ADLINK nanoX-TCR User Manual

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nanoX-TCR

(Computer-on-Module)

Reference Manual

P/N 50-1Z108-1000

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DISCLAIMER

ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for incidental or consequential damages or related expenses resulting from the use of this product, even if it has been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from time to time without obligation to notify any person of such revisions. If errors are found, please contact ADLINK at the address listed on this Notice Page.

TRADEMARKS

CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard, MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel, RuffSystem, and ReadySystem are trademarks of ADLINK Technology, Inc. All other marks are the property of their respective companies.

REVISION HISTORY

Revision Reason for Change Date

1000 Initial Release Jan/12

Audience

This manual provides reference only for computer design engineers, including but not limited to hardware and software designers and applications engineers. ADLINK Technology, Inc. assumes you are qualified to design and implement prototype computer equipment.

ii Reference Manual nanoX-TCR

Contents

Chapter 1 About This Manual ....................................................................................................1

Purpose of this Manual ....................................................................................................................1

References ..................................................................................................................................1

Chapter 2 Product Overview......................................................................................................3

COM Express Concept ....................................................................................................................3

COM Express Architecture ..............................................................................................................4

Product Description..........................................................................................................................5

Module Features ........................................................................................................................5

Block Diagram ............................................................................................................................8

Major Components (ICs) .................................................................................................................9

Connector ......................................................................................................................................12

Specifications.................................................................................................................................13

Physical Specifications .............................................................................................................13

Mechanical Specifications ........................................................................................................14

Power Specifications ...............................................................................................................15

Environmental Specifications....................................................................................................15

Thermal/Cooling Requirements ................................................................................................16

Chapter 3 Hardware .................................................................................................................17

Overview ........................................................................................................................................17

CPU ...............................................................................................................................................18

Graphics.........................................................................................................................................18

Memory .........................................................................................................................................18

Interrupt Channel Assignments .....................................................................................................19

Memory Map .................................................................................................................................20

I/O Address Map ...........................................................................................................................21

COM Express A-B Connector .......................................................................................................22

LPC Interface............................................................................................................................22

SATA Interface .........................................................................................................................22

USB Interface ...........................................................................................................................22

Power Interface ........................................................................................................................22

Power Management..................................................................................................................22

Video Interfaces........................................................................................................................23

LVDS ..................................................................................................................................23

SDVO .................................................................................................................................23

Audio Interface ........................................................................................................................23

Ethernet Interface ....................................................................................................................23

I²C™ Bus ..................................................................................................................................24

PCI Express™ ..........................................................................................................................24

System Management Bus (SMBus) .........................................................................................24

CAN Bus [Optional]...................................................................................................................24

GPIO.........................................................................................................................................25

Watchdog Timer.............................................................................................................................28

Temperature Sensor ......................................................................................................................29

nanoX-TCR Reference Manual iii

Contents

Chapter 4 BIOS Setup .............................................................................................................. 31

Introduction.................................................................................................................................... 31

Entering BIOS Setup (Local Video Display) ........................................................................... 31

Entering BIOS Setup (Serial Port Console) ............................................................................ 31

OEM Logo Utility .......................................................................................................................... 32

Logo Image Requirements....................................................................................................... 32

BIOS Setup Menus ....................................................................................................................... 33

Main BIOS Setup Screen ......................................................................................................... 33

Advanced BIOS Setup Screen................................................................................................. 34

Chipset BIOS Setup Screen..................................................................................................... 37

Boot BIOS Setup Screen ......................................................................................................... 39

Security BIOS Setup Screen.................................................................................................... 40

Save & Exit BIOS Setup Screen .............................................................................................. 41

Appendix A Technical Support ................................................................................................. 43

Index .................................................................................................................................................. 45

List of Figures

Figure 2-1. Mini, Compact, Basic and Extended Form Factors ................................................. 4

Figure 2-2. Functional Block Diagram ....................................................................................... 8

Figure 2-3. Component Locations (Top Side).......................................................................... 11

Figure 2-4. Component Locations (Bottom Side) .................................................................... 11

Figure 2-5. Connector Locations (Bottom Side) ..................................................................... 12

Figure 2-6. Mechanical Dimensions (Top Side)....................................................................... 14

Figure 2-7. Stack Heights of Cooling Assemblies (Side Width Views) .................................... 16

Figure 4-1. Main BIOS Setup Screen ..................................................................................... 33

Figure 4-2. Advanced BIOS Setup Screen ............................................................................. 34

Figure 4-3. Chipset BIOS Setup Screen ................................................................................. 37

Figure 4-4. Boot BIOS Setup Screen ...................................................................................... 39

Figure 4-5. Security BIOS Setup Screen ................................................................................ 40

Figure 4-6. Save & Exit BIOS Setup Screen .......................................................................... 41

List of Tables

Table 2-1. COM Express Pinout Types .................................................................................... 3

Table 2-2. Major Integrated Circuit Descriptions and Functions............................................... 9

Table 2-3. Module Connector and Socket Descriptions ......................................................... 12

Table 2-4. Weight and Footprint Dimensions ......................................................................... 13

Table 2-5. Power Supply Requirements ................................................................................ 15

Table 2-6. Environmental Requirements ................................................................................ 15

Table 2-7. ADLINK Optional Cooling Solutions ...................................................................... 16

Table 3-1. Interrupt Channel Assignments ............................................................................. 19

Table 3-2. Memory Map ......................................................................................................... 20

Table 3-3. I/O Address Map ................................................................................................... 21

Table 3-4. SMBus Reserved Addresses ................................................................................ 24

Table 3-5. COM Express A-B Connector Signal Descriptions................................................ 25

Table 4-1. BIOS Setup Menus................................................................................................ 33

Table A-1. Technical Support Contact Information ................................................................. 43

iv Reference Manual nanoX-TCR

Chapter 1 About This Manual

Purpose of this Manual

This manual is for designers of systems based on the nanoX-TCR (Computer-on-Module). This manual contains information that permits designers to create an embedded system based on specific design requirements.

Information provided in this reference manual includes:

• nanoX-TCR specifications

• Environmental requirements

• Major ICs and features implemented

• nanoX-TCR connector/pin numbers and definitions

• BIOS Setup information

Information not provided in this reference manual includes:

• Detailed chip specifications

• Internal component operation

• Internal registers or signal operations

• Bus or signal timing for industry-standard busses and signals

References

The following list of references may be helpful for you to complete your custom design successfully.

Specifications

• COM Express Specification Revision 2.0

Web site: http://www.picmg.org/

• COM Express Carrier Design Guide 1.0

Web site: http://www.picmg.org/pdf/PICMG_COMDG_100.pdf

• LPC Bus Specification, Revision 1.1, August, 2002

Specification: http://www.intel.com/design/chipsets/industry/25128901.pdf

• PCIe Specification, Revision 1.0a, April 15, 2003

Specification (for members): http://www.pcisig.com/home

• I

C Bus Specification Version 2.1

Specification: http://www.nxp.com/documents/other/39340011.pdf

• AMI BIOS Aptio TSE User’s Guide

Datasheet: http://www.ami.com/support/doc/AMI_TSE_User_Manual_PUB.pdf

• Bosch CAN specification version 2.0B

Specification: http://www.can-cia.org/fileadmin/cia/specifications/CAN20B.pdf

• SATA Specification Version 2.6

Web site: http://www.sata-io.org/

nanoX-TCR Reference Manual 1

Chapter 1 About This Manual

Chip Specifications

• Intel® Corporation and the Atom™ E6XXT series CPU, used as integrated processor core and graphics

memory hub

Datasheet: http://download.intel.com/embedded/processor/datasheet/324208.pdf

• Intel Corporation and the EG20T chip, used as Platform Controller Hub (PCH)

Datasheet: http://download.intel.com/embedded/chipsets/datasheet/324211.pdf

• National Semiconductor and the LM96163 chip, used as Temperature Sensor

Datasheet: http://www.national.com/ds/LM/LM96163.pdf

• Intel Corporation and the 82574IT chip used as the Gigabit Ethernet controller

Datasheet: h

ttp://download.intel.com/design/network/datashts/82574.pdf

• Atmel Corporation and the ATMEGA168V-10AU chip used as the board controller

Datasheet: http://www.atmel.com/dyn/resources/prod_documents/2545S.pdf

NOTE If you are unable to locate the datasheets using the links provided, search the internet

to find the manufacturer’s web site and locate the documents you need.

2 Reference Manual nanoX-TCR

Chapter 2 Product Overview

This introduction presents general information about the COM Express™ architecture and the nanoX-TCR Computer-on-Module (COM). After reading this chapter you should understand:

• COM Express Concept

• COM Express Architecture

• nanoX-TCR Product Description

• nanoX-TCR Major Components

• nanoX-TCR Connector Description

• nanoX-TCR Specifications

COM Express Concept

COM Express is an open industry standard defined specifically for COM boards. Its creation provides the ability to make a smooth transition from legacy parallel interfaces to the newest technologies based on serial buses available today. COM Express modules are available in the following form factors:

• Mini 84mm x 55mm

• Compact 95mm x 95mm

• Basic 125mm x 95mm

• Extended 155mm x 110mm

The COM Express specification 2.0 defines seven different pinout types.

Table 2-1. COM Express Pinout Types

Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports

Type 1 A-B Up to 6 1

Type 2 A-B C-D Up to 22 32 bit 1 1

Type 3 A-B C-D Up to 22 32 bit 3

Type 4 A-B C-D Up to 32 1 1

Type 5 A-B C-D Up to 32 3

Type 6 A-B C-D Up to 24 1

Type 10 A-B Up to 4 1

The nanoX-TCR utilizes the Mini form factor and the Type 10 pinout definition, featuring one highperformance COM Express connector that ensures stable data throughput. The single-connector interfaces of the Type 1 and Type 10 pinouts free systems completely from legacy signals while solving the space constraints of the Mini form factor. The Type 10 pinout provides additional flexibility for developers by freeing up pins reserved for SATA and PCIe for future technologies and using the second LVDS channel, VGA, and TV-Out pins to support SDVO (via DDI). The Type 10 pinout also supports the SPI interface, which was unavailable in previous COM Express revisions.

The COM board integrates all core components and is mounted onto an application specific baseboard. COM boards are legacy-free hardware designs (no Super I/O, PS/2 keyboard, and PS/2 mouse) and provide most of the functional requirements for any application. These functions include, but are not limited to a rich complement of contemporary, high-bandwidth serial interfaces such as PCI Express, Serial ATA, USB 2.0, and Gigabit Ethernet. The robust thermal and mechanical concept of the COM board, combined with extended power management capabilities, is perfectly suited for all applications.

nanoX-TCR Reference Manual 3

Chapter 2 Product Overview

Baseboard designers can utilize as little or as many of the I/O interfaces as necessary. The baseboard can therefore provide all the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express modules are scalable, which means once an application has been created, the ability to diversify the product range is possible through the use of different performance class modules. Simply unplug one module and replace it with another. No redesign is necessary.

COM Express Architecture

The COM Express specification was developed by the PCI Industrial Computer Manufacturing Group (PICMG) in close collaboration with many leading companies across the embedded industry in order to find an implementation solution to handle upcoming new high speed serial I/Os, processors, and chipsets. COM Express specifies four form factors, as well as seven different types of connector pinouts.

The four form factors are referred to as Mini, Compact, Basic, and Extended. The Mini form factor targets battery powered, mobile, and handheld system designs and features a footprint of just 84mm x 55mm. The Compact form factor is 95mm x 95mm, designed to match the requirements of small applications. The Basic module footprint is 125mm x 95mm and focuses on space-constrained, low power systems which typically do not contain more than one horizontal mounted SODIMM. The Extended footprint is slightly larger at 155mm x 110mm and supports up to two full-size, vertically mounted DIMM modules to accommodate larger memory configurations for high-performance CPUs, chipsets, and multiprocessor systems. The placement of the shielded 220-pin connectors and the mounting holes are identical between these four footprints.

Compact Form Factor

Mini Form Factor

Figure 2-1. Mini, Compact, Basic and Extended Form Factors

Basic Form Factor

Extended Form Factor

Note: Measurements are in millimeters

COM_FormFactors_b

4 Reference Manual nanoX-TCR

Chapter 2 Product Overview

Product Description

The nanoX-TCR is an exceptionally high integration, high performance, rugged Intel® Atom™ E6XXT processor based system, compatible with the COM Express standard. This rugged and high quality module system contains all the component subsystems of an ATX motherboard plus the equivalent of several PCI Express expansion boards.

The Intel Atom E6XXT series CPUs integrate processor cores with Graphics and Memory Controller Hubs (GMCHs), providing low-power, high-performance processors, memory controllers for up to 2GB of onboard memory, and graphics controllers for LVDS and SDVO signals.

The Intel EG20T PCH (Platform Controller Hub) provides controllers for a range of common interfaces including six USB 2.0 ports and up to two SATA ports as well as embedded interfaces for CAN (optional), GPIO, and I2C. The nanoX-TCR provides an optional Solid State Drive through the SATA1 port and one Gigabit Ethernet interface through the Intel 82574IT Gigabit Ethernet controller chip (external magnetics required) using PCIe Port1 from the CPU. The PCIe Port0 connects the PCH to the CPU.

Expansion for additional system functions is possible on the nanoX-TCR through the PCIe and LPC expansion buses. The PCIe and LPC buses operate at clock speeds of 100MHz and 33MHz, respectively.

The nanoX-TCR is particularly well suited for either embedded or portable applications and meets the size, power consumption, temperature range, quality, and reliability demands of embedded system applications.

Module Features

• CPU

♦

Provides Intel® Atom™ 600MHz (E620T), 1.3GHz (E660T), or 1.6GHz (E680T) Processor Cores and Graphics Memory Hubs

♦

Provides internal 512-kB, 8-way L2 cache

♦

Provides Enhanced Intel SpeedStep® Technology (EIST)

♦

Supports Hyper-Threading Technology

♦

Provides L2 Dynamic Cache Sizing

♦

Supports 32-bit physical addresses and 48-bit linear addresses

♦

Provides 3D graphics engine

♦

Provides single-channel DDR2 memory controller

• Memory

♦

Provides non-ECC, unbuffered memory

♦

Provides up to 2 GB of +1.8V DDR2 soldered, on-board memory

♦

Supports 32-bit data bus

♦

Supports DDR2 800MHz memory

• Expansion Buses

♦

PCIe between CPU/PCH and COM Express connector

♦

LPC (Low Pin Count) for LPC devices

♦

I2C for fast mode I2C devices

♦

SMBus for expansion cards

♦

CAN bus for devices on the baseboard

nanoX-TCR Reference Manual 5

Chapter 2 Product Overview

• COM Express Interface

♦

SATA Interface

• Provides up to two SATA ports

• Supports up to 3 Gb/s transfer speed

• Supports Native Command Queuing for up to 32 entries

• Provides Auto Activate for DMA

• Supports Hot Plug features

♦

HD Audio

• Provides Intel HD Audio controller

• Supports Audio Docking

• Provides 32-bit sample depth

• Supports sample rates up to 192kHz

♦

USB Port Interface

• Supports six EHCI USB 2.0 ports

• Supports one USB Client port

• Supports legacy OHCI USB 1.1 signals

• Supports Per-Port-Disable

♦

Ethernet Interface

• Provides one fully independent Ethernet port

• Provides integrated LEDs on each port (Link/Activity and Speed)

• Provides one Intel 82574IT controller chip

• Supports IEEE 802.3 10/100BaseT and 10/100/1000BaseT compatible physical layers

• Supports Auto-negotiation for speed, duplex mode, and flow control

• Supports full duplex or half-duplex mode

-Full-duplex mode supports transmit and receive frames simultaneously

-Supports IEEE 802.3x Flow control in full duplex mode

-Half-duplex mode supports enhanced proprietary collision reduction mode

♦

Video Interfaces (SDVO and LVDS)

• Provide SDVO outputs

-Resolutions up to 1280x1024 @ 85Hz

-A variety of external display technologies such as DVI, TV-Out, and VGA

-Maximum pixel clock rate up to 160MHz

• Provide LVDS flat panel outputs

-Resolutions up to 1280x768 @ 60Hz

-Minimum pixel clock rate of 19.75MHz

-Maximum pixel clock rate of 80MHz

-Pixel color depths of 18 and 24 bits

6 Reference Manual nanoX-TCR

Chapter 2 Product Overview

♦

CAN Interface (Optional)

• Supports bit rate up to 1 Mbps

• Supports 32 message objects

• Miscellaneous

♦

Real Time Clock (RTC) with external battery

♦

Watchdog Timer (WDT)

♦

CPU Temperature Sensor

♦

OEM Logo Screen (Splash)

nanoX-TCR Reference Manual 7

Chapter 2 Product Overview

Block Diagram

Figure 2-2 shows the functional components of the module.

LVDS

SDVO

HD Audio

SPI Flash - BIOS

Temp Sensor

Gigabit

Ethernet

Controller

82574IT

GLAN

SD/GPIO

Switch

GPIO

SPI

LPC

SMBus

1X PCIe X1

2X PCIe X1

USB 0-5

USB Client

SSD -

[Optional]

SD0

Generator

SATA 0

GPIO

Intel“ Atom™ E620T, E660T,

or E680T

(0.6, 1.3, or 1.6 GHz)

with integrated

Processor Core

and Graphics Memory Hub

PCIe1

PCIe2 PCIe3

(Platform Controller Hub)

Intel CS82TPCF

SATA 1

CPU

PCIe0

1X PCIe X1

EG20T PCH

667/800MHz,

1.5V, 2GB Max.

GPIO

Controller

GPIO

DDR2

On-board

System

Memory (8)

Board

I2C

LVDS DDC I2C

CAN

COM Express Connector - Rows A and B

LVDS

SDVO

HD Audio

SPI

LPC

SMBus

2X PCIe X1

Gb Ethernet

CAN (Optional)

GPIO (8) USB 2.0 (6)

SATA (1 or 2)

USB Client

I2C

LVDS DDC I2C

nanoX-TCR_BlkDiag_a

Figure 2-2. Functional Block Diagram

8 Reference Manual nanoX-TCR

Chapter 2 Product Overview

Major Components (ICs)

Table 2-2 lists the major integrated circuits on the nanoX-TCR, including a brief description of each IC. Figures 2-3 and 2-4 show the locations of the major ICs.

Table 2-2. Major Integrated Circuit Descriptions and Functions

Chip Type Mfg. Model Description Function

CPU (U31) Intel Atom E620T,

E660T, and E680T

PCH (Platform Controller Hub [U42])

SSD (U3) -

Optional

GPIO Generator Philips PCA9535BS Module providing 16

SD/GPIO Switch (U5)

Gigabit Ethernet Controller (U7)

Board Controller (U10)

Ethernet EEPROM (U19

- on bottom side [see Figure 2-4])

Memory EEPROM (U27

- on bottom side [see Figure 2-4])

Intel CS82TPCS

(EG20CP PCH)

SiliconMotion SM631GE Industrial-grade

Pericom PI5C3390QE Multiplexer/

Intel 82574IT Gigabit Ethernet

Atmel ATMEGA168V-

10AU

Atmel AT25128B-

SSHL

Atmel AT24C02B Two-Wire Serial

600MHz, 1.3GHz, or

1.6GHz processor with 8-way L2 cache

I/O hub providing Southbridge functions (standard I/O functions)

soldered solid state storage module

bits of GPIO expansion for I2C/SMBus applications

Demultiplexer providing switching function between SD and GPIO signals

controller

Micro controller for board functions

including I²C, Watchdog Timer, and LVDS Display Data Channel (DDC)

Three-Wire Serial EEPROM for Gigabit Ethernet Controller

EEPROM for SPD (Serial Presence Detect)

Integrates Processor Core and Graphics Memory Hub

Provides I/O interfaces such as USB, SATA, and video

Provides solid state storage through the SATA interface

Provides additional digital control lines

Provides a zero-delay switch connection

Generates PCIe 10T/100TX/ 1000T Ethernet signals

Optimizes power consumption versus processor speed

Provides storage for MAC addresses, serial numbers, and pre-boot configuration data

Provides storage for System Memory configuration data

nanoX-TCR Reference Manual 9

Chapter 2 Product Overview

Table 2-2. Major Integrated Circuit Descriptions and Functions (Continued)

DDR2 Memory (U38, U39, U40, U41 - on bottom

Micron MT47H128M8C

F-25E

On-board DDR2 System Memory

Provides highspeed data

transfer side [see

Figure 2-4])

DDR2 Memory (U43, U44, U45, U46)

Temperature Sensor - CPU (U113 - on bottom side; see

Figure 2-4])

Micron MT47H128M8C

F-25E

National

LM96163 Remote diode digital

Semiconductor

On-board DDR2 System Memory

temperature sensor

Provides high-

speed data

transfer

Measures its

own temperature

and the

temperature of

the CPU thermal

diode and

provides

temperature

correction with

fan speed

control.

Power Management IC (U115)

Power Regulator (U116 - on bottom side; see

Figure 2-4])

ROHM BD9591MWV Power Management

Chipset

Supplies power

to main system

blocks

ROHM BD9595MUV Power Regulator Rectifies sudden

change in power

load from

BD9591MWV

10 Reference Manual nanoX-TCR

Chapter 2 Product Overview

Key: U3 - SSD [Optional] U5 - SD/GPIO Switch U7 - Gigabit Ethernet Controller U10 - Board Controller U31 - CPU U38 - DDR2 SDRAM U39 - DDR2 SDRAM U40 - DDR2 SDRAM U41 - DDR2 SDRAM U42 - PCH U115 - Power Management (IC)

U40

U38U39

Key: U19 - SPI Ethernet EEPROM U27 - 2-Wire Serial EEPROM U43 - DDR2 SDRAM U44 - DDR2 SDRAM U45 - DDR2 SDRAM U46 - DDR2 SDRAM U113 - Temperature Sensor U116 - Power Regulator CN2 - COM Express Type 10

Connector (see connector table)

U31

U41

U10

U115

U42

Figure 2-3. Component Locations (Top Side)

U43

U44

U46

nanoX-TCR_Top_Comp_a

U45

U27

U113

nanoX-TCR_Bottom_Comp_a

Figure 2-4. Component Locations (Bottom Side)

nanoX-TCR Reference Manual 11

Chapter 2 Product Overview

Connector

Table 2-3 describes the COM Express connector (CN2) shown in Figure 2-5.

Table 2-3. Module Connector and Socket Descriptions

Connector # Board

Description

Access

CN2 – COM Express A-B Bottom 220-pin connector for Northbridge Video and Southbridge

I/O functions.

Key: CN2A - COM Express pins A1-A110 CN2B - COM Express pins B1-B110

110110

CN2

A B

nanoX-TCR_Bottom_Conn_a

Figure 2-5. Connector Locations (Bottom Side)

12 Reference Manual nanoX-TCR

Chapter 2 Product Overview

Specifications

Physical Specifications

Table 2-4 lists the physical dimensions of the module.

Table 2-4. Weight and Footprint Dimensions

Item Dimension

Weight 0.04 kg (0.10 lb)

Height (overall) 3.10 mm (0.12 inches)

Board thickness 2.36 mm (0.093 inches)

Width 55.00 mm (2.17 inches)

Length 84.00 mm (3.31 inches)

NOTE Overall height is measured from the

upper board surface to the highest permanent component on the upper board surface. This measurement does not include the cooling solution. The heights of the board with the cooling solutions are 15.00mm (0.43 inches) for the heatsink and 11.00mm (0.59 inches) for the heatspreader. See Figure 2-7 on page 16 for an illustration of the cooling solution stack heights.

nanoX-TCR Reference Manual 13

Chapter 2 Product Overview

Mechanical Specifications

The following figure provides mechanical dimensions of the nanoX-TCR. Figure 2-6 shows the top-side view of the board with measurements between mounting holes.

0.00

0.16 (4.00mm)

2.01 (51.00mm)

1.84 (47.00mm)

0.08 (2.00mm)

3.15 (80.00mm)

2.99 (76.00mm)

2.74 (69.60mm)

nanoX-TCR_mech_dwg_a

Figure 2-6. Mechanical Dimensions (Top Side)

NOTE All dimensions are given in inches.

0.74 (18.80mm)

0.00

0.08 (2.00mm)

0.16 (4.00mm)

1.14 (28.96mm)

0.49 (12.50mm)

0.00

0.16 (4.00mm)

14 Reference Manual nanoX-TCR

Chapter 2 Product Overview

Power Specifications

Table 2-5 provides the power requirements for the nanoX-TCR with 600MHz, 1.3GHz, and 1.6GHz CPUs

and a 430 watt power supply.

Table 2-5. Power Supply Requirements

Parameter 600MHz E620T CPU 1.3GHz E660T CPU 1.6GHz E680T CPU

Input Type +12V Regulated DC

voltage

In-rush Voltage & Current

Typical Idle Voltage & Current (Windows XP)

BIT Voltage & Current

Operating configurations:

1.59A (19.00W) 1.57A (19.00W) 1.58A (19.00W)

0.41A (5.00W) 0.50A (6.00W) 0.53A (6.00W)

0.46A (6.00W) 0.57A (7.00W) 0.60A (7.00W)

• In-rush operating configuration includes 350W ATX power supply, 1GB on-board RAM, one LVDS

video panel, one PS2 keyboard and mouse.

• Idle (Windows XP) operating configuration includes the in-rush running in BIOS setup.

• BIT = Burn-In-Test. Operating configuration includes the Idle configuration as well as one SATA

device, and one 4GB SSD (on 1.6GHz CPU models).

+12V Regulated DC voltage

Environmental Specifications

Table 2-6 provides the operating and storage temperature ranges required for this module.

Table 2-6. Environmental Requirements

Parameter Conditions

Temperature

Operating –20° to +70°C (–4° to +158°F)

Extended (Optional) –40° to +85°C (–40° to +185°F)

Storage –55° to +85°C (–67° to +185°F)

Humidity

Operating 5% to 90% relative humidity, non-condensing

Non-operating 5% to 95% relative humidity, non-condensing

nanoX-TCR Reference Manual 15

Chapter 2 Product Overview

Thermal/Cooling Requirements

The nanoX-TCR is designed to operate at its maximum CPU speeds of 600MHz, 1.3GHz, and 1.6GHz and requires a thermal solution to cool the CPU, PCH, and voltage regulators. ADLINK offers one optional cooling solution as well as a heat spreader platform on which to build a cooling solution. (See Table 2-7 for descriptions of cooling options.)

NOTE The overall system design must keep the ICs within their operating temperature

specifications.

Table 2-7. ADLINK Optional Cooling Solutions

Cooling Solution Description

Passive Heat Sink (without fan)

Heat Spreader Provides a simple thermal platform on which to build a cooling solution.

Qualified to maintain optimal performance up to +70°C.

Heat Spreader

Heatsink

0.43 (11.00mm)

0.22 (5.60mm)

0.59 (15.00mm)

0.22 (5.60mm)

nanoX-TCR_Cooling_Ht_a

Figure 2-7. Stack Heights of Cooling Assemblies (Side Width Views)

NOTE All heights are given in inches.

16 Reference Manual nanoX-TCR

Chapter 3 Hardware

Overview

This chapter discusses the module features in the following order:

• CPU

• Graphics

• Memory

• Interrupt Channel Assignments

• Memory Map

• I/O Address Map

• COM Express Connector A-B

♦

LPC interface

♦

SATA interface

♦

USB interface

♦

Power interface

♦

Power Management

♦

Video interfaces

♦

HD Audio interface

♦

Gigabit Ethernet interface

♦

I²C interface

♦

PCI Express interface

♦

SMBus

♦

CAN Bus [Optional]

♦

GPIO interface

• COM Express A-B Connector Signals

• Watchdog Timer

• Temperature Sensor

NOTE ADLINK Technology, Inc. only supports the features/options tested and listed in

this manual. The main chips used in the nanoX-TCR may provide more features or options than are listed for the nanoX-TCR, but some of these features or options are not supported on the module and will not function as specified in the chip documentation.

nanoX-TCR Reference Manual 17

Chapter 3 Hardware

CPU

The nanoX-TCR offers three versions of the Intel® Atom™ E6XXT CPU—the E620T, E660T, and E680T—operating at 600MHz, 1.3GHz, and 1.6GHz, respectively. The E6XXT integrates a highperformance x86 Processor Core with Memory Controller and 3D Graphics Engine. This single chip is based on 45-nm process technology and provides an open-standard PCI Express v1.0 interface, supporting user-defined PCH, ASIC, FPGA, and off-the-shelf discrete components, ideal for deeply embedded applications.

Graphics

The E6XXT CPU provides a 2D/3D graphics engine that performs pixel shading and vertex shading within a single hardware accelerator, which minimizes access to memory and improves render performance.

Memory

The nanoX-TCR employs two ranks of four system DRAM memory chips, which provide up to 2GB of extended memory, supporting aggressive power management to reduce power consumption, shallow selfrefresh and a new deep self-refresh, proactive page closing policies to close unused pages, and partial writes through data mask pins.

18 Reference Manual nanoX-TCR

Chapter 3 Hardware

Interrupt Channel Assignments

The interrupt channel assignments are shown in Table 3-1.

NOTE Tab le 3-1 is only for reference. Interrupt channel assignments are tied to the

specific legacy Super I/O device residing on the baseboard. This table can be used with the baseboard in ADLINK’s Quick Start Kit.

Table 3-1. Interrupt Channel Assignments

Device vs IRQ No. 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Timer X

PS/2 Keyboard* X

Secondary Cascade X

COM0* O D

COM1* D O

Floppy* D

Parallel* O D

RTC X

Math Coprocessor X

PS/2 Mouse* X

Audio Controller Automatically Assigned

PCI INTA Automatically Assigned

PCI INTB Automatically Assigned

PCI INTC Automatically Assigned

PCI INTD Automatically Assigned

USB Automatically Assigned

Video Automatically Assigned

Ethernet Automatically Assigned

*Located on baseboard, if supported

Legend: D = Default, X = Fixed, O = Optional

NOTE The IRQs for the Ethernet, Video, and USB are automatically assigned by the

BIOS Plug and Play logic. Local IRQs assigned during initialization can not be used by external devices.

nanoX-TCR Reference Manual 19

Chapter 3 Hardware

Memory Map

The following table provides the common PC/AT memory allocations. Memory below 000500h is used by the BIOS.

Table 3-2. Memory Map

Base Address Function

00000000h - 0009FFFFh Conventional Memory

000A0000h - 000AFFFFh Graphics Memory

000B0000h - 000B7FFFh Mono Text Memory

000B8000h - 000BFFFFh Color Text Memory

000C0000h - 000CFFFFh Standard Video BIOS

000D0000h - 000DFFFFh Reserved for Extended BIOS

000E0000h - 000EFFFFh Extended System BIOS Area

000F0000h - 000FFFFFh System BIOS Area (Storage and RAM Shadowing)

Top 32, 64, or 128MB of Physical Memory

FFE00000h - FFFFFFFFh System Flash

Shared memory of Integrated Graphics enabled

20 Reference Manual nanoX-TCR

Chapter 3 Hardware

I/O Address Map

Table 3-3 shows the I/O address map.

NOTE Tab le 3-3 is only for reference. I/O addresses are tied to the specific legacy

Super I/O device residing on the baseboard. This table can be used with the baseboard in ADLINK’s Quick Start Kit.

Table 3-3. I/O Address Map

Address (hex) Subsystem

0000-000F Primary DMA Controller

0020-0021 Master Interrupt Controller

0040-0043 Programmable Interrupt Timer (Clock/Timer)

0060 Keyboard Controller*

0061 NMI, Speaker control

0063 NMI Controller

0064 Keyboard Controller*

0065 NMI Controller

0067 NMI Controller

0070-007F CMOS RAM, NMI Mask Reg, RT Clock

0080 System reserved

0081-0083 DMA Page Registers

0084-0086 System reserved

0087 DMA Page Register

0088 System reserved

0089-008B DMA Page Registers

008C-008E System reserved

008F DMA Page Register

0090-0091 System reserved

0092 Fast A20 gate and CPU reset*

0093-009F System reserved

00A0-00A1 Slave Interrupt Controller

00A2-00BF System reserved

00C0-00DF Slave DMA Controller #2

00E0-00EF System reserved

00F0-00FF Math Coprocessor

01F0-01F7 SATA Controller

02F8-02FF Serial Port 2 (COM1)*

03B0-03BB Video (monochrome)

03F8-03FF Serial Port 1 (COM0)*

04D0-04D1 Edge/Level Trigger PIC

0CF9 Reset Control Register

*Located on the baseboard.

nanoX-TCR Reference Manual 21

Chapter 3 Hardware

COM Express A-B Connector

This section provides descriptions of interfaces and signals within the COM Express A-B connector. The COM Express A-B connector provides the following features:

• LPC interface

• SATA interface

• USB interface

• Power interface

• Power Management

• Video interfaces

• HD Audio interface

• Gigabit Ethernet interface

• I²C interface

• PCI Express

• SMBus

• CAN Bus [Optional]

• GPIO

LPC Interface

The nanoX-TCR offers the LPC (Low Pin Count) bus through the CPU. Many devices already exist for this Intel defined bus. The LPC bus corresponds approximately to a serialized ISA bus yet with a significantly reduced number of signals. Because of the software compatibility to an ISA bus, I/O extensions such as additional serial ports can be easily implemented on an application specific baseboard using this bus.

SATA Interface

Two Serial ATA connections (SATA0 and SATA1) are provided through the Intel® SATA1 port is dedicated for an optional SSD (Solid State Drive) and is not available for use if the board model supports an SSD. SATA is an enhancement of parallel ATA therefore offering higher performance. As a result of this enhancement, the traditional restrictions of parallel ATA are overcome with respect to speed and EMI. SATA starts with a transfer rate of 1.5 Gb/s and can be expanded up to 3Gb/s. SATA is completely protocol and software compatible to parallel ATA.

EG20T

(PCH). The

USB Interface

The PCH offers two USB host controllers, which contain six USB ports. Each port complies with USB standards 1.1 and 2.0 and offers high-speed, full-speed, and low-speed capabilities. The USB interface also provides one USB client port for the Mini-USB connector on the baseboard.

Power Interface

A 12V voltage rail on the A-B COM Express connector accepts the voltages required for the board. The RTC 3.3V battery feed and 5V standby functions draw power through the A-B connector. The nanoX-TCR requires a 4.75V to 14V wide-range power supply with optional 5V standby for ATX support.

Power Management

The nanoX-TCR is ACPI 3.0 compliant with smart battery support. The board supports S0, S1, S3, S4, and S5 sleep states.

22 Reference Manual nanoX-TCR

Chapter 3 Hardware

Video Interfaces

The Atom™ E6XXT CPU provides an integrated 2D/3D graphics engine, which supports video decode such as MPEG2, MPEG4, VC1, WMV9, H.264 (main, baseline at L3 and High-profile level 4.0/4.1), and DivX* as well as video encode such as MPEG4, H.264 (baseline at L3). The CPU supports LVDS and SDVO display ports, permitting simultaneous, independent operation of two displays. The video interface features are listed in the following two bullet lists.

LVDS

• Supports a maximum resolution of 1280 x 768 at 60 Hz (pixel clock rate up to 80 MHz)

• Supports minimum pixel clock rate of 19.75 MHz

• Supports pixel color depths of 18 and 24 bits

• Supports 20 MHz to 80 MHz derivative clock frequency

SDVO

• Supports a maximum resolution of 1280 x 1024 at 85Hz (pixel clock rate up to 160MHz)

• Supports 100MHz to 160MHz derivative clock frequency

• Supports third-party output formats such as DVI, LVDS, HDMI, TV-Out, and VGA

• Provides a control bus able to operate at up to 1MHz

Audio Interface

The High Definition (HD) Audio controller resides in the CPU and communicates with external codec(s) on the baseboard (such as audio and modem codecs) over the Intel HD Audio serial link. The PCH implements a single Serial Data Output signal (AC/HDA_SDOUT) that is connected to all external codecs. Two Serial Digital Input signals (AC/HDA_SDIN) support up to two codecs.

Ethernet Interface

The nanoX-TCR supports one Gigabit Ethernet interface. The Ethernet interface is implemented from the 82574IT Ethernet controller and provides one GLAN interface, which occupies PCI Express port 1. The Ethernet function supports multi-speed operation at 10/100/1000 Mbps and operates in full-duplex at all supported speeds or half duplex at 10/100 Mbps while adhering to the IEEE 802.3x flow control specification.

The Ethernet interface offers the following features:

• Full duplex or half duplex support at 10 Mbps, 100 Mbps, or 1000 Mbps

• In full duplex mode, the Ethernet controller adheres to the IEEE 802.3x Flow Control specification

• In half duplex mode, performance is enhanced by a proprietary collision reduction mechanism

• IEEE 802.3 compatible physical layer to wire transformer

• IEEE 802.3u Auto-Negotiation support

• Fast back-to-back transmission support with minimum interframe spacing (IFS)

• IEEE 802.3x auto-negotiation support for speed and duplex operation

• 3 kB transmit and 3 kB receive FIFOs (helps prevent data underflow and overflow)

• Requires magnetics (Ethernet isolation transformer) on the baseboard

nanoX-TCR Reference Manual 23

Chapter 3 Hardware

I²C™ Bus

The I²C bus is implemented through the use of the Atmel ATmega168 board controller. The board controller provides a Fast Mode (400kHz max.) multi-master I²C bus that has maximum I²C bandwidth. Use the ADLINK Intelligent Device Interface (AIDI) Library for access to the I²C bus. AIDI driver information is available in the Utilities link of the nanoX-TCR product page at: http://www.adlinktech.com demo program and the AIDI User’s Manual describing how to use the I²C bus also reside in the Utilities link of the nanoX-TCR product page.

. An AIDI

PCI Express

™

The nanoX-TCR offers four (4x) PCI Express x1 ports (ports 0-3) through the COM Express A-B connector, originating from the CPU. Ports 2 and 3 can be configured to support PCI Express edge cards or ExpressCards, supporting up to 2.5 Gb/s bandwidth in each direction. The first x1 port (port 0) acts as the connection between the CPU and the PCH and cannot be used as a PCIe port. The second x1 port (port 1) is occupied by the onboard Gigabit Ethernet controller and is also unavailable as a PCIe port. The PCI Express interface is based on the PCI Express Specification 1.0a.

System Management Bus (SMBus)

The E6XXT chip contains a host SMBus port. The host port allows the CPU access to the SMBus slaves. The SMBus slaves include the Gigabit Ethernet Controller and the CPU Temperature Sensor. Table 3-4 lists the device names and corresponding reserved binary addresses on the SMBus.

Table 3-4. SMBus Reserved Addresses

Component Address (binary)

CPU Temperature Sensor 1001,100x

Gigabit Ethernet Controller 1100,001x

CAN Bus [Optional]

The CAN controller resides in the PCH and performs communication in accordance with the Bosch CAN Protocol version 2.0B (standard and extended formats.) The CAN controller transmits and receives CAN signals to and from the CAN header on the baseboard. The CAN interface delivers CAN signals used for automotive, industrial automation, and medical scanning and imaging applications. The following list describes some of the features of the CAN Bus Interface.

♦

+/- 12 kV ESD protection

♦

Low-current Standby mode with bus wake up: 5 A typical

♦

Bus-fault protection of -27V to 40V

♦

Over-temperature shutdown

NOTE Please contact your ADLINK sales representative for ordering information on

the optional CAN bus.

24 Reference Manual nanoX-TCR

Chapter 3 Hardware

GPIO

The nanoX-TCR provides GPIO (General Purpose I/O) pins for custom use through the COM Express A-B connector. Use the ADLINK Intelligent Device Interface (AIDI) Library to configure the GPIO interface. AIDI driver information is available in the Utilities link of the nanoX-TCR product page at:

http://www.adlinktech.com

GPIO pins also reside in the Utilities link of the nanoX-TCR product page.

For more information about GPIO pin operation, refer to the PCA9535BS GPIO Generator Datasheet. Refer to “References” on page 1 for a hyper link to the datasheet.

Table 3-5 provides the pin signals for the COM Express A-B connector.

Table 3-5. COM Express A-B Connector Signal Descriptions

Pin # Row A Pin # Row B

A1 GND B1 GND

A2 GBE0_MDI3- B2 GBE0_ACT# (PU 10k 3.3V)

A3 GBE0_MDI3+ B3 LPC_FRAME#

A4 GBE0_LINK100# (Ethernet Speed LED) B4 LPC_AD0

A5 GBE0_LINK1000# (Ethernet Speed LED) B5 LPC_AD1

A6 GBE0_MDI2- B6 LPC_AD2

A7 GBE0_MDI2+ B7 LPC_AD3

A8 GBE0_LINK# (LAN Link LED) B8 NC (Not Connected)

A9 GBE0_MDI1- B9 NC (Not Connected)

A10 GBE0_MDI1+ B10 LPC_CLK

A11 GND B11 GND

A12 GBE0_MDI0- B12 PWRBTN# (PU 10k 3.3V S5 Standby)

A13 GBE0_MDI0+ B13 SMB_CK (PU 4.7k 3.3V S5 Standby)

A14 GBE0_CTREF B14 SMB_DAT (PU 4.7k 3.3V S5 Standby)

A15 SUS_S3# B15 SMB_ALERT#

A16 SATA0_TX+ B16 SATA1_TX+ (Occupied by optional SSD)

A17 SATA0_TX- B17 SATA1_TX- (Occupied by optional SSD)

A18 SUS_S4# B18 SUS_STAT# (Not Used)

A19 SATA0_RX+ B19 SATA1_RX+ (Occupied by optional SSD)

A20 SATA0_RX- B20 SATA1_RX- (Occupied by optional SSD)

A21 GND B21 GND

A22 RSVD B22 RSVD

A23 RSVD B23 RSVD

A24 SUS_S5# (Connected S4) B24 PWR_OK

A25 RSVD B25 RSVD

A26 RSVD B26 RSVD

A27 BATLOW# () B27 WDT (PU 10k 3.3V S5 Standby)

A28 ATA_ACT# (PU 10k 3.3V) B28 NC (Not Connected)

A29 AC/HDA_SYNC B29 AC_SDIN1 (Weak Pull Down)

A30 AC/HDA_RST# B30 AC_SDIN0 (Weak Pull Down)

A31 GND B31 GND

. An AIDI demo program and the AIDI User’s Manual describing how to use the

nanoX-TCR Reference Manual 25

Chapter 3 Hardware

Table 3-5. COM Express A-B Connector Signal Descriptions (Continued)

A32 AC/HDA_BITCLK (Int. weak Pull-

B32 SPKR (HDA Speaker)

Down)

A33 AC/HDA_SDOUT B33 I2C_CK

A34 BIOS_DISABLE# (PU 10k 3.3V S5

B34 I2C_DAT

Standby)

A35 THRMTRIP# (PU 1k 3.3V) B35 THRM# (Over Temperature

- PU 1.2k 3.3V S5 Standby)

A36 NC (Not Connected) B36 USB7- (Client Port)

A37 NC (Not Connected) B37 USB7+ (Client Port)

A38 USB_6_7_OC# (PU 10k 3.3V) B38 USB_4_5_OC# (PU 10k 3.3V)

A39 USB4- B39 USB5-

A40 USB4+ B40 USB5+

A41 GND B41 GND

A42 USB2- B42 USB3-

A43 USB2+ B43 USB3+

A44 USB_2_3_OC# (PU 10k 3.3V) B44 USB_0_1_OC# (PU 10k 3.3V)

A45 USB0- B45 USB1-

A46 USB0+ B46 USB1+

A47 VCC_RTC (VBAT) B47 EXCD1_PERST# (Express Card Reset -

PU 10k 3.3V S5 Standby)

A48 EXCD0_PERST# (Express Card Reset -

PU 10k 3.3V S5 Standby)

A49 EXCD0_CPPE# (Express Card

B48 EXCD1_CPPE# (Express Card Capable

Request - PU 10k 3.3V S5 Standby)

B49 SYS_RESET# Capable Request - PU 10k 3.3V S5 Standby)

A50 LPC_SERIRQ (PU 10k 3.3V S5

B50 CB_RESET# (Carrier Board Reset)

Standby)

A51 GND B51 GND

A52 NC (Not Connected) B52 NC (Not Connected)

A53 NC (Not Connected) B53 NC (Not Connected)

A54 GPI0 B54 GPO1

A55 NC (Not Connected) B55 NC (Not Connected)

A56 NC (Not Connected) B56 NC (Not Connected)

A57 GND B57 GPO2

A58 PCIE3_TX+ (Occupied by Gb

Ethernet - PCIE1 of CPU)

A59 P CIE3_TX- (Occup ied by

Gb Ethernet PCIE1 of CPU)

B58 PCIE3_RX+ (Occupied by Gb

Ethernet - PCIE1 of CPU)

B59 PCIE3_RX- (Occupied by Gb

Ethernet - PCIE1 of CPU)

A60 GND B60 GND

A61 PCIE2_TX+ (Occupied by PCH - PCIE0) B61 PCIE2_RX+ (Occupied by PCH - PCIE0)

26 Reference Manual nanoX-TCR

Chapter 3 Hardware

Table 3-5. COM Express A-B Connector Signal Descriptions (Continued)

A62 PCIE2_TX- (Occupied by PCH - PCIE0) B62 PCIE2_RX- (Occupied by PCH - PCIE0)

A63 GPI1 B63 GPO3

A64 PCIE1_TX+ B64 PCIE1_RX+

A65 PCIE1_TX- B65 PCIE1_RX-

A66 GND B66 WAKE0# (PU 1k 3.3V S5 Standby)

A67 GPI2 B67 WAKE1# (PU 1k 3.3V S5 Standby)

A68 PCIE0_TX+ B68 PCIE0_RX+

A69 PCIE0_TX- B69 PCIE0_RX-

A70 GND B70 GND

A71 LVDS_A0+ B71 DDIO_PAIR0+ (SDVO_RED+)

A72 LVDS_A0- B72 DDIO_PAIR0- (SDVO_RED-)

A73 LVDS_A1+ B73 DDIO_PAIR1+ (SDVO_GREEN+)

A74 LVDS_A1- B74 DDIO_PAIR1- (SDVO_GREEN-)

A75 LVDS_A2+ B75 DDIO_PAIR2+ (SDVO_BLUE+)

A76 LVDS_A2- B76 DDIO_PAIR2- (SDVO_BLUE-)

A77 LVDS_VDD_EN (PD 10k) B77 DDIO_PAIR4+ (SDVO_INT+)

A78 LVDS_A3+ B78 DDIO_PAIR4- (SDVO_INT-)

A79 LVDS_A3- B79 LVDS_BKLT_EN (Backlight Enable)

A80 GND B80 GND

A81 LVDS_A_CK+ B81 DDIO_PAIR3+ (SDVO_CLK+)

A82 LVDS_A_CK- B82 DDIO_PAIR3- (SDVO_CLK-)

A83 LVDS_I2C_CK (PU 2.2k 3.3V

B83 LVDS_BKLT_CTRL (Backlight Brightness)

S5 Standby)

A84 LVDS_I2C_DAT (PU 2.2k 3.3V

B84 VCC_5V_SBY

S5 Standby)

A85 GPI3 (PU 10k 3.3V S5 Standby) B85 VCC_5V_SBY

A86 RSVD B86 VCC_5V_SBY

A87 RSVD B87 VCC_5V_SBY

A88 PCIE_CK_REF+ B88 BIOS_DS1# (PU 10k 3.3V Standby)

A89 PCIE_CK_REF- B89 DD0_HPD (Hot Plug Detect - PU

10k 3.3V Standby)

A90 GND B90 GND

A91 SPI_POWER (3.3 V S5 Standby) B91 DDIO_PAIR5+

(SDVO_TVCLKINP)

A92 SPI_MISO B92 DDIO_PAIR5-

(SDVO_TVCLKINN)

A93 GPO0 B93 DDIO_PAIR6+ (SDVO_STALLP)

A94 SPI_CLK B94 DDIO_PAIR6- (SDVO_STALLN)

A95 SPI_MOSI B95 RSVD

A96 NC (Not Connected) B96 RSVD

A97 NC (Not Connected) B97 SPI_CS# (SPI Chip Select for Carrier)

nanoX-TCR Reference Manual 27

Chapter 3 Hardware

Table 3-5. COM Express A-B Connector Signal Descriptions (Continued)

A98 SER0_TX B98 DDI0_CTRLCLK_AUX+

(SDVO Control Clock)

A99 SER0_RX B99 DDI0_CTRLDATA_AUX-

(SDVO Control Data)

A100 GND B100 GND

A101 SER1_TX B101 FAN_PWMOUT (Fan Speed Control)

A102 SER1_RX B102 FAN_TACHIN (Fan Tachometer -

PU 10k 3.3V)

A103 LID# (ACPI type LID Switch -

PU 10k 3.3V S5 Standby)

A104 VCC_12V B104 VCC_12V

A105 VCC_12V B105 VCC_12V

A106 VCC_12V B106 VCC_12V

A107 VCC_12V B107 VCC_12V

A108 VCC_12V B108 VCC_12V

A109 VCC_12V B109 VCC_12V

A110 GND B110 GND

B103 SLEEP# (GPIO4 of PCH -

PU 10k 3.3V S5 Standby)

Watchdog Timer

The Watchdog Timer (WDT) restarts the system if a mishap occurs, ensuring proper start-up after the interruption. Possible problems include failure to boot properly, the application software’s loss of control, failure of an interface device, unexpected conditions on the bus, or other hardware or software malfunctions. Use the ADLINK Intelligent Device Interface (AIDI) Library to configure the WDT interface. AIDI driver information is available in the Utilities link of the nanoX-TCR product page at: http://www.adlinktech.com An AIDI demo program and the AIDI User’s Manual showing how to use the WDT function also reside in the Utilities link of the nanoX-TCR product page.

The WDT (Watchdog Timer) can be used both during the boot process and during normal system operation.

• During the Boot process – If the OS fails to boot in the time interval set in the AIDI Library, the system

will reset.

Enable the WDT as described in the AIDI Library User’s guide. Set the WDT for a time-out interval in seconds, between 1 and 255, in one second increments. Ensure you allow enough time for the boot process to complete and for the OS to boot. The OS or application must tickle the WDT as soon as it comes up.

• During System Operation – The user can set up the WDT hardware by accessing the hardware directly

using the AIDI Library. The system must tickle the WDT in the time set when the WDT is initialized or the system will be reset.

• Watchdog Code example – ADLINK provides a source code example (AIDI demo program) in the

Utilities link of the nanoX-TCR product page illustrating how to control the WDT. The code example can be easily copied to your development environment to compile and test or make any desired changes before compiling.

28 Reference Manual nanoX-TCR

Chapter 3 Hardware

Temperature Sensor

The nanoX-TCR provides a temperature sensor to ensure the health of your embedded system with built-in support for monitoring and control of system temperatures, fan speeds, and critical module voltage levels. The AIDI Library provides simple APIs at the application level to support these functions and adds alarm functions when voltage or temperature levels exceed the upper or lower limits set by the user. AIDI driver information for the nanoX-TCR is available in the Utilities link of the nanoX-TCR product page at:

http://www.adlinktech.com

Temperature Sensor also reside in the Utilities link of the nanoX-TCR product page.

. An AIDI demo program and the AIDI User’s Manual showing how to use the

nanoX-TCR Reference Manual 29

Chapter 3 Hardware

30 Reference Manual nanoX-TCR

Chapter 4 BIOS Setup

Introduction

This section assumes the user is familiar with general BIOS Setup and does not attempt to describe the BIOS functions. Refer to “BIOS Setup Menus ” on page 33 in this chapter for a map of the BIOS Setup settings. If ADLINK has added to or modified any of the standard BIOS functions, these functions will be described.

Entering BIOS Setup (Local Video Display)

To enter BIOS Setup using a local video display for the nanoX-TCR:

1. Power on the display and the power supply to the nanoX-TCR.

2. Start Setup by pressing the [Del] or [F2] keys (F2 allows you to load previous settings) when the following message appears on the boot screen.

Please wait. This will take a few seconds

NOTE If the setting for Fast Boot is [Enabled], the system may not enter the BIOS set

up if you do not press the <Del> or <F2> keys early in the boot sequence.

3. Follow the instructions on the right side of the screen to navigate through the selections and modify any settings.

Entering BIOS Setup (Serial Port Console)

This section describes how to enter the BIOS setup through a remote serial terminal or PC.

1. Turn on the power supply to the nanoX-TCR and enter the BIOS Setup Utility using a local video display.

2. Ensure the BIOS feature Serial Port Console Redirection is set to [Enabled] under the Advanced menu.

3. Accept the default options or make your own selections for the balance of the Console Redirection fields and record your settings.

4. Ensure you select the type of remote serial terminal you will be using and record your selection.

5. Select Save Changes and Exit and then shut down the nanoX-TCR.

6. Connect the remote serial terminal (or the PC with communications software) to the COM port you selected and recorded earlier in the procedure.

7. Turn on the remote serial terminal or PC and set it to the settings you selected earlier in the procedure.

The default settings for the nanoX-TCR are:

♦

ANSI

♦

115200

♦

8 bits

♦

no parity (None)

♦

1 stop bit

♦

no flow control (None)

♦

Disabled Recorder Mode

♦

Disabled Resolution 100x31

♦

[80x24] for Legacy OS Redirection

nanoX-TCR Reference Manual 31

Chapter 4 BIOS Setup

8. Restore power to the nanoX-TCR.

9. Press the F2 key to enter Setup (early in the boot sequence if Fast Boot is set to [Enabled].)

If Fast Boot is set to [Enabled], you may never see the screen prompt.

10. Use the <Enter> key to select the screen menus listed in the Opening BIOS screen.

NOTE The serial console port is not hardware protected. Diagnostic software that

probes hardware addresses may cause a loss or failure of the serial console functions.

OEM Logo Utility

The nanoX-TCR BIOS supports a graphical logo utility, which allows the user to customize the boot screen image. The graphical image can be a company logo or any custom image the user wants to display during the boot process. The custom image can be displayed as the first image on screen during the boot process and remain there while the OS boots, depending on the options selected in BIOS Setup.

NOTE The Quiet Boot feature must be set to Enabled in the Boot screen of BIOS Setup

for the system to recognize the OEM Logo feature.

Logo Image Requirements

Please contact your ADLINK Sales Representative for more information on OEM Logo Utility requirements.

32 Reference Manual nanoX-TCR

Chapter 4 BIOS Setup

BIOS Setup Menus

This section provides illustrations of the six top-level setup screens in the nanoX-TCR BIOS Setup Utility. Below each illustration is a bullet list of the screen’s submenus and setting selections. The setting selections are presented in brackets after each submenu or menu item, and the optimal default settings are presented in bold. For more detailed definitions of the BIOS settings, refer to the AMI Aptio TSE User Manual: http://www.ami.com/support/doc/AMI_TSE_User_Manual_PUB.pdf

Table 4-1. BIOS Setup Menus

BIOS Setup Utility Menu Item/Topic

Main Date and Time

Advanced Launch PXE OpROM, ACPI, CPU, USB, Hardware Monitor, Super IO,

Serial Port Console Redirection

Chipset North Bridge and South Bridge

Boot Boot up Settings, Boot Options, Boot Order

Security Setting or changing Passwords

Save & Exit Exiting with or without changing settings, Loading and restoring

Optimal or User defaults

Main BIOS Setup Screen

Aptio Setup Utility - Copyright (C) 20XX Amreican Megatrends, Inc.

Main Advanced Chipset Boot Security Save & Exit

BIOS Information Project Version NATCR X.XX Build Date XX/XX/XXXX XX:XX:XX

Memory Information Total Memory XXXX MB (DDR2)

System and Board Info

System Date [Xxx XX/XX/20XX] System Time [XX:XX:XX]

Version X.XX.XXXX. Copyright (C) 20XX American Megatrends, Inc.

[Setting Description]

: Select Screen

: Select Item

Enter : Select +/- : Change Opt.

F1 : General Help F2 : Previous Values F3 : Optimized Defaults F4 : Save & Exit ESC: Exit

nanoX-TCR_BIOS_Main_a

Figure 4-1. Main BIOS Setup Screen

• System and Board Info

♦

BIOS Rev. [XXX]

♦

BC Firmware Rev. [X.X.X]

nanoX-TCR Reference Manual 33

Chapter 4 BIOS Setup

♦

Manufacture Date [XX/XX/20XX]

♦

Last Repair Date [XX/XX/20XX]

♦

Serial Number [XXXXXXXXXX]

♦

Hardware Rev [XXXXX-XXXX-XXXX]

♦

LAN MAC ID [XX-XX-XX-XX-XX-XX]

♦

Boot Counter [XXXXXXXX]

♦

Running Time [XXXXX HRs]

• System Date

System Date (day of week, mm:dd:yyyy) – This field requires the alpha-numeric entry of the day of week, day of the month, calendar month, and all 4 digits of the year, indicating the century plus year (Fri XX/XX/20XX).

• System Time

System Time (hh:mm:ss) – This is a 24-hour clock setting in hours, minutes, and seconds.

Advanced BIOS Setup Screen

Aptio Setup Utility - Copyright (C) 20XX American Megatrends, Inc.

Main Advanced Chipset Boot Security Save & Exit

Legacy OpROM Support

Launch PXE OpROM [Disabled]

ACPI Settings Trusted Computing CPU Configuration

USB Configuration H/W Monitor LM96163 Super IO Configuration

Serial Port Console Redirection

Version X.XX.XXXX. Copyright (C) 20XX American Megatrends, Inc.

[Setting Description]

: Select Screen

: Select Item

Enter : Select +/- : Change Opt.

F1 : General Help F2 : Previous Values F3 : Optimized Defaults F4 : Save & Exit ESC: Exit

nanoX-TCR_BIOS_Advanced_a

Figure 4-2. Advanced BIOS Setup Screen

• Legacy OpROM Support

♦

Launch PXE OpROM [Disabled; Enabled]

34 Reference Manual nanoX-TCR

Chapter 4 BIOS Setup

• Trusted Computing

♦

TPM SUPPORT [Disabled; Enabled]

♦

Current TPM Status Information [no TPM on board]

• CPU Configuration

♦

Processor Type Genuine Intel(R) CPU

♦

EMT64 Supported

♦

Processor Speed XXXX MHz

♦

System Bus Speed XXX MHz

♦

Ratio Status XX

♦

Actual Ratio XX

♦

Processor Stepping XXXXX

♦

Microcode Revision XXX

♦

L1 Cache RAM XX k

♦

L1 Cache RAM XXX k

♦

Processor Core Single

♦

Hyper-Threading Supported

♦

Intel SpeedStep [Disabled; Enabled]

♦

Hyper-Threading [Disabled; Enabled]

♦

Execute Disable Bit [Disabled; Enabled]

♦

Limit CPUID Maximum [Disabled; Enabled]

♦

Intel Virtualization Technology [Disabled; Enabled]

♦

C-States [Disabled; Enabled]

• USB Configuration

♦

USB Devices:

1 Keyboard

• Legacy USB Support [Disabled; Enabled]

• EHCI Hand-off [Disabled; Enabled]

• H/W Monitor LM9163

♦

Pc Health Status

• System temperature : +XX C

• CPU temperature (By PECI) : +XX C

• Fan1 Speed : N/A

• Fan2 Speed : N/AXXXX RPM

• Fan3 Speed : N/A

• Fan4 Speed : N/A

nanoX-TCR Reference Manual 35

Chapter 4 BIOS Setup

• Super IO Configuration

♦

Serial Port 0 Configuration

• Serial Port [Disabled; Enabled]

• Device Settings IO=3F8h; IRQ=4

• Change Settings [Auto;

IO=3F8h; IRQ=4;

IO=3F8h; IRQ=3, 4, 5, 6, 7, 10, 11, 12;

IO=2F8h; IRQ=3, 4, 5, 6, 7, 10, 11, 12;

IO=3E8h; IRQ=3, 4, 5, 6, 7, 10, 11, 12;

IO=2E8h; IRQ=3, 4, 5, 6, 7, 10, 11, 12;]

♦

Serial Port 1 Configuration

• Serial Port [Disabled; Enabled]

• Device Settings IO=2F8h; IRQ=3

• Change Settings [Auto;

IO=2F8h; IRQ=3;

IO=3F8h; IRQ=3, 4, 5, 6, 7, 10, 11, 12;

IO=2F8h; IRQ=3, 4, 5, 6, 7, 10, 11, 12;

IO=3E8h; IRQ=3, 4, 5, 6, 7, 10, 11, 12;

IO=2E8h; IRQ=3, 4, 5, 6, 7, 10, 11, 12;]

• Serial Port Console Redirection

♦

COM0

• Console Redirection [Disabled; Enabled]

• Console Redirection Settings

- Terminal Type [VT100; VT100+; VT-UTF8; ANSI]

- Bits per second [9600; 19200; 38400; 57600; 115200]

- Data Bits [7; 8]

- Parity [None; Even; Odd; Mark; Space]

- Stop Bits [1; 2]

- Flow Control [None; Hardware RTS/CTS]

- Recorder Mode [Disabled; Enabled]

- Resolution 100x31 [Disabled; Enabled]

- Legacy OS Redirection Resolution [80x24; 80x25]

♦

COM1

• Console Redirection [Disabled; Enabled]

• Console Redirection Settings [Same as COM0]

NOTE The serial port console is not hardware protected. Diagnostic software that

probes hardware addresses may cause a loss or failure of the serial console functions.

36 Reference Manual nanoX-TCR

Chapter 4 BIOS Setup

Chipset BIOS Setup Screen

Aptio Setup Utility - Copyright (C) 20XX American Megatrends, Inc.

Main Advanced Chipset Boot Security Save & Exit

North Bridge Chipset Configuration

South Bridge Chipset Configuration

Version X.XX.XXXX. Copyright (C) 20XX American Megatrends, Inc.

[Setting Description]

: Select Screen

: Select Item

Enter : Select +/- : Change Opt.

F1 : General Help F2 : Previous Values F3 : Optimized Defaults F4 : Save & Exit ESC: Exit

nanoX-TCR_BIOS_Chipset_a

Figure 4-3. Chipset BIOS Setup Screen

• North Bridge Chipset Configuration

♦

Memory Information

• Total Memory XXXX MB (DDR2)

♦

IGD Mode Select [Disabled;

Enabled, 1MB;

Enabled, 4MB;

Enabled, 8MB;

Enabled, 16MB;

Enabled, 32MB;

Enabled, 48MB;

Enabled, 64MB]

♦

MSAC Mode Select [Enabled, 512MB;

Enabled, 256MB;

Enabled, 128MB]

♦

Boot Display Configuration

• Boot Display Device [Integrated LVDS; External DVI/HDMI]

• Flat Panel Type [640x480 18bit(generic);

nanoX-TCR Reference Manual 37

Chapter 4 BIOS Setup

800x600 18bit(generic);

1024x600 18bit;

1024x768 18bit;

1280x768 18bit;

640x480 24bit;

800x600 24bit;

1024x600 24bit;

1024x768 24bit;

1280x768 24bit]

• LVDS Backlight Controller [0%; 20%; 40%; 60%; 80%; 100%]

• South Bridge Chipset Configuration

♦

Audio Controller [Disabled; Enabled; Auto]

♦

SMBus Controller [Enabled; Disabled]

♦

PCI Express Ports Configuration

• PCI Express Root Port 0 [Disabled; Enabled]

• PCI Express Root Port 1 [Disabled; Enabled]

• PCI Express Root Port 2 [Disabled; Enabled]

• PCI Express Root Port 3 [Disabled; Enabled]

38 Reference Manual nanoX-TCR

Chapter 4 BIOS Setup

Boot BIOS Setup Screen

Aptio Setup Utility - Copyright (C) 20XX Amreican Megatrends, Inc.

Main Advanced Chipset Boot Security Save & Exit

Boot Configuration

Quiet Boot [Disabled] Fast Boot [Disabled] Setup Prompt Timeout 1

Bootup NumLock State [On]

Boot Option Priorities

Boot Option #1 [P1SILICONMOTION S. . .]

Boot Option #2 [UEFI: Hard Drive]

Hard Drive BBS Priorities

Version X.XX.XXXX. Copyright (C) 20XX American Megatrends, Inc.

[Setting Description]

: Select Screen

: Select Item

Enter : Select +/- : Change Opt.

F1 : General Help F2 : Previous Values F3 : Optimized Defaults F4 : Save & Exit ESC: Exit

nanoX-TCR_BIOS_Boot_a

• Boot Configuration

♦

Quiet Boot [Disabled; Enabled]

♦

Fast Boot [Disabled; Enabled]

♦

Setup Prompt Timeout 1

♦

Bootup NumLock State [On; Off]

• Boot Option Priorities

♦

Boot Option #1 [P1-SILICONMOTION SM631GX8AB; UEFI: Hard Drive; Disabled]

♦

Boot Option #2 [P1-SILICONMOTION SM631GX8AB; UEFI: Hard Drive; Disabled]

♦

Hard Drive BBS Priorities

• Boot Option #1 [P1-SILICONMOTION SM631GX8AB; SDHC - SDC; Disabled]

• Boot Option #2 [P1-SILICONMOTION SM631GX8AB; SDHC - SDC; Disabled]

Figure 4-4. Boot BIOS Setup Screen

nanoX-TCR Reference Manual 39

Chapter 4 BIOS Setup

Security BIOS Setup Screen

Aptio Setup Utility - Copyright (C) 20XX American Megatrends, Inc.

Main Advanced Chipset Boot Security Save & Exit

Password Description

If ONLY the Administrator’s password is set, then this only limits access to Setup and is only asked for when entering Setup. If ONLY the User’s password is set, then this is a power on password and must be entered to boot or enter Setup. In Setup the User will have Administrator rights.

Administrator Password

User Password

Version X.XX.XXXX. Copyright (C) 20XX American Megatrends, Inc.

[Setting Description]

: Select Screen

: Select Item

Enter : Select +/- : Change Opt.

F1 : General Help F2 : Previous Values F3 : Optimized Defaults F4 : Save & Exit ESC: Exit

nanoX-TCR_BIOS_Security_a

• Password Description

♦

Administrator Password [Create New Password]

♦

User Password [Create New Password]

Figure 4-5. Security BIOS Setup Screen

40 Reference Manual nanoX-TCR

Chapter 4 BIOS Setup

Save & Exit BIOS Setup Screen

Aptio Setup Utility - Copyright (C) 20XX American Megatrends, Inc.

Main Advanced Chipset Boot Security Save & Exit

Save Changes and Exit Discard Changes and Exit Save Changes and Reset

Discard Changes and Reset

Save Options

Save Changes Discard Changes

Restore Defaults Save as User Defaults

Restore User Defaults

Boot Override

P1-SILICONMOTION SM631GX8 AB SDHC - SDC UEFI: Hard Drive

Version X.XX.XXXX. Copyright (C) 20XX American Megatrends, Inc.

[Setting Description]

: Select Screen

: Select Item

Enter : Select

+/- : Change Opt. F1 : General Help

F2 : Previous Values F3 : Optimized Defaults

F4 : Save & Exit

ESC: Exit

nanoX-TCR_BIOS_Save&Exit_a

• Exit and Reset Options

♦

Save Changes and Exit

• Save configuration and exit? [Ye s ; No]

♦

Discard Changes and Exit

• Quit without saving? [Ye s ; No] (ESC key can be used for this operation.)

♦

Save Changes and Reset

• Save configuration and reset? [Ye s ; No]

♦

Discard Changes and Reset

• Reset without saving? [Ye s ; No]

• Save Options

♦

Save Changes

• Save configuration [Ye s ; No]

♦

Discard Changes (F7 key can be used for this operation.)

• Load Previous Values [Ye s ; No]

♦

Restore Defaults

Figure 4-6. Save & Exit BIOS Setup Screen

• Load Optimized Defaults [Ye s ; No]

nanoX-TCR Reference Manual 41

Chapter 4 BIOS Setup

♦

Save as User Defaults

• Save configuration? [Ye s ; No]

♦

Restore User Defaults

• Restore User Defaults? [Ye s ; No]

• Boot Override

♦

P1-SILICONMOTION SM631GX8AB

♦

SDHC - SDC

♦

UEFI: Hard Drive

42 Reference Manual nanoX-TCR

Appendix A Technical Support

ADLINK Technology, Inc.

Address: 9F, No.166 Jian Yi Road, Zhonghe District New Taipei City 235, Taiwan

ᄅקؑխࡉ೴৬ԫሁ 166 ᇆ 9 ᑔ

Tel: +886-2-8226-5877 Fax: +886-2-8226-5717 Email: service@adlinktech.com

Ampro ADLINK Technology, Inc.

Address: 5215 Hellyer Avenue, #110, San Jose, CA 95138, USA Tel: +1-408-360-0200 Toll Free: +1-800-966-5200 (USA only) Fax: +1-408-360-0222 Email: info@adlinktech.com

ADLINK Technology (China) Co., Ltd.

Address: Ϟ⍋Ꮦ⌺ϰᮄᓴ∳催⾥ᡔು㢇᯹䏃 300 ো(201203) 300 Fang Chun Rd., Zhangjiang Hi-Tech Park,

Pudong New Area, Shanghai, 201203 China Tel: +86-21-5132-8988 Fax: +86-21-5132-3588 Email: market@adlinktech.com

ADLINK Technology, Inc. provides a number of methods for contacting Technical Support listed in the

Table A-1 below. Requests for support through Ask an Expert are given the highest priority, and usually will

be addressed within one working day.

• ADLINK Ask an Expert – This is a comprehensive support center designed to meet all your technical

needs. This service is free and available 24 hours a day through the Ampro By ADLINK web page at

http://www.adlinktech.com/AAE/

which will help you with the common information requested by most customers. This is a good source of information to look at first for your technical solutions. However, you must register online if you wish to use the Ask a Question feature.

ADLINK strongly suggests that you register with the web site. By creating a profile on the ADLINK web site, you will have a portal page called “My ADLINK”, unique to you with access to exclusive services and account information.

• Personal Assistance – You may also request personal assistance by creating an Ask an Expert account

and then going to the Ask a Question feature. Requests can be submitted 24 hours a day, 7 days a week. You will receive immediate confirmation that your request has been entered. Once you have submitted your request, you must log in to go to the My Question area where you can check status, update your request, and access other features.

• Download Service – This service is also free and available 24 hours a day at

http://www.adlinktech.com

. This includes a searchable database of Frequently Asked Questions,

. For certain downloads such as technical documents and software, you must

Table A-1. Technical Support Contact Information

Method Contact Information

Ask an Expert http://www.adlinktech.com/AAE/

Web Site http://www.adlinktech.com

Standard Mail

nanoX-TCR Reference Manual 43

Appendix A Technical Support

Table A-1. Technical Support Contact Information (Continued)

ADLINK Technology Beijing

Address: ࣫ҀᏖ⍋⎔Ϟഄϰ䏃 1 োⲜ߯ࡼ࡯໻ E ᑻ 801 ᅸ(100085)

Rm. 801, Power Creative E, No. 1, B/D

Shang Di East Rd., Beijing, 100085 China Tel: +86-10-5885-8666 Fax: +86-10-5885-8625 Email: market@adlinktech.com

ADLINK Technology Shenzhen

Address: ⏅ഇᏖቅ⾥ᡔು催ᮄϗ䘧᭄ᄫᡔᴃು

A1 󰶀 2 ὐ C  (518057)

2F, C Block, Bldg. A1, Cyber-Tech Zone, Gao Xin Ave. Sec. 7,

High-Tech Industrial Park S., Shenzhen, 518054 China Tel: +86-755-2643-4858 Fax: +86-755-2664-6353 Email: market@adlinktech.com

ADLINK Technology (Europe) GmbH

Address: Nord Carree 3, 40477 Duesseldorf, Germany Tel: +49-211-495-5552 Fax: +49-211-495-5557 Email: emea@adlinktech.com

ADLINK Technology, Inc. (French Liaison Office)

Address: 15 rue Emile Baudot, 91300 Massy CEDEX, France Tel: +33 (0) 1 60 12 35 66 Fax: +33 (0) 1 60 12 35 66 Email: france@adlinktech.com

ADLINK Technology Japan Corporation

Address: ͱ101-0045 ᵅҀ䛑ҷ⬄⼲⬄䤯ފ⬎ 3-7-4

⼲⬄ 374 ɛɳ 4F

KANDA374 Bldg. 4F, 3-7-4 Kanda Kajicho,

Chiyoda-ku, Tokyo 101-0045, Japan Tel: +81-3-4455-3722 Fax: +81-3-5209-6013 Email: japan@adlinktech.com

ADLINK Technology, Inc. (Korean Liaison Office)

Address: 昢殾柢昢爎割昢爎壟 1506-25 穢壊 B/D 2 猻

2F, Hando B/D, 1506-25, Seocho-Dong, Seocho-Gu,

Seoul 137-070, Korea Tel: +82-2-2057-0565 Fax: +82-2-2057-0563 Email: korea@adlinktech.com

ADLINK Technology Singapore Pte. Ltd.

Address: 84 Genting Lane #07-02A, Cityneon Design Centre,

Singapore 349584 Tel: +65-6844-2261 Fax: +65-6844-2263 Email: singapore@adlinktech.com

ADLINK Technology Singapore Pte. Ltd. (Indian Liaison Office)

Address: No. 1357, "Anupama", Sri Aurobindo Marg, 9th Cross, JP Nagar Phase I, Bangalore - 560078, India Tel: +91-80-65605817 Fax: +91-80-22443548 Email: india@adlinktech.com

44 Reference Manual nanoX-TCR

Index

AMI BIOS User’s Guide ...................................... 1

Ask an Expert Atom E6XXT CPU

..................................................... 43

.........................................5, 18

BIOS Setup Utility

access

............................................................ 31

Advanced screen Boot screen Chipset screen Main screen menus

............................................................ 33

Save & Exit screen Security screen

Splash Screen (OEM Logo) block diagram board

controller datasheet

controller description

dimensions

thickness

........................................................ 13

........................................... 34

.................................................... 39

............................................... 37

................................................... 33

........................................ 41

.............................................. 40

.......................... 32

....................................................... 8

......................................... 2

...................................... 9

.................................................... 13

CAN Bus Specification ......................................... 1

chip specifications COM Express

2.0 specification

A-B connector

Carrier Design Guide

signal descriptions components connector description cooling solution CPU

datasheet

description

................................................ 2

.............................................. 1

............................................... 22

...................................... 1

......................................... 25

........................................................... 9

.......................................... 12

.................................................. 16

.......................................................... 2

...................................................5, 9

DDR2 on-board memory ...................................... 5

dimensions

.......................................................... 13

E6XXT CPU ...................................................5, 18

Environmental specifications Ethernet

controller datasheet

description

EEPROM

interface expansion buses

....................................................... 6

........................................................ 9

......................................................... 23

.................................................... 5

.............................. 15

......................................... 2

features list ............................................................ 5

Gigabit Ethernet

controller description

interface

nanoX-TCR Reference Manual 45

.....................................................6, 23

...................................... 9

GPIO

description generator

.....................................................25

..........................................................9

hardware overview ..............................................17

HD Audio interface humidity

...............................................................15

........................................ 6, 23

I/O address map ...................................................21

I2C Specification Interrupt (IRQs) list

...................................................1

.............................................19

LPC

interface Specification

LVDS description

.........................................................22

....................................................1

................................................23

major components (ICs) ........................................9

memory

description EEPROM map

..........................................5, 10, 18

.........................................................9

................................................................20

OEM Logo Utility (Splash) ............................ 7, 32

operating temperature

..........................................15

PCH

datasheet description

PCI Express

description specification

power

consumption interface description management description management IC regulator

product description

..........................................................2

.......................................................9

.....................................................24

.....................................................1

...................................................15

......................................22

................................22

..............................................10

.........................................................10

................................................5

Real Time Clock (RTC) ........................................7

references

...............................................................1

CAN specification COM Express 2.0 specification COM Express Carrier Design Guide I2C specification LPC specification PCIe specification SATA specification

...........................................1

.......................1

..............................................1

............................................1

.........................................1

...............1

SATA

interface specification

.................................................... 6, 22

.....................................................1

Index

SD/GPIO switch SDVO description serial console

accessing BIOS

site preparation

environmental requirements

SMBus

................................................................24

specification references Splash Screen SSD (optional)

description

support

................................................................43

supported features

Atom E6XXT CPU DDR2 memory Ethernet port expansion buses Gigabit Ethernet interface HD Audio IRQ assignments memory map OEM Logo Utility (Splash) Real Time Clock (RTC) SATA Splash Screen (OEM Logo) temperature sensor USB ports video interfaces Watchdog Timer

................................................... 9

............................................... 23

............................................. 31

...................................................... 32

....................................................... 9

................................................5

.................................................. 23

............................................... 5

........................................................ 6

........................................... 19

.................................................. 20

.............................................................. 6

.......................................... 7

........................................................ 6

............................................... 6

........................................7, 28

.......................... 15

.........................................1

.........................................5

............................... 6

............................. 7

.................................. 7

.......................... 32

Technical

references support contact information

temperature

requirements sensor datasheet sensor description

sensor on feature list thermal cooling requirements thickness

........................................................ 1

.......................... 43

.................................................. 15

.............................................. 2

...................................10, 29

....................................... 7

............................. 16

............................................................. 13

USB interface .................................................6, 22

video interfaces ................................................... 23

Watchdog Timer .............................................7, 28

web sites

AMI BIOS Aptio TSE User’s Guide weight

................................................................. 13

.............. 1

46 Reference Manual nanoX-TCR

ADLINK nanoX-TCR User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Notice Page

Index