The HMC475ST89 / HMC475ST89E is an ideal RF/IF
gain block & LO or PA driver:
• Cellular / PCS / 3G
• Fixed Wireless & WLAN
• CATV, Cable Modem & DBS
• Microwave Radio & Test Equipment
Features
P1dB Output Power: +22 dBm
Gain: 21.5 dB
Output IP3: +35 dBm
Cascadable 50 Ohm I/Os
Single Supply: +8V to +12V
Industry Standard SOT89 Package
• IF and RF Applications
Functional DiagramGeneral Description
The HMC475ST89(E) is a InGaP Heterojunction
Bipolar Transistor (HBT) Gain Block MMIC SMT
ampli er covering DC to 4.5 GHz. Packaged in an
industry standard SOT89, the ampli er can be used
as a cascadable 50 Ohm RF/IF gain stage as well as
a LO or PA driver with up to +25 dBm output power.
The HMC475ST89(E) offers 21.5 dB of gain and +35
dBm output IP3 at 850 MHz while requiring only 110
mA from a single positive supply. The Darlington
topology results in reduced sensitivity to normal
process variations and excellent gain stability over
temperature while requiring a minimal number of
external bias components.
5 - 432
Electrical Specifications, Vs= 8.0 V, Rbias= 9.1 Ohm, T
ParameterMin.Typ.Max.Units
DC - 1.0 GHz
Gain
Gain Variation Over TemperatureDC - 4.5 GHz0.0080.012dB/ °C
Input Return Loss
Output Return Loss
Reverse IsolationDC - 4.5 GHz25dB
Output Power for 1 dB Compression (P1dB)
Output Third Order Intercept (IP3)
(Pout= 0 dBm per tone, 1 MHz spacing)
Noise Figure
Supply Current (Icq)110135mA
Note: Data taken with broadband bias tee on device output.
1.0 - 2.0 GHz
2.0 - 3.0 GHz
3.0 - 4.0 GHz
4.0 - 4.5 GHz
DC - 1.0 GHz
1.0 - 2.0 GHz
2.0 - 4.5 GHz
DC - 1.0 GHz
1.0 - 4.5 GHz
DC - 1.0 GHz
1.0 - 2.0 GHz
2.0 - 3.0 GHz
3.0 - 4.0 GHz
4.0 - 4.5 GHz
DC - 2.5 GHz
2.5 - 4.5 GHz
DC - 3.0 GHz
3.0 - 4.5 GHz
= +25° C
A
19.5
17.5
14.5
11.5
9
19.0
18.0
17.5
13.0
11.0
21.5
19.5
16.5
13.5
12
11
14
14
13
10
22.0
21.0
19.5
16.0
14.0
35
30
3.5
3.8
dBm
dBm
dBm
dBm
dBm
dBm
dBm
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
The circuit board used in the nal application
should use RF circuit design techniques. Signal
lines should have 50 ohm impedance while the
package ground leads and package bottom should
be connected directly to the ground plane similar to
that shown. A suf cient number of via holes should
be used to connect the top and bottom ground
planes. The evaluation board should be mounted
to an appropriate heat sink. The evaluation circuit
board shown is available from Hittite upon request.
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