Ampro Corporation COM 830 User Manual

COM 830

(Computer-On-Module)

Reference Manual

P/N 5001829A Revision A

Notice Page

NOTICE

No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual, or otherwise, without the prior written permission of Ampro
Computers, Incorporated.

DISCLAIMER

Ampro Computers, Incorporated makes no representations or warranties with respect to the contents of this
manual or of the associated Ampro products, and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. Ampro shall under no circumstances be liable for
incidental or consequential damages or related expenses resulting from the use of this product, even if it has
been notified of the possibility of such damages. Ampro reserves the right to revise this publication from
time to time without obligation to notify any person of such revisions. If errors are found, please contact
Ampro at the address listed below on the Notice page of this do cu ment.

TRADEMARKS

Ampro and the Ampro logo are registered trademarks, and CoreModule, EnCore, Little Board,
LittleBoard, MightyBoard, MightySystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel, and
ReadySystem are trademarks of Ampro Computers, Inc. All other marks are the property of their
respective companies.

REVISION HISTORY

Revision Reason for Change Date

A, 1 Preliminary Release Apr/07

A, A Final Release July/07

Ampro Computers, Incorporated
5215 Hellyer Avenue
San Jose, CA 95138-1007
Tel. [phone]
Fax [phone]
www.ampro.com
© Copyright 2007, Ampro Computers, Incorporated

Audience

This reference manual is for the person who designs computer related equipment, including but not limited
to hardware and software design and implementation of the same. Ampro Computers, Inc. assumes you are
qualified in designing and implementing your hardware designs and its related software into your prototype
computer equipment.

ii Reference Manual COM 830

Contents

Chapter 1 About This Manual....................................................................................................1

Symbols...........................................................................................................................................1

Warning.................................................................................................................................1

Caution..................................................................................................................................1

Note.......................................................................................................................................1

Terminology.....................................................................................................................................1

Warranty ..........................................................................................................................................1

COM Express™ Concept...................... ... ... ... ....................................... ... .... ... ... ... .... ... ....................2

Certification......................................................................................................................................3

Technical Support............................................................................................................................3

Lead-Free Designs (RoHS) .................................. ....................................... ... ... ... .... ... ... ... ... .... .......3

Electrostatic Sensitive Device .........................................................................................................3

COM 830 Options Information .........................................................................................................3

Chapter 2 Specifications............................................................................................................5

Feature List......................................................................................................................................5

Usable Memory..................................... ... ... ... .... ... ... ... ....................................... ... .... ... ... .................6

Supported Operating Systems.........................................................................................................6

Mechanical Dimensions. ... .... ...................................... .... ... ... ... .... ... ... ... ... .... ... ... ..............................6

Electrostatic Sensitive Device.....................................................................................................7

Supply Voltage Standard Power......................................................................................................7

Electrical Characteristics .......................... ..................................................................................7

Power Consumption.........................................................................................................................7

Windows XP Professional SP2...................................................................................................7

Processor Information......................................................................................................................8

Environmental Specifications................................... ... .......................................... .... .......................9

Block Diagram................................................................................................................................10

Heatspreader.................................................................................................................................11

Heatspreader Dimensions .............................................................................................................12

Connector Subsystems Rows A, B, C, D.......................................................................................13

Primary Connector Rows A and B.................................................................................................13

Serial ATA™ (SATA)................................................................................................................13

USB 2.0 ................................. ... .... ... ... ... ... ....................................... ... .... ..................................13

AC'97 Digital Audio Interface/HDA ......................................... ... ... ... ... .... ... ... ... .... .....................13

Gigabit Ethernet .......................................................................................................................13

LPC Bus....................................................................................................................................13

I²C Bus 400kHz.........................................................................................................................13

PCI Express™..........................................................................................................................14

ExpressCard™ .........................................................................................................................14

Graphics Output (VGA/CRT)........ ... ... ... ... .... ... ... ... ...................................................................14

LCD...........................................................................................................................................14

TV-Out......................................................................................................................................14

Power Control................................................................................................................................14

PWR_OK .................................................................................................................................14

SUS_S5#/PS_ON#...................................................................................................................14

PWRBTN#................................................................................................................................14

Power Supply Implementation Guidelines.....................................................................................15

Power Management..................................................................................................................15

COM 830 Reference Manual iii

Contents

Secondary Connector Rows C and D ......................................................................................15

PCI Express Graphics (PEG)...................................................................................................15

SDVO.......................................................................................................................................15

PCI Bus....................................................................................................................................15

IDE...........................................................................................................................................15

Additional Features .................................................................. ... ... .... ... ... ... ... .... ... ... ... .... ..............15

Watchdog.................................................................................................................................15

Onboard Microcontroller...........................................................................................................16

Embedded BIOS .................................................... ... ... .... ... ... ... .... ... ... .....................................16

Simplified Overview of BIOS Setup Data Backup....................................................................17

Security Features.......................................................................................................................... 18

Suspend to Ram...................... .... ... ... ... .... ...................................... .... ... ... ... ... .... ... ........................18

Ampro Tech Notes ...................... ... ... ... .... ... ... ... ... ....................................... ... .... ... ... .....................18

Comparison of I/O APIC to 8259 PIC Interrupt mode ...................................................................18

Intel® Matrix Storage Technology ........................... .....................................................................18

AHCI......................................................................................................................................... 18

RAID.........................................................................................................................................18

Native vs. Compatible IDE mode ..................................................................................................19

Compatible Mode................................... ... ... ... .... ... ... ... .... ... ... ... .... ... ........................................ 19

Native Mode ............................................................................................................................19

Intel® Processor Features.............................. ... ... .... ... ... ... .... ... ... ... .... ... ... ... ... .... ... ... ... .... ... ... ........ 19

Thermal Monitor and Catastrophic Thermal Protection ...........................................................19

Processor Performance Control...............................................................................................20

Intel 64 .....................................................................................................................................20

Intel® Virtualization Technology...............................................................................................21

Thermal Management...................................................................................................................21

Passive Cooling ..................................................................................................................21

Active Cooling............................ .... ... ....................................... ... ... ... ... ...............................22

Critical Trip Point.................................................................................................................22

ACPI Suspend Modes and Resume Events..................................................................................22

USB 2.0 EHCI Host Controller Support......................................................................................... 24

Routing Diagram:..................................................................................................................... 24

Chapter 3 Signals and Pinout Tables..................................................................................... 25

A-B Connector Signal Descriptions...............................................................................................26

A-B Connector Pinout....................................................................................................................36

C-D Connector Signal Descriptions...............................................................................................38

C-D Connector Pinout...................................................................................................................43

Boot Strap Signals....................... ... ... ... .... ...................................... .... ... ... ... ... .... ... ... ... .... ..............45

System Resources ............................................ ... .... ... ... ... .... ... ... ....................................... ........... 46

System Memory Map... ... ... .... ...................................... .... ... ... ... .... ... ... .....................................46

I/O Address Assignment................................................................................................................46

LPC Bus...................................................................................................................................47

Interrupt Request (IRQ) Lines .......................................................................................................48

PCI Configuration Space Map.......................................................................................................49

PCI Interrupt Routing Map.............................................................................................................51

PCI Bus Masters ...........................................................................................................................52

I²C Bus .......................................................................................................................................... 52

SM Bus.......................................................................................................................................... 52

iv Reference Manual COM 830

Contents

Chapter 4 BIOS Setup Description..........................................................................................53

Entering the BIOS Setup Program.................................................................................................53

Boot Selection Popup............... .... ... ... ... ... .... ... ... ... ....................................... ... .... ... ... ... ... .... .....53

Manufacturer Default Settings ..................................................................................................53

Setup Menu and Navigation...........................................................................................................53

Main Setup Screen ........................................................................................................................54

Advanced Setup.............................................................................................................................55

ACPI Configuration Submenu...................................................................................................56

Win XP Watchdog ACPI Event restart configuration .....................................................................57

PCI Configuration Submenu.....................................................................................................57

PCI IRQ Resource Exclusion Submenu..............................................................................58

PCI Interrupt Routing Submenu ..........................................................................................58

Graphics Configuration Submenu.............................................................................................58

CPU Configuration Submenu ................................ ...................................................................61

Chipset Configuration Submenu...............................................................................................63

I/O Interface Configuration Submenu.......................................................................................64

SIO Winbond W83627 Configuration ..................................................................................65

Clock Configuration ...................................... ... ... ... .... ... ... ....................................... ... ... ... .........66

IDE Configuration Submenu.....................................................................................................66

Primary/Secondary IDE Master/Slave Submenu............... ... ... ... ... .... ... ... ... .........................68

USB Configuration Submenu..................................................................... ... ............................70

USB Mass Storage Device Configuration Submenu ...........................................................71

Keyboard/Mouse Configuration Submenu................................................................................71

Remote Access Configuration Submenu..................................................................................72

Hardware Monitoring Submenu................................................................................................73

Watchdog Configuration Submenu...........................................................................................74

Boot Setup.................. ... ... .... ...................................... .... ... ... ....................................... ..................75

Boot Device Priority.................. .... ... ... ... ... .... ............................................................................76

Boot Settings Configuration............................................. ....................................... ... ... ... .... .....77

Security Setup................................................................................................................................78

Security Settings.......................................................................................................................79

Hard Disk Security....................................................................................................................79

Hard Disk Security User Password .....................................................................................80

Hard Disk Security User Password .....................................................................................80

Power Setup ..................................................................................................................................80

Exit Menu..................................................................................................................................81

Additional BIOS Features ........................................ ... .... .......................................... ... ..................81

Updating the BIOS...... ....................................... ... ... ... .... ... ... ... ....................................... ... ............81

BIOS Recovery..............................................................................................................................81

BIOS Recovery via Storage Devices........................................................................................81

BIOS Recovery via Serial Port..................................................................................................81

Serial Port and Console Redirection..............................................................................................82

BIOS Security Features.................................................................................................................82

Hard Disk Security Features..........................................................................................................82

Industry Specifications....................................... ... ... ... .... ... ... ....................................... ... ... ............83

Appendix A Technical Support...................................................................................................85

COM 830 Reference Manual v

Contents

List of Tables

Table 1-1. Definitions of Terms ......................... ... .......................................... ... .......................1

Table 1-2. COM Express Pinout Types................................... .... ... .......................................... 2

Table 1-3. COM 830 Configuration Matrix................................................................................3

Table 2-1. Feature Summary................... ... ... .... ... ... ... .... .......................................... ... .............5

Table 2-2. Dual Connector Pinout Limitations.......................................................................... 7

Table 2-3. COM 830 Intel® Core™ Duo U2500 1.2G Hz 2MB L2 cache.................................. 8

Table 2-4. COM 830 Intel® Celeron M 423 1.07GHz 1MB L2 cache.......................................9

Table 3-1. Signal Tables Terminology Descriptions...............................................................25

Table 3-2. AC'97/Intel® High Definition Audio Link Signals Descriptions...............................26

Table 3-3. Gigabit Ethernet Signal Descriptions.....................................................................27

Table 3-4. Serial ATA Signal Descriptions ............................................................................ 27

Table 3-5. PCI Express Signal Descriptions [general purpose] .............................................28

Table 3-6. ExpressCard Support Pins Descriptions ...............................................................29

Table 3-7. LPC Signal Descriptions........................................................................................29

Table 3-8. USB Signal Descriptions ......................................................................................30

Table 3-9. CRT Signal Descriptions ......................................................................................31

Table 3-10. LVDS Signal Descriptions...................... ... .... ... ... ... .... ... ... ... ... .... ... ... ... .... ... ... ... .....32

Table 3-11. TV-Out Signal Descriptions ..................................................................................32

Table 3-12. Miscellaneous Signal Descriptions........................................................................33

Table 3-13. General Purpose I/O Signal Descriptions .............................................................34

Table 3-14. Power and System Management Signal Descriptions ......................................... 34

Table 3-15. Power and GND Signal Descriptions ....................................................................35

Table 3-16. Connector A-B Pinout.......................................... .......................................... ... ... .. 36

Table 3-17. PCI Signal Descriptions ........................................................................................38

Table 3-18. IDE Signal Descriptions ........................................................................................39

Table 3-19. PCI Express Signal Descriptions (x16 Graphics)..................................................40

Table 3-20. SDVO Signal Descriptions .............................. ... ... .... ... ... ... ... .... ... ... ... .... ... ... ... .....41

Table 3-21. Module Type Definition Signal Description............................................................42

Table 3-22. Power and GND Signal Descriptions ....................................................................42

Table 3-23. Connector C-D Pinout .................................................................. ... ... .... ..............43

Table 3-24. Boot Strap Signal Descriptions ............................................................................. 45

Table 3-25. Memory Map .......................................... ... .... ... ... ... .... ... ...................................... .. 46

Table 3-26. I/O Address Assignment...................................... ... .... ......................................... .. 47

Table 3-27. IRQ Lines in PIC mode........................................ ... .... ... ... ... ... .... ... ... ... ..................48

Table 3-28. IRQ Lines in APIC mode .............................................................. ... ... .... ... ... ... ... .. 48

Table 3-29. PCI Configuration Space Map ..............................................................................49

Table 3-30. PCI Interrupt Routing Map................................... ... ....................................... ... ... .. 51

Table 3-31. PCI Interrupt Routing Map (continued).................................................................. 52

Table 3-32. LAN ........................................... ... .... ... ... ... ....................................... ... .... ... ... ........ 52

Table A-1. Technical Support Contact Information................................................................. 85

vi Reference Manual COM 830

Chapter 1 About This Manual

This manual provides information about the components, features, connectors and BIOS Setup menus
available on the COM 830.

Symbols

The following symbols are used in this manual:

Warning

Warnings indicate conditions that, if not observed, can cause personal injury.

Caution

Cautions warn the user about how to prevent damage to hardware or loss of data.

Note

Notes call attention to important information that should be observed.

Terminology

Table 1-1. Definitions of Terms

Term Description

GB Gigabyte (1,073,741,824 bytes)
GHz Gigahertz (one billion hertz)
kB Kilobyte (1024 bytes)
MB Megabyte (1,048,576 bytes)
Mb Megabit (1,048,576 bits)
kHz Kilohertz (one thousand hertz)
MHz Megahertz (one million hertz)
TDP Thermal Design Power
PCIe P C I E xpress
SATA Serial ATA
PATA Parallel ATA
T.O.M. Top of memory = max. DRAM installed
HDA High Definition Audio
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined

Warranty

Ampro makes no representation, warranty or guaranty, express or implied regarding the products except its
standard form of limited warranty ("Limited Warranty"). Ampro may in its sole discretion modify its
Limited Warranty at any time and from time to time.

COM 830 Reference Manual 1

Chapter 1 About This Manual

Beginning on the date of shipment to its direct customer and continuing for the publi shed warranty period,
Ampro represents that the products are new and warrants that each product failing to function properly under
normal use, due to a defect in materials or workmanship or due to non conformance to the agreed upon
specifications, will be repaired or exchanged, at Ampro's option and expense.

Customer will obtain a Return Material Authorization ("RMA") number from Ampro prior to returning the
non conforming product freight prepaid. Ampro will pay for transporting the repaired or exchanged product
to the customer.

Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the
date the repaired, exchanged or replaced product is shipped by Ampro, or the rem ainder of the original
warranty, whichever is longer. This Limited Warranty extends to Ampro's direct customer only and is not
assignable or transferable.

Except as set forth in writing in the Limited Warranty, Ampro makes no performance representations,
warranties, or guarantees, either express or implied, oral or written, with respect to the products, including
without limitation any implied warranty (a) of merchantability, (b) of fitness for a particular purpose, or (c)
arising from course of performance, course of dealing, or usage of trade.

Ampro shall in no event be liable to the end user for collateral or consequential damages of any kind. Ampro
shall not otherwise be liable for loss, damage or expense directly or indirectly arising from the use of the
product or from any other cause. The sole and exclusive remedy against Ampro, whether a claim sound in
contract, warranty, tort or any other legal theory, shall be repair or replacement of the product only

COM Express™ Concept

COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its
creation provides the ability to make a smooth transition from legacy parallel interfaces to the newest
technologies based on serial buses available today. COM Express™ modules are available in the following
form factors:

• Compact 95mm x 95mm (not specified by PICMG

®

)

• Basic 25mm x 95mm

• Extended 55mm x 110mm

The COM Express™ specification 1.0 defines five different pinout types.

Table 1-2. COM Express Pinout Types

Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports
Type 1 A-B Up to 6 1
Type 2 A-B C-D Up to 22 32 bit 1 1
Type 3 A-B C-D Up to 22 32 bit 3
Type 4 A-B C-D Up to 32 1 1
Type 5 A-B C-D Up to 32 3

Ampro modules utilize the Type 2 pinout definition. They are equipped with two high performance
connectors that ensure stable data throughput.

The COM (computer on module) integrates all the core components and is mounted onto an application
specific carrier board. COM modules are a legacy-free design (no Super I/O, PS/2 keyboard and mouse) and
provide most of the functional requirements for any application. These functions include, but are not limited
to, a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 2 pinout provides the ability to offer 32-bit PCI, Parallel ATA, and
LPC options thereby expanding the range of potential peripherals. The robust thermal and mechanical
concept, combined with extended power management capabilities, is perfectly suited for all applications.

2 Reference Manual COM 830

Chapter 1 About This Manual

Carrier board designers can utilize as little or as many of the I/O interfaces as necessary. The carrier board
can therefore provide all the interface connectors required to attach the system to the application specific
peripherals. This versatility allows the designer to create a dense and optimized package, which results in a
more reliable product while simplifying system integration. Most importantly, COM Express™ modules are
scalable, which means once an application has been created there is the ability to diversify the product range
through the use of different performance class or form factor size modules. Simply unplug one module and
replace it with another, no redesign is necessary.

Certification

Ampro is certified to DIN EN ISO 9001:2000 standard.

Technical Support

Ampro technicians and engineers are committed to providing the best possible technical support for our
customers so that our products can be easily used and implemented. We request that you first visit our
website at www.ampro.com for the latest documentation, utilities and drivers, which have been made
available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at www.ampro.com.com/Support/.

Lead-Free Designs (RoHS)

As of July 2006 all electronic products are required to be environmentally friendly. In the future, many of the
currently available embedded computer modules will not be offered as lead-free variants. For this reason all
Ampro designs are created from lead-free components and are completely RoHS compliant. This makes
Ampro products ideal lead-free substitutes for new and exi st ing de signs.

Electrostatic Sensitive Device

All Ampro products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle
an Ampro product except at an electrostatic-free workstation. Additionally, do not ship or store Ampro
products near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is
contained within its original manufacturer's packaging. Be aware that failure to comply with these
guidelines will void the Ampro Limited Warranty.

COM 830 Options Information

The COM 830 is currently available in two different variants. This manual describes all of these options.
Below you will find an order table showing the different configurations that are currently offered by Ampro.
Check the table for the Part no./Order no. that applies to your product. This will tell you which options
described in this manual are available on your particular module.

Table 1-3. COM 830 Configuration Matrix

Part-No. COM 830-R-30 COM 830-R-10

CPU

L2 Cache 2 MByte 1 MByte
FSB 533MHz 533MHz
CPU TDP 9 W 5.5 W

Intel® Core™ Duo U2500 ULV

1.2GHz (Ultra Low Voltage)

Intel® Celeron M 423 1.07GHz ULV
(Ultra Low Voltage)

COM 830 Reference Manual 3

Chapter 1 About This Manual

4 Reference Manual COM 830

Chapter 2 Specifications

Feature List

Table 2-1. Feature Summary

Form Factor
Processor

Memory

Chipset

Audio

Ethernet
Graphics

Options

Based on COM Express™ standard pinout Type 2 (Basic size 95 x 125mm)
Intel® Core™ Duo U2500 ULV 1.2GHz, with 2-MByte L2 cache ULV (Ultra

Low Voltage)
Intel® Celeron M 423 UL V 1.07GHz, with 1-MByte L2 cache (Ultra Low Voltage)

2 sockets: SO-DIMM DDR2 667 up to 4-GByte physical memory. Sockets located
top and bottom side of module.

Graphics and Memory Controller Hub (GMHC) Intel

®

I/O Controller Hub 82801GHM (ICH7M-DH)

Intel
AC‘97 Rev.2.2 compatible, HDA (High Definition Audio)/digital audio interface

with support for multiple codecs
Gigabit Ethernet, Marvell 88E8056 (uses one x1 PCI Express Lane)

Intel® Graphics Media Accelerator 950 with max.224MByte Dynamic Video
Memory Technology (DVMT 3.0) as well as Dual independent display support.

CRT Interface
400 MHz RAMDAC
Resolutions up to 2048x1536 @ 70Hz

(QXGA) including 1920x1080 @ 85Hz
(HDTV)

Flatpanel Interface (integrated)
2x112MHz LVDS Transmitter

Supports all 1x18, 2x18, 1x24, 2x24 Bit TFT
configurations (current chipset revisions
support 24Bit modes although not officially

®

stated by Intel
Supports both conventional (FPDI) and non-

conventional (LDI) color mappings
Automatic Panel Detection via EPI

(Embedded Panel Interface based on VESA
EDID™ 1.3)

)

®

82945GM

Motion Video Support
Up- and Downscaling

High definition content decode
H/W motion compensation
Subpicture support
Dynamic bob and weave
AUX Output

2 x Intel compliant SDVO ports
(serial DVO) 200MPixel/sec each
(shared with PEG x16 pins)

Supports external DVI, TV and
LVDS transmitter

TV Out: Integrated TV encoder
Supports component + s-video

Resolutions 640x480 up to 1920x1200
(UXGA)

Peripheral
Interfaces

COM 830 Reference Manual 5

2x Serial ATA® supports RAID 0/1
5x x1 PCI Express® Lanes
PCI Express Graphics x16 (shared

with SDVO)
8x USB 2.0 (EHCI)

PCI Bus Rev. 2.3
1x EIDE (UDMA-66/100)
LPC Bus
I2C Bus, Fast Mode (400 kHz)

multimaster

Chapter 2 Specifications

Table 2-1. Feature Summary (Continued)

®

BIOS
Power

Management

NOTE Some of the features mentioned in the above Feature Summary are optional.

Based on AMIBIOS8
ACPI 2.0 compliant with battery support. Also supports Suspend to RAM (S3).

Check the article number of your module and compare it to the option
information listed in Tables 2-3 and 2-4 on page 9 of this manual to determine
what options are available on your particular module.

-1MByte Flash BIOS with Embedded BIOS features.

Usable Memory

Although the Intel® 82945GM Graphics and Memory Controller Hub (GMHC) supports up to 4GB of
physical memory, not all of the available memory is usable for applications. This is due to the fact that some
of the physical memory will always be allocated to the following:

Legacy MMIO (Memory Mapped I/O)
Chipset MMIO
PCI Enumeration Area

In order to provide full support for the above mentioned areas, usable memory is limited to 3GB on the
COM 830 when a maximum of 4GB physical memory is installed.

Supported Operating Systems

The COM 830 supports the following operating systems.

®

Microsoft
Linux

Windows ®XP Embedded

Mechanical Dimensions

95.0 mm x 125.0 mm (3.74" x 4.92")
Height approx. 18 or 21mm (including heatspreader) depending on the carrier board connector that is used.

If the 5mm (height) carrier board connector is used then approximate overall height is 18mm. If the 8mm
(height) carrier board connector is used then approximate overall height is 21mm.

6 Reference Manual COM 830

Chapter 2 Specifications

Electrostatic Sensitive Device

All COM 830 variants are electrostatic sensitive devices. Do not handle the COM 830, or processor, except
at an electrostatic-free workstation. Failure to do so may cause damage to the module and/or processor and
void the manufacturer’s warranty.

Supply Voltage Standard Power

12V DC ± 5%

Electrical Characteristics

Power supply pins on the module's connectors limit the amount of input power. The following table provides
an overview of the limitations for pinout Type 2 (dual connector, 440 pins).

Table 2-2. Dual Connector Pinout Limitations

Power
Rail

VCC_
12V

VCC_
5V­SBY

VCC_
RTC

Module
Pin
Current
Capability
(Amps)

16.5 12 11.4-

2 5 4.75-

0.5 3 2.0-3.3 +/- 20

Nominal
Input

(Volts)

Input
Range

(Volts)

12.6

5.25

Derated
Input

(Volt)

11.4 +/- 100 188 85% 160

4.75 +/- 50 9

Max.
Input
Ripple

(mV)

Max. Module
Input Power

(w. derated
input)(Watts)

Assumed
Conversion
Efficiency

Max. Load
Power

(Watts)

Power Consumption

The power consumption values listed in this document were measured under a controlled environment. The
hardware used includes a COM 830 module, Ampro baseboard, CRT monitor, SATA drive, and USB
keyboard. The complete testing environment was powered by a Direct Current (DC) power supply that is set
to output 12V. The current consumption value displayed by the DC pow er supply's readout is the value that
is recorded as the power consumption measurement. All recorded values are approximate.

The power consumption of the Ampro baseboard (without module attached) was first measured and the
resulting value was later subtracted from the overall power consumption value measured when the module
and all peripherals were connected.

The SATA drive was powered externally by an ATX power supply so that it does not influence the power
consumption value that is measured for the module. The USB keyboard was detached once the module was
configured within the OS.

Each module was measured while running Windows XP Professional with SP2 (service pack 2) and the
“Power Scheme” was set to “Portable/Laptop”. This setting ensures that Core 2 Duo and Core Duo
processors run in LFM (lowest frequency mode) with minimal co re vol tage during desktop idle. Celeron M
processors do not support this feature and therefore always run at the same core voltage even during desktop
idle. Each module was tested while using a swissbit
different sizes of RAM, as well as two memory modules, will cause slight variances in the measured results.
Power consumption values were recorded during the following stages:

® DDR2 PC2-4200-444 512MB memory module. Using

Windows XP Professional SP2

Desktop Idle (1000MHz for 667MHz FSB or 800MHz for 533MHz FSB modules)
100% CPU workload (see note below)

COM 830 Reference Manual 7

Chapter 2 Specifications

Windows XP Professional Standby Mode (requires setup node “Suspend Mode” in the BIOS to be
configured to S1 POS [Power On Suspend])

Suspend to RAM (requires setup node “Suspend Mode” in BIOS to be configured to S3 STR [suspend to
RAM])

NOTE The PassMark, Burn-In Test-Suite was used to stress the CPU to 100% workload.

Processor Information

In the following power tables there is some additional information about the processors. Intel® offers
processors that are considered to be low power consuming. These processors can be identified by their
voltage status. Intel uses the following terms to describe these processors. If none of these terms are used
then the processor is not considered to be low power consuming.

LV=Low voltage
ULV=Ultra low voltage

When applicable, the above mentioned terms will be added to the power tables to describe the processor. For
example:

®

Intel

Core™ Duo L2400 1.66GHz 2MB L2 cache LV

®

Intel

also describes the type of manufacturing process used for each processor. The following term is

used:
nm=nanometer

The manufacturing process description is included in the power tables as well. See example below. For
information about the manufacturing process, visit Intel's website.

®

Intel

Core™ Duo L2400 1.66GHz 2MB L2 cache LV 65nm

Table 2-3. COM 830 Intel® Core™ Duo U2500 1.2GHz 2MB L2 cache

COM 830-R-30

Intel® Core™ Duo U2500 1.2GHz 2MB L2 cache
ULV 65nm

Layout Rev.B945LX0 /BIOS Rev. B945R007
Memory Size
Operating System
Power State Desktop Idle 100%

Power consumption (measured

512MB

Windows XP Professional SP2

Standby (S1) Suspend to

workload

Ram (S3)

0.99A/11.88 W 2.07A/24.84 W 1.62A/19.49W 0.81A/9.78W

in Amperes/Watts)

8 Reference Manual COM 830

Chapter 2 Specifications

Table 2-4. COM 830 Intel® Celeron M 423 1.07GHz 1MB L2 cache

COM 830-R-10

Memory Size
Operating System
Power State Desktop Idle 100%

Power consumption
(measured in Amperes/Watts)

NOTE All recorded power consumption values are approximate and only valid for the

controlled environment described earlier. Power consumption results will vary
depending on the workload of other components such as graphics engine,
memory, etc.

Intel® Celeron M 423 1.06GHz 1MB L2 cache
ULV 65nm

512MB
Windows XP Professional SP2

1.26A/15.10W 1.90A/22.82W 1.60A/19.23W 0.82A/9.86W

Environmental Specifications

Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%

workload

Standby (S1) Suspend to

Ram (S3)

CAUTION The above operating temperatures must be strictly adhered to at all times.

When using a heatspreader the maximum operating temperature refers to
any measurable spot on the heatspreader's surface.

Ampro strongly recommends that you use the appropriate module heatspreader as a thermal interface
between the module and your application’s cooling solution.

If for some reason it is not possible to use the appropriate module heatspreader, then it is the responsibility
of the operator to ensure that all components found on the module operate within the component
manufacturer’s specified temperature range.

COM 830 Reference Manual 9

Chapter 2 Specifications

Block Diagram

Composite Video

Component Video

S-Video

OR

CRT

LCD I/F

(LVDS)

SM Bus

AC’97 Digital Audio / HDA Interface

8x USB 2.0

2x SATA

GPIs/GPOs

A-B

LPC Bus

5x x1 PCIe Lanes

Gbit Ethernet

TV-Out

System Bus

(533 or 667MHz)

GMCH

Intel 82945GM

DMI Interface

[

[

3&,H

1x x1 PCIe Lane

PCI Express Graphics x16

x16

OR

DDR2-SODIMM

Socket (top)

Memory Bus
(533 or 667MHz)

DDR2-SODIMM

Socket (bottom)

PCI Bus

1x IDE

2x SDVO

(Primary)

Power Management and Control Signals

I2C

SPI

Fan

Control

10 Reference Manual COM 830

Chapter 2 Specifications

Heatspreader

An important factor for each system integration is the thermal design. The heatspreader acts as a thermal
coupling device to the module. It is a 3mm thick aluminum plate.

The heatspreader is thermally coupled to the CPU via a thermal gap filler and on some modules it may also
be thermally coupled to other heat generating components with the use of additional thermal gap fillers.

Although the heatspreader is the thermal interface where most of the heat generated by the module is
dissipated, it is not to be considered as a heatsink. It has been designed to be used as a thermal interface
between the module and the application specific thermal solution. The application specific thermal solution
may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal
solutions may also require that the heatspreader is attached directly to the systems chassis therefore using the
whole chassis as a heat dissipater.

CAUTION Att e nti on must be given to the mounting solution used to mount the heatspreader

and module into the system chassis. Do not use a threaded heatspreader together
with threaded carrier board standoffs. The combination of the two threads may be
staggered, which could lead to stripping or cross-threading of the threads in either
the standoffs of the heatspreader or carrier board.

COM 830 Reference Manual 11

Chapter 2 Specifications

Heatspreader Dimensions

Heatspreader is available for all variants of COM 830.

NOTE All measurements are in millimeters. Torque specification for heatspreader screws is 0.5

Nm.

12 Reference Manual COM 830

Chapter 2 Specifications

Connector Subsystems Rows A, B, C, D

The COM 830 is connected to the carrier board via two 220-pin connectors (COM Express Type 2 pinout)
for a total of 440 pins connectivity. These connectors are broken down into four rows. The primary
connector consists of rows A and B while the secondary connector consists of rows C and D.

In this view the connectors are seen “through” the module.

Primary Connector Rows A and B

The following subsystems can be found on the primary connector rows A and B.

Serial ATA™ (SATA)

Two Serial ATA150 connections are provided via the Intel® 82801GHM (ICH7M-DH). SATA is an
enhancement of the parallel A TA therefore offering higher performance. As a result of this enhancement the
traditional restrictions of parallel ATA are overcome with respect to speed and EMI. SATA starts with a
transfer rate of 150 Mbytes/s and can be expanded up to 600 Mbytes/s in order to accommodate future
developments. SATA is completely protocol and software compatible to parallel ATA.

USB 2.0

The COM 830 offers 4 UHCI USB host controllers and one EHCI USB host controller provided by the

®

Intel

82801GHM (ICH7M-DH). These controllers comply with USB standard 1.1 and 2.0 and offer a total

of 8 USB ports via connector rows A and B.

NOTE The USB controller is a PCI bus device. The BIOS allocates the necessary

system resources when configuring the PCI devices.

AC'97 Digital Audio Interface/HDA

The COM 830 provides an interface that supports the connection of AC'97 digital audio codecs as well as
HDA audio codecs.

Gigabit Ethernet

The COM 830 is equipped with a Marvell 88E8056 Gigabit Ethernet Controller. This controller is
implemented through the use of the sixth x1 PCI Express lane. The Ethernet interface consists of 4 pairs of
low voltage differential pair signals designated from GBE0_MD0 (+ and -) to GBE0_MD3 (+ and -) plus
control signals for link activity indicators. These signals can be used to connect to a 10/100/1000 BaseT
RJ45 connector with integrated or external isolation magnetics on the carrier board.

LPC Bus

COM 830 offers the LPC (Low Pin Count) bus through the use of the Intel® 82801GHM (ICH7M-DH).
There are already many devices available for this Intel defined bus. The LPC bus corresponds approximately
to a serialized ISA bus yet with a significantly reduced number of signals. Due to the software compatibility
to the ISA bus, I/O extensions such as additional serial ports can be easily implemented on an application
specific baseboard using this bus.

I²C Bus 400kHz

The I²C bus is implemented through the use of AT MEL ATmega168 microcontroller. It provides a Fast
Mode (400kHz max.) multi-master I²C Bus that has maximum I²C bandwidth.

COM 830 Reference Manual 13

Chapter 2 Specifications

PCI Express™

The COM 830 offers 6x x1 PCI Express lanes via the Intel 82801GHM (ICH7M-DH), which can be
configured to support PCI Express edge cards or ExpressCards. One of the six x1 PCI Express lane is
utilized by the onboard Ethernet controller therefore there are only 5x x1 PCI Express lanes available on the
A,B connector row. The PCI Express interface is based on the PCI Express Specification 1.0a.

ExpressCard™

The COM 830 supports the implementation of ExpressCards, which require the dedication of one USB port
and one PCI Express lane for each ExpressCard used.

Graphics Output (VGA/CRT)

The COM 830 graphics are driven by an Intel Graphics Media Accelerator 950 engine, which is
incorporated into the Intel 82945GM chipset found on the COM 830. This graphic engine offers

significantly higher performance than the Intel

Extreme Graphics Engine found on other Intel chipsets.

LCD

The Intel 82945GM chipset, found on the COM 830, offers an integrated dual channel LVDS interface that
is connected to Display Pipe B.

TV-Out

TV-Ou t su pport is integrated into the Intel 82945GM chipset and is supported on both Display Pipe A and
Pipe B.

Power Control

PWR_OK

Power OK from main power supply. A high value indicates that the power is good. Using this input is
optional. Through the use of an internal monitor on the +12V ± 5% input voltage and/or the internal power
supplies the COM 830 module is capable of generating its own power-on reset. According to the COM
Express PWR_OK is a 3.3V signal.

The COM 830 provides support for controlling ATX-style power supplies. When not using an ATX power
supply then the COM 830's pins SUS_S3/PS_ON, 5V_SB, and PWRBTN# should be left unconnected.

SUS_S5#/PS_ON#

The SUS_S5#/PS_ON# (pin A24 on the A-B connector) signal is an active-high output that can be used to
turn on the main outputs of an ATX-style power supply. In order to accomplish this the signal must be
inverted with an inverter/transistor that is supplied by standby voltage and is locat ed on the carrier board.

PWRBTN#

When using ATX-style power supplies PWRBTN# (pin B12 on the A-B connector) is used to connect to a
momentary-contact, active-low debounced pushbutton input while the other termin al on the pushbutton
must be connected to ground. This signal is internally pulled up to 3V_SB using a 10k resistor. When
PWRBTN# is asserted it indicates that an operator wants to turn the power on or off. The response to this
signal from the system may vary as a result of modifications made in BIOS settings or by system software.

14 Reference Manual COM 830

Chapter 2 Specifications

Power Supply Implementation Guidelines

12 volt input power is the sole operational power source for the COM 830. The remaining necessary
voltages are internally generated on the module using onboard voltage regulators. A baseboard designer
should be aware of the following important information when designing a power supply for a COM 830
application:

It has also been noticed that on some occasions problems occur when using a 12V power supply that
produces non monotonic voltage when powered up. The problem is that some internal circuits on the module
(e.g. clock-generator chips) will generate their own reset signals when the supply voltage exceeds a certain
voltage threshold. A voltage dip after passing this threshold may lead to these circuits becoming confused
resulting in a malfunction. It must be mentioned that this problem is quite rare but has been observed in
some mobile power supply applications. The best way to ensure that this problem is not encountered is to
observe the power supply rise waveform through the use of an oscilloscope to determine if the rise is indeed
monotonic and does not have any dips. This should be done during the power supply qualification phase
therefore ensuring that the above mentioned problem doesn't arise in the application. For more information
about this issue visit www.formfactors.org and view page 25 figure 7 of the document “ATX12V Power
Supply Design Guide V2.2”.

Power Management

APM 1.2 compliant. ACPI 2.0 compliant with battery support. Also supports Suspend to RAM (S3).

Secondary Connector Rows C and D

The following subsystems can be found on the secondary connector rows C and D.

PCI Express Graphics (PEG)

The COM 830 supports the implementation of a x16 link for an external high-performance PCI Express
Graphics card. It supports a theoretical bandwidth of up to 4GB/s. Each lane of the PEG Port consists of a
receive and transmit differential signal pair designated from PEG_RX0 (+ and -) to PEG_RX15 (+ and -)
and correspondingly from PEG_TX0 (+ and -) to PEG_RX15 (+ and -). It's also possible to utilize a
standardized Advanced Digital Display Card 2nd Generation (ADD2-based on SDVO) via the x16 PEG
Port connector, which can support a wide variety of display options like DVI, LVDS, TV-Out and HDMI.

SDVO

The pins of PEG Port are shared with the Serial Digital Video Ouput (SDVO) functionality and may be
alternatively used for two third party SDVO compliant devices connected to channels B and C.

PCI Bus

The implementation of the PCI bus complies with PCI specification Rev. 2.3 and provides a 32bit parallel
PCI bus that is capable of operating at 33MHz.

IDE

The IDE host adapter is capable of UDMA-100 operation. Only the Primary IDE channel is supported.

Additional Features

Watchdog

The COM 830 is equipped with a multi stage watchdog solution that is triggered by softw are. The COM
Express Specification does not provide support for external hardware triggering of the Watchdog, which
means the COM 830 does not support external hardware triggering.

COM 830 Reference Manual 15

Chapter 2 Specifications

Onboard Microcontroller

The COM 830 is equipped with an A TMEL Atmega168 microcontroller . This onboard microcontroller plays
an important role for most of the BIOS features. It fully isolates some of the embedded features such as
system monitoring or the I²C bus from the x86 core architecture, which results in higher embedded feature
performance and more reliability , even when the x86 processor is in a low power mode.

Embedded BIOS

The COM 830 is equipped with Embedded BIOS and has the following features:

ACPI Power Management
ACPI Battery Support
Supports Customer Specific CMOS Defaults
Multistage Watchdog
User Data Storage
Manufacturing Data and Board Information
OEM Splash Screen
Flat Panel Auto Detection
BIOS Setup Data Backup
Fast Mode I²C Bus

16 Reference Manual COM 830

Chapter 2 Specifications

Simplified Overview of BIOS Setup Data Backup

Ampro,

Ampro

The above diagram provides an overview of how the BIOS Setup Data is backed up on modules. OEM
default values mentioned above refer to customer specific CMOS settings created using the System Utility
tool.

Once the BIOS Setup Program has been entered and the settings have been changed, the user saves the
settings and exits the BIOS Setup Program using the F10 key feature. After the F10 function has been
evoked, the CMOS Data is stored in a dedicated non-volatile CMOS Data Backup area located in the BIOS
Flash Memory chip as well as RTC. The CMOS Data is written to and read back from the CMOS Data
Backup area and verified. Once verified the F10 Save and Exit function continues to perform some minor
processing tasks and finally reaches an automatic reset point, which instructs the module to reboot. After the
Automatic Reset has been triggered the module can be powered off and if need be removed from the
baseboard without losing the new CMOS settings.

COM 830 Reference Manual 17

Chapter 2 Specifications

Security Features

The COM 830 can be equipped optionally with a “Trusted Platform Module” (TPM 1.2). This TPM 1.2
includes co-processors to calculate efficient hash and RSA algorithms with key lengths up to 2,048 bits as
well as a real random number generator. Security sensitive applications like gaming and e-commerce will
benefit also with improved authentication, integrity and confidence levels.

Suspend to Ram

The Suspend to RAM feature is available on the COM 830.

Ampro Tech Notes

The COM 830 has some technological features that require additional explanation. The following section
will give the reader a better understanding of some of these features. This information will also help to gain
a better understanding of the information found in the System Resources section of this manual as well as
some of the setup nodes found in the BIOS Setup Program description section.

Comparison of I/O APIC to 8259 PIC Interrupt mode

I/O APIC (Advanced Programmable Interrupt controller) mode deals with interrupts differently than the
8259 PIC.

The method of interrupt transmission used by APIC mode is implemented by transmitting interrupts through
the system bus and they are handled without the requirement of the processor to perform an interrupt
acknowledge cycle.

Another difference between I/O APIC and 8259 PIC is the way the interrupt numbers are prioritized. Unlike
the 8259 PIC, the I/O APIC interrupt priority is independent of the actual interrupt number.

A major advantage of the I/O APIC found in the chipset of the COM 830 is that it's able to provide more
interrupts, a total of 24 to be exact. It must be mentioned that the APIC is not supported by all operating
systems. In order to utilize the APIC mode it must be enabled in the BIOS setup program before the
installation of the OS and it only functions in ACPI mode. You can find more information about APIC in the
IA-32 Intel Architecture Software Developer's Manual, Volume 3 in chapter 8.

NOTE You must ensure that your operating system su pports APIC mode in order to use it.

Intel® Matrix Storage Technology

The ICH7M-DH provides support for Intel® Matrix Storage Technology, providing both AHCI and
integrated RAID functionality.

AHCI

The ICH7M-DH provides hardware support for Advanced Host Controller Interface (AHCI), a new
programming interface for SATA host controllers. Platforms supporting AHCI may take advantage of
performance features such as no master/slave designation for SATA devices (each device is treated as a
master) and hardware-assisted native command queuing. AHCI also provides usability enhancements such
as Hot-Plug.

RAID

The industry-leading RAID capability provides high performance RAID 0 and 1 functionality on the 2
SATA ports of ICH7M-DH. Software components include an Option ROM for pre-boot configuration and
boot functionality, a Microsoft* Windows* compatible driver, and a user interface for configuration and
management of the RAID capability of ICH7M-DH.

18 Reference Manual COM 830

Chapter 2 Specifications

Native vs. Compatible IDE mode

Compatible Mode

When operating in compatible mode, the SATA and PATA (Parallel ATA) controller together need two
legacy IRQs (14 and 15) and are unable to share these IRQs with other devices. This is a result of the fact
that the SATA and PATA controller emulate legacy IDE controllers.

Native Mode

Native mode allows the SATA and PA TA controllers to operate as true PCI devices and therefore do not need
dedicated legacy resources, which means it can be configured anywhere within the system. When either the
SATA or PATA controll er runs in native mode it only requires one PCI interrupt for both channels and also
has the ability to share this interrupt with other devices in the system. Setting Enhanced mode in the BIOS
setup program will automatically enable Native mode as Native mode is a subset of Enhanced mode.

Running in native mode frees up interrupt resour ces (IRQs 14 and 15) and decreases the chance that there
may be a shortage of interrupts when installing devices.

NOTE If your operating system supports native mode then Ampro recommends you

enable it.

Intel® Processor Features

Thermal Monitor and Catastrophic Thermal Protection

Intel® Core™ 2 Duo, Core™ Duo and Celeron M processors have a thermal monitor feature that helps to
control the processor temperature. The integrated TCC (Thermal Control Circuit) activates if the processor
silicon reaches its maximum operating temperature. The activation temperature, that the Intel Thermal
Monitor uses to activate the TCC, cannot be configured by the user nor is it software visible.

The Thermal Monitor can control the processor temperature through the use of two different methods
defined as TM1 and TM2. TM1 method consists of the modulation (starting and stopping) of the processor
clocks at a 50% duty cycle. The TM2 method initiates an Enhanced Intel Speedstep transition to the lowest
performance state once the processor silicon reaches the maximum operating temperature.

NOTE The maximum operating temperature for Intel Core™ 2 Duo, Core™ Duo and

Celeron M processors is 100°C. TM2 mode is used for Intel Core 2 Duo and
Core Duo processors, it is not supported by Intel Celeron M processors.

Two modes are supported by the Thermal Monitor to activate the TCC. They are called Automatic and On­Demand. No additional hardware, software, or handling routines are necessary when using Autom atic
Mode.

NOTE T o ensure that the TCC is active for only short periods of time thus reducing the

impact on processor performance to a minimum, it is necessary to have a
properly designed thermal solution. The Intel Core 2 Duo, Core™ Duo and
Celeron M processor's respective datasheet can provide you with more
information about this subject.

THERMTRIP# signal is used by Intel's Intel Core 2 Duo, Core Duo and Celeron M processors for
catastrophic thermal protection. If the processor's silicon reaches a temperature of approximately 125°C then
the processor signal THERMTRIP# will go active and the system will automatically shut down to prevent

COM 830 Reference Manual 19

Chapter 2 Specifications

any damage to the processor as a result of overheating. The THERMTRIP# signal activation is completely
independent from processor activity and therefore does not produce any bus cycles.

NOTE In order for THERMTRIP# to be able to automatically switch off the system it is

necessary to use an ATX style power supply.

Processor Performance Control

Intel® Core™ 2 Duo and Core™ Duo processors run at different voltage/frequency states (performance
states), which is referred to as Enhanced Intel

®

SpeedStep® technology (EIST). Operating systems that
support performance control take advantage of microprocessors that use several different performance states
in order to efficiently operate the processor when it is not being fully utilized. The operating system will
determine the necessary performance state that the processor should run at so that the optimal balance
between performance and power consumption can be achieved during runtime.

The Windows family of operating systems links its processor performance control policy to the power
scheme setting found in the control panel option applet.

NOTE If the “Home/Office” or “Always On” power scheme is selected when using

Windows operating systems then the processor will always run at the highest
performance state. For more information about this subject see chapter 8 of the
ACPI Specification Revision 2.0c, which can be found at www.acpi.info. Also
visit Microsoft's website and search for the document called “Windows Native
Processor Performance Control”.

The Ampro BIOS allows you to limit the maximum processor frequency . This can be useful if the maximum
performance is not required or if the maximum processor perform ance state dissipates too much power and
heat.

In the 'CPU Configuration' submenu of the 'BIOS Setup Program' you'll find the node for 'Max. Frequency'
limitation. For each Intel Core 2 Duo and Core Duo processor the BIOS lists the supported frequencies. If a
lower frequency than the maximum one is selected, the processor will never run at frequencies above this
setting.

Celeron M processors do not support Enhanced Intel SpeedStep

®

technology. They always run at a fixed
frequency. In order to limit the performance and power consumption of Celeron M processors, the BIOS
offers 'On-Demand Clock Modulation' support in the 'CPU Configuration' submenu of the 'BIOS Setup
Program'. When 'On-Demand Clock Modulation' is enabled, the processor clock is throttled using the duty
cycle determined in setup. Keep in mind that the 'On-Demand' clock modulation duty cycle indicates that the
clock on to clock off interval ratio. This means that when set to 75% the clock is running 75% of the overall
time and this leads to a performance decrease of approximately 25%.

Intel 64

The formerly known Intel Extended Memory 64 Technology is an enhancement to Intel's IA-32 architecture.
Intel 64 is only available on Core 2 Duo processors and is designed to run newly written 64-bit code and
access more than 4GB of memory. Processors with Intel 64 architecture support 64-bit-capable operating
systems from Microsoft and Red Hat. Processors running in legacy mode remain fully compatible with
today's existing 32-bit applications and operating systems.

Platforms with Intel 64 can be run in three basic ways:

1. Legacy Mode: 32-bit operating system and 32-bit applicat ion s. In th is mod e no software changes are

required, however the benefits of Intel 64 are not utilized.

2. Compatibility Mode: 64-bit operating system and 32 -bi t appl ications. This mode requires all device

drivers to be 64-bit. The operating system will see the 64-bit extensio ns but the 32-bit application will
not. Existing 32-bit applications do not need to be recompiled and may or may not benefit from the 64­bit extensions. The application will likely need to be re-certified by the vendor to run on the new 64-bit
extended operating system.

20 Reference Manual COM 830

Chapter 2 Specifications

3. 64-bit Mode: 64-bit operating system and 64-bit applications. This usage requires 64-bit device drivers.

It also requires applications to be modified for 64-bit operation and then recompiled and validated.
Intel 64 provides support for:

64-bit flat virtual address space
64-bit pointers
64-bit wide general purpose registers
64-bit integer support
Up to one Terabyte (TB) of platform address space

You can find more information about Intel 64 Technology at: http://developer.intel.com/technology/intel64/
index.htm

NOTE Ampro does not intend to offer BSPs for 64-bit operating systems. Contact

technical support if you plan to use a 64-bit operating system on the COM 830.

Intel® Virtualization Technology

Virtualization solutions enhanced by Intel VT will allow a Core Duo and Core 2 Duo platform to run
multiple operating systems and applications in independent partitions. When using virtualization
capabilities, one computer system can function as multiple "virtual" systems. With processor and I/O
enhancements to Intel's various platforms, Intel Virtualization T echnology can improve the performance and
robustness of today's software-only virtual machine solutions.

Intel VT is a multi-generational series of extensions to Intel processor and platform architecture that
provides a new hardware foundation for virtualization, establishing a common infrastructure for all classes
of Intel based systems. The broad availability of Intel VT makes it possible to create entirely new
applications for virtualization in servers, clients as well as embedded systems thus providing new ways to
improve system reliability, manageability, security, and real-time quality of service.

The success of any new hardware architecture is highly dependent on the system software that puts its new
features to use. In the case of virtualization technology, that support comes from the virtual machine monitor
(VMM), a layer of software that controls the underlying physical platform resources sharing them between
multiple "guest" operating systems. Intel VT is already incorporated into most commercial and open-source
VMMs including those from VMware, Microsoft, XenSource, Parallels, Virtual Iron, Jaluna and TenAsys.

You can find more information about Intel Virtualization Technology at: http:// developer.intel.com/
technology/virtualization/index.htm

NOTE Ampro does not offer virtual machine monitor (VMM) software. All VMM

software support questions and queries should be directed to the VMM software
vendor and not technical support.

Thermal Management

ACPI is responsible for allowing the operating system to play an important part in the system's thermal
management. This results in the operating system having the ability to take control of the operating
environment by implementing cooling decisions according to the demands put on the CPU by the
application.

The COM 830 ACPI thermal solution offers three different cooling policies.

Passive Cooling

When the temperature in the thermal zone must be reduced, the operating system can decrease the power
consumption of the processor by throttling the processor clock. One of the advantages of this cooling policy
is that passive cooling devices (in this case the processor) do not produce any noise. Use the “passive
cooling trip point” setup node in the BIOS setup program to determine the temperature threshold that the
operating system will use to start or stop the passive cooling procedure.

COM 830 Reference Manual 21

Chapter 2 Specifications

Active Cooling

During this cooling policy the operating system is turning the fan on/off. Although active cooling devices
consume power and produce noise, they also have the ability to cool the thermal zone without having to
reduce the overall system performance. Use the “active cooling trip point” setup node in the BIOS setup
program to determine the temperature threshold that the operating system will use to start the active cooling
device. It is stopped again when the temperature goes below the threshold (5°C hysteresis).

Critical Trip Point

If the temperature in the thermal zone reaches a critical point then the operating system will perform a
system shut down in an orderly fashion in order to ensure that there is no damage done to the system as
result of high temperatures. Use the “critical trip point” setup node in the BIOS setup program to determine
the temperature threshold that the operating system will use to shut down the system.

NOTE The end user must determine the cooling preferences for the system by using the

setup nodes in the BIOS setup program to establish the appropriate trip points.

If passive cooling is activated and the processor temperature is above the trip point the
processor clock is throttled according to the formula below.

ΔP[%] = TC1(T
ΔP is the performance delta

is the target temperature = critical trip point.

T

t

The two coefficients TC1 and TC2 and the sampling period TSP are hardware
dependent constants. These constants are set to fixed values for the COM 830:

TC1= 1
TC2= 5
TSP= 5 seconds
See section 12 of the ACPI Specification 2.0 C for more information about passive

cooling.

) + TC2(Tn-Tt)

n-Tn-1

ACPI Suspend Modes and Resume Events

COM 830 supports the S1 (POS= Power On Suspend) state and S3 (STR= Suspend to RAM). For more
information about S3 wake events see section “ACPI Configuration Submenu”.

S4 (Suspend to Disk) is not supported by the BIOS (S4_BIOS) but it is supported by the following operating
systems (S4_OS= Hibernate):

Win2K
WinXP
The following table lists the “Wake Events” that resume the system from both S1 or S3 unless otherwise

stated in the “Conditions/Remarks” column:

Wake Event Conditions/Remarks

Power Button Wakes unconditionally from S1-S5.
GPI1# Only if configured as Lid Switch in the ACPI setup menu. Additionally the

lid button has to be activated using the Windows Power Options. The best
way to use it is to go to Standby (see note below) on lid button press and
wake from Standby (see note below) on lid button release.

22 Reference Manual COM 830