ADLINK Express-IB User Manual

Express-IB

User’s Manual
Manual Revision: 2.03
Revision Date: December 3, 2014
Part Number: 50-1J044-1030
Revision Description Date By
2.00 Initial release 2013-08-30 JC
2.01 Correct CPU support spec (Intel® Core™ i7-3615QE); correct GBE0_MDI0- pin description 2013-10-25 JC
2.02 Add Celeron® SKUs; update PCIe expansion specifications 2014-07-04 JC
2.03 Add BIOS beep codes; remove Industrial Temp. SKU 2014-12-03 JC
Page 2 Express-IB

Preface

Copyright 2013-14 ADLINK Technology, Inc.
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product disposal and/or recovery programs prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks of their respective companies.
Express-IB Page 3

Table of Contents

Revision History ............................................................................................................ 2
Preface............................................................................................................................ 3
1. Introduction......................................................................................................... 7
2. Specifications....................................................................................................... 8
2.1. Core System ..............................................................................................................................8
2.2. Expansion Busses......................................................................................................................8
2.3. Video.........................................................................................................................................8
2.4. Audio.........................................................................................................................................9
2.5. LAN ...........................................................................................................................................9
2.6. Multi I/O and Storage ...............................................................................................................9
2.7. Serial I/O on Module ................................................................................................................9
2.8. Super I/O (on Carrier using LPC -bus) .......................................................................................9
2.9. GPIO ..........................................................................................................................................9
2.10. Board Controller .......................................................................................................................9
2.11. TPM (Trusted Platform Module) ........................................................................................... 10
2.12. Fan Control ............................................................................................................................ 10
2.13. Debug..................................................................................................................................... 10
2.14. Power Specifications ............................................................................................................. 10
2.15. Mechanical and Environmental............................................................................................. 10
2.16. Specification Compliance ...................................................................................................... 10
2.17. Functional Diagram................................................................................................................ 11
2.18. Mechanical Drawing .............................................................................................................. 12
3. Pinouts and Signal Descriptions......................................................................
3.1. AB / CD Pin Definitions .......................................................................................................... 13
13
3.2. Signal Description Terminology............................................................................................. 16
3.3. AB Signal Descriptions ........................................................................................................... 17
3.3.1. Audio Signals....................................................................................................................................17
3.3.2. Analog VGA ......................................................................................................................................17
3.3.3. LVDS .................................................................................................................................................17
3.3.4. Gigabit Ethernet...............................................................................................................................18
3.3.5. Serial ATA .........................................................................................................................................19
3.3.6. PCI Express .......................................................................................................................................20
3.3.7. Express Card.....................................................................................................................................20
3.3.8. LPC bus.............................................................................................................................................21
Page 4 Express-IB
3.3.9. USB...................................................................................................................................................21
3.3.10. SPI (BIOS only).............................................................................................................................22
3.3.11. Miscellaneous..............................................................................................................................22
3.3.12. SMBus..........................................................................................................................................22
3.3.13. I2C Bus.........................................................................................................................................23
3.3.14. General Purpose I/O (GPIO) ........................................................................................................23
3.3.15. Power And System Management................................................................................................23
3.3.16. Power and Ground ......................................................................................................................24
3.4. CD Signal Descriptions ........................................................................................................... 25
3.4.1. USB 3.0 extension ............................................................................................................................25
3.4.2. PCI Express x1 ..................................................................................................................................25
3.4.3. DDI Channels....................................................................................................................................26
3.4.4. DDI to DP/HDMI/SDVO Mapping.....................................................................................................28
3.4.5. PCI Express Graphics x16 (PEG)........................................................................................................29
3.4.6. Module Type Definition ...................................................................................................................30
3.4.7. Power and Ground...........................................................................................................................30
4. Module Configuration ...................................................................................... 31
4.1. PCI Express Configuration Switch (SW1) ............................................................................... 31
4.2. PCIe x16-to-two-x8 Adapter Card.......................................................................................... 31
5. Embedded Functions ........................................................................................ 32
5.1. Watchdog Timer .................................................................................................................... 32
5.1.1. AIDI Demo Program - Watchdog Tab...............................................................................................32
5.2. GPIO ....................................................................................................................................... 33
5.2.1. AIDI Demo Program - GPIO Tab .......................................................................................................33
5.3. Hardware Monitoring ............................................................................................................ 34
5.3.1. AIDI Demo Program - HW Monitor Tab ...........................................................................................34
6. System Resources..............................................................................................
6.1. System Memory Map ............................................................................................................ 35
35
6.2. Direct Memory Access Channels ........................................................................................... 35
6.3. I/O Map........................................................................................................................ .......... 36
6.4. Interrupt Request (IRQ) Lines................................................................................................ 38
6.5. PCI Configuration Space Map ................................................................................................ 39
6.6. PCI Interrupt Routing Map .................................................................................................... 40
6.7. SMBus Address Table ............................................................................................................ 40
7. BIOS Setup .........................................................................................................
41
7.1. Starting the BIOS ................................................................................................................... 41
Express-IB Page 5
7.1.1. Setup Menu......................................................................................................................................42
7.1.2. Navigation........................................................................................................................................43
7.2. Main Setup ............................................................................................................................ 46
7.3. Advanced Setup..................................................................................................................... 47
7.3.1. ACPI Settings ....................................................................................................................................47
7.3.2. Trusted Computing ..........................................................................................................................48
7.3.3. CPU Configuration............................................................................................................................49
7.3.4. SATA Configuration..........................................................................................................................50
7.3.5. Intel TXT(LT) Configuration ..............................................................................................................50
7.3.6. PCH-FW Configuration .....................................................................................................................51
7.3.7. Intel Anti-Theft Technology Configuration ......................................................................................52
7.3.8. AMT Configuration...........................................................................................................................53
7.3.9. USB Configuration............................................................................................................................54
7.3.10. ADT 7490 H/W Monitor ..............................................................................................................55
7.3.11. W8362DHG Super IO Configuration............................................................................................55
7.3.12. Serial Port Console Redirection...................................................................................................56
7.3.13. CPU PPM Configuration ..............................................................................................................57
7.4. Chipset Setup......................................................................................................................... 58
7.4.1. PCH-IO Configuration.......................................................................................................................58
7.4.2. System Agent (SA) Configuration.....................................................................................................61
7.5. Boot Setup ............................................................................................................................. 67
7.6. Security Setup........................................................................................................................ 68
7.7. Save & Exit Menu................................................................................................................... 69
8. BIOS Checkpoints, Beep Codes........................................................................ 70
8.1. Status Code Ranges ............................................................................................................... 71
8.2. Standard Status Codes........................................................................................................... 71
8.2.1. SEC Status Codes..............................................................................................................................71
8.2.2. SEC Beep Codes................................................................................................................................72
8.2.3. PEI Status Codes...............................................................................................................................72
8.2.4. PEI Beep Codes.................................................................................................................................74
8.2.5. DXE Status Codes .............................................................................................................................74
8.2.6. DXE Beep Codes ...............................................................................................................................76
8.2.7. ACPI/ASL Checkpoint .......................................................................................................................77
8.3. OEM-Reserved Checkpoint Ranges ....................................................................................... 77
Safety Instructions ...................................................................................................... 78
Getting Service ............................................................................................................ 79
Page 6 Express-IB

1. Introduction

The Express-IB is a COM Express® COM.0 R2.1 Type 6 module supporting the 64-bit 3rd Generation Intel® Core™ i7/i5/3 and Celeron® processor with CPU, memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel® QM77 Express chipset, the Express-IB is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.
The Express-IB features the Intel® Core™ i7/i5/i3 processor supporting Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1066/1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity to the Intel® QM77 Express chipset.
Integrated HD Graphics 4000 includes features such as OpenGL 3.1, DirectX11, Intel® Clear Video HD Technology, Advanced Scheduler
2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI / DVI / DisplayPort or SDVO. The Express-IB is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-IB has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The Intel® Mobile QM77 Express chipset integrates VGA and dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express connectivity.
The Express-IB features a single onboard Gigabit Ethernet port, four USB 3.0 ports and four USB 2.0 ports, two SATA 6 Gb/s ports and two SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
Express-IB Page 7

2. Specifications

2.1. Core System

¾ CPU: 3rd Generation Intel® Core™, Celeron® Processor, 2/4-core mobile processor with Integrated Graphics, BGA 1023 type
Intel® Core™ i7-3615QE quad-core 2.3 GHz (3.3/3.1 GHz Turbo), 6MB L3 cache, 45W
Intel® Core™ i7-3612QE quad-core 2.1 GHz (3.1/2.8 GHz Turbo), 6MB L3 cache, 35W
Intel® Core™ i7-3555LE dual-core 2.5 GHz (3.2/3.1 GHz Turbo), 4MB L3 cache, 25W
Intel® Core™ i7-3517UE dual-core 1.7 GHz (2.8/2.6 GHz Turbo), 4MB L3 cache, 17W
Intel® Core™ i5-3610ME dual-core 2.7 GHz (3.3/3.1 GHz Turbo), 3MB L3 cache, 35W
Intel® Core™ i3-3120ME dual-core 2.4 GHz (no Turbo), 3MB L3 cache, 35W
Intel® Core™ i3-3127UE dual-core 1.6 GHz (no Turbo), 3MB L3 cache, 17W
Intel® Celeron® 1020E dual-core 2.2 GHz (no Turbo) 35W
Intel® Celeron® 1047UE dual-core 1.4 GHz (no Turbo) 17W
Intel® Celeron® 927UE dual-core 1.5 GHz (no Turbo) 17W
¾ Cache: 2MB to 16MB LLC cache depending on CPU type ¾ Memory: dual stacked SO-DIMM socket memory on top
Dual channel DDR3 Memory DDR3 data transfer rates of 1066 MT/s, 1333 MT/s and 1600 MT/s
¾ Chipset: Mobile Intel® QM77 Express Chipset ¾ BIOS: AMI EFI with CMOS backup in 16 Mbit SPI BIOS ¾ Hardware Monitor: Supply voltages and CPU temperature ¾ Fan Control: through AB conenctor or mini connector on module routed from the same PWM source (ADMT controller) ¾ Debug Interface: XDP SFF-26 extension for ICE debug ¾ Management: Intel® AMT 8.0 (availability dependent on processor)

2.2. Expansion Busses

¾ PCI Express x16 Gen3/2* supporting up to 8GT/Sec transactions
Configurable as 1 x16 , 2 x8 or 1 x8-lane and 2 x4-lane (routed to CB connector PCIe x16) *Core™ i7/i5 support Gen3, Core™ i3/Celeron support Gen2
¾ 6x PCIe x1 Gen2 (port 0~5) on AB connector
1x PCIe x1 Gen2 (port 6) on CD connector
¾ LPC bus, SPI bus (BIOS only)
2
¾ SMBus (system) , I
C (user)

2.3. Video

¾ Integrated in processor: Intel® HD Graphics 4000 or HD Graphics (dependent on processor) ¾ Supports: DirectX 11, OpenGL 3.1, OpenCL 1.1 ¾ Features (dependent on processor):
Intel Clear Video HD Technology
Advanced Scheduler 2.0, 1.0, XPDM support
DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode
¾ Multi-display Support: 3 independent displays
Page 8 Express-IB
¾ Display Types
VGA Interface support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536)
LVDS Interface Dual channel 18/24-bit LVDS
Three Digital Display Ports
DDI0 supporting HDMI / DisplayPort / SDVO DDI1 supporting HDMI / DisplayPort DDI2 supporting HDMI / DisplayPort

2.4. Audio

¾ Integrated: Intel® HD Audio integrated in PCH QM77 ¾ Audio Codec: Realtek ALC888/886 on Express-BASE6

2.5. LAN

¾ Integrated: LAN MAC integrated in PCH QM77 ¾ Intel PHY: 82579 Gb Ethernet ¾ Interface: 10/100/1000 GbE connection

2.6. Multi I/O and Storage

¾ Integrated in PCH QM77 ¾ USB ports: 4 ports USB 3.0 (USB0,1,2,3) and 4 ports USB 2.0 (USB4,5,6,7) ¾ SATA ports: two ports SATA 6Gb/s (SATA0, SATA1) two ports SATA 3 Gb/s (SATA2, SATA3)

2.7. Serial I/O on Module

¾ Not implemeted

2.8. Super I/O (on Carrier using LPC -bus)

¾ Chipset: Winbond W83627HG-AW AND W83627DHG-P
Without keyboard A20 line
¾ Parallel Port: LPT1 ¾ Serial Ports: COM1 / COM2 (with console redirection)

2.9. GPIO

¾ Chipset: NXP PCA9535 ¾ Description: 16-bit I2C-bus and SMBus, low power I/O port with interrupt ¾ GPO: 4 ports ¾ GPI: 4 ports with interrupt

2.10. Board Controller

¾ Type: Atmega168 ¾ Functions:
AT mode control
2
C supports 100/200/400 speed selectable in BIOS
I
Vdde control
Backlight Enable
Brightness through DDC to PWM on Carrier
Watchdog
Express-IB Page 9

2.11. TPM (Trusted Platform Module)

¾ Chipset: Infineon SLB9635TT1.2 ¾ Type: TPM 1.2

2.12. Fan Control

¾ Control Source: Temperature Sensor ¾ Location
On AB connector (B101/102): PWM and TACH 12V based on carrier
4-pin Mini connector on module: PWM and TACH 5V based on module
¾ Connection: route single source to dual locations

2.13. Debug

¾ JTAG: SFF connector for XDP to CPU ¾ LPC header: for mounting POST CODE assembly

2.14. Power Specifications

¾ Power Modes: AT and ATX mode (AT mode start controlled by ADMT) ¾ Standard Voltage Input: ATX = 12V±5% / 5Vsb or AT = 12V±5% ¾ Wide Voltage Input: ATX = 8.5~19V / 5Vsb or AT = 8.5 ~19V ¾ Power Management: ACPI 3.0 compliant, Smart battery support. ¾ Power States: supports C1-C6, S0, S1, S4, S3, S5 (Wake on USB S3/S4, WOL S3/S4/S5)

2.15. Mechanical and Environmental

¾ Standard Operating Temperature: 0 to 60°C (Wide Voltage Input)

2.16. Specification Compliance

¾ PICMG COM.0: Rev 2.1 Type 6, basic size 125 x 95
Page 10 Express-IB

2.17. Functional Diagram

Express-IB Page 11

2.18. Mechanical Drawing

Page 12 Express-IB

3. Pinouts and Signal Descriptions

The following information is a summary of the most important information regarding pinout and signal description in the official PICMG COM.0 Rev 2.0 (soon 2.1)
The pinout is noted here to emphazise issues that have not been followed in the past. The following might have small inacuaracies so in case of doubt the offical design guide of PICMG should be consulted.

3.1. AB / CD Pin Definitions

The Express-IB is a Type 6 module supporting USB3.0 and DDI channels on the CD connector
All pin in the specification are described also those not supported on the Express-IB. Those not supported on the Express-IB module are crossed out
Row A Row B Row C Row D
Pin Name Pin Name Pin Name Pin Name
A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32 A33 A34 A35
GND (FIXED) GBE0_MDI3­GBE0_MDI3+ GBE0_LINK100# GBE0_LINK1000# GBE0_MDI2­GBE0_MDI2+ GBE0_LINK# GBE0_MDI1­GBE0_MDI1+ GND (FIXED) GBE0_MDI0­GBE0_MDI0+ GBE0_CTREF
SUS_S3#
SATA0_TX+ SATA0_TX-
SUS_S4#
SATA0_RX+ SATA0_RX­GND (FIXED) SATA2_TX+ SATA2_TX-
SUS_S5#
SATA2_RX+ SATA2_RX-
BATLOW#
(S)ATA_ACT# AC/HDA_SYNC AC/HDA_RST# GND (FIXED) AC/HDA_BITCLK AC/HDA_SDOUT
BIOS_DIS0# THRMTRIP#
B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 B32 B33 B34 B35
GND (FIXED) GBE0_ACT# LPC_FRAME# LPC_AD0 LPC_AD1 LPC_AD2 LPC_AD3 LPC_DRQ0# LPC_DRQ1# LPC_CLK GND (FIXED)
PWRBTN# SMB_CK SMB_DAT SMB_ALERT#
SATA1_TX+ SATA1_TX-
SUS_STAT#
SATA1_RX+ SATA1_RX­GND (FIXED) SATA3_TX+ SATA3_TX-
PWR_OK
SATA3_RX+ SATA3_RX-
WDT
AC/HDA_SDIN2 AC/HDA_SDIN1 AC/HDA_SDIN0 GND (FIXED)
SPKR I2C_CK I2C_DAT THRM#
C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C29 C30 C31 C32 C33 C34 C35
GND FIXED) GND USB_SSRX0­USB_SSRX0+ GND USB_SSRX1­USB_SSRX1+ GND USB_SSRX2­USB_SSRX2+ GND (FIXED) USB_SSRX3­USB_SSRX3+ GND DDI1_PAIR6+ DDI1_PAIR6­RSVD RSVD PCIE_RX6+ PCIE_RX6­GND (FIXED) PCIE_RX7+ PCIE_RX7­DDI1_HPD DDI1_PAIR4+ DDI1_PAIR4­RSVD RSVD DDI1_PAIR5+ DDI1_PAIR5­GND (FIXED)
DDI2_CTRLCLK_AUX+ DDI2_CTRLDATA_AUX­DDI2_DDC_AUX_SEL
RSVD
D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 D32 D33 D34 D35
GND FIXED) GND USB_SSTX0­USB_SSTX0+ GND USB_SSTX1­USB_SSTX1+ GND USB_SSTX2­USB_SSTX2+ GND (FIXED) USB_SSTX3­USB_SSTX3+ GND
DDI1_CTRLCLK_AUX+ DDI1_CTRLDATA_AUX-
RSVD RSVD PCIE_TX6+ PCIE_TX6­GND (FIXED) PCIE_TX7+ PCIE_TX7­RSVD RSVD DDI1_PAIR0+ DDI1_PAIR0­RSVD DDI1_PAIR1+ DDI1_PAIR1­GND (FIXED) DDI1_PAIR2+ DDI1_PAIR2-
DDI1_DDC_AUX_SEL
RSVD
Express-IB Page 13
Row A Row B Row C Row D
Pin Name Pin Name Pin Name Pin Name
A36 A37 A38 A39 A40 A41 A42 A43 A44 A45 A46 A47 A48 A49 A50 A51 A52 A53 A54 A55 A56 A57 A58 A59 A60 A61 A62 A63 A64 A65 A66 A67 A68 A69 A70 A71 A72 A73 A74 A75 A76 A77 A78 A79 A80
USB6­USB6+ USB_6_7_OC# USB4­USB4+ GND (FIXED) USB2­USB2+ USB_2_3_OC# USB0­USB0+ VCC_RTC EXCD0_PERST# EXCD0_CPPE# LPC_SERIRQ GND (FIXED) PCIE_TX5+ PCIE_TX5- GPI0 PCIE_TX4+ PCIE_TX4­GND PCIE_TX3+ PCIE_TX3­GND (FIXED) PCIE_TX2+ PCIE_TX2­GPI1 PCIE_TX1+ PCIE_TX1­GND GPI2 PCIE_TX0+ PCIE_TX0­GND (FIXED) LVDS_A0+ LVDS_A0­LVDS_A1+ LVDS_A1­LVDS_A2+ LVDS_A2­LVDS_VDD_EN LVDS_A3+ LVDS_A3­GND (FIXED)
USB7-
B36
USB7+
B37
USB_4_5_OC#
B38
USB5-
B39
USB5+
B40
GND (FIXED)
B41
USB3-
B42
USB3+
B43
USB_0_1_OC#
B44
USB1-
B45
USB1+
B46
EXCD1_PERST#
B47
EXCD1_CPPE#
B48
SYS_RESET#
B49
CB_RESET#
B50
GND (FIXED)
B51
PCIE_RX5+
B52
PCIE_RX5-
B53
GPO1
B54
PCIE_RX4+
B55
PCIE_RX4-
B56
GPO2
B57
PCIE_RX3+
B58
PCIE_RX3-
B59
GND (FIXED)
B60
PCIE_RX2+
B61
PCIE_RX2-
B62
GPO3
B63
PCIE_RX1+
B64
PCIE_RX1-
B65
WAKE0#
B66
WAKE1#
B67
PCIE_RX0+
B68
PCIE_RX0-
B69
GND (FIXED)
B70
LVDS_B0+
B71
LVDS_B0-
B72
LVDS_B1+
B73
LVDS_B1-
B74
LVDS_B2+
B75
LVDS_B2-
B76
LVDS_B3+
B77
LVDS_B3-
B78
LVDS_BKLT_EN
B79
GND (FIXED)
B80
C36
DDI3_CTRLCLK_AUX+
C37
DDI3_CTRLDATA_AUX-
C38
DDI3_DDC_AUX_SEL
DDI3_PAIR0+
C39
DDI3_PAIR0-
C40
GND (FIXED)
C41
DDI3_PAIR1+
C42
DDI3_PAIR1-
C43
DDI3_HPD
C44
RSVD
C45
DDI3_PAIR2+
C46
DDI3_PAIR2-
C47
RSVD
C48
DDI3_PAIR3+
C49
DDI3_PAIR3-
C50
GND (FIXED)
C51
PEG_RX0+
C52
PEG_RX0-
C53
TYPE0#
C54
PEG_RX1+
C55
PEG_RX1-
C56
TYPE1#
C57
PEG_RX2+
C58
PEG_RX2-
C59
GND (FIXED)
C60
PEG_RX3+
C61
PEG_RX3-
C62
RSVD
C63
RSVD
C64
PEG_RX4+
C65
PEG_RX4-
C66
RSVD
C67
PEG_RX5+
C68
PEG_RX5-
C69
GND (FIXED)
C70
PEG_RX6+
C71
PEG_RX6-
C72
GND
C73
PEG_RX7+
C74
PEG_RX7-
C75
GND
C76
RSVD
C77
PEG_RX8+
C78
PEG_RX8-
C79
GND (FIXED)
C80
DDI1_PAIR3+
D36
DDI1_PAIR3-
D37
RSVD
D38
DDI2_PAIR0+
D39
DDI2_PAIR0-
D40
GND (FIXED)
D41
DDI2_PAIR1+
D42
DDI2_PAIR1-
D43
DDI2_HPD
D44
RSVD
D45
DDI2_PAIR2+
D46
DDI2_PAIR2-
D47
RSVD
D48
DDI2_PAIR3+
D49
DDI2_PAIR3-
D50
GND (FIXED)
D51
PEG_TX0+
D52
PEG_TX0-
D53
PEG_LANE_RV#
D54
PEG_TX1+
D55
PEG_TX1-
D56
TYPE2#
D57
PEG_TX2+
D58
PEG_TX2-
D59
GND (FIXED)
D60
PEG_TX3+
D61
PEG_TX3-
D62
RSVD
D63
RSVD
D64
PEG_TX4+
D65
PEG_TX4-
D66
GND
D67
PEG_TX5+
D68
PEG_TX5-
D69
GND (FIXED)
D70
PEG_TX6+
D71
PEG_TX6-
D72
GND
D73
PEG_TX7+
D74
PEG_TX7-
D75
GND
D76
RSVD
D77
PEG_TX8+
D78
PEG_TX8-
D79
GND (FIXED)
D80
Page 14 Express-IB
Row A Row B Row C Row D
Pin Name Pin Name Pin Name Pin Name
A81 A82 A83 A84 A85 A86 A87 A88 A89 A90 A91 A92 A93 A94 A95 A96 A97 A98 A99 A100 A101 A102 A103 A104 A105 A106 A107 A108 A109 A110
LVDS_A_CK+ LVDS_A_CK­LVDS_I2C_CK LVDS_I2C_DAT GPI3 RSVD RSVD
PCIE0_CK_REF+ PCIE0_CK_REF-
GND (FIXED)
SPI_POWER SPI_MISO
GPO0
SPI_CLK SPI_MOSI TPM_PP TYPE10# SER0_TX SER0_RX
GND (FIXED)
SER1_TX SER1_RX LID#
VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V GND (FIXED)
B81 B82 B83 B84 B85 B86 B87 B88 B89 B90 B91 B92 B93 B94 B95 B96 B97 B98 B99 B100 B101 B102 B103 B104 B105 B106 B107 B108 B109 B110
LVDS_B_CK+ LVDS_B_CK­LVDS_BKLT_CTRL
VCC_5V_SBY VCC_5V_SBY VCC_5V_SBY VCC_5V_SBY BIOS_DIS1# VGA_RED
GND (FIXED)
VGA_GRN VGA_BLU VGA_HSYNC VGA_VSYNC VGA_I2C_CK VGA_I2C_DAT SPI_CS#
RSVD RSVD GND (FIXED)
FAN_PWMOUT FAN_TACHIN SLEEP#
VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V GND (FIXED)
C81 C82 C83 C84 C85 C86 C87 C88 C89 C90 C91 C92 C93 C94 C95 C96 C97 C98 C99 C100 C101 C102 C103 C104 C105 C106 C107 C108 C109 C110
PEG_RX9+ PEG_RX9-
TPM_PP
GND PEG_RX10+ PEG_RX10­GND PEG_RX11+ PEG_RX11­GND (FIXED) PEG_RX12+ PEG_RX12­GND PEG_RX13+ PEG_RX13­GND RSVD PEG_RX14+ PEG_RX14­GND (FIXED) PEG_RX15+ PEG_RX15­GND VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V GND (FIXED)
D81 D82 D83 D84 D85 D86 D87 D88 D89 D90 D91 D92 D93 D94 D95 D96 D97 D98 D99 D100 D101 D102 D103 D104 D105 D106 D107 D108 D109 D110
PEG_TX9+ PEG_TX9­RSVD GND PEG_TX10+ PEG_TX10­GND PEG_TX11+ PEG_TX11­GND (FIXED) PEG_TX12+ PEG_TX12­GND PEG_TX13+ PEG_TX13­GND RSVD PEG_TX14+ PEG_TX14­GND (FIXED) PEG_TX15+ PEG_TX15­GND VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V GND (FIXED)
Express-IB Page 15

3.2. Signal Description Terminology

The following terms are used in the COM Express AB/CD Signal Descriptions below.
I Input to the Module
O Output from the Module
I/O Bi-directional input / output signal
OD Open drain output
I 3.3V Input 3.3V tolerant
I 5V Input 5V tolerant
O 3.3V Output 3.3V signal level
O 5V Output 5V signal level
I/O 3.3V Bi-directional signal 3.3V tolerant
I/O 5V Bi-directional signal 5V tolerant
I/O 3.3Vsb Input 3.3V tolerant active in standby state
P Power Input/Output
REF Reference voltage output that may be sourced from a module power plane.
PDS Pull-down strap. This is an output pin on the module that is either tied to GND or not connected.
The signal is used to indicate the PICMG module type to the Carrier Board.
PU ADLINK implemented pull-up resistor on module
PD ADLINK implemented pull-down resistor on module
Page 16 Express-IB

3.3. AB Signal Descriptions

3.3.1. Audio Signals

Signal Pin # Description I/O PU/PD Comment
AC_RST# / HDA_RST#
AC_SYNC / HDA_SYNC
AC_BITCLK / HDA_BITCLK
AC _SDOUT / HDA_SDOUT
AC _SDIN[2:0] HDA_SDIN[2:0]
A30 Reset output to CODEC, active low. O 3.3VSB
A29 Sample-synchronization signal to the CODEC(s). O 3.3V
A32 Serial data clock generated by the external
CODEC(s).
A33 Serial TDM data output to the CODEC. O 3.3V
B28 B30
Serial TDM data inputs from up to 3 CODECs. I/O 3.3VSB
I/O 3.3V

3.3.2. Analog VGA

Signal Pin # Description I/O PU/PD Comment
VGA_RED B89 Red for monitor.
Analog DAC output, designed to drive a
37.5-Ohm equivalent load.
VGA_GRN B91 Green for monitor
Analog DAC output, designed to drive a
37.5-Ohm equivalent load.
O Analog If VGA is used than signal should
be pulled to GND by 150 on the carrier
O Analog If VGA is used than signal should
be pulled to GND by 150 on the carrier
VGA_BLU B92 Blue for monitor.
Analog DAC output, designed to drive a
37.5-Ohm equivalent load.
VGA_HSYNC B93 Horizontal sync output to VGA monitor O 3.3V
VGA_VSYNC B94 Vertical sync output to VGA monitor O 3.3V
VGA_I2C_CK B95 DDC clock line (I²C port dedicated to identify
VGA monitor capabilities)
VGA_I2C_DAT B96 DDC data line. I/O OD 3.3V PU 2k2 3.3V
O Analog If VGA is used than signal should
be pulled to GND by 150 on the carrier
I/O OD 3.3V PU 2k2 3.3V

3.3.3. LVDS

Signal Pin # Description I/O PU/PD Comment
LVDS_A0+ LVDS_A0- LVDS_A1+ LVDS_A1- LVDS_A2+ LVDS_A2- LVDS_A3+ LVDS_A3-
LVDS_A_CK+ LVDS_A_CK-
A71 A72 A73 A74 A75 A76 A78 A79
A81 A82
LVDS Channel A differential pairs O LVDS
LVDS Channel A differential clock O LVDS
LVDS_B0+ LVDS_B0-
B71 B72
LVDS Channel B differential pairs O LVDS
Express-IB Page 17
Signal Pin # Description I/O PU/PD Comment
LVDS_B1+ LVDS_B1- LVDS_B2+ LVDS_B2- LVDS_B3+ LVDS_B3-
LVDS_B_CK+ LVDS_B_CK-
LVDS_VDD_EN A77 LVDS panel power enable O 3.3V
LVDS_BKLT_EN B79 LVDS panel backlight enable O 3.3V
LVDS_BKLT_CTRL B83 LVDS panel backlight brightness control O 3.3V
LVDS_I2C_CK A83 DDC lines used for flat panel detection and control. O 3.3V PU 2k2 3.3V
LVDS_I2C_DAT A84 DDC lines used for flat panel detection and control. I/O 3.3V PU 2k2 3.3V
B73 B74 B75 B76 B77 B78
B81 B82
LVDS Channel B differential clock O LVDS

3.3.4. Gigabit Ethernet

Gigabit Ethernet Pin # Description I/O PU/PD Comment
GBE0_MDI0+ GBE0_MDI0- GBE0_MDI1+ GBE0_MDI1- GBE0_MDI2+ GBE0_MDI2- GBE0_MDI3+ GBE0_MDI3-
A13 A12 A10 A9 A7 A6 A3 A2
Gigabit Ethernet Controller 0: Media Dependent Interface Differential Pairs 0, 1, 2, 3. The MDI can operate in 1000, 100, and 10Mbit/sec modes. Some pairs are unused in some modes according to the following:
1000BASE-T 100BASE-TX 10BASE-T MDI[0]+/- B1_DA+/- TX+/- TX+/- MDI[1]+/- B1_DB+/- RX+/- RX+/- MDI[2]+/- B1_DC+/­MDI[3]+/- B1_DD+/-
I/O Analog Twisted pair
signals for external transformer.
GBE0_ACT# B2 Gigabit Ethernet Controller 0 activity indicator, active low. O 3.3VSB
GBE0_LINK# A8 Gigabit Ethernet Controller 0 link indicator, active low. O 3.3VSB
GBE0_LINK100# A4 Gigabit Ethernet Controller 0 100Mbit/sec link indicator, active low. O 3.3VSB
GBE0_LINK1000# A5 Gigabit Ethernet Controller 0 1000Mbit/sec link indicator, active low. O 3.3VSB
GBE0_CTREF A14 Reference voltage for Carrier Board Ethernet channel 1 and 2
magnetics center tap. The reference voltage is determined by the requirements of the Module PHY and may be as low as 0V and as high as 3.3V. The reference voltage output shall be current limited on the Module. In the case in which the reference is shorted to ground, the current shall be 250 mA or less.
GND min
3.3V max
Page 18 Express-IB

3.3.5. Serial ATA

Signal Pin # Description I/O PU/PD Comment
SATA0_TX+ SATA0_TX-
SATA0_RX+ SATA0_RX-
SATA1_TX+ SATA1_TX-
SATA1_RX+ SATA1_RX-
SATA2_TX+ SATA2_TX-
SATA2_RX+ SATA2_RX-
SATA3_TX+ SATA3_TX-
SATA3_RX+ SATA3_RX-
(S)ATA_ACT# A28 ATA (parallel and serial) or SAS activity
A16 A17
A19 A20
B16 B17
B19 B20
A22 A23
A25 A26
B22 B23
B25 B26
Serial ATA channel 0, Transmit Output differential pair.
Serial ATA channel 0, Receive Input differential pair.
Serial ATA channel 1, Transmit Output differential pair.
Serial ATA channel 1, Receive Input differential pair.
Serial ATA channel 2, Transmit Output differential pair.
Serial ATA channel 2, Receive Input differential pair.
Serial ATA channel 3, Transmit Output differential pair.
Serial ATA channel 3, Receive Input differential pair.
indicator, active low.
O SATA AC coupled on Module
I SATA AC coupled on Module
O SATA AC coupled on Module
I SATA AC coupled on Module
O SATA AC coupled on Module
I SATA AC coupled on Module
O SATA AC coupled on Module
I SATA AC coupled on Module
O 3.3V
Express-IB Page 19

3.3.6. PCI Express

Signal Pin # Description I/O PU/PD Comment
PCIE_TX0+ PCIE_TX0-
PCIE_RX0+ PCIE_RX0-
PCIE_TX1+ PCIE_TX1-
PCIE_RX1+ PCIE_RX1-
PCIE_TX2+ PCIE_TX2-
PCIE_RX2+ PCIE_RX2-
PCIE_TX3+ PCIE_TX3-
PCIE_RX3+ PCIE_RX3-
PCIE_TX4+ PCIE_TX4-
PCIE_RX4+ PCIE_RX4-
A68 A69
B68 B69
A64 A65
B64 B65
A61 A62
B61 B62
A58 A59
B58 B59
A55 A56
B55 B56
PCI Express channel 0, Transmit Output differential pair.
PCI Express channel 0, Receive Input differential pair.
PCI Express channel 1, Transmit Output differential pair.
PCI Express channel 1, Receive Input differential pair.
PCI Express channel 2, Transmit Output differential pair.
PCI Express channel 2, Receive Input differential pair.
PCI Express channel 3, Transmit Output differential pair.
PCI Express channel 3, Receive Input differential pair.
PCI Express channel 4, Transmit Output differential pair.
PCI Express channel 4, Receive Input differential pair.
O PCIE AC coupled on Module
I PCIE AC coupled off Module
O PCIE AC coupled on Module
I PCIE AC coupled off Module
O PCIE AC coupled on Module
I PCIE AC coupled off Module
O PCIE AC coupled on Module
I PCIE AC coupled off Module
O PCIE AC coupled on Module
I PCIE AC coupled off Module
PCIE_TX5+ PCIE_TX5-
PCIE_RX5+ PCIE_RX5-
PCIE_CLK_REF+ PCIE_CLK_REF-
A52 A53
B52 B53
A88 A89
PCI Express channel 5, Transmit Output differential pair.
PCI Express channel 5, Receive Input differential pair.
PCI Express Reference Clock output for all PCI Express and PCI Express Graphics Lanes.
O PCIE AC coupled on Module
I PCIE AC coupled off Module
O PCIE

3.3.7. Express Card

Signal Pin # Description I/O PU/PD Comment
EXCD0_CPPE# EXCD1_CPPE#
EXCD0_PERST# EXCD1_PERST#
A49 B48
A48 B47
PCI ExpressCard: PCI Express capable card request I 3.3V PU 10k
3.3V
PCI ExpressCard: reset O 3.3V Cannot be tested on Express-
BASE6 (DVT issue)
Page 20 Express-IB

3.3.8. LPC bus

Signal Pin # Description I/O PU/PD Comment
LPC_AD[0:3] B4-B7 LPC multiplexed address, command and data bus I/O 3.3V
LPC_FRAME# B3 LPC frame indicates the start of an LPC cycle O 3.3V
LPC_DRQ0# LPC_DRQ1#
LPC_SERIRQ A50 LPC serial interrupt I/O OD 3.3V PU 8k2 3.3V
LPC_CLK B10 LPC clock output - 33MHz nominal O 3.3V
B8 B9
LPC serial DMA request I 3.3V

3.3.9. USB

Signal Pin # Description I/O PU/PD Comment
USB0+ USB0-
USB1+ USB1-
USB2+ USB2-
USB3+ USB3-
USB4+ USB4-
USB5+ USB5-
A46
USB differential data pairs for Port 0 I/O 3.3VSB USB 1.1/ 2.0 compliant
A45
B46
USB differential data pairs for Port 1 I/O 3.3VSB USB 1.1/ 2.0 compliant
B45
A43
USB differential data pairs for Port 1 I/O 3.3VSB USB 1.1/ 2.0 compliant
A42
B43
USB differential data pairs for Port 2 I/O 3.3VSB USB 1.1/ 2.0 compliant
B42
A40
USB differential data pairs for Port 3 I/O 3.3VSB USB 1.1/ 2.0 compliant
A39
B40
USB differential data pairs for Port 4 I/O 3.3VSB USB 1.1/ 2.0 compliant
B39
USB6+ USB6-
USB7+ USB7-
USB_0_1_OC# B44 USB over-current sense, USB ports 0 and 1. A pull-up
USB_2_3_OC# A44 USB over-current sense, USB ports 2 and 3. A pull-up
USB_4_5_OC# B38 USB over-current sense, USB ports 4 and 5. A pull-up
USB_6_7_OC# A38 USB over-current sense, USB ports 6 and 7. A pull-up
A37
USB differential data pairs for Port 5 I/O 3.3VSB USB 1.1/ 2.0 compliant
A36
B37
USB differential data pairs for Port 6 I/O 3.3VSB USB 1.1/ 2.0 compliant
B37
for this line shall be present on the module. An open drain driver from a USB current monitor on the carrier board may drive this line low.
for this line shall be present on the module. An open drain driver from a USB current monitor on the carrier board may drive this line low. .
for this line shall be present on the module. An open drain driver from a USB current monitor on the carrier board may drive this line low.
for this line shall be present on the module. An open drain driver from a USB current monitor on the carrier board may drive this line low.
I 3.3VSB PU 10k 3.3VSB Do not pull high on carrier
I 3.3VSB PU 10k 3.3VSB Do not pull high on carrier
I 3.3VSB PU 10k 3.3VSB Do not pull high on carrier
I 3.3VSB PU 10k 3.3VSB Do not pull high on carrier
Express-IB Page 21

3.3.10. SPI (BIOS only)

Signal Pin # Description I/O PU/PD Comment
SPI_CS# B97 Chip select for Carrier Board SPI BIOS Flash. O 3.3VSB
SPI_MISO A92 Data in to module from carrier board SPI BIOS flash. I 3.3VSB
SPI_MOSI A95 Data out from module to carrier board SPI BIOS flash. O 3.3VSB
SPI_CLK A94 Clock from module to carrier board SPI BIOS flash. O 3.3VSB
SPI_POWER A91 Power supply for Carrier Board SPI – sourced from Module
– nominally 3.3V. The Module shall provide a minimum of 100mA on SPI_POWER. Carriers shall use less than 100mA of SPI_POWER. SPI_POWER shall only be used to power SPI devices on the Carrier
BIOS_DIS0# A34 Selection strap to determine the BIOS boot device. I PU 10K 3.3V Carrier shall pull to GND
BIOS_DIS1# B88 Selection strap to determine the BIOS boot device. I PU 10K 3.3V Carrier shall pull to GND
O P 3.3VSB
or leave no- connect.
or leave no- connect

3.3.11. Miscellaneous

Signal Pin # Description I/O PU/PD Comment
SPKR B32 Output for audio enunciator, the “speaker” in PC-AT
systems
WDT B27 Output indicating that a watchdog time-out event has
occurred.
THRM# B35 Input from off-module temp sensor indicating an over-temp
situation.
THERMTRIP# A35 Active low output indicating that the CPU has entered
thermal shutdown.
O 3.3V
O 3.3V
I 3.3V
O 3.3V
FAN_PWMOUT B101 Fan speed control. Uses the Pulse Width Modulation
(PWM) technique to control the fan’s RPM.
FAN_TACHIN11 B102 Fan tachometer input for a fan with a two pulse output. I OD 3.3V PU 10k 3.3V
TPM_PP11 C83 Trusted Platform Module (TPM) Physical Presence pin.
Active high. TPM chip has an internal pull down. This signal is used to indicate Physical Presence to the TPM.
O OD 3.3V
I 3.3V PD 3.3V If TPM not installed on
module than remove PD
3.3V

3.3.12. SMBus

Signal Pin # Description I/O PU/PD Comment
SMB_CK B13 System Management Bus bidirectional clock line. Power
sourced through 5V standby rail and main power rails.
SMB_DAT# B14 System Management Bus bidirectional data line. Power
sourced through 5V standby rail and main power rails.
SMB_ALERT# B15 System Management Bus Alert – active low input can
be used to generate an SMI# (System Management Interrupt) or to wake the system. Power sourced through 5V standby rail and main power rails.
Page 22 Express-IB
I/O OD 3.3VSB PU 2k2 3.3VSB
I/O OD 3.3VSB PU 2k2 3.3VSB
I 3.3VSB

3.3.13. I2C Bus

Signal Pin # Description I/O PU/PD Comment
I2C_CK B33 General purpose I²C port clock output/input I/O OD 3.3VSB PU 2k2 3.3VSB
I2C_DAT B34 General purpose I²C port data I/O line I/O OD 3.3VSB PU 2k2 3.3VSB

3.3.14. General Purpose I/O (GPIO)

Signal Pin # Description I/O PU/PD Comment
GPO[0] A93 General purpose output pins. O 3.3V
GPO[1] B54 General purpose output pins. O 3.3V
GPO[2] B57 General purpose output pins. O 3.3V
GPO[3] B63 General purpose output pins. O 3.3V
GPI[0] A54 General purpose input pins.
Pulled high internally on the module.
GPI[1] A63 General purpose input pins.
Pulled high internally on the module.
GPI[2] A67 General purpose input pins.
Pulled high internally on the module.
GPI[3] A85 General purpose input pins.
Pulled high internally on the module.
I 3.3V PU 10K 3.3V PU not in PICMG
suggest 10K
I 3.3V PU 10K 3.3V PU not in PICMG
suggest 10K
I 3.3V PU 10K 3.3V PU not in PICMG
suggest 10K
I 3.3V PU 10K 3.3V PU not in PICMG
suggest 10K

3.3.15. Power And System Management

Signal Pin # Description I/O PU/PD Comment
PWRBTN# B12 Power button to bring system out of S5 (soft off), active on falling edge. I 3.3VSB PU 10k
3.3VSB
SYS_RESET# B49 Reset button input. Active low request for module to reset and reboot. May
be falling edge sensitive. For situations when SYS_RESET# is not able to reestablish control of the system, PWR_OK or a power cycle may be used.
CB_RESET# B50 Reset output from module to Carrier Board. Active low. Issued by module
chipset and may result from a low SYS_RESET# input, a low PWR_OK input, a VCC_12V power input that falls below the minimum specification, a watchdog timeout, or may be initiated by the module software.
I 3.3VSB PU 10k
3.3VSB
O 3.3VSB
PWR_OK B24 Power OK from main power supply. A high value indicates that the power is
good. This signal can be used to hold off Module startup to allow carrier based FPGAs or other configurable devices time to be programmed.
SUS_STAT# B18 Indicates imminent suspend operation; used to notify LPC devices. O 3.3VSB
SUS_S3# A15 Indicates system is in Suspend to RAM state. Active-low output. An inverted
copy of SUS_S3# on the carrier board (also known as “PS_ON”) may be used to enable the non-standby power on a typical ATX power supply.
SUS_S4# A18 Indicates system is in Suspend to Disk state. Active low output. O 3.3VSB
SUS_S5# A24 Indicates system is in Soft Off state. O 3.3VSB
WAKE0# B66 PCI Express wake up signal. I 3.3VSB PU 10k
I 3.3V TBD by R&D
in CPLD
O 3.3VSB
3.3VSB
Should have weak pull up
Express-IB Page 23
Signal Pin # Description I/O PU/PD Comment
WAKE1# B67 General purpose wake up signal. May be used to implement wake-up on
PS/2 keyboard or mouse activity.
BATLOW# A27 Battery low input. This signal may be driven low by external circuitry to
signal that the system battery is low, or may be used to signal some other external power-management event.
LID# LID button. Low active signal used by the ACPI operating system for a LID
switch.
SLEEP# Sleep button. Low active signal used by the ACPI operating system to bring
the system to sleep state or to wake it up again.
I 3.3VSB PU 10k
3.3VSB
I 3.3VSB PU 10k
3.3VSB
I OD
3.3VSB
I OD
3.3VSB
PU 10k
3.3VSB
PU 10K
3.3VSB

3.3.16. Power and Ground

Signal Pin # Description I/O PU/PD Comment
VCC_12V A104-A109
B104-B109
VCC_5V_SBY B84-B87 Standby power input: +5.0V nominal. See section 7 “Electrical
Primary power input: +12V nominal (5 ~ 19V). See section 7 “Electrical Specifications“ for allowable input range. All available VCC_12V pins on the connector(s) shall be used.
Specifications“ for allowable input range. If VCC5_SBY is used, all available VCC_5V_SBY pins on the connector(s) shall be used. Only used for standby and suspend functions. May be left unconnected if these functions are not used in the system design.
P 8.5~19 V
P 5Vsb ±5%
VCC_RTC A47 Real-time clock circuit-power input. Nominally +3.0V. P
GND A1, A11, A21, A31,
A41, A51, A57, A66, A80, A90, A96, A100, A110, B1, B11, B21 ,B31, B41, B51, B60, B70, B80, B90, B100, B110
Ground - DC power and signal and AC signal return path. P
Page 24 Express-IB
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