Mobile communications
Instrumentation and control systems
Data acquisition systems
High speed modems
Optical sensors
GENERAL DESCRIPTION
of 2.35 V to 5.25 V
DD
10-/12-Bit ADCs in 6-Lead SC70
AD7910/AD7920
FUNCTIONAL BLOCK DIAGRAM
V
DD
10-/12-BIT
V
T/H
IN
PRODUCT HIGHLIGHTS
SUCCESSIVE
APPROXIMATION
ADC
CONTROL LOGIC
AD7910/AD7920
GND
Figure 1.
SCLK
SDATA
CS
02976-001
The AD7910/AD79201 are, respectively, 10-bit and 12-bit, high
speed, low power, successive approximation ADCs. The parts
operate from a single 2.35 V to 5.25 V power supply and feature
throughput rates up to 250 kSPS. The parts contain a low noise,
wide bandwidth track-and-hold amplifier that can handle input
frequencies in excess of 13 MHz.
The conversion process and data acquisition are controlled
CS
using
and the serial clock, allowing the devices to interface
with microprocessors or DSPs. The input signal is sampled on
the falling edge of
CS
and the conversion is initiated at this
point. There are no pipeline delays associated with the part.
The AD7910/AD7920 use advanced design techniques to
achieve very low power dissipation at high throughput rates.
The reference for the part is taken internally from V
DD
. This
allows the widest dynamic input range to the ADC. Thus, the
analog input range for the part is 0 to V
. The conversion rate
DD
is determined by the SCLK.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
1. 10-/12-bit ADCs in SC70 and MSOP packages.
2. Low power consumption.
3. Flexible power/serial clock speed management. The
conversion rate is determined by the serial clock, allowing
the conversion time to be reduced through the serial clock
speed increase. This allows the average power consumption
to be reduced when power-down mode is used while not
converting. The part also features a power-down mode to
maximize power efficiency at lower throughput rates.
Current consumption is 1 μA maximum and 50 nA typically
when in power-down mode.
4. Reference derived from the power supply.
5. No pipeline delay. The parts feature a standard successive
approximation ADC with accurate control of the sampling
Signal-to-Noise + Distortion (SINAD)3 61 dB min
Total Harmonic Distortion (THD)3 −72 dB max
Peak Harmonic or Spurious Noise (SFDR)3 −73 dB max
Intermodulation Distortion (IMD)3
Second-Order Terms −82 dB typ fa = 100.73 kHz, fb = 90.7 kHz
Third-Order Terms −82 dB typ fa = 100.73 kHz, fb = 90.7 kHz
Aperture Delay 10 ns typ
Aperture Jitter 30 ps typ
Full Power Bandwidth 13.5 MHz typ @ 3 dB
2 MHz typ @ 0.1 dB
DC ACCURACY
Resolution 10 Bits
Integral Nonlinearity ±0.5 LSB max
Differential Nonlinearity ±0.5 LSB max Guaranteed no missed codes to 10 bits
Offset Error
Gain Error
3, 4
±1 LSB max
3, 4
Total Unadjusted Error (TUE)
ANALOG INPUT
Input Voltage Ranges 0 to VDD V
DC Leakage Current ±0.5 A max
Input Capacitance 20 pF typ Track-and-hold in track, 6 pF typ when in hold
LOGIC INPUTS
Input High Voltage, V
Input Low Voltage, V
0.4 V max VDD = 3 V
Input Current, IIN, SCLK Pin ± 0.5 A max Typically 10 nA, VIN = 0 V or VDD
Input Current, IIN, CS Pin
Input Capacitance, C
LOGIC OUTPUTS
Output High Voltage, VOH VDD − 0.2 V min I
Output Low Voltage, VOL 0.4 V max I
Floating-State Leakage Current ±1 A max
Floating-State Output Capacitance5 5 pF max
Output Coding Straight (natural) binary
CONVERSION RATE
Conversion Time 2.8 s max 14 SCLK cycles with SCLK at 5 MHz
Track-and-Hold Acquisition Time3 250 ns max
Throughput Rate 250 kSPS max
POWER REQUIREMENTS
VDD 2.35/5.25 V min/max
IDD Digital I/Ps = 0 V or VDD
Normal Mode (Static) 2.5 mA typ VDD = 4.75 V to 5.25 V, SCLK on or off
1.2 mA typ VDD = 2.35 V to 3.6 V, SCLK on or off
Normal Mode (Operational) 3 mA max VDD = 4.75 V to 5.25 V, f
1.4 mA max VDD = 2.35 V to 3.6 V, f
Full Power-Down Mode 1 A max Typically 50 nA
= 5 MHz, f
SCLK
= 250 kSPS, TA = T
SAMPLE
1, 2
MIN
to T
, unless otherwise noted.
MAX
Unit Test Conditions/Comments
±1 LSB max
3, 4
2.4 V min
INH
0.8 V max VDD = 5 V
INL
±1.2 LSB max
± 10 nA typ
5
5 pF max
IN
SOURCE
= 200 A
SINK
= 200 A, VDD = 2.35 V to 5.25 V
= 250 kSPS
SAMPLE
= 250 kSPS
SAMPLE
Rev. C | Page 3 of 24
AD7910/AD7920
Parameter1 A Grade
Power Dissipation
6
Normal Mode (Operational) 15 mW max VDD = 5 V, f
4.2 mW max VDD = 3 V, f
1, 2
Unit Test Conditions/Comments
= 250 kSPS
SAMPLE
= 250 kSPS
SAMPLE
Full Power-Down 5 W max VDD = 5 V
3 W max VDD = 3 V
1
Temperature range from −40°C to +85°C.
2
Operational from VDD = 2.0 V, with input high voltage (V
3
See the Terminology section.
4
SC70 values guaranteed by characterization.
5
Guaranteed by characterization.
6
See the Power vs. Throughput Rate section.
) 1.8 V min.
INH
AD7920
VDD = 2.35 V to 5.25 V, f
Table 2.
Parameter1 A Grade
DYNAMIC PERFORMANCE fIN = 100 kHz sine wave
Signal-to-Noise + Distortion (SINAD)3 70 70 dB min VDD = 2.35 V to 3.6 V, TA = 25°C
69 69 dB min VDD = 2.4 V to 3.6 V
71.5 71.5 dB typ VDD = 2.35 V to 3.6 V
69 69 dB min VDD = 4.75 V to 5.25 V, TA = 25°C
68 68 dB min VDD = 4.75 V to 5.25 V
Signal-to-Noise Ratio (SNR)3 71 71 dB min VDD = 2.35 V to 3.6 V, TA = 25°C
70 70 dB min VDD = 2.4 V to 3.6 V
70 70 dB min VDD = 4.75 V to 5.25 V, TA = 25°C
69 69 dB min VDD = 4.75 V to 5.25 V
Total Harmonic Distortion (THD)3 −80 −80 dB typ
Peak Harmonic or Spurious Noise (SFDR)3 −82 −82 dB typ
Intermodulation Distortion (IMD)3
Second-Order Terms −84 −84 dB typ fa = 100.73 kHz, fb = 90.72 kHz
Third-Order Terms −84 −84 dB typ fa = 100.73 kHz, fb = 90.72 kHz
Aperture Delay 10 10 ns typ
Aperture Jitter 30 30 ps typ
Full Power Bandwidth 13.5 13.5 MHz typ @ 3 dB
2 2 MHz typ @ 0.1 dB
DC ACCURACY B Grade4
Resolution 12 12 Bits
Integral Nonlinearity3 ±1.5 LSB max ± 0.75 LSB typ
Differential Nonlinearity −0.9/+1.5 LSB max Guaranteed no missed codes to 12 bits
±0.75 LSB typ
Offset Error
3, 5
±1.5 LSB max ±1.5 ±0.2 LSB typ
Gain Error
3, 5
±1.5 ±0.5 LSB typ
Total Unadjusted Error (TUE)
ANALOG INPUT
Input Voltage Ranges 0 to VDD 0 to VDD V
DC Leakage Current ±0.5 ±0.5 A max
Input Capacitance 20 20 pF typ Track-and-hold in track, 6 pF typ when in hold
= 5 MHz, f
SCLK
= 250 kSPS, TA = T
SAMPLE
, 1 2
B Grade
MIN
to T
, unless otherwise noted.
MAX
1, 2
Unit Test Conditions/Comments
±1.5 LSB max
3, 5
±2 LSB max
Rev. C | Page 4 of 24
AD7910/AD7920
Parameter1 A Grade
, 1 2
B Grade
1, 2
Unit Test Conditions/Comments
LOGIC INPUTS
Input High Voltage, V
2.4 2.4 V min
INH
1.8 1.8 V min VDD = 2.35 V
Input Low Voltage, V
0.8 0.8 V max VDD = 3.6 V to 5.25 V
INL
0.4 0.4 V max VDD = 2.35 V to 3.6 V
Input Current, IIN, SCLK Pin ±0.5 ±0.5 A max Typically 10 nA, VIN = 0 V or VDD
Input Current, IIN, CS Pin
Input Capacitance, C
6
IN
5 5 pF max
±10 ±10 nA typ
LOGIC OUTPUTS
Output High Voltage, VOH VDD − 0.2 VDD − 0.2 V min I
Output Low Voltage, VOL 0.4 0.4 V max I
= 200 µA, VDD = 2.35 V to 5.25 V
SOURCE
= 200 µA
SINK
Floating-State Leakage Current ±1 ±1 A max
Floating-State Output Capacitance6 5 5 pF max
Output Coding Straight (natural) binary
CONVERSION RATE
Conversion Time 3.2 3.2 s max 16 SCLK cycles with SCLK at 5 MHz
Track-and-Hold Acquisition Time3 250 250 ns max
Throughput Rate 250 250 kSPS max See the Serial Interface section
POWER REQUIREMENTS
VDD 2.35/5.25 2.35/5.25 V min/max
IDD Digital I/Ps = 0 V or VDD
Normal Mode (Static) 2.5 2.5 mA typ VDD = 4.75 V to 5.25 V, SCLK on or off
1.2 1.2 mA typ VDD = 2.35 V to 3.6 V, SCLK on or off
Normal Mode (Operational) 3 3 mA max VDD = 4.75 V to 5.25 V, f
1.4 1.4 mA max VDD = 2.35 V to 3.6 V, f
SAMPLE
= 250 kSPS
SAMPLE
= 250 kSPS
Full Power-Down Mode 1 1 A max Typically 50 nA
Power Dissipation
Normal Mode (Operational) 15 15 mW max VDD = 5 V, f
4.2 4.2 mW max VDD = 3 V, f
7
SAMPLE
SAMPLE
= 250 kSPS
= 250 kSPS
Full Power-Down 5 5 W max VDD = 5 V
3 3 W max VDD = 3 V
1
Temperature range from −40°C to +85°C.
2
Operational from VDD = 2.0 V, with input low voltage (V
3
See the Terminology section.
4
B Grade, maximum specifications apply as typical figures when VDD = 4.75 V to 5.25 V.
5
SC70 values guaranteed by characterization.
6
Guaranteed by characterization.
7
See the Power vs. Throughput Rate section.
) 0.35 V max.
INL
Rev. C | Page 5 of 24
AD7910/AD7920
TIMING SPECIFICATIONS
VDD = 2.35 V to 5.25 V, TA = T
Table 3.
AD7910/AD7920
Parameter1
2
f
10 kHz min3
SCLK
Limit at T
5 MHz max
t
14 × t
CONVER T
16 × t
t
50 ns min
QUIET
t1 10 ns min
t2 10 ns min
4
t
22 ns max
3
t4 40 ns max Data access time after SCLK falling edge
t5 0.4 × t
t6 0.4 × t
5, 6
t
7
SCLK to data valid hold time
10 ns min VDD ≤ 3.3 V
9.5 ns min 3.3 V < VDD ≤ 3.6 V
7 ns min VDD > 3.6 V
6, 7
t
8
36 ns max SCLK falling edge to SDATA three-state
See Note 7 ns min SCLK falling edge to SDATA three-state
8
t
POWER-UP
1
Guaranteed by characterization. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
2
Mark/Space ratio for the SCLK input is 40/60 to 60/40.
3
Minimum f
4
Measured with the load circuit of Figure 2 and defined as the time required for the output to cross 0.8 V or 1.8 V when VDD = 2.35 V and 0.8 V or 2.0 V for VDD > 2.35 V.
5
Measured with a 50 pF load capacitor.
6
t8 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 2. The measured number is then extrapolated
at which specifications are guaranteed.
SCLK
1 s max Power-up time from full power-down
back to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t8, shown in the Timing Specifications is the true bus relinquish
time of the part and is independent of the bus loading.
7
T7 values apply to t8 minimum values also.
8
See Power-Up Time section.
to T
MIN
, T
MIN
AD7910
SCLK
AD7920
SCLK
, unless otherwise noted.
MAX
Unit Description
MAX
Minimum quiet time required between bus relinquish and start of next
conversion
Minimum
CS pulse width
CS to SCLK setup time
Delay from
ns min SCLK low pulse width
SCLK
ns min SCLK high pulse width
SCLK
CS until SDATA three-state disabled
TO OUTPUT
PIN
200μAI
C
L
50pF
200μAI
OL
1.6V
OH
02976-002
Figure 2. Load Circuit for Digital Output Timing Specifications
Rev. C | Page 6 of 24
AD7910/AD7920
S
TIMING EXAMPLES
Figure 3 and Figure 4 show some of the timing parameters from
Tabl e 3.
TIMING EXAMPLE 1
From Figure 4, having f
250 kSPS gives a cycle time of t
With t
= 10 ns min, this leaves t
2
satisfies the requirement of 250 ns for t
comprises 2.5(1/f
SCLK
allows a value of 954 ns for t
requirement of 50 ns.
CS
SCLK
SDATA
STATE
= 5 MHz and a throughput rate of
SCLK
+ 12.5(1/f
2
to be 1.49 μs. This 1.49 μs
ACQ
) + t8 + t
t
2
1234513141516
t
3
Z
, where t8 = 36 ns max. This
QUIET
, satisfying the minimum
QUIET
ZEROZEROZERODB11DB10DB2DB1DB0
4 LEADING ZEROS
) + t
SCLK
ACQ
. From Figure 4, t
ACQ
t
t
4
= 4 μs.
t
CONVERT
6
t
ACQ
7
Figure 3. AD7920 Serial Interface Timing Diagram
TIMING EXAMPLE 2
The AD7920 can also operate with slower clock frequencies.
Figure 4, having f
From
150 kSPS gives a cycle time of t
With t
= 10 ns min, this leaves t
2
satisfies the requirement of 250 ns for t
comprises 2.5(1/f
SCLK
value of 2.19 μs for t
of 50 ns. As in this example and with other slower clock values,
the signal may already be acquired before the conversion is
complete, but it is still necessary to leave 50 ns minimum t
between conversions. In this example, the signal should be fully
acquired at approximately Point C in
B
t
5
= 3.4 MHz and a throughput rate of
SCLK
+ 12.5(1/f
2
to be 2.97 μs. This 2.97 μs
ACQ
) + t8 + t
, satisfying the minimum requirement
QUIET
, t8 = 36 ns max. This allows a
QUIET
) + t
SCLK
ACQ
. From Figure 4, t
ACQ
Figure 4.
t
1
t
8
t
QUIET
THREE-STATETHREE-
= 6.66 μs.
ACQ
QUIET
02976-003
CS
t
SCLK
CONVERT
)
B
1/THROUGHPUT
C
t
8
t
ACQ
t
QUIET
02976-004
CLK
t
2
1234513141516
12.5(1/f
Figure 4. Serial Interface Timing Example
Rev. C | Page 7 of 24
AD7910/AD7920
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Tabl e 4.
Parameter Rating
VDD to GND −0.3 V to +7 V
Analog Input Voltage to GND −0.3 V to VDD + 0.3 V
Digital Input Voltage to GND −0.3 V to +7 V
Digital Output Voltage to GND −0.3 V to VDD + 0.3 V
Input Current to Any Pin Except Supplies1± 10 mA
Operating Temperature Range
Commercial (A, B Grade) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
MSOP Package
θJA Thermal Impedance 205.9°C/W
θJC Thermal Impedance 43.74°C/W
SC70 Package
θJA Thermal Impedance 340.2°C/W
θJC Thermal Impedance 228.9°C/W
Lead Temperature, Soldering
Reflow (10 sec to 30 sec) 235 (0/+5)°C
ESD 3.5 kV
1
Transient currents of up to 100 mA will not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 8 of 24
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