Slew Rate (25% to 75%)G = +2, V
Settling Time to 0.1%G = +2, V
= 4 V Step5580V/µs
O
= 2 V Step95ns
O
G = +2, VO = 8 V Step225ns
NOISE/HARMONIC PERFORMANCE
Distortionf
Second HarmonicR
Third HarmonicR
= 1 MHz, VO = 2 V p-p
C
= 500 Ω–82dBc
L
= 1 kΩ–85dBc
R
L
= 500 Ω–70dBc
L
R
= 1 kΩ–81dBc
L
Crosstalk, Output-to-Outputf = 1 MHz, G = +2–86dB
Input Voltage Noisef = 100 kHz11nV/√Hz
Input Current Noisef = 100 kHz0.7fA/√Hz
DC PERFORMANCE
Input Offset VoltageVCM = 0 V12mV
– T
T
MIN
MAX
Input Offset Voltage Match2.5mV
Input Offset Voltage Drift427µV/
3.5mV
o
C
Input Bias Current1.511pA
T
MIN
– T
MAX
50pA
Open-Loop GainVO = ±3 V8992dB
INPUT CHARACTERISTICS
Common-Mode Input Impedance1000||2.3GΩ||pF
Differential Input Impedance1000||1.7GΩ||pF
Input Common-Mode Voltage Range
FET Input Range–5.0 to +2.2V
Usable Input Range–5.0 to +5.0V
Common-Mode Rejection RatioVCM = (–3 V to +1.5 V)–89–100dB
OUTPUT CHARACTERISTICS
Output Voltage Swing±4.75±4.95V
Output Short Circuit Current40mA
Capacitive Load Drive30% Overshoot, G = +1,35pF
VO = 400 mV p-p
POWER SUPPLY
Operating Range524V
Quiescent Current per Amplifier3.33.5mA
Power Supply Rejection RatioVS = ±2 V–90–100dB
Specifications subject to change without notice.
REV. B–2–
AD8033/AD8034
SPECIFICATIONS
(TA = 25ⴗC, VS = 5 V, RL = 1 k⍀, Gain = +2, unless otherwise noted.)
ParameterConditionsMinTypMaxUnit
DYNAMIC PERFORMANCE
–3 dB BandwidthG = +1, VO = 0.2 V p-p7080MHz
G = +2, V
G = +2, V
= 0.2 V p-p32MHz
O
= 2 V p-p21MHz
O
Input Overdrive Recovery Time–3 V to +3 V Input180ns
Output Overdrive Recovery Time–1.5 V to +1.5 V Input, G = +2200ns
Slew Rate (25% to 75%)G = +2, V
= 4 V Step5570V/µs
O
Settling Time to 0.1%G = +2, VO = 2 V Step100ns
NOISE/HARMONIC PERFORMANCE
DistortionfC = 1 MHz, VO = 2 V p-p
Second HarmonicR
Third HarmonicR
= 500 Ω–80dBc
L
= 1 kΩ–84dBc
R
L
= 500 Ω–70dBc
L
= 1 kΩ–80dBc
R
L
Crosstalk, Output to Outputf = 1 MHz, G = +2–86dB
Input Voltage Noisef = 100 kHz11nV/√Hz
Input Current Noisef = 100 kHz0.7fA/√Hz
DC PERFORMANCE
Input Offset VoltageVCM = 0 V12.0mV
– T
T
MIN
MAX
Input Offset Voltage Match2.5mV
Input Offset Voltage Drift430µV/
3.5mV
o
C
Input Bias Current110pA
T
MIN
– T
MAX
50pA
Open-Loop GainVO = 0 V to 3 V8792dB
INPUT CHARACTERISTICS
Common-Mode Input Impedance1000||2.3GΩ||pF
Differential Input Impedance1000||1.7GΩ||pF
Input Common-Mode Voltage Range
FET Input Range0 to 2.0V
Usable Input Range0 to 5.0V
Common-Mode Rejection RatioVCM = 1.0 V to 2.5 V–80–100dB
OUTPUT CHARACTERISTICS
Output Voltage SwingRL = 1 kΩ
0.16 to 4.830.04 to 4.95
V
Output Short Circuit Current30mA
Capacitive Load Drive30% Overshoot, G = +1,25pF
VO = 400 mV p-p
POWER SUPPLY
Operating Range524V
Quiescent Current per Amplifier3.33.5mA
Power Supply Rejection RatioVS = ±1 V–80–100dB
Specifications subject to change without notice.
REV. B
–3–
AD8033/AD8034
SPECIFICATIONS
(TA = 25ⴗC, VS = ⴞ12 V, RL = 1 k⍀, Gain = +2, unless otherwise noted.)
ParameterConditionsMinTypMaxUnit
DYNAMIC PERFORMANCE
–3 dB BandwidthG = +1, VO = 0.2 V p-p6580MHz
G = +2, V
G = +2, V
= 0.2 V p-p30MHz
O
= 2 V p-p21MHz
O
Input Overdrive Recovery Time–13 V to +13 V Input100ns
Output Overdrive Recovery Time–6.5 V to +6.5 V Input, G = +2100ns
Slew Rate (25% to 75%)G = +2, V
Settling Time to 0.1%G = +2, V
= 4 V Step5580V/µs
O
= 2 V Step90ns
O
G = +2, VO = 10 V Step225ns
NOISE/HARMONIC PERFORMANCE
Distortionf
Second HarmonicR
Third HarmonicR
= 1 MHz, VO = 2 V p-p
C
= 500 Ω–80dBc
L
= 1 kΩ–82dBc
R
L
= 500 Ω–70dBc
L
= 1 kΩ–82dBc
R
L
Crosstalk, Output to Outputf = 1 MHz, G = +2–86dB
Input Voltage Noisef = 100 kHz11nV/√Hz
Input Current Noisef = 100 kHz0.7fA/√Hz
DC PERFORMANCE
Input Offset VoltageV
= 0 V12.0mV
CM
– T
T
MIN
MAX
3.5mV
Input Offset Voltage Match2.5mV
Input Offset Voltage Drift424µV/
Input Bias Current212pA
– T
T
MIN
MAX
50pA
Open-Loop GainVO = ±8 V8896dB
INPUT CHARACTERISTICS
Common-Mode Input Impedance1000||2.3GΩ||pF
Differential Input Impedance1000||1.7GΩ||pF
Input Common-Mode Voltage Range
FET Input Range–12.0 to +9.0V
Usable Input Range–12.0 to +12.0V
Common-Mode Rejection RatioVCM = ±5 V–92–100dB
OUTPUT CHARACTERISTICS
Output Voltage Swing±11.52± 11.84V
Output Short Circuit Current60mA
Capacitive Load Drive30% Overshoot; G = +135pF
POWER SUPPLY
Operating Range524V
Quiescent Current per Amplifier3.33.5mA
Power Supply Rejection RatioVS = ±2 V–85–100dB
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
REV. B–4–
AD8033/AD8034
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8033/AD8034
packages is limited by the associated rise in junction temperature
) on the die. The plastic that encapsulates the die will locally
(T
J
reach the junction temperature. At approximately 150°C, which is
the glass transition temperature, the plastic will change its properties. Even temporarily exceeding this temperature limit may change
the stresses that the package exerts on the die, permanently shifting
the parametric performance of the AD8033/AD8034. Exceeding a
junction temperature of 175°C for an extended period of time can
result in changes in silicon devices, potentially causing failure.
The still-air thermal properties of the package and PCB (
ambient temperature (T
package (P
) determine the junction temperature of the die.
D
), and the total power dissipated in the
A
),
JA
The junction temperature can be calculated as follows
TT
=+ ×()Pθ
AD AJJ
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the package
due to the load drive for all outputs. The quiescent power is the
voltage between the supply pins (VS) times the quiescent current (IS).
Assuming the load (R
drive power is VS/2 I
package and some in the load (V
) is referenced to midsupply, then the total
L
some of which is dissipated in the
OUT,
OUT
I
). The difference
OUT
between the total drive power and the load power is the drive
power dissipated in the package:
PQuiescent PowerTotal Drive PowerLoad Power
=+(–)
D
PVI VV R V R
=×
[]
DSS SOUTLOUTL
+
()
[]
×
//–/2
()
2
[]
RMS output voltages should be considered. If RL is referenced
to V
, as in single-supply operation, then the total drive power
S–
I
is V
S
OUT
.
If the rms signal levels are indeterminate, consider the worst
case, when V
= VS/4 for RL to midsupply:
OUT
PVI VR
=×
()
DSS SL
+
//4
()
2
Airflow will increase heat dissipation, effectively reducing
Also, more metal directly in contact with the package leads from
metal traces, through holes, ground, and power planes will reduce
the JA. Care must be taken to minimize parasitic capacitances at
the input leads of high speed op amps as discussed in the Layout,
Grounding, and Bypassing Considerations section.
Figure 2 shows the maximum safe power dissipation in the
package versus the ambient temperature for the SOIC-8 (125°C/W),
SC70
standard 4-layer board.
OUTPUT SHORT CIRCUIT
Shorting the output to ground or drawing excessive current for
the AD8033/AD8034 will likely cause catastrophic failure.
In single-supply operation with RL referenced to VS–, worst case
= VS/2.
is V
OUT
2.0
1.5
SOT-23-8
1.0
SC70-5
0.5
MAXIMUM POWER DISSIPATION – W
0.0
–60–40–20020406080100
SOIC-8
AMBIENT TEMPERATURE – C
Figure 2. Maximum Power Dissipation vs.
Temperature for a Four-Layer Board
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD8033/AD8034 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
–40ºC to
–40ºC to
–40ºC to
–40ºC to
–40ºC to
–40ºC to
–40ºC to
–40ºC to
–40ºC to
–40ºC to