ADLINK nanoX-TCR User Manual
nanoX-TCR
(Computer-on-Module)
Reference Manual
P/N 50-1Z108-1000
Notice Page
DISCLAIMER
ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of
this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for
incidental or consequential damages or related expenses resulting from the use of this product, even if it has
been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from
time to time without obligation to notify any person of such revisions. If errors are found, please contact
ADLINK at the address listed on this Notice Page.
TRADEMARKS
CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard,
MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel,
RuffSystem, and ReadySystem are trademarks of ADLINK Technology, Inc. All other marks are the
property of their respective companies.
REVISION HISTORY
Revision Reason for Change Date
1000 Initial Release Jan/12
ADLINK Technology, Incorporated
5215 Hellyer Avenue, #110
San Jose, CA 95138-1007
Tel. 408 360-0200
Fax 408 360-0222
www.adlinktech.com
© Copyright 2012 ADLINK Technology, Incorporated
Audience
This manual provides reference only for computer design engineers, including but not limited to hardware
and software designers and applications engineers. ADLINK Technology, Inc. assumes you are qualified to
design and implement prototype computer equipment.
ii Reference Manual nanoX-TCR
Contents
Chapter 1 About This Manual ....................................................................................................1
Purpose of this Manual ....................................................................................................................1
References ..................................................................................................................................1
Chapter 2 Product Overview......................................................................................................3
COM Express Concept ....................................................................................................................3
COM Express Architecture ..............................................................................................................4
Product Description..........................................................................................................................5
Module Features ........................................................................................................................5
Block Diagram ............................................................................................................................8
Major Components (ICs) .................................................................................................................9
Connector ......................................................................................................................................12
Specifications.................................................................................................................................13
Physical Specifications .............................................................................................................13
Mechanical Specifications ........................................................................................................14
Power Specifications ...............................................................................................................15
Environmental Specifications....................................................................................................15
Thermal/Cooling Requirements ................................................................................................16
Chapter 3 Hardware .................................................................................................................17
Overview ........................................................................................................................................17
CPU ...............................................................................................................................................18
Graphics.........................................................................................................................................18
Memory .........................................................................................................................................18
Interrupt Channel Assignments .....................................................................................................19
Memory Map .................................................................................................................................20
I/O Address Map ...........................................................................................................................21
COM Express A-B Connector .......................................................................................................22
LPC Interface............................................................................................................................22
SATA Interface .........................................................................................................................22
USB Interface ...........................................................................................................................22
Power Interface ........................................................................................................................22
Power Management..................................................................................................................22
Video Interfaces........................................................................................................................23
LVDS ..................................................................................................................................23
SDVO .................................................................................................................................23
Audio Interface ........................................................................................................................23
Ethernet Interface ....................................................................................................................23
I²C™ Bus ..................................................................................................................................24
PCI Express™ ..........................................................................................................................24
System Management Bus (SMBus) .........................................................................................24
CAN Bus [Optional]...................................................................................................................24
GPIO.........................................................................................................................................25
Watchdog Timer.............................................................................................................................28
Temperature Sensor ......................................................................................................................29
nanoX-TCR Reference Manual iii
Contents
Chapter 4 BIOS Setup .............................................................................................................. 31
Introduction.................................................................................................................................... 31
Entering BIOS Setup (Local Video Display) ........................................................................... 31
Entering BIOS Setup (Serial Port Console) ............................................................................ 31
OEM Logo Utility .......................................................................................................................... 32
Logo Image Requirements....................................................................................................... 32
BIOS Setup Menus ....................................................................................................................... 33
Main BIOS Setup Screen ......................................................................................................... 33
Advanced BIOS Setup Screen................................................................................................. 34
Chipset BIOS Setup Screen..................................................................................................... 37
Boot BIOS Setup Screen ......................................................................................................... 39
Security BIOS Setup Screen.................................................................................................... 40
Save & Exit BIOS Setup Screen .............................................................................................. 41
Appendix A Technical Support ................................................................................................. 43
Index .................................................................................................................................................. 45
List of Figures
Figure 2-1. Mini, Compact, Basic and Extended Form Factors ................................................. 4
Figure 2-2. Functional Block Diagram ....................................................................................... 8
Figure 2-3. Component Locations (Top Side).......................................................................... 11
Figure 2-4. Component Locations (Bottom Side) .................................................................... 11
Figure 2-5. Connector Locations (Bottom Side) ..................................................................... 12
Figure 2-6. Mechanical Dimensions (Top Side)....................................................................... 14
Figure 2-7. Stack Heights of Cooling Assemblies (Side Width Views) .................................... 16
Figure 4-1. Main BIOS Setup Screen ..................................................................................... 33
Figure 4-2. Advanced BIOS Setup Screen ............................................................................. 34
Figure 4-3. Chipset BIOS Setup Screen ................................................................................. 37
Figure 4-4. Boot BIOS Setup Screen ...................................................................................... 39
Figure 4-5. Security BIOS Setup Screen ................................................................................ 40
Figure 4-6. Save & Exit BIOS Setup Screen .......................................................................... 41
List of Tables
Table 2-1. COM Express Pinout Types .................................................................................... 3
Table 2-2. Major Integrated Circuit Descriptions and Functions............................................... 9
Table 2-3. Module Connector and Socket Descriptions ......................................................... 12
Table 2-4. Weight and Footprint Dimensions ......................................................................... 13
Table 2-5. Power Supply Requirements ................................................................................ 15
Table 2-6. Environmental Requirements ................................................................................ 15
Table 2-7. ADLINK Optional Cooling Solutions ...................................................................... 16
Table 3-1. Interrupt Channel Assignments ............................................................................. 19
Table 3-2. Memory Map ......................................................................................................... 20
Table 3-3. I/O Address Map ................................................................................................... 21
Table 3-4. SMBus Reserved Addresses ................................................................................ 24
Table 3-5. COM Express A-B Connector Signal Descriptions................................................ 25
Table 4-1. BIOS Setup Menus................................................................................................ 33
Table A-1. Technical Support Contact Information ................................................................. 43
iv Reference Manual nanoX-TCR
Chapter 1 About This Manual
Purpose of this Manual
This manual is for designers of systems based on the nanoX-TCR (Computer-on-Module). This manual
contains information that permits designers to create an embedded system based on specific design
requirements.
Information provided in this reference manual includes:
• nanoX-TCR specifications
• Environmental requirements
• Major ICs and features implemented
• nanoX-TCR connector/pin numbers and definitions
• BIOS Setup information
Information not provided in this reference manual includes:
• Detailed chip specifications
• Internal component operation
• Internal registers or signal operations
• Bus or signal timing for industry-standard busses and signals
References
The following list of references may be helpful for you to complete your custom design successfully.
Specifications
• COM Express Specification Revision 2.0
Web site: http://www.picmg.org/
• COM Express Carrier Design Guide 1.0
Web site: http://www.picmg.org/pdf/PICMG_COMDG_100.pdf
• LPC Bus Specification, Revision 1.1, August, 2002
Specification: http://www.intel.com/design/chipsets/industry/25128901.pdf
• PCIe Specification, Revision 1.0a, April 15, 2003
Specification (for members): http://www.pcisig.com/home
2
• I
C Bus Specification Version 2.1
Specification: http://www.nxp.com/documents/other/39340011.pdf
• AMI BIOS Aptio TSE User’s Guide
Datasheet: http://www.ami.com/support/doc/AMI_TSE_User_Manual_PUB.pdf
• Bosch CAN specification version 2.0B
Specification: http://www.can-cia.org/fileadmin/cia/specifications/CAN20B.pdf
• SATA Specification Version 2.6
Web site: http://www.sata-io.org/
nanoX-TCR Reference Manual 1
Chapter 1 About This Manual
Chip Specifications
• Intel® Corporation and the Atom™ E6XXT series CPU, used as integrated processor core and graphics
memory hub
Datasheet: http://download.intel.com/embedded/processor/datasheet/324208.pdf
• Intel Corporation and the EG20T chip, used as Platform Controller Hub (PCH)
Datasheet: http://download.intel.com/embedded/chipsets/datasheet/324211.pdf
• National Semiconductor and the LM96163 chip, used as Temperature Sensor
Datasheet: http://www.national.com/ds/LM/LM96163.pdf
• Intel Corporation and the 82574IT chip used as the Gigabit Ethernet controller
Datasheet: h
ttp://download.intel.com/design/network/datashts/82574.pdf
• Atmel Corporation and the ATMEGA168V-10AU chip used as the board controller
Datasheet: http://www.atmel.com/dyn/resources/prod_documents/2545S.pdf
NOTE If you are unable to locate the datasheets using the links provided, search the internet
to find the manufacturer’s web site and locate the documents you need.
2 Reference Manual nanoX-TCR
Chapter 2 Product Overview
This introduction presents general information about the COM Express™ architecture and the nanoX-TCR
Computer-on-Module (COM). After reading this chapter you should understand:
• COM Express Concept
• COM Express Architecture
• nanoX-TCR Product Description
• nanoX-TCR Major Components
• nanoX-TCR Connector Description
• nanoX-TCR Specifications
COM Express Concept
COM Express is an open industry standard defined specifically for COM boards. Its creation provides the
ability to make a smooth transition from legacy parallel interfaces to the newest technologies based on serial
buses available today. COM Express modules are available in the following form factors:
• Mini 84mm x 55mm
• Compact 95mm x 95mm
• Basic 125mm x 95mm
• Extended 155mm x 110mm
The COM Express specification 2.0 defines seven different pinout types.
Table 2-1. COM Express Pinout Types
Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports
Type 1 A-B Up to 6 1
Type 2 A-B C-D Up to 22 32 bit 1 1
Type 3 A-B C-D Up to 22 32 bit 3
Type 4 A-B C-D Up to 32 1 1
Type 5 A-B C-D Up to 32 3
Type 6 A-B C-D Up to 24 1
Type 10 A-B Up to 4 1
The nanoX-TCR utilizes the Mini form factor and the Type 10 pinout definition, featuring one highperformance COM Express connector that ensures stable data throughput. The single-connector interfaces of
the Type 1 and Type 10 pinouts free systems completely from legacy signals while solving the space
constraints of the Mini form factor. The Type 10 pinout provides additional flexibility for developers by
freeing up pins reserved for SATA and PCIe for future technologies and using the second LVDS channel,
VGA, and TV-Out pins to support SDVO (via DDI). The Type 10 pinout also supports the SPI interface,
which was unavailable in previous COM Express revisions.
The COM board integrates all core components and is mounted onto an application specific baseboard.
COM boards are legacy-free hardware designs (no Super I/O, PS/2 keyboard, and PS/2 mouse) and provide
most of the functional requirements for any application. These functions include, but are not limited to a rich
complement of contemporary, high-bandwidth serial interfaces such as PCI Express, Serial ATA, USB 2.0,
and Gigabit Ethernet. The robust thermal and mechanical concept of the COM board, combined with
extended power management capabilities, is perfectly suited for all applications.
nanoX-TCR Reference Manual 3
Chapter 2 Product Overview
Baseboard designers can utilize as little or as many of the I/O interfaces as necessary. The baseboard can
therefore provide all the interface connectors required to attach the system to the application specific
peripherals. This versatility allows the designer to create a dense and optimized package, which results in a
more reliable product while simplifying system integration. Most importantly, COM Express modules are
scalable, which means once an application has been created, the ability to diversify the product range is
possible through the use of different performance class modules. Simply unplug one module and replace it
with another. No redesign is necessary.
COM Express Architecture
The COM Express specification was developed by the PCI Industrial Computer Manufacturing Group
(PICMG) in close collaboration with many leading companies across the embedded industry in order to find
an implementation solution to handle upcoming new high speed serial I/Os, processors, and chipsets. COM
Express specifies four form factors, as well as seven different types of connector pinouts.
The four form factors are referred to as Mini, Compact, Basic, and Extended. The Mini form factor targets
battery powered, mobile, and handheld system designs and features a footprint of just 84mm x 55mm. The
Compact form factor is 95mm x 95mm, designed to match the requirements of small applications. The Basic
module footprint is 125mm x 95mm and focuses on space-constrained, low power systems which typically
do not contain more than one horizontal mounted SODIMM. The Extended footprint is slightly larger at
155mm x 110mm and supports up to two full-size, vertically mounted DIMM modules to accommodate
larger memory configurations for high-performance CPUs, chipsets, and multiprocessor systems. The
placement of the shielded 220-pin connectors and the mounting holes are identical between these four
footprints.
Compact Form Factor
Mini Form Factor
Figure 2-1. Mini, Compact, Basic and Extended Form Factors
Basic Form Factor
Extended Form Factor
Note:
Measurements are in millimeters
COM_FormFactors_b
4 Reference Manual nanoX-TCR
Chapter 2 Product Overview
Product Description
The nanoX-TCR is an exceptionally high integration, high performance, rugged Intel® Atom™ E6XXT
processor based system, compatible with the COM Express standard. This rugged and high quality module
system contains all the component subsystems of an ATX motherboard plus the equivalent of several PCI
Express expansion boards.
The Intel Atom E6XXT series CPUs integrate processor cores with Graphics and Memory Controller Hubs
(GMCHs), providing low-power, high-performance processors, memory controllers for up to 2GB of onboard memory, and graphics controllers for LVDS and SDVO signals.
The Intel EG20T PCH (Platform Controller Hub) provides controllers for a range of common interfaces
including six USB 2.0 ports and up to two SATA ports as well as embedded interfaces for CAN (optional),
GPIO, and I2C. The nanoX-TCR provides an optional Solid State Drive through the SATA1 port and one
Gigabit Ethernet interface through the Intel 82574IT Gigabit Ethernet controller chip (external magnetics
required) using PCIe Port1 from the CPU. The PCIe Port0 connects the PCH to the CPU.
Expansion for additional system functions is possible on the nanoX-TCR through the PCIe and LPC
expansion buses. The PCIe and LPC buses operate at clock speeds of 100MHz and 33MHz, respectively.
The nanoX-TCR is particularly well suited for either embedded or portable applications and meets the size,
power consumption, temperature range, quality, and reliability demands of embedded system applications.
Module Features
• CPU
♦
Provides Intel® Atom™ 600MHz (E620T), 1.3GHz (E660T), or 1.6GHz (E680T) Processor Cores
and Graphics Memory Hubs
♦
Provides internal 512-kB, 8-way L2 cache
♦
Provides Enhanced Intel SpeedStep® Technology (EIST)
♦
Supports Hyper-Threading Technology
♦
Provides L2 Dynamic Cache Sizing
♦
Supports 32-bit physical addresses and 48-bit linear addresses
♦
Provides 3D graphics engine
♦
Provides single-channel DDR2 memory controller
• Memory
♦
Provides non-ECC, unbuffered memory
♦
Provides up to 2 GB of +1.8V DDR2 soldered, on-board memory
♦
Supports 32-bit data bus
♦
Supports DDR2 800MHz memory
• Expansion Buses
♦
PCIe between CPU/PCH and COM Express connector
♦
LPC (Low Pin Count) for LPC devices
♦
I2C for fast mode I2C devices
♦
SMBus for expansion cards
♦
CAN bus for devices on the baseboard
nanoX-TCR Reference Manual 5
Chapter 2 Product Overview
• COM Express Interface
♦
SATA Interface
• Provides up to two SATA ports
• Supports up to 3 Gb/s transfer speed
• Supports Native Command Queuing for up to 32 entries
• Provides Auto Activate for DMA
• Supports Hot Plug features
♦
HD Audio
• Provides Intel HD Audio controller
• Supports Audio Docking
• Provides 32-bit sample depth
• Supports sample rates up to 192kHz
♦
USB Port Interface
• Supports six EHCI USB 2.0 ports
• Supports one USB Client port
• Supports legacy OHCI USB 1.1 signals
• Supports Per-Port-Disable
♦
Ethernet Interface
• Provides one fully independent Ethernet port
• Provides integrated LEDs on each port (Link/Activity and Speed)
• Provides one Intel 82574IT controller chip
• Supports IEEE 802.3 10/100BaseT and 10/100/1000BaseT compatible physical layers
• Supports Auto-negotiation for speed, duplex mode, and flow control
• Supports full duplex or half-duplex mode
-Full-duplex mode supports transmit and receive frames simultaneously
-Supports IEEE 802.3x Flow control in full duplex mode
-Half-duplex mode supports enhanced proprietary collision reduction mode
♦
Video Interfaces (SDVO and LVDS)
• Provide SDVO outputs
-Resolutions up to 1280x1024 @ 85Hz
-A variety of external display technologies such as DVI, TV-Out, and VGA
-Maximum pixel clock rate up to 160MHz
• Provide LVDS flat panel outputs
-Resolutions up to 1280x768 @ 60Hz
-Minimum pixel clock rate of 19.75MHz
-Maximum pixel clock rate of 80MHz
-Pixel color depths of 18 and 24 bits
6 Reference Manual nanoX-TCR
Chapter 2 Product Overview
♦
CAN Interface (Optional)
• Supports bit rate up to 1 Mbps
• Supports 32 message objects
• Miscellaneous
♦
Real Time Clock (RTC) with external battery
♦
Watchdog Timer (WDT)
♦
CPU Temperature Sensor
♦
OEM Logo Screen (Splash)
nanoX-TCR Reference Manual 7
Chapter 2 Product Overview
Block Diagram
Figure 2-2 shows the functional components of the module.
LVDS
SDVO
HD Audio
SPI Flash - BIOS
Temp Sensor
Gigabit
Ethernet
Controller
82574IT
GLAN
SD/GPIO
Switch
GPIO
SPI
LPC
SMBus
1X PCIe X1
2X PCIe X1
USB 0-5
USB Client
SSD -
[Optional]
SD0
Generator
SATA 0
GPIO
Intel“ Atom™ E620T, E660T,
or E680T
(0.6, 1.3, or 1.6 GHz)
with integrated
Processor Core
and Graphics Memory Hub
PCIe1
PCIe2
PCIe3
(Platform Controller Hub)
Intel CS82TPCF
SATA 1
CPU
PCIe0
1X PCIe X1
EG20T PCH
667/800MHz,
1.5V, 2GB Max.
GPIO
Controller
GPIO
DDR2
On-board
System
Memory (8)
Board
I2C
LVDS DDC I2C
CAN
COM Express Connector - Rows A and B
LVDS
SDVO
HD Audio
SPI
LPC
SMBus
2X PCIe X1
Gb Ethernet
CAN (Optional)
GPIO (8) USB 2.0 (6)
SATA (1 or 2)
USB Client
I2C
LVDS DDC I2C
nanoX-TCR_BlkDiag_a
Figure 2-2. Functional Block Diagram
8 Reference Manual nanoX-TCR
Chapter 2 Product Overview
Major Components (ICs)
Table 2-2 lists the major integrated circuits on the nanoX-TCR, including a brief description of each IC.
Figures 2-3 and 2-4 show the locations of the major ICs.
Table 2-2. Major Integrated Circuit Descriptions and Functions
Chip Type Mfg. Model Description Function
CPU (U31) Intel Atom E620T,
E660T, and
E680T
PCH (Platform
Controller Hub
[U42])
SSD (U3) -
Optional
GPIO Generator Philips PCA9535BS Module providing 16
SD/GPIO
Switch (U5)
Gigabit Ethernet
Controller (U7)
Board Controller
(U10)
Ethernet
EEPROM (U19
- on bottom side
[see Figure 2-4])
Memory
EEPROM (U27
- on bottom side
[see Figure 2-4])
Intel CS82TPCS
(EG20CP PCH)
SiliconMotion SM631GE Industrial-grade
Pericom PI5C3390QE Multiplexer/
Intel 82574IT Gigabit Ethernet
Atmel ATMEGA168V-
10AU
Atmel AT25128B-
SSHL
Atmel AT24C02B Two-Wire Serial
600MHz, 1.3GHz, or
1.6GHz processor with
8-way L2 cache
I/O hub providing
Southbridge functions
(standard I/O functions)
soldered solid state
storage module
bits of GPIO expansion
for I2C/SMBus
applications
Demultiplexer
providing switching
function between SD
and GPIO signals
controller
Micro controller for
board functions
including I²C,
Watchdog Timer, and
LVDS Display Data
Channel (DDC)
Three-Wire Serial
EEPROM for Gigabit
Ethernet Controller
EEPROM for SPD
(Serial Presence Detect)
Integrates
Processor Core
and Graphics
Memory Hub
Provides I/O
interfaces such
as USB, SATA,
and video
Provides solid
state storage
through the
SATA interface
Provides
additional
digital control
lines
Provides a
zero-delay
switch
connection
Generates PCIe
10T/100TX/
1000T Ethernet
signals
Optimizes
power
consumption
versus processor
speed
Provides storage
for MAC
addresses, serial
numbers, and
pre-boot
configuration
data
Provides storage
for System
Memory
configuration
data
nanoX-TCR Reference Manual 9
Chapter 2 Product Overview
Table 2-2. Major Integrated Circuit Descriptions and Functions (Continued)
DDR2 Memory
(U38, U39, U40,
U41 - on bottom
Micron MT47H128M8C
F-25E
On-board DDR2
System Memory
Provides highspeed data
transfer
side [see
Figure 2-4])
DDR2 Memory
(U43, U44, U45,
U46)
Temperature
Sensor - CPU
(U113 - on
bottom side; see
Figure 2-4])
Micron MT47H128M8C
F-25E
National
LM96163 Remote diode digital
Semiconductor
On-board DDR2
System Memory
temperature sensor
Provides high-
speed data
transfer
Measures its
own temperature
and the
temperature of
the CPU thermal
diode and
provides
temperature
correction with
fan speed
control.
Power
Management IC
(U115)
Power Regulator
(U116 - on
bottom side; see
Figure 2-4])
ROHM BD9591MWV Power Management
Chipset
Supplies power
to main system
blocks
ROHM BD9595MUV Power Regulator Rectifies sudden
change in power
load from
BD9591MWV
10 Reference Manual nanoX-TCR
Chapter 2 Product Overview
Key:
U3 - SSD [Optional]
U5 - SD/GPIO Switch
U7 - Gigabit Ethernet Controller
U10 - Board Controller
U31 - CPU
U38 - DDR2 SDRAM
U39 - DDR2 SDRAM
U40 - DDR2 SDRAM
U41 - DDR2 SDRAM
U42 - PCH
U115 - Power Management (IC)
U40
U38U39
Key:
U19 - SPI Ethernet EEPROM
U27 - 2-Wire Serial EEPROM
U43 - DDR2 SDRAM
U44 - DDR2 SDRAM
U45 - DDR2 SDRAM
U46 - DDR2 SDRAM
U113 - Temperature Sensor
U116 - Power Regulator
CN2 - COM Express Type 10
Connector (see
connector table)
U31
U5
U41
U10
U115
U3
U42
U7
Figure 2-3. Component Locations (Top Side)
U43
U44
U46
nanoX-TCR_Top_Comp_a
U45
U27
U113
nanoX-TCR_Bottom_Comp_a
Figure 2-4. Component Locations (Bottom Side)
nanoX-TCR Reference Manual 11
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