ADLINK LEC-3517 User Manual
LEC‐3517
(Computer‐on‐Module)
Technical Reference
P/N50‐1Z152‐1000
Advance Technologies. Automate the World.
Disclaimer
Information in this document is provided in connection with ADLINK products. No license,
express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products,
ADLINK assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. If you intend to use ADLINK products in or as medical devices, you
are solely responsible for all required regulatory compliance, including, without limitation, Title
21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may
make changes to specifications and product descriptions at any time, without notice.
Trademarks
CoreModule is a registered trademark, and ADLINK, Little Board, LittleBoard, MightyBoard,
MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel, RuffSystem,
and ReadySystem are trademarks of ADLINK Technology, Inc. All other marks are the property of their respective companies.
Revision History
Revision Reason for Change Date
1000 Initial Release Dec/13
ADLINK Technology, Incorporated
5215 Hellyer Avenue, #110
San Jose, CA 95138-1007
Tel. 408 360-0200
Fax 408 360-0222
www.adlinktech.com
© Copyright 2013 ADLINK Technology, Incorporated
Audience
This manual provides reference only for computer design engineers, including but not limited
to hardware and software designers and applications engineers. ADLINK Technology, Inc.
assumes you are qualified to design and implement prototype computer equipment.
ii
LEC-3517
Table of Contents
1 Overview ........................................................................................................................... 1
1.1 Block Diagram........................................................................................................................ 1
1.2 Major Components (ICs)........................................................................................................ 2
1.3 Connectors............................................................................................................................. 3
1.4 Specifications......................................................................................................................... 3
1.5 Interface Signals .................................................................................................................... 5
Appendix A Technical Support ......................................................................................... 11
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iv
1 Overview
314-pin SMARC Connector
Texas Instruments
Micro Processor
®
AM3517
Texas Instruments
®
PMIC
(Power Management IC)
TPS650732
Memory
1Gb DDR2
64x16
NAND
4Gb (8-bit)
Memory
1Gb DDR2
64x16
USB1 Host
USB0 Host/OTG
4x UART (2x 4-pin, 2x 2-pin)
LCD 24-bit RGB
LAN PHY
SMSC LAN8710A-EZK
10/100 Mbps
Power
1x CAN
SPI0 / SPI1
I2S (3x)
I2C (3x)
GPIO (12x)
SDMMC (8-bit)
SDIO (4-bit)
10-pin JTAG
connector
Watchdog
Management
Camera (8-bit) +I2C
LCD Support + I2C
Boot Select (0,1,2)
Force Recovery
LEC_3517_Blk_Diag_a
EEPROM
Level
Shift
RTC
VRTC
This initial manual version presents a general overview of the LEC-3517 Computer-On-Module
(COM). The next version of this manual shall include more detailed information including user
interface descriptions, boot setup access and menu settings, memory map, interrupt channel
assignments, and I/O address map. After reviewing this document you should understand the
following features of the LEC-3517.
Functional Block Diagram
Major Component (IC) Locations and Descriptions
Connector Location and Description
Specifications
SMARC Interface Signal Definitions
NOTE: Please refer to BSP readme documents in the Quick Drive for BSP installation instructions.
1.1 Block Diagram
Figure 1-1 represents the component functions of the module.
LEC-3517
Figure 1-1: Functional Block Diagram
Overview 1
1.2 Major Components (ICs)
U68
U65
U10
U5
U7
U4
Key:
U4, U7 - DDR2 SDRAM
U5 - CPU
U10 - Ethernet Transceiver
U65 - Power Management IC
U68 - NAND Flash Staorage
LEC_3517_Top_Comp_a
Table 1-1 lists the major integrated circuits on the LEC-3517, including a brief description of
each IC. Figure 1-2 shows the locations of the major ICs.
Table 1-1: Major Integrated Circuit Descriptions and Functions
Chip Type Mfg. Model Description Function
CPU (U5) Texas
Instruments
DDR2 SDRAM
Hynix H5PS1G63JFR-SGC On-board DDR2, 1Gb,
(U4, U7)
Ethernet
SMSC LAN8710AI-EXK-TR Single-port, Fast
Transceiver
(U10)
PMIC (U65) Texas
Instruments
NAND Flash
Micron MT29F4G16ABBDA
(U68)
AM3517 ARM
Cortex-A8
600MHz
Microprocessor
64Mx16 System
Memory
Ethernet PHY
Transceiver
TP650732RSLR Single-chip, power
management solution
Rugged, Solid State
H4-IT
Storage
Integrates
Processor Core,
Graphics and
Memory
Controller Hub,
and I/O Hub
Provides
high-speed data
transfer
Provides a
standard IEEE
802.3 Ethernet
interface for
Ethernet
transfer rates up
to 100 Mb/s
Provides power
path
management
Provides 4Gb,
8-bit data
storage and
transfer
2 Overview
Figure 1-2: Component Locations (Top Side)
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