Zte MC8630 User Manual

This manual is applicable for MC8630 Module.

ZTE MC8630 Module Hardware Design User Manual

Version：V1.3

MC8630 模块产品

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Copyright Statement

Copyright © 2009 by ZTE Corporation
The copyright of this User Manual belongs to ZTE Corporation and under the protection of Copyright

Law of the People’s Republic of China and other relative laws.
No part of this publication may be excerpted，reproduced, translated or utilized in any form or by any

means (electronic or mechanical， including photocopying and microfilm) without prior written
permission from ZTE Corporation. Any violation behavior will be punished.

The information in the document is subject to change without notice. At the same time we reserve the
right to revise or recall the User Manual.

If there is anything unclear in this manual, please contact us or our agent or seller.

REV3.0, Sept.2009

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With strong technical force, ZTE Corporation can provide CDMA/GPRS module customers with the
following all-around technical support:

1. Provide complete technical documentation;

2. Provide the development board used for R&D, test, production, after-sales, etc.;

3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios;

4. Provide test environment;

ZTE Corporation provides customers with onsite supports, and also you could get supports through
telephone, website, instant communication, E-mail, etc.

The module website http://module.ztemt.com.cn

provides the relevant industry information and
module technical documentation. The authorized module customers could download the latest
technical documentation for our website. If you have more requirements, you could send an E-mail to
[e-mail]

. You can also call us at 0755-86140899 for more supports.

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Preface

Summary

This manual is applicable for MC8630 module. This manual takes MC8630 for example to instruct the users
how to design the hardware and how to quickly and conveniently design different kinds of wireless terminals
based on the modules.

Target Readers

 System designing engineers
 Mechanical engineers
 Hardware engineers
 Software engineers
 T est engineers

Brief Introduction

The manual contains 5 chapters, shown as below:

Chapter Contents

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错误！未找到引用源。

Introduces MC8630 module’s technical specs and relevant documents and
abbreviations.

错误！未找到引用
源。.MC8630 module’s

Introduction

Introduces MC8630 module’s principle diagram and relevant standards.

3 PIN Definitions Introduces MC8630 module’s PIN name and function.

错误！未找到引用
源。.Descriptions of

Hardware Interface

Introduces MC8630 module’s hardware interfaces.

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错误！未找到引用源。

Design

Introduces MC8630 module’s appearance, assembly diagram and PCB layout
diagram.

Update History

The update history records the descriptions of document update each time. The latest version contains the all
previous updates.

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CONTENTS

1 DESCRIPTION.............................................................................................................................................7

1.1 1.1 DESCRIPTIONS OF UPDATE OF MC8630 MODULE’S HARDWARE VERSION................................................7

1.2 1.2 TECHNICAL SPECIFICATION.......................................................................................................................7

1.2.1 Descriptions of Specs ................................................................................................................................7

1.2.2 Basic Functions .........................................................................................................................................7

1.2.3 Module Interfaces......................................................................................................................................8

1.2.4 Technical Parameters.................................................................................................................................8

1.3 RELEVANT DOCUMENTS........................................................................................................................................9

1.4 ABBREVIATIONS ....................................................................................................................................................9

2 MC8630 MODULE INTRODUCTION...................................................................................................... 12

3 PIN DEFINITIONS..................................................................................................................................... 13

4 DESCRIPTIONS OF HARDWARE INTERFACES...................................................................................16

4.1 DESCRIPTION.......................................................................................................................................................16

4.2 POWER AND RESET..............................................................................................................................................16

4.2.1 Power Design...........................................................................................................................................16

4.2.2 Power-on..................................................................................................................................................16

4.2.3 Power-off.................................................................................................................................................16

4.2.4 Reset........................................................................................................................................................16

4.2.5 Other Device............................................................................................................................................17

4.3 PORT ...................................................................................................................................................................17

NOTE: WHEN THE RXD SIGNAL IS AT HIGH LEVEL, THE MODULE WILL NOT BE IN DORMANT STATE..................................17

4.4 USB INTERFACE..................................................................................................................................................17

4.5 UIM CARD INTERFACE........................................................................................................................................18

4.6 AUDIO INTERFACE...............................................................................................................................................19

4.7 ANTENNA INTERFACE..........................................................................................................................................20

4.8 PCM INTERFACE CIRCUIT DESIGN (ONLY FOR VERSION C)..................................................................................21

5 MECHANICAL DESIGN........................................................................................................................... 22

5.1 APPEARANCE.......................................................................................................................................................22

5.2 MODULE MAIN BOARD PCB LAYOUT DIAGRAM.................................................................................................22

5.3 MODULE’S FASTENING METHOD.........................................................................................................................24

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INSERT DIAGRAMS

Figure 1-1 Three Versions of MC8630 Module ............................................ 7

Figure 2-1 MC8630 Module’s principle diagram ........................................ 12

Figure 3-1 Descriptons of PINs ....................................................... 13

Figure 3-2 Descriptions of PINs ...................................................... 14

Figure 4-1 PIN Descriptions .......................................................... 17

Figure 4-2 USB 2.0 Interface ......................................................... 18

Figure 4-3 MC8630 Module USB Power Design Diagram .................................... 18

Figure 4-4 UIM card circuit reference design diagram ................................. 19

Figure 5-1 MC8630 module’s appearance ............................................... 22

Figure 5-2 PCB sealing diagram ....................................................... 23

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TABLES

Table 1-1 Module specification ........................................................ 7

Table 1-2 Module’s basic functions ................................................... 8

Table 1-3 Module’s Interfaces ........................................................ 8

Table 1-4 Technical parameters ........................................................ 8

Table 3-1 36PIN Definitions .......................................................... 13

Table 4-1 Voltage Features ........................................................... 16

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1 Description

This manual is applicable for MC8630 module. MC8630 module is CDMA2000 1X EVDO RevA
manufactured by ZTE Corporation, which has the functions like voice, SMS and data service. The peak value
of forward data rate can reach up to 3.1 Mbit/s and reverse data rate can reach up to 1.8 Mbit/s. The data
service could provide users with economical high-speed Internet access and wireless data service. Using
MC8630 1X EVDO RevA can easily help you realize the following: MODEM, U-Modem, Embedded
Module, Wileless Phone, Smart Phone, Multimedia Phone and Touch-screen Telecom Device, etc.
This manual describes MC8630 module’s logic structure, hardware interface and main functions, and provides
reference design for the hardware and mechanics.

1.1 1.1 Descriptions of Update of MC8630 Module’s Hardware version

MC8630 module currently has three PCB versions, which are respectively MC8630MD_A, MC8630MD_B
and MC8630MD_C. Among them, MC8630MD_A has been stopped production, MC8630MD_B and
MC8630MD_C are for batch production. The difference between MC8630MD_A and MC8630MD_B lies in
the replacement of power inductor and adding of 5 test points USB D+, USB D-, ON/OFF, TXD and RXD on
PCB bottom layer. The difference between MC8630MD_B and MC8630MD_C lies in the replacement of PA &
Duplexex and adding of PCM interface. All modifications do not affect the performance of module. You could
distinguish three different versions of modules through the silkscreen area at the bottom of module, shown in
figure 1.1:

Figure 1-1 Three Versions of MC8630 Module

1.2 1.2 Technical Specification

1.2.1 Descriptions of Specs

Please refer to Table 1-1for the specifications of MC8630.

T able 1-1 Modul e specif ica t ion

Module Model Technical System Work Frequency

MC8630

CDMA 2000 1X EVDO RevA
Down compatible with CDM

A

1X, EVDO Rev0

CDMA 800MHz

1.2.2 Basic Functions

Please refer to Table 1-2 for the module’s basic functions.

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T ab le 1-2 Mo dul e’s basic functions

Basic Functions Descriptions

Voice

EVRC, 13Kqcelp, 4GV high quality voice（need network support）, add PCM interface
for phone applications in Version C

SMS Support TEXT
Data

Forward data rate’s peak value up to 3.1 Mbit/s, and reverse data rate’s peak value up
to 1.8 Mbit/s.

1.2.3 Module Interfaces

Please refer to Table 1-3 for the module’s Interfaces.

T ab le 1-3 Mo dul e’s Interfaces

Module’s Interface Descriptions

UART interface  Support software customization, only version C supports port

USB interface

 Software download upgrade
 Data communication（MODEM）
 USB2.0

Power interface Used to supply the power, reset, and power on-off the module
Audio interface Two audio input/output, one for diffenrential, one for single-end

ON/OFF interface

Press key to power on/off, or toggle the switch to power on/off（indirect switch
power）

PCM interface Only version C supports PCM interface
UIM ard interface Built-in UIM or R-UIM , Class B/C UIM interface specification

Antenna interface

Provides two RF connectors and two stamp-hole PINs, used for CDMA main antenna
and auxiliary antenna. Select the detailed connection method.

1.2.4 Technical Parameters

Please refer to Table 1-4 for the module’s technical parameters.

T ab le 1-4 Tec hni cal parameters

Technical parameters Description

Working temperature -30°C ~ +75°C
Input voltage

3.0V-4.4V typical: 3.6V

Maximum current

650mA @ -105.5 dBm recommended current: 1A

Standby current

Min. standby current 3mA @ -75 dBm,（Method： USB hangup, RXD
pull-down for 20s）

Talk current

230mA @ -75 dBm

Rx. sensitivity

-105.5dBm

Tx. power

23dBm ~ 30dBm (Class II) typical testing value: 24.0dBm

Frequency range

800MHz
Tx: 824~849 MHz
Rx: 869~894 MHz

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1.3 Relevant Documents

 《AT Command Manual of ZTE Corporation’s MC8630 Module》
 《Test References of ZTE Corporation's CDMA Wireless Modules》

1.4 Abbreviations

A
ADC

Analog-Digital Converter

AFC

Automatic Frequency Control

AGC

Automatic Gain Control

ARFCN

Absolute Radio Frequency Channel Number

ARP

Antenna Reference Point

ASIC

Application Specific Integrated Circuit

B
BER

Bit Error Rate

BTS

Base Transceiver Station

C
CDMA

Code Division Multiple Access

CDG

CDMA Development Group

CS

Coding Scheme

CSD

Circuit Switched Data

CPU

Central Processing Unit

D
DAI

Digital Audio interface

DAC

Digital-to-Analog Converter

DCE

Data Communication Equipment

DSP

Digital Signal Processor

DTE

Data T erm inal Equipment

DTMF

Dual T one Multi-Frequency

DTR

Data T erm inal Ready

E
EFR

Enhanced Full Rate

EGSM

Enhanced GSM

EMC

Electromagnetic Compatibility

EMI

Electro Magnetic Interference

ESD

Electronic Static Discharge

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ETS

European T ele comm unication Sta ndard

EVDO

Evolution Data Only

F
FDMA

Frequency Division Multiple Access

FR

Full Rate

G
GPRS

General Packet Radio Service

GSM

Global Standard for Mobile Communications

H
HR

Half Rate

I
IC

Integrated Circuit

IMEI

International Mobile Equipment Identity

ISO

International Standards Organization

ITU

International T ele communicati ons Union

L
LCD

Liquid Crystal Display

LED

Light Emitting Diode

M
MCU

Machine Control Unit

MMI

Man Machine Interface

MS

Mobile Station

P
PCB

Printed Circuit Board

PCL

Power Control Level

PCS

Personal Communication System

PDU

Protocol Data Unit

PLL

Phase Locked Loop

PPP

Point-to-point protocol

R
RAM

Random Access Memory

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RF

Radio Frequency

ROM

Read-only Memory

RMS

Root Mean Square

RTC

Real Time Clock

S
SIM

Subscriber Identification Module

SMS

Short Message Service

SRAM

Static Random Access Memory

T
TA

Terminal adapter

TDMA

Time Division Multiple Access

TE

Terminal Equipment also referred it as DTE

U
UART

Universal asynchronous receiver-transmitter

UIM

User Identifier Management

USB

Universal Serial Bus

V
VSWR

Voltage Standing Wave Ratio

Z
ZTE

ZTE Corporation

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2 MC8630 Module Introduction

Please refer to Figure 2-1 for MC8630 module’s principle diagram.

Figure 2-1 MC8630 Module’s principle diagram

MC8630 module is EVDO Rev.A wireless 3G module based on Qualcomm’s QSC6085 platform. The module
adopts 36PIN stampt-hole, it applies for CDMA 1X and EVDO network and supports CDMA 800MHz.

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3 PIN Definitions

MC8630 module adopts stamp-hole welding method, totally 36 PINs. The distance among the pins is 0.5mm.
See the descriptions of PINs in figure 3-1. Please refer to table 3-2 for the key voltage of each pin.

Figure 3-1 Descriptons of PINs

（Note: only for version A and B）

See table 3-1 for PIN definitions.

Table 3-1 36PIN Definitions

（Note: only for version A and B）

Function PIN No. Signal Name I/O

Descriptions of Function/Compatibility

15 VCHG I External power inspection and auto power-on
14 VBUS I USB power
29 ON/OFF I Power on/off enabled (ON/OFF)
13 /PON_RESET I Module reset
16 V_MAIN I Work power
18 V_MAIN I Work power

Power

17 V_MSMP O Refer to 2.6V outout for external power

5 GND GND
12 GND GND
20 GND GND

GND

35 GND GND
30 USB_D+ I/O USB_D+

USB

31 USB_D- I/O USB_D-

1 V_UIM_3V O UIM card power 3V

2 UIM_RST O UIM card reset

3 UIM_CLK O UIM card clock

UIM

4 UIM_DATA I/O UIM card data
11 MIC1_N I MIC1­10 MIC1_P I MIC1+

AUDIO

8 EAR1_N O Audio output 1-

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7 EAR1_P O Audio output 1+

9 MIC2_P I MIC2+

6 EAR2_P O Audio output 2+
22 NC

23 NC
25 NC
21 NC
26 NC
28 NC
27 NC

NC

24 NC
32 NC

NC

33 NC

NC

34 NC

ANT2

19 RF_ANT O RF antenna plug (Main)

ANT1

36 RF_ANT O RF antenna plug (Auxiliary)

Figure 3-2 Descriptions of PINs

（Note: only for version C）

Table 3-2 36PIN Definitions

（Note: only for version C）

MC8630 Module PIN Definitions（36PIN）

Function PIN No. Signal Name I/O

Descriptions of
Function/Compatibility

15 VCHG

Input, allowable voltage range

-0.5—14.5V

External power inspection
and auto power-on

14 VBUS

Input, allowable voltage range

-0.5—7.5V

USB power

Power

29 ON/OFF

Input, low level valid, pull-up to

2.8V

Power on/off enabled
(ON/OFF)

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13 /PON_RESET

Input, low level valid, pull-up to

1.8V

Module reset
16 V_MAIN Input, 3.0—4.4V Work power
18 V_MAIN Input,3.0—4.4V Work power

17 V_MSMP

Output，2.6V

Refer to 2.6V outout for

external power

5 GND GND
12 GND GND
20 GND GND

GND

35 GND GND
30 USB_D+ Input/output USB_D+

USB

31 USB_D- Input/output USB_D-

1 V_UIM_3V

Output，2.85V

UIM card power 2.85V
2 UIM_RST Output UIM card reset
3 UIM_CLK Output UIM card clock

UIM

4 UIM_DATA Input/output UIM card data

11 MIC1_N Input MIC1­10 MIC1_P Input MIC1+

8 EAR1_N Output Audio output 1­7 EAR1_P Output Audio output 1+
9 MIC2_P Input MIC2+

AUDIO

6 EAR2_P Output Audio output 2+

22 RXD Input, 1.8V Receive data
23 TXD

Output， 1.8V

Transmit data

25 /RTS

Output，1.8V

Request to send

21 /CTS

Input，1.8V

Clear to send

26 /DTR

Input，1.8V

Data terminal ready

28 /DSR(PCM_SYNC) DSR output, 1.8V

Data set ready(multiplex with

PCM_SYNC

)

27 /DCD(PCM_DOUT)

DCD output，1.8V

Carrier wave inspection

(multiplex with

PCM_DOUT)

UART

Port

24 RI

RI output，1.8V

Ringtone indication

(multiplex with SD_D1)

32 PCM_CLK Input/output Realize PCM_CLK

PCM

33 PCM_DIN Output Realize PCM_DIN

NC

34 NC

ANT2

19 RF_ANT Output RF antenna plug (Main)

ANT1

36 RF_ANT Output RF antenna plug (Auxiliary)

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4 Descriptions of Hardware Interfaces

4.1 Description

This section describes the function interfaces and usage of MC8630 modules in details, and provides the
designing sample.

 Power
 Power on/off
 Serial Port (only for version C)
 PCM interface
 USB interface
 UIM Card
 Audio Interface
 Antenna Interface

Remarks: In the system, the module layout should be far away from high-speed circuit, switch power, power
transformer, large power inductor, or single chip microcomputer’s clock circui t.

4.2 Power and Reset

4.2.1 Power Design

The module could work under two modes: 1. powered by power adaptor; 2. powered by battery.
The power could be directly supplied by external power, which is directly added to V_MAIN and satisfy the
voltage in the table 4-1. The external power could be power adaptor, battery, USB power convertor, etc. It’s
recommended that the power current is 1A.

T ab le 4-1 Voltage Features

Classification MIN. TYPICAL MAX.
Input Voltage

3.0V 3.6V 4.4V

4.2.2 Power-on

The module could be turned on in the following two methods.

1. After the module is powered off, and then provide a 500-1000mS low level pulse to ON/OFF PIN.

2. Connect V_CHG to V_MAIN, and the module will be powered on automatically.

4.2.3 Power-off

To turn off the module, provide a 500-1000mS low level pulse to ON/OFF PIN as the module is powered on.
If the module can’t be powered off after V_CHG is connected to V_MAIN, then the module would be
automatically powered on after power-off.

4.2.4 Reset

You could turn off the module firstly and then turn it on to reset the module.
ON/OFF timing figure is as follows:
Provide a low logic to MC8630’s reset pin, and the baseband circuit in the module would reset. Select the
circuit design based on the usage. Usually: Controlled by the switch and external GPIO, etc.

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4.2.5 Other Device

In order to make sure the module’s data is saved safely and guarantee the security of the module’s data, please
don’t cut off the power when the module is powered on. It’s strongly recommended that the battery or soft
switch key like the power key on the mobile phone should be added.

4.3 Port

The module provides an integrated full duplex full flow control UART interface, whose maximal data rate is
230400bps, typical value is 11.5kbps. External interface is 2.6VCMOS level signal, input is compatible

3.3VCMOS level signal，their logic functions conform to RS-232 interface standard.

Note: users need to extend UART1 to update software, if they’d like to connect module to DTE in the design
phase.

The module’s output IO level is 2.6VTTL，it needs to transfer the level when connect wi th sta nd ard 3 .3 V logic
circuit（such as MCU or RS232 drive chip MAX3238 etc）, it’s not need level transfer circuit.

Note: when the RxD signal is at high level, the module will not be in
dormant state

 The support of serial port depends on different software versions. Some MC8630 module’s software

versions might not support the serial port function.

 Not all software versions support the serial port function (only version C supports).
 When using MC8630 module’s URAT interface to communicate with PC or MCU, please pay attention to

TX and RX direction, especially, note that MC8630 UART interface only supports 1.8V. Therefore, the
triode is usually used to realize level conversion for non 1.8V external UART. See figure 4-4, the
resistance is just for reference. Please recalculate when designing it.

Figure 4-1 PIN Descriptions

Note: When designing or using the serial port, a 5.1K resistance should be paralleled to GND at CTS PIN of
MC8630’s end.

4.4 USB Interface

The module provides a USB2.0 interface, which is composed of VBUS, D+ and D-. The module’s external
circuit could connect directly with USB signal connector, but during the design process, try to add ESB
protection component to avoid damage. Figure D12 shows USB2.0 ESD protection component with the

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junction capacitance is smaller than 3P. VBUS might not connect with VBUS at external host end, but connect
directly with the module’s VMAIN. The USB recommended voltage is: 3.0—5.6V, typical 5V.

Figure 4-2 USB 2.0 Interface

MC8630 module’s UBS power reference design:
V_MAIN output voltage is adjusted by feedback resistance. Neither perform serial connection with any
resistance or inductor, nor parallel connect with any capacitance. It’s advised to design V_MAIN output as
typical voltage 3.6V. See figure 4-3.

Figure 4-3 MC8630 Module USB Power Design Diagram

4.5 UIM Card Interface

Three kinds of work voltage ClassA-5V±10%, ClassB-3V±10%, ClassC-1.8V±10% are specified in UICC
standard. UIM card at least supports continuous two kinds of voltage: Class A/B or Class B/C. China
Telecom’s clear requirements upon the terminal: The terminal should support Class B/C, and ClassB-3V±10%,
ClassC-1.8V±10%, and should comply with the Power-on time sequence specified in ISO 7816. UIM_VPP
should be hang up, and applied for 5V.
MC8630 module supports UIM card, which includes 4 pins at the end. V_CARD is used to power UIM card.
It’s strongly recommended to add ESD protection component when designing UIM circuit. See ESD protection
component D2 in figure 4-4.

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Figure 4-4 UIM card circuit reference design diagram

NOTE: Considering the difference on the output current from DATA pin of different cards, a 10K
resistor should be used to pull up DATA pin to V_CARD. UIM card PCB layout should be close to the
module as much as possible to avoid the interference of reading/writing UIM card from other sources.

4.6 Audio Interface

The module provides two audio inputs and two audio outputs through stamp-hole PIN. The module also
provides 2 microphone interfaces and only one pair I/O works at the same time. Two audio outputs include 1
receiver differential output and 1 headset single-end output.
 Microphone
It provides two microphone interfaces MIC1 and MIC_P, among which MIC2_P is differential interface. These
two microphone inputs are internally coupled in AC domain and added a 1.8V offset voltage to directly
connect the microphone.
 Earpiece
It provides two earpieces: EAR1 & EAR2_P, and EAR1 is differential interface with 32Ω resistance;

while EAR2_P is single-ended interface with 32Ω resistance.
CDMA module’s audio interfaces are designed as below:

 Design of audio interface on the receiver
Select the microphone with the sensitivity lower than -52dB since the output power for EAR1 is 50mW and the
max. gain in MIC1 can reach up to 52dB. The level of MIC_1P is about 1.8V.

Note: if other kind of audio input method is adopted, the input signal should be within 2V. If the signal voltage
is lower than 2V, then the pre-amplifier should be added. If the signal voltage is higher than 2V, then network
attenuation should be added.

 Design of audio interface on the earpiece
Select the microphone with the sensitivity lower than -52dB since the output power for EAR2_P is 8.8mW and
the max. gain in MIC2_P can reach up to52dB. The level of MIC_P is about 1.8V. The design is almost the
same.
If EAR2_P is used for hands-free speaker output, an audio power amplifier (e.g., LM4890) should be added.
SPKR_EN can be used as the signal of enabling.

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4.7 Antenna Interface

The module provides two RF connectors and two Pins, used for CDMA main antenna and auxiliary antenna.
The performance of the antenna shou ld not be lower than CDMA1X. Please select RF connector or stamp-hole
based on the actual demand.
MC8630 dual antenna requirements:
It’s strongly recommended to add auxiliary antenna when suing MC8630 module. In special cases, such as no
requirements or low requirements on data rate, the auxiliary antenna might not be used.

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4.8 PCM Interface Circuit Design (only for version C)

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5 Mechanical Design

5.1 Appearance

See MC8630 module’s appearance in figure 5-1.

Figure 5-1 MC8630 module’s appearance

 Dimensions（L x W x H）:

39.5mm*27mm*2.35mm

 Weight: 6g

Note: the rectangle line frame in yellow is man-made, and it doesn’t exist on the actual object.

5.2 Module Main board PCB Layout Diagram

See the module main board PCB layout diagram in figure 5-2.（Unit: mm）

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Figure 5-2 PCB sealing diagram

Note: Its recommended to open a window for user board at the blue area on the bottom layer. The blue line
frame is man-made, and it doesn’t exist on the actual object. Please see the dimensions for the size of hole.

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5.3 Module’s Fastening Method

The module’s fastening method adopts direct manual soldering to avoid second-time soldering. It’s strongly
recommend to use the manual soldering because MC8630 module board is just 0.8mm thick and QSC6085
BGA space is too small. The second-time soldering would cause the melting of soldering tin and lead to short
circuit of QSC6085 main chip, such as USB disconnected, large current, etc.