Design and specifications are subject to change without
•
notice
.
Design and specifications are subject to change without
•
notice
66 (U)67 (LH)
.
Design and specifications are subject to change without
•
notice
.
-2-
Design and specifications are subject to change without
•
notice
.
Page 3
PROTECTION OF EYES FROM LASER BEAM DURING SERVICING
This set employs laser. Therefore, be sure to follow carefully the
instructions below when servicing.
WARNING!
WHEN SERVICING, DO NOT APPROACH THE LASER EXIT
WITH THE EYE TOO CLOSELY. IN CASE IT IS NECESSARY TO
CONFIRM LASER BEAM EMISSION. BE SURE TO OBSERVE
FROM A DISTANCE OF MORE THAN 30cm FROM THE
SURFACE OF THE OBJECTIVE LENS ON THE OPTICAL
PICK-UP BLOCK.
Caution: Invisible laser radiation when
open and interlocks defeated avoid exposure to beam.
Advarsel:Usynling laserståling ved åbning,
når sikkerhedsafbrydere er ude af funktion.
Undgå udsættelse for stråling.
VAROITUS!
Laiteen Käyttäminen muulla kuin tässä käyttöohjeessa mainitulla tavalla saattaa altistaa käyt-täjän turvallisuusluokan 1 ylittävälle näkymättömälle lasersäteilylle.
VARNING!
Om apparaten används på annat sätt än vad som specificeras i
denna bruksanvising, kan användaren utsättas för osynling
laserstrålning, som överskrider gränsen för laserklass 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
ATTENTION
L'utilisation de commandes, réglages ou procédures autres que
ceux spécifiés peut entraîner une dangereuse exposition aux
radiations.
ADVARSEL!
Usynlig laserståling ved åbning, når sikkerhedsafbrydereer ude
af funktion. Undgå udsættelse for stråling.
This Compact Disc player is classified as a CLASS 1 LASER
product.
The CLASS 1 LASER PRODUCT label is located on the rear
exterior.
CLASS 1
KLASSE 1
LUOKAN 1
KLASS 1
LASER PRODUCT
LASER PRODUKT
LASER LAITE
LASER APPARAT
-3-
Page 4
Precaution to replace Optical block
(SF-P101NR)
Body or clothes electrostatic potential could ruin
laser diode in the optical block. Be sure ground
body and workbench, and use care the clothes
do not touch the diode.
1) After the connection, remove solder shown in
the right figure.
C409 87-010-248-080 CAP, ELECT 220-10V
C410 87-010-263-080 CAP, ELECT 100-10V
C411 87-A11-177-080 C-CAP,S 0.15-16 K B
C412 87-010-401-080 CAP, ELECT 1-50V
C413 87-016-369-080 C-CAP,S 0.033-25 B K
C414 87-010-405-080 CAP, ELECT 10-50V
C416 87-010-545-080 CAP, ELECT 0.22-50V
C417 87-012-157-080 C-CAP,S 330P-50 CH
C418 87-010-213-080 C-CAP,S 0.015-50 B
C419 87-A11-608-080 C-CAP,S 0.33-25 K B
C420 87-016-369-080 C-CAP,S 0.033-25 B K
C421 87-A11-177-080 C-CAP,S 0.15-16 K B
C422 87-010-184-080 CHIP CAPACITOR 3300P(K)
C423 87-010-992-080 C-CAP,S 0.047-25 B
C424 87-A11-606-080 C-CAP,S 0.22-25 K B
C211 87-A11-603-080 C-CAP,S 0.15-16 K B
C212 87-A11-603-080 C-CAP,S 0.15-16 K B
C215 87-016-460-080 C-CAP,S 0.22-16 B
C216 87-016-460-080 C-CAP,S 0.22-16 B
C231 87-010-213-080 C-CAP,S 0.015-50 B
C232 87-010-213-080 C-CAP,S 0.015-50 B
C233 87-A10-201-080 C-CAP,S0.33-16 KB
C234 87-A10-201-080 C-CAP,S0.33-16 KB
C235 87-016-669-080 C-CAP,S 0.1-25 K B
C236 87-016-669-080 C-CAP,S 0.1-25 K B
C823 87-010-178-080 CHIP CAP 1000P
C824 87-010-178-080 CHIP CAP 1000P
C829 87-010-178-080 CHIP CAP 1000P
C830 87-010-178-080 CHIP CAP 1000P
C834 87-010-248-080 CAP, ELECT 220-10V
C843 87-A11-132-080 CAP,TC U 0.01-50 K B
C844 87-018-124-080 CAP, CER 270P-50V
C845 87-010-178-080 CHIP CAP 1000P
C846 87-010-263-080 CAP, ELECT 100-10V
C851 87-A11-128-080 CAP,TC U 4700P-50 K B
C852 87-018-131-080 CAP, CER 1000P-50V
C853 87-A11-132-080 CAP,TC U 0.01-50 K B
CN201 87-099-018-010 CONN,16P
CN801 87-A60-110-010 CONN,4P V S2M-4W
CNA302 8B-CDA-629-010 CONN ASSY,6P MA-TU
• Regarding connectors, they are not stocked as they are not the initial order items.
The connectors are available after they are supplied from connector manufacturers upon the order is received.
9. Tape speed Adjustment
Settings:• Test tape: TTA-100
• Test point: PHONES JACK (J201)
• Adjustment location: SFR of deck motor
Method:Play back the test tape and adjust so that the output
frequency is 3000Hz ±30Hz.
10. Azimuth Adjustment
Settings:• Test tape: TTA-320
• Test point: PHONES JACK (J201)
• Adjustment location:Azimuth adjustment screw
Method:Play back the test tape and adjust so that the output is
maximum.
< CD SECTION >
11. FE Balance Adjustment
Settings:• Test point: IC401 PIN58 (VR) , IC401 PIN20 (FE)
• Adjustment location:SFR430
Method:Playback the disc and adjust SFR430 so that the test
point voltage becomes 0~-10mV.
-26-
Page 27
IC DESCRIPTION-1/3 (LA9241ML)-1/2
Pin No.Pin NameI/ODescription
1
FIN2
Pin to which external pickup photo diode is connected. RF signal is created by adding with the
I
FIN1 pin signal. FE signal is created by subtracting from the FIN1 pin signal.
10
11
12
13
14
15
16
2
3
4
5
6
7
8
9
FIN1
E
F
TB
TE-
TE
TESI
SCI
TH
TA
TD-
TD
JP
TO
FD
I
Pin to which external pickup photo diode is connected.
Pin to which external pickup photo diode is connected. TE signal is created by subtracting from
I
the F pin signal.
I
Pin to which external pickup photo diode is connected.
I
DC component of the TE signal is input.
I
Pin to which external resistor setting the TE signal gain is connected between the TE pin.
O
TE signal output pin.
TES “Track Error Sense” comparator input pin. TE signal is passed through a band-pass filter
I
then input.
I
Shock detection signal input pin.
I
Tracking gain time constant setting pin.
O
TA amplifier output pin.
Pin to which external tracking phase compensation constants are connected between the TD and
I
VR pins.
I
Tracking phase compensation setting pin.
I
Tracking jump signal (kick pulse) amplitude setting pin.
O
Tracking control signal output pin.
O
Focusing control signal output pin.
17
18
19
20
21
22
23
24
25
26
27
28
29
30, 31
FD-
FA
FA-
FE
FE-
AGND
SP
SPI
SPG
SP-
SPD
SLEQ
SLD
SL-, SL+
—
Pin to which external focusing phase compensation constants are connected between the FD and
I
FA pins.
Pin to which external focusing phase compensation constants are connected between the FD–
I
and FA– pins.
Pin to which external focusing phase compensation constants are connected between the FA and
I
FE pins.
O
FE signal output pin.
I
Pin to which external FE signal gain setting resistor is connected between the FE pin.
Analog signal GND.
O
Signal ended output of the CV+and CV- pin input signal.
I
Spndle amp input.
I
Pin to which external spindle gain setting resistor in 12 cm mode is connected. (Not connected)
Pin to which external spindle phase compensation constants are connected together with SPD
I
pin.
O
Spindle control signal output pin.
I
Pin to which external sled phase compensation constants are connected.
O
Sled control signal output pin.
I
Sled advance signal input pin from microprocessor.
32, 33
34
35
JP-, JP+
TGL
TOFF
I
Tracking jump signal input pin from DSP.
I
Tracking gain control signal input from DSP. Low gain when TGL = H.
I
Tracking off control signal input pin from DSP. Off when TOFF = H.
-27-
Page 28
IC DESCRIPTION-1/3 (LA9241ML)-2/2
Pin No.Pin NameI/ODescription
36
TES
O
Pin from which TES signal is output to DSP.
37
38
39, 40
41
42
43
44
45
46
47
48
49
50
51
52
53
HFL
SLOF
CV-, CV+
RFSM
RFS-
SLC
SLI
DGND
FSC
TBC
NC
DEF
CLK
CL
DAT
CE
O
O
O
—
O
—
O
“High Frequency Level” is used to judge whether the main beam position is on top of bit or on
top of mirror.
I
Sled servo off control input pin.
I
CLV error signal input pin from DSP.
RF output pin.
I
RF gain setting and EFM signal 3T compensation constant setting pin together with RFSM pin.
“Slice Level Control” is the output pin which controls the RF signal data slice level by DSP.
I
Input pin which control the data slice level by the DSP.
Digital system GND.
Output pin to which external focus search smoothing capacitor is connected.
I
“Tracking Balance Control” EF balance variable range setting pin.
Not connected.
Disc defect detector output pin.
I
Reference clock input pin. 4.23 MHz of the DSP is input.
(Not connected)
Servo system and digital system Vcc pin.
Pin to which external bypass capacitor for reference voltage is connected.
O
Reference voltage output pin.
I
Disc defect detector time constant setting pin.
I
Pin to which external capacitor for RF signal peak holding is connected.
I
Pin to which external capacitor for RF signal bottom holding is connected.
O
APC circuit output pin.
I
APC circuit input pin.
RF system Vcc pin.
-28-
Page 29
IC DESCRIPTION-2/3 (LC78622NE)-1/2
Pin No.Pin NameI/ODescription
1
DEFI
I
Defect sense signal (DEF) input pin. (Connect to 0V when not used).
2
3
4
5
6
7
8
9
10
11
12, 13
14
15
16
17
18
TAI
PDO
VVSS
ISET
VVDD
FR
VSS
EFMO
EFMIN
T2
CLV+, CLK-
__
V/P
HFL
TES
TOFF
TGL
—
—
—
I
O
For PLL.
I
I
Digital system GND. Be sure to connect to 0V.
O
For slice level control.
I
I
Test signal input pin with built-in pull-down resistor. Be sure to connect to 0V.
O
Disc motor control output. Three level output is possible using command.
Rough servo or phase control automatic selection monitoring output pin. Rough servo at H.
O
Phase servo at L.
I
Track detect signal input pin. Schmidt input.
I
Tracking error signal input pin. Schmidt input.
O
Tracking OFF output pin.
O
Tracking gain selection output pin. Gain boost at L.
Test signal input pin with built-in pull-down resistor. Be sure to connect to 0V.
Phase comparator output pin to control external VCO.
GND pin for built-in VCO. Be sure to connect to 0V.
Pin to which external resistor adjusting the PD0 output current.
Power supply pin for built-in VCO.
Pin for VCO frequency range adjustment.
EFM signal output pin.
EFM signal input pin.
19, 20
21
22
23
24
25
26
27
28
29
30
31
32, 33
34
35
36
37
JP+, JP-
PCK
FSEQ
VDD
SL+
SL-
—
PUIN
RW
EMPH
C2F
DOUT
T3, T4
N.C.
MUTEL
LVDD
LCHO
—
—
—
—
O
Track jump control signal output pin. Three level output is possible using command.
O
EFM data playback clock monitoring pin 4.3218 MHz when phase is locked in. (Not connected)
Sync signal detection output pin. H when the sync signal which is detected from EFM signal and
O
thesync signal which is internally generated agree. (Not connected)
Digital system power supply pin.
O
Moves the sled to outer circumference.
O
Moves the sled to inner circumference.
Not connected.
I
CD pickup inner switch detection.
O
Read, wright signal.
O
De-emphasis monitor output pin. De-emphasis disc is being played back at H. (Not connected)
O
C2 flag output pin. (Not connected)
O
DIGITAL OUT output pin. (EIAJ format). (Not connected)
I
Test signal input pin with built-in pull-down resistor. Be sure to connect to 0V.
Not connected. Set the pin to open.
O
L-channel 1-bit DAC.
O
L-channel mute output pin. (Not connected)
L-channel power supply pin.
L-channel output pin.
38
39
40
41
42
LVSS
RVSS
RCHO
RVDD
MUTER
—
—
—
O
R-channel 1-bit DAC.
O
L-channel GND. Be sure to connect to 0V.
R-channel GND. Be sure to connect to 0V.
R-channel output pin.
R-channel power supply pin.
R-channel mute output pin. (Not connected)
Pin to which external 16.9344 MHz crystal oscillator is connected.
I
Crystal oscillator GND pin. Be sure to connect to 0V.
O
Subcode block sync signal output pin. (Not connected)
O
C1, C2, single and dual correction monitoring pin. (Not connected)
O
Subcode P, Q, R, S, T, U and W output pin. (Not connected)
Subcode frame sync signal output pin. Falls down when subcode enters standby. (Not
O
connected)
I
Subcode read clock input pin. Schmidt input. (Be sure to connected to 0V when not in use.)
Pin outputting the 7.35 kHz sync signal which is generated by dividing frequency of crystal
O
oscillator. (Not connected)
O
Subcode Q output standby output pin.
I
Read/write control input pin. Schmidt input.
O
Subcode Q output pin.
I
Command input pin from microprocessor.
I
Command input read clock or subcode read input clock from SQOUT pin
I
LC78622 reset input pin. Set this pin to L once when the main power is turned on.
59
60
61
62
63
64
T11
16M
4.2M
T5
_____
CS
T1
O
Test signal output pin. Use this pin as open (normally L output). (Not connected)
O
16.9344 MHz output pin. (Not connected)
O
4.2336 MHz output pin.
I
Test signal input pin with built-in pull-down resistor. Be sure to connect to 0V.
Chip select signal input pin with built-in pull-down resistor. Be sure to connect to 0V while it is
I
not controlling.
I
Test signal input pin without built-in pull-down resistor. Be sure to connect to 0V.
-30-
Page 31
IC DESCRIPTION-3/3 (LC867132V-5T67)-1/2
Pin No.Pin NameI/ODescription
O
1
2
3
O-RWC/CE
O-DATA
O-CLK
CD read/write control output.
O
Data output to sound processor IC (M62495AFP or M61509FP).
O
Clock output to sound processor IC (M62495AFP or M61509FP).