AMD 780E Technical Reference Manual

AMD 780E

Databook

Technical Reference Manual

Rev. 3.10

P/N: 45732_rs780e_ds_pub

Please note that in this databook, references to "DVI" and "HDMI" refer to the capa bility of the TMDS interface, multiplexed on the PCI-E external graphics interface, to enable DVI or HDMI through passive enabling circuitries. Any statement in this databook on any DVI or HDMI-related functionality must be understood in that context.

Advanced Micro Devices, Inc., will not provide any indemnity, pay any royalty, nor provide any license/sublicense to any:

(a) Intellectual property rights relating to any of the following: (i) Macrovision for its Analog Protection System ("APS") technologies; (ii) Advanced Television Systems Committee (ATSC) standard and related technologies; or (iii) the High Definition Multimedia Interface (HDMI) standard and related technologies; or

(b) Audio and/or video codecs or any industry standard technology (e.g., technology or specifications promulgated by any standards development organization, consortium, trade association, special interest group or like entity).

This device is protected by U.S. patent numbers 5,583,936; 6,516,132; 6,836,5 49; and 7,050,698 and other intellectual property rights. The use of Macrovision's copy protection technology in the device must be authorized by Macrovision and is intended for home and other limited pay-per-view uses only, unless otherwise authorized in writing by Macrovision. Reverse engineering or disassembly is prohibited.

This device may only be sold or distributed to: (i) a Macrovision Authorized Buyer, (ii) a customer (PMA Customer) who has executed a Proprietary Materials Agreement (PMA) with Macrovision that is still in effect, (iii) a contract manufacturer approved by Macrovision to purchase this device on behalf of a Macrovision Authorized Buyer or a PMA Customer, or (iv) a distributor who has executed a Macrovision-specified distribution agreement with ATI.

Trademarks

AMD, the AMD Arrow logo, AMD Athlon, and combinations thereof, ATI, ATI logo, ATI Radeon, ATI Avivo, PowerPlay, PowerShift, PowerXpress, ATI HyperMemory, 3Dc, Cool'n'Quiet, AMD OverDrive, and AMD PowerNow! are trademarks of Advanced Micro Devices, Inc.

DisplayPort is a trademark of VESA.

HDMI, the HDMI Logo and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC.

HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.

C is a trademark of Philips.

Linux is a registered trademark of Linus Torvalds.

Macrovision is a registered trademark of Macrovision Corporation in the United States and/or other countries.

Microsoft, Windows, Windows Vista, DirectDraw, and DirectX are registered trademarks of Microsoft Corporation.

OpenGL is a registered trademark of SGI.

PCI Express is a registered trademark of PCI-SIG.

WinBench is a registered trademark of Ziff Davis, Inc.

Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

Disclaimer

The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel, or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD's Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

AMD's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD's product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice.

Table of Contents

Chapter 1: Overview

1.1 Introducing the AMD 780E ................................................................................................................................................1-1

1.2 RS780E Features.................................................................................................................................................................1-2

1.2.1 CPU HyperTransport™ Interface.........................................................................................................................1-2

1.2.2 Memory Interface .................................................................................................................................................1-2

1.2.3 ATI HyperMemory™...........................................................................................................................................1-2

1.2.4 PCI Express® Interface ........................................................................................................................................1-3

1.2.5 A-Link Express II Interface..................................................................................................................................1-4

1.2.6 2D Acceleration Features .....................................................................................................................................1-4

1.2.7 3D Acceleration Features .....................................................................................................................................1-4

1.2.8 Motion Video Acceleration Features....................................................................................................................1-5

1.2.9 Multiple Display Features ....................................................................................................................................1-5

1.2.10 Integrated LVDS/TMDS (LVTM) Interface ........................................................................................................1-7

1.2.11 DVI/HDMI™ .......................................................................................................................................................1-7

1.2.12 DisplayPort™ Interface........................................................................................................................................1-7

1.2.13 Integrated HD Audio Controller and Codec.........................................................................................................1-8

1.2.14 Clock Generation..................................................................................................................................................1-8

1.2.15 Power Management Features ...............................................................................................................................1-8

1.2.16 PC Design Guide Compliance..............................................................................................................................1-8

1.2.17 Test Capability Features .......................................................................................................................................1-9

1.2.18 Additional Features ..............................................................................................................................................1-9

1.2.19 Packaging .............................................................................................................................................................1-9

1.3 Software Features................................................................................................................................................................1-9

1.4 Branding Diagram.............................................................................................................................................................1-10

1.5 Graphics Device ID and Graphics Engine Clock Speed...................................................................................................1-10

1.6 Conventions and Notations ...............................................................................................................................................1-10

1.6.1 Pin Names...........................................................................................................................................................1-10

1.6.2 Pin Types ............................................................................................................................................................1-10

1.6.3 Numeric Representation .....................................................................................................................................1-11

1.6.4 Register Field......................................................................................................................................................1-11

1.6.5 Hyperlinks ..........................................................................................................................................................1-11

1.6.6 Acronyms and Abbreviations .............................................................................................................................1-11

Chapter 2: Functional Descriptions

2.1 Host Interface......................................................................................................................................................................2-1

2.2 Side-Port Memory Interface................................................................................................................................................2-3

2.2.1 DDR2 Memory Interface......................................................................................................................................2-3

2.2.1.1 Supported DDR2 Components 4

2.2.1.2 Row and Column Addressing 4

2.2.2 DDR3 Memory Interface......................................................................................................................................2-5

2.2.2.1 Supported DDR3 Components 5

2.2.2.2 Row and Column Addressing 5

2.3 LVTM (LVDS/TMDS) Interface........................................................................................................................................2-6

2.4 LVDS ..................................................................................................................................................................................2-7

2.4.1 LVDS Data Mapping............................................................................................................................................2-7

2.4.2 LVDS Spread Spectrum .....................................................................................................................................2-12

2.5 DVI/HDMI™....................................................................................................................................................................2-13

2.5.1 DVI/HDMI™ Data Transmission Order and Signal Mapping ..........................................................................2-13

Table of Contents

2.5.2 Support for HDMI™ Packet Types ................................................................................................................... 2-16

2.6 VGA DAC Characteristics ............................................................................................................................................... 2-17

2.7 DVI-I Support .................................................................................................................................................................. 2-18

2.8 Clock Generation.............................................................................................................................................................. 2-18

Chapter 3: Pin Descriptions and Strap Options

3.1 Pin Assignment Top View ................................................................................................................................................. 3-2

3.1.1 RS780E Pin Assignment Top View .................................................................................................................... 3-2

3.2 Interface Block Diagram .................................................................................................................................................... 3-4

3.3 CPU HyperTransport™ Interface ...................................................................................................................................... 3-5

3.4 Side-port Memory Interface............................................................................................................................................... 3-5

3.5 PCI Express® Interfaces .................................................................................................................................................... 3-6

3.5.1 1 x 16 or 2 x 8 Lane Interface for External Graphics .......................................................................................... 3-6

3.5.2 A-Link Express II Interface for Southbridge....................................................................................................... 3-6

3.5.3 6 x 1 Lane Interface for General Purpose External Devices .............................................................................. 3-6

3.5.4 Miscellaneous PCI Express® Signals ................................................................................................................. 3-6

3.6 Clock Interface ................................................................................................................................................................... 3-7

3.7 CRT Interface..................................................................................................................................................................... 3-7

3.8 LVTM Interface ................................................................................................................................................................. 3-8

3.8.1 LVTM Interface in LVDS Mode......................................................................................................................... 3-8

3.8.2 LVTM Interface in TMDS Mode ........................................................................................................................ 3-9

3.9 TMDS Interface Multiplexed on the PCI Express® Graphics Lanes .............................................................................. 3-10

3.10 DisplayPort™ Interface.................................................................................................................................................. 3-10

3.11 Power Management Pins................................................................................................................................................3-11

3.12 Miscellaneous Pins......................................................................................................................................................... 3-12

3.13 Power Pins...................................................................................................................................................................... 3-12

3.14 Ground Pins.................................................................................................................................................................... 3-13

3.15 Strapping Options........................................................................................................................................................... 3-14

Chapter 4: Timing Specifications

4.1 HyperTransportTM Bus Timing ........................................................................................................................................ 4-1

4.2 HyperTransportTM Reference Clock Timing Parameters ................................................................................................. 4-1

4.3 PCI Express® Differential Clock AC Specifications......................................................................................................... 4-2

4.4 Timing Requirements for REFCLK_P Used as OSCIN (14.3181818MHz) ..................................................................... 4-2

4.5 Side-port Memory Timing for DDR2 Mode...................................................................................................................... 4-2

4.5.1 Read Cycle DQ/DQS Delay ................................................................................................................................4-2

4.5.2 Write Cycle DQ/DQS Delay ............................................................................................................................... 4-3

4.6 LVDS Timing..................................................................................................................................................................... 4-3

4.7 Power Rail Power-up Sequence ......................................................................................................................................... 4-4

4.8 LCD Panel Power Up/Down Timing ................................................................................................................................. 4-5

Chapter 5: Electrical Characteristics and Physical Data

5.1 Electrical Characteristics.................................................................................................................................................... 5-1

5.1.1 Maximum and Minimum Ratings........................................................................................................................ 5-1

5.1.2 DC Characteristics............................................................................................................................................... 5-2

5.2 RS780E Thermal Characteristics ....................................................................................................................................... 5-7

5.2.1 RS780E Thermal Limits ...................................................................................................................................... 5-7

5.2.2 Thermal Diode Characteristics ............................................................................................................................ 5-8

Table of Contents

5.3 Package Information ...........................................................................................................................................................5-9

5.3.1 Physical Dimensions ............................................................................................................................................5-9

5.3.2 Pressure Specification ........................................................................................................................................5-10

5.3.3 Board Solder Reflow Process Recommendations ..............................................................................................5-11

5.3.3.1 Stencil Opening Size for Solder Paste Pads on PCB 11

5.3.3.2 Reflow Profile 11

Chapter 6: Power Management and ACPI

6.1 ACPI Power Management Implementation ........................................................................................................................6-1

6.2 Power Management for the Graphics Controller ................................................................................................................6-2

6.2.1 PCI Function Power States...................................................................................................................................6-2

6.2.2 PCI Power Management Interface........................................................................................................................6-2

6.2.3 Capabilities List Data Structure in PCI Configuration Space ..............................................................................6-2

6.2.4 Register Block Definition.....................................................................................................................................6-3

6.2.5 Capability Identifier: CAP_ID (Offset = 0) .........................................................................................................6-4

6.2.6 Next Item Pointer (Offset = 1) .............................................................................................................................6-5

6.2.7 PMC - Power Management Capabilities (Offset = 2) ..........................................................................................6-6

Chapter 7: Testability

7.1 Test Capability Features......................................................................................................................................................7-1

7.2 Test Interface.......................................................................................................................................................................7-1

7.3 XOR Test ............................................................................................................................................................................7-1

7.3.1 Description of a Generic XOR Tree.....................................................................................................................7-1

7.3.2 Description of the RS780E XOR Tree .................................................................................................................7-2

7.3.3 XOR Tree Activation ...........................................................................................................................................7-2

7.3.4 XOR Tree for the RS780E ...................................................................................................................................7-2

7.4 VOH/VOL Test...................................................................................................................................................................7-4

7.4.1 Description of a Generic VOH/VOL Tree ...........................................................................................................7-4

7.4.2 VOH/VOL Tree Activation..................................................................................................................................7-5

7.4.3 VOH/VOL Pin List...............................................................................................................................................7-6

Appendix A: Pin Listings

A.1 RS780E Pin List Sorted by Ball Reference........................................................................................................................1-2

A.2 RS780E Pin List Sorted by Pin Name................................................................................................................................1-7

Appendix B: Revision History

Table of Contents

This page is left blank intentionally.

List of Figures

Figure 1-1: Possible Configurations for the x16 PCI-E Graphics Interface .................................................................................. 1-3

Figure 1-2: RS780E Multiple Display Options .............................................................................................................................. 1-6

Figure 1-3: RS780E ASIC A13 Production Branding ................................................................................................................. 1-10

Figure 2-1: RS780E Internal Block Diagram ................................................................................................................................. 2-1

Figure 2-2: Host Interface Block Diagram ..................................................................................................................................... 2-2

Figure 2-3: RS780E Host Bus Interface Signals ............................................................................................................................ 2-3

Figure 2-4: RS780E Side-Port Memory Interface .......................................................................................................................... 2-4

Figure 2-5: LVTM Interface of the RS780E ................................................................................................................................. 2-6

Figure 2-6: Single/Dual Channel 18-bit LVDS Data Transmission Ordering ............................................................................... 2-7

Figure 2-7: Single/Dual Channel 24-bit LVDS Data Transmission Ordering ............................................................................. 2-10

Figure 2-8: Data Transmission Ordering for the TMDS Interfaces ............................................................................................. 2-13

Figure 2-9: Pins for Analog Output on the DVI-I Connector ...................................................................................................... 2-18

Figure 3-1: RS780E Pin Assignment Top View (Left) .................................................................................................................. 3-2

Figure 3-2: RS780E Pin Assignment Top View (Right) ................................................................................................................ 3-3

Figure 3-3: RS780E Interface Block Diagram ............................................................................................................................... 3-4

Figure 4-1: RS780E Power Rail Power-up Sequence .................................................................................................................... 4-4

Figure 4-2.: LCD Panel Power Up/Down Timing ......................................................................................................................... 4-5

Figure 5-1: DC Characteristics of the TMDS Interfaces ................................................................................................................ 5-5

Figure 5-2: DC Characteristics of the LVDS Interface .................................................................................................................. 5-6

Figure 5-1: RS780E 528-Pin FCBGA Package Outline ................................................................................................................ 5-9

Figure 5-2: RS780E Ball Arrangement (Bottom View) ............................................................................................................... 5-10

Figure 5-3: Recommended Stencil Opening Sizes for Solder Paste Pads on PCB ...................................................................... 5-11

Figure 5-4: RoHS/Lead-Free Solder (SAC305/405 Tin-Silver-Copper) Reflow Profile ............................................................ 5-12

Figure 6-1: Linked List for Capabilities ......................................................................................................................................... 6-5

Figure 7-1: Example of a Generic XOR Tree ................................................................................................................................7-2

Figure 7-2: Sample of a Generic VOH/VOL Tree ......................................................................................................................... 7-5

List of Figures

This page is left blank intentionally.

List of Tables

Table 1-1: Possible Configurations for the PCI-E General Purpose Links .....................................................................................1-3

Table 1-2: Graphics Device ID and Graphics Engine Clock Speed .............................................................................................1-10

Table 1-3: Pin Type Codes ............................................................................................................................................................1-10

Table 1-4: Acronyms and Abbreviations ......................................................................................................................................1-11

Table 2-1: Supported DDR2 Components ......................................................................................................................................2-4

Table 2-2: DDR2 Memory Row and Column Addressing ..............................................................................................................2-4

Table 2-3: Supported DDR3 Components ......................................................................................................................................2-5

Table 2-4: DDR3 Memory Row and Column Addressing ..............................................................................................................2-5

Table 2-5: LVDS 18-bit TFT Single Pixel per Clock (Single Channel) Signal Mapping ..............................................................2-8

Table 2-6: LVDS 18-bit TFT Dual Pixel per Clock (Dual Channel) Signal Mapping ...................................................................2-9

Table 2-7: LVDS 24-bit TFT Single Pixel per Clock (Single Channel) Signal Mapping ............................................................2-11

Table 2-8: LVDS 24-bit TFT Dual Pixel per Clock (Dual Channel) Signal Mapping .................................................................2-12

Table 2-9: Single Link Signal Mapping for DVI/HDMI™ .........................................................................................................2-14

Table 2-10: Dual-Link Signal Mapping for DVI ..........................................................................................................................2-15

Table 2-11: Support for HDMI™ Packet Type .............................................................................................................................2-16

Table 2-12: VGA DAC Characteristics ........................................................................................................................................2-17

Table 3-1: CPU HyperTransport™ Interface ..................................................................................................................................3-5

Table 3-2: Side-Port Memory Interface ..........................................................................................................................................3-5

Table 3-3: 1 x 16 or 2 x 8 Lane PCI Express® Interface for External Graphics ............................................................................3-6

Table 3-4: 1 x 4 Lane A-Link Express II Interface for Southbridge ...............................................................................................3-6

Table 3-5: 6 x 1 Lane PCI Express® Interface for General Purpose External Devices ..................................................................3-6

Table 3-6: PCI Express® Interface for Miscellaneous PCI Express® Signals ...............................................................................3-6

Table 3-7: Clock Interface ...............................................................................................................................................................3-7

Table 3-8: CRT Interface ................................................................................................................................................................3-7

Table 3-9: .......................................................................................................................................................................................3-8

Table 3-10: LVTM Interface in TMDS Mode ................................................................................................................................3-9

Table 3-11: TMDS Interface Multiplexed on the PCI Express® Graphics Interface ...................................................................3-10

Table 3-12: DisplayPort™ Interface Multiplexed on the PCI Express® Graphics Interface .......................................................3-11

Table 3-13: Power Management Pins ...........................................................................................................................................3-11

Table 3-14: Miscellaneous Pins ....................................................................................................................................................3-12

Table 3-15: Power Pins .................................................................................................................................................................3-12

Table 3-16: Ground Pins ...............................................................................................................................................................3-13

Table 3-17: Strap Definitions for the RS780E ..............................................................................................................................3-15

Table 4-1: Timing Requirements for HyperTransport Reference Clock (100MHz) Output by the Clock Generator ....................4-1

Table 4-2: PCI-E Differential Clock (GFX_REFCLK, GPPSB_REFCLK, 100MHz) AC Characteristics ...................................4-2

Table 4-3: Timing Requirements for REF_CLKP Used as OSCIN (14.3181818MHz) .................................................................4-2

Table 4-4: Timing Requirements for the LVTM Interface in LVDS Mode ...................................................................................4-3

Table 4-5: RS780E Power Rail Power-up Sequence ......................................................................................................................4-4

Table 4-6: LCD Power Up/Down Timing .......................................................................................................................................4-5

Table 5-1: Maximum and Minimum Ratings ..................................................................................................................................5-1

Table 5-2: DC Characteristics for 3.3V TTL Signals .....................................................................................................................5-2

Table 5-3: DC Characteristics for DDC Signals (DDC Mode) .......................................................................................................5-2

Table 5-4: DC Characteristics for AUX Signals (AUX Mode) ......................................................................................................5-2

Table 5-5: DC Characteristics for POWERGOOD .........................................................................................................................5-3

Table 5-6: DC Characteristics for HyperTransport™ and PCI-E Differential Clock (HT_REFCLK, GFX_REFCLK,

GPPSB_REFCLK, 100MHz) ..........................................................................................................................................................5-3

Table 5-7: DC Characteristics for REFCLK_P Input for OSCIN (14.3181818MHz) ....................................................................5-3

Table 5-8: DC Characteristics for the Memory Interface when Supporting DDR2 ........................................................................5-3

Table 5-9: DC Characteristics for the Memory Interface when Supporting DDR3 ........................................................................5-4

Table 5-10: DC Characteristics for the LVTM Interface in TMDS Mode .....................................................................................5-4

Table 5-11: DC Characteristics for the TMDS Interface Multiplexed on the PCI-E Gfx Lanes ....................................................5-5

Table 5-12: Electrical Requirements for the LVTM Interface in LVDS Mode ..............................................................................5-6

List of Tables

Table 5-13: Electrical Specifications for the DisplayPort™ Interface ...........................................................................................5-7

Table 5-14: RS780E Thermal Limits ..............................................................................................................................................5-7

Table 5-15: RS780E 528-Pin FCBGA Package Physical Dimensions ...........................................................................................5-9

Table 5-16: Recommended Board Solder Reflow Profile - RoHS/Lead-Free Solder ..................................................................5-12

Table 6-1: ACPI States Supported by the RS780E .........................................................................................................................6-1

Table 6-2: ACPI Signal Definitions ................................................................................................................................................6-1

Table 6-3: Standard PCI Configuration Space Header Type 0 .......................................................................................................6-2

Table 6-4: PCI Status Register ........................................................................................................................................................6-3

Table 6-5: Capabilities Pointer (CAP_PTR) ...................................................................................................................................6-3

Table 6-6: Power Management Register Block ..............................................................................................................................6-3

Table 6-7: Power Management Control/Status Register (PMCSR) ................................................................................................6-4

Table 6-8: Capability Identifier (CAP_ID) .....................................................................................................................................6-4

Table 6-9: Next Item Pointer (NEXT_ITEM_PTR) .......................................................................................................................6-5

Table 6-10: Power Management Capabilities – PMC .....................................................................................................................6-6

Table 7-1: Pins on the Test Interface ..............................................................................................................................................7-1

Table 7-2: Example of an XOR Tree ..............................................................................................................................................7-2

Table 7-3: RS780E XOR Tree ........................................................................................................................................................7-3

Table 7-4: Truth Table for the VOH/VOL Tree Outputs ................................................................................................................7-5

Table 7-5: RS780E VOH/VOL Tree ...............................................................................................................................................7-7

1.1 Introducing the AMD 780E

Chapter 1

Overview

The AMD 780E (referred to in this document by its codenmae “RS780E”) is an eighth generation Integrated Graphics Processor (IGP) that integrates a DirectX single chip. It supports AMD Athlon™ single-core and AMD Athlon X2 dual-core processors, AMD Sempron™ processors, and AMD Turion™ 64 X2 dual-core mobile technology. The RS780E integrates an ATI M72-based graphics engine, dual display, an LVDS interface, internal or external TMDS, DisplayPort™ capability, and Northbridge functionality in a single BGA package. This high level of integration and scalability enables manufacturers to offer enthusiast level capabilities and performance while minimizing board space and system cost.

Robust and Flexible Core Logic Features

The RS780E combines graphics and system logic functions in a single chip using a 21mm body BGA package, reducing overall solution area. For optimal system and graphics performance, the RS780E supports a high speed HyperTransport™ interface to the AMD processor, running at a data rate of up to 4.4GT/s and supporting both HT 1.0 and HT 3.0 protocols. The RS780E is ideally suited for 64-bit operating systems, and supports platform configurations with greater than 4GB of system memory. The rich PCI Express Express external graphics controllers and up to six other PCI Express peripherals (up to seven when using only 8 lanes for external graphics, or up to eight when not using external graphics), all supporting the PCI Express 2.0 standard with data rates of up to 5.0GT/s. These capabilities are complemented by the advanced I/O features of AMD’s SB710 Southbridge.

Best for Windows Vista

The RS780E delivers an unmatched Windows Vista® experience. It harnesses the increased bandwidth of HyperTransport

3.0 to a DirectX 10 graphics core, which provides the 3D rendering power needed to generate the Windows Vista desktop even under the most demanding circumstances. The ATI M72-based graphics core employs a unified shader architecture to deliver optimal 3D performance across the whole spectrum of 3D applications. This future-proof core ensures compatibility with both current and upcoming 3D applications, and meets Windows Vista Premium Logo requirements through 2008 and beyond.

10 compliant Shader Model 4.0 graphics core and a system controller in a

expansion capabilities of RS780E include support for one x16 or two x8 PCI

Leading Multimedia Capabilities

The RS780E incorporates AMD’s Unified Video Decoder (UVD) technology, which provides dedicated hardware decode of the H.264, VC-1, and MPEG-2 video formats used in HD DVD and for Blu-ray disks. The RS780E also incorporates the innovative ATI Avivo™* display architecture, providing users with visual quality which is second to none. Advanced scaling and color correction capabilities, along with increased precision through the entire display pipeline, ensure an optimal image on CRT monitors, LCD panels, and any other display device. Dual DisplayPort output capability provides the ability to interface to the next generation of digital display devices. That is complemented by two integrated TMDS interfaces, configurable to enable DVI/HDMI™ and support HDCP, allowing compatibility with even the most modern high definition televisions without the additional cost of external components.

*Note: ATI Avivo™ is a technology platform that includes a broad set of capabilities offered by certain ATI Radeon™ products. Full enablement of some ATI Avivo™ capabilities may require complementary products.

Low Power Consumption and Industry Leading Power Management

The RS780E is manufactured using the power efficient nm technology, and it supports a whole range of industry standards and new proprietary power management features. In addition to comprehensive support for the ACPI specification, the exclusive ATI PowerPlay™ technology (enhanced with new adaptive frame buffer compression and ATI PowerShift™ features) minimizes the RS780E's power consumption by adjusting graphics core performance and core voltage to the task and usage environment. System power can be further reduced through the dedicated local frame buffer interface supported by the RS780E. The integrated UVD dramatically reduces CPU loading and hence overall power consumption during HD video playback.

Software Compatibility

The graphics driver for the RS780E is fully compatible with all other Radeon class graphics controllers from AMD. A single driver can support multiple graphics configurations across AMD’s product lines, including the Radeon family and the AMD chipset family. In addition, this driver compatibility allows the RS780E to benefit immediately from AMD's software optimization and from the advanced Windows Radeon family drivers.

1.2 RS780E Features

1.2.1 CPU HyperTransport™ Interface

•

Supports 16-bit up/down HyperTransport (HT) 3.0 interface up to 4.4GT/s.

• Supports 200, 400, 600, 800, and 1000MHz HT1 frequencies.

• Supports 1.8, 2.0, and 2.2 GHz HT3 frequencies.

• Supports AMD Athlon single-core and AMD Athlon X2 dual-core processors, AMD Sempron processors, and AMD

Turion 64 X2 dual-core mobile technology.

• Supports power saving features as specified in section 8.6.1 of the HyperTransport I/O Link Specification Rev 3.00a,

including:

• Dynamic link configuration

• Dynamic link disconnection

RS780E Features

XP, Windows Vista®, and Linux® support available in the

• Dynamic link width

• Dynamic link frequency

• Disconnected link refresh (HT3 only)

• Inactive link refresh (HT3 only)

• Supports LDTSTOP interface and CPU link frequency throttling and stutter mode.

1.2.2 Memory Interface

•

Supports an optional dedicated local frame buffer (side-port) of up to 128MB through a 16-bit interface. Note, however, that the memory interface is optimized for a 64MB local frame buffer.

• New highly flexible memory architecture allows asymmetric side-port and shared system memory frame buffer sizes.

Supported configurations include UMA only and UMA+side-port (interleave mode).

• New dynamic memory allocation scheme improves performance and reduces power simultaneously.

• Support for DDR2 memories up to DDR2-800, with a maximum memory clock speed of 400MHz. Memory clock is

independent of any other clock source and can therefore be set to any frequency equal to or less than 400MHz (DDR2-800), allowing the use of lower speed side-port memories.

• Support for DDR3 memories up to DDR3-800, with a maximum memory clock speed of 400MHz (up to

DDR3-1200, with a maximum memory clock speed of 600MHz, when the core voltage is fixed at 1.1V). Memory clock is independent of any other clock source and can therefore be set to any frequency equal to or less than the maximum limit, allowing the use of lower speed side-port memories.

• Support one memory device of x16 width (see section 2.2.1.1, “Supported DDR2 Components,” on page 2-4.and

section 2.2.2.1, “Supported DDR3 Components,” on page 2-5, for details).

• Asynchronous HyperTransport and memory controller interface speeds.

• Supports DDR SDRAM self refresh mechanism.

• Supports dynamic CKE and ODT for power conservation.

1.2.3 ATI HyperMemory™

• Supports ATI HyperMemory™*.

RS780E Features

01 32 456789101112131415

PCI-E x16

PCI-E x 8 External Graphics

DL-DVI

PCI-E x 16 External Graphics

TMDS enabling Dual- Link

DVI(DL-DVI)

LEGEND

Not Used

TMDS enabling Single- Link

DVI(SL-DVI)

DisplayPort (DP)

TMDS enabling HDMI

PCI-E x 16 Interface

HDMI

SL-DVI

Not Used

SL-DVI Not Used

HDMI Not Used

DP Not Used

DL-DVI

PCI-E x 8

SL-DVIHDMI

PCI-E x 8

DPDP

HDMI Not Used

DP Not Used

SL-DVI Not Used

PCI-E x 8

DP Not Used

HDMI

PCI-E x 8 PCI-E x 8

* Note: Includes dedicated and shared memory. The amount of HyperMemory available is determined by various factors. For details, please consult your AMD CSS representative.

1.2.4 PCI Express® Interface

Supports PCI-E Gen2 (version 2.0).

•

• Optimized peer-to-peer and general purpose link performance.

• Highly flexible PCI Express implementation to suit a variety of platform needs.

• A dual-port, x16 graphics interface, configurable to any one of the modes illustrated in Figure 1-1:

• Supports programmable lane reversal for the graphics link to ease motherboard layout when the end device does not

support lane reversal.

• Supports six general purpose lanes, for up to six devices on specific ports. Possible configurations are listed in

Table 1-1.

Table 1-1 Possible Configurations for the PCI-E General Purpose Links

GPP1 x4 x4 x2 x2 x2 x1

GPP2-----x1

GPP3 - - x2 x1 x2 x1

GPP4---x1-x1

GPP5 x2 x1 x2 x1 x1 x1

GPP6 - x1 - x1 x1 x1

Figure 1-1 Possible Configurations for the x16 PCI-E Graphics Interface

Config. B Config. C Config. C2 Config. E Config. K Config. L

• Supports x1, x2, x4, x8, x12 and x16 polarity inversion.

1.2.5 A-Link Express II Interface

One x4 A-Link Express II interface for connection to an AMD Southbridge. The A-Link Express II is a proprietary

•

interface developed by AMD basing on the PCI Express Gen2 version 2.0 technology, with additional Northbridge-Southbridge messaging functionalities.

• Supports programmable lane reversal to ease motherboard layout.

1.2.6 2D Acceleration Features

•

Highly-optimized 128-bit engine, capable of processing multiple pixels per clock.

• Hardware acceleration of Bitblt, line drawing, polygon and rectangle fills, bit masking, monochrome expansion,

panning and scrolling, scissoring, and full ROP support (including ROP3).

• Optimized handling of fonts and text using AMD proprietary techniques.

• Game acceleration including support for Microsoft's DirectDraw

Blit, and Masked Blit.

• Acceleration in 1/8/15/16/32-bpp modes:

• Pseudocolor mode for 8bpp

• ARGB1555 and RGB565 modes for 16bpp

• ARGB8888 mode for 32bpp

• Significant increase in the High-End Graphics WinBench

• Setup of 2D polygons and lines.

• Support for GDI extensions:

• In Windows XP and Windows Vista: Alpha BLT, Transparent BLT, and Gradient Fill.

RS780E Features

: Double Buffering, Virtual Sprites, Transparent

score due to capability for C18 color expansion.

• In Windows 7: Alpha BLT, Transparent BLT, Color Fill BLT, Stretch BLT, and Clear Type BLT.

• Hardware cursor (up to 64x64x32bpp), with alpha channel for direct support of Windows XP, Windows Vista

and Windows 7 alpha cursor.

1.2.7 3D Acceleration Features

•

Fully DirectX 10.0 compliant, including full speed 32-bit floating point per component operations

• Shader Model 4.0 geometry and pixel support in a unified shader architecture:

• Full speed 32-bit floating point processing per component.

• High dynamic range rendering with floating point blending, texture filtering and anti-aliasing support.

• High performance dynamic branching and flow control.

• Nearly unlimited shader instruction store, using an advance caching system.

• Advanced shader design, with ultra-threading sequencer for high efficiency operations.

• Advanced, high performance branching support, including static and dynamic branching.

• 32-bit floating point components for high dynamic range computations.

• Full anti-aliasing on render surfaces up to and including 128-bit floating point formats.

• Support for OpenGL

2.0

• Anti-Aliasing Filtering:

• 2x/4x/8x modes.

• Sparse multi-sample algorithm with gamma correction, programmable sample patterns, and centroid sampling.

• Temporal anti-aliasing.

• Adaptive anti-aliasing mode.

• Lossless color compression (up to 8:1) at all resolutions, up to and including widescreen HDTV.

• Anisotropic Filtering:

RS780E Features

• 2x/4x/8x/16x modes

• Up to 128-tap texture filtering.

• Adaptive algorithm with performance (bi-linear) and quality (tri-linear) options.

• Improved quality mode due to improved subpixel precision, higher precision LOD computations, and

• Advanced Texture Compression (3Dc+™ ):

• High quality 4:1 compression for normal maps and luminance maps.

• Works with any single-channel or two-channel data format.

• HW support to overcome "Small batch" issues in CPU limited applications.

• 3D resources virtualized to a 32-bit addressing space, for support of large numbers of render targets and textures.

• New vertex cache and vertex fetch design, to increase vertex throughput from previous generations.

• Full support of 64-bit and 128-bit textures and surfaces, which can be 4x to 8x faster than previous generation of HW.

• Up to 8K x 8K textures, including 128 bpp texture are supported.

• New multi-level texture cache to give optimal performance, greater than 8x the previous designs.

• High efficiency ring bus memory controller:

• Programmable arbitration logic maximizes memory efficiency, software upgradeable.

• Fully associative texture, color, and Z cache design.

• New hierarchical Z and stencil buffers with early Z Test.

• New lossless Z-buffer compression for both Z and stencil.

• Fast Z-Buffer Clear.

• Z cache optimized for real-time shadow rendering.

• Z and color compression resources virtualized to a 32-bit addressing space, for support of multiple render targets

rotationally invariant LOD computations.

and textures simultaneously.

1.2.8 Motion Video Acceleration Features

Video scaling and fully programmable YCrCb to RGB color space conversion for full-speed video playback and fully

•

adjustable color controls.

• Adaptive de-interlacing eliminates video artifacts caused by displaying interlaced video on non-interlaced displays,

and by analyzing image and using optimal de-interlacing function on a per-pixel basis.

• Motion video acceleration for HD DVD/Blu-ray technology.

• Dedicated UVD (Unified Video Decoder) hardware for H.264,VC-1, and MPEG-2 decode:

• H.264 implementation is based on the ISO/IEC 14496-10 spec.

• VC-1 implementation is based on the SMPTE 421M spec.

1.2.9 Multiple Display Features

General

• Dual independent displays. Possible configurations are illustrated in Figure 1-2.

RS780E Features

Figure 1-2 RS780E Multiple Display Options

• Resolution, refresh rates, and display data can be completely independent for the two display paths.

• Each display controller supports true 30 bits per pixel throughout the display pipe.

• Each display path supports VGA and accelerated modes, video overlay, hardware cursor, hardware icon, and palette

gamma correction.

• Supports both interlaced and non-interlaced displays.

• Full ratiometric expansion ability is supported for source desktop modes up to 1920 pixels/line.

• Maximum DAC frequency of 400 MHz.

• Supports 8, 16, 32, and 64-bpp depths for the main graphics layer:

• For 32-bpp depth, supports xRGB 8:8:8:8, xRGB 2:10:10:10, sCrYCb 8:8:8:8, and xCrYCb 2:10:10:10 data

formats.

• For 64-bpp depth, supports xRGB 16:16:16:16 data format.

• Independent gamma, color conversion and correction controls for main graphics layer.

• Support for DDC1 and DDC2B+ for plug and play monitors.

• 8-bit alpha blending of graphics and video overlay.

• Hardware cursor up to 64x64 pixels in 2 bpp, full color AND/XOR mix, and full color 8-bit alpha blend.

• Hardware icon up to 128x128 pixels in 2 bpp, with two colors, transparent, and inverse transparent. AND/XOR

mixing. Supports 2x2 icon magnification.

• Virtual desktop support.

• Support for flat panel displays via VGA.

• Configurable to support flat panel displays or TVs via DVI/HDMI.

• Integrated HD audio controller for HDMI audio data.

RS780E Features

VGA Output

• Maximum resolutions supported by the VGA output for different refresh rates are:

• 2048x1536 @85Hz (pixel clock at 388.5MHz) for 4:3 format

• 2560x1440 @75Hz (pixel clock at 397.25MHz) for 16:9 format

• 2456x1536 @60Hz (pixel clock at 320MHz) for 16:10 format

1.2.10 Integrated LVDS/TMDS (LVTM) Interface

Configurable to output either LVDS or TMDS signals.

•

• LVDS mode:

• Integrated dual-link 18-/24-bit LVDS interface.

• 805 Mbps/channel with 115 MHz pixel clock rate per link (230 MHz maximum pixel clock).

• FPDI-2 compliant; compatible with receivers from National Semiconductor, Texas Instruments, and THine.

• OpenLDI compliant excluding DC balancing.

• Programmable internal spread spectrum controller for the signals.

• TMDS Mode, enabling DVI or HDMI™:

• See Section 1.2.11, “DVI/HDMI™,” for details.

1.2.11 DVI/HDMI™

• Supports two TMDS interfaces, one multiplexed on the PCI-E graphics interface and the other on the LVTM

interface, enabling DVI or HDMI™*

• 1620 Mbps/channel with 162 MHz pixel clock rate per link.

• Supports industry standard EIA-861B video modes including 480p, 720p, 1080i, and 1080p (for a full list of currently

supported modes, contact you AMD CSS representative). Maximum resolutions supported by various modes are:

• Single-link DVI: 1600x1200 @60Hz with standard timings, and 1920x1200 @60Hz with reduced blanking

timings.

• Dual-link DVI: 2560x1600 @60Hz.

• HDMI: 1080p.

• Supports YCbCr 4:4:4 and 4:2:2 modes with HDMI.

• HDMI basic audio support at 32, 44.1 or 48 kHz. Supports two-channel uncompressed audio data, and, for Windows

Vista platforms only, 5.1-channel audio data and DTS. HD audio device compatible with the Microsoft HD audio driver.

• HDCP support for two independent display streams with on-chip key storage. Also available when the TMDS

interfaces run in dual-link mode.**

Notes: * HDMI must only be enabled on systems that are legally entitled. It is the responsibility of the system designer to

ensure that the system is entitled to support this feature.

CEC is not supported.

‡ The TMDS interface multiplexed on the PCI-E graphics lanes cannot enable HDMI when the LVTM interface is

enabling HDMI, and vice versa.

(passing HDMI CTS v1.3b). ‡

** HDCP content protection is only available to licensed buyers of the technology and can only be enabled when connected to an HDCP-capable receiver.

1.2.12 DisplayPort™ Interface

•

Supports all mandatory features of DisplayPort™ Standard, Version 1.1, plus the following optional features:

• 10-bit support.

• YCbCr 4:4:4 and 4:2:2 support.

• HDCP support

• Optional test pattern support.

• Supports two independent displays over the PCI-E interface for external graphics (see Figure 1-1,“Possible

Configurations for the x16 PCI-E Graphics Interface,” on page 1-3 for details).

• Supports 4, 2, or 1-lane transmission.

• Supports both the 2.7Gbps and 1.62Gbps link symbol rates.

• Supports the Auxiliary Channel (AUX CH).

• Supports a maximum resolution of 2560x1600 @60Hz with 4 lanes.

1.2.13 Integrated HD Audio Controller and Codec

•

Integrated HD Audio codec supports linear PCM and AC3 (5.1) audio formats for HDMI output.

• Separate logical chip function.

• Can encrypt data onto one associated HDMI output.

• Uses Microsoft UAA driver.

• Internally connected to the integrated HDMI, or HDMI-enabled interface, hence no external cable required.

• Support for basic audio (32, 44.1 or 48 KHz stereo) and AC3 or DTS at the same sample rates.

RS780E Features

1.2.14 Clock Generation

Support for an external clock chip to generate side-port memory, PCI-E, and A-Link Express II clocks.

•

1.2.15 Power Management Features

•

Single chip solution in 55nm, 1.1V CMOS technology.

• Supports ACPI 2.0 for S0, S3, S4, and S5 states.

• Full IAPC (Instantly Available PC) power management support.

• Static and dynamic power management support (APM as well as ACPI) with full VESA DPM and Energy Star

compliance.

• The Chip Power Management Support logic supports four device power states defined for the OnNow Architecture—

On, Standby, Suspend, and Off. Each power state can be achieved by software control bits.

• Hardware controlled intelligent clock gating enables clocks only to active functional blocks, and is completely

transparent to software.

• Dynamic self-refresh for the side-port memory.

• Support for Cool'n'Quiet™ via FID/VID change.

• Support for AMD PowerNow!™.

• Clocks to every major functional block are controlled by a unique dynamic clock switching technique that is

completely transparent to the software. By turning off the clock to the block that is idle or not used at that point, the power consumption is significantly reduced during normal operation.

• Supports PowerExpress™ and PowerPlay™ (enhanced with the PowerShift™ feature).

• Supports dynamic lane reduction for the PCI-E graphics interface when coupled with an AMD-based graphics

device, adjusting lane width according to required bandwidth.

1.2.16 PC Design Guide Compliance

The RS780E complies with all relevant Windows Logo Program (WLP) requirements from Microsoft for WHQL certification.

Software Features

1.2.17 Test Capability Features

The RS780E has a variety of test modes and capabilities that provide a very high fault coverage and low DPM (Defect Per Million) ratio:

• Full scan implementation on the digital core logic through ATPG (Automatic Test Pattern Generation Vectors).

• Dedicated test logic for the on-chip custom memory macros to provide complete coverage on these modules.

• A JTAG test mode to allow board level testing of neighboring devices.

• An EXOR tree test mode on all the digital I/O's to allow for proper soldering verification at the board level.

• A VOH/VOL test mode on all digital I/O’s to allow for proper verification of output high and output low values at the

board level.

• Access to the analog modules to allow full evaluation and characterization.

• IDDQ mode support to allow chip evaluation through current leakage measurements.

These test modes can be accessed through the settings on the instruction register of the JTAG circuitry.

1.2.18 Additional Features

•

Integrated spread spectrum PLLs on the memory and LVDS interface.

1.2.19 Packaging

Single chip solution in 55nm, 1.1V low power CMOS technology.

•

• 528-FCBGA package, 21mmx21mm.

1.3 Software Features

• BIOS ability to read EDID 1.1, 1.2, and 1.3.

• Ability to selectively enable and disable several devices including CRT, LCD, and DFP.

• Register-compatible with VGA standards, BIOS-compatible with VESA VBE2.0.

• Supports corporate manageability requirements such as DMI.

• ACPI support.

• Full Write Combining support for maximum performance of the CPU.

• Full-featured, yet simple Windows utilities:

• Calibration utility for WYSIWYG color

• Independent brightness control of desktop and overlay

• End user diagnostics

• Drivers meet Microsoft's rigorous WHQL criteria and are suitable for systems with the "Designed for Windows"

logos.

• Comprehensive OS and API support.

• Hot-key support (Windows ACPI 2.0 or AMD Event Handler Utility where appropriate).

• Extensive power management support.

• Rotation mode support in software.

• Dual CRTC, simultaneous view, extended desktop support (Windows XP and Windows Vista)

• DirectX 10.0 support.

• Switchable overlay support.

• H.264 playback support.

• Supports AMD OverDrive™ utility*.

RADEON IGP YYWW MADE IN TAIWAN WXXXXX 216-0674040

* YY - Assembly Start Year WW - Assembly Start Week

Part Number

Date Code*

AMD Product Type

AMD Logo

Wafer Lot Number

Country of Origin

*Note: AMD’s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via the AMD OverDrive utility.

1.4 Branding Diagram

Branding Diagram

Figure 1-3 RS780E ASIC A13 Production Branding

1.5 Graphics Device ID and Graphics Engine Clock Speed

Table 1-2 Graphics Device ID and Graphics Engine Clock Speed

Variant

RS780E 0x9615 200 500

Graphics Device ID

Graphics Engine Clock Speed (MHz)

Min. Max.

1.6 Conventions and Notations

The following conventions are used throughout this manual.

1.6.1 Pin Names

Pins are identified by their pin names or ball references. Multiplexed pins sometimes assume alternate “functional names” when they perform their alternate functions, and these “functional names” are given in Chapter 3, “Pin Descriptions and

Strap Options.”

All active-low signals are identified by the suffix ‘#’ in their names (e.g., MEM_RAS#).

1.6.2 Pin Types

The pins are assigned different codes according to their operational characteristics. These codes are listed in Table 1-3.

Table 1-3 Pin Type Codes

Code Pin Type

I Digital Input

O Digital Output

OD Open Drain

I/O Bi-Directional Digital Input or Output

I/OD Digital Input or Open Drain

M Multifunctional

Conventions and Notations

Table 1-3 Pin Type Codes (Continued)

Code Pin Type

Pwr Power

Gnd Ground

A-O Analog Output

A-I Analog Input

A-I/O Analog Bi-Directional Input/Output

A-Pwr Analog Power

A-Gnd Analog Ground

Other Pin types not included in any of the categories above

1.6.3 Numeric Representation

Hexadecimal numbers are appended with “h” (Intel assembly-style notation) whenever there is a risk of ambiguity. Other numbers are in decimal.

Pins of identical functions but different running integers (e.g., “GFX_TX7P, GFX_TX6P,... GFX_TX0P”) are referred to collectively by specifying their integers in square brackets and with colons (i.e., “GFX_TX[7:0]P”). A similar short-hand notation is used to indicate bit occupation in a register. For example, NB_COMMAND[15:10] refers to the bit positions 10 through 15 of the NB_COMMAND register.

1.6.4 Register Field

A field of a register is referred to by the format of [Register Name].[Register.Field]. For example, “NB_MC_CNTL.DISABLE_BYPASS” is the “DISABLE_BYPASS” field of the register “NB_MC_CNTL.”

1.6.5 Hyperlinks

Phrases or sentences in blue italic font are hyperlinks to other parts of the manual. Users of the PDF version of this manual can click on the links to go directly to the referenced sections, tables, or figures.

1.6.6 Acronyms and Abbreviations

The following is a list of the acronyms and abbreviations used in this manual.

Table 1-4 Acronyms and Abbreviations

Acronym Full Expression

ACPI Advanced Configuration and Power Interface

A-Link-E II A-Link Express II interface between the IGP and the Southbridge.

BGA Ball Grid Array

BIOS

BIST Built In Self Test.

BLT Blit

bpp bits per pixel

CEC Consumer Electronic Control

CPIS Common Panel Interface Specification

CRT Cathode Ray Tube

CSP Chip Scale Package

DAC Digital to Analog Converter

DBI Dynamic Bus Inversion

DDC

DDR Double Data Rate

Basic Input Output System. Initialization code stored in a ROM or Flash RAM used to start up a system or expansion card.

Display Data Channel. A VESA standard for communicating between a computer system and attached display devices.

Table 1-4 Acronyms and Abbreviations (Continued)

Acronym Full Expression

DFP Digital Flat Panel. Monitor connection standard from VESA.

DPM Defects per Million

DTV Digital TV

DVD Digital Video Disc

DVI

DVS Digital Video Stream

EPROM Erasable Programmable Read Only Memory

FIFO First In, First Out

FPDI Flat Panel Display Interface

GDI Graphics Device Interface

GND Ground

GPIO General Purpose Input/Output

HDCP High-Bandwidth Digital Content Protection

HDMI High Definition Multimedia Interface

HDTV High Definition TV. The 1920x1080 and the 1280x720 modes defined by ATSC.

HPD Hot Plug Detect

iDCT inverse Discrete Cosine Transform

IDDQ Direct Drain Quiescent Current

IGP

JTAG Joint Test Access Group. An IEEE standard.

LVDS Low Voltage Differential Signaling

MB Mega Byte

MPEG

NTSC

PAL Phase Alternate Line. The standard definition TV system used in Europe and other areas.

PCI Peripheral Component Interface

PCI-E PCI Express

PCMCIA

PLL Phase Locked Loop

POST Power On Self Test

PD Pull-down Resistor

PU Pull-up Resistor

ROP Raster Operation

SDRAM Synchronous Dynamic RAM

TMDS Transition Minimized Differential Signaling

UMA Unified Memory Architecture

UV Chrominance (also CrCb). Corresponds to the color of a pixel.

UVD Unified Video Decoder

UXGA Ultra Extended Graphics Array

VBI Vertical Blank Interval

VESA Video Electronics Standards Association

VGA Video Graphics Adapter

VRM Voltage Regulation Module

Digital Video Interface. Monitor connection standard from the DDWG (Digital Display Work Group).

Integrated Graphics Processor. A single device that integrates a graphics processor and a system controller.

Motion Pictures Experts Group. Refers to compressed video image streams in either MPEG-1 or MPEG-2 formats.

National Television Standards Committee. The standard definition TV system used in North America and other areas.

Personal Computer Memory Card International Association. It is also the name of a standard for PC peripherals promoted by the Association.

Conventions and Notations

Chapter 2

HyperTransport™

Unit

CPU

Interface

UVD

Setup

Engine2DEngine

Engine

Overlay

Root

MUX

Display 1& 2

CRT

Memory Controller

AMD CPU

Bus Interface

Complex

Optional 16-bit

DDR2/DDR3

Memory Channel

TMDS, enabling DVI/HDMI™

External

Graphics

A-Link-E II

Gfx Interface*

PCI-E

Interface

(1x16 or 2x8

GPP Interface

PCI-E

(6 x 1 Lanes)

Expansion

Slots or

On-board

Devices

(1 x 4 Lanes)

DisplayPort™

(Multiplexed on PCI-E Gfx Lanes)

LVDS

TMDS, supporting DVI/HDMI

(Multiplexed on the LVTM interface)

Lanes)

Functional Descriptions

This chapter describes the functional operation of the major interfaces of the RS780E system logic. Figure 2-1, “RS780E

Internal Block Diagram,” illustrates the RS780E internal blocks and interfaces.

2.1 Host Interface

The RS780E is optimized to interface with AMD processors through the HyperTransport presents an overview of the HyperTransport

Figure 2-1 RS780E Internal Block Diagram

interface. For a detailed description of the interface, please refer to the

interface. This section

Host Interface

HT Interface to CPU (PHY)

Configuration

Registers

Root Complex

Memory Controller

LTA

LRA

SCH

Data Link Layer

Protocol/Transaction Layer

HyperTransport I/O Link Specification from the HyperTransport Consortium. Figure 2-2, “Host Interface Block

Diagram,” illustrates the basic blocks of the host bus interface of the RS780E.

Figure 2-2 Host Interface Block Diagram

The HyperTransport (HT) Interface, formerly known as the LDT (Lightning Data Transport) interface, is a high speed, packet-based link implemented on two unidirectional buses. It is a point-to-point interface where data can flow both upstream and downstream at the same time. The commands, addresses, and data travel in packets on the HyperTransport link. Lengths of packets are in multiples of four bytes. The HT link consists of three parts: the physical layer (PHY), the data link layer, and the protocol/transaction layer. The PHY is the physical interface between the RS780E and the CPU. The data link layer includes the initialization and configuration sequences, periodic redundancy checks, connect/disconnect sequences, and information packet flow controls. The protocol layer is responsible for maintaining strict ordering rules defined by the HT protocol.

The RS780E HyperTransport bus interface consists of eighteen unidirectional differential data/control pairs and two differential clock pairs in each of the upstream and downstream direction. On power up, the HT link is 8-bit wide and runs at a default speed of 400MT/s. After negotiation, carried out by the HW and SW together, the link width can be brought up to 16-bit and the interface can run up to 4.4GT/s. The interface is illustrated in Figure 2-3, “RS780E Host Bus

Interface Signals.” The signal name and direction for each signal is shown with respect to the processor. Note that the

signal names may be different from those used in the pin listing of the RS780E. Detailed descriptions of the signals are given in section 3.3, “CPU HyperTransport™ Interface‚’ on page 3-5.

Side-Port Memory Interface

HT_RXCADN

RS780E

CPU

HT_TXCALP

HT_RXCALN

HT_RXCALP

HT_TXCALN

HT_RXCADP

HT_RXCTLN

HT_RXCTLP

HT_RXCLKN

HT_RXCLKP

HT_TXCADN

HT_TXCADP

HT_TXCTLN

HT_TXCTLP

HT_TXCLKN

HT_TXCLKP

Figure 2-3 RS780E Host Bus Interface Signals

2.2 Side-Port Memory Interface

In order to significantly decrease system power and increase graphics performance, the RS780E provides an optional side-port memory interface for dedicated frame buffer memory, to be used exclusively for the integrated graphics core. The side-port memory interface can significantly reduce system power by allowing the CPU to stay in its lowest power state during periods of inactivity. Screen refreshes are fetched from the side-port memory, and there is no need to "wake up" the CPU to fetch screen refresh data.

The RS780E memory controller is unique and highly optimized. It operates in 16-bit mode at very high speed (up to DDR2-800 and DDR3-800, and up to DDR3-1200 when the core voltage is fixed at 1.1V), and has a programmable interleaved mode that significantly increases the memory bandwidth and reduces data latency to the integrated graphics core. The additional bandwidth provided to the internal graphics core will also aid the RS780E in reaching and exceeding Microsoft's Windows Vista

2.2.1 DDR2 Memory Interface

Figure 2-4, “RS780E Side-Port Memory Interface,” on page 2-4 illustrates the side-port memory interface of the

RS780E.

The RS780E memory controller supports up to 128MB of dedicated side-port frame buffer DDR2 memory. It controls a single rank of DDR2 devices in 16-bit memory configuration. It supports device sizes of 256, 512, and 1024 Mbits, and a device width of x16. Because the memory controller supplies only one chip select signal, only devices with one chip select are supported. A wide range of DDR2 timing parameters, configurations, and loadings are programmable via the RS780E memory controller configuration registers

Premium logo requirements.

Data Mask MEM_DM[1:0]

Data MEM_DQ[15:0]

RS780E Side-Port Memory

Interface

Data Strobes MEM_DQS[1:0]P/N

Un-buffered DDR2 SDRAM

MEM_CKE, MEM_RAS#,

Differential Clocks MEM_CKP/MEM_CKN

MEM_CAS#, MEM_WE#

Address MEM_A[13:0]

Chip Select MEM_CS#

On-Die Termination MEM_ODT

Bank Address MEM_BA[2:0]

MEM_CALN

MEM_CALP

VDD_MEM

Side-Port Memory Interface

Figure 2-4 RS780E Side-Port Memory Interface

2.2.1.1 Supported DDR2 Components

The memory controller supports DDR2 SDRAM chips in several configurations. These chips are organized in banks, rows (or pages), and columns. The supported DDR2 components have four or eight banks. Table 2-1 lists the supported memory components.

Table 2-1 Supported DDR2 Components

DDR2 SDRAM

Config Mbits CS Mode Bank Bits Row Bits Col Bits

16Mbx16 256 4 2 13 9 32

32Mbx16 512 10 2 13 10 64

64Mbx16 1024 11 3 13 10 128

Mbytes

2.2.1.2 Row and Column Addressing

Table 2-2 shows how the physical address P (after taking out the bank bit) is used to provide the row and column

addressing for each size of DDR2 memories.

Table 2-2 DDR2 Memory Row and Column Addressing

Row P10 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

Column - - PC - P9P8P7P6P5P4P3 P2 P1

Row P23 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

Column - - PCP10P9P8P7P6P5P4P3 P2 P1

A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

16Mbx16 devices

32Mbx16 devices

Address

Side-Port Memory Interface

A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

Row

Column

Row

Column

Note: PC = precharge flag

P23 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

- - PC P10 P9 P8 P7 P6 P5 P4 P3 P2 P1

P24 P23 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

- - PC P10 P9 P8 P7 P6 P5 P4 P3 P2 P1

2.2.2 DDR3 Memory Interface

The RS780E memory controller supports up to 128MB of dedicated side-port frame buffer DDR3 memory. It supports a single rank of DDR3 device in 16-bit memory configuration. It supports device sizes of 512 and 1024 Mbits, and a device width of x16. A wide range of DDR3 timing parameters, configurations, and loadings are programmable via the RS780E memory controller configuration registers.

2.2.2.1 Supported DDR3 Components

The memory controller supports DDR3 SDRAM chips in several configurations. These chips are organized in banks, rows (or pages), and columns. Table 2-3 lists the supported memory components.

Address

64Mbx16 devices

128Mbx16 devices

Table 2-3 Supported DDR3 Components

DDR3 SDRAM

Config Mbits CS Mode Bank Bits Row Bits Col Bits

32Mbx16 512 9 3 12 10 64

64Mbx16 1024 11 3 13 10 128

Mbytes

2.2.2.2 Row and Column Addressing

Table 2-4 shows how the physical address P (after taking out the bank bit) is used to provide the row and column

addressing for each size of DDR3 memories.

Table 2-4 DDR3 Memory Row and Column Addressing

Address

A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

32Mbx16 devices

Row P23 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

Column - - PCP10P9P8P7P6P5P4P3 P2 P1

64Mbx16 devices

Row P23 P14 P13 P12 P11 P22 P21 P20 P19 P18 P17 P16 P15

Column - - PC P10 P9 P8 P7 P6 P5 P4 P3 P2 P1

Note: PC = precharge flag

2.3 LVTM (LVDS/TMDS) Interface

TXOUT_U0N/P

TXOUT_U1N/P TXOUT_U2N/P

TXCLK_LN/P

TXOUT_L0N/P

TXCLK_UN/P

TXOUT_L1N/P TXOUT_L2N/P

LVDS_DIGON

LVDS_BLON

LVDS_BLEN

LVDS upper data channel 0

LVDS upper data channel 2

LVDS lower clock channel

LVDS lower data channel 0

LVDS upper clock channel

LVDS lower data channel 1 LVDS lower data channel 2

LVDS_DIGON

LVDS_BLON

LVDS_BLEN

LVDS upper data channel 3

TXOUT_U3N/P

LVDS upper data channel 1

TXOUT_U0N/P

TXOUT_U1N/P TXOUT_U2N/P

TXCLK_LN/P

TXOUT_L0N/P

TXCLK_UN/P

TXOUT_L1N/P TXOUT_L2N/P

LVDS_DIGON

LVDS_BLON

LVDS_BLEN

TMDS data channel 0

TMDS data channel 2

TMDS data channel 4

TMDS clock channel

TMDS data channel 5

GPIO3

GPIO2

GPIO4

TMDS data channel 3

TXOUT_U3N/P

TMDS data channel 1

TXOUT_L3N/P

LVDS lower data channel 3

TXOUT_L3N/P

LVTM Interface in LVDS Mode

LVTM Interface in TMDS Mode

The RS780E’s LVTM (LVDS/TMDS) interface supports either an LVDS or a TMDS output. A custom video BIOS from AMD will configure the LVTM interface to drive out either LVDS or a TMDS signals as desired.

A custom video BIOS and proper signal routing from the LVTM interface to a connector are the only requirements for the RS780E to support either an LVDS or a TMDS output on the LVTM interface. No other register programming is needed for selecting one option over the other, and customers should not attempt to configure the LVTM port by programming the RS780E’s registers directly. Figure 2-5, “LVTM Interface of the RS780E,” compares the functions of the pins in LVDS and TMDS mode. Operations in the LVDS and TMDS mode are explained in section 2.4, “LVDS‚’ on page 2-7, and section 2.5, “DVI/HDMI™‚’ on page 2-13, respectively.

LVTM (LVDS/TMDS) Interface

Notice that the RS780E can also provide a TMDS output via its TMDS interface that is multiplexed with its PCI Express graphics link. As a result, the RS780E can provide two digital display outputs using its two on-chip integrated TMDS transmitters—one through the LVTM interface, and the other through the TMDS interface multiplexed with the PCI-E graphics interface.

Figure 2-5 LVTM Interface of the RS780E

LVDS

LP1C1LP1C2LP1C3

T Cycle

LP1C4LP1C5LP1C6LP1C7

TXOUT_L0-/+

LP2C1LP2C2LP2C3LP2C4LP2C5LP2C6LP2C7

TXOUT_L1-/+

LP3C1LP3C2LP3C3LP3C4LP3C5LP3C6LP3C7

TXOUT_L2-/+

TXCLK_L-/+

UP1C1UP1C2UP1C3

T Cycle

UP1C4UP1C5UP1C6UP1C7

TXOUT_U0-/+

UP2C1UP2C2UP2C3UP2C4UP2C5UP2C6UP2C7

TXOUT_U1-/+

UP3C1UP3C2UP3C3UP3C4UP3C5UP3C6UP3C7

TXOUT_U2-/+

TXCLK_U-/+

2.4 LVDS

The RS780E’s LVTM interface can operate as a dual-channel 18-/24-bit LVDS interface. Notice that for designs implementing only a single LVDS channel, the LOWER channel of the interface should be used.

2.4.1 LVDS Data Mapping

Figure 2-6 shows the transmission ordering of the LVDS signals for 18-bit transmission on the lower and the upper data

channels. The signal mappings for single and dual channel transmission are shown in Table 2-5 and Table 2-6 respectively.

Figure 2-7 shows the transmission ordering of the LVDS signals for 24-bit transmission on the lower and the upper data

channels. The signal mappings for single and dual channel transmission are shown in Table 2-9 and Table 2-10 respectively.

Figure 2-6 Single/Dual Channel 18-bit LVDS Data Transmission Ordering

Table 2-5 LVDS 18-bit TFT Single Pixel per Clock (Single Channel) Signal Mapping

TX Signal 18-bit

LP1C1 R0

LP1C2 R1

LP1C3 R2

LP1C4 R3

LP1C5 R4

LP1C6 R5

LP1C7 G0

LP2C1 G1

LP2C2 G2

LP2C3 G3

LP2C4 G4

LP2C5 G5

LP2C6 B0

LP2C7 B1

LP3C1 B2

LP3C2 B3

LP3C3 B4

LP3C4 B5

LP3C5 HSYNC

LP3C6 VSYNC

LP3C7 ENABLE

LVDS

+ 72 hidden pages

AMD 780E Technical Reference Manual

Specifications and Main Features

Frequently Asked Questions

User Manual