AD7776/AD7777/AD7778
–4–
REV. 0
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VCC to AGND or DGND . . . . . . . . . . . . . . . . . .–0.3 V, +7 V
AGND, RTN to DGND . . . . . . . . . . . . . –0.3 V, V
CC
+ 0.3 V
CS, RD, WR, CLKIN, DB0–DB9,
BUSY/INT to DGND . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V
Analog Input Voltage to AGND . . . . . . . –0.3 V, V
CC
+ 0.3 V
REFOUT to AGND . . . . . . . . . . . . . . . . –0.3 V, V
CC
+ 0.3 V
REFIN to AGND . . . . . . . . . . . . . . . . . . –0.3 V, V
CC
+ 0.3 V
Operating Temperature Range
All Versions . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
DIP Package, Power Dissipation . . . . . . . . . . . . . . . . 875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +260°C
SOIC Packages, Power Dissipation . . . . . . . . . . . . . . 875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PQFP Package, Power Dissipation . . . . . . . . . . . . . . 500 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 95°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only; functional operation
of the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
PIN CONFIGURATIONS
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7776/AD7777/AD7778 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
24-Pin SOIC
1
2
24
23
22
10
15
11
12
14
13
21
20
18
17
16
19
9
3
4
5
TOP VIEW
(Not to Scale)
7
8
6
AD7776
DB2
DB3
DGND
DB4
DB5
DB6
DB7
DB1
DB0
C
REFIN
AGND
RTN
REFIN
A
IN
AGND
REFOUT
V
CC
DB8
(MSB) DB9
CLKIN
BUSY/INT
RD
WR
CS
28-Pin DIP & SOIC
1
2
24
23
22
10
15
11
12
14
13
21
20
17
16
9
3
4
5
7
8
6
18
19
TOP VIEW
(Not to Scale)
28
27
26
25
AD7777
NC
NC = NO CONNECT
DB2
DB3
DGND
DB4
DB5
DB6
DB7
DB1
DB0
DB8
(MSB) DB9
BUSY/INT
C
REFIN
AGND
RTN
REFIN
AGND
REFOUT
V
CC
CLKIN
RD
WR
CS
AIN4
A
IN
3
AIN2
A
IN
1
ORDERING GUIDE
Temperature No. of Package
Model Range Channels Option
1
AD7776AR2–40°C to +85°C 1 R-24
AD7777AN –40°C to +85°C 4 N-28
AD7777AR
2
–40°C to +85°C 4 R-28
AD7778AS
2
–40°C to +85°C 8 S-44
NOTES
1
R = SOIC, N = Plastic DIP, S = PQFP.
2
Analog Devices reserves the right to ship devices branded with a J in place of
the A, e.g., AD7776JR instead of AD7776AR. Temperature range remains
–40°C to +85°C.
44-Pin PQFP
7
8
9
10
11
6
5
4
3
2
1 33
32
31
30
29
28
27
26
25
24
23
18 19 20 21 221716151413
12
39 38 37 36 35 3444 43 42 41 40
TOP VIEW
(Not to Scale)
AD7778
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
DB2
DB3
DGND
DB4
DB5
DB6
DB7
DB1
DB0
C
REFIN
RTN
AGND
REFIN
AIN8
AIN7
AIN6
AIN5
AIN4
AIN3
AIN2
AIN1
AGND
REFOUT
V
CC
DB8
(MSB) DB9
CLKIN
BUSY/INT
RD
WR
CS
NC = NO CONNECT