ADLINK LEC-iMX6 User Manual

LEC‐iMX6

(Computer‐on‐Module)

Technical Reference

P/N50‐1Z167‐1000

Rev1.0

Advance Technologies. Automate the World.

Disclaimer

Information in this document is provided in connection with ADLINK products. No license,
express or implied, by estoppel or otherwise, to any intellectual property rights is granted by
this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such prod­ucts, ADLINK assumes no liability whatsoever, and ADLINK disclaims any express or implied
warranty, relating to sale and/or use of ADLINK products including liability or warranties relat­ing to fitness for a particular purpose, merchantability, or infringement of any patent, copy­right or other intellectual property right. If you intend to use ADLINK products in or as medical
devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if
any. ADLINK may make changes to specifications and product descriptions at any time, with­out notice.

Trademarks

MS-DOS, Windows, Windows 95, Windows 98, Windows NT and Windows XP are trademarks
of Microsoft Corporation. PS/2 is a trademark of International Business Machines, Inc. Intel and
Solid State Drive are trademarks of Intel Corporation. PC/104 is a registered trademark of the
PC/104 Consortium. All other trademarks appearing in this document are the property of their
respective owners. CoreModule is a registered trademark, and ADLINK, Little Board, Little­Board, MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, Ready­Panel, RuffSystem, ReadySystem, and HPERC are trademarks of ADLINK Technology, Inc. All
other trademarks that may appear in this document or the ADLINK website are the properties of
their respective owners.

Revision History

Revision Reason for Change Date

1.0 Initial Release Nov/14

ADLINK Technology, Incorporated
www.adlinktech.com
© Copyright 2014 ADLINK Technology, Incorporated

Audience

This manual provides reference only for computer design engineers, including but not limited
to hardware and software designers and applications engineers. ADLINK Technology, Inc.
assumes you are qualified to design and implement prototype computer equipment.

ii

LEC-iMX6

Table of Contents

1 Overview ........................................................................................................................... 1

1.1 Block Diagram........................................................................................................................ 1

1.2 Major Components (ICs)........................................................................................................ 2

1.3 Connectors, LEDs, and Switches .......................................................................................... 3

1.4 Specifications......................................................................................................................... 4

1.5 Getting Started....................................................................................................................... 7

2 Hardware ......................................................................................................................... 10

2.1 CPU ..................................................................................................................................... 10

2.2 Memory ............................................................................................................................... 10

2.3 eMMC NAND Flash ............................................................................................................. 10

3 Interfaces ........................................................................................................................ 11

3.1 Parallel LCD Video............................................................................................................... 11

3.2 18/24 Bit LVDS LCD ........................................................................................................... 11

3.3 HDMI (High-Definition Multimedia Interface) ....................................................................... 12

3.4 Camera PCAM..................................................................................................................... 12

3.5 Camera MIPI-CSI................................................................................................................. 12

3.6 PCIe ..................................................................................................................................... 12

3.7 Gigabit Ethernet .................................................................................................................. 12

3.8 USB 2.0 Ports ...................................................................................................................... 13

3.9 SATA.................................................................................................................................... 13

3.10 I2C ...................................................................................................................................... 13

3.11 SPI ....................................................................................................................................... 13

3.12 Serial (UART)....................................................................................................................... 14

3.13 SPDIF .................................................................................................................................. 14

3.14 I2S........................................................................................................................................ 14

3.15 CAN ..................................................................................................................................... 14

3.16 SD/SDIO Interface ............................................................................................................... 14

3.17 eMMC Interface ................................................................................................................... 15

3.18 GPIO .................................................................................................................................... 15

3.19 AFB Alternate Function Block .............................................................................................. 15

3.20 LPC Debug .......................................................................................................................... 15

4 Interface Signals............................................................................................................. 16

4.1 SMARC Interface ................................................................................................................. 16

4.2 Debug (DB40) ...................................................................................................................... 19

iii

5 Power and System Management .................................................................................. 20

5.1 SEMA Utility ........................................................................................................................ 20

5.2 On-Board Power Supply ..................................................................................................... 20

5.3 System States ..................................................................................................................... 20

5.4 External Power Button ........................................................................................................ 20

5.5 Reset-In Signal.................................................................................................................... 20

5.6 External Battery................................................................................................................... 20

Appendix A Technical Support ........................................................................................ 21

iv

1 Overview

314-pin SMARC Connector

Freescale

iMX6

Memory

DDR3L

eMMC

(optional)

USB0 Host/OTG

LCD 24-bit RGB

eMMC/SDMMC (8-bit)

SDIO (4-bit)

40-pin Debug

Connector

PCAM (10-bit)

Memory

DDR3L

Memory

DDR3L

Memory

DDR3L

USB2 Host

USB1 Host

BMC

LM73

Thermal

Sensor

GbE

LAN
PHY

RGMII

SATA

1x I2C (option)

3x I2C

LVDS 24-bit (incl. DDC)

HDMI (Including DDC and CEC)

PCA

9535A

GPIO

12x GPIO

PCIe

switch

(option)

PCIe

PCIe

PCIe

PCIe

4x UARTS (2x 4, 2x 2)

2x CAN

MLB

SPDIF

MIPI CSI Camera, 2 lanes

MUX

I2S
SPI

SPI/I2S

1x SPI

SPI

Flash

(option)

RTC

Flash

Flash

1x SPI

1x I2C

USB
Hub

USB

Watchdog

LEC_iMX6_blk_diag_d

Power Management

This initial manual version presents a general overview of the LEC-iMX6. After reviewing this
document you should understand the following features of the LEC-iMX6.

 Functional Block Diagram

 Major Components (ICs) and Connectors (Locations and Descriptions)

 Specifications

 Boot Up Configuration

 Interface Signal and Power Management Definitions

NOTE: Please refer to BSP readme documents in the Quick Drive for BSP installation instruc­tions.

1.1 Block Diagram

Figure 1-1 represents the component functions of the module.

LEC-iMX6

Overview 1

Figure 1-1: Functional Block Diagram

1.2 Major Components (ICs)

U7

U9

U1

Key:
U1 - CPU
U7 - DDR3L SDRAM
U9 - DDR3L SDRAM
U11 - Ethernet Controller

LEC_iMX6_Top_Comp_a

1 2

U11

Table 1-1 lists the major integrated circuits on the LEC-iMX6, including a brief description of
each IC. Figure 1-2 and Figure 1-3 show the locations of the major ICs.

Table 1-1: Major Integrated Circuit Descriptions and Functions

Chip Type Mfg. Model Description Function

CPU (U1) Freescale

Semiconductor

DDR3L

Micron MT41K256M16HA On-board DDR3L,
SDRAM (U7,
U8, U9, U10
[U8 and U10
on bottom
side])

Ethernet

Atheros AR8035-AL1B-R Integrated 10/100/
PHY
Transceiver
(U11)

eMMC,

Micron MTFC8GLDEA-4M-IT MultiMediaCard
NAND Flash
(U16 - on
bottom side)

i.MX 6Solo (one core)
i.MX 6Dual (two cores)
i.MX 6DualLite
(two cores, no SATA)
i.MX 6Quad (four cores)

800 MHz, ARM
Cortex-A8, 40nm SoC
(System on Chip)

1.35V, 4Gb,
32Mx16x8 System
Memory

1000 Mbps
single-port, tri-speed
Ethernet PHY
Transceiver

Controller and NAND
Flash Memory up to
64GB

Integrates
Processor
Core, Graphics
and Memory
Controller Hub,
and I/O Hub

Provides
high-speed
data transfer

Provides a
standard IEEE

802.3 Ethernet
interface for
Ethernet
transfer rates
up to 1000
Mbps

Provides
communication
and mass data
storage
capabilities

Figure 1-2: Component Locations (Top Side)

2 Overview

Figure 1-3: Component Locations (Bottom Side)

U8

U10

U16

LEC_iMX6_Bottom_Comp_a

Key:
U8 - DDR3L SDRAM
U10 - DDR3L SDRAM
U16 - eMMC, NAND Flash

ON

1 2

(1 2)

(4 3)

LEC-iMX6

1.3 Connectors, LEDs, and Switches

Table 1-2 describes the connectors, LEDs, and switches shown in Figure 1-4.

Table 1-2: Module Connector, LED, and Switch Descriptions

Connector, LED, Switch #

J1 – SMARC P-S Top/

CN2 Top 40-pin connector for debug card
LED1 Top Blue LED indicating system status activities for HW Reset,

LED2 Top Green LED for Power On
LED3 Top Red LED for Watchdog Activity
SW1 Top 4-pin dip switch for:

Board

Access

Bottom

Description

314-pin, MXM edge connector for Memory, Video, and I/O
functions.

SW Reset, Power Up, Power Down, Reset Button, Power
Button, and U-Boot_Select

• U-BOOT_SELECT: 1=off, 4=on [default]

1 = 8MB SPI Flash with U-BOOT+Debian
installer

4 = 4MB SPI Flash with U-BOOT

• WDT Disable: 2=off, 3=on [default]

Overview 3

Figure 1-4: Connector, LED, and Switch Locations (Top Side)

LEC_iMX6_Top_Conn_a

1 2

Key:
J1 - SMARC Connector
CN2 - DB40 Debug Connector
LED1 - System Status, Blue
LED2 - Power On, Green
LED3 - Watchdog Activity, Red
SW1 - U-BOOT_Select

LED 1

LED 2

LED 3

1

J1

J1

J1

J1

1 2

SW1

CN2

1

1.4 Specifications

1.4.1 Physical Specifications

Table 1-3 lists the physical dimensions of the module.

Table 1-3: Weight and Footprint Dimensions

Item Dimension

Weight 0.02 kg (0.05 lb)
Height (overall) 3.05 mm (0.12 inches)
Board thickness 1.27 mm (0.05 inches)
Width 50.00 mm (1.97 inches)
Length 82.00 mm (3.23 inches)

Overall height is measured from the upper board
surface to the top of the highest permanent
component (CN2 connector) on the upper board
surface. This measurement does not include the
cooling solution, which can vary. The cooling
solution will probably increase this dimension.

4 Overview

1.4.2 Mechanical Specifications

LEC-iMX6_mech_dmn_top_a

LEC-iMX6

Figure 1-5: Mechanical Dimensions (Top Side)

NOTE: All dimensions are given in millimeters.

Overview 5