Z Microsystems Multi Processor Unit User Manual

ZZ
Z
ZZ
MM
M
MM
FIELDFIELD
FIELD
FIELDFIELD
PP
P
PP
--
READREAD
-
READ
--
READREAD
UU
U
UU
YY
Y
YY
System Overview
1.0
1.1
1.1
System
Sealed Sealed
Z MPUZ MPU
Z MPU
Z MPUZ MPU
• Shared Chassis -- Shared Peripherals
• Less space, less weight, less power, less cost
The rugged Z MPU delivers four independent computers. Each computer is an Intel or Sun COTS computer encased in its own environmentally sealed hot swappable module.
Each computer is a complete stand alone system with its own dedicated boot disk.
• Hot swappable Sealed Computer Modules (SCM) and Disk modules
• Mix & match platforms and OS’s
The chassis can be quickly populated with SCM’s and hard drives, and can be mixed and matched with Intel and Sun motherboards using IDE and SCSI hard drives.
Each hot pluggable computer and its dedicated disk module is environmentally sealed against sand and dust, effectively reducing maintenance and increasing reliability and system life.
1.2
1.2
Independent Independent
• Independent Stand Alone Systems
Four physically and logically separate computers enable different software applications to run independently.
Each computer has its own dedicated TranzPak 7 disk module, its own external I/O connectors, and shared access to support peripherals.
Each computer has two independent USB busses that are matrix-switched to the array of USB peripherals.
Component Overview
2.0
Hot swap TranzPak 7 Modules contain environmentally sealed IDE or SCSI hard drives.
2.2
TranzPak 7
Inside Look
Internal DC Power Input and Switched USB
2.1
Hot swap SCM’s contain environmentally sealed COTS motherboards. Keep your configurations current with the latest Intel/Sun motherboards.
SCM
External I/O Connectors
Dedicated 28 VDC Power and ATX Interface Board
Heatsinks conduct thermal energy to module cover for dispersion
ATX Motherboard (Intel or Sun)
Transition Board
PCI Card
Dedicated Disk (SCSI or IDE)
Operator Front
Each docking slot has a transition board that mates with the removable SCM and its dedicated TranzPak 7 disk module. Inside each SCM an interface board generates the required voltages and transitions the motherboard’s I/O signals to the outside world.
Shared Peripherals & System Administration
Peripheral Sharing
3.0
• Shared Peripheral Clusters
The Peripheral Device Layer organizes an array of the most popular USB devices (CDW, floppy, PCMCIA) and an external hub into four switchable clusters that can be individually and dynamically switched to any SCM.
Peripheral Cluster
3.1
Remote SysAdmin
3.2
• Maximum Flexibility
Each SCM has two independent internal USB busses that are assignable to any of the four peripheral clusters.
Peripheral assignments can be made locally using the front panel or remotely via the SysAdmin network facility.
• Web Based SysAdmin
An embedded multiprocessor monitors system health and watch-dog activity.
An HTML web page provides network capability for remote monitoring and system administration.
The ability to independently control power, reboot, monitor environmental performance, execute failover strategies, and administer system functions across the network allows the system to be located in “lights out” inaccessible locations.
System Architecture
6.0
External connector transition board
Z Microsystems - Multi Processor Unit
FF
uture Proof Tuture Proof T
F
uture Proof T
FF
uture Proof Tuture Proof T
TranzPak 7 removable disk module
echnologechnolog
echnolog
echnologechnolog
y Insery Inser
y Inser
y Insery Inser
(SCM) Sealed computer module stack
tiontion
tion
tiontion
DC Power In
Quad modulated fan array provides front to back cooling
Fan array control board
Peripheral clusters
Switched peripheral and power distribution backplane
7.0 Schematics
7.1 Specifications
Motherboards Intel and Sun ATX form
factor Storage Options SCSI and/or IDE Dimensions 10.5” H x 17.5" W x 22" D Net Weight 110 lbs. (depending on
device)
Power
DC Voltage: 22 – 29 VDC DC Current: 18A @ 28VDC Typ. AC Voltage: 85 – 264 VAC @ 47-63 Hz AC Current : 5.6A @ 120VAC Typ.
Environmental
Operating Temp. 5º to + 50º Celsius Non Op. Temp. -40º to + 65º Celsius Operating Humidity 5% to 95% Non condensing Non Op. Humidity 5% to 95% Non condensing
Shipping Humidity 5% to 95% Non condensing Non Op. Altitude -1,300 to 40,000 ft. Operating Altitude -1,300 to 10,000 ft. Operating Vibration Wheeled and tracked vehicles, fixed
and rotary wing aircraft.
Mil-Std-167 (in transit case) Shock Operating Mil-Std-810E, Method 516, 30g’s Fungus Non Nutrients / contaminants
Reliability
Operating Life 10 years Maintainability <20 minutes
Regulatory
Safety UL 1950 EMI FCC Class A Quality/Workmanship IPC / ISO 9002 and applicable section
of MIL-HDBK-454
7.2 Options
Z MPU 2X
Z MPU 4X
Z Microsystems 5945 Pacific Center Blvd., Suite 505 San Diego, CA 92121-4309 T: 858.657.1000 F: 858.657.1001 www.zmicro.com
Loading...