AMD 780E Technical Reference Manual

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AMD 780E

Databook

Technical Reference Manual

Rev. 3.10

P/N: 45732_rs780e_ds_pub

Please note that in this databook, references to "DVI" and "HDMI" refer to the capa bility of the TMDS interface, multiplexed on the PCI-E external graphics interface, to enable DVI or HDMI through passive enabling circuitries. Any statement in this databook on any DVI or HDMI-related functionality must be understood in that context.

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Trademarks

AMD, the AMD Arrow logo, AMD Athlon, and combinations thereof, ATI, ATI logo, ATI Radeon, ATI Avivo, PowerPlay, PowerShift, PowerXpress, ATI HyperMemory, 3Dc, Cool'n'Quiet, AMD OverDrive, and AMD PowerNow! are trademarks of Advanced Micro Devices, Inc.

DisplayPort is a trademark of VESA.

HDMI, the HDMI Logo and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC.

HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.

C is a trademark of Philips.

Linux is a registered trademark of Linus Torvalds.

Macrovision is a registered trademark of Macrovision Corporation in the United States and/or other countries.

Microsoft, Windows, Windows Vista, DirectDraw, and DirectX are registered trademarks of Microsoft Corporation.

OpenGL is a registered trademark of SGI.

PCI Express is a registered trademark of PCI-SIG.

WinBench is a registered trademark of Ziff Davis, Inc.

Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

Disclaimer

The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel, or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD's Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

AMD's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD's product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice.

Table of Contents

Chapter 1: Overview

1.1 Introducing the AMD 780E ................................................................................................................................................1-1

1.2 RS780E Features.................................................................................................................................................................1-2

1.2.1 CPU HyperTransport™ Interface.........................................................................................................................1-2

1.2.2 Memory Interface .................................................................................................................................................1-2

1.2.3 ATI HyperMemory™...........................................................................................................................................1-2

1.2.4 PCI Express® Interface ........................................................................................................................................1-3

1.2.5 A-Link Express II Interface..................................................................................................................................1-4

1.2.6 2D Acceleration Features .....................................................................................................................................1-4

1.2.7 3D Acceleration Features .....................................................................................................................................1-4

1.2.8 Motion Video Acceleration Features....................................................................................................................1-5

1.2.9 Multiple Display Features ....................................................................................................................................1-5

1.2.10 Integrated LVDS/TMDS (LVTM) Interface ........................................................................................................1-7

1.2.11 DVI/HDMI™ .......................................................................................................................................................1-7

1.2.12 DisplayPort™ Interface........................................................................................................................................1-7

1.2.13 Integrated HD Audio Controller and Codec.........................................................................................................1-8

1.2.14 Clock Generation..................................................................................................................................................1-8

1.2.15 Power Management Features ...............................................................................................................................1-8

1.2.16 PC Design Guide Compliance..............................................................................................................................1-8

1.2.17 Test Capability Features .......................................................................................................................................1-9

1.2.18 Additional Features ..............................................................................................................................................1-9

1.2.19 Packaging .............................................................................................................................................................1-9

1.3 Software Features................................................................................................................................................................1-9

1.4 Branding Diagram.............................................................................................................................................................1-10

1.5 Graphics Device ID and Graphics Engine Clock Speed...................................................................................................1-10

1.6 Conventions and Notations ...............................................................................................................................................1-10

1.6.1 Pin Names...........................................................................................................................................................1-10

1.6.2 Pin Types ............................................................................................................................................................1-10

1.6.3 Numeric Representation .....................................................................................................................................1-11

1.6.4 Register Field......................................................................................................................................................1-11

1.6.5 Hyperlinks ..........................................................................................................................................................1-11

1.6.6 Acronyms and Abbreviations .............................................................................................................................1-11

Chapter 2: Functional Descriptions

2.1 Host Interface......................................................................................................................................................................2-1

2.2 Side-Port Memory Interface................................................................................................................................................2-3

2.2.1 DDR2 Memory Interface......................................................................................................................................2-3

2.2.1.1 Supported DDR2 Components 4

2.2.1.2 Row and Column Addressing 4

2.2.2 DDR3 Memory Interface......................................................................................................................................2-5

2.2.2.1 Supported DDR3 Components 5

2.2.2.2 Row and Column Addressing 5

2.3 LVTM (LVDS/TMDS) Interface........................................................................................................................................2-6

2.4 LVDS ..................................................................................................................................................................................2-7

2.4.1 LVDS Data Mapping............................................................................................................................................2-7

2.4.2 LVDS Spread Spectrum .....................................................................................................................................2-12

2.5 DVI/HDMI™....................................................................................................................................................................2-13

2.5.1 DVI/HDMI™ Data Transmission Order and Signal Mapping ..........................................................................2-13

Table of Contents

2.5.2 Support for HDMI™ Packet Types ................................................................................................................... 2-16

2.6 VGA DAC Characteristics ............................................................................................................................................... 2-17

2.7 DVI-I Support .................................................................................................................................................................. 2-18

2.8 Clock Generation.............................................................................................................................................................. 2-18

Chapter 3: Pin Descriptions and Strap Options

3.1 Pin Assignment Top View ................................................................................................................................................. 3-2

3.1.1 RS780E Pin Assignment Top View .................................................................................................................... 3-2

3.2 Interface Block Diagram .................................................................................................................................................... 3-4

3.3 CPU HyperTransport™ Interface ...................................................................................................................................... 3-5

3.4 Side-port Memory Interface............................................................................................................................................... 3-5

3.5 PCI Express® Interfaces .................................................................................................................................................... 3-6

3.5.1 1 x 16 or 2 x 8 Lane Interface for External Graphics .......................................................................................... 3-6

3.5.2 A-Link Express II Interface for Southbridge....................................................................................................... 3-6

3.5.3 6 x 1 Lane Interface for General Purpose External Devices .............................................................................. 3-6

3.5.4 Miscellaneous PCI Express® Signals ................................................................................................................. 3-6

3.6 Clock Interface ................................................................................................................................................................... 3-7

3.7 CRT Interface..................................................................................................................................................................... 3-7

3.8 LVTM Interface ................................................................................................................................................................. 3-8

3.8.1 LVTM Interface in LVDS Mode......................................................................................................................... 3-8

3.8.2 LVTM Interface in TMDS Mode ........................................................................................................................ 3-9

3.9 TMDS Interface Multiplexed on the PCI Express® Graphics Lanes .............................................................................. 3-10

3.10 DisplayPort™ Interface.................................................................................................................................................. 3-10

3.11 Power Management Pins................................................................................................................................................3-11

3.12 Miscellaneous Pins......................................................................................................................................................... 3-12

3.13 Power Pins...................................................................................................................................................................... 3-12

3.14 Ground Pins.................................................................................................................................................................... 3-13

3.15 Strapping Options........................................................................................................................................................... 3-14

Chapter 4: Timing Specifications

4.1 HyperTransportTM Bus Timing ........................................................................................................................................ 4-1

4.2 HyperTransportTM Reference Clock Timing Parameters ................................................................................................. 4-1

4.3 PCI Express® Differential Clock AC Specifications......................................................................................................... 4-2

4.4 Timing Requirements for REFCLK_P Used as OSCIN (14.3181818MHz) ..................................................................... 4-2

4.5 Side-port Memory Timing for DDR2 Mode...................................................................................................................... 4-2

4.5.1 Read Cycle DQ/DQS Delay ................................................................................................................................4-2

4.5.2 Write Cycle DQ/DQS Delay ............................................................................................................................... 4-3

4.6 LVDS Timing..................................................................................................................................................................... 4-3

4.7 Power Rail Power-up Sequence ......................................................................................................................................... 4-4

4.8 LCD Panel Power Up/Down Timing ................................................................................................................................. 4-5

Chapter 5: Electrical Characteristics and Physical Data

5.1 Electrical Characteristics.................................................................................................................................................... 5-1

5.1.1 Maximum and Minimum Ratings........................................................................................................................ 5-1

5.1.2 DC Characteristics............................................................................................................................................... 5-2

5.2 RS780E Thermal Characteristics ....................................................................................................................................... 5-7

5.2.1 RS780E Thermal Limits ...................................................................................................................................... 5-7

5.2.2 Thermal Diode Characteristics ............................................................................................................................ 5-8

Table of Contents

5.3 Package Information ...........................................................................................................................................................5-9

5.3.1 Physical Dimensions ............................................................................................................................................5-9

5.3.2 Pressure Specification ........................................................................................................................................5-10

5.3.3 Board Solder Reflow Process Recommendations ..............................................................................................5-11

5.3.3.1 Stencil Opening Size for Solder Paste Pads on PCB 11

5.3.3.2 Reflow Profile 11

Chapter 6: Power Management and ACPI

6.1 ACPI Power Management Implementation ........................................................................................................................6-1

6.2 Power Management for the Graphics Controller ................................................................................................................6-2

6.2.1 PCI Function Power States...................................................................................................................................6-2

6.2.2 PCI Power Management Interface........................................................................................................................6-2

6.2.3 Capabilities List Data Structure in PCI Configuration Space ..............................................................................6-2

6.2.4 Register Block Definition.....................................................................................................................................6-3

6.2.5 Capability Identifier: CAP_ID (Offset = 0) .........................................................................................................6-4

6.2.6 Next Item Pointer (Offset = 1) .............................................................................................................................6-5

6.2.7 PMC - Power Management Capabilities (Offset = 2) ..........................................................................................6-6

Chapter 7: Testability

7.1 Test Capability Features......................................................................................................................................................7-1

7.2 Test Interface.......................................................................................................................................................................7-1

7.3 XOR Test ............................................................................................................................................................................7-1

7.3.1 Description of a Generic XOR Tree.....................................................................................................................7-1

7.3.2 Description of the RS780E XOR Tree .................................................................................................................7-2

7.3.3 XOR Tree Activation ...........................................................................................................................................7-2

7.3.4 XOR Tree for the RS780E ...................................................................................................................................7-2

7.4 VOH/VOL Test...................................................................................................................................................................7-4

7.4.1 Description of a Generic VOH/VOL Tree ...........................................................................................................7-4

7.4.2 VOH/VOL Tree Activation..................................................................................................................................7-5

7.4.3 VOH/VOL Pin List...............................................................................................................................................7-6

Appendix A: Pin Listings

A.1 RS780E Pin List Sorted by Ball Reference........................................................................................................................1-2

A.2 RS780E Pin List Sorted by Pin Name................................................................................................................................1-7

Appendix B: Revision History

Table of Contents

This page is left blank intentionally.

List of Figures

Figure 1-1: Possible Configurations for the x16 PCI-E Graphics Interface .................................................................................. 1-3

Figure 1-2: RS780E Multiple Display Options .............................................................................................................................. 1-6

Figure 1-3: RS780E ASIC A13 Production Branding ................................................................................................................. 1-10

Figure 2-1: RS780E Internal Block Diagram ................................................................................................................................. 2-1

Figure 2-2: Host Interface Block Diagram ..................................................................................................................................... 2-2

Figure 2-3: RS780E Host Bus Interface Signals ............................................................................................................................ 2-3

Figure 2-4: RS780E Side-Port Memory Interface .......................................................................................................................... 2-4

Figure 2-5: LVTM Interface of the RS780E ................................................................................................................................. 2-6

Figure 2-6: Single/Dual Channel 18-bit LVDS Data Transmission Ordering ............................................................................... 2-7

Figure 2-7: Single/Dual Channel 24-bit LVDS Data Transmission Ordering ............................................................................. 2-10

Figure 2-8: Data Transmission Ordering for the TMDS Interfaces ............................................................................................. 2-13

Figure 2-9: Pins for Analog Output on the DVI-I Connector ...................................................................................................... 2-18

Figure 3-1: RS780E Pin Assignment Top View (Left) .................................................................................................................. 3-2

Figure 3-2: RS780E Pin Assignment Top View (Right) ................................................................................................................ 3-3

Figure 3-3: RS780E Interface Block Diagram ............................................................................................................................... 3-4

Figure 4-1: RS780E Power Rail Power-up Sequence .................................................................................................................... 4-4

Figure 4-2.: LCD Panel Power Up/Down Timing ......................................................................................................................... 4-5

Figure 5-1: DC Characteristics of the TMDS Interfaces ................................................................................................................ 5-5

Figure 5-2: DC Characteristics of the LVDS Interface .................................................................................................................. 5-6

Figure 5-1: RS780E 528-Pin FCBGA Package Outline ................................................................................................................ 5-9

Figure 5-2: RS780E Ball Arrangement (Bottom View) ............................................................................................................... 5-10

Figure 5-3: Recommended Stencil Opening Sizes for Solder Paste Pads on PCB ...................................................................... 5-11

Figure 5-4: RoHS/Lead-Free Solder (SAC305/405 Tin-Silver-Copper) Reflow Profile ............................................................ 5-12

Figure 6-1: Linked List for Capabilities ......................................................................................................................................... 6-5

Figure 7-1: Example of a Generic XOR Tree ................................................................................................................................7-2

Figure 7-2: Sample of a Generic VOH/VOL Tree ......................................................................................................................... 7-5

List of Figures

This page is left blank intentionally.

List of Tables

Table 1-1: Possible Configurations for the PCI-E General Purpose Links .....................................................................................1-3

Table 1-2: Graphics Device ID and Graphics Engine Clock Speed .............................................................................................1-10

Table 1-3: Pin Type Codes ............................................................................................................................................................1-10

Table 1-4: Acronyms and Abbreviations ......................................................................................................................................1-11

Table 2-1: Supported DDR2 Components ......................................................................................................................................2-4

Table 2-2: DDR2 Memory Row and Column Addressing ..............................................................................................................2-4

Table 2-3: Supported DDR3 Components ......................................................................................................................................2-5

Table 2-4: DDR3 Memory Row and Column Addressing ..............................................................................................................2-5

Table 2-5: LVDS 18-bit TFT Single Pixel per Clock (Single Channel) Signal Mapping ..............................................................2-8

Table 2-6: LVDS 18-bit TFT Dual Pixel per Clock (Dual Channel) Signal Mapping ...................................................................2-9

Table 2-7: LVDS 24-bit TFT Single Pixel per Clock (Single Channel) Signal Mapping ............................................................2-11

Table 2-8: LVDS 24-bit TFT Dual Pixel per Clock (Dual Channel) Signal Mapping .................................................................2-12

Table 2-9: Single Link Signal Mapping for DVI/HDMI™ .........................................................................................................2-14

Table 2-10: Dual-Link Signal Mapping for DVI ..........................................................................................................................2-15

Table 2-11: Support for HDMI™ Packet Type .............................................................................................................................2-16

Table 2-12: VGA DAC Characteristics ........................................................................................................................................2-17

Table 3-1: CPU HyperTransport™ Interface ..................................................................................................................................3-5

Table 3-2: Side-Port Memory Interface ..........................................................................................................................................3-5

Table 3-3: 1 x 16 or 2 x 8 Lane PCI Express® Interface for External Graphics ............................................................................3-6

Table 3-4: 1 x 4 Lane A-Link Express II Interface for Southbridge ...............................................................................................3-6

Table 3-5: 6 x 1 Lane PCI Express® Interface for General Purpose External Devices ..................................................................3-6

Table 3-6: PCI Express® Interface for Miscellaneous PCI Express® Signals ...............................................................................3-6

Table 3-7: Clock Interface ...............................................................................................................................................................3-7

Table 3-8: CRT Interface ................................................................................................................................................................3-7

Table 3-9: .......................................................................................................................................................................................3-8

Table 3-10: LVTM Interface in TMDS Mode ................................................................................................................................3-9

Table 3-11: TMDS Interface Multiplexed on the PCI Express® Graphics Interface ...................................................................3-10

Table 3-12: DisplayPort™ Interface Multiplexed on the PCI Express® Graphics Interface .......................................................3-11

Table 3-13: Power Management Pins ...........................................................................................................................................3-11

Table 3-14: Miscellaneous Pins ....................................................................................................................................................3-12

Table 3-15: Power Pins .................................................................................................................................................................3-12

Table 3-16: Ground Pins ...............................................................................................................................................................3-13

Table 3-17: Strap Definitions for the RS780E ..............................................................................................................................3-15

Table 4-1: Timing Requirements for HyperTransport Reference Clock (100MHz) Output by the Clock Generator ....................4-1

Table 4-2: PCI-E Differential Clock (GFX_REFCLK, GPPSB_REFCLK, 100MHz) AC Characteristics ...................................4-2

Table 4-3: Timing Requirements for REF_CLKP Used as OSCIN (14.3181818MHz) .................................................................4-2

Table 4-4: Timing Requirements for the LVTM Interface in LVDS Mode ...................................................................................4-3

Table 4-5: RS780E Power Rail Power-up Sequence ......................................................................................................................4-4

Table 4-6: LCD Power Up/Down Timing .......................................................................................................................................4-5

Table 5-1: Maximum and Minimum Ratings ..................................................................................................................................5-1

Table 5-2: DC Characteristics for 3.3V TTL Signals .....................................................................................................................5-2

Table 5-3: DC Characteristics for DDC Signals (DDC Mode) .......................................................................................................5-2

Table 5-4: DC Characteristics for AUX Signals (AUX Mode) ......................................................................................................5-2

Table 5-5: DC Characteristics for POWERGOOD .........................................................................................................................5-3

Table 5-6: DC Characteristics for HyperTransport™ and PCI-E Differential Clock (HT_REFCLK, GFX_REFCLK,

GPPSB_REFCLK, 100MHz) ..........................................................................................................................................................5-3

Table 5-7: DC Characteristics for REFCLK_P Input for OSCIN (14.3181818MHz) ....................................................................5-3

Table 5-8: DC Characteristics for the Memory Interface when Supporting DDR2 ........................................................................5-3

Table 5-9: DC Characteristics for the Memory Interface when Supporting DDR3 ........................................................................5-4

Table 5-10: DC Characteristics for the LVTM Interface in TMDS Mode .....................................................................................5-4

Table 5-11: DC Characteristics for the TMDS Interface Multiplexed on the PCI-E Gfx Lanes ....................................................5-5

Table 5-12: Electrical Requirements for the LVTM Interface in LVDS Mode ..............................................................................5-6

List of Tables

Table 5-13: Electrical Specifications for the DisplayPort™ Interface ...........................................................................................5-7

Table 5-14: RS780E Thermal Limits ..............................................................................................................................................5-7

Table 5-15: RS780E 528-Pin FCBGA Package Physical Dimensions ...........................................................................................5-9

Table 5-16: Recommended Board Solder Reflow Profile - RoHS/Lead-Free Solder ..................................................................5-12

Table 6-1: ACPI States Supported by the RS780E .........................................................................................................................6-1

Table 6-2: ACPI Signal Definitions ................................................................................................................................................6-1

Table 6-3: Standard PCI Configuration Space Header Type 0 .......................................................................................................6-2

Table 6-4: PCI Status Register ........................................................................................................................................................6-3

Table 6-5: Capabilities Pointer (CAP_PTR) ...................................................................................................................................6-3

Table 6-6: Power Management Register Block ..............................................................................................................................6-3

Table 6-7: Power Management Control/Status Register (PMCSR) ................................................................................................6-4

Table 6-8: Capability Identifier (CAP_ID) .....................................................................................................................................6-4

Table 6-9: Next Item Pointer (NEXT_ITEM_PTR) .......................................................................................................................6-5

Table 6-10: Power Management Capabilities – PMC .....................................................................................................................6-6

Table 7-1: Pins on the Test Interface ..............................................................................................................................................7-1

Table 7-2: Example of an XOR Tree ..............................................................................................................................................7-2

Table 7-3: RS780E XOR Tree ........................................................................................................................................................7-3

Table 7-4: Truth Table for the VOH/VOL Tree Outputs ................................................................................................................7-5

Table 7-5: RS780E VOH/VOL Tree ...............................................................................................................................................7-7

1.1 Introducing the AMD 780E

Chapter 1

Overview

The AMD 780E (referred to in this document by its codenmae “RS780E”) is an eighth generation Integrated Graphics Processor (IGP) that integrates a DirectX single chip. It supports AMD Athlon™ single-core and AMD Athlon X2 dual-core processors, AMD Sempron™ processors, and AMD Turion™ 64 X2 dual-core mobile technology. The RS780E integrates an ATI M72-based graphics engine, dual display, an LVDS interface, internal or external TMDS, DisplayPort™ capability, and Northbridge functionality in a single BGA package. This high level of integration and scalability enables manufacturers to offer enthusiast level capabilities and performance while minimizing board space and system cost.

Robust and Flexible Core Logic Features

The RS780E combines graphics and system logic functions in a single chip using a 21mm body BGA package, reducing overall solution area. For optimal system and graphics performance, the RS780E supports a high speed HyperTransport™ interface to the AMD processor, running at a data rate of up to 4.4GT/s and supporting both HT 1.0 and HT 3.0 protocols. The RS780E is ideally suited for 64-bit operating systems, and supports platform configurations with greater than 4GB of system memory. The rich PCI Express Express external graphics controllers and up to six other PCI Express peripherals (up to seven when using only 8 lanes for external graphics, or up to eight when not using external graphics), all supporting the PCI Express 2.0 standard with data rates of up to 5.0GT/s. These capabilities are complemented by the advanced I/O features of AMD’s SB710 Southbridge.

Best for Windows Vista

The RS780E delivers an unmatched Windows Vista® experience. It harnesses the increased bandwidth of HyperTransport

3.0 to a DirectX 10 graphics core, which provides the 3D rendering power needed to generate the Windows Vista desktop even under the most demanding circumstances. The ATI M72-based graphics core employs a unified shader architecture to deliver optimal 3D performance across the whole spectrum of 3D applications. This future-proof core ensures compatibility with both current and upcoming 3D applications, and meets Windows Vista Premium Logo requirements through 2008 and beyond.

10 compliant Shader Model 4.0 graphics core and a system controller in a

expansion capabilities of RS780E include support for one x16 or two x8 PCI

Leading Multimedia Capabilities

The RS780E incorporates AMD’s Unified Video Decoder (UVD) technology, which provides dedicated hardware decode of the H.264, VC-1, and MPEG-2 video formats used in HD DVD and for Blu-ray disks. The RS780E also incorporates the innovative ATI Avivo™* display architecture, providing users with visual quality which is second to none. Advanced scaling and color correction capabilities, along with increased precision through the entire display pipeline, ensure an optimal image on CRT monitors, LCD panels, and any other display device. Dual DisplayPort output capability provides the ability to interface to the next generation of digital display devices. That is complemented by two integrated TMDS interfaces, configurable to enable DVI/HDMI™ and support HDCP, allowing compatibility with even the most modern high definition televisions without the additional cost of external components.

*Note: ATI Avivo™ is a technology platform that includes a broad set of capabilities offered by certain ATI Radeon™ products. Full enablement of some ATI Avivo™ capabilities may require complementary products.

Low Power Consumption and Industry Leading Power Management

The RS780E is manufactured using the power efficient nm technology, and it supports a whole range of industry standards and new proprietary power management features. In addition to comprehensive support for the ACPI specification, the exclusive ATI PowerPlay™ technology (enhanced with new adaptive frame buffer compression and ATI PowerShift™ features) minimizes the RS780E's power consumption by adjusting graphics core performance and core voltage to the task and usage environment. System power can be further reduced through the dedicated local frame buffer interface supported by the RS780E. The integrated UVD dramatically reduces CPU loading and hence overall power consumption during HD video playback.

Software Compatibility

The graphics driver for the RS780E is fully compatible with all other Radeon class graphics controllers from AMD. A single driver can support multiple graphics configurations across AMD’s product lines, including the Radeon family and the AMD chipset family. In addition, this driver compatibility allows the RS780E to benefit immediately from AMD's software optimization and from the advanced Windows Radeon family drivers.

1.2 RS780E Features

1.2.1 CPU HyperTransport™ Interface

•

Supports 16-bit up/down HyperTransport (HT) 3.0 interface up to 4.4GT/s.

• Supports 200, 400, 600, 800, and 1000MHz HT1 frequencies.

• Supports 1.8, 2.0, and 2.2 GHz HT3 frequencies.

• Supports AMD Athlon single-core and AMD Athlon X2 dual-core processors, AMD Sempron processors, and AMD

Turion 64 X2 dual-core mobile technology.

• Supports power saving features as specified in section 8.6.1 of the HyperTransport I/O Link Specification Rev 3.00a,

including:

• Dynamic link configuration

• Dynamic link disconnection

RS780E Features

XP, Windows Vista®, and Linux® support available in the

• Dynamic link width

• Dynamic link frequency

• Disconnected link refresh (HT3 only)

• Inactive link refresh (HT3 only)

• Supports LDTSTOP interface and CPU link frequency throttling and stutter mode.

1.2.2 Memory Interface

•

Supports an optional dedicated local frame buffer (side-port) of up to 128MB through a 16-bit interface. Note, however, that the memory interface is optimized for a 64MB local frame buffer.

• New highly flexible memory architecture allows asymmetric side-port and shared system memory frame buffer sizes.

Supported configurations include UMA only and UMA+side-port (interleave mode).

• New dynamic memory allocation scheme improves performance and reduces power simultaneously.

• Support for DDR2 memories up to DDR2-800, with a maximum memory clock speed of 400MHz. Memory clock is

independent of any other clock source and can therefore be set to any frequency equal to or less than 400MHz (DDR2-800), allowing the use of lower speed side-port memories.

• Support for DDR3 memories up to DDR3-800, with a maximum memory clock speed of 400MHz (up to

DDR3-1200, with a maximum memory clock speed of 600MHz, when the core voltage is fixed at 1.1V). Memory clock is independent of any other clock source and can therefore be set to any frequency equal to or less than the maximum limit, allowing the use of lower speed side-port memories.

• Support one memory device of x16 width (see section 2.2.1.1, “Supported DDR2 Components,” on page 2-4.and

section 2.2.2.1, “Supported DDR3 Components,” on page 2-5, for details).

• Asynchronous HyperTransport and memory controller interface speeds.

• Supports DDR SDRAM self refresh mechanism.

• Supports dynamic CKE and ODT for power conservation.

1.2.3 ATI HyperMemory™

• Supports ATI HyperMemory™*.

RS780E Features

01 32 456789101112131415

PCI-E x16

PCI-E x 8 External Graphics

DL-DVI

PCI-E x 16 External Graphics

TMDS enabling Dual- Link

DVI(DL-DVI)

LEGEND

Not Used

TMDS enabling Single- Link

DVI(SL-DVI)

DisplayPort (DP)

TMDS enabling HDMI

PCI-E x 16 Interface

HDMI

SL-DVI

Not Used

SL-DVI Not Used

HDMI Not Used

DP Not Used

DL-DVI

PCI-E x 8

SL-DVIHDMI

PCI-E x 8

DPDP

HDMI Not Used

DP Not Used

SL-DVI Not Used

PCI-E x 8

DP Not Used

HDMI

PCI-E x 8 PCI-E x 8

* Note: Includes dedicated and shared memory. The amount of HyperMemory available is determined by various factors. For details, please consult your AMD CSS representative.

1.2.4 PCI Express® Interface

Supports PCI-E Gen2 (version 2.0).

•

• Optimized peer-to-peer and general purpose link performance.

• Highly flexible PCI Express implementation to suit a variety of platform needs.

• A dual-port, x16 graphics interface, configurable to any one of the modes illustrated in Figure 1-1:

• Supports programmable lane reversal for the graphics link to ease motherboard layout when the end device does not

support lane reversal.

• Supports six general purpose lanes, for up to six devices on specific ports. Possible configurations are listed in

Table 1-1.

Table 1-1 Possible Configurations for the PCI-E General Purpose Links

GPP1 x4 x4 x2 x2 x2 x1

GPP2-----x1

GPP3 - - x2 x1 x2 x1

GPP4---x1-x1

GPP5 x2 x1 x2 x1 x1 x1

GPP6 - x1 - x1 x1 x1

Figure 1-1 Possible Configurations for the x16 PCI-E Graphics Interface

Config. B Config. C Config. C2 Config. E Config. K Config. L

• Supports x1, x2, x4, x8, x12 and x16 polarity inversion.

1.2.5 A-Link Express II Interface

One x4 A-Link Express II interface for connection to an AMD Southbridge. The A-Link Express II is a proprietary

•

interface developed by AMD basing on the PCI Express Gen2 version 2.0 technology, with additional Northbridge-Southbridge messaging functionalities.

• Supports programmable lane reversal to ease motherboard layout.

1.2.6 2D Acceleration Features

•

Highly-optimized 128-bit engine, capable of processing multiple pixels per clock.

• Hardware acceleration of Bitblt, line drawing, polygon and rectangle fills, bit masking, monochrome expansion,

panning and scrolling, scissoring, and full ROP support (including ROP3).

• Optimized handling of fonts and text using AMD proprietary techniques.

• Game acceleration including support for Microsoft's DirectDraw

Blit, and Masked Blit.

• Acceleration in 1/8/15/16/32-bpp modes:

• Pseudocolor mode for 8bpp

• ARGB1555 and RGB565 modes for 16bpp

• ARGB8888 mode for 32bpp

• Significant increase in the High-End Graphics WinBench

• Setup of 2D polygons and lines.

• Support for GDI extensions:

• In Windows XP and Windows Vista: Alpha BLT, Transparent BLT, and Gradient Fill.

RS780E Features

: Double Buffering, Virtual Sprites, Transparent

score due to capability for C18 color expansion.

• In Windows 7: Alpha BLT, Transparent BLT, Color Fill BLT, Stretch BLT, and Clear Type BLT.

• Hardware cursor (up to 64x64x32bpp), with alpha channel for direct support of Windows XP, Windows Vista

and Windows 7 alpha cursor.

1.2.7 3D Acceleration Features

•

Fully DirectX 10.0 compliant, including full speed 32-bit floating point per component operations

• Shader Model 4.0 geometry and pixel support in a unified shader architecture:

• Full speed 32-bit floating point processing per component.

• High dynamic range rendering with floating point blending, texture filtering and anti-aliasing support.

• High performance dynamic branching and flow control.

• Nearly unlimited shader instruction store, using an advance caching system.

• Advanced shader design, with ultra-threading sequencer for high efficiency operations.

• Advanced, high performance branching support, including static and dynamic branching.

• 32-bit floating point components for high dynamic range computations.

• Full anti-aliasing on render surfaces up to and including 128-bit floating point formats.

• Support for OpenGL

2.0

• Anti-Aliasing Filtering:

• 2x/4x/8x modes.

• Sparse multi-sample algorithm with gamma correction, programmable sample patterns, and centroid sampling.

• Temporal anti-aliasing.

• Adaptive anti-aliasing mode.

• Lossless color compression (up to 8:1) at all resolutions, up to and including widescreen HDTV.

• Anisotropic Filtering:

RS780E Features

• 2x/4x/8x/16x modes

• Up to 128-tap texture filtering.

• Adaptive algorithm with performance (bi-linear) and quality (tri-linear) options.

• Improved quality mode due to improved subpixel precision, higher precision LOD computations, and

• Advanced Texture Compression (3Dc+™ ):

• High quality 4:1 compression for normal maps and luminance maps.

• Works with any single-channel or two-channel data format.

• HW support to overcome "Small batch" issues in CPU limited applications.

• 3D resources virtualized to a 32-bit addressing space, for support of large numbers of render targets and textures.

• New vertex cache and vertex fetch design, to increase vertex throughput from previous generations.

• Full support of 64-bit and 128-bit textures and surfaces, which can be 4x to 8x faster than previous generation of HW.

• Up to 8K x 8K textures, including 128 bpp texture are supported.

• New multi-level texture cache to give optimal performance, greater than 8x the previous designs.

• High efficiency ring bus memory controller:

• Programmable arbitration logic maximizes memory efficiency, software upgradeable.

• Fully associative texture, color, and Z cache design.

• New hierarchical Z and stencil buffers with early Z Test.

• New lossless Z-buffer compression for both Z and stencil.

• Fast Z-Buffer Clear.

• Z cache optimized for real-time shadow rendering.

• Z and color compression resources virtualized to a 32-bit addressing space, for support of multiple render targets

rotationally invariant LOD computations.

and textures simultaneously.

1.2.8 Motion Video Acceleration Features

Video scaling and fully programmable YCrCb to RGB color space conversion for full-speed video playback and fully

•

adjustable color controls.

• Adaptive de-interlacing eliminates video artifacts caused by displaying interlaced video on non-interlaced displays,

and by analyzing image and using optimal de-interlacing function on a per-pixel basis.

• Motion video acceleration for HD DVD/Blu-ray technology.

• Dedicated UVD (Unified Video Decoder) hardware for H.264,VC-1, and MPEG-2 decode:

• H.264 implementation is based on the ISO/IEC 14496-10 spec.

• VC-1 implementation is based on the SMPTE 421M spec.

1.2.9 Multiple Display Features

General

• Dual independent displays. Possible configurations are illustrated in Figure 1-2.

RS780E Features

Figure 1-2 RS780E Multiple Display Options

• Resolution, refresh rates, and display data can be completely independent for the two display paths.

• Each display controller supports true 30 bits per pixel throughout the display pipe.

• Each display path supports VGA and accelerated modes, video overlay, hardware cursor, hardware icon, and palette

gamma correction.

• Supports both interlaced and non-interlaced displays.

• Full ratiometric expansion ability is supported for source desktop modes up to 1920 pixels/line.

• Maximum DAC frequency of 400 MHz.

• Supports 8, 16, 32, and 64-bpp depths for the main graphics layer:

• For 32-bpp depth, supports xRGB 8:8:8:8, xRGB 2:10:10:10, sCrYCb 8:8:8:8, and xCrYCb 2:10:10:10 data

formats.

• For 64-bpp depth, supports xRGB 16:16:16:16 data format.

• Independent gamma, color conversion and correction controls for main graphics layer.

• Support for DDC1 and DDC2B+ for plug and play monitors.

• 8-bit alpha blending of graphics and video overlay.

• Hardware cursor up to 64x64 pixels in 2 bpp, full color AND/XOR mix, and full color 8-bit alpha blend.

• Hardware icon up to 128x128 pixels in 2 bpp, with two colors, transparent, and inverse transparent. AND/XOR

mixing. Supports 2x2 icon magnification.

• Virtual desktop support.

• Support for flat panel displays via VGA.

• Configurable to support flat panel displays or TVs via DVI/HDMI.

• Integrated HD audio controller for HDMI audio data.

RS780E Features

VGA Output

• Maximum resolutions supported by the VGA output for different refresh rates are:

• 2048x1536 @85Hz (pixel clock at 388.5MHz) for 4:3 format

• 2560x1440 @75Hz (pixel clock at 397.25MHz) for 16:9 format

• 2456x1536 @60Hz (pixel clock at 320MHz) for 16:10 format

1.2.10 Integrated LVDS/TMDS (LVTM) Interface

Configurable to output either LVDS or TMDS signals.

•

• LVDS mode:

• Integrated dual-link 18-/24-bit LVDS interface.

• 805 Mbps/channel with 115 MHz pixel clock rate per link (230 MHz maximum pixel clock).

• FPDI-2 compliant; compatible with receivers from National Semiconductor, Texas Instruments, and THine.

• OpenLDI compliant excluding DC balancing.

• Programmable internal spread spectrum controller for the signals.

• TMDS Mode, enabling DVI or HDMI™:

• See Section 1.2.11, “DVI/HDMI™,” for details.

1.2.11 DVI/HDMI™

• Supports two TMDS interfaces, one multiplexed on the PCI-E graphics interface and the other on the LVTM

interface, enabling DVI or HDMI™*

• 1620 Mbps/channel with 162 MHz pixel clock rate per link.

• Supports industry standard EIA-861B video modes including 480p, 720p, 1080i, and 1080p (for a full list of currently

supported modes, contact you AMD CSS representative). Maximum resolutions supported by various modes are:

• Single-link DVI: 1600x1200 @60Hz with standard timings, and 1920x1200 @60Hz with reduced blanking

timings.

• Dual-link DVI: 2560x1600 @60Hz.

• HDMI: 1080p.

• Supports YCbCr 4:4:4 and 4:2:2 modes with HDMI.

• HDMI basic audio support at 32, 44.1 or 48 kHz. Supports two-channel uncompressed audio data, and, for Windows

Vista platforms only, 5.1-channel audio data and DTS. HD audio device compatible with the Microsoft HD audio driver.

• HDCP support for two independent display streams with on-chip key storage. Also available when the TMDS

interfaces run in dual-link mode.**

Notes: * HDMI must only be enabled on systems that are legally entitled. It is the responsibility of the system designer to

ensure that the system is entitled to support this feature.

CEC is not supported.

‡ The TMDS interface multiplexed on the PCI-E graphics lanes cannot enable HDMI when the LVTM interface is

enabling HDMI, and vice versa.

(passing HDMI CTS v1.3b). ‡

** HDCP content protection is only available to licensed buyers of the technology and can only be enabled when connected to an HDCP-capable receiver.

1.2.12 DisplayPort™ Interface

•

Supports all mandatory features of DisplayPort™ Standard, Version 1.1, plus the following optional features:

• 10-bit support.

• YCbCr 4:4:4 and 4:2:2 support.

• HDCP support

• Optional test pattern support.

• Supports two independent displays over the PCI-E interface for external graphics (see Figure 1-1,“Possible

Configurations for the x16 PCI-E Graphics Interface,” on page 1-3 for details).

• Supports 4, 2, or 1-lane transmission.

• Supports both the 2.7Gbps and 1.62Gbps link symbol rates.

• Supports the Auxiliary Channel (AUX CH).

• Supports a maximum resolution of 2560x1600 @60Hz with 4 lanes.

1.2.13 Integrated HD Audio Controller and Codec

•

Integrated HD Audio codec supports linear PCM and AC3 (5.1) audio formats for HDMI output.

• Separate logical chip function.

• Can encrypt data onto one associated HDMI output.

• Uses Microsoft UAA driver.

• Internally connected to the integrated HDMI, or HDMI-enabled interface, hence no external cable required.

• Support for basic audio (32, 44.1 or 48 KHz stereo) and AC3 or DTS at the same sample rates.

RS780E Features

1.2.14 Clock Generation

Support for an external clock chip to generate side-port memory, PCI-E, and A-Link Express II clocks.

•

1.2.15 Power Management Features

•

Single chip solution in 55nm, 1.1V CMOS technology.

• Supports ACPI 2.0 for S0, S3, S4, and S5 states.

• Full IAPC (Instantly Available PC) power management support.

• Static and dynamic power management support (APM as well as ACPI) with full VESA DPM and Energy Star

compliance.

• The Chip Power Management Support logic supports four device power states defined for the OnNow Architecture—

On, Standby, Suspend, and Off. Each power state can be achieved by software control bits.

• Hardware controlled intelligent clock gating enables clocks only to active functional blocks, and is completely

transparent to software.

• Dynamic self-refresh for the side-port memory.

• Support for Cool'n'Quiet™ via FID/VID change.

• Support for AMD PowerNow!™.

• Clocks to every major functional block are controlled by a unique dynamic clock switching technique that is

completely transparent to the software. By turning off the clock to the block that is idle or not used at that point, the power consumption is significantly reduced during normal operation.

• Supports PowerExpress™ and PowerPlay™ (enhanced with the PowerShift™ feature).

• Supports dynamic lane reduction for the PCI-E graphics interface when coupled with an AMD-based graphics

device, adjusting lane width according to required bandwidth.

1.2.16 PC Design Guide Compliance

The RS780E complies with all relevant Windows Logo Program (WLP) requirements from Microsoft for WHQL certification.

Software Features

1.2.17 Test Capability Features

The RS780E has a variety of test modes and capabilities that provide a very high fault coverage and low DPM (Defect Per Million) ratio:

• Full scan implementation on the digital core logic through ATPG (Automatic Test Pattern Generation Vectors).

• Dedicated test logic for the on-chip custom memory macros to provide complete coverage on these modules.

• A JTAG test mode to allow board level testing of neighboring devices.

• An EXOR tree test mode on all the digital I/O's to allow for proper soldering verification at the board level.

• A VOH/VOL test mode on all digital I/O’s to allow for proper verification of output high and output low values at the

board level.

• Access to the analog modules to allow full evaluation and characterization.

• IDDQ mode support to allow chip evaluation through current leakage measurements.

These test modes can be accessed through the settings on the instruction register of the JTAG circuitry.

1.2.18 Additional Features

•

Integrated spread spectrum PLLs on the memory and LVDS interface.

1.2.19 Packaging

Single chip solution in 55nm, 1.1V low power CMOS technology.

•

• 528-FCBGA package, 21mmx21mm.

1.3 Software Features

• BIOS ability to read EDID 1.1, 1.2, and 1.3.

• Ability to selectively enable and disable several devices including CRT, LCD, and DFP.

• Register-compatible with VGA standards, BIOS-compatible with VESA VBE2.0.

• Supports corporate manageability requirements such as DMI.

• ACPI support.

• Full Write Combining support for maximum performance of the CPU.

• Full-featured, yet simple Windows utilities:

• Calibration utility for WYSIWYG color

• Independent brightness control of desktop and overlay

• End user diagnostics

• Drivers meet Microsoft's rigorous WHQL criteria and are suitable for systems with the "Designed for Windows"

logos.

• Comprehensive OS and API support.

• Hot-key support (Windows ACPI 2.0 or AMD Event Handler Utility where appropriate).

• Extensive power management support.

• Rotation mode support in software.

• Dual CRTC, simultaneous view, extended desktop support (Windows XP and Windows Vista)

• DirectX 10.0 support.

• Switchable overlay support.

• H.264 playback support.

• Supports AMD OverDrive™ utility*.

RADEON IGP YYWW MADE IN TAIWAN WXXXXX 216-0674040

* YY - Assembly Start Year WW - Assembly Start Week

Part Number

Date Code*

AMD Product Type

AMD Logo

Wafer Lot Number

Country of Origin

*Note: AMD’s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via the AMD OverDrive utility.

1.4 Branding Diagram

Branding Diagram

Figure 1-3 RS780E ASIC A13 Production Branding

1.5 Graphics Device ID and Graphics Engine Clock Speed

Table 1-2 Graphics Device ID and Graphics Engine Clock Speed

Variant

RS780E 0x9615 200 500

Graphics Device ID

Graphics Engine Clock Speed (MHz)

Min. Max.

1.6 Conventions and Notations

The following conventions are used throughout this manual.

1.6.1 Pin Names

Pins are identified by their pin names or ball references. Multiplexed pins sometimes assume alternate “functional names” when they perform their alternate functions, and these “functional names” are given in Chapter 3, “Pin Descriptions and

Strap Options.”

All active-low signals are identified by the suffix ‘#’ in their names (e.g., MEM_RAS#).

1.6.2 Pin Types

The pins are assigned different codes according to their operational characteristics. These codes are listed in Table 1-3.

Table 1-3 Pin Type Codes

Code Pin Type

I Digital Input

O Digital Output

OD Open Drain

I/O Bi-Directional Digital Input or Output

I/OD Digital Input or Open Drain

M Multifunctional

Conventions and Notations

Table 1-3 Pin Type Codes (Continued)

Code Pin Type

Pwr Power

Gnd Ground

A-O Analog Output

A-I Analog Input

A-I/O Analog Bi-Directional Input/Output

A-Pwr Analog Power

A-Gnd Analog Ground

Other Pin types not included in any of the categories above

1.6.3 Numeric Representation

Hexadecimal numbers are appended with “h” (Intel assembly-style notation) whenever there is a risk of ambiguity. Other numbers are in decimal.

Pins of identical functions but different running integers (e.g., “GFX_TX7P, GFX_TX6P,... GFX_TX0P”) are referred to collectively by specifying their integers in square brackets and with colons (i.e., “GFX_TX[7:0]P”). A similar short-hand notation is used to indicate bit occupation in a register. For example, NB_COMMAND[15:10] refers to the bit positions 10 through 15 of the NB_COMMAND register.

1.6.4 Register Field

A field of a register is referred to by the format of [Register Name].[Register.Field]. For example, “NB_MC_CNTL.DISABLE_BYPASS” is the “DISABLE_BYPASS” field of the register “NB_MC_CNTL.”

1.6.5 Hyperlinks

Phrases or sentences in blue italic font are hyperlinks to other parts of the manual. Users of the PDF version of this manual can click on the links to go directly to the referenced sections, tables, or figures.

1.6.6 Acronyms and Abbreviations

The following is a list of the acronyms and abbreviations used in this manual.

Table 1-4 Acronyms and Abbreviations

Acronym Full Expression

ACPI Advanced Configuration and Power Interface

A-Link-E II A-Link Express II interface between the IGP and the Southbridge.

BGA Ball Grid Array

BIOS

BIST Built In Self Test.

BLT Blit

bpp bits per pixel

CEC Consumer Electronic Control

CPIS Common Panel Interface Specification

CRT Cathode Ray Tube

CSP Chip Scale Package

DAC Digital to Analog Converter

DBI Dynamic Bus Inversion

DDC

DDR Double Data Rate

Basic Input Output System. Initialization code stored in a ROM or Flash RAM used to start up a system or expansion card.

Display Data Channel. A VESA standard for communicating between a computer system and attached display devices.

Table 1-4 Acronyms and Abbreviations (Continued)

Acronym Full Expression

DFP Digital Flat Panel. Monitor connection standard from VESA.

DPM Defects per Million

DTV Digital TV

DVD Digital Video Disc

DVI

DVS Digital Video Stream

EPROM Erasable Programmable Read Only Memory

FIFO First In, First Out

FPDI Flat Panel Display Interface

GDI Graphics Device Interface

GND Ground

GPIO General Purpose Input/Output

HDCP High-Bandwidth Digital Content Protection

HDMI High Definition Multimedia Interface

HDTV High Definition TV. The 1920x1080 and the 1280x720 modes defined by ATSC.

HPD Hot Plug Detect

iDCT inverse Discrete Cosine Transform

IDDQ Direct Drain Quiescent Current

IGP

JTAG Joint Test Access Group. An IEEE standard.

LVDS Low Voltage Differential Signaling

MB Mega Byte

MPEG

NTSC

PAL Phase Alternate Line. The standard definition TV system used in Europe and other areas.

PCI Peripheral Component Interface

PCI-E PCI Express

PCMCIA

PLL Phase Locked Loop

POST Power On Self Test

PD Pull-down Resistor

PU Pull-up Resistor

ROP Raster Operation

SDRAM Synchronous Dynamic RAM

TMDS Transition Minimized Differential Signaling

UMA Unified Memory Architecture

UV Chrominance (also CrCb). Corresponds to the color of a pixel.

UVD Unified Video Decoder

UXGA Ultra Extended Graphics Array

VBI Vertical Blank Interval

VESA Video Electronics Standards Association

VGA Video Graphics Adapter

VRM Voltage Regulation Module

Digital Video Interface. Monitor connection standard from the DDWG (Digital Display Work Group).

Integrated Graphics Processor. A single device that integrates a graphics processor and a system controller.

Motion Pictures Experts Group. Refers to compressed video image streams in either MPEG-1 or MPEG-2 formats.

National Television Standards Committee. The standard definition TV system used in North America and other areas.

Personal Computer Memory Card International Association. It is also the name of a standard for PC peripherals promoted by the Association.

Conventions and Notations

Chapter 2

HyperTransport™

Unit

CPU

Interface

UVD

Setup

Engine2DEngine

Engine

Overlay

Root

MUX

Display 1& 2

CRT

Memory Controller

AMD CPU

Bus Interface

Complex

Optional 16-bit

DDR2/DDR3

Memory Channel

TMDS, enabling DVI/HDMI™

External

Graphics

A-Link-E II

Gfx Interface*

PCI-E

Interface

(1x16 or 2x8

GPP Interface

PCI-E

(6 x 1 Lanes)

Expansion

Slots or

On-board

Devices

(1 x 4 Lanes)

DisplayPort™

(Multiplexed on PCI-E Gfx Lanes)

LVDS

TMDS, supporting DVI/HDMI

(Multiplexed on the LVTM interface)

Lanes)

Functional Descriptions

This chapter describes the functional operation of the major interfaces of the RS780E system logic. Figure 2-1, “RS780E

Internal Block Diagram,” illustrates the RS780E internal blocks and interfaces.

2.1 Host Interface

The RS780E is optimized to interface with AMD processors through the HyperTransport presents an overview of the HyperTransport

Figure 2-1 RS780E Internal Block Diagram

interface. For a detailed description of the interface, please refer to the

interface. This section

Host Interface

HT Interface to CPU (PHY)

Configuration

Registers

Root Complex

Memory Controller

LTA

LRA

SCH

Data Link Layer

Protocol/Transaction Layer

HyperTransport I/O Link Specification from the HyperTransport Consortium. Figure 2-2, “Host Interface Block

Diagram,” illustrates the basic blocks of the host bus interface of the RS780E.

Figure 2-2 Host Interface Block Diagram

The HyperTransport (HT) Interface, formerly known as the LDT (Lightning Data Transport) interface, is a high speed, packet-based link implemented on two unidirectional buses. It is a point-to-point interface where data can flow both upstream and downstream at the same time. The commands, addresses, and data travel in packets on the HyperTransport link. Lengths of packets are in multiples of four bytes. The HT link consists of three parts: the physical layer (PHY), the data link layer, and the protocol/transaction layer. The PHY is the physical interface between the RS780E and the CPU. The data link layer includes the initialization and configuration sequences, periodic redundancy checks, connect/disconnect sequences, and information packet flow controls. The protocol layer is responsible for maintaining strict ordering rules defined by the HT protocol.

The RS780E HyperTransport bus interface consists of eighteen unidirectional differential data/control pairs and two differential clock pairs in each of the upstream and downstream direction. On power up, the HT link is 8-bit wide and runs at a default speed of 400MT/s. After negotiation, carried out by the HW and SW together, the link width can be brought up to 16-bit and the interface can run up to 4.4GT/s. The interface is illustrated in Figure 2-3, “RS780E Host Bus

Interface Signals.” The signal name and direction for each signal is shown with respect to the processor. Note that the

signal names may be different from those used in the pin listing of the RS780E. Detailed descriptions of the signals are given in section 3.3, “CPU HyperTransport™ Interface‚’ on page 3-5.

Side-Port Memory Interface

HT_RXCADN

RS780E

CPU

HT_TXCALP

HT_RXCALN

HT_RXCALP

HT_TXCALN

HT_RXCADP

HT_RXCTLN

HT_RXCTLP

HT_RXCLKN

HT_RXCLKP

HT_TXCADN

HT_TXCADP

HT_TXCTLN

HT_TXCTLP

HT_TXCLKN

HT_TXCLKP

Figure 2-3 RS780E Host Bus Interface Signals

2.2 Side-Port Memory Interface

In order to significantly decrease system power and increase graphics performance, the RS780E provides an optional side-port memory interface for dedicated frame buffer memory, to be used exclusively for the integrated graphics core. The side-port memory interface can significantly reduce system power by allowing the CPU to stay in its lowest power state during periods of inactivity. Screen refreshes are fetched from the side-port memory, and there is no need to "wake up" the CPU to fetch screen refresh data.

The RS780E memory controller is unique and highly optimized. It operates in 16-bit mode at very high speed (up to DDR2-800 and DDR3-800, and up to DDR3-1200 when the core voltage is fixed at 1.1V), and has a programmable interleaved mode that significantly increases the memory bandwidth and reduces data latency to the integrated graphics core. The additional bandwidth provided to the internal graphics core will also aid the RS780E in reaching and exceeding Microsoft's Windows Vista

2.2.1 DDR2 Memory Interface

Figure 2-4, “RS780E Side-Port Memory Interface,” on page 2-4 illustrates the side-port memory interface of the

RS780E.

The RS780E memory controller supports up to 128MB of dedicated side-port frame buffer DDR2 memory. It controls a single rank of DDR2 devices in 16-bit memory configuration. It supports device sizes of 256, 512, and 1024 Mbits, and a device width of x16. Because the memory controller supplies only one chip select signal, only devices with one chip select are supported. A wide range of DDR2 timing parameters, configurations, and loadings are programmable via the RS780E memory controller configuration registers

Premium logo requirements.

Data Mask MEM_DM[1:0]

Data MEM_DQ[15:0]

RS780E Side-Port Memory

Interface

Data Strobes MEM_DQS[1:0]P/N

Un-buffered DDR2 SDRAM

MEM_CKE, MEM_RAS#,

Differential Clocks MEM_CKP/MEM_CKN

MEM_CAS#, MEM_WE#

Address MEM_A[13:0]

Chip Select MEM_CS#

On-Die Termination MEM_ODT

Bank Address MEM_BA[2:0]

MEM_CALN

MEM_CALP

VDD_MEM

Side-Port Memory Interface

Figure 2-4 RS780E Side-Port Memory Interface

2.2.1.1 Supported DDR2 Components

The memory controller supports DDR2 SDRAM chips in several configurations. These chips are organized in banks, rows (or pages), and columns. The supported DDR2 components have four or eight banks. Table 2-1 lists the supported memory components.

Table 2-1 Supported DDR2 Components

DDR2 SDRAM

Config Mbits CS Mode Bank Bits Row Bits Col Bits

16Mbx16 256 4 2 13 9 32

32Mbx16 512 10 2 13 10 64

64Mbx16 1024 11 3 13 10 128

Mbytes

2.2.1.2 Row and Column Addressing

Table 2-2 shows how the physical address P (after taking out the bank bit) is used to provide the row and column

addressing for each size of DDR2 memories.

Table 2-2 DDR2 Memory Row and Column Addressing

Row P10 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

Column - - PC - P9P8P7P6P5P4P3 P2 P1

Row P23 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

Column - - PCP10P9P8P7P6P5P4P3 P2 P1

A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

16Mbx16 devices

32Mbx16 devices

Address

Side-Port Memory Interface

A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

Row

Column

Row

Column

Note: PC = precharge flag

P23 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

- - PC P10 P9 P8 P7 P6 P5 P4 P3 P2 P1

P24 P23 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

- - PC P10 P9 P8 P7 P6 P5 P4 P3 P2 P1

2.2.2 DDR3 Memory Interface

The RS780E memory controller supports up to 128MB of dedicated side-port frame buffer DDR3 memory. It supports a single rank of DDR3 device in 16-bit memory configuration. It supports device sizes of 512 and 1024 Mbits, and a device width of x16. A wide range of DDR3 timing parameters, configurations, and loadings are programmable via the RS780E memory controller configuration registers.

2.2.2.1 Supported DDR3 Components

The memory controller supports DDR3 SDRAM chips in several configurations. These chips are organized in banks, rows (or pages), and columns. Table 2-3 lists the supported memory components.

Address

64Mbx16 devices

128Mbx16 devices

Table 2-3 Supported DDR3 Components

DDR3 SDRAM

Config Mbits CS Mode Bank Bits Row Bits Col Bits

32Mbx16 512 9 3 12 10 64

64Mbx16 1024 11 3 13 10 128

Mbytes

2.2.2.2 Row and Column Addressing

Table 2-4 shows how the physical address P (after taking out the bank bit) is used to provide the row and column

addressing for each size of DDR3 memories.

Table 2-4 DDR3 Memory Row and Column Addressing

Address

A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

32Mbx16 devices

Row P23 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

Column - - PCP10P9P8P7P6P5P4P3 P2 P1

64Mbx16 devices

Row P23 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

Column - - PC P10 P9 P8 P7 P6 P5 P4 P3 P2 P1

Note: PC = precharge flag

2.3 LVTM (LVDS/TMDS) Interface

TXOUT_U0N/P

TXOUT_U1N/P TXOUT_U2N/P

TXCLK_LN/P

TXOUT_L0N/P

TXCLK_UN/P

TXOUT_L1N/P TXOUT_L2N/P

LVDS_DIGON

LVDS_BLON

LVDS_BLEN

LVDS upper data channel 0

LVDS upper data channel 2

LVDS lower clock channel

LVDS lower data channel 0

LVDS upper clock channel

LVDS lower data channel 1 LVDS lower data channel 2

LVDS_DIGON

LVDS_BLON

LVDS_BLEN

LVDS upper data channel 3

TXOUT_U3N/P

LVDS upper data channel 1

TXOUT_U0N/P

TXOUT_U1N/P TXOUT_U2N/P

TXCLK_LN/P

TXOUT_L0N/P

TXCLK_UN/P

TXOUT_L1N/P TXOUT_L2N/P

LVDS_DIGON

LVDS_BLON

LVDS_BLEN

TMDS data channel 0

TMDS data channel 2

TMDS data channel 4

TMDS clock channel

TMDS data channel 5

GPIO3

GPIO2

GPIO4

TMDS data channel 3

TXOUT_U3N/P

TMDS data channel 1

TXOUT_L3N/P

LVDS lower data channel 3

TXOUT_L3N/P

LVTM Interface in LVDS Mode

LVTM Interface in TMDS Mode

The RS780E’s LVTM (LVDS/TMDS) interface supports either an LVDS or a TMDS output. A custom video BIOS from AMD will configure the LVTM interface to drive out either LVDS or a TMDS signals as desired.

A custom video BIOS and proper signal routing from the LVTM interface to a connector are the only requirements for the RS780E to support either an LVDS or a TMDS output on the LVTM interface. No other register programming is needed for selecting one option over the other, and customers should not attempt to configure the LVTM port by programming the RS780E’s registers directly. Figure 2-5, “LVTM Interface of the RS780E,” compares the functions of the pins in LVDS and TMDS mode. Operations in the LVDS and TMDS mode are explained in section 2.4, “LVDS‚’ on page 2-7, and section 2.5, “DVI/HDMI™‚’ on page 2-13, respectively.

LVTM (LVDS/TMDS) Interface

Notice that the RS780E can also provide a TMDS output via its TMDS interface that is multiplexed with its PCI Express graphics link. As a result, the RS780E can provide two digital display outputs using its two on-chip integrated TMDS transmitters—one through the LVTM interface, and the other through the TMDS interface multiplexed with the PCI-E graphics interface.

Figure 2-5 LVTM Interface of the RS780E

LVDS

LP1C1LP1C2LP1C3

T Cycle

LP1C4LP1C5LP1C6LP1C7

TXOUT_L0-/+

LP2C1LP2C2LP2C3LP2C4LP2C5LP2C6LP2C7

TXOUT_L1-/+

LP3C1LP3C2LP3C3LP3C4LP3C5LP3C6LP3C7

TXOUT_L2-/+

TXCLK_L-/+

UP1C1UP1C2UP1C3

T Cycle

UP1C4UP1C5UP1C6UP1C7

TXOUT_U0-/+

UP2C1UP2C2UP2C3UP2C4UP2C5UP2C6UP2C7

TXOUT_U1-/+

UP3C1UP3C2UP3C3UP3C4UP3C5UP3C6UP3C7

TXOUT_U2-/+

TXCLK_U-/+

2.4 LVDS

The RS780E’s LVTM interface can operate as a dual-channel 18-/24-bit LVDS interface. Notice that for designs implementing only a single LVDS channel, the LOWER channel of the interface should be used.

2.4.1 LVDS Data Mapping

Figure 2-6 shows the transmission ordering of the LVDS signals for 18-bit transmission on the lower and the upper data

channels. The signal mappings for single and dual channel transmission are shown in Table 2-5 and Table 2-6 respectively.

Figure 2-7 shows the transmission ordering of the LVDS signals for 24-bit transmission on the lower and the upper data

channels. The signal mappings for single and dual channel transmission are shown in Table 2-9 and Table 2-10 respectively.

Figure 2-6 Single/Dual Channel 18-bit LVDS Data Transmission Ordering

Table 2-5 LVDS 18-bit TFT Single Pixel per Clock (Single Channel) Signal Mapping

TX Signal 18-bit

LP1C1 R0

LP1C2 R1

LP1C3 R2

LP1C4 R3

LP1C5 R4

LP1C6 R5

LP1C7 G0

LP2C1 G1

LP2C2 G2

LP2C3 G3

LP2C4 G4

LP2C5 G5

LP2C6 B0

LP2C7 B1

LP3C1 B2

LP3C2 B3

LP3C3 B4

LP3C4 B5

LP3C5 HSYNC

LP3C6 VSYNC

LP3C7 ENABLE

LVDS

LP1C1LP1C2LP1C3

T Cycle

LP1C4LP1C5LP1C6LP1C7

TXOUT_L0-/+

LP2C1LP2C2LP2C3LP2C4LP2C5LP2C6LP2C7

TXOUT_L1-/+

LP3C1LP3C2LP3C3LP3C4LP3C5LP3C6LP3C7

TXOUT_L2-/+

TXCLK_L-/+

LP4C1LP4C2LP4C3LP4C4LP4C5LP4C6LP4C7

TXOUT_L3-/+

Table 2-6 LVDS 18-bit TFT Dual Pixel per Clock (Dual Channel) Signal Mapping

TX Signal 18-bit TX Signal 18-bit

LP1C1 Ro0 UP1C1 Re0

LP1C2 Ro1 UP1C2 Re1

LP1C3 Ro2 UP1C3 Re2

LP1C4 Ro3 UP1C4 Re3

LP1C5 Ro4 UP1C5 Re4

LP1C6 Ro5 UP1C6 Re5

LP1C7 Go0 UP1C7 Ge0

LP2C1 Go1 UP2C1 Ge1

LP2C2 Go2 UP2C2 Ge2

LP2C3 Go3 UP2C3 Ge3

LP2C4 Go4 UP2C4 Ge4

LP2C5 Go5 UP2C5 Ge5

LP2C6 Bo0 UP2C6 Be0

LP2C7 Bo1 UP2C7 Be1

LP3C1 Bo2 UP3C1 Be2

LP3C2 Bo3 UP3C2 Be3

LP3C3 Bo4 UP3C3 Be4

LP3C4 Bo5 UP3C4 Be5

LP3C5 HSYNC UP3C5 (from the register)

LP3C6 VSYNC UP3C6 (from the register)

LP3C7 ENABLE UP3C7 (from the register)

Note: Signal names with letter 'o' mean 'odd' pixel or the first pixel on the panel, and signal names with letter 'e' mean

'even' pixel or the second pixel on the panel.

LVDS

UP1C1

UP1C2UP1C3

T Cycle

UP1C4UP1C5UP1C6UP1C7TXOUT_U0-/+

UP2C1

UP2C2UP2C3UP2C4UP2C5UP2C6UP2C7

TXOUT_U1-/+

UP3C1

UP3C2UP3C3UP3C4UP3C5UP3C6UP3C7

TXOUT_U2-/+

TXCLK_U-/+

UP4C1

UP4C2UP4C3UP4C4UP4C5UP4C6UP4C7

TXOUT_U3-/+

Figure 2-7 Single/Dual Channel 24-bit LVDS Data Transmission Ordering

LVDS

Table 2-7 LVDS 24-bit TFT Single Pixel per Clock (Single Channel) Signal Mapping

TX Signal 24-bit

LP1C1 R0

LP1C2 R1

LP1C3 R2

LP1C4 R3

LP1C5 R4

LP1C6 R5

LP1C7 G0

LP2C1 G1

LP2C2 G2

LP2C3 G3

LP2C4 G4

LP2C5 G5

LP2C6 B0

LP2C7 B1

LP3C1 B2

LP3C2 B3

LP3C3 B4

LP3C4 B5

LP3C5 HSYNC

LP3C6 VSYNC

LP3C7 ENABLE

LP4C1 R6

LP4C2 R7

LP4C3 G6

LP4C4 G7

LP4C5 B6

LP4C6 B7

LP4C7 Reserved

Table 2-8 LVDS 24-bit TFT Dual Pixel per Clock (Dual Channel) Signal Mapping

TX Signal 24-bit TX Signal 24-bit

LP1C1 Ro0 UP1C1 Re0

LP1C2 Ro1 UP1C2 Re1

LP1C3 Ro2 UP1C3 Re2

LP1C4 Ro3 UP1C4 Re3

LP1C5 Ro4 UP1C5 Re4

LP1C6 Ro5 UP1C6 Re5

LP1C7 Go0 UP1C7 Ge0

LP2C1 Go1 UP2C1 Ge1

LP2C2 Go2 UP2C2 Ge2

LP2C3 Go3 UP2C3 Ge3

LP2C4 Go4 UP2C4 Ge4

LP2C5 Go5 UP2C5 Ge5

LP2C6 Bo0 UP2C6 Be0

LP2C7 Bo1 UP2C7 Be1

LP3C1 Bo2 UP3C1 Be2

LP3C2 Bo3 UP3C2 Be3

LP3C3 Bo4 UP3C3 Be4

LP3C4 Bo5 UP3C4 Be5

LP3C5 HSYNC UP3C5 (from the register)

LP3C6 VSYNC UP3C6 (from the register)

LP3C7 ENABLE UP3C7 (from the register)

LP4C1 Ro6 UP4C1 Re6

LP4C2 Ro7 UP4C2 Re7

LP4C3 Go6 UP4C3 Ge6

LP4C4 Go7 UP4C4 Ge7

LP4C5 Bo6 UP4C5 Be6

LP4C6 Bo7 UP4C6 Be7

LP4C7 Reserved UP4C7 Reserved

LVDS

Note: Signal names with letter 'o' mean 'odd' pixel or the first pixel on the panel, and signal names with letter 'e' mean

'even' pixel or the second pixel on the panel.

2.4.2 LVDS Spread Spectrum

The RS780E has an internal LVDS spread spectrum controller capable of generating a frequency modulated profile for the LVDS signals. The amount of spread (center spread of up to +/-2.5% and down spread of up to 5%) and the modulation frequency (in the range of 20-50kHz) are programmable through the LVDS registers.

DVI/HDMI™

TX0P

TX0M

TX1P

TX1M

TX2P

TX2M

TXCP TXCM

TG9TG8TG7TG6TG5TG4TG3TG2TG1TG0

Depending upon state of HSYNC and VSYNC

Depending upon encoded Green channel pixel dataDepending upon state of PLL_SYNC and CTL1

Depending upon state of CTL2 and CTL3

TR1TR0 TR2 TR3 TR4 TR5 TR6 TR7 TR8 TR9

Depending upon encoded Red channel pixel data

TB0 TB1 TB2 TB3 TB4 TB5 TB6 TB7 TB8 TB9

Depending upon encoded Blue channel pixel data

Various control and audio (for HDMI only) signals

Various control and audio (for HDMI™ only) signals

Encoded Red Channel Pixel Data

Encoded Green Channel Pixel Data

Encoded Blue Channel Pixel Data

2.5 DVI/HDMI™

2.5.1 DVI/HDMI™ Data Transmission Order and Signal Mapping

The RS780E contains two dual-link TMDS interfaces, multiplexed on the PCI Express® graphics lanes (see section 3.9,

“TMDS Interface Multiplexed on the PCI Express® Graphics Lanes‚’ on page 3-10 section 3.8, “LVTM Interface in TMDS Mode‚’ on page 3-9), which support clock frequencies of up to 162 MHz on each

link.

Figure 2-8 shows the transmission ordering of the signals on the interfaces.

) and on the LVTM interface (see

Figure 2-8 Data Transmission Ordering for the TMDS Interfaces

For dual-link mode, which is for DVI only, the same transmission order applies to data channels on the second link, with the first link transmitting data for even pixels and the second link for odd pixels. See

The signal mapping for the transmission is shown in

Table 2-9 (single link) and Table 2-10 (dual-link DVI) below.

Table 2-10 below for details.

Table 2-9 Single Link Signal Mapping for DVI/HDMI™

DVI/HDMI™

Functional Name

TX0M/P Phase 1 B0

TX1M/P Phase 1 G0

TX2M/P Phase 1 R0

Note: H/VSYNC are transmitted on TX0M/P (Blue) channel during blank.

Data Phase Signal

Phase 2 B1

Phase 3 B2

Phase 4 B3

Phase 5 B4

Phase 6 B5

Phase 7 B6

Phase 8 B7

Phase 9 B8

Phase 10 B9

Phase 2 G1

Phase 3 G2

Phase 4 G3

Phase 5 G4

Phase 6 G5

Phase 7 G6

Phase 8 G7

Phase 9 G8

Phase 10 G9

Phase 2 R1

Phase 3 R2

Phase 4 R3

Phase 5 R4

Phase 6 R5

Phase 7 R6

Phase 8 R7

Phase 9 R8

Phase 10 R9

DVI/HDMI™

Table 2-10 Dual-Link Signal Mapping for DVI

DVI Functional

Notes:

- H/VSYNC are transmitted on TX0M/P (Blue) channel during blank.

- For DVI dual-link mode, the first active data pixel is defined as pixel#0 (an even pixel), as opposed to the DVI specifications.

Link 1 Link 2

Name

TX0M/P Phase 1 EVEN_B0 TX3M/P Phase 1 ODD_B0

TX1M/P Phase 1 EVEN_G0 TX4M/P Phase 1 ODD_G0

TX2M/P Phase 1 EVEN_R0 TX5M/P Phase 1 ODD_R0

Data Phase Signal

Phase 2 EVEN_B1 Phase 2 ODD_B1

Phase 3 EVEN_B2 Phase 3 ODD_B2

Phase 4 EVEN_B3 Phase 4 ODD_B3

Phase 5 EVEN_B4 Phase 5 ODD_B4

Phase 6 EVEN_B5 Phase 6 ODD_B5

Phase 7 EVEN_B6 Phase 7 ODD_B6

Phase 8 EVEN_B7 Phase 8 ODD_B7

Phase 9 EVEN_B8 Phase 9 ODD_B8

Phase 10 EVEN_B9 Phase 10 ODD_B9

Phase 2 EVEN_G1 Phase 2 ODD_G1

Phase 3 EVEN_G2 Phase 3 ODD_G2

Phase 4 EVEN_G3 Phase 4 ODD_G3

Phase 5 EVEN_G4 Phase 5 ODD_G4

Phase 6 EVEN_G5 Phase 6 ODD_G5

Phase 7 EVEN_G6 Phase 7 ODD_G6

Phase 8 EVEN_G7 Phase 8 ODD_G7

Phase 9 EVEN_G8 Phase 9 ODD_G8

Phase 10 EVEN_G9 Phase 10 ODD_G9

Phase 2 EVEN_R1 Phase 2 ODD_R1

Phase 3 EVEN_R2 Phase 3 ODD_R2

Phase 4 EVEN_R3 Phase 4 ODD_R3

Phase 5 EVEN_R4 Phase 5 ODD_R4

Phase 6 EVEN_R5 Phase 6 ODD_R5

Phase 7 EVEN_R6 Phase 7 ODD_R6

Phase 8 EVEN_R7 Phase 8 ODD_R7

Phase 9 EVEN_R8 Phase 9 ODD_R8

Phase 10 EVEN_R9 Phase 10 ODD_R9

DVI Functional

Name

Data Phase Signal

2.5.2 Support for HDMI™ Packet Types

Table 2-11 Support for HDMI™ Packet Type

DVI/HDMI™

Packet

Value

0x00 Null Yes Inserted by hardware when needed.

0x01

0x02 Audio Sample Yes

0x03 General Control No

0x04 ACP Packet No — —

0x05 ISRC1 Packet No — —

0x06 ISRC2 Packet No — —

0x07 Reserved N/A N/A N/A

InfoFrame Packet Type

HDMI™ IDEIA-861B

0x80 0x00 Vendor-Specific Yes* — —

0x81 0x01 AVI Yes Inserted on line selected by software.

0x82 0x02

0x83 0x03 Audio Yes

0x84 0x04 MPEG Source No —

* Note: These packet types are supported using generic packet types. A maximum of two of them can be supported simultaneously.

Packet Type

Audio Clock Regeneration

Source Product Descriptor

Supported

or Not

Yes Inserted by hardware as required. —

Yes * — —

Source Comment

Sent when required to meet maximum time between data island specification.

Audio samples come from HD audio DMA. Channel status from HD audio and video registers. Inserted in horizontal blank whenever audio FIFO contains data.

Sending and contents controlled by video driver.

For colorimetry, repetition count, video format, picture formatting.

Inserted on line selected by software. Contents from registers written by video and HD audio drivers.

For channel counts, sampling frequency, etc.

According to the CEA-861 specification, MPEG Source InfoFrames should not be used.

—

VGA DAC Characteristics

2.6 VGA DAC Characteristics

Table 2-12 VGA DAC Characteristics

Parameter Min Typ Max Notes

Resolution 10 bits - - 1

Maximum PS/2 setting Output Voltage - 0.7V - 1

Maximum PS/2 setting Output Current - 18.7mA - 1

Full Scale Error +8% / -3% - +10% 2, 3

DAC to DAC Correlation -2% - +2% 1, 4

Differential Linearity -2 LSB - +2 LSB 1, 5

Integral Linearity -2 LSB - +2 LSB 1, 5

Rise Time (10% to 90%) 0.58ns - 1.7ns 1, 6

Full Scale Settling Time - TBA - 1, 7, 8

Glitch Energy - TBA - 1, 8

Monotonicity - - - 9

Notes: 1 - Tested over the operating temperature range at nominal supply voltage, with an Iref of -1.50mA (Iref is the level of the current flowing

out of the RSET resistor).

2 - Tested over the operating temperature range at reduced supply voltage, with an Iref of -1.50mA (Iref is the level of the current flowing

out of the Rset resistor). 3 - Full scale error from the value predicted by the design equations. 4 - About the mid-point of the distribution of the three DACs measured at full scale deflection. 5 - Linearity measured from the best fit line through the DAC characteristics. Monotonicity guaranteed. 6 - Load = 37.5 + 20 pF with Iref = -1.50 mA (Iref is the current flowing out of the Rset resistor). 7 - Measured from the end of the overshoot to the point where the amplitude of the video ringing is down to +/-5% of the final steady state

value. 8 - This parameter is sampled, not 100% tested. 9 - Monotonicity is guaranteed.

2.7 DVI-I Support

VGA Signals

The RS780E has the capability of driving both digital and analog outputs simultaneously to a DVI-I connector. This is accomplished by routing the RED, GREEN, BLUE, DACHSYNC, DACVSYNC, and AVSSN signals from the RS780E’s CRT output (see C4(HS), C5(GND), and Pin 8 (VS) signals (see

For the DVI output portion of the DVI-I connector, AMD recommends using the RS780E’s LVTM interface to provide the DVI output and routing these digital signals (see appropriate inputs on the DVI-I connector. The video BIOS must be configured so that the RS780E drives out DVI signals from its LVTM interface. Display modes supported include desktop resolutions such as 800x600, 1024x768, 1152x864, 1280x1024, and 1600x1200 at 16bpp or 32bpp, with 60Hz or 75Hz screen refresh rate.

DVI-I Support

section 3.7, “CRT Interface‚’ on page 3-7) to the DVI-I connector’s C1(R), C2(G), C3(B),

Figure 2-9, “Pins for Analog Output on the DVI-I Connector,” below).

Figure 2-9 Pins for Analog Output on the DVI-I Connector

section 2.3, “LVTM (LVDS/TMDS) Interface‚’ on page 2-6) to the

2.8 Clock Generation

The RS780E provides support for an external clock chip to generate side-port memory, PCI-E, and A-Link II clocks. For information on the supported external clock chips, please consult your AMD CSS representative.

Chapter 3

Pin Descriptions and Strap Options

This chapter gives the pin descriptions and the strap options for the RS780E. To jump to a topic of interest, use the following list of hyperlinked cross references:

“Pin Assignment Top View” on page 3-2

“Interface Block Diagram” on page 3-4

“CPU HyperTransport™ Interface” on page 3-5

“Side-port Memory Interface” on page 3-5

“PCI Express® Interfaces” on page 3-6:

“1 x 16 or 2 x 8 Lane Interface for External Graphics” on page 3-6

“A-Link Express II Interface for Southbridge” on page 3-6

“6 x 1 Lane Interface for General Purpose External Devices” on page 3-6

“Miscellaneous PCI Express® Signals” on page 3-6

“Clock Interface” on page 3-7

“CRT Interface” on page 3-7

“LVTM Interface” on page 3-8

“TMDS Interface Multiplexed on the PCI Express® Graphics Lanes” on page 3-10

“DisplayPort™ Interface” on page 3-10

“Power Management Pins” on page 3-11

“Miscellaneous Pins” on page 3-12

“Power Pins” on page 3-12

“Ground Pins” on page 3-13

“Strapping Options” on page 3-14

3.1 Pin Assignment Top View

3.1.1 RS780E Pin Assignment Top View

The figures below only represent the relative ball positions. For the actual physical layout of the balls, please refer to

Figure 5-2, “RS780E Ball Arrangement (Bottom View),” on page 5- 10.

Pin Assignment Top View

12345678910111213

VSSAPCIE GFX_TX 2N GFX_RX1N GFX_TX1N GFX_TX0N VDDPCIE

GFX_RX2N GFX_RX2P GFX_TX2P GFX_RX0N VDDPCIE AUX_CAL LDTSTOP#

D GFX_TX3P GFX_TX3N VSSAPCIE GFX_RX0P VSSAPCIE VDDPCIE

GFX_TX4N GFX_TX4P VSSAPCIE GFX_RX3P VDDPCIE

GFX_TX6P GFX _TX6N GFX_TX 5N GFX_TX5P GFX_RX3N VDDPCIE LV DS_ BLO N DAC_SCL VDD18 REFCLK_N AVDD

VSSAPCIE VSSAPCIE VSSAPCIE GFX_RX4P GFX_RX4N VDDPCIE VSS VDD18 RESERVED LVDS_ENA_BL

GFX_TX8P GFX _TX8N GFX_TX 7N GFX_TX7P GFX_RX5P GFX_RX5N VSSAPCIE VDDPCIE VDDA18PCIE VDD33 VDD33

GFX_TX9N GFX_TX9P VSSAPCIE GFX_RX6N GFX_RX6P GFX_RX7P GFX_RX7N VDDPCIE VDDA18PCIE VDDC VSS

GFX_TX11P GFX_TX11N GFX_TX10N GFX_TX10P VDDPCIE VDDA18PCIE VSS VDDC

VSSAPCIE VSSAPCIE VSSAPCIE GFX_RX8P GFX_RX8N VSSAPCIE GFX_RX9N VDDPCIE VDDA18PCIE VDDC VSS

GFX_TX13P GFX_TX13N GFX_TX12N GFX_TX12P GFX_RX11N VSSAPCIE GFX_RX10N GFX_RX9P VDD PCIE VDDA18PCIE VSS VDDC VDDC

GFX_TX14N GFX_TX14P VSSAPCIE VDDC VSS

GFX_TX15P GFX_TX15N GFX_RX14N GFX_RX14P GFX_RX11P VSSAPCIE GFX_RX10P GFX_RX12N VDDPCI E VDDA18PCIE VDDC VSS VDDC

VSSAPCIE VSSAPCIE VSSAPCIE GFX_RX13N GFX_RX13P VSSAPCIE GFX_RX12P VDDPCIE VDDA18PCIE VSS VDDC

GFX_REFCLKNGFX_REFCLK

GPP_REFCLKPGPP_REFCLK

GPP_TX5P GPP_TX5N

VSSAPCIE VSSAPCIE VSSAPCIE SB_RX3P GPP_RX3N VSSAPCIE VSSAPCIE VDDA18PCIE VSS MEM_RAS#

GPP_TX3P GPP_TX3N GPP_TX4N GPP_T X4P SB_RX3N VSSAPCIE SB_RX1N SB_RX0N VDDA18PCIE VDD_MEM MEM_CAS#

GPP_TX2N GPP_TX2P VSSAPCIE SB_RX2P SB_RX2N SB_RX1P SB_RX0P VDDA18PCIE VDD_MEM MEM_A4

VSSAPCIE VSSAPCIE GPP_TX1N GPP_ TX1P VSSAPCIE SB_TX2P VSSAPCIE PCE_CALRN VDDA18PCIE VDD_MEM VSS MEM_A0 MEM_CS#

GPP_TX0P GPP_TX0N VSSAPCIE VSSAPCIE SB_TX2N PCE_CALRP VDD_MEM VSS

GPP_RX2P GPP_RX2N GPP_RX1N GPP_RX0N SB_TX 3P SB_TX1N SB_TX0P

VSSAPCIE GPP_RX1P GPP_RX0P VSSAPCIE SB_TX3N SB_TX1P SB_TX0N

VSSAPCIE GFX_RX1P GFX_TX1P GFX_TX0P VDDPCIE

GFX_RX15N GFX_RX 15P VDDPCIE VDDA18PCIE VDDC VSS

GPPSB_REFC

12345678910111213

VSSAPCIE GPP_RX4P GPP_RX4N GPP_RX5N GPP_RX5P VDDPCIE VDDA18PCIE VSS VDDC

GPPSB_REFC

LKN

GPP_RX3P VSSAPCIE VSSAPCIE VSSAPCIE VDDPCIE MEM_A2 VSS

LKP

DDC_DATA1/

AUX1N

DDC_CLK1/

AUX1P

VDDA18PCIEP

DDC_CLK0/

AUX0P

DDC_DATA0/

AUX0N

SYSRESET# TMDS_HPD HPD VSS SUS_STAT# TESTMODE

DAC_SDA LVDS_DIGON REFCLK_P AVD D

THERMALDIO

DE_N

THERMALDIO

DE_P

I2C_DATA

POWERGOOD DAC_HSYNC PLLVDD VDDLTP18

I2C_CLK STRP_DATA DAC_VSYNC PLLVSS VSSLTP18

VDDA18PCIE VDD_MEM VDD18_MEM MEM_COM PN MEM_A8

VDDA18PCIE VDD_MEM VDD18_MEM MEM_COMPP MEM_A11

ALLOW_LDTSTO

CPU Interface

A-Link Express II Interface

Clock Interface

Side-port Memory Interface

CRT Interface

External graphics Interface

LVDS Interface

General Purpose External Device Interface

Power Management Interface

Powers

Grounds

Others

Figure 3-1 RS780E Pin Assignment Top View (Left)

Pin Assignment Top View

14 15 16 17 18 19 20 21 22 23 24 25

VDDLT33 VDDLT18 TXCLK_LN TXOUT_U1P TXOUT_ U0N TXOUT_L3P TXOUT_L2N TXOUT_L 1P TXOUT_ L0P VDDHTRX HT_RXCALN VSSAHT A

VDDLT33 VDDLT18 TXCLK_LP TXOUT_U1N TXOUT_U0P TXOUT_L3N TXOUT_L2P TX OUT_L1N TXOUT_L0N VDDHTRX HT_TXCALP HT_TX CALN B

VSSLT VS SLT VSSLT VSS LT VSSLT HT_RXCALP HT _REFCLKN HT_RE FCLKP C

PLLVDD18 VSSLT TXCLK_UP TX CLK_UN TXOU T_U3P TXOUT_U3N TXOUT_U2P TXOUT_U2N VDDHTRX VSSAHT HT_TXCAD0P HT_TXCAD0N D

VSS VSS RESERVED GREEN BLUE VSSLT VDDHTRX VSSAHT HT_TXCAD1P HT_TXCAD1N E

AVDDDI RESERVED RESERVED GREEN# BLUE# VDDHTRX HT_TXCAD8P HT_TXCAD3N HT_TXCAD3P HT_TXCAD2P HT_TXCAD2N F

DAC_RSET AVSSDI RED# RED VDDHTRX HT_TXCAD9P HT_TXCAD8N VSSAHT VSSAHT VS SAHT G

AVSS Q AVDDQ VDDA18HTPLL VDDHTRX VS SAHT VSSAHT HT_TXCAD 9N HT_TXCAD4N HT_TXCA D4P HT_TXCLK0P HT_TXCLK 0N H

VDDC VSS VDDC VDDHT HT_TXCAD11P HT_TXCAD12N HT_TXCAD10P HT_TXCAD10N VSSAHT HT_TXCAD5N HT_TXCAD5P J

VSS VDDC VDDHT HT_TXCAD11N HT_TXCAD7N HT_TXCAD7P HT_TXCAD6P HT_TXCAD6N K

VDDC VSS VDDHT VSSAHT HT_TXCAD13N HT_TXCAD12P HT_TXCLK1N HT_TXCLK1P VSSAHT VSSAHT VSSAHT L

VSS VDDC VDDHT VDDHTTX HT_TXCAD 15N HT_TXCAD13P VSSAHT HT_TXCAD14P HT_RXCTL0P HT_RXCTL0N HT_TXCTL0P HT_TXCTL0N M

VDDC VSSAHT HT_RXCAD7P HT_RXCAD7N N

VDDC VSS VDDHT VDDHTTX HT_TXCAD15P HT_TXCTL1P VSSAHT HT_T XCAD14N HT_RXCAD5P HT_RXCAD5N HT_RXCAD6N HT_RXCAD6P P

VSS VDDC VDDHT VDDHTTX HT_TXCTL1N VSSAHT HT_RXCTL1N HT_RXCTL1P VSSAHT VSSAHT VSSAHT R

VDDC VDD C VDDHT VDDHTTX HT_RXCLK0P HT_RXCLK0N HT_RXCAD4N HT_RXCAD4P T

VSS VSS VDDC VDDHTTX

MEM_ODT MEM_CKP MEM_DQ4 VDDHTTX VSSAHT

MEM_CKN VSS MEM_DM0 MEM_DQS0N VDDHTTX

MEM_A13 MEM_DQ7 MEM_DQS0P VSS MEM_DQ3 VDDHTTX VSSAHT HT_RXCAD11P

VSS MEM_DQ 6 ME M_DQ5 MEM_DQ0 MEM_DQ2 MEM_DQ1 VDDHTTX HT_RXCLK1N

MEM_A6 VSS MEM_A5 VSS MEM_CKE VSS MEM_DQ12 VSS VDDHTTX HT_RXCLK1P HT_RXCAD9N HT_RXCAD9P AB

MEM_A12 MEM_A10 MEM_DQ11 MEM_DQ8 MEM_DQ14 VDDHTTX HT_RXCAD8P HT_RXCAD8N AC

MEM_A7 MEM_A9 MEM_BA0 MEM_BA2 MEM_WE# MEM_DQ9 MEM_DQS1P MEM_DQ15 MEM_DQ13 IOPLLVSS VDDHTTX VSSAHT AD

VSS MEM_A3 MEM_A1 MEM_BA1 MEM_VREF MEM_DM1 VSS MEM_DQS1N MEM_DQ10 IOPLLVDD18 IOPLLVDD VDDHTTX AE

14 15 16 17 18 19 20 21 22 23 24 25

HT_RXCAD15 HT_RXCAD15 HT_RXCAD14 HT_RXCAD14

HT_RXCAD13 HT_RXCAD13

HT_RXCAD12 HT_RXCAD12

VSSAHT HT_RXCAD3P HT_RXCAD3N U

HT_RXCAD1P HT_RXCAD1N HT_RXCAD2N HT_RXCAD2P V

VSSAHT VSSAHT VSSAHT W

HT_RXCAD11

HT_RXCAD0N HT_RXCAD0P Y

HT_RXCAD10 HT_RXCAD10

CPU Interface

A-Link Express II Interface

Clock Interface

Side-port Memory Interface

CRT Interface

External graphics Interface

LVDS Interface

General Purpose External Device Interface

Power Management Interface

Powers

Grounds

Others

Figure 3-2 RS780E Pin Assignment Top View (Right)

3.2 Interface Block Diagram

HT_RXCAD[15:0]P, HT_RXCAD[15:0]N

HT_RXCLK[1:0]P, HT_RXCLK[1:0]N

HT_RXCTL[1:0]P, HT_RXCTL[1:0]N

HT_TXCTL[1:0]P, HT_TXCTL[1:0]N

HT_RXCALP, HT_RXCALN

HT_TXCALP, HT_TXCALN

HT_TXCLK[1:0]P, HT_TXCLK[1:0]N

HT_TXCAD[15:0]P, HT_TXCAD[15:0]N

SB_TX[3:0]P, SB_TX[3:0]N SB_RX[3:0]P, SB_RX[3:0]N

TXOUT_U0N, TXOUT_U0P TXOUT_U1N, TXOUT_U1P TXOUT_U2N, TXOUT_U2P

TXCLK_LN, TXCLK_LP

TXOUT_L0N, TXOUT_L0P

TXCLK_UN, TXCLK_UP

TXOUT_L1N, TXOUT_L1P TXOUT_L2N, TXOUT_L2P

GFX_TX[15:0]P, GFX_TX[15:0]N GFX_RX[15:0]P, GFX_RX[15:0]N

GPPSB_REFCLKP, GPPSB_REFCLKN

AVSSQ

TESTMODE

THERMALDIDOE_N,

SYSRESET#

POWERGOOD

VDDC

PLLVSS

DAC_RSET

RED, RED#

GREEN, GREEN#

DAC_SCL DAC_SDA

DAC_HSYNC

DAC_VSYNC

BLUE, BLUE#

THERMALDIODE_P

Interface

LVTM

Interface

A-Link Express

II Interface

Power

Management

Interface

Misc. Signals

PCI-E

External

Graphics or

TMDS

Interface

CRT

Interface

Clock

Interface

Power

Grounds

VDDHTRX

AVSSDI

LVDS_DIGON

LVDS_BLON

PCI-E

Interface

for General

Purpose

External Devices

GPP_TX[5:0]P, GPP_TX[5:0]N GPP_RX[5:0]P, GPP_RX[5:0]N

PCE_CALRP

Misc. PCI-E

Signals

PCE_CALRN

VSS

HT_REFCLKP, HT_REFCLKN

LDTSTOP#

ALLOW_LDTSTOP

I2C_CLK

DDC_DATA0/AUX0N

I2C_DATA

STRP_DATA

TMDS_HPD

IOPLLVDD

AVDD AVDDDI

VDDLTP18

VDDLT18

AVDDQ

LVDS_EN_BL

DDC_CLK0/AUX0P

VSSLT

IOPLLVSS

VSSAPCIE

VSSAHT

VDD_MEM

IOPLLVDD18

PLLVDD

PLLVDD18 VDDA18HTPLL

VDD33

VDDHT VDDA18PCIEPLL

VDDA18PCIE

GFX_REFCLKP, GFX_REFCLKN

VDD18_MEM

VDD18

VDDHTTX

AUX_CAL

DDC_CLK1/AUX1P

HPD

REFCLK_N, REFCLK_P

DDC_DATA1/AUX1N

MEM_DM[1:0]

MEM_A[13:0]

MEM_CKE

MEM_CKP, MEM_CKN

MEM_RAS#

MEM_CS#

Side-port

Memory

Interface

MEM_CAS#

MEM_DQ[15:0]

MEM_DQS[1:0]P, MEM_DQS[1:0]N

MEM_WE#

MEM_ODT

MEM_COMPP, MEM_COMPN

MEM_VREF

MEM_BA[2:0]

SUS_STAT#

GPP_REFCLKP, GPP_REFCLKN

VDDLT33

VSSLTP18

RED#, GREEN#, BLUE#

Figure 3-3 shows the different interfaces on the RS780E. Interface names in blue are hyperlinks to the corresponding sections in this chapter.

Interface Block Diagram

Figure 3-3 RS780E Interface Block Diagram

CPU HyperTransport™ Interface

3.3 CPU HyperTransport™ Interface

Table 3-1 CPU HyperTransport™ Interface

Pin Name Type

HT_RXCAD[15:0]P, HT_RXCAD[15:0]N

HT_RXCLK[1:0]P, HT_RXCLK[1:0]N

HT_RXCTL[1:0]P, HT_RXCTL[1:0]N

HT_TXCAD[15:0]P, HT_TXCAD[15:0]N

HT_TXCLK[1:0]P, HT_TXCLK[1:0]N

HT_TXCTL[1:0]P, HT_TXCTL[1:0]N

HT_RXCALN Other VDDHTRX VSS Receiver Calibration Resistor to VDD_HT power rail.

HT_RXCALP Other VDDHTRX VSS Receiver Calibration Resistor to Ground

HT_TXCALP Other VDDHTTX VSS Transmitter Calibration Resistor to HTTX_CALN

HT_TXCALN Other VDDHTTX VSS Transmitter Calibration Resistor to HTTX_CALP

I VDDHTRX VSS Receiver Command, Address, and Data Differential Pairs

I VDDHTRX VSS

O VDDHTTX VSS Transmitter Command, Address, and Data Differential Pairs

O VDDHTTX VSS

Power

Domain

3.4 Side-port Memory Interface

Table 3-2 Side-Port Memory Interface

Ground Domain

Functional Description

Receiver Clock Signal Differential Pairs. Forwarded clock signal. Each byte of RXCAD uses a different clock signal. Data is transferred on each clock edge.

Receiver Control Differential Pairs. For distinguishing control packets from data packets.

Transmitter Clock Signal Differential Pairs. Each byte of TXCAD uses a different clock signal. Data is transferred on each clock edge.

Transmitter Control Differential Pairs. Forwarded clock signal. For distinguishing control packets from data packets.

Pin Name Type

MEM_A[13:0] O VDD_MEM VSS None

MEM_BA[2:0] O VDD_MEM VSS None Memory Bank Address

MEM_RAS# O VDD_MEM VSS None Row Address Strobe

MEM_CAS# O VDD_MEM VSS None Column Address Strobe

MEM_WE# O VDD_MEM VSS None Write Enable Strobe

MEM_CKE O VDD_MEM VSS None Clock Enable

MEM_CKP O VDD_MEM VSS None Memory Differential Positive Clock

MEM_CKN O VDD_MEM VSS None Memory Differential Negative Clock

MEM_CS# O VDD_MEM VSS None Chip Select

MEM_ODT O VDD_MEM VSS None On-die Termination

MEM_DQ[15:0] I/O VDD_MEM VSS None Memory Data Bus. Supports SSTL2 and SSTL3.

MEM_DM[1:0] I/O VDD_MEM VSS None Data masks for each byte during memory write cycles

MEM_DQS[1:0]P I/O VDD_MEM VSS None

MEM_DQS[1:0]N I/O VDD_MEM VSS None Do not connect.

MEM_COMPP, MEM_COMPN

MEM_VREF Other – VSS None

Other VDD_MEM VSS None

Power

Domain

Ground Domain

Integrated Termination

Functional Description

Memory Address Bus. Provides the multiplexed row and column addresses to the memory.

Memory Data Strobes. These are bi-directional data strobes for latching read/write data.

Memory interface compensation pins for N and P channel devices. Connect through resistors to VDD_MEM and ground respectively (refer to the reference schematics for the proper resistor values).

Reference voltage. It supplies the threshold value for distinguishing between “1” and “0” on a memory signal. Typical value is 0.5*VDD_MEM.

3.5 PCI Express® Interfaces

3.5.1 1 x 16 or 2 x 8 Lane Interface for External Graphics

Table 3-3 1 x 16 or 2 x 8 Lane PCI Express® Interface for External Graphics

PCI Express® Interfaces

Pin Name Type

GFX_TX[15:0]P, GFX_TX[15:0]N

GFX_RX[15:0]P, GFX_RX[15:0]N

O VDDPCIE VSSAPCIE

Power

Domain

I VDDPCIE VSSAPCIE

Ground Domain

Integrated Termination

50 between complements

3.5.2 A-Link Express II Interface for Southbridge

Note: The widths of the A-Link Express II interface and the general purpose links for external devices are configured

through the programmable strap GPPSB_LINK_CONFIG, which is programmed through RS780E’s registers. See the

RS780 ASIC Family Register Reference Guide, order# 43451, and the RS780 ASIC Family Register Programming Requirements,

Table 3-4 1 x 4 Lane A-Link Express II Interface for Southbridge

Pin Name Type

SB_TX[3:0]P, SB_TX[3:0]N

SB_RX[3:0]P, SB_RX[3:0]N

order# 43291, for details.

Power

Domain

O VDDPCIE VSSAPCIE

I VDDPCIE VSSAPCIE

Ground Domain

Integrated

Termination

50 between complements

Functional Description

Transmit Data Differential Pairs. Connect to external connector for an external graphics card on the motherboard (if implemented).

Receive Data Differential Pairs. Connect to external connector for an external graphics card on the motherboard (if implemented).

Functional Description

Transmit Data Differential Pairs. Connect to the corresponding Receive Data Differential pairs on the Southbridge.

Receive Data Differential Pairs. Connect to the corresponding Transmit Data Differential pairs on the Southbridge.

3.5.3 6 x 1 Lane Interface for General Purpose External Devices

Note: The widths of the A-Link Express II interface and the general purpose links for external devices are configured

through the programmable strap GPPSB_LINK_CONFIG, which is programmed through RS780E’s registers. See the

RS780 ASIC Family Register Reference Guide, order# 43451, and the RS780 ASIC Family Register Programming Requirements,

Table 3-5 6 x 1 Lane PCI Express® Interface for General Purpose External Devices

Pin Name Type

GPP_TX[5:0]P, GPP_TX[5:0]N

GPP_RX[5:0]P, GPP_RX[5:0]N

order# 43291, for details.

Power

Domain

O VDDPCIE VSSAPCIE

I VDDPCIE VSSAPCIE

Ground Domain

Integrated

Termination

50 between complements

Functional Description

Transmit Data Differential Pairs. Connect to external connectors on the motherboard for add-in card or ExpressCard support.

Receive Data Differential Pairs. Connect to external connectors on the motherboard for add-in card or ExpressCard support.

3.5.4 Miscellaneous PCI Express® Signals

Table 3-6 PCI Express® Interface for Miscellaneous PCI Express® Signals

Pin Name Type

PCE_CALRN Other VDDPCIE VSSAPCIE

PCE_CALRP Other VDDPCIE VSSAPCIE

Power

Domain

Ground Domain

Functional Description

RX Impedance Calibration. Connect to VDDPCIE on the motherboard with an external resistor of an appropriate value.

TX Impedance Calibration. Connect to GND on the motherboard with an external resistor of an appropriate value.

Clock Interface

3.6 Clock Interface

Table 3-7 Clock Interface

Pin Name Type

HT_REFCLKP, HT_REFCLKN

GFX_REFCLKP, GFX_REFCLKN

GPPSB_REFCLKP, GPPSB_REFCLKN

GPP_REFCLKP, GPP_REFCLKN

REFCLK_P, REFCLK_N

3.7 CRT Interface

Table 3-8 CRT Interface

Pin Name Type

RED A-O AVDD – – Red for CRT monitor output

GREEN A-O AVDD – – Green for CRT monitor output

BLUE A-O AVDD – – Blue for CRT monitor output

DAC_HSYNC A-O VDD33 VSS

DAC_VSYNC A-O VDD33 VSS

DAC_RSET Other N/A AVSSQ –

DAC_SDA I/O VDD33 VSS

DAC_SCL I/O VDD33 VSS

Power

Domain

VDDA18H

TPLL

I/O VDDPCIE VSSAPCIE

I VDDPCIE VSSAPCIE

O VDDPCIE VSSAPCIE

I VDD33 VSS –

Power

Domain

Ground Domain

VSSAHT –

Ground Domain

Integrated

Termination

50 between complements

Integrated

Termination

programmable:

PU/PD/none

programmable:

PU/PD/none

programmable:

PU/PD/none

programmable:

PU/PD/none

50k

Functional Description

HyperTransport™ 100MHz reference clock differential pair input from external clock source

Clock Differential Pair for external graphics. Input from the external clock generator, as a reference clock for external graphics.

Clock Differential Pair for Southbridge and general purpose PCI-E devices. Input from the external clock generator, as a reference clock for A-Link II and general purpose PCI-E.

Clock Differential Pair for general purpose PCI-E devices. Not used. Can be left unconnected, or connected to the external clock generator for maintaining system compatibility with the RX780 or RD780.

Reference clock input for the RS780E. REFCLK_P is a single-ended,

14.31818MHz input from the external clock generator; input swing should be 1.1V. Connect REFCLK_N to VREF (0.55V) on the motherboard.

Functional Description

Display Horizontal Sync

Display Vertical Sync

DAC internal reference to set full scale DAC current through 1% resistor to AVSSQ

C™ data for display (to video monitor). The signal is 5V-tolerant.

C clock for display (to video monitor). The signal is 5V-tolerant.

3.8 LVTM Interface

3.8.1 LVTM Interface in LVDS Mode

Note: For designs implementing only a single LVDS channel, the LOWER channel of the interface should be used.

Table 3-9

LVTM Interface

Pin Name Type

TXOUT_U0N O VDDLT18 LVSSR None

TXOUT_U0P O VDDLT18 LVSSR None

TXOUT_U1N O VDDLT18 LVSSR None

TXOUT_U1P O VDDLT18 LVSSR None

TXOUT_U2N O VDDLT18 LVSSR None

TXOUT_U2P O VDDLT18 LVSSR None

TXOUT_U3N O VDDLT18 LVSSR None

TXOUT_U3P O VDDLT18 LVSSR None

TXCLK_UN O VDDLT18 LVSSR None

TXCLK_UP O VDDLT18 LVSSR None

TXOUT_L0N O VDDLT18 LVSSR None

TXOUT_L0P O VDDLT18 LVSSR None

TXOUT_L1N O VDDLT18 LVSSR None

TXOUT_L1P O VDDLT18 LVSSR None

TXOUT_L2N O VDDLT18 LVSSR None

TXOUT_L2P O VDDLT18 LVSSR None

TXOUT_L3N O VDDLT18 LVSSR None

TXOUT_L3P O VDDLT18 LVSSR None

TXCLK_LN O VDDLT18 LVSSR None

TXCLK_LP O VDDLT18 LVSSR None

Power

Domain

Ground Domain

Integrated

Termination

Functional Description

LVDS upper data channel 0 (-). Only used in dual-channel LVDS mode.

LVDS upper data channel 0 (+). Only used in dual-channel LVDS mode.

LVDS upper data channel 1 (-). Only used in dual-channel LVDS mode.

LVDS upper data channel 1 (+). Only used in dual-channel LVDS mode.

LVDS upper data channel 2 (-). Only used in dual-channel LVDS mode.

LVDS upper data channel 2 (+). Only used in dual-channel LVDS mode.

LVDS upper data channel 3 (-). Only used in dual-channel LVDS mode.

LVDS upper data channel 3 (+). Only used in dual-channel LVDS mode.

LVDS upper clock channel (-). Only used in dual-channel LVDS mode.

LVDS upper clock channel (+). Only used in dual-channel LVDS mode.

LVDS lower data channel 0 (-). This channel is used as the transmitting channel in single channel LVDS mode.

LVDS lower data channel 0 (+). This channel is used as the transmitting channel in single channel LVDS mode.

LVDS lower data channel 1 (-) This channel is used as the transmitting channel in single channel LVDS mode.

LVDS lower data channel 1 (+). This channel is used as the transmitting channel in single channel LVDS mode.

LVDS lower data channel 2 (-). This channel is used as the transmitting channel in single channel LVDS mode.

LVDS lower data channel 2 (+). This channel is used as the transmitting channel in single channel LVDS mode.

LVDS lower data channel 3 (-). This channel is used as the transmitting channel in single channel LVDS mode.

LVDS lower data channel 3 (+). This channel is used as the transmitting channel in single channel LVDS mode.

LVDS lower clock channel (-). This channel is used as the transmitting channel in single channel LVDS mode.

LVDS lower clock channel (+). This channel is used as the transmitting channel in single channel LVDS mode.

LVTM Interface

Table 3-9 (Continued)

Pin Name Type

LVDS_BLON I/O VDD33 VSS

LVDS_DIGON I/O VDD33 VSS

LVDS_EN_BL I/O VDD33 VSS

Power

Domain

Ground Domain

Integrated

Termination

50k

programmable:

PU/PD/none

50k

programmable:

PU/PD/none

50k

programmable:

PU/PD/none

Functional Description

Digital panel backlight brightness control. Active high. It controls backlight on/off or acts as PWM output to adjust brightness. If LVTMA_BL_MOD_CNTL.LVTMA_BL_MOD_EN = 0, the pin controls backlight on/off. Otherwise, it is the PWM output to adjust the brightness. LVTMA_BL_MOD_CNTL.LVTMA_BL_MOD_LEVEL can be used to control the backlight level (256 steps) by means of pulse width modulation. The duty cycle of the backlight signal can be set through the LVTMA_BL_MOD_CNTL.LVTMA_BL_MOD_LEVEL bits. For example, setting these bits to a value of 32 will set the on-time to 32/256*(1/REF) and the off-time to (256-32)/256*(1/REF), where REF is the XTALIN frequency and is typically 14.318MHz or 100MHz. Note that the PWM frequency is set by LVTMA_BL_MOD_CNTL.LVTMA_BL_MOD_RES and LVTMA_PWRSEQ_REF_DIV.LVTMA_BL_MOD_REF_DIV. The PWM frequency = REF/((BL_MOD_REF_DIV+1)*(BL_MOD_RES+1)). For more information, refer to the RS780 Register Reference Guide, order# 43451. In CPIS mode, LVDS_BLON is VARY_BL as defined in CPIS. PWM mode should be enabled. LVDS_EN_BL should be connected to ENA_BL, which turns the backlight AC inverter on/off.

Control Panel Digital Power On/Off. Active high.

Enables Backlight for CPIS compliant LCD panels. Active high. Controlled by the hardware power up/down sequencer. For more details, refer to

Figure 4-2, “LCD Panel Power Up/Down

Timing,” on page 4- 5.

3.8.2 LVTM Interface in TMDS Mode

Table 3-10 LVTM Interface in TMDS Mode

Pin Name

TXOUT_L0N TX0M O VDDLT18 VSSLT None TMDS data channel 0 (-)

TXOUT_L0P TX0P O VDDLT18 VSSLT None TMDS data channel 0 (+)

TXOUT_L1N TX1M O VDDLT18 VSSLT None TMDS data channel 1 (-)

TXOUT_L1P TX1P O VDDLT18 VSSLT None TMDS data channel 1 (+)

TXOUT_L2N TX2M O VDDLT18 VSSLT None TMDS data channel 2 (-)

TXOUT_L2P TX2P O VDDLT18 VSSLT None TMDS data channel 2 (+)

TXOUT_L3N TX3M O VDDLT18 VSSLT None

TXOUT_L3P TX3P O VDDLT18 VSSLT None

TXOUT_U0N TX4M O VDDLT18 VSSLT None

TXOUT_U0P TX4P O VDDLT18 VSSLT None

TMDS

Functional

Name

Type

Power

Domain

Ground

Domain

Integrated

Termination

Functional Description

TMDS data channel 3 (-). The channel is only used in DVI dual-link mode and is not used for HDMI™ support.

TMDS data channel 3 (+). The channel is only used in DVI dual-link mode and is not used for HDMI support.

TMDS data channel 4 (-). The channel is only used in DVI dual-link mode and is not used for HDMI support.

TMDS data channel 4 (+) The channel is only used in DVI dual-link mode and is not used for HDMI support.

TMDS Interface Multiplexed on the PCI Express® Graphics Lanes

Table 3-10 LVTM Interface in TMDS Mode (Continued)

Pin Name

Functional

Type

Name

TXOUT_U1N TX5M O VDDLT18 VSSLT None

TXOUT_U1P TX5P O VDDLT18 VSSLT None

TXOUT_U2N – O VDDLT18 VSSLT None Unused. NC.

TXOUT_U2P – O VDDLT18 VSSLT None Unused. NC.

TXOUT_U3N – O VDDLT18 VSSLT None Unused. NC.

TXOUT_U3P – O VDDLT18 VSSLT None Unused. NC.

TXCLK_LN TXCM O VDDLT18 VSSLT None TMDS clock channel (-)

TXCLK_LP TXCP O VDDLT18 VSSLT None TMDS clock channel (+)

TXCLK_UN – O VDDLT18 VSSLT None Unused. NC.

TXCLK_UP – O VDDLT18 VSSLT None Unused. NC.

TMDS

Power

Domain

Ground Domain

Integrated

Termination

Functional Description

TMDS data channel 5 (-). The channel is only used in DVI dual-link mode and is not used for HDMI support.

TMDS data channel 5 (+). The channel is only used in DVI dual-link mode and is not used for HDMI support.

3.9 TMDS Interface Multiplexed on the PCI Express® Graphics Lanes

The RS780E supports a dual-link TMDS interface, enabling DVI/HDMI™, which is multiplexed on the PCI-E external graphics lanes.

HDMI is enabled only through the single-link mode.

Graphics Interface,”

shows the multiplexing relationships between the PCI-E external graphics signals and the TMDS

signals.

Table 3-11 TMDS Interface Multiplexed on the PCI Express® Graphics Interface

Table 3-11, “TMDS Interface Multiplexed on the PCI Express®

Pin Name

GFX_TX0P A5 TX2P - 1st Link Red+

GFX_TX0N B5 TX2M - 1st Link Red-

GFX_TX1P A4 TX1P - 1st Link Green+

GFX_TX1N B4 TX1M - 1st Link Green-

GFX_TX2P C3 TX0P - 1st Link Blue+

GFX_TX2N B2 TX0M- 1st Link Blue -

GFX_TX3P D1 TXCP - Clock+

GFX_TX3N D2 TXCM - Clock-

GFX_TX4P E2 TX5P- 2nd Link Red+

GFX_TX4N E1 TX5M - 2nd Link Red-

GFX_TX5P F4 TX4P- 2nd Link Green+

GFX_TX5N F3 TX4M - 2nd Link Green-

GFX_TX6P F1 TX3P - 2nd Link Blue+

GFX_TX6N F2 TX3M - 2nd Link Blue-

Ball

Reference

3.10 DisplayPort™ Interface

The RS780E supports a maximum two DisplayPort™ channels through signals multiplexed on the PCI-E graphics interface. Different implementations are possible, depending on the system configuration. possibility, which uses the lower eight lanes of the interface for two DisplayPort outputs. For more explanations, please refer to

RS780 DisplayPort Implementation Details (AN_RS780A5).

TMDS Function

Table 3-11 shows only one

Power Management Pins

Table 3-12 DisplayPort™ Interface Multiplexed on the PCI Express® Graphics Interface

Pin Name

GFX_TX0P, GFX_TX0N

GFX_TX1P, GFX_TX1N

GFX_TX2P, GFX_TX2N

GFX_TX3P, GFX_TX3N

DDC_CLK0/AUX0P, DDC_DATA0/AUX0N

GFX_TX4P, GFX_TX4N

GFX_TX5P, GFX_TX5N

GFX_TX6P, GFX_TX6N

GFX_TX7P, GFX_TX7N

DDC_CLK1/AUX1P, DDC_DATA1/AUX1N

AUX_CAL C8 Calibration for auxiliary pads.

Ball

Reference

A5/B5 Main Link Channel Pair 0 on the first DisplayPort™ connector

A4/B4 Main Link Channel Pair 1 on the first DisplayPort connector

C3/B2 Main Link Channel Pair 2 on the first DisplayPort connector

D1/D2 Main Link Channel Pair 3 on the first DisplayPort connector

A8/B8 Auxiliary Channel Pair 0 on the first DisplayPort connector

E2/E1 Main Link Channel Pair 0 on the second DisplayPort connector

F4/F3 Main Link Channel Pair 1 on the second DisplayPort connector

F1/F2 Main Link Channel Pair 2 on the second DisplayPort connector

H4/H3 Main Link Channel Pair 3 on the second DisplayPort connector

B7/A7 Auxiliary Channel Pair 1 on the second DisplayPort connector

DisplayPort™ Function

3.11 Power Management Pins

Table 3-13 Power Management Pins

Pin Name Type

ALLOW_LDTSTOP I/OD VDD33 VSS Allow LDTSTOP. The signal is used for controlling LDTSTOP assertions. When

SYSRESET# I VDD33 VSS Global Hardware Reset. This signal comes from the Southbridge.

SUS_STAT# I VDD33 VSS

POWERGOOD I VDD18 VSS Input from the motherboard signifying that the power to the RS780E is up and

Power

Domain

Ground Domain

Functional Description

running in CLMC mode it is an input from the CPU (LDTREQ#) or SB; when running in legacy C3 and GSM modes, it is an output to the SB 1 = LDTSTOP# can be asserted 0 = LDTSTOP# has to be de-asserted

Note: 1.8V signalling can be used on the signal.

Suspend Status. SUS_STAT# from the Southbridge is connected to the pin to gate the sideport memory I/Os while power is ramping up and the POWERGOOD signal to the RS780E is still low.

ready. Signal High means all power planes are valid. It is not observed internally until it has been high for more than six consecutive REFCLK cycles. The rising edge of this signal is deglitched.

3.12 Miscellaneous Pins

Table 3-14 Miscellaneous Pins

Miscellaneous Pins

Pin Name Type

AUX_CAL I VDD33 VSS

DDC_CLK0/AUX0P I/O VDD33 VSS

DDC_DATA0/AUX0N I/O VDD33 VSS

DDC_CLK1/AUX1P I/O VDD33 VSS

DDC_DATA1/AUX1N I/O VDD33 VSS

HPD I VDD33 VSS

I2C_CLK I/O VDD33 VSS

I2C_DATA I/O VDD33 VSS

NC – – – – No connect. These pins should be left unconnected to anything.

STRP_DATA I/O VDD33 VSS

TESTMODE I VDD33 VSS –

THERMALDIODE_P, THERMALDIODE_N

TMDS_HPD I/O VDD33 VSS

VDDLT33 Other – – –

A-O – – –

Power

Domain

Ground Domain

Integrated

Termination

50k

programmable:

PU/PD/non

50k

programmable:

PU/PD/none

50k

programmable:

PU/PD/none

50k

programmable:

PU/PD/none

50k

programmable:

PU/PD/none

50k

programmable:

PU/PD/none

50k

programmable:

PU/PD/none

50k

programmable:

PU/PD/none

50k

programmable:

PU/PD/none

50k

programmable:

PU/PD/none

Functional Description

Calibration for auxiliary pads.

DDC Clock 0 for displays, or AUX0P of the auxiliary pair for the DisplayPort™ connected onto lane 0 to 3 of the PCI-E external graphics interface. Can also be used as a GPIO.

DDC Data Channel 0 for displays, or AUX0N of the auxiliary pair for the DisplayPort connected onto lane 0 to 3 on the PCI-E external graphics interface. Can also be used as a GPIO.

DDC Clock 1 for displays, or AUX1P of the auxiliary pair for the DisplayPort connected onto lane 4 to 7 of the PCI-E external graphics interface. Can also be used as a GPIO.

DDC Data Channel 1 for displays, or AUX1N of the auxiliary pair for the DisplayPort connected onto lane 4 to 7 on the PCI-E external graphics interface. Can also be used as a GPIO.

Hot plug detect for DisplayPort. Can also be used as GPIO.

C™ interface clock signal.It can also be used as GPIO. The signal

is 5V-tolerant.

C interface data signal. It can also be used as GPIO. The signal

is 5V-tolerant.

C interface data signal for external EEPROM based strap loading. Can also be used as GPIO, or as output to the voltage regulator for pulse-width modulation of RS780E’s core voltage.

When High, puts the RS780E in test mode and disables the RS780E from operating normally.

Diode connections to external SMBus microcontroller for monitoring IC thermal characteristics.

TMDS Hot Plug Detect. It monitors the hot-plug line for panel detection. It is a 3.3V CMOS compatible input. When not used for hot plug detection, it can also be used as output to the voltage regulator for pulse-width modulation of various voltages on the motherboard.

These balls are only for maintaining pin-compatibility with the RS740-series IGPs AMD chipsets. They can either be connected to a 3.3V rail or left unconnected on RS780E systems.

3.13 Power Pins

Table 3-15 Power Pins

Pin Name Voltage

AVDD 3.3V 2 E12, F12 Dedicated power for the DAC. Effort should be made at the board

AVDDDI 1.8V 1 F14 Dedicated digital power for the DAC

Count

Ball Reference Pin Description

level to provide as clean a power as possible to this pin to avoid noise injection, which can affect display quality. Adequate decoupling should be provided between this pin and AVSS.

Ground Pins

Table 3-15 Power Pins (Continued)

Pin Name Voltage

AVDDQ 1.8V 1 H15 DAC Bandgap Reference Voltage

IOPLLVDD 1.1V 1 AE24 1.1V power for memory I/O PLLs

IOPLLVDD18 1.8V 1 AE23 1.8V power for memory I/O PLLs

PLLVDD 1.V 1 A12 1.1V Power for system PLLs

PLLVDD18 1.8V 1 D14 1.8V power for system PLLs

VDD_MEM 1.5/1.8V 6 AA11, AB10, AC10, AD10,

VDD18_MEM 1.8V 2 AD11, AE11 1.8V power for side-port memory interface

VDDA18HTPLL 1.8V 1 H17 I/O power for HyperTransport PLL

VDDA18PCIE 1.8V 15 AA9, AB9, AD9, AE9, H9,

VDDA18PCIEPLL 1.8V 2 D7, E7 1.8V I/O power for PCI-E PLLs

VDDC 1.0-1.1V 22 J11, J14, J16, K12, K15,

VDD18 1.8V 2 F9, G9 1.8V I/O transform power

VDD33 3.3V 2 H11, H12 3.3V I/O power

VDDHT 1.1V 7 J17, K16, L16, M16, P16,

VDDHTRX 1.1V 7 A23, B23, D22, E21, F20,

VDDHTTX 1.2V 13 AA21, AB22, AC23, AD24,

VDDLT18 1.8V 2 A15, B15 1.8V I/O power for the interface

VDDLTP18 1.8V 1 A13 Power for PLL macro.

VDDPCIE 1.1V 17 A6, B6, C6, D6, E6, F6, G7,

Total Power Pin Count 107

Count

Ball Reference Pin Description

Isolated power for side-port memory interface.

AE10, Y11

1.8V I/O power for PCI-E graphics, SB, and GPP interfaces J10, K10, L10, M10, P10, R10, T10, U10, W9, Y9

Core power L11, L14, M12, M13, M15, N12, N14, P11, P13, P14, R12, R15, T11, T14, T15, U12, U16

R16, T16

G19, H18

AE25, M17, P17, R17, T17, U17, V18, W19, Y20

H8, J9, K9, L9, M9, P9, R9, T9, U9, V9

Note: Variable core voltage is not supported on platforms that

support either (a) PCI-E Gen2, or (b) DDR3-1200 side-port frame

buffer memory, as these features require a fixed core voltage of

1.1V.

Digital I/O power for HyperTransport™ interface

I/O power for HyperTransport receive interface

I/O power for HyperTransport transmit interface

Main I/O power for PCI-E graphics, SB, and GPP interfaces

3.14 Ground Pins

Table 3-16 Ground Pins

Pin Name Pin Count Ball Reference Comments

AVSSDI 1 G15 Dedicated digital ground for the DAC (1.8V)

AVSSQ 1 H14 Dedicated ground for the Band Gap Reference. Effort should be

IOPLLVSS 1 AD23 Ground for system PLLs

PLLVSS 1 B12 Ground pin for graphics core PLL

RED#, GREEN#, BLUE#

3 G17, F18, F19 Grounds for the DAC. These pins must be connected directly to

made at the board level to provide as clean a ground as possible to this pin to avoid noise injection, which can affect display quality. Adequate decoupling should be provided between this pin and AVDD.

ground.

Table 3-16 Ground Pins (Continued)

Pin Name Pin Count Ball Reference Comments

VSS 34 AA14, AB11, AB15, AB17,

AB19, AB21, AC12, AE14, AE20, D11, E14, E15, G8, J12, J15, K11, K14, L12, L15, M11, M14, N13, P12, P15, R11, R14, T12, U11, U14, U15, V12, W11, W15, Y18

VSSAHT 27 A25, AD25, D23, E22, G22,

G24, G25, H19, H20, J22, L17, L22, L24, L25, M20, N22, P20, R19, R22, R24, R25, U22, V19, W22, W24, W25, Y21

VSSAPCIE 40 A2, AA4, AB1, AB2, AB5, AB7,

AC3, AC4, AE1, AE4, B1, D3, D5, E4, G1, G2, G4, H7, J4, L1, L2, L4, L7, M6, N4, P6, R1, R2, R4, R7, U4, V6, V7, V8, W1, W2, W4, W7, W8, Y6

VSSLT 7 C14, C16, C18, C20, C22,

D15, E20

VSSLTP18 1 B13 Ground for LVDS interface PLL macro

Total Ground Pin Count 116

Common Ground

Ground pin for HyperTransport interface PLL

Ground for PCI Express

Ground for LVDS interface

Interface

Strapping Options

3.15 Strapping Options

The RS780E provides strapping options to define specific operating parameters. The strap values are latched into internal registers after the assertion of the POWERGOOD signal to the RS780E. shows the definitions of all the strap functions. These straps are set by one of the following four methods:

• Attaching pull-up resistors to specific strap pins listed in Table 3-17 to set their values to “1”.

• Attaching pull-down resistors to specific strap pins listed in Table 3-17 to set their values to “0”.

• Downloading the strap values from an I

representative for details).

• Setting through an external debug port, if implemented (contact your AMD CSS representative for details).

All of the straps listed in through resistors. To select “0”, the strap pins must be pulled down to VSS through resistors. During reset, the strap pins are undriven, allowing the external pull-up or pull-down to pull a pin to “0” or “1.” The values on the strap pins are then latched into the device and used as operational parameters. However, for debug purposes, those latched values may be overridden through an external debug strap port or by a bit-stream downloaded from a serial EEPROM.

Table 3-17, “Strap Definitions for the RS780E,”

C™ serial EEPROM (for debug purpose only; contact your AMD CSS

Table 3-17 are defined active low. To select “1”, the strap pins must be pulled up to VDD33

Strapping Options

Table 3-17 Strap Definitions for the RS780E

Strap Function Strap Pin Description

STRAP_DEBUG_BUS_GPIO _ENABLE#

SIDE_PORT_EN# DAC_HSYNC Indicates if memory side-port is available or not.

LOAD_EEPROM_STRAPS# SUS_STAT# Selects loading of strap values from EEPROM.

Note: On the RS780E, the widths of the A-Link Express II interface and the general purpose PCI-E links are configured through the programmable strap GPPSB_LINK_CONFIG, which is programmed through RS780E’s registers. See the RS780 ASIC Family Register

Reference Guide, order# 43451, and the RS780 ASIC Family Register Programming Requirements, order# 43291, for details.SR5580 Register Reference Guide [forthcoming] and the SR5580 Register Programming Requirements [forthcoming] for details.

DAC_VSYNC Enables debug bus access through memory I/O pads and GPIOs.

0: Enable 1: Disable (See debug bus specification documents for more details.)

0: Available 1: Not available.

0: I

C™ master can load strap values from EEPROM if connected, or use default values if EEPROM is not connected. Please refer to RS780E's reference schematics for system level implementation details.

1: Use default values

This page intentionally left blank.

Strapping Options

4.1 HyperTransportTM Bus Timing

For HyperTransport bus timing information, please refer to CPU specifications.

4.2 HyperTransportTM Reference Clock Timing Parameters

Table 4-1 Timing Requirements for HyperTransport Reference Clock (100MHz) Output by the Clock Generator

Symbol Parameter Minimum Maximum Unit Note

V

CROSS

F Frequency 99.9 100 MHz 2

ppm Long Term Accuracy -300 +300 Ppm 3

FALL

RISE

jc max

j-accumulated

D(PK-PK)

V

DC Duty Cycle 45 55 % 11

Notes:

More details are available in AMD HyperTransport 3.0 Reference Clock Specification and AMD Family 10h Processor Reference Clock Parameters, order # 34864.

1 Single-ended measurement at crossing point. Value is maximum-minimum over all time. DC value of common mode is not important due to blocking cap. 2 Minimum frequency is a consequence of 0.5% down spread spectrum. 3 Measured with spread spectrum turned off. 4 Only simulated at the receive die pad. This parameter is intended to give guidance for simulation. It cannot be tested on a tester but is guaranteed by design. 5 Differential measurement through the range of ±100mV, differential signal must remain monotonic and within slew rate specification when crossing through this region. 6 T 7 Accumulated T 8 V 9 V V 10 The difference in magnitude of two adjacent V signal. 11 Defined as t

is the maximum difference of t

jc max

D(PK-PK)

is the amplitude of the ring-back differential measurement, guaranteed by design that the ring-back will not cross 0V VD.

D(min)

is the largest amplitude allowed.

D(max)

Change in Crossing point voltage over all edges - 140 mV 1

Output falling edge slew rate -10 -0.5 V/ns 4, 5

Output rising edge slew rate 0.5 10 V/ns 4, 5

Jitter, cycle to cycle - 150 ps 6

Accumulated jitter over a 10 s period -1 1 ns 7

Peak to Peak Differential Voltage 400 2400 mV 8

Differential Voltage 200 1200 mV 9

Change in V

over a 10s time period, measured with JIT2 TIE at 50ps interval.

is the overall magnitude of the differential signal.

HIGH/tCYCLE

cycle to cycle -75 75 mV 10

DDC

between any two adjacent cycles.

CYCLE

measurements. V

DDC

Chapter 4

Timing Specifications

is the stable post overshoot and ring-back part of the

PCI Express® Differential Clock AC Specifications

4.3 PCI Express® Differential Clock AC Specifications

Table 4-2 PCI-E Differential Clock (GFX_REFCLK, GPPSB_REFCLK, 100MHz) AC Characteristics

Symbol Description Minimum Maximum Unit

Rising Edge Rate Rising Edge Rate 0.6 4.0 V/ns

Falling Edge Rate Falling Edge Rate 0.6 4.0 V/ns

PERIOD AVG

PERIOD ABS

CCJITTER

Duty Cycle Duty Cycle 40 60 %

Rise-Fall Matching Rising edge rate (REFCLK+) to falling edge rate

Average Clock Period Aquaria -300 +2800 ppm

Absolute Period (including jitter and spread spectrum modulation)

Cycle to Cycle Jitter - 150 Ps

(REFCLK-) matching

9.847 10.203 ns

-20%

4.4 Timing Requirements for REFCLK_P Used as OSCIN (14.3181818MHz)

Table 4-3 Timing Requirements for REF_CLKP Used as OSCIN (14.3181818MHz)

Symbol Parameter Min Max Unit Note

TIP REFCLK Period 69.82033 69.86224 ns

TIH REFCLK High Time 2.0 – ns

TIL REFCLK Low Time 2.0 – ns

TIR REFCLK Rise Time – 1.5 ns 1

TIF REFCLK Fall Time – 1.5 ns 1

TIRR REFCLK Rising Edge Rate 0.09 4.0 V/ns

TIFR REFCLK Falling Edge Rate 0.09 4.0 V/ns

TIDC Duty Cycle 45 55 % 2

TIJCC REFCLK Cycle-to-Cycle Jitter Requirement – 300 ps 3

TIJPP REFCLK Peak-to-Peak Jitter Requirement – 200 ps 2, 3

TIJLT

Notes:

1. Measured from -150mV to + 150mV from VREF, which is 0.55V.

2. Measured at VREF, which is 0.55V.

3. Measured with spread spectrum disabled.

REFCLK Long Term Jitter Requirement (1s after scope trigger)

– 500 ps

4.5 Side-port Memory Timing for DDR2 Mode

The RS780E’s side-port memory DDR2 interface complies with all the timing requirements given in the JESD79-2B specification. Please refer to the JEDEC standard for any timing details.

4.5.1 Read Cycle DQ/DQS Delay

During a memory read cycle, there is a DLL inside the RS780E that can delay each DQS signal with respect to its byte of the DQ valid window. This delay ensures adequate setup and hold time to capture the memory data. This DLL delay is programmable through the following registers:

MCA_DLL_SLAVE_RD_0. MCA_DLL_ADJ_DQSR_0 <NBMCIND : 0xE0[7:0]>

MCA_DLL_SLAVE_RD_1. MCA_DLL_ADJ_DQSR_1 <NBMCIND : 0xE1[7:0]>

The fraction of strobe delay, in terms of a memory clock period is (24+MCA_DLL_ADJ_DQSR) / 240. For example: if MCA_DLL_ADJ_DQSR_1 = 36, then DQS1 is delayed by 0.25 x memory_clock_period. So, if the memory clock period is 5ns, then DQS1 is delayed internally by 1.25ns with respect to DQ[15:8].

LVDS Timing

4.5.2 Write Cycle DQ/DQS Delay

Similar to a read cycle, during memory write cycle there is a DLL inside the RS780E that can delay each DQS signal with respect to its byte of the DQ valid window. This delay ensures adequate setup and hold time for DQ and DQS to the memory. This DLL delay is programmable by the following registers in the same manner as with the read cycle:

MCA_DLL_SLAVE_WR_0.MCA_DLL_ADJ_DQ_B0 <NBMCIND : 0xE8[7:0]>

MCA_DLL_SLAVE_WR_1.MCA_DLL_ADJ_DQ_B1 <NBMCIND : 0xE9[7:0]>

Again, the fraction of strobe delay, in terms of a memory clock period is (24+MCA_DLL_ADJ_DQSR) / 240. For example: if MCA_DLL_ADJ_DQ_B0 = 96, then DQS0 is delayed by 0.5 x memory_clock_period. So, if the memory clock period is 5ns, then DQS0 is delayed internally by 2.5ns with respect to DQ[7:0].

Depending on the board layout of DQS and DQ signals, it may be necessary to have different delays for each DQS signal. Layouts of the DQS and DQ signals should follow the rules given in the AMD

Design Guide,

order# 42336.

4.6 LVDS Timing

Table 4-4 Timing Requirements for the LVTM Interface in LVDS Mode

Parameter Min Ty p Max Unit Notes

Differential Clock Period 11.7 – 40 ns 1

Differential Clock Frequency 25 – 85 MHz

Frequency of the LVDS PLL VOC 175 – 595 MHz

Differential Clock Cycle-to-Cycle Jitter – – 420 ps 1

Transmitter PLL Reset Time

Transmitter PLL Lock Time

Differential Low-to-High Transition Time

Differential High-to-Low Transition Time

Data Channel to Channel Skew – 100 – ps

Notes: 1 Time intervals measured at 50% LTPVDD18 threshold point.

2 Minimum time to keep LVDS_PLL_RESET asserted.

3 Measured after LVDS_PLL_RESET is de-asserted.

is the bit-time, which is 1/7 of the differential clock period

4 T

RS740/RS780-Series IGP Motherboard

10 – –

––750

0.26 –

0.3T

s

ns 4

1,2

1,3

4.7 Power Rail Power-up Sequence

T11

T12

T13

3.3V Rails

(AVDD, VDD33)

1.8V Display, PLL, and IO Transform Rails

(PLLVDD18, IOPLLVDD18, VDDLT18,

VDDLTP18, VDDA18HTPLL, VDDA18PCIEPLL,

AVDDDI, AVDDQ, VDD18)

1.1V PLL Rails

(PLLVDD, IOPLLVDD)

1.1V VDDC

Note: There are no specific requirements for the following 1.1V or 1.2V rails: VDDHT, VDDHTRX, VDDHTTX, VDDPCIE

Power Rail Power-up Sequence

Table 4-5 RS780E Power Rail Power-up Sequence

Symbol Parameter

T11

T12

T13 1.1V PLL rails ramp high relative to VDDC (1.1V) 0 No restrictions

Figure 4-1 RS780E Power Rail Power-up Sequence

3.3V rails ramp high relative to 1.8V Display, PLL, and I/O Transform rails

1.8V Display, PLL, and I/O Transform rails ramp high relative to 1.1V PLL rails

Voltage Difference During Ramping

Minimum (V) Maximum (V)

02.1

0 No restrictions

LCD Panel Power Up/Down Timing

LVDS_DIGON

LVDS DATA/CLOCK

LVDS_BLON

T1 T2 T3 T4

LVDS_EN_BL

(CPIS)

PWM

4.8 LCD Panel Power Up/Down Timing

Table 4-6 LCD Power Up/Down Timing

*Note: Values for M, N1 and N2 are programmable through the following registers:

Figure 4-2. LCD Panel Power Up/Down Timing

Parameter Description Time (s)*

T1 Delay from LVDS_DIGON active to LVDS data/clock M*N1

T2 Delay from LVDS data/clock to LVDS_BLON active M*N2

T3 Delay from LVDS_BLON inactive to LVDS inactive M*N2

T4 Delay from LVDS inactive to LVDS_DIGON inactive M*N1

M = LVTMA_PWRSEQ_REF_DIV.LVTMA_PWRSEQ_REF_DIV (1- 255) N1 = LVTMA_PWRSEQ_DELAY1.LVTMA_PWRUP_DELAY1 (0 - 15) N2 = LVTMA_PWRSEQ_DELAY1.LVTMA_PWRUP_DELAY2 (0 - 15)

This page is left blank intentionally.

LCD Panel Power Up/Down Timing

Electrical Characteristics and Physical Data

5.1 Electrical Characteristics

5.1.1 Maximum and Minimum Ratings

Table 5-1 Maximum and Minimum Ratings

Pin Minimum Typical Maximum Unit Comments

AVDD 3.135 3.3 3.465 V Dedicated power for the DAC

AVDDDI 1.71 1.8 1.89 V Dedicated digital power for the DAC

AVDDQ 1.71 1.8 1.89 V DAC Bandgap Reference Voltage

IOPLLVDD 1.045 1.1 1.155 V 1.1V power for memory I/O PLLs

IOPLLVDD18 1.71 1.8 1.89 V 1.8V power for memory I/O PLLs

PLLVDD 1.045 1.1 1.155 V 1.1V power for system PLLs

PLLVDD18 1.71 1.8 1.89 V 1.8V power for system PLLs

VDD_MEM 1.425/1.71 1.5/1.8V 1.575/1.89 V Isolated power for side-port memory

VDD18_MEM 1.71 1.8 1.89 V 1.8V power for side-port memory

VDDA18HTPLL 1.71 1.8 1.89 V I/O power for HyperTransport PLL

VDDA18PCIE 1.71 1.8 1.89 V 1.8V I/O power for PCI-E graphics,

VDDA18PCIEPLL 1.71 1.8 1.89 V 1.8V I/O power for PCI-E PLLs

VDDC 0.95 1.0-1.1 1.155 V Core power

VDD18 1.71 1.8 1.89 V 1.8V I/O transform power

VDD33 3.135 3.3 3.465 V 3.3V I/O power

VDDHT 1.045 1.1 1.155 V I/O power for HyperTransport interface

VDDHTRX

VDDHTTX

VDDLT18 1.71 1.8 1.89 V 1.8V I/O power for the LVTM interface

VDDLTP18 1.71 1.8 1.89 V Power for LVTM PLL macro

VDDPCIE 1.045 1.1 1.155 V Main I/O power for PCI-E graphics,

Note: Numbers in this table are to be qualified.

1.045

1.14 1.2 1.26 V

1.1

1.155 V

Chapter 5

interface

SB, and GPP interfaces

Note: Variable core voltage is not supported on platforms that support either (a) PCI-E Gen2, or (b) DDR3-1200 side-port frame buffer memory, as these features require a fixed core voltage of 1.1V.

I/O power for HyperTransport receive interface

I/O power for HyperTransport transmit interface

SB, and GPP interfaces

Electrical Characteristics

5.1.2 DC Characteristics

Table 5-2 DC Characteristics for 3.3V TTL Signals

Pins Symbol Description Minimum Maximum Unit

All pins belonging to the VDD33 domain (refer to pin description tables in this chapter).

Note: * Measured with edge rate of 1s at PAD pin.

** For detailed current/voltage characteristics, please refer to the IBIS model.

Table 5-3 DC Characteristics for DDC Signals (DDC Mode)

Pins Symbol Description Minimum Maximum Unit Note

DDC_DATA0/AUX0N DDC_CLK0/AUX0P DDC_DATA1/AUX1N DDC_CLK1/AUX1P

Notes:

1. Measured with edge rate of 1s at PAD pin.

2. For detailed current/voltage characteristics, please refer to the IBIS model.

3. Measurement taken with PMOS/NMOS strength set to default values, PVT=Nominal Case.

4. Interface circuit is open drain. Pulled high by external power.

VILdc

VIHdc

VILac AC input low voltage – 0.15 V

VIHac AC input high voltage 2.5 – V

VOLdc Output low voltage** – 0.53 V

VOHdc Output high voltage** 2.46 – V

IOLdc Output low current at V=0.1V** 2.8 – mA

IOHdc Output high current at V=VDD33-0.1V** 2.6 – mA

VILdc

VIHdc

VILac AC input low voltage – TBD V

VIHac AC input high voltage 2.3 – V

VOL Output low voltage –

VOH Output high voltage

IOL Output low current at V=0.1V 0.55 6.25 mA 2, 3, 4

DC voltage at PAD pin that will produce a stable low at the Y pin of macro*

DC voltage at PAD pin that will produce a stable high at the Y pin of macro*

DC voltage at PAD pin that will produce a stable low at the Y pin of macro

DC voltage at PAD pin that will produce a stable high at the Y pin of macro

–0.7V

1.4 – V

–TBDV1

1.8 – V 1

VDD5-0.25

(VDD5 is external

5V DDC pull-up

supply)

86mV @ I=3mA,

230mV@I=8mA

– V 2, 3, 4

V 2, 3, 4

Table 5-4 DC Characteristics for AUX Signals (AUX Mode)

Pins Symbol Description Minimum Maximum Unit

DDC_DATA0/AUX0N DDC_CLK0/AUX0P DDC_DATA1/AUX1N DDC_CLK1/AUX1P

Note: The AUX signals comply with VESA’s DisplayPort™ Standard. Please refer to the document for other electrical characteristics of the signals.

Vcm Input/output common mode voltage 569 610 mV

Vdiff Pad differential output swing 525 622 mV

Electrical Characteristics

Table 5-5 DC Characteristics for POWERGOOD

Symbol Description Minimum Typical Maximum

VIL Input Low Voltage 0 0V 300mV

VIH Input High Voltage 1.62V 1.8V 1.98V

Table 5-6 DC Characteristics for HyperTransport™ and PCI-E Differential Clock (HT_REFCLK, GFX_REFCLK, GPPSB_REFCLK, 100MHz)

Symbol Description Minimum Maximum Unit

CROSS

CROSS DELTA

IMAX

IMIN

Table 5-7 DC Characteristics for REFCLK_P Input for OSCIN (14.3181818MHz)

Differential Input Low Voltage - -150 mV

Differential Input High Voltage +150 - mV

Absolute Crossing Point Voltage +250 +550 mV

Variation of V clock edges

Ring-back Voltage Margin -100 +100 mV

Absolute Max Input Voltage - +1.15 V

Absolute Min Input Voltage - -0.15 V

CROSS

over all rising

- +140 mV

Symbol Description Minimum Maximum Unit Note

IMAX

IMIN

C-DC

Notes:

1. V

ILmax =

2. V

IHmin =

Single Input Low Voltage - 0.40 V 1

Single Input High Voltage 0.70 - V 2

Absolute Max Input Voltage - +1.15 V

Absolute Min Input Voltage - -0.15 V

Clock source DC impedance 40 60 

VREF - 0.15V, where VREF = 0.55V

VREF + 0.15V, where VREF = 0.55V

Table 5-8 DC Characteristics for the Memory Interface when Supporting DDR2

Symbol Description Minimum Maximum Comments

VIL(dc) DC Input Low Voltage -0.3V VREF-0.15V For DQ and DQS

VIH(dc) DC Input High Voltage VREF + 0.15V VDDQ + 0.3V

VIL(ac) AC Input Low Voltage – VREF - 0.31V For DQ and DQS

VIH(ac) AC Input High Voltage VREF + 0.31V – For DQ and DQS

VUSH

VOSH

Minimum Voltage Allowed for Undershoot

Maximum Voltage Allowed for Overshoot

- 0.3V – For DQ and DQS

– VDDQ + 0.3V

VOI Output Low Voltage 0.186V 0.305V I_out = 16.5mA

VOH Output High Voltage 1.7V 1.9V I_out = -16.5mA

VREF DC Input Reference Voltage 0.882V 0.918V

ILI Input Leakage Current 10A15A

ILO Tri-state Leakage Current 10A15A

IOL Output Low Current 19mA 28mA

IOH Output High Current -19mA -29.5mA

CIN Input Capacitance 3pF 5pF

For DQ and DQS. (VDDQ is I/O voltage of memory device.)

Electrical Characteristics

Table 5-9 DC Characteristics for the Memory Interface when Supporting DDR3

Symbol Description Minimum Maximum Comments

VIL(dc) DC Input Low Voltage -0.3V VREF - 0.1V For DQ and DQS

VIH(dc) DC Input High Voltage VREF + 0.1V VDDQ + 0.3V

VIL(ac) AC Input Low Voltage – VREF - 0.15V For DQ and DQS

VIH(ac) AC Input High Voltage VREF + 0.15V – For DQ and DQS

VUSH

VOSH

VOI Output Low Voltage 0.186V 0.305V I_out = 16.5mA

VOH Output High Voltage 1.4V 1.6V I_out = -16.5mA

VREF DC Input Reference Voltage 0.735V 0.765V

ILI Input Leakage Current 10A15A

ILO Tri-state Leakage Current 10A15A

IOL Output Low Current 16.5mA 24.3mA

IOH Output High Current -15.8mA -24.6mA

CIN Input Capacitance 3pF 5pF

Table 5-10 DC Characteristics for the LVTM Interface in TMDS Mode

Minimum Voltage Allowed for Undershoot

Maximum Voltage Allowed for Overshoot

- 0.3V – For DQ and DQS

– VDDQ + 0.3V

For DQ and DQS. (VDDQ is IO voltage of memory device.)

Symbol Parameter Min Typical Max Unit Note

VH Single-ended High Level Output Voltage AVCC - 10 – AVCC + 10 mV 1

VL Single-ended Low Level Output Voltage AVCC - 600 – AVCC - 400 mV 1

VSW Single-ended Output Swing 400 – 600 mV

VOS Differential Output Overshoot (Ringing) – – 15%*2VSW –

VUS Differential Output Undershoot (Ringing) – – 25%*2VSW –

IDDLP Average Supply Current at LPVDD – 20.0 – mA 2

IDDLV

IOL Output Low Current – 8 – mA

IOH Output High Current – 12 – mA

IPDLP Power Down Current at LPVDD – 10.0 – A3

IPDLV

Notes: 1 AVCC stands for the termination supply voltage of the receiver, which is 3.3V +/- 5%.

2 Measured under typical conditions, at minimum differential clock frequency and maximum DVI/HDMI™ PLL VOC frequency.

3 Measured under typical conditions, based on typical leakage values.

4 Figure 5-1 below illustrates some of the DC Characteristics of the DVI/HDMI interface.

Average Supply Current at LVDDR18 and LVDDR33

Power Down Current at LVDDR18 and LVDDR33

– 100.0 – mA 2

– 10.0 – A3

Electrical Characteristics

VSW

VHmax

VHmin

VLmax

VLmin

2VSW

VOS

VUS

Single-ended Waveforms

Differential Waveform

VOS

VUS

Table 5-11 DC Characteristics for the TMDS Interface Multiplexed on the PCI-E Gfx Lanes

Symbol Parameter Min Typical Max Unit Note

VH Single-ended High Level Output Voltage AVCC - 10 – AVCC + 10 mV 1

VL Single-ended Low Level Output Voltage AVCC - 600 – AVCC - 400 mV 1

VSW Single-ended Output Swing 400 – 600 mV

VOS Differential Output Overshoot (Ringing) – – 15%*2VSW –

VUS Differential Output Undershoot (Ringing) – – 25%*2VSW –

Notes: 1 AVCC stands for the termination supply voltage of the receiver, which is 3.3V +/- 5%.

2 Figure 5-1 below illustrates some of the DC Characteristics of the TMDS interface.

Figure 5-1 DC Characteristics of the TMDS Interfaces

Electrical Characteristics

+257 to

+454mV

-257 to

-454mV

Differential Waveform

VCM = 1.125-

Single-ended Waveforms

Ground

Table 5-12 Electrical Requirements for the LVTM Interface in LVDS Mode

Symbol Parameter Min Typical Max Unit Note

VCM Differential Output Common-mode Voltage 1.125 – 1.375 V 1

DVCM

VH Single-ended High Level Output Voltage VCM + 0.125 – VCM + 0.225 V 1

VL Single-ended Low Level Output Voltage VCM - 0.225 – VCM - 0.125 V 1

VSW Single-ended Output Swing 257 – 454 mV 1

VOS Differential Output Overshoot (Ringing) – – 160 mV 1

VUS Differential Output Undershoot (Ringing) – – 160 mV 1

IDDLP Average Supply Current at LTPVDD18 – 10.0 – mA 2

IDDLV Average Supply Current at VDDLT18/33 – 100.0 – mA 2

IOL Output Low Current – 2.5 – mA

IOH Output High Current – 4.5 – mA

IPDLP Power Down Current at LTPVDD18 – 10.0 – A3

IPDLV Power Down Current at VDDLT18/33 – 10.0 – A3

Notes: 1 Differential termination is 100 ohms.

2 Measured under typical conditions, at minimum Differential Clock Frequency and maximum LVDS PLL VOC frequency.

3 Measured under typical conditions, based on typical leakage values.

4 Figure 5-2 below illustrates the DC Characteristics of the LVDS interface.

Differential Output Common-mode Voltage Ripple

– – 150 mV 1

VSW

Figure 5-2 DC Characteristics of the LVDS Interface

1.375V

RS780E Thermal Characteristics

Table 5-13 Electrical Specifications for the DisplayPort™ Interface

Symbol Parameter Min Typ Max Unit Notes

HIGH_RATE

LOW_RATE

TX-DIFFp_p

TX-PREMMP-RATIO

Unit Interval for DP High Bit Rate (2.7 Gbps/lane)

Unit Interval for DP Reduced Bit Rate (1.62 Gbps/lane)

Differential Peak-to-Peak Output Voltage Level 0.34 - 0.92 V -

Pre-emphasis Level 0 - 7.2 dB -

5.2 RS780E Thermal Characteristics

This section describes some key thermal parameters of the RS780E. For a detailed discussion on these parameters and other thermal design descriptions including package level thermal data and analysis, please consult the Thermal

Design and Analysis Guidelines

5.2.1 RS780E Thermal Limits

Table 5-14 RS780E Thermal Limits

Parameter Minimum Nominal Maximum Unit Note

Operating Case Temperature 0 — 95

Absolute Rated Junction Temperature

Storage Temperature -40 — 60

Ambient Temperature 0 — 45

Thermal Design Power — 13 — W 4

Notes:

1 - The maximum operating case temperature is the die geometric top-center temperature measured via a thermocouple based on the methodology given in the document Thermal Design and Analysis Guidelines for the RS780 Product Family, order# 44638 (Chapter 12). This is the temperature at which the functionality of the chip is qualified. 2 - The maximum absolute rated junction temperature is the junction temperature at which the device can operate without causing damage to the ASIC. This temperature can be measured via the integrated thermal diode described in the next section. 3 - The ambient temperature is defined as the temperature of the local intake air to the thermal management device. The maximum ambient temperature is dependent on the heat sink's local ambient conditions as well as the chassis' external ambient, and the value given here is based on AMD’s reference heat sink solution for the RS780E. Refer to Chapter 6 in the Thermal Design and Analysis Guidelines for the RS780 Product Family, order# 44638, for heatsink and thermal design guidelines. Refer to Chapter 7 of the above mentioned document for details of ambient conditions. 4 - Thermal Design Power (TDP) is defined as the highest power dissipated while running currently available worst case applications at nominal voltages. Since the core power of modern ASICs using 65nm and smaller process technology can vary significantly, parts specifically screened for higher core power were used for TDP measurement. The TDP is intended only as a design reference, and

the value given here is preliminary.

for the RS780 Product Family, order# 44638.

- 370 - ps High limit = +300 ppm

- 617 - ps High limit = +300 ppm

——115

Low limit = -5300 ppm

5.2.2 Thermal Diode Characteristics

V

 K T Nln

--------------------------------------------=

The RS780E has an on-die thermal diode, with its positive and negative terminals connected to the THERMALDIODE_P and THERMALDIODE_N pins respectively. Combined with a thermal sensor circuit, the diode temperature, and hence the ASIC temperature, can be derived from a differential voltage reading ( below:

where:



V = Difference of two base-to-emitter voltage readings, one using current = I and the other using current = N x I

= Ratio of the two thermal diode currents (=10 when using an ADI thermal sensor, e.g. ADM 1020, 1030)



= Ideality factor of the diode

K = Boltzman’s Constant

T = Temperature in Kelvin

q = Electron charge

RS780E Thermal Characteristics



V). The equation relating T to V is given

The series resistance of the thermal diode (RT) must be taken into account as it introduces an error in the reading

(for every 1.0, approximately 0.8

induced, plus any other known fixed error. Measured values of diode ideality factor and series resistance for the

diode circuit are defined in the Thermal Design and Analysis Guidelines

C is added to the reading). The sensor circuit should be calibrated to offset the

for the RS780 Product Family, order#

44638.

5-8 Proprietary

Package Information

Mod-00085-Rev-03

5.3 Package Information

5.3.1 Physical Dimensions

Figure 5-1 and Table 5-15 describe the physical dimensions of the RS780E package. Figure 5-2 shows the detailed

ball arrangement for the RS780E.

Table 5-15 RS780E 528-Pin FCBGA Package Physical Dimensions

Ref. Min(mm) Typical (mm) Max. (mm)

c 0.48 0.58 0.68

A 1.69 1.84 1.99

A1 0.30 0.40 0.50

A2 0.81 0.86 0.91

b 0.40 0.50 0.60

D1 20.85 21.00 21.15

D2 - 8.58 -

D3 2.00 - -

D4 1.00 - -

E1 20.85 21.00 21.15

E2 - 7.70 -

E3 2.00 - -

E4 1.00 - -

F1 - 19.20 -

F2 - 19.20 -

e1 - 0.80 (min. pitch) -

ddd - - 0.20

Note: Maximum height of SMT components is 0.650 mm.

Figure 5-1 RS780E 528-Pin FCBGA Package Outline

Package Information

Figure 5-2 RS780E Ball Arrangement (Bottom View)

5.3.2 Pressure Specification

To avoid damages to the ASIC (die or solder ball joint cracks) caused by improper mechanical assembly of the cooling device, follow the recommendations below:

• It is recommended that the maximum load that is evenly applied across the contact area between the thermal

management device and the die does not exceed 6 lbf. Note that a total load of 4-6 lbf is adequate to secure the thermal management device and achieve the lowest thermal contact resistance with a temperature drop across the thermal interface material of no more than 3°C. Also, the surface flatness of the metal spreader should be

0.001 inch/1 inch.

• Pre-test the assembly fixture with a strain gauge to make sure that the flexing of the final assembled board and

the pressure applying around the ASIC package will not exceed 600 micron strain under any circumstances.

• Ensure that any distortion (bow or twist) of the board after SMT and cooling device assembly is within industry

Package Information

1:1 ratio to pad, or 400µm max for the nine corner balls’ openings

1:1 ratio to pad, or 400µm max for the eight corner balls’ openings

1:1 ratio to pad, or 400µm max for the nine corner balls’ openings

1:1 ratio to pad,

with special

requirement for

corner balls

guidelines (IPC/EIA J-STD-001). For measurement method, refer to the industry approved technique described in the manual IPC-TM-650, section 2.4.22.

5.3.3 Board Solder Reflow Process Recommendations

5.3.3.1 Stencil Opening Size for Solder Paste Pads on PCB

It is recommended that the stencil aperture for solder paste be kept at the same size as the land pads'. However, for the nine (or eight) pads at each corner of the ASIC package, the size of the openings should not exceed 400µm (see

Figure 5-3 below). This recommendation is based on AMD’s sample land pattern design for the RS780E, which is

available from your AMD CSS representative.

5.3.3.2 Reflow Profile

A reference reflow profile is given below. Please note the following when using RoHS/lead-free solder (SAC105/305/405 Tin-Silver-Cu):

• The final reflow temperature profile will depend on the type of solder paste and chemistry of flux used in the SMT

process. Modifications to the reference reflow profile may be required in order to accommodate the requirements of the other components in the application.

• An oven with 10 heating zones or above is recommended.

Figure 5-3 Recommended Stencil Opening Sizes for Solder Paste Pads on PCB

• To ensure that the reflow profile meets the target specification on both sides of the board, a different profile and oven

recipe for the first and second reflow may be required.

Package Information

250

150

200

100

Peak 245°C max.

220°C

Heating Time

Solder/Part Surface Temperature ( C)

170°C

250

150

200

100

C max.

220 C

120 - 240 sec max

Heating Time

60 – 120 sec max

130 C

60 – 80 sec typical

45 – 90 sec max

60 – 80 sec typical

Pre–heating Zone

Soldering Zone

Ramp Rate < 2 C / sec

Soaking Zone

• Mechanical stiffening can be used to minimize board warpage during reflow.

• It is suggested to decrease temperature cooling rate to minimize board warpage.

• This reflow profile applies only to RoHS/lead-free (high temperature) soldering process and it should not be used for

Eutectic solder packages. Damage may result if this condition is violated.

• Maximum 3 reflows are allowed on the same part.

Table 5-16 Recommended Board Solder Reflow Profile - RoHS/Lead-Free Solder

Profiling Stage Temperature Process Range

Overall Preheat Room temp to 220C 2 mins to 4 mins

Soaking Time 130C to 170C Typical 60 – 80 seconds

Liquidus 220C Typical 60 – 80 seconds

Ramp Rate Ramp up and Cooling <2C / second

Peak Max. 245C 235C +/-5C

Temperature at peak

within 5C

240C to 245C 10 – 30 seconds

Figure 5-4 RoHS/Lead-Free Solder (SAC305/405 Tin-Silver-Copper) Reflow Profile

6.1 ACPI Power Management Implementation

This chapter describes the support for ACPI power management provided by the RS780E. The RS780E Northbridge supports ACPI required for meeting the power management specifications of PC2001, OnNow, and the Windows Logo Program and Device Requirements version 2.1. supported by the RS780E. management scheme of the RS780E.

Table 6-1 ACPI States Supported by the RS780E

Graphics States:

D0 Full on, display active.

D1 Display Off. RS780E power on. Configuration registers, state, and main memory contents retained.

D3 Hot Similar to D1, with additional power saving and the graphics PLLs shut off.

D3 Cold RS780E power off.

Processor States:

S0/C0: Working State Working State. The processor is executing instructions.

S0/C1: Halt CPU Halt state. No instructions are executed. This state has the lowest latency on resume and contributes

S0/C2: Stop Grant Caches Snoopable

S0/C3/C1e: Stop Grant Caches Snoopable

System States:

S3: Standby Suspend to RAM

S4: Hibernate Suspend to Disk

S5: Soft Off System is off. OS re-boots when the system transitions to the working state.

G3: Mechanical Off Occurs when system power (AC or battery) is not present or is unable to keep the system in one of the

Revision 2.0. The hardware, system BIOS, video BIOS, and drivers of the RS780E have all the logic

Table 6-1, “ACPI States Supported by the RS780E,” describes the ACPI states

Table 6-2, “ACPI Signal Definitions,” describes the signals used in the ACPI power

ACPI State Description

minimum power savings.

Stop Grant or Cache Snoopable CPU state. This state offers more power savings but has a higher latency on resume than the C1 state.

Processor is put into Stop Grant state. Caches are still snoopable. The HyperTransport link may be disconnected and put into a low power state. System memory may be put into self-refresh.

System is off but context is saved to RAM. OEM support of this state is optional. System memory is put into self-refresh.

System is off but context is saved to disk. When the system transitions to the working state, the OS is resumed without a system re-boot.

other states.

Chapter 6

Power Management and ACPI

Note: Also supported are additional processor power states that are not part of the ACPI specification, e.g. C1E (C1

Enhanced) and C3 pop-up. Please refer to the

Programming Requirements,

Table 6-2 ACPI Signal Definitions

Signal Name Description Source

ALLOW_LDTSTOP Output to the Southbridge to allow LDTSTOP# assertion. Northbridge

LDTSTOP# HyperTransport™ Technology Stop: Enables and disables links during

system state transitions.

POWERON# Power On Power switch

RESET# Global Reset Southbridge

SB710 Databook, order# 45215, and the RS780 ASIC Family Register

order# 43291, for more information.

Southbridge

6.2 Power Management for the Graphics Controller

The RS780E supports power management for the embedded graphics device as specified by the PCI Bus Power Management Interface Specification version 1.0, according to which the integrated graphics core of the RS780E qualifies as a device embedding a single function in the power management system.

6.2.1 PCI Function Power States

There are up to four power states defined for each PCI function associated with each PCI device in the system. These power states are D0, D1, D2 and D3. D0 (on) consumes the most power while D3 (off) consumes the least. D1 and D2 enable levels of power savings in between those of D0 and D3. The concepts of these power states are universal for all functions in the system. When transitioned to a given power management state, the intended functional behavior is dependent upon the type (or class) of the function.

6.2.2 PCI Power Management Interface

The four basic power management operations are:

• Capabilities Reporting

• Power Status Reporting

• Setting Power State

• System Wakeup

All four of these capabilities are required for each power management function with the exception of wakeup event generation.

Power Management for the Graphics Controller

This section describes the format of the registers in the PCI Configuration Space that are used by these power management operations. The Status and Capabilities Pointer (CAP_PTR) fields have been highlighted to indicate where the PCI Power Management features appear in the standard Configuration Space Header.

Table 6-3 Standard PCI Configuration Space Header Type 0

R e g i s t e r F i e l d s ( 3 2 B i t s )

MSB LSB

Device ID Vendor ID 00h (LSB)

Status (with Bit 4 set to 1) Command 04h

Class Code Revision ID 08h

BIST Header Type Latency Timer Cache Line Size 0Ch

Base Address Registers 10h

CardBus CIS Pointer 28h

Subsystem ID Subsystem Vendor ID 2Ch

Expansion ROM Base Address 30h

Reserved CAP_PTR 34h

Reserved 38h

Max_Lat Min_Gnt Interrupt Pin Interrupt Line 3Ch

Offset

14h

18h

1Ch

20h

24h

6.2.3 Capabilities List Data Structure in PCI Configuration Space

The Capabilities bit in the PCI Status register (offset = 06h) indicates whether or not the subject function implements a linked list of extended capabilities. Specifically, if bit 4 is set, the CAP_PTR register is implemented to give offset to the first item in the Capabilities link list.

Power Management for the Graphics Controller

Table 6-4 PCI Status Register

Bits Default Value

15:05----Refer to PCI Local Bus Specification, Revision 2.2

04 1b Read Only This bit indicates whether this function implements a list of extended capabilities

03:00 0h Read Only Reserved

Read/

Write

Description

such as PCI power management. When set, this bit indicates the presence of Capabilities. A value of 0 implies that this function does not implement Capabilities.

The location of the Capabilities Pointer (CAP_PTR) depends on the PCI header type. See PCI Specification Revision 2.2 for specification of CAP_PTR offsets.

Table 6-5 Capabilities Pointer (CAP_PTR)

Bits Default Value

07:00 50h Read Only The CAP_PTR provides an offset in the PCI Configuration Space of the

Read/

Write

Description

function to access the location of the first item in the Capabilities linked list. The CAP_PTR offset is DWORD aligned, so that the two least significant bits are always zeros.

The graphics core implements extended capabilities of the AGP and Power Management. It needs to provide the standardized register interface. The first entry in the chain of descriptors has to be the PMI descriptor, as this functionality will be supported even if the RS780E operates as a PCI device. The Capabilities Identifier for Power Management is 01h.

6.2.4 Register Block Definition

This section describes the PCI Power Management Interface registers. These registers are implemented inside the Host Interface (HI) as part of the configuration space of the device (RS780E).

Table 6-6 Power Management Register Block

Capability Identifiers (CAP_ID) 00h

Next Item Pointer (NEXT_ITEM_PTR) 01h

Power Management Capabilities (PMC) 02h

Power Management Control/Status Register (PMCSR) 04h

Reserved 06h

The first 16 bits (Capabilities ID [offset = 0] and Next Item Pointer [offset = 1]) are used for the linked list infrastructure. The next 32 bits (PMC [offset = 2] and PMCSR registers [offset = 4]) are required for compliance with this specification.

As with all PCI configuration registers, these registers may be accessed as bytes, 16-bit words, or 32-bit DWORDs. All of the write operations to the reserved registers must be treated as no-ops. This implies that the access must be completed normally on the bus and the data should be discarded. Read accesses to the reserved or the unimplemented registers must be completed normally and a data value of 0000h should be returned.

Power Management for the Graphics Controller

Table 6-7 Power Management Control/Status Register (PMCSR)

Field

Name

Power State 1:0 00 This field describes the power state of the graphics core.

Power State 15:2 0 These Read Only bits will return the clock status of each clock tree, generated inside the clock

Bits

Default (Reset)

States Function

00 = D0 Normal operation, no power savings enabled

01 = D1 Sleeping state 1:

10 = D2 Sleeping state 2

11 = D3 Everything, except Host Interface, is turned off.

block.

The offset for each register is listed as an offset from the beginning of the linked list item that is determined either from the CAP_PTR (if Power Management is the first item in the list) or the NEXT_ITEM_PTR of the previous item in the list.

6.2.5 Capability Identifier: CAP_ID (Offset = 0)

The Capability Identifier, when read by system software as 01h, indicates that the data structure currently being pointed to is the PCI Power Management data structure. Each function of a PCI device may have only one item in its capability list with CAP_ID set to 01h.

Description

Display is off Host access to DRAM is allowed

Display is off. All engines are off. Graphics core does not respond to host accesses to the frame buffer.

Table 6-8 Capability Identifier (CAP_ID)

Bits Default Value

07:00 01h Read Only This field, when set to 01h, identifies the linked list item as being the PCI Power

Read/

Write

Description

Management registers

Figure 6-1, ‘Linked List for Capabilities,” shows the implementation of the capabilities list. The CAP_PTR gives the

location of the first item in the list. PCI Power Management registers have been stated as example in this list (although the capabilities can be in any order).

• The first byte of each entry is required to be the ID of that capability. The PCI Power Management capability has an

ID of 01h.

• The next byte is a pointer giving an absolute offset in the functions PCI Configuration Space to the next item in the

list and must be DWORD aligned.

• If there are no more entries in the list, the NEXT_ITEM_PTR must be set to 0 to indicate an end of the linked list.

Each capability can then have registers following the NEXT_ITEM_PTR.

The definition of these registers (including layout, size, and bit definitions) is specific to each capability. The PCI Power Management Register Block is defined in

Figure 6-1, ‘Linked List for Capabilities,” below.

Power Management for the Graphics Controller

Cap_Ptr = 50h

8 bits

PCI Configuration Header

Offset 34h

025Ch

AGP Capability

0100h

PM Registers

Offset 5Ch

Offset 50h

Figure 6-1 Linked List for Capabilities

6.2.6 Next Item Pointer (Offset = 1)

The Next Item Pointer register describes the location of the next item in the capability list of the function. The value given is an offset in the PCI Configuration Space of that function. This register must be set to 00h if the function does not implement any other capabilities defined by the PCI Specifications for inclusion in the capabilities list, or if power management is the last item in the list.

Table 6-9 Next Item Pointer (NEXT_ITEM_PTR)

Bits

07:00 80h Read Only This field provides an offset in the PCI Configuration Space of the function pointing to the location

Default

Value

Read/

Write

Description

of next item in the capability list of the function. For Power Management of the RS780E, this pointer is set to 80h and it points to the next capability pointer of the MSI structure.

6.2.7 PMC - Power Management Capabilities (Offset = 2)

The Power Management Capabilities register is a 16-bit Read Only register that provides information on the capabilities

of the function related to power management. The information in this register is generally static and is known at design

time.

Table 6-10 Power Management Capabilities – PMC

Power Management for the Graphics Controller

Bits Default Value

15:11 00111b Read Only This 5-bit field indicates the power states in which the function may assert PME#. A value of

10 001b Read Only RS780E supports D2.

09 001b Read Only RS780E supports D1.

08:06 000b Read Only Reserved

05 1b Read Only The Device Specific Initialization bit indicates whether special initialization of this function is

04 0b Read Only Reserved

03 0b Read Only Reserved

02:00 001b Read Only A value of 001b indicates that this function complies with Revision 1.0 of the PCI Power

Read/

Write

Description

0b for any bit indicates that the function is not capable of asserting the PME# signal while in that power state. bit(11) XXXX1b - PME# can be asserted from D0. bit(12) XXX1Xb - PME# can be asserted from D1. bit(13) XX1XXb - PME# can be asserted from D2. bit(14) X0XXXb - PME# cannot be asserted from D3hot. bit(15) 0XXXXb - PME# cannot be asserted from D3cold.

required (beyond the standard PCI configuration header) before the generic class device driver is able to use it. The RS780E requires device specific initialization after Reset; this field must therefore return a value 1 to the system.

Management Interface Specification.

7.1 Test Capability Features

The RS780E has integrated test modes and capabilities. These test features cover both the ASIC and board level testing. The ASIC tests provide a very high fault coverage and low DPM (Defect Per Million) ratio of the part. The board level tests modes can be used for motherboard manufacturing and debug purposes. The following are the test modes of the RS780E:

• Full scan implementation on the digital core logic that provides about 99% fault coverage through ATPG (Automatic

Test Pattern Generation Vectors).

• Dedicated test logic for the on-chip custom memory macros to provide complete coverage on these modules.

• Improved access to the analog modules and PLLs in the RS780E to allow full evaluation and characterization of these

modules.

• A JTAG test mode (which is not entirely compliant to the IEEE 1149.1 standard) to allow board level testing of

neighboring devices.

• An XOR TREE test mode on all the digital I/O’s to allow for proper soldering verification at the board level.

• A VOH/VOL test mode on all digital I/O’s to allow for proper verification of output high and output low voltages at

the board level.

These test modes can be accessed through the settings on the instruction register of the JTAG circuitry.

Chapter 7

Testability

7.2 Test Interface

Table 7-1 Pins on the Test Interface

Pin Name Ball number Type Description

TESTMODE D13 I IEEE 1149.1 test port reset

DDC_DATA0/AUX0N B8 I TMS: Test Mode Select (IEEE 1149.1 test mode select)

I2C_DATA A9 I TDI: Test Mode Data In (IEEE 1149.1 data in)

I2C_CLK B9 I TCLK: Test Mode Clock (IEEE 1149.1 clock)

TMDS_HPD D9 O TDO: Test Mode Data Out (IEEE 1149.1 data out)

POWERGOOD A10 I I/O Reset

7.3 XOR Test

7.3.1 Description of a Generic XOR Tree

An example of a generic XOR tree is shown in the Figure 7-1.

XOR Test

XOR Start Signal

Figure 7-1 Example of a Generic XOR Tree

Pin A is assigned to the output direction, and pins 1 through 6 are assigned to the input direction. It can be seen that after all pins 1 to 6 are assigned to logic 0 or 1, a logic change in any one of these pins will toggle the output pin A.

The following is the truth table for the XOR tree shown in

Table 7-2 Example of an XOR Tree

Test Vector

number

10000001

21000000

31100001

41110000

51111001

61111100

71111111

Input Pin 1 Input Pin 2 Input Pin 3 Input Pin 4 Input Pin 5 Input Pin 6 Output Pin A

7.3.2 Description of the RS780E XOR Tree

7.3.3 XOR Tree Activation

The RS780E chip enters the XOR tree test mode by means of the JTAG. First, the 8-bit instruction register of the JTAG is loaded with the XOR instruction (“00001000”). This instruction assigns the input direction to all the pins except pin TDO, which is assigned the output direction to serve as the output of the XOR tree. After loading, the JTAG is taken to the Run-Test state for completion of the XOR tree initialization.

10MHz clock frequency for the Test Mode Clock (I2C_CLK) is recommended for the XOR TREE test mode. A pair of

differential clock at 10MHz should also be supplied to HT_REFCLKP/N to enable I/Os for testing.

Figure 7-1 The XOR start signal is assumed to be logic 1.

7.3.4 XOR Tree for the RS780E

The XOR start signal is applied at the TDI Pin of the JTAG circuitry and the output of the XOR tree is obtained at the TDO Pin. Refer to tree will cause the output to toggle.

There is no specific connection order to the signals on the tree. When the XOR tree is activated, any pin on the XOR tree must be either pulled down or pulled up to the I/O voltage of the pin. Only pins that are floating.

When differential signal pairs are listed as single entries on the XOR tree, opposite input values should be applied to the two signals in each pair (e.g., for entry no. 1 on the tree, when “1” is applied to HT_RXCAD0P, “0” should be applied to HT_RXCAD0N).

Table 7-3 for the list of the signals included on the XOR tree. A toggle of any of these balls in the XOR

not on the XOR tree can be left

XOR Test

Table 7-3 RS780E XOR Tree

No. Pin Name

1 HT_RXCAD0P/N Y25/Y24

2 HT_RXCAD1P/N V22/V23

3 HT_RXCAD2P/N V25/V24

4 HT_RXCAD3P/N U24/U25

5 HT_RXCAD4P/N T25/T24

6 HT_RXCAD5P/N P22/P23

7 HT_RXCAD6P/N P25/P24

8 HT_RXCAD7P/N N24/N25

9 HT_RXCAD8P/N AC24/AC25

10 HT_RXCAD9P/N AB25/AB24

11 HT_RXCAD10P/N AA24/AA25

12 HT_RXCAD11P/N Y22/Y23

13 HT_RXCAD12P/N W21/W20

14 HT_RXCAD13P/N V21/V20

15 HT_RXCAD14P/N U20/U21

16 HT_RXCAD15P/N U19/U18

17 HT_RXCTL0P/N M22/M23

18 HT_RXCTL1P/N R21/R20

19 MEM_CKE AB18

20 MEM_CS# AB13

21 MEM_ODT V14

22 MEM_WE# AD18

23 MEM_RAS# W12

24 MEM_CAS# Y12

25 MEM_BA0 AD16

26 MEM_BA1 AE17

27 MEM_BA2 AD17

28 MEM_A0 AB12

29 MEM_A1 AE16

30 MEM_A2 V11

31 MEM_A3 AE15

32 MEM_A4 AA12

33 MEM_A5 AB16

34 MEM_A6 AB14

35 MEM_A7 AD14

Ball

Reference

No. Pin Name

36 MEM_A8 AD13

37 MEM_A9 AD15

38 MEM_A10 AC16

39 MEM_A11 AE13

40 MEM_A12 AC14

41 MEM_A13 Y14

42 MEM_DQ0 AA18

43 MEM_DQ1 AA20

44 MEM_DQ2 AA19

45 MEM_DQ3 Y19

46 MEM_DQ4 V17

47 MEM_DQ5 AA17

48 MEM_DQ6 AA15

49 MEM_DQ7 Y15

50 MEM_DQ8 AC20

51 MEM_DQ9 AD19

52 MEM_DQ10 AE22

53 MEM_DQ11 AC18

54 MEM_DQ12 AB20

55 MEM_DQ13 AD22

56 MEM_DQ14 AC22

57 MEM_DQ15 AD21

58 MEM_DM0 W17

59 MEM_DM1 AE19

60 MEM_DQS0P/N Y17/W18

61 MEM_DQS1P/N AD20/AE21

62 MEM_CKP/N V15/W14

63 GFX_RX0P/N D4/C4

64 GFX_RX1P/N A3/B3

65 GFX_RX2P/N C2/C1

66 GFX_RX3P/N E5/F5

67 GFX_RX4P/N G5/G6

68 GFX_RX5P/N H5/H6

69 GFX_RX6P/N J6/J5

70 GFX_RX7P/N J7/J8

Ball

Reference

VOH/VOL Test

No. Pin Name

71 GFX_RX8P/N L5/L6

72 GFX_RX9P/N M8/L8

73 GFX_RX10P/N P7/M7

74 GFX_RX11P/N P5/M5

75 GFX_RX12P/N R8/P8

76 GFX_RX13P/N R6/R5

77 GFX_RX14P/N P4/P3

78 GFX_RX15P/N T4/T3

79 GPP_RX0P/N AE3/AD4

80 GPP_RX1P/N AE2/AD3

81 GPP_RX2P/N AD1/AD2

82 GPP_RX3P/N V5/W6

83 GPP_RX4P/N U5/U6

84 GPP_RX5P/N U8/U7

85 SB_RX0P/N AA8/Y8

Ball

Reference

86 SB_RX1P/N AA7/Y7

87 SB_RX2P/N AA5/AA6

88 SB_RX3P/N W5/Y5

89 LVDS_DIGON E9

90 LVDS_ENA_BL G12

91 LVDS_BLON F7

92 DAC_HSYNC A11

93 DAC_VSYNC B11

94 DAC_SCL F8

95 DDC_CLK0/AUX0P A8

96 HPD D10

97 DDC_DATA1/AUX1N A7

98 DDC_CLK1/AUX1P B7

7.4 VOH/VOL Test

7.4.1 Description of a Generic VOH/VOL Tree

The VOH/VOL logic gives signal output on I/O’s when test patterns are applied through the TEST_ODD and TEST_EVEN inputs. Sample of a generic VOH/VOL tree is shown in

Figure 7-2.

VOH/VOL Test

VOH/VOL

mode

TEST_ODD

TEST_EVEN

Figure 7-2 Sample of a Generic VOH/VOL Tree

7.4.2 VOH/VOL Tree Activation

The following is the truth table for the above VOH/VOL tree.

Table 7-4 Truth Table for the VOH/VOL Tree Outputs

Test Vector

Number

1 0 0 000000

2 0 1 010101

3 1 0 101010

4 1 1 111111

Refer to

To activate the VOH/VOL tree and run a VOH/VOL test, perform the sequence below:

1. Supply a 10MHz clock to the REF_CLKP pin and a 10MHz differential clock pair to the HT_REFCLKP/N pins to enable I/Os for testing.

2. Set POWERGOOD to 0.

Section 7.4.3 for the list of pins that are on the VOH/VOL tree. VOH/VOL Tree Activation

TEST_ODD

Input

TEST_EVEN

Input

Output

Pin 1

Output

Pin 2

Output

Pin 3

Output

Pin 4

Output

Pin 5

Output

Pin 6

3. Set TESTMODE to 1.

4. Set DAC_SDA to 0.

5. Load JTAG instruction register with the instruction 0110 0011.

6. Load JTAG instruction register with the instruction 0010 0111.

7. Set POWERGOOD to 1.

8. Load JTAG instruction register with the instruction 1001 1001.

9. Run test by loading JTAG data register with data 0000 0000 0000 00xy, where bit x is the input value for TEST_ODD and bit y that for TEST_EVEN (see Table 7-4 above).

10. To end test, load JTAG instruction register with the instruction 0101 1101.

7.4.3 VOH/VOL Pin List

Table 7-5 shows the RS780E VOH/VOL tree. There is no specific order for connection. Under the Control column, an “ODD” or “EVEN” indicates that the logical output of the pin is same as the “TEST_ODD” or “TEST_EVEN” input respectively.

When a differential pair appear in the table as a single entry, the output of the positive (“P”) pin is indicated in the Control column (see last paragraph for explanations), and the output of the negative pin (“N”) will be of the opposite value. For example, for entry no. 1 on the tree, when TEST_EVEN is 1, HT_TXCAD0P will give a value of 1 and HT_TXCAD0N will give a value of 0.

VOH/VOL Test

Table 7-5 RS780E VOH/VOL Tree

No. Pin Name

1 HT_TXCAD0P/N D24/D25 Even

2 HT_TXCAD1P/N E24/E25 Odd

3 HT_TXCAD2P/N F24/F25 Even

4 HT_TXCAD3P/N F23/F22 Odd

5 HT_TXCAD4P/N H23/H22 Even

6 HT_TXCAD5P/N J25/J24 Odd

7 HT_TXCAD6P/N K24/K25 Even

8 HT_TXCAD7P/N K23/K22 Odd

9 HT_TXCAD8P/N F21/G21 Even

10 HT_TXCAD9P/N G20/H21 Odd

11 HT_TXCAD10P/N J20/J21 Even

12 HT_TXCAD11P/N J18/K17 Odd

13 HT_TXCAD12P/N L19/J19 Even

14 HT_TXCAD13P/N M19/L18 Odd

15 HT_TXCAD14P/N M21/P21 Even

16 HT_TXCAD15P/N P18/M18 Odd

17 HT_TXCTL0P/N M24/M25 Even

18 HT_TXCTL1P/N P19/R18 Odd

19 MEM_DQ0 AA18 Even

20 MEM_DQ1 AA20 Odd

21 MEM_DQ2 AA19 Even

22 MEM_DQ3 Y19 Odd

23 MEM_DQ4 V17 Even

24 MEM_DQ5 AA17 Odd

25 MEM_DQ6 AA15 Even

26 MEM_DQ7 Y15 Odd

27 MEM_DQ8 AC20 Even

28 MEM_DQ9 AD19 Odd

29 MEM_DQ10 AE22 Even

30 MEM_DQ11 AC18 Odd

31 MEM_DQ12 AB20 Even

32 MEM_DQ13 AD22 Odd

33 MEM_DQ14 AC22 Even

34 MEM_DQ15 AD21 Odd

35 MEM_DM0 W17 Even

Ball

Reference

Control

No. Pin Name

36 MEM_DM1 AE19 Odd

37 MEM_DQS0P/N Y17/W18 Even

38 MEM_DQS1P/N AD20/AE21 Odd

39 MEM_CKE AB18 Even

40 MEM_CS# AB13 Odd

41 MEM_ODT V14 Even

42 MEM_WE# AD18 Odd

43 MEM_RAS# W12 Even

44 MEM_CAS# Y12 Odd

45 MEM_BA0 AD16 Even

46 MEM_BA1 AE17 Odd

47 MEM_BA2 AD17 Even

48 MEM_A0 AB12 Odd

49 MEM_A1 AE16 Even

50 MEM_A2 V11 Odd

51 MEM_A3 AE15 Even

52 MEM_A4 AA12 Odd

53 MEM_A5 AB16 Even

54 MEM_A6 AB14 Odd

55 MEM_A7 AD14 Even

56 MEM_A8 AD13 Odd

57 MEM_A9 AD15 Even

58 MEM_A10 AC16 Odd

59 MEM_A11 AE13 Even

60 MEM_A12 AC14 Odd

61 MEM_A13 Y14 Even

62 MEM_CKP/N V15/W14 Odd

63 GFX_TX0P/N A5/B5 Even

64 GFX_TX1P/N A4/B4 Odd

65 GFX_TX2P/N C3/B2 Even

66 GFX_TX3P/N D1/D2 Odd

67 GFX_TX4P/N E2/E1 Even

68 GFX_TX5P/N F4/F3 Odd

69 GFX_TX6P/N F1/F2 Even

70 GFX_TX7P/N H4/H3 Odd

Ball

Reference

Control

VOH/VOL Test

No. Pin Name

71 GFX_TX8P/N H1/H2 Even

72 GFX_TX9P/N J2/J1 Odd

73 GFX_TX10P/N K4/K3 Even

74 GFX_TX11P/N K1/K2 Odd

75 GFX_TX12P/N M4/M3 Even

76 GFX_TX13P/N M1/M2 Odd

77 GFX_TX14P/N N2/N1 Even

78 GFX_TX15P/N P1/P2 Odd

79 GPP_TX0P/N AC1/AC2 Even

80 GPP_TX1P/N AB4/AB3 Odd

81 GPP_TX2P/N AA2/AA1 Even

82 GPP_TX3P/N Y1/Y2 Odd

83 GPP_TX4P/N Y4/Y3 Even

84 GPP_TX5P/N V1/V2 Odd

85 SB_TX0P/N AD7/AE7 Even

Ball

Reference

Control

86 SB_TX1P/N AE6/AD6 Odd

87 SB_TX2P/N AB6/AC6 Even

88 SB_TX3P/N AD5/AE5 Odd

89 LVDS_BLON F7 Even

90 LVDS_ENA_BL G12 Odd

91 LVDS_DIGON E9 Even

92 DAC_VSYNC B11 Odd

93 DAC_HSYNC A11 Even

94 HPD D10 Odd

Appendix A

Pin Listings

This appendix contains pin listings for the RS780E sorted in different ways. To go to the listing of interest, use the linked cross-references below:

“RS780E Pin List Sorted by Ball Reference” on page A-2

“RS780E Pin List Sorted by Pin Name” on page A-7

A.1 RS780E Pin List Sorted by Ball Reference

Table A-1 RS780E Pin List Sorted by Ball Reference

Ball Ref Pin Name

A10 POWERGOOD

A11 DAC_HSYNC

A12 PLLVDD

A13 VDDLTP18

A14 VDDLT33

A15 VDDLT18

A16 TXCLK_LN

A17 TXOUT_U1P

A18 TXOUT_U0N

A19 TXOUT_L3P

A2 VSSAPCIE

A20 TXOUT_L2N

A21 TXOUT_L1P

A22 TXOUT_L0P

A23 VDDHTRX

A24 HT_RXCALN

A25 VSSAHT

A3 GFX_RX1P

A4 GFX_TX1P

A5 GFX_TX0P

A6 VDDPCIE

A7 DDC_DATA1/AUX1N

A8 DDC_CLK0/AUX0P

A9 I2C_DATA

AA1 GPP_TX2N

AA11 VDD_MEM

AA12 MEM_A4

AA14 VSS

AA15 MEM_DQ6

AA17 MEM_DQ5

AA18 MEM_DQ0

AA19 MEM_DQ2

AA2 GPP_TX2P

AA20 MEM_DQ1

AA21 VDDHTTX

AA22 HT_RXCLK1N

AA24 HT_RXCAD10P

AA25 HT_RXCAD10N

AA4 VSSAPCIE

AA5 SB_RX2P

AA6 SB_RX2N

AA7 SB_RX1P

Ball Ref Pin Name

AA8 SB_RX0P

AA9 VDDA18PCIE

AB1 VSSAPCIE

AB10 VDD_MEM

AB11 VSS

AB12 MEM_A0

AB13 MEM_CS#

AB14 MEM_A6

AB15 VSS

AB16 MEM_A5

AB17 VSS

AB18 MEM_CKE

AB19 VSS

AB2 VSSAPCIE

AB20 MEM_DQ12

AB21 VSS

AB22 VDDHTTX

AB23 HT_RXCLK1P

AB24 HT_RXCAD9N

AB25 HT_RXCAD9P

AB3 GPP_TX1N

AB4 GPP_TX1P

AB5 VSSAPCIE

AB6 SB_TX2P

AB7 VSSAPCIE

AB8 PCE_CALRN

AB9 VDDA18PCIE

AC1 GPP_TX0P

AC10 VDD_MEM

AC12 VSS

AC14 MEM_A12

AC16 MEM_A10

AC18 MEM_DQ11

AC2 GPP_TX0N

AC20 MEM_DQ8

AC22 MEM_DQ14

AC23 VDDHTTX

AC24 HT_RXCAD8P

AC25 HT_RXCAD8N

AC3 VSSAPCIE

AC4 VSSAPCIE

AC6 SB_TX2N

Pin Listings

Ball Ref Pin Name

AC8 PCE_CALRP

AD1 GPP_RX2P

AD10 VDD_MEM

AD11 VDD18_MEM

AD12 MEM_COMPN

AD13 MEM_A8

AD14 MEM_A7

AD15 MEM_A9

AD16 MEM_BA0

AD17 MEM_BA2

AD18 MEM_WE#

AD19 MEM_DQ9

AD2 GPP_RX2N

AD20 MEM_DQS1P

AD21 MEM_DQ15

AD22 MEM_DQ13

AD23 IOPLLVSS

AD24 VDDHTTX

AD25 VSSAHT

AD3 GPP_RX1N

AD4 GPP_RX0N

AD5 SB_TX3P

AD6 SB_TX1N

AD7 SB_TX0P

AD8 THERMALDIODE_N

AD9 VDDA18PCIE

AE1 VSSAPCIE

AE10 VDD_MEM

AE11 VDD18_MEM

AE12 MEM_COMPP

AE13 MEM_A11

AE14 VSS

AE15 MEM_A3

AE16 MEM_A1

AE17 MEM_BA1

AE18 MEM_VREF

AE19 MEM_DM1

AE2 GPP_RX1P

AE20 VSS

AE21 MEM_DQS1N

AE22 MEM_DQ10

AE23 IOPLLVDD18

Pin Listings

Ball Ref Pin Name

AE24 IOPLLVDD

AE25 VDDHTTX

AE3 GPP_RX0P

AE4 VSSAPCIE

AE5 SB_TX3N

AE6 SB_TX1P

AE7 SB_TX0N

AE8 THERMALDIODE_P

AE9 VDDA18PCIE

B1 VSSAPCIE

B10 STRP_DATA

B11 DAC_VSYNC

B12 PLLVSS

B13 VSSLTP18

B14 VDDLT33

B15 VDDLT18

B16 TXCLK_LP

B17 TXOUT_U1N

B18 TXOUT_U0P

B19 TXOUT_L3N

B2 GFX_TX2N

B20 TXOUT_L2P

B21 TXOUT_L1N

B22 TXOUT_L0N

B23 VDDHTRX

B24 HT_TXCALP

B25 HT_TXCALN

B3 GFX_RX1N

B4 GFX_TX1N

B5 GFX_TX0N

B6 VDDPCIE

B7 DDC_CLK1/AUX1P

B8 DDC_DATA0/AUX0N

B9 I2C_CLK

C1 GFX_RX2N

C10 LDTSTOP#

C12 ALLOW_LDTSTOP

C14 VSSLT

C16 VSSLT

C18 VSSLT

C2 GFX_RX2P

C20 VSSLT

C22 VSSLT

C23 HT_RXCALP

Ball Ref Pin Name

C24 HT_REFCLKN

C25 HT_REFCLKP

C3 GFX_TX2P

C4 GFX_RX0N

C6 VDDPCIE

C8 AUX_CAL

D1 GFX_TX3P

D10 HPD

D11 VSS

D12 SUS_STAT#

D13 TESTMODE

D14 PLLVDD18

D15 VSSLT

D16 TXCLK_UP

D17 TXCLK_UN

D18 TXOUT_U3P

D19 TXOUT_U3N

D2 GFX_TX3N

D20 TXOUT_U2P

D21 TXOUT_U2N

D22 VDDHTRX

D23 VSSAHT

D24 HT_TXCAD0P

D25 HT_TXCAD0N

D3 VSSAPCIE

D4 GFX_RX0P

D5 VSSAPCIE

D6 VDDPCIE

D7 VDDA18PCIEPLL

D8 SYSRESET#

D9 TMDS_HPD

E1 GFX_TX4N

E11 REFCLK_P

E12 AVDD

E14 VSS

E15 VSS

E17 RESERVED

E18 GREEN

E19 BLUE

E2 GFX_TX4P

E20 VSSLT

E21 VDDHTRX

E22 VSSAHT

E24 HT_TXCAD1P

Ball Ref Pin Name

E25 HT_TXCAD1N

E4 VSSAPCIE

E5 GFX_RX3P

E6 VDDPCIE

E7 VDDA18PCIEPLL

E8 DAC_SDA

E9 LVDS_DIGON

F1 GFX_TX6P

F11 REFCLK_N

F12 AVDD

F14 AVDDDI

F15 RESERVED

F17 RESERVED

F18 GREEN#

F19 BLUE#

F2 GFX_TX6N

F20 VDDHTRX

F21 HT_TXCAD8P

F22 HT_TXCAD3N

F23 HT_TXCAD3P

F24 HT_TXCAD2P

F25 HT_TXCAD2N

F3 GFX_TX5N

F4 GFX_TX5P

F5 GFX_RX3N

F6 VDDPCIE

F7 LVDS_BLON

F8 DAC_SCL

F9 VDD18

G1 VSSAPCIE

G11 RESERVED

G12 LVDS_ENA_BL

G14 DAC_RSET

G15 AVSSDI

G17 RED#

G18 RED

G19 VDDHTRX

G2 VSSAPCIE

G20 HT_TXCAD9P

G21 HT_TXCAD8N

G22 VSSAHT

G24 VSSAHT

G25 VSSAHT

G4 VSSAPCIE

Pin Listings

Ball Ref Pin Name

G5 GFX_RX4P

G6 GFX_RX4N

G7 VDDPCIE

G8 VSS

G9 VDD18

H1 GFX_TX8P

H11 VDD33

H12 VDD33

H14 AVSSQ

H15 AVDDQ

H17 VDDA18HTPLL

H18 VDDHTRX

H19 VSSAHT

H2 GFX_TX8N

H20 VSSAHT

H21 HT_TXCAD9N

H22 HT_TXCAD4N

H23 HT_TXCAD4P

H24 HT_TXCLK0P

H25 HT_TXCLK0N

H3 GFX_TX7N

H4 GFX_TX7P

H5 GFX_RX5P

H6 GFX_RX5N

H7 VSSAPCIE

H8 VDDPCIE

H9 VDDA18PCIE

J1 GFX_TX9N

J10 VDDA18PCIE

J11 VDDC

J12 VSS

J14 VDDC

J15 VSS

J16 VDDC

J17 VDDHT

J18 HT_TXCAD11P

J19 HT_TXCAD12N

J2 GFX_TX9P

J20 HT_TXCAD10P

J21 HT_TXCAD10N

J22 VSSAHT

J24 HT_TXCAD5N

J25 HT_TXCAD5P

J4 VSSAPCIE

Ball Ref Pin Name

J5 GFX_RX6N

J6 GFX_RX6P

J7 GFX_RX7P

J8 GFX_RX7N

J9 VDDPCIE

K1 GFX_TX11P

K10 VDDA18PCIE

K11 VSS

K12 VDDC

K14 VSS

K15 VDDC

K16 VDDHT

K17 HT_TXCAD11N

K2 GFX_TX11N

K22 HT_TXCAD7N

K23 HT_TXCAD7P

K24 HT_TXCAD6P

K25 HT_TXCAD6N

K3 GFX_TX10N

K4 GFX_TX10P

K9 VDDPCIE

L1 VSSAPCIE

L10 VDDA18PCIE

L11 VDDC

L12 VSS

L14 VDDC

L15 VSS

L16 VDDHT

L17 VSSAHT

L18 HT_TXCAD13N

L19 HT_TXCAD12P

L2 VSSAPCIE

L20 HT_TXCLK1N

L21 HT_TXCLK1P

L22 VSSAHT

L24 VSSAHT

L25 VSSAHT

L4 VSSAPCIE

L5 GFX_RX8P

L6 GFX_RX8N

L7 VSSAPCIE

L8 GFX_RX9N

L9 VDDPCIE

M1 GFX_TX13P

Ball Ref Pin Name

M10 VDDA18PCIE

M11 VSS

M12 VDDC

M13 VDDC

M14 VSS

M15 VDDC

M16 VDDHT

M17 VDDHTTX

M18 HT_TXCAD15N

M19 HT_TXCAD13P

M2 GFX_TX13N

M20 VSSAHT

M21 HT_TXCAD14P

M22 HT_RXCTL0P

M23 HT_RXCTL0N

M24 HT_TXCTL0P

M25 HT_TXCTL0N

M3 GFX_TX12N

M4 GFX_TX12P

M5 GFX_RX11N

M6 VSSAPCIE

M7 GFX_RX10N

M8 GFX_RX9P

M9 VDDPCIE

N1 GFX_TX14N

N12 VDDC

N13 VSS

N14 VDDC

N2 GFX_TX14P

N22 VSSAHT

N24 HT_RXCAD7P

N25 HT_RXCAD7N

N4 VSSAPCIE

P1 GFX_TX15P

P10 VDDA18PCIE

P11 VDDC

P12 VSS

P13 VDDC

P14 VDDC

P15 VSS

P16 VDDHT

P17 VDDHTTX

P18 HT_TXCAD15P

P19 HT_TXCTL1P

Pin Listings

Ball Ref Pin Name

P2 GFX_TX15N

P20 VSSAHT

P21 HT_TXCAD14N

P22 HT_RXCAD5P

P23 HT_RXCAD5N

P24 HT_RXCAD6N

P25 HT_RXCAD6P

P3 GFX_RX14N

P4 GFX_RX14P

P5 GFX_RX11P

P6 VSSAPCIE

P7 GFX_RX10P

P8 GFX_RX12N

P9 VDDPCIE

R1 VSSAPCIE

R10 VDDA18PCIE

R11 VSS

R12 VDDC

R14 VSS

R15 VDDC

R16 VDDHT

R17 VDDHTTX

R18 HT_TXCTL1N

R19 VSSAHT

R2 VSSAPCIE

R20 HT_RXCTL1N

R21 HT_RXCTL1P

R22 VSSAHT

R24 VSSAHT

R25 VSSAHT

R4 VSSAPCIE

R5 GFX_RX13N

R6 GFX_RX13P

R7 VSSAPCIE

R8 GFX_RX12P

R9 VDDPCIE

T1 GFX_REFCLKN

T10 VDDA18PCIE

T11 VDDC

T12 VSS

T14 VDDC

T15 VDDC

T16 VDDHT

T17 VDDHTTX

Ball Ref Pin Name

T2 GFX_REFCLKP

T22 HT_RXCLK0P

T23 HT_RXCLK0N

T24 HT_RXCAD4N

T25 HT_RXCAD4P

T3 GFX_RX15N

T4 GFX_RX15P

T9 VDDPCIE

U1 GPP_REFCLKP

U10 VDDA18PCIE

U11 VSS

U12 VDDC

U14 VSS

U15 VSS

U16 VDDC

U17 VDDHTTX

U18 HT_RXCAD15N

U19 HT_RXCAD15P

U2 GPP_REFCLKN

U20 HT_RXCAD14P

U21 HT_RXCAD14N

U22 VSSAHT

U24 HT_RXCAD3P

U25 HT_RXCAD3N

U4 VSSAPCIE

U5 GPP_RX4P

U6 GPP_RX4N

U7 GPP_RX5N

U8 GPP_RX5P

U9 VDDPCIE

V1 GPP_TX5P

V11 MEM_A2

V12 VSS

V14 MEM_ODT

V15 MEM_CKP

V17 MEM_DQ4

V18 VDDHTTX

V19 VSSAHT

V2 GPP_TX5N

V20 HT_RXCAD13N

V21 HT_RXCAD13P

V22 HT_RXCAD1P

V23 HT_RXCAD1N

V24 HT_RXCAD2N

Ball Ref Pin Name

V25 HT_RXCAD2P

V3 GPPSB_REFCLKN

V4 GPPSB_REFCLKP

V5 GPP_RX3P

V6 VSSAPCIE

V7 VSSAPCIE

V8 VSSAPCIE

V9 VDDPCIE

W1 VSSAPCIE

W11 VSS

W12 MEM_RAS#

W14 MEM_CKN

W15 VSS

W17 MEM_DM0

W18 MEM_DQS0N

W19 VDDHTTX

W2 VSSAPCIE

W20 HT_RXCAD12N

W21 HT_RXCAD12P

W22 VSSAHT

W24 VSSAHT

W25 VSSAHT

W4 VSSAPCIE

W5 SB_RX3P

W6 GPP_RX3N

W7 VSSAPCIE

W8 VSSAPCIE

W9 VDDA18PCIE

Y1 GPP_TX3P

Y11 VDD_MEM

Y12 MEM_CAS#

Y14 MEM_A13

Y15 MEM_DQ7

Y17 MEM_DQS0P

Y18 VSS

Y19 MEM_DQ3

Y2 GPP_TX3N

Y20 VDDHTTX

Y21 VSSAHT

Y22 HT_RXCAD11P

Y23 HT_RXCAD11N

Y24 HT_RXCAD0N

Y25 HT_RXCAD0P

Y3 GPP_TX4N

Ball Ref Pin Name

Y4 GPP_TX4P

Y5 SB_RX3N

Y6 VSSAPCIE

Y7 SB_RX1N

Y8 SB_RX0N

Y9 VDDA18PCIE

Pin Listings

A.2 RS780E Pin List Sorted by Pin Name

Table A-2 RS780E Pin List Sorted by Pin Name

Pin Name Ball Ref

ALLOW_LDTSTOP C12

AUX_CAL C8

AVD D E1 2

AVD D F1 2

AVDDDI F14

AVD DQ H 15

AVSSDI G15

AVSSQ H14

BLUE E19

BLUE# F19

DAC_HSYNC A11

DAC_RSET G14

DAC_SCL F8

DAC_SDA E8

DAC_VSYNC B11

DDC_CLK0/AUX0P A8

DDC_CLK1/AUX1P B7

DDC_DATA0/AUX0N B8

DDC_DATA1/AUX1N A7

GFX_REFCLKN T1

GFX_REFCLKP T2

GFX_RX0N C4

GFX_RX0P D4

GFX_RX10N M7

GFX_RX10P P7

GFX_RX11N M5

GFX_RX11P P5

GFX_RX12N P8

GFX_RX12P R8

GFX_RX13N R5

GFX_RX13P R6

GFX_RX14N P3

GFX_RX14P P4

GFX_RX15N T3

GFX_RX15P T4

GFX_RX1N B3

GFX_RX1P A3

GFX_RX2N C1

GFX_RX2P C2

GFX_RX3N F5

GFX_RX3P E5

Pin Name Ball Ref

GFX_RX4N G6

GFX_RX4P G5

GFX_RX5N H6

GFX_RX5P H5

GFX_RX6N J5

GFX_RX6P J6

GFX_RX7N J8

GFX_RX7P J7

GFX_RX8N L6

GFX_RX8P L5

GFX_RX9N L8

GFX_RX9P M8

GFX_TX0N B5

GFX_TX0P A5

GFX_TX10N K3

GFX_TX10P K4

GFX_TX11N K2

GFX_TX11P K1

GFX_TX12N M3

GFX_TX12P M4

GFX_TX13N M2

GFX_TX13P M1

GFX_TX14N N1

GFX_TX14P N2

GFX_TX15N P2

GFX_TX15P P1

GFX_TX1N B4

GFX_TX1P A4

GFX_TX2N B2

GFX_TX2P C3

GFX_TX3N D2

GFX_TX3P D1

GFX_TX4N E1

GFX_TX4P E2

GFX_TX5N F3

GFX_TX5P F4

GFX_TX6N F2

GFX_TX6P F1

GFX_TX7N H3

GFX_TX7P H4

GFX_TX8N H2

GFX_TX8P H1

Pin Name Ball Ref

GFX_TX9N J1

GFX_TX9P J2

GPP_REFCLKN U2

GPP_REFCLKP U1

GPP_RX0N AD4

GPP_RX0P AE3

GPP_RX1N AD3

GPP_RX1P AE2

GPP_RX2N AD2

GPP_RX2P AD1

GPP_RX3N W6

GPP_RX3P V5

GPP_RX4N U6

GPP_RX4P U5

GPP_RX5N U7

GPP_RX5P U8

GPP_TX0N AC2

GPP_TX0P AC1

GPP_TX1N AB3

GPP_TX1P AB4

GPP_TX2N AA1

GPP_TX2P AA2

GPP_TX3N Y2

GPP_TX3P Y1

GPP_TX4N Y3

GPP_TX4P Y4

GPP_TX5N V2

GPP_TX5P V1

GPPSB_REFCLKN V3

GPPSB_REFCLKP V4

GREEN E18

GREEN# F18

HPD D10

HT_REFCLKN C24

HT_REFCLKP C25

HT_RXCAD0N Y24

HT_RXCAD0P Y25

HT_RXCAD10N AA25

HT_RXCAD10P AA24

HT_RXCAD11N Y23

HT_RXCAD11P Y22

HT_RXCAD12N W20

Pin Listings

Pin Name Ball Ref

HT_RXCAD12P W21

HT_RXCAD13N V20

HT_RXCAD13P V21

HT_RXCAD14N U21

HT_RXCAD14P U20

HT_RXCAD15N U18

HT_RXCAD15P U19

HT_RXCAD1N V23

HT_RXCAD1P V22

HT_RXCAD2N V24

HT_RXCAD2P V25

HT_RXCAD3N U25

HT_RXCAD3P U24

HT_RXCAD4N T24

HT_RXCAD4P T25

HT_RXCAD5N P23

HT_RXCAD5P P22

HT_RXCAD6N P24

HT_RXCAD6P P25

HT_RXCAD7N N25

HT_RXCAD7P N24

HT_RXCAD8N AC25

HT_RXCAD8P AC24

HT_RXCAD9N AB24

HT_RXCAD9P AB25

HT_RXCALN A24

HT_RXCALP C23

HT_RXCLK0N T23

HT_RXCLK0P T22

HT_RXCLK1N AA22

HT_RXCLK1P AB23

HT_RXCTL0N M23

HT_RXCTL0P M22

HT_RXCTL1N R20

HT_RXCTL1P R21

HT_TXCAD0N D25

HT_TXCAD0P D24

HT_TXCAD10N J21

HT_TXCAD10P J20

HT_TXCAD11N K17

HT_TXCAD11P J18

HT_TXCAD12N J19

HT_TXCAD12P L19

HT_TXCAD13N L18

Pin Name Ball Ref

HT_TXCAD13P M19

HT_TXCAD14N P21

HT_TXCAD14P M21

HT_TXCAD15N M18

HT_TXCAD15P P18

HT_TXCAD1N E25

HT_TXCAD1P E24

HT_TXCAD2N F25

HT_TXCAD2P F24

HT_TXCAD3N F22

HT_TXCAD3P F23

HT_TXCAD4N H22

HT_TXCAD4P H23

HT_TXCAD5N J24

HT_TXCAD5P J25

HT_TXCAD6N K25

HT_TXCAD6P K24

HT_TXCAD7N K22

HT_TXCAD7P K23

HT_TXCAD8N G21

HT_TXCAD8P F21

HT_TXCAD9N H21

HT_TXCAD9P G20

HT_TXCALN B25

HT_TXCALP B24

HT_TXCLK0N H25

HT_TXCLK0P H24

HT_TXCLK1N L20

HT_TXCLK1P L21

HT_TXCTL0N M25

HT_TXCTL0P M24

HT_TXCTL1N R18

HT_TXCTL1P P19

I2C_CLK B9

I2C_DATA A9

IOPLLVDD AE24

IOPLLVDD18 AE23

IOPLLVSS AD23

LDTSTOP# C10

LVDS_BLON F7

LVDS_DIGON E9

LVDS_ENA_BL G12

MEM_A0 AB12

MEM_A1 AE16

Pin Name Ball Ref

MEM_A10 AC16

MEM_A11 AE13

MEM_A12 AC14

MEM_A13 Y14

MEM_A2 V11

MEM_A3 AE15

MEM_A4 AA12

MEM_A5 AB16

MEM_A6 AB14

MEM_A7 AD14

MEM_A8 AD13

MEM_A9 AD15

MEM_BA0 AD16

MEM_BA1 AE17

MEM_BA2 AD17

MEM_CAS# Y12

MEM_CKE AB18

MEM_CKN W14

MEM_CKP V15

MEM_COMPN AD12

MEM_COMPP AE12

MEM_CS# AB13

MEM_DM0 W17

MEM_DM1 AE19

MEM_DQ0 AA18

MEM_DQ1 AA20

MEM_DQ10 AE22

MEM_DQ11 AC18

MEM_DQ12 AB20

MEM_DQ13 AD22

MEM_DQ14 AC22

MEM_DQ15 AD21

MEM_DQ2 AA19

MEM_DQ3 Y19

MEM_DQ4 V17

MEM_DQ5 AA17

MEM_DQ6 AA15

MEM_DQ7 Y15

MEM_DQ8 AC20

MEM_DQ9 AD19

MEM_DQS0N W18

MEM_DQS0P Y17

MEM_DQS1N AE21

MEM_DQS1P AD20

Pin Listings

Pin Name Ball Ref

MEM_ODT V14

MEM_RAS# W12

MEM_VREF AE18

MEM_WE# AD18

PCE_CALRN AB8

PCE_CALRP AC8

PLLVDD A12

PLLVDD18 D14

PLLVSS B12

POWERGOOD A10

RED G18

RED# G17

REFCLK_N F11

REFCLK_P E11

RESERVED E17

RESERVED F15

RESERVED F17

RESERVED G11

SB_RX0N Y8

SB_RX0P AA8

SB_RX1N Y7

SB_RX1P AA7

SB_RX2N AA6

SB_RX2P AA5

SB_RX3N Y5

SB_RX3P W5

SB_TX0N AE7

SB_TX0P AD7

SB_TX1N AD6

SB_TX1P AE6

SB_TX2N AC6

SB_TX2P AB6

SB_TX3N AE5

SB_TX3P AD5

STRP_DATA B10

SUS_STAT# D12

SYSRESET# D8

TESTMODE D13

THERMALDIODE_N AD8

THERMALDIODE_P AE8

TMDS_HPD D9

TXCLK_LN A16

TXCLK_LP B16

TXCLK_UN D17

Pin Name Ball Ref

TXCLK_UP D16

TXOUT_L0N B22

TXOUT_L0P A22

TXOUT_L1N B21

TXOUT_L1P A21

TXOUT_L2N A20

TXOUT_L2P B20

TXOUT_L3N B19

TXOUT_L3P A19

TXOUT_U0N A18

TXOUT_U0P B18

TXOUT_U1N B17

TXOUT_U1P A17

TXOUT_U2N D21

TXOUT_U2P D20

TXOUT_U3N D19

TXOUT_U3P D18

VDD_MEM AA11

VDD_MEM AB10

VDD_MEM AC10

VDD_MEM AD10

VDD_MEM AE10

VDD_MEM Y11

VDD18 F9

VDD18 G9

VDD18_MEM AD11

VDD18_MEM AE11

VDD33 H11

VDD33 H12

VDDA18HTPLL H17

VDDA18PCIE AA9

VDDA18PCIE AB9

VDDA18PCIE AD9

VDDA18PCIE AE9

VDDA18PCIE H9

VDDA18PCIE J10

VDDA18PCIE K10

VDDA18PCIE L10

VDDA18PCIE M10

VDDA18PCIE P10

VDDA18PCIE R10

VDDA18PCIE T10

VDDA18PCIE U10

VDDA18PCIE W9

Pin Name Ball Ref

VDDA18PCIE Y9

VDDA18PCIEPLL D7

VDDA18PCIEPLL E7

VDDC J11

VDDC J14

VDDC J16

VDDC K12

VDDC K15

VDDC L11

VDDC L14

VDDC M12

VDDC M13

VDDC M15

VDDC N12

VDDC N14

VDDC P11

VDDC P13

VDDC P14

VDDC R12

VDDC R15

VDDC T11

VDDC T14

VDDC T15

VDDC U12

VDDC U16

VDDHT J17

VDDHT K16

VDDHT L16

VDDHT M16

VDDHT P16

VDDHT R16

VDDHT T16

VDDHTRX A23

VDDHTRX B23

VDDHTRX D22

VDDHTRX E21

VDDHTRX F20

VDDHTRX G19

VDDHTRX H18

VDDHTTX AA21

VDDHTTX AB22

VDDHTTX AC23

VDDHTTX AD24

VDDHTTX AE25

Pin Listings

Pin Name Ball Ref

VDDHTTX M17

VDDHTTX P17

VDDHTTX R17

VDDHTTX T17

VDDHTTX U17

VDDHTTX V18

VDDHTTX W19

VDDHTTX Y20

VDDLT18 A15

VDDLT18 B15

VDDLT33 A14

VDDLT33 B14

VDDLTP18 A13

VDDPCIE A6

VDDPCIE B6

VDDPCIE C6

VDDPCIE D6

VDDPCIE E6

VDDPCIE F6

VDDPCIE G7

VDDPCIE H8

VDDPCIE J9

VDDPCIE K9

VDDPCIE L9

VDDPCIE M9

VDDPCIE P9

VDDPCIE R9

VDDPCIE T9

VDDPCIE U9

VDDPCIE V9

VSS AA14

VSS AB11

VSS AB15

VSS AB17

VSS AB19

VSS AB21

VSS AC12

VSS AE14

VSS AE20

VSS D11

VSS E14

VSS E15

VSS G8

VSS J12

Pin Name Ball Ref

VSS J15

VSS K11

VSS K14

VSS L12

VSS L15

VSS M11

VSS M14

VSS N13

VSS P12

VSS P15

VSS R11

VSS R14

VSS T12

VSS U11

VSS U14

VSS U15

VSS V12

VSS W11

VSS W15

VSS Y18

VSSAHT A25

VSSAHT AD25

VSSAHT D23

VSSAHT E22

VSSAHT G22

VSSAHT G24

VSSAHT G25

VSSAHT H19

VSSAHT H20

VSSAHT J22

VSSAHT L17

VSSAHT L22

VSSAHT L24

VSSAHT L25

VSSAHT M20

VSSAHT N22

VSSAHT P20

VSSAHT R19

VSSAHT R22

VSSAHT R24

VSSAHT R25

VSSAHT U22

VSSAHT V19

VSSAHT W22

Pin Name Ball Ref

VSSAHT W24

VSSAHT W25

VSSAHT Y21

VSSAPCIE A2

VSSAPCIE AA4

VSSAPCIE AB1

VSSAPCIE AB2

VSSAPCIE AB5

VSSAPCIE AB7

VSSAPCIE AC3

VSSAPCIE AC4

VSSAPCIE AE1

VSSAPCIE AE4

VSSAPCIE B1

VSSAPCIE D3

VSSAPCIE D5

VSSAPCIE E4

VSSAPCIE G1

VSSAPCIE G2

VSSAPCIE G4

VSSAPCIE H7

VSSAPCIE J4

VSSAPCIE L1

VSSAPCIE L2

VSSAPCIE L4

VSSAPCIE L7

VSSAPCIE M6

VSSAPCIE N4

VSSAPCIE P6

VSSAPCIE R1

VSSAPCIE R2

VSSAPCIE R4

VSSAPCIE R7

VSSAPCIE U4

VSSAPCIE V6

VSSAPCIE V7

VSSAPCIE V8

VSSAPCIE W1

VSSAPCIE W2

VSSAPCIE W4

VSSAPCIE W7

VSSAPCIE W8

VSSAPCIE Y6

VSSLT C14

Pin Listings

Pin Name Ball Ref

VSSLT C16

VSSLT C18

VSSLT C20

VSSLT C22

VSSLT D15

VSSLT E20

VSSLTP18 B13

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Pin Listings

AMD 780E Technical Reference Manual

Specifications and Main Features

Frequently Asked Questions

User Manual