AMD Am129LV800B Service Manual
SUPPLEMENT
Am29LV800B Known Good Die
8 Megabit (1 M x 8-Bit/512 K x 16-Bit)
CMOS 3.0 Volt-only, Boot Sector Flash Memory—Die Revision 1
DISTINCTIVE CHARACTERISTICS
■ Single power supply operation
— 2.7 to 3.6 V for read, program, and erase
operations
— Ideal for battery-powered applications
■ Manufactured on 0.35 µm process technology
■ High performance
— 90 or 120 ns access time
■ Low power consumption (typical values at 5
MHz)
— 200 nA Automatic Sleep mode current
— 200 nA standby mode current
— 7 mA read current
— 15 mA program/erase current
■ Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
fifteen 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and
fifteen 32 Kword sectors (word mode)
— Supports full chip erase
— Sector Protection features:
A hardware method of locking a sector to
prevent any program or erase operations within
that sector
Sectors can be locked in-system or via
programming equipment
T emporary Sector Unprotect feature allows code
changes in previously locked sectors
■ Unlock Bypass Program Command
— Reduces overall programming time when
issuing multiple program command sequences
■ Top or bottom boot block configurations
available
■ Embedded Al gorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
■ Minimum 1,000,000 write cycle guarantee per
sector
■ Compatibility with JEDEC standards
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
■ Data# Polling and toggle bits
— Provides a software method of detecting
program or erase operation completion
■ Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
program or erase cycle completion
■ Erase Suspend/Erase Resume
— Suspends an erase operation to read data fr om,
or program data to, a sector that is not being
erased, then resumes the erase operation
■ Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
array data
Publication# 21356 Rev: B Amendment/+1
Issue Date: March 1998
SUPPLEMENT
GENERAL DESCRIPTION
The Am29LV800B in Known Good Die (KGD) form is
an 8 Mbit, 3.0 volt-only Flash memory. AMD defines
KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same
reliability and q uality as AMD produc ts in packaged
form.
The host system can detect whether a program or
erase operation is complete by observing the RY/BY#
pin, or by re ading the DQ7 (D ata# Polling) and DQ6
(toggle) status bits. After a program or erase cycle has
been completed, the device is ready to read array data
or accept another command.
Am29LV800B Features
The Am29LV800B is an 8 Mbit, 3.0 volt-only Flash
memory organized as 1,048,576 bytes or 524,288
words. The word-w ide data (x16) ap pears on DQ15–
DQ0; the byte-wide (x 8) data appears on D Q7–DQ0.
To eliminate bus contention the device has separate
chip enable (CE#), write enable (WE#) and output
enable (OE#) controls.
The device requires only a single 3.0 volt p ower
supply for both read and write functions. Internally
generated and regulated voltages are provided for the
program and erase operations. No V
program or erase operations. The device can also be
programmed in standard EPROM programmers.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents
serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles
also internally latch addresses and data n eeded for the
programming and erase operations. Reading data out
of the device is similar to reading from other Flash or
EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the Embedded
Program algorithm—an internal algorithm that automatically times the program pulse widths and verifies
proper cell margin. The Unlock Bypass mode facili-
tates faster program ming times by req uiring only two
write cycles to program data instead of four.
Device erasure occurs by executing the erase
command sequence. This initiates the Embedded
Erase algorithm—an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation.
During erase, the device automatically t i mes t he erase
pulse widths and verifies proper cell margin.
is required for
PP
The sec tor erase arc hitecture allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection measures include a low
detector that automatically inhibits write opera-
V
CC
tions during p ower transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of
memory. This can be achieved in-system or via programming equipment.
The Er ase Suspend feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved.
The hardware RESET# pin terminates any operation
in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the
system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor
to read the boot-up firmware from the Flash memory.
The device offers two pow er-saving features. When
addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode.
The system can also place the device into the standby
mode. Power consumption is greatly reduced in both
these modes.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effectiveness. The device e lectrically erases a ll b its wit hin
a sector simultaneously via Fowler-Nordheim tunneling. The data is programmed using hot electron
injection.
ELECTRICAL SPECIFICATIONS
Refer to the Am29LV800B data sheet, publication
number 21490, for full electrical specification s on the
Am29LV800B in KGD form.
2 Am29LV800B Known Good Die
SUPPLEMENT
PRODUCT SELECTOR GUIDE
Family Part Number Am29LV800B KGD
Speed Option (V
Max Access Time, t
Max CE# Access, t
Max OE# Access, t
= 2.7 – 3.6 V) -90 -120
CC
(ns) 90 120
ACC
(ns) 90 120
CE
(ns) 35 50
OE
DIE PHOTOGRAPH
Orientation relative
to top left corner of
Gel-Pak
Orientation relative
to leading edge of
tape and reel
Am29LV800B Known Good Die 3
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