VIPA System MICRO
CPU | M13-CCF0000 | Manual
HB400 | CPU | M13-CCF0000 | en | 18-50
SPEED7 CPU M13C
www.vipa.com/en/service-support/manuals
VIPA GmbH
Ohmstr
91074 Herzogenaurach
Telephone: 09132-744-0
Fax: 09132-744-1864
Email: info@vipa.com
Internet: www.vipa.com
M13-CCF0000_000_CPU M13C,5,EN - © 2018
. 4
VIPA System MICRO
Table of contents
Table of contents
1 General.................................................................................................................... 8
1.1 Copyright © VIP
1.2 About this manual............................................................................................. 9
1.3 Safety information........................................................................................... 10
2 Basics and mounting........................................................................................... 1
2.1 Safety information for users............................................................................ 11
2.2 System conception......................................................................................... 12
2.3 Dimensions..................................................................................................... 13
2.4 Mounting......................................................................................................... 14
2.4.1 Mounting CPU............................................................................................. 14
2.4.2 Mounting the extension module................................................................... 17
2.4.3 Mounting periphery module......................................................................... 18
2.5 Wiring............................................................................................................. 19
2.5.1 Wiring CPU.................................................................................................. 19
2.5.2 Wiring periphery module.............................................................................. 23
2.6 Demounting.................................................................................................... 25
2.6.1 Demounting CPU......................................................................................... 25
2.6.2 Demounting the extension module.............................................................. 29
2.6.3 Demounting periphery module.................................................................... 30
2.7 Installation guidelines..................................................................................... 33
2.8 General data................................................................................................... 35
3 Hardware description........................................................................................... 37
3.1 Properties....................................................................................................... 37
3.2 Structure......................................................................................................... 38
3.2.1 System MICRO CPU M13C........................................................................ 38
3.2.2 Interfaces..................................................................................................... 39
3.2.3 LEDs............................................................................................................ 43
3.2.4 Memory management.................................................................................. 47
3.2.5 Slot for storage media................................................................................. 47
3.2.6 Buffering mechanisms................................................................................. 48
3.2.7 Operating mode switch................................................................................ 48
3.3 Option: Extension module EM M09 2x serial interface .................................. 49
3.4 Technical data................................................................................................. 51
3.4.1 Technical data CPU..................................................................................... 51
3.4.2 Technical data EM M09............................................................................... 64
4 Deployment CPU M13-CCF0000.......................................................................... 65
4.1 Assembly........................................................................................................ 65
4.2 Start-up behavior............................................................................................ 65
4.3 Addressing...................................................................................................... 66
4.3.1 Overview...................................................................................................... 66
4.3.2 Default address assignment of the I/O part................................................. 66
4.3.3 Option: Addressing periphery modules....................................................... 67
4.4 Hardware configuration - CPU........................................................................ 68
4.5 Hardware configuration - System MICRO modules........................................ 70
4.6 Hardware configuration - Ethernet PG/OP channel........................................ 71
4.6.1 Take IP address parameters in project........................................................ 72
4.7 Setting standard CPU parameters.................................................................. 76
A GmbH ................................................................................. 8
1
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VIPA System MICRO
4.7.1 Parameterization via Siemens CPU............................................................ 76
4.7.2 Parameter CPU........................................................................................... 77
4.8 Setting VIPA specific CPU parameters........................................................... 80
4.9 Project transfer............................................................................................... 81
4.9.1 Transfer via Ethernet................................................................................... 81
4.9.2 Transfer via memory card............................................................................ 82
4.9.3 Option: Transfer via MPI.............................................................................. 82
4.10 Accessing the web server............................................................................. 85
4.10.1 Device web page....................................................................................... 85
4.10.2 WebVisu project
4.11 Operating modes.......................................................................................... 91
4.11.1 Overview.................................................................................................... 91
4.11.2 Function security........................................................................................ 93
4.12 Overall reset................................................................................................. 94
4.12.1 Overall reset by means of the operating mode switch............................... 94
4.12.2 Overall reset by means of the Siemens SIMATIC Manager ..................... 94
4.12.3 Actions after the overall reset.................................................................... 94
4.13 Firmware update........................................................................................... 96
4.14 Reset to factory settings............................................................................... 97
4.15 Deployment storage media - VSD, VSC....................................................... 98
4.16 Extended know-how protection.................................................................. 101
4.17 CMD - auto commands............................................................................... 102
4.18 Control and monitoring of variables with test functions.............................. 104
4.19 Diagnostic entries....................................................................................... 105
5 Deployment I/O periphery.................................................................................. 106
5.1 Overview....................................................................................................... 106
5.2 Address assignment..................................................................................... 107
5.3 Analog input.................................................................................................. 108
5.3.1 Properties.................................................................................................. 108
5.3.2 Analog value representation...................................................................... 108
5.3.3 Wiring........................................................................................................ 109
5.3.4 Parametrization.......................................................................................... 110
5.4 Digital input................................................................................................... 111
5.4.1 Properties................................................................................................... 111
5.4.2 Wiring......................................................................................................... 111
5.4.3 Parametrization.......................................................................................... 112
5.4.4 Status indication........................................................................................ 113
5.5 Digital output................................................................................................. 115
5.5.1 Properties.................................................................................................. 115
5.5.2 Wiring......................................................................................................... 115
5.5.3 Parametrization.......................................................................................... 116
5.5.4 Status indication........................................................................................ 116
5.6 Counting....................................................................................................... 118
5.6.1 Properties.................................................................................................. 118
5.6.2 Wiring......................................................................................................... 118
5.6.3 Proceeding................................................................................................ 120
5.6.4 Parametrization......................................................................................... 121
5.6.5 Counter operating modes.......................................................................... 126
5.6.6 Counter - Additional functions................................................................... 133
........................................................................................ 89
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5.6.7 Diagnostics and interrupt........................................................................... 139
5.7 Frequency measurement.............................................................................. 140
5.7.1 Properties.................................................................................................. 140
5.7.2 Wiring........................................................................................................ 141
5.7.3 Proceeding................................................................................................ 142
5.7.4 Parametrization......................................................................................... 142
5.7.5 Status indication........................................................................................ 144
5.8 Pulse width modulation - PWM..................................................................... 146
5.8.1 Properties.................................................................................................. 146
5.8.2 Wiring........................................................................................................ 146
5.8.3 Proceeding................................................................................................ 147
5.8.4 Parametrization......................................................................................... 147
5.8.5 Status indication........................................................................................ 149
5.9 Pulse train..................................................................................................... 151
5.9.1 Properties.................................................................................................. 151
5.9.2 Wiring........................................................................................................ 152
5.9.3 Proceeding................................................................................................ 152
5.9.4 Parametrization......................................................................................... 153
5.9.5 Status indication........................................................................................ 154
5.10 Diagnostic and interrupt.............................................................................. 155
5.10.1 Overview.................................................................................................. 155
5.10.2 Process interrupt..................................................................................... 155
5.10.3 Diagnostic interrupt.................................................................................. 157
6 Deployment PG/OP communication - productive........................................... 163
6.1 Basics - Industrial Ethernet in automation.................................................... 163
6.2 Basics - ISO/OSI reference model............................................................... 164
6.3 Basics - Terms.............................................................................................. 166
6.4 Basics - Protocols......................................................................................... 167
6.5 Basics - IP address and subnet.................................................................... 168
6.6 Fast introduction........................................................................................... 170
6.7 Hardware configuration................................................................................ 170
6.8 Configure Siemens S7 connections............................................................. 171
6.9 Configure Open Communication.................................................................. 176
7 Deployment PG/OP communication - PROFINET............................................ 179
7.1 Basics PROFINET........................................................................................ 179
7.2 PROFINET installation guidelines................................................................ 181
7.3 Deployment as PROFINET IO controller...................................................... 182
7.3.1 Steps of configuration................................................................................ 182
7.3.2 Commissioning and initialization............................................................... 183
7.3.3 Configuration PROFINET IO controller..................................................... 183
7.3.4 Configuration PROFINET IO device.......................................................... 185
7.4 Deployment as PROFINET I-Device............................................................ 186
7.4.1 Steps of configuration................................................................................ 186
7.4.2 Installing the GSDML file........................................................................... 187
7.4.3 Configuration as I-Device.......................................................................... 188
7.4.4 Configuration in the higher-level IO controller........................................... 189
7.4.5 Error behavior and interrupts..................................................................... 190
7.5 MRP.............................................................................................................. 193
7.6 Topology....................................................................................................... 194
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7.7 Device replacement without exchangeable medium/PG.............................. 195
7.8 Commissioning and start-up behavior.......................................................... 196
7.9 PROFINET diagnostics................................................................................ 197
7.9.1 Overview.................................................................................................... 197
7.9.2 Diagnostics with the configuration and engineering tool........................... 197
7.9.3 Diagnostics during runtime in the user program........................................ 197
7.9.4 Diagnostics via OB start information......................................................... 199
7.9.5 Diagnostics status indication via SSLs...................................................... 199
7.10 PROFINET system limits............................................................................ 201
8 Option: PtP communication.............................................................................. 202
8.1 Fast introduction........................................................................................... 202
8.2 Principle of the data transfer......................................................................... 203
8.3 PtP communication via extension module EM M09..................................... 204
8.4 Parametrization............................................................................................ 207
8.4.1 FC/SFC 216 - SER_CFG - Parametrization PtP....................................... 207
8.5 Communication............................................................................................. 208
8.5.1 FC/SFC 217 - SER_SND - Send to PtP.................................................... 208
8.5.2 FC/SFC 218 - SER_RCV - Receive from PtP........................................... 208
8.6 Protocols and procedures............................................................................. 208
8.7 Modbus - Function codes ............................................................................ 212
9 Option: Deployment PROFIBUS communication............................................ 216
9.1 Fast introduction........................................................................................... 216
9.2 PROFIBUS communication.......................................................................... 217
9.3 PROFIBUS communication via extension module EM M09......................... 218
9.4 Deployment as PROFIBUS DP slave........................................................... 220
9.5 PROFIBUS installation guidelines................................................................ 222
10 Configuration with VIPA SPEED7 Studio......................................................... 225
10.1 SPEED7 Studio
10.2 SPEED7 Studio - Work environment.......................................................... 226
10.2.1 Project tree ............................................................................................. 228
10.2.2 Catalog ................................................................................................... 229
10.3 SPEED7 Studio - Hardware configuration - CPU....................................... 231
10.4 SPEED7 Studio - Hardware configuration - Ethernet PG/OP channel....... 232
10.5 SPEED7 Studio - Hardware configuration - I/O modules........................... 234
10.6 Deployment I/O periphery........................................................................... 235
10.6.1 Overview.................................................................................................. 235
10.6.2 Analog input............................................................................................. 235
10.6.3 Digital input.............................................................................................. 237
10.6.4 Digital output............................................................................................ 237
10.6.5 Counter.................................................................................................... 238
10.6.6 Frequency measurement......................................................................... 242
10.6.7 Pulse width modulation - PWM................................................................ 244
10.6.8 Pulse train................................................................................................ 246
10.7 Deployment Web visualization................................................................... 248
10.7.1 Activate WebVisu functionality................................................................ 249
10.7.2 WebVisu editor........................................................................................ 249
10.7.3 Start-up of the WebVisu project............................................................... 252
10.7.4 Access to the WebVisu............................................................................ 253
10.7.5 Status of the WebVisu............................................................................. 253
- Overview........................................................................ 225
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10.8 SPEED7 Studio
10.8.1 Transfer via MPI...................................................................................... 254
10.8.2 Transfer via Ethernet............................................................................... 256
10.8.3 Transfer via memory card........................................................................ 257
11 Configuration with TIA Portal............................................................................ 258
11.1 TIA Portal - Work environment .................................................................. 258
11.1.1 General.................................................................................................... 258
11.1.2 Work environment of the TIA Portal......................................................... 259
11.2 TIA Portal - Hardware configuration - CPU................................................. 259
11.3 TIA Portal - Hardware configuration - Ethernet PG/OP channel................. 263
11.3.1 Take IP address parameters in project.................................................... 264
11.4 TIA Portal - VIPA-Include library................................................................. 268
11.5 TIA Portal - Project transfer........................................................................ 269
11.5.1 Transfer via Ethernet............................................................................... 269
11.5.2 Transfer via memory card........................................................................ 269
11.5.3 Option: Transfer via MPI.......................................................................... 270
Appendix............................................................................................................. 272
A System specific event IDs............................................................................... 274
B Integrated blocks............................................................................................. 322
C SSL partial list................................................................................................. 325
- Project transfer............................................................... 254
HB400 | CPU | M13-CCF0000 | en | 18-50 7
General
VIPA System MICRO
Copyright © VIP
A GmbH
1 General
1.1 Copyright © VIPA GmbH
All Rights Reserved
This document contains proprietary information of VIPA and is not to be disclosed or used
except in accordance with applicable agreements.
This material is protected by the copyright laws. It may not be reproduced, distributed, or
altered in any fashion by any entity (either internal or external to VIPA), except in accordance with applicable agreements, contracts or licensing, without the express written consent of VIPA and the business management owner of the material.
For permission to reproduce or distribute, please contact: VIPA, Gesellschaft für Visualisierung und Prozessautomatisierung mbH Ohmstraße 4, D-91074 Herzogenaurach, Germany
Tel.: +49 9132 744 -0
Fax.: +49 9132 744-1864
EMail: info@vipa.de
http://www.vipa.com
Every effort has been made to ensure that the information contained in
this document was complete and accurate at the time of publishing. Nevertheless, the authors retain the right to modify the information.
This customer document describes all the hardware units and functions
known at the present time. Descriptions may be included for units which
are not present at the customer site. The exact scope of delivery is
described in the respective purchase contract.
CE Conformity Declaration
Conformity Information
Trademarks
Hereby, VIPA GmbH declares that the products and systems are in compliance with the
essential requirements and other relevant provisions. Conformity is indicated by the CE
marking af
For more information regarding CE marking and Declaration of Conformity (DoC), please
contact your local VIPA customer service organization.
VIPA, SLIO, System 100V, System 200V, System 300V, System 300S, System 400V,
System 500S and Commander Compact are registered trademarks of VIPA Gesellschaft
für Visualisierung und Prozessautomatisierung mbH.
SPEED7 is a registered trademark of profichip GmbH.
SIMATIC, STEP, SINEC, TIA Portal, S7-300, S7-400 and S7-1500 are registered trademarks of Siemens AG.
Microsoft and Windows are registered trademarks of Microsoft Inc., USA.
Portable Document Format (PDF) and Postscript are registered trademarks of Adobe
Systems, Inc.
All other trademarks, logos and service or product marks specified herein are owned by
their respective companies.
fixed to the product.
8
HB400 | CPU | M13-CCF0000 | en | 18-50
VIPA System MICRO
General
About this manual
Information product support
Technical support
1.2 About this manual
Objective and contents
Contact your local VIPA Customer Service Organization representative if you wish to
report errors or questions regarding the contents of this document. If you are unable to
locate a customer service centre, contact VIP
VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany
Telefax: +49 9132 744-1204
EMail: documentation@vipa.de
Contact your local VIPA Customer Service Organization representative if you encounter
problems with the product or have questions regarding the product. If you are unable to
locate a customer service centre, contact VIPA as follows:
VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany
Tel.: +49 9132 744-1150 (Hotline)
EMail: support@vipa.de
This manual describes the CPU M13-CCF0000 of the System MICRO from VIPA. It contains a description of the construction, project implementation and usage.
A as follows:
Product Order number as of state:
CPU-HW CPU-FW
CPU M13C M13-CCF0000 01 V2.4.12
Target audience
Structure of the manual
Guide to the document
Availability
Icons Headings
The manual is targeted at users who have a background in automation technology.
The manual consists of chapters. Every chapter provides a self-contained description of a
specific topic.
The following guides are available in the manual:
n An overall table of contents at the beginning of the manual
n References with page numbers
The manual is available in:
n printed form, on paper
n in electronic form as PDF-file (Adobe Acrobat Reader)
Important passages in the text are highlighted by following icons and headings:
DANGER!
Immediate or likely danger
HB400 | CPU | M13-CCF0000 | en | 18-50 9
. Personal injury is possible.
General
Safety information
1.3 Safety information
VIPA System MICRO
CAUTION!
Damages to property is likely if these warnings are not heeded.
Supplementary information and useful tips.
Applications conforming
with specifications
Documentation
The system is constructed and produced for:
n communication and process control
n general control and automation tasks
n industrial applications
n operation within the environmental conditions specified in the technical data
n installation into a cubicle
DANGER!
This device is not certified for applications in
–
in explosive environments (EX-zone)
The manual must be available to all personnel in the
n project design department
n installation department
n commissioning
n operation
CAUTION!
The following conditions must be met before using or commis-
sioning the components described in this manual:
– Hardware modifications to the process control system should only be
carried out when the system has been disconnected from power!
Installation and hardware modifications only by properly trained per-
–
sonnel.
– The national rules and regulations of the respective country must be
satisfied (installation, safety, EMC ...)
Disposal
National rules and regulations apply to the disposal of the unit!
HB400 | CPU | M13-CCF0000 | en | 18-50 10
VIPA System MICRO
2 Basics and mounting
2.1 Safety information for users
Basics and mounting
Safety information for users
Handling of electrostatic
sensitive modules
Shipping of modules
Measurements and alterations on electrostatic sensitive modules
VIPA modules make use of highly integrated components in MOS-Technology. These
components are extremely sensitive to over-voltages that can occur during electrostatic
discharges. The following symbol is attached to modules that can be destroyed by electrostatic discharges.
The Symbol is located on the module, the module rack or on packing material and it indicates the presence of electrostatic sensitive equipment. It is possible that electrostatic
sensitive equipment is destroyed by energies and voltages that are far less than the
human threshold of perception. These voltages can occur where persons do not discharge themselves before handling electrostatic sensitive modules and they can damage
components thereby
that have been damaged by electrostatic discharges can fail after a temperature change,
mechanical shock or changes in the electrical load. Only the consequent implementation
of protection devices and meticulous attention to the applicable rules and regulations for
handling the respective equipment can prevent failures of electrostatic sensitive modules.
Modules must be shipped in the original packing material.
When you are conducting measurements on electrostatic sensitive modules you should
take the following precautions:
n Floating instruments must be discharged before use.
n Instruments must be grounded.
Modifying electrostatic sensitive modules you should only use soldering irons with
grounded tips.
, causing the module to become inoperable or unusable. Modules
CAUTION!
Personnel and instruments should be grounded when working on electrostatic sensitive modules.
HB400 | CPU | M13-CCF0000 | en | 18-50 11
Basics and mounting
System conception
2.2 System conception
Overview
VIPA System MICRO
The System MICRO is a modular automation system for assembly on a 35mm mounting
rail. By means of periphery modules this system may be adapted matching to your automation tasks. In addition, it is possible to expand your CPU by appropriate interfaces. The
wiring complexity is low, because the DC 24V electronic section supply is integrated to
the backplane bus and this allows replacement with standing wire.
Components
CPU
Extension module
n CPU
n Extension module
n Periphery module
With the CPU electronic, input/output components and power supply are integrated to
one casing. In addition, up to 8 periphery modules of the System MICRO can be connected to the backplane bus. As head module via the integrated power module for power
supply CPU electronic and the I/O components are supplied as well as the electronic of
the periphery modules, which are connected via backplane bus. T
supply of the I/O components and for DC 24V electronic power supply of the periphery
modules, which are connected via backplane bus, the CPU has removable connectors.
By installing of up to 8 periphery modules at the backplane bus of the CPU, these are
electrically connected, this means these are assigned to the backplane bus and connected to the DC 24V electronic power supply.
By using extension modules you can extend the interfaces of the CPU. The attachment to
the CPU is made by plugging on the left side of the CPU. You can only connect one
extension module to the CPU at a time.
o connect the power
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VIPA System MICRO
Periphery module
2.3
Dimensions
Dimensions CPU M13C
Basics and mounting
Dimensions
By means of up to 8 periphery modules, you can extend the internal I/O areas. The
attachment to the CPU is made by plugging them on the right side of the CPU.
Dimensions extension
module EM M09
Dimensions in mm
Dimensions in mm
HB400 | CPU | M13-CCF0000 | en | 18-50 13
Basics and mounting
Mounting > Mounting CPU
Dimensions periphery
module
VIPA System MICRO
Dimensions in mm
2.4 Mounting
2.4.1
2.4.1.1 Mounting CPU without mounting rail
Mounting CPU
CAUTION!
Mounting without mounting rail is only permitted, if you only want to use
the CPU without extension and periphery modules. Otherwise, a
mounting rail must always be used for EMC technical reasons.
HB400 | CPU | M13-CCF0000 | en | 18-50 14
VIPA System MICRO
Basics and mounting
Mounting > Mounting CPU
Proceeding
You can screw the CPU to the back wall by means of screws via the locking levers. This
happens with the following proceeding:
Dimensions in mm
1. The CPU has a locking lever on the upper and lower side. Pull these levers outwards as shown in the figure, until these engage 2x audible.
By this openings on the locking levers get visible.
ð
2.4.1.2
Proceeding
Mounting with mounting rail
2. Use the appropriate screws to fix your CPU to your back wall. Consider the installa-
tion clearances for the CPU.
The CPU is now mounted and can be wired.
ð
Dimensions in mm
1. Mount the mounting rail. Please consider that a clearance from the middle of the
mounting rail of at least 44mm respectively 55mm above and below exists.
HB400 | CPU | M13-CCF0000 | en | 18-50 15
Basics and mounting
Mounting > Mounting CPU
VIPA System MICRO
2. The CPU has a locking lever on the upper and lower side. Pull these levers outwards as shown in the figure, until these engage audible.
CAUTION!
It is not allowed to mount the module sideways on the mounting rail,
as otherwise the module may be damaged.
3. Plug the CPU from the top onto the mounting rail and turn the CPU downward until
it rests on the mounting rail.
4. Move the CPU on the mounting rail at its position.
5. T
o fix the CPU at the mounting rail, move the locking levers back to the initial posi-
tion.
The CPU is now mounted and can be wired.
ð
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VIPA System MICRO
2.4.2 Mounting the extension module
Proceeding
ou have the possibility to extend the interfaces of the CPU by plugging an extension
Y
module. For this the extension module is plugged at the left side of the CPU. The mountings happens with the following proceeding:
1. Remove the bus cover with a screwdriver on the left side of the CPU.
2. The extension module has a locking lever on the upper and lower side. Pull these
levers outwards as shown in the figure, until these engage audible.
Basics and mounting
Mounting > Mounting the extension module
CAUTION!
It is not allowed to mount the module sideways on the mounting rail,
as otherwise the module may be damaged.
3. T
4. Attach the extension module to the CPU by sliding the extension module on the
5. To fix the extension module at the mounting rail, move the locking levers back to the
o mount plug the extension module from the top onto the mounting rail and turn
the extension module downward until it rests on the mounting rail.
mounting rail to the right until the interface connector slightly locks into the CPU.
initial position.
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Basics and mounting
Mounting > Mounting periphery module
2.4.3 Mounting periphery module
Proceeding
ou have the possibility to extend the periphery area of the CPU by plugging up to 8
Y
periphery modules. For this the periphery modules are plugged at the right side of the
CPU. The mountings happens with the following proceeding:
1. Remove the bus cover with a screwdriver on the right side of the CPU.
2. Each periphery module has a locking lever on its upper and lower side. Pull these
levers outwards as shown in the figure, until these engage audible.
VIPA System MICRO
CAUTION!
It is not allowed to mount the module sideways on the mounting rail,
as otherwise the module may be damaged.
3. T
4. Attach the periphery module to the CPU by sliding the periphery module on the
5. T
6. Proceed in this way with additional periphery modules.
o mount plug the periphery module from the top onto the mounting rail and turn the
periphery module downward until it rests on the mounting rail.
mounting rail to the left until the interface connector slightly locks into the CPU.
o fix the periphery module at the mounting rail, move the locking levers back to the
initial position.
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VIPA System MICRO
2.5 Wiring
2.5.1 Wiring CPU
CPU connector
Basics and mounting
Wiring > Wiring CPU
CAUTION!
Consider temperature for external cables!
Cables may experience temperature increase due to system heat dissipation. Thus the cabling specification must be chosen 5°C above ambient
temperature!
CAUTION!
Separate insulation areas!
The system is specified for SEL
V/PELV environment. Devices, which are
attached to the system must meet theses specifications. Installation and
cable routing other than SELV/PELV specification must be separated
from the system’s equipment!
For wiring the CPU has removable connectors. With the wiring of the connectors a "pushin" spring-clip technique is used. This allows a quick and easy connection of your signal
and supply lines. The clamping of
f takes place by means of a screwdriver.
Data
Wiring procedure
Insert wire
U
max
I
max
Cross section
30V DC
10A
0.2 ... 1.5mm2 (A
WG 24 ... 16)
Stripping length 10mm
Use for wiring rigid wires respectively use wire sleeves. When using stranded wires you
have to press the release button with a screwdriver during the wiring.
1 Labeling on the casing
2 Status LED
3 Release area
4 Connection hole for wire
5 Pin 1 of the connector is labelled by a white line
The wiring happens without a tool.
Determine according to the casing labelling the connection position and insert
through the round connection hole of the according contact your prepared wire until
it stops, so that it is fixed.
By pushing the contact spring opens, thus ensuring the necessary contact pres-
ð
sure.
HB400 | CPU | M13-CCF0000 | en | 18-50 19
Basics and mounting
Wiring > Wiring CPU
VIPA System MICRO
Remove wire
Standard wiring
The wire is to be removed by means of a screwdriver with 2.5mm blade width.
1. Press with your screwdriver vertically at the release button.
The contact spring releases the wire.
ð
2. Pull the wire from the round hole.
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VIPA System MICRO
Basics and mounting
Wiring > Wiring CPU
Fusing
Remove connector
(1) X2: 4L+: DC 24V power section supply for integrated outputs
X1: 3L+: DC 24V power section supply for integrated inputs
(2) X6: 1L+ DC 24V for electronic power supply
The electronic power section supply is internally protected against higher
voltage by fuse. The fuse is located inside the CPU and can not be
changed by the user
CAUTION!
– The power section supply of the internal DOs is to be externally pro-
tected with a 8A fuse (fast) respectively by a line circuit breaker 8A
characteristics Z.
By means of a screwdriver there is the possibility to remove the connectors e.g. for
module exchange with a fix wiring. For this each connector has indentations for unlocking
at the top. Unlocking takes place by the following proceeding:
1. Remove connector:
Insert your screwdriver from above into one of the indentations.
.
HB400 | CPU | M13-CCF0000 | en | 18-50 21
Basics and mounting
Wiring > Wiring CPU
2. Push the screwdriver backwards:
The connector is unlocked and can be removed.
ð
CAUTION!
ia wrong operation such as pressing the screwdriver down-
V
ward, the release lever may be damaged.
3. Plug connector:
The connector is plugged by plugging it directly into the release lever
VIPA System MICRO
.
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VIPA System MICRO
2.5.2 Wiring periphery module
Periphery module connector
Data
Wiring procedure
For wiring the periphery module has removable connectors. With the wiring of the connectors a "push-in" spring-clip technique is used. This allows a quick and easy connection
of your signal and supply lines. The clamping of
U
max
I
max
Cross section
Stripping length 10mm
Use for wiring rigid wires respectively use wire sleeves. When using stranded wires you
have to press the release button with a screwdriver during the wiring.
1 Labeling on the casing
2 Status LED
3 Release area
4 Connection hole for wire
5 Pin 1 of the connector is labelled by a white line
240V AC / 30V DC
10A
0.2 ... 1.5mm2 (A
WG 24 ... 16)
Basics and mounting
Wiring > Wiring periphery module
f takes place by means of a screwdriver.
Insert wire
Remove wire
The wiring happens without a tool.
Determine according to the casing labelling the connection position and insert
through the round connection hole of the according contact your prepared wire until
it stops, so that it is fixed.
By pushing the contact spring opens, thus ensuring the necessary contact pres-
ð
sure.
The wire is to be removed by means of a screwdriver with 2.5mm blade width.
1. Press with your screwdriver vertically at the release button.
The contact spring releases the wire.
ð
2. Pull the wire from the round hole.
Fusing
CAUTION!
– The power section supply of the output modules DO16 is to be exter-
nally protected with a 10A fuse (fast) respectively by a line circuit
breaker 10A characteristics Z.
The power section supply of the output part of the DIO8 is to be
–
externally protected with a 5A fuse (fast) respectively by a line circuit
breaker 5A characteristics Z.
HB400 | CPU | M13-CCF0000 | en | 18-50 23
Basics and mounting
Wiring > Wiring periphery module
VIPA System MICRO
Remove connector
By means of a screwdriver there is the possibility to remove the connectors e.g. for
module exchange with a fix wiring. For this each connector has indentations for unlocking
at the top. Unlocking takes place by the following proceeding:
1. Remove connector:
Insert your screwdriver from above into one of the indentations.
2. Push the screwdriver backwards:
The connector is unlocked and can be removed.
ð
CAUTION!
V
ia wrong operation such as pressing the screwdriver down-
ward, the release lever may be damaged.
3. Plug connector:
The connector is plugged by plugging it directly into the release lever
.
HB400 | CPU | M13-CCF0000 | en | 18-50 24
VIPA System MICRO
2.6 Demounting
Basics and mounting
Demounting > Demounting CPU
2.6.1
Remove connector
Demounting CPU
By means of a screwdriver there is the possibility to remove the connectors e.g. for
module exchange with a fix wiring. For this each connector has indentations for unlocking
at the top. Unlocking takes place by the following proceeding:
1. Power-of
2. Remove connector:
Insert your screwdriver from above into one of the indentations.
3. Push the screwdriver backwards:
ð
f your system.
The connector is unlocked and can be removed.
CAUTION!
Via wrong operation such as pressing the screwdriver downward, the connector may be damaged!
CPU replacement (standalone)
4. In this way
If more modules are connected to the CPU
page 27. If no other modules are connected to the CPU, the CPU is replaced according
to the following proceeding:
1. Use a screwdriver to pull the locking levers of the CPU outwards until these engage
audible.
2. Remove the CPU with a rotation upwards from the mounting rail.
, remove all plugged connectors on the CPU.
Ä
‘Option: CPU replacement in a system’
HB400 | CPU | M13-CCF0000 | en | 18-50 25
Basics and mounting
Demounting > Demounting CPU
VIPA System MICRO
3. Pull the locking levers of the CPU outwards until these engage audible.
CAUTION!
It is not allowed to mount the module sideways on the mounting rail,
as otherwise the module may be damaged!
4. Plug the CPU from the top onto the mounting rail and turn the CPU downward until
it rests on the mounting rail.
5. Move the CPU on the mounting rail at its position.
6. T
7. Remove the connectors, which are not necessary at the CPU.
o fix the CPU at the mounting rail, move the locking levers back to the initial posi-
tion.
HB400 | CPU | M13-CCF0000 | en | 18-50 26
VIPA System MICRO
8. Plug again the wired connectors.
Now you can bring your system back into operation.
ð
Basics and mounting
Demounting > Demounting CPU
Option: CPU replacement
in a system
In the following the replacement of a CPU in a system is shown:
1. If there is an extension module connected to the CPU, you have to remove it from
the CPU. For this use a screwdriver to pull the locking levers of the extension
module and CPU outwards until these engage audible.
2. Disconnect all the modules, which are connected to the CPU by moving the CPU
along with the extension module on the mounting rail.
3. Remove the CPU with a rotation upwards from the mounting rail.
4. Pull the locking levers of the CPU outwards until these engage audible.
CAUTION!
It is not allowed to mount the module sideways on the mounting rail,
as otherwise the module may be damaged!
5. For mounting pull the locking levers of the CPU outwards until these engage
audible. Plug the CPU from the top onto the mounting rail and turn the CPU downward until it rests on the mounting rail.
HB400 | CPU | M13-CCF0000 | en | 18-50 27
Basics and mounting
Demounting > Demounting CPU
VIPA System MICRO
6. Rebind your modules by moving the CPU along with the extension module on the
mounting rail.
7. T
8. Remove the connectors, which are not necessary at the CPU.
9. Plug again the wired connectors.
o fix the CPU at the mounting rail, move the locking levers back to the initial posi-
tion.
Now you can bring your system back into operation.
ð
HB400 | CPU | M13-CCF0000 | en | 18-50 28
VIPA System MICRO
2.6.2 Demounting the extension module
Proceeding
1. Power-of
2. Remove the corresponding bus connectors.
3. Use a screwdriver to pull the locking levers of the extension module outwards until
these engage audible.
4. Remove the extension module from the CPU by sliding it on the mounting rail.
5. Remove the extension module with a rotation upwards from the mounting rail.
f your system.
Basics and mounting
Demounting > Demounting the extension module
6. Pull the locking levers of the extension module outwards until these engage
audible.
CAUTION!
It is not allowed to mount the module sideways on the mounting rail,
as otherwise the module may be damaged!
7. Plug the extension module from the top onto the mounting rail and turn the extension module downward until it rests on the mounting rail.
8. Reattach the extension module to the CPU by sliding the extension module on the
mounting rail to the right until the interface connector slightly locks into the CPU.
9. Move the locking levers back to the initial position.
10. Plug the corresponding bus connectors.
Now you can bring your system back into operation.
ð
HB400 | CPU | M13-CCF0000 | en | 18-50 29
Basics and mounting
Demounting > Demounting periphery module
2.6.3 Demounting periphery module
Remove connector
By means of a screwdriver there is the possibility to remove the connectors e.g. for
module exchange with a fix wiring. For this each connector has indentations for unlocking
at the top. Unlocking takes place by the following proceeding:
1. Power-of
2. Remove connector:
Insert your screwdriver from above into one of the indentations.
VIPA System MICRO
f your system.
CAUTION!
Make sure that the working contacts from the relay module are disconnected from the power supply!
Replace the periphery
module
3. Push the screwdriver backwards:
The connector is unlocked and can be removed.
ð
CAUTION!
ia wrong operation such as pressing the screwdriver down-
V
ward, the connector may be damaged!
4. In this way
1. Remove the modules that are connected to the module to be replaced by pulling
their release levers outwards until these engage audible ...
2. ... and move the modules accordingly
, remove all plugged connectors on the periphery module.
.
HB400 | CPU | M13-CCF0000 | en | 18-50 30
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