YASKAWA VIPA System 300S+ User Manual
CPU | 317-4PN23 | Manual
HB140 | CPU | 317-4PN23 | en | 18-01
VIPA System 300S
+
SPEED7 CPU 317PN
www.vipa.com/en/service-support/manuals
317-4PN23_000_CPU 317PN,2,EN - © 2018
VIPA GmbH
Ohmstr. 4
91074 Herzogenaurach
Telephone: 09132-744-0
Fax: 09132-744-1864
Email: info@vipa.com
Internet: www.vipa.com
Table of contents
1 General.................................................................................................................... 6
1.1 Copyright © VIPA GmbH ................................................................................. 6
1.2 About this manual............................................................................................. 7
1.3 Safety information............................................................................................. 8
2 Basics...................................................................................................................... 9
2.1 Safety information for users.............................................................................. 9
2.2 Operating structure of a CPU......................................................................... 10
2.2.1 General........................................................................................................ 10
2.2.2 Applications ................................................................................................ 10
2.2.3 Operands..................................................................................................... 10
2.3 CPU 317-4PN23............................................................................................. 12
2.4 General data................................................................................................... 14
3 Assembly and installation guidelines................................................................ 16
3.1 Overview......................................................................................................... 16
3.2 Installation dimensions................................................................................... 17
3.3 Assembly SPEED-Bus................................................................................... 18
3.4 Assembly standard bus.................................................................................. 21
3.5 Cabling........................................................................................................... 24
3.6 Installation guidelines..................................................................................... 25
4 Hardware description........................................................................................... 27
4.1 Properties....................................................................................................... 27
4.2 Structure......................................................................................................... 28
4.2.1 General........................................................................................................ 28
4.2.2 Interfaces..................................................................................................... 28
4.2.3 Memory management.................................................................................. 30
4.2.4 Slot for storage media................................................................................. 30
4.2.5 Battery backup for clock and RAM.............................................................. 30
4.2.6 Operating mode switch................................................................................ 31
4.2.7 LEDs............................................................................................................ 32
4.3 Technical data................................................................................................. 35
5 Deployment CPU 317-4PN23............................................................................... 43
5.1 Assembly........................................................................................................ 43
5.2 Start-up behavior............................................................................................ 43
5.3 Addressing...................................................................................................... 44
5.4 Hardware configuration - CPU........................................................................ 47
5.5 Hardware configuration - I/O modules............................................................ 48
5.6 Hardware configuration - Ethernet PG/OP channel........................................ 49
5.7 Hardware configuration - Communication...................................................... 50
5.8 Hardware configuration - SPEED-Bus............................................................ 50
5.8.1 Preconditions............................................................................................... 50
5.8.2 Proceeding.................................................................................................. 51
5.9 Setting standard CPU parameters.................................................................. 52
5.9.1 Parameterization via Siemens CPU............................................................ 52
5.9.2 Parameters CPU......................................................................................... 52
5.9.3 Parameters for DP....................................................................................... 55
5.9.4 Parameters for MPI/DP .............................................................................. 56
5.10 Setting VIPA specific CPU parameters......................................................... 56
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5.10.1 Proceeding................................................................................................ 56
5.10.2 VIPA specific parameters.......................................................................... 57
5.11 Project transfer............................................................................................. 61
5.11.1 Transfer via MPI/PROFIBUS..................................................................... 61
5.11.2 Transfer via Ethernet................................................................................. 62
5.11.3 Transfer via memory card.......................................................................... 63
5.12 Accessing the web server............................................................................. 64
5.13 Operating modes.......................................................................................... 70
5.13.1 Overview.................................................................................................... 70
5.13.2 Function security....................................................................................... 72
5.14 Overall reset................................................................................................. 73
5.15 Firmware update........................................................................................... 74
5.16 Reset to factory settings............................................................................... 76
5.17 Deployment storage media - MMC, MCC..................................................... 77
5.18 Extended know-how protection.................................................................... 79
5.19 CMD - auto commands................................................................................. 80
5.20 Diagnostic entries......................................................................................... 81
5.21 Control and monitoring of variables with test functions................................ 82
6 Deployment PtP communication........................................................................ 84
6.1 Fast introduction............................................................................................. 85
6.2 Principle of the data transfer........................................................................... 86
6.3 Deployment of RS485 interface for PtP.......................................................... 86
6.4 Parametrization.............................................................................................. 89
6.4.1 FC/SFC 216 - SER_CFG - Parametrization PtP......................................... 89
6.5 Communication............................................................................................... 89
6.5.1 FC/SFC 217 - SER_SND - Send to PtP...................................................... 89
6.5.2 FC/SFC 218 - SER_RCV - Receive from PtP............................................. 90
6.6 Protocols and procedures .............................................................................. 90
6.7 Modbus - Function codes .............................................................................. 94
6.8 Modbus - Example communication................................................................ 98
7 Deployment PROFIBUS communication.......................................................... 100
7.1 Overview....................................................................................................... 100
7.2 Fast introduction........................................................................................... 101
7.3 Hardware configuration - CPU...................................................................... 102
7.4 Deployment as PROFIBUS DP master........................................................ 103
7.5 Deployment as PROFIBUS DP slave........................................................... 104
7.6 PROFIBUS installation guidelines................................................................ 106
7.7 Commissioning and Start-up behavior......................................................... 109
8 Deployment Ethernet communication - productive........................................ 110
8.1 Basics - Industrial Ethernet in automation.................................................... 110
8.2 Basics - ISO/OSI reference model................................................................ 111
8.3 Basics - Terms.............................................................................................. 113
8.4 Basics - Protocols......................................................................................... 114
8.5 Basics - IP address and subnet.................................................................... 115
8.6 Fast introduction........................................................................................... 117
8.7 Commissioning and initialization................................................................... 117
8.8 Hardware configuration - CPU via Ethernet.................................................. 118
8.9 Configure Siemens S7 connections............................................................. 120
8.10 Configure Open Communication................................................................ 126
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8.11 NCM diagnostic - Help for error diagnostic................................................. 127
9 Deployment Ethernet communication - PROFINET........................................ 130
9.1 Basics PROFINET........................................................................................ 130
9.2 PROFINET installation guidelines................................................................ 132
9.3 PROFINET system limits.............................................................................. 133
9.4 Fast introduction PROFINET........................................................................ 135
9.5 Commissioning and Initialization.................................................................. 136
9.6 Hardware configuration - CPU...................................................................... 137
9.7 Parameters - PROFINET IO controller......................................................... 138
9.7.1 Precondition............................................................................................... 138
9.7.2 PN-IO......................................................................................................... 138
9.7.3 Port 1......................................................................................................... 139
9.8 Configuration PROFINET IO device............................................................. 140
9.9 Configuration PROFINET-I-Device / Shared-Device.................................... 141
9.10 Topology - Configuration............................................................................. 142
9.11 Device replacement without exchangeable medium/PG............................ 142
9.11.1 Replace device........................................................................................ 144
9.12 Commissioning and start-up behaviour...................................................... 145
9.13 PROFINET diagnostics.............................................................................. 146
9.13.1 Overview.................................................................................................. 146
9.13.2 Diagnostics with the configuration and engineering tool......................... 146
9.13.3 Diagnostics during runtime in the user program...................................... 146
9.13.4 Diagnostics via OB start information....................................................... 148
9.13.5 Diagnostics via status LEDs.................................................................... 149
10 Configuration with TIA Portal............................................................................ 150
10.1 TIA Portal - Work environment .................................................................. 150
10.1.1 General.................................................................................................... 150
10.1.2 Work environment of the TIA Portal........................................................ 150
10.2 TIA Portal - Hardware configuration - CPU ............................................... 152
10.3 TIA Portal - Hardware configuration - I/O modules..................................... 153
10.4 TIA Portal - Hardware configuration - Ethernet PG/OP channel................ 154
10.5 TIA Portal - Hardware configuration - PG/OP via PROFINET.................... 156
10.6 TIA Portal - Setting VIPA specific CPU parameters................................... 158
10.7 TIA Portal - VIPA-Include library................................................................. 162
10.8 TIA Portal - Project transfer........................................................................ 163
Appendix............................................................................................................. 165
A System specific event IDs............................................................................... 167
B Integrated blocks............................................................................................. 215
C SSL partial list................................................................................................. 219
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1 General
1.1 Copyright © VIPA GmbH
This document contains proprietary information of VIPA and is not to be disclosed or used
except in accordance with applicable agreements.
This material is protected by the copyright laws. It may not be reproduced, distributed, or
altered in any fashion by any entity (either internal or external to VIPA), except in accordance with applicable agreements, contracts or licensing, without the express written consent of VIPA and the business management owner of the material.
For permission to reproduce or distribute, please contact: VIPA, Gesellschaft für Visualisierung und Prozessautomatisierung mbH Ohmstraße 4, D-91074 Herzogenaurach, Germany
Tel.: +49 9132 744 -0
Fax.: +49 9132 744-1864
EMail: info@vipa.de
http://www.vipa.com
Every effort has been made to ensure that the information contained in
this document was complete and accurate at the time of publishing. Nevertheless, the authors retain the right to modify the information.
This customer document describes all the hardware units and functions
known at the present time. Descriptions may be included for units which
are not present at the customer site. The exact scope of delivery is
described in the respective purchase contract.
Hereby, VIPA GmbH declares that the products and systems are in compliance with the
essential requirements and other relevant provisions. Conformity is indicated by the CE
marking affixed to the product.
For more information regarding CE marking and Declaration of Conformity (DoC), please
contact your local VIPA customer service organization.
VIPA, SLIO, System 100V, System 200V, System 300V, System 300S, System 400V,
System 500S and Commander Compact are registered trademarks of VIPA Gesellschaft
für Visualisierung und Prozessautomatisierung mbH.
SPEED7 is a registered trademark of profichip GmbH.
SIMATIC, STEP, SINEC, TIA Portal, S7-300 and S7-400 are registered trademarks of
Siemens AG.
Microsoft and Windows are registered trademarks of Microsoft Inc., USA.
Portable Document Format (PDF) and Postscript are registered trademarks of Adobe
Systems, Inc.
All other trademarks, logos and service or product marks specified herein are owned by
their respective companies.
Contact your local VIPA Customer Service Organization representative if you wish to
report errors or questions regarding the contents of this document. If you are unable to
locate a customer service centre, contact VIPA as follows:
All Rights Reserved
CE Conformity Declaration
Conformity Information
Trademarks
Information product support
VIPA System 300S
+
General
Copyright © VIPA GmbH
HB140 | CPU | 317-4PN23 | en | 18-01 6
VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany
Telefax: +49 9132 744-1204
EMail: documentation@vipa.de
Contact your local VIPA Customer Service Organization representative if you encounter
problems with the product or have questions regarding the product. If you are unable to
locate a customer service centre, contact VIPA as follows:
VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany
Tel.: +49 9132 744-1150 (Hotline)
EMail: support@vipa.de
1.2 About this manual
This manual describes the SPEED7 CPU 317-4PN23 of the System 300S from VIPA. It
contains a description of the construction, project implementation and usage.
Product Order no. as of state:
CPU-HW CPU-FW DPM-FW PN-IO controller-FW
CPU 317PN 317-4PN23 01 V3.7.3 V3.3.5 V1.1.20
The manual is targeted at users who have a background in automation technology.
The manual consists of chapters. Every chapter provides a self-contained description of a
specific topic.
The following guides are available in the manual:
n An overall table of contents at the beginning of the manual
n References with page numbers
The manual is available in:
n printed form, on paper
n in electronic form as PDF-file (Adobe Acrobat Reader)
Important passages in the text are highlighted by following icons and headings:
DANGER!
Immediate or likely danger. Personal injury is possible.
CAUTION!
Damages to property is likely if these warnings are not heeded.
Technical support
Objective and contents
Target audience
Structure of the manual
Guide to the document
Availability
Icons Headings
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General
About this manual
HB140 | CPU | 317-4PN23 | en | 18-01 7
Supplementary information and useful tips.
1.3 Safety information
The system is constructed and produced for:
n communication and process control
n general control and automation tasks
n industrial applications
n operation within the environmental conditions specified in the technical data
n installation into a cubicle
DANGER!
This device is not certified for applications in
– in explosive environments (EX-zone)
The manual must be available to all personnel in the
n project design department
n installation department
n commissioning
n operation
CAUTION!
The following conditions must be met before using or commis-
sioning the components described in this manual:
– Hardware modifications to the process control system should only be
carried out when the system has been disconnected from power!
– Installation and hardware modifications only by properly trained per-
sonnel.
– The national rules and regulations of the respective country must be
satisfied (installation, safety, EMC ...)
National rules and regulations apply to the disposal of the unit!
Applications conforming
with specifications
Documentation
Disposal
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General
Safety information
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2 Basics
2.1 Safety information for users
VIPA modules make use of highly integrated components in MOS-Technology. These
components are extremely sensitive to over-voltages that can occur during electrostatic
discharges. The following symbol is attached to modules that can be destroyed by electrostatic discharges.
The Symbol is located on the module, the module rack or on packing material and it indicates the presence of electrostatic sensitive equipment. It is possible that electrostatic
sensitive equipment is destroyed by energies and voltages that are far less than the
human threshold of perception. These voltages can occur where persons do not discharge themselves before handling electrostatic sensitive modules and they can damage
components thereby, causing the module to become inoperable or unusable. Modules
that have been damaged by electrostatic discharges can fail after a temperature change,
mechanical shock or changes in the electrical load. Only the consequent implementation
of protection devices and meticulous attention to the applicable rules and regulations for
handling the respective equipment can prevent failures of electrostatic sensitive modules.
Modules must be shipped in the original packing material.
When you are conducting measurements on electrostatic sensitive modules you should
take the following precautions:
n Floating instruments must be discharged before use.
n Instruments must be grounded.
Modifying electrostatic sensitive modules you should only use soldering irons with
grounded tips.
CAUTION!
Personnel and instruments should be grounded when working on electrostatic sensitive modules.
Handling of electrostatic
sensitive modules
Shipping of modules
Measurements and alterations on electrostatic sensitive modules
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Basics
Safety information for users
HB140 | CPU | 317-4PN23 | en | 18-01 9
2.2 Operating structure of a CPU
2.2.1 General
The CPU contains a standard processor with internal program memory. In combination
with the integrated SPEED7 technology the unit provides a powerful solution for process
automation applications within the System 300S family. A CPU supports the following
modes of operation:
n cyclic operation
n timer processing
n alarm controlled operation
n priority based processing
Cyclicprocessing represents the major portion of all the processes that are executed in
the CPU. Identical sequences of operations are repeated in a never-ending cycle.
Where a process requires control signals at constant intervals you can initiate certain
operations based upon a timer, e.g. not critical monitoring functions at one-second intervals.
If a process signal requires a quick response you would allocate this signal to an alarm
controlled procedure. An alarm can activate a procedure in your program.
The above processes are handled by the CPU in accordance with their priority. Since a
timer or an alarm event requires a quick reaction, the CPU will interrupt the cyclic processing when these high-priority events occur to react to the event. Cyclic processing will
resume, once the reaction has been processed. This means that cyclic processing has
the lowest priority.
2.2.2 Applications
The program that is present in every CPU is divided as follows:
n System routine
n User application
The system routine organizes all those functions and procedures of the CPU that are not
related to a specific control application.
This consists of all the functions that are required for the processing of a specific control
application. The operating modules provide the interfaces to the system routines.
2.2.3 Operands
The following series of operands is available for programming the CPU:
n Process image and periphery
n Bit memory
n Timers and counters
n Data blocks
Cyclic processing
Timer processing
Alarm controlled processing
Priority based processing
System routine
User application
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Basics
Operating structure of a CPU > Operands
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The user application can quickly access the process image of the inputs and outputs PIO/
PII. You may manipulate the following types of data:
n individual Bits
n Bytes
n Words
n Double words
You may also gain direct access to peripheral modules via the bus from user application.
The following types of data are available:
n Bytes
n Words
n Blocks
The bit memory is an area of memory that is accessible by means of certain operations.
Bit memory is intended to store frequently used working data.
You may access the following types of data:
n individual Bits
n Bytes
n Words
n Double words
In your program you may load cells of the timer with a value between 10ms and 9990s.
As soon as the user application executes a start-operation, the value of this timer is
decremented by the interval that you have specified until it reaches zero.
You may load counter cells with an initial value (max. 999) and increment or decrement
these when required.
A data block contains constants or variables in the form of bytes, words or double words.
You may always access the current data block by means of operands.
You may access the following types of data:
n individual Bits
n Bytes
n Words
n Double words
Process image and
periphery
Bit Memory
Timers and counters
Data Blocks
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Basics
Operating structure of a CPU > Operands
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2.3 CPU 317-4PN23
The CPU 317-4PN23 bases upon the SPEED7 technology. This supports the CPU at programming and communication by means of co-processors that causes a power improvement for highest needs.
n The CPU is programmed in STEPÒ7 from Siemens. For this you may use the
SIMATIC Manager or TIA Portal from Siemens. Here the instruction set of the S7-400
from Siemens is used.
n Modules and CPUs of the System 300S from VIPA and Siemens may be used at the
bus as a mixed configuration.
n The user application is stored in the battery buffered RAM or on an additionally plug-
gable storage module.
n The CPU is configured as CPU 317-2 PN/DP (6ES7 317-2EK14-0AB0 V3.2) from
Siemens.
Please always use the CPU 317-2 PN/DP (6ES7 317-2EK14-0AB0 V3.2)
from Siemens of the hardware catalog to configure this CPU from VIPA.
For the project engineering, a thorough knowledge of the Siemens
SIMATIC Manager and the hardware configurator from Siemens is
required!
Overview
Access
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Basics
CPU 317-4PN23
HB140 | CPU | 317-4PN23 | en | 18-01 12
The CPU has an integrated memory. Information about the capacity of the memory may
be found at the front of the CPU. The memory is divided into the following parts:
n Load memory 8Mbyte
n Code memory (50% of the work memory)
n Data memory (50% of the work memory)
n Work memory 4Mbyte
– There is the possibility to extend the work memory to its maximum printed
capacity 8Mbyte by means of a memory extension card.
n The SPEED-Bus is a 32bit parallel bus developed from VIPA.
n Via the SPEED-Bus you may connect up to 10 SPEED-Bus modules to your CPU.
n In opposite to the "standard" backplane bus where the modules are plugged-in at the
right side of the CPU by means of single bus connectors, the modules at the SPEEDBus are plugged-in at the left side of the CPU via a special SPEED-Bus rail.
n VIPA delivers profile rails with integrated SPEED-Bus for 2, 6, or 10 SPEED-Bus
peripheral modules with different lengths.
n Each SPEED-Bus rail has a slot for an external power supply. This allows you to raise
the maximum current at the back plane bus. Only the "SLOT1 DCDC" allows you to
plug-in either a SPEED-Bus module or an additional power supply (307-1FB70).
The CPU has a PROFIBUS/PtP interface with a fix pinout. After an overall reset the interface is deactivated. By appropriate configuration, the following functions for this interface
may be enabled:
n PROFIBUS DP master operation: Configuration via PROFIBUS sub module with
‘Operation mode’ master in the hardware configuration.
n PROFIBUS DP slave operation: Configuration via PROFIBUS sub module with
‘Operation mode’ slave in the hardware configuration.
n PtP functionality: Configuration as virtual PROFIBUS master system by including the
VIPA SPEEDBUS.GSD.
The CPU has an integrated PROFINET IO controller which is to be configured via the
PROFINET sub module in the hardware configurator from Siemens.
The CPU has an Ethernet interface for PG/OP communication. After assigning IP
address parameters with your configuration tool, via the "PLC" functions you may directly
access the Ethernet PG/OP channel and program res. remote control your CPU. You may
also access the CPU with a visualization software via these connections.
n Wiring by means of spring pressure connections (CageClamps) at the front connector
n Core cross-section 0.08...2.5mm
2
n Total isolation of the wiring at module change
n Potential separation of all modules to the backplane bus
Dimensions of the basic enclosure:
n 2tier width: (WxHxD) in mm: 80x125x120
The CPU comes with an integrated power supply. The power supply is to be supplied with
DC 24V. By means of the supply voltage, the internal electronic is supplied as well as the
connected modules via backplane bus. The power supply is protected against inverse
polarity and overcurrent.
Memory
SPEED-Bus
Integrated PROFIBUS DP
master/slave respectively
PtP functionality
Integrated PROFINET IO
controller
Integrated Ethernet PG/OP
channel
Operation Security
Dimensions/ Weight
Integrated power supply
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Basics
CPU 317-4PN23
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2.4 General data
Conformity and approval
Conformity
CE 2014/35/EU Low-voltage directive
2014/30/EU EMC directive
Approval
UL Refer to Technical data
others
RoHS 2011/65/EU Restriction of the use of certain hazardous substances in
electrical and electronic equipment
Protection of persons and device protection
Type of protection - IP20
Electrical isolation
to the field bus - electrically isolated
to the process level - electrically isolated
Insulation resistance -
Insulation voltage to reference earth
Inputs / outputs - AC / DC 50V, test voltage AC 500V
Protective measures - against short circuit
Environmental conditions to EN 61131-2
Climatic
Storage / transport EN 60068-2-14 -25…+70°C
Operation
Horizontal installation hanging EN 61131-2 0…+60°C
Horizontal installation lying EN 61131-2 0…+55°C
Vertical installation EN 61131-2 0…+50°C
Air humidity EN 60068-2-30 RH1 (without condensation, rel. humidity 10…95%)
Pollution EN 61131-2 Degree of pollution 2
Installation altitude max. - 2000m
Mechanical
Oscillation EN 60068-2-6 1g, 9Hz ... 150Hz
Shock EN 60068-2-27 15g, 11ms
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Basics
General data
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Mounting conditions
Mounting place - In the control cabinet
Mounting position - Horizontal and vertical
EMC Standard Comment
Emitted interference EN 61000-6-4 Class A (Industrial area)
Noise immunity
zone B
EN 61000-6-2 Industrial area
EN 61000-4-2
ESD
8kV at air discharge (degree of severity 3),
4kV at contact discharge (degree of severity 2)
EN 61000-4-3 HF field immunity (casing)
80MHz … 1000MHz, 10V/m, 80% AM (1kHz)
1.4GHz ... 2.0GHz, 3V/m, 80% AM (1kHz)
2GHz ... 2.7GHz, 1V/m, 80% AM (1kHz)
EN 61000-4-6 HF conducted
150kHz … 80MHz, 10V, 80% AM (1kHz)
EN 61000-4-4 Burst, degree of severity 3
EN 61000-4-5 Surge, degree of severity 3 *
*)
Due to the high-energetic single pulses with Surge an appropriate external protective circuit with lightning protection
elements like conductors for lightning and overvoltage is necessary.
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Basics
General data
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3 Assembly and installation guidelines
3.1 Overview
This CPU is provided with a parallel SPEED-Bus that enables the additional connection
of up to 10 modules from the SPEED-Bus periphery. While the standard peripheral
modules are plugged-in at the right side of the CPU, the SPEED-Bus peripheral modules
are connected via a SPEED-Bus bus connector at the left side of the CPU.
VIPA delivers profile rails with integrated SPEED-Bus for 2, 6 or 10 SPEED-Bus peripheral modules with different lengths.
The single modules are directly installed on a profile rail and connected via the backplane
bus coupler. Before installing the modules you have to clip the backplane bus coupler to
the module from the backside. The backplane bus couplers are included in the delivery of
the peripheral modules.
With SPEED-Bus the bus connection happens via a SPEED-Bus rail integrated in the
profile rail at the left side of the CPU. Due to the parallel SPEED-Bus not all slots must be
occupied in sequence.
At slot (SLOT 1 DCDC) you may plug either a SPEED-Bus module or an additional power
supply.
You may assemble the System 300 horizontally, vertically or lying. Please regard the
allowed environment temperatures:
1 horizontal assembly: from 0 to 60°C
2 vertical assembly: from 0 to 50°C
3 lying assembly: from 0 to 55°C
General
Serial Standard bus
Parallel SPEED-Bus
SLOT 1 for additional
power supply
Assembly possibilities
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Assembly and installation guidelines
Overview
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3.2 Installation dimensions
2tier width (WxHxD) in mm: 80 x 125 x 120Dimensions Basic enclo-
sure
Installation dimensions
VIPA System 300S
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Assembly and installation guidelines
Installation dimensions
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3.3 Assembly SPEED-Bus
For the deployment of SPEED-Bus modules, a pre-manufactured SPEED-Bus rail is
required. This is available mounted on a profile rail with 2, 6 or 10 extension slots.
Order
number
Number of modules SPEED-
Bus/Standard bus
A B C D E
391-1AF10 2/6 530 100 268 510 10
391-1AF30 6/2 530 100 105 510 10
391-1AF50 10/0 530 20 20 510 10
391-1AJ10 2/15 830 22 645 800 15
391-1AJ30 6/11 830 22 480 800 15
391-1AJ50 10/7 830 22 320 800 15
Measures in mm
Pre-manufactured SPEEDBus profile rail
Dimensions
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Assembly and installation guidelines
Assembly SPEED-Bus
HB140 | CPU | 317-4PN23 | en | 18-01 18
1. Bolt the profile rail with the background (screw size: M6), so that you still have minimum 65mm space above and 40mm below the profile rail. Please look for a lowimpedance connection between profile rail and background.
2. Connect the profile rail with the protected earth conductor. The minimum cross-section of the cable to the protected earth conductor has to be 10mm2.
1. Dismantle the according protection flaps of the SPEED-Bus slot with a screw driver
(open and pull down).
For the SPEED-Bus is a parallel bus, not every SPEED-Bus slot must be used in
series. Leave the protection flap installed at an unused SPEED-Bus slot.
2. At deployment of a DC 24V power supply, install it at the shown position at the profile rail at the left side of the SPEED-Bus and push it to the left to the isolation bolt
of the profile rail.
3. Fix the power supply by screwing.
Installation of the profile
rail
Installation SPEED-Bus
module
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Assembly and installation guidelines
Assembly SPEED-Bus
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4. To connect the SPEED-Bus modules, plug it between the triangular positioning
helps to a slot marked with "SLOT ..." and pull it down.
5. Only the "SLOT1 DCDC" allows you to plug-in either a SPEED-Bus module or an
additional power supply.
6. Fix the CPU by screwing.
1. To deploy the SPEED7-CPU exclusively at the SPEED-Bus, plug it between the tri-
angular positioning helps to the slot marked with "CPU SPEED7" and pull it down.
2. Fix the CPU by screwing.
1. If also standard modules shall be plugged, take a bus coupler and click it at the
CPU from behind like shown in the picture. Plug the CPU between the triangular
positioning helps to the slot marked with "CPU SPEED7" and pull it down.
2. Fix the CPU by screwing.
Repeat this procedure with the peripheral modules, by clicking a backplane bus
coupler, stick the module right from the modules you've already fixed, click it downwards and connect it with the backplane bus coupler of the last module and bolt it.
Installation CPU without
Standard-Bus-Modules
Installation CPU with
Standard-Bus-Modules
Installation Standard-BusModules
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Assembly and installation guidelines
Assembly SPEED-Bus
HB140 | CPU | 317-4PN23 | en | 18-01 20
CAUTION!
– The power supplies must be released before installation and repair
tasks, i.e. before handling with the power supply or with the cabling
you must disconnect current/voltage (pull plug, at fixed connection
switch off the concerning fuse)!
– Installation and modifications only by properly trained personnel!
3.4 Assembly standard bus
The single modules are directly installed on a profile rail and connected via the backplane
bus connector. Before installing the modules you have to clip the backplane bus connector to the module from the backside. The backplane bus connector is delivered
together with the peripheral modules.
Order number A B C
390-1AB60 160 140 10
390-1AE80 482 466 8.3
390-1AF30 530 500 15
390-1AJ30 830 800 15
390-9BC00* 2000 Drillings only left 15
*) Unit pack: 10 pieces
Measures in mm
General
Profile rail
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Assembly and installation guidelines
Assembly standard bus
HB140 | CPU | 317-4PN23 | en | 18-01 21
For the communication between the modules the System 300S uses a backplane bus
connector. Backplane bus connectors are included in the delivering of the peripheral
modules and are clipped at the module from the backside before installing it to the profile
rail.
Bus connector
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Assembly and installation guidelines
Assembly standard bus
HB140 | CPU | 317-4PN23 | en | 18-01 22
Please regard the allowed environment temperatures:
1 horizontal assembly: from 0 to 60°C
2 vertical assembly: from 0 to 50°C
3 lying assembly: from 0 to 55°C
1. Bolt the profile rail with the background (screw size: M6), so that you still have minimum 65mm space above and 40mm below the profile rail.
2. If the background is a grounded metal or device plate, please look for a low-impedance connection between profile rail and background.
3. Connect the profile rail with the protected earth conductor. For this purpose there is
a bolt with M6-thread.
4. The minimum cross-section of the cable to the protected earth conductor has to be
10mm2.
5. Stick the power supply to the profile rail and pull it to the left side to the grounding
bolt of the profile rail.
6. Fix the power supply by screwing.
7. Take a backplane bus connector and click it at the CPU from the backside like
shown in the picture.
8. Stick the CPU to the profile rail right from the power supply and pull it to the power
supply.
9. Click the CPU downwards and bolt it like shown.
10. Repeat this procedure with the peripheral modules, by clicking a backplane bus
connector, stick the module right from the modules you've already fixed, click it
downwards and connect it with the backplane bus connector of the last module and
bolt it.
Assembly possibilities
Approach
VIPA System 300S
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Assembly and installation guidelines
Assembly standard bus
HB140 | CPU | 317-4PN23 | en | 18-01 23
3.5 Cabling
CAUTION!
– The power supplies must be released before installation and repair
tasks, i.e. before handling with the power supply or with the cabling
you must disconnect current/voltage (pull plug, at fixed connection
switch off the concerning fuse)!
– Installation and modifications only by properly trained personnel!
For the cabling of power supply of a CPU, a green plug with CageClamp technology is
deployed. The connection clamp is realized as plug that may be clipped off carefully if it is
still cabled.
Here wires with a cross-section of 0.08mm2 to 2.5mm2 may be connected. You can use
flexible wires without end case as well as stiff wires.
1 Test point for 2mm test tip
2 Locking (orange) for screwdriver
3 Round opening for wires
The picture on the left side shows the cabling step by step from top view.
1. For cabling you push the locking vertical to the inside with a suiting screwdriver and
hold the screwdriver in this position.
2. Insert the de-isolated wire into the round opening. You may use wires with a crosssection from 0.08mm2 to 2.5mm
2
3. By removing the screwdriver the wire is connected safely with the plug connector
via a spring.
CageClamp technology
(green)
VIPA System 300S
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Assembly and installation guidelines
Cabling
HB140 | CPU | 317-4PN23 | en | 18-01 24
3.6 Installation guidelines
The installation guidelines contain information about the interference free deployment of a
PLC system. There is the description of the ways, interference may occur in your PLC,
how you can make sure the electromagnetic compatibility (EMC), and how you manage
the isolation.
Electromagnetic compatibility (EMC) means the ability of an electrical device, to function
error free in an electromagnetic environment without being interfered respectively without
interfering the environment.
The components of VIPA are developed for the deployment in industrial environments
and meets high demands on the EMC. Nevertheless you should project an EMC planning
before installing the components and take conceivable interference causes into account.
Electromagnetic interferences may interfere your control via different ways:
n Electromagnetic fields (RF coupling)
n Magnetic fields with power frequency
n Bus system
n Power supply
n Protected earth conductor
Depending on the spreading medium (lead bound or lead free) and the distance to the
interference cause, interferences to your control occur by means of different coupling
mechanisms.
There are:
n galvanic coupling
n capacitive coupling
n inductive coupling
n radiant coupling
In the most times it is enough to take care of some elementary rules to guarantee the
EMC. Please regard the following basic rules when installing your PLC.
n Take care of a correct area-wide grounding of the inactive metal parts when installing
your components.
– Install a central connection between the ground and the protected earth conductor
system.
– Connect all inactive metal extensive and impedance-low.
– Please try not to use aluminium parts. Aluminium is easily oxidizing and is there-
fore less suitable for grounding.
n When cabling, take care of the correct line routing.
– Organize your cabling in line groups (high voltage, current supply, signal and data
lines).
– Always lay your high voltage lines and signal respectively data lines in separate
channels or bundles.
– Route the signal and data lines as near as possible beside ground areas (e.g.
suspension bars, metal rails, tin cabinet).
General
What does EMC mean?
Possible interference
causes
Basic rules for EMC
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Assembly and installation guidelines
Installation guidelines
HB140 | CPU | 317-4PN23 | en | 18-01 25
n Proof the correct fixing of the lead isolation.
– Data lines must be laid isolated.
– Analog lines must be laid isolated. When transmitting signals with small ampli-
tudes the one sided laying of the isolation may be favourable.
– Lay the line isolation extensively on an isolation/protected earth conductor rail
directly after the cabinet entry and fix the isolation with cable clamps.
– Make sure that the isolation/protected earth conductor rail is connected impe-
dance-low with the cabinet.
– Use metallic or metallised plug cases for isolated data lines.
n In special use cases you should appoint special EMC actions.
– Consider to wire all inductivities with erase links.
– Please consider luminescent lamps can influence signal lines.
n Create a homogeneous reference potential and ground all electrical operating sup-
plies when possible.
– Please take care for the targeted employment of the grounding actions. The
grounding of the PLC serves for protection and functionality activity.
– Connect installation parts and cabinets with your PLC in star topology with the
isolation/protected earth conductor system. So you avoid ground loops.
– If there are potential differences between installation parts and cabinets, lay suffi-
ciently dimensioned potential compensation lines.
Electrical, magnetically and electromagnetic interference fields are weakened by means
of an isolation, one talks of absorption. Via the isolation rail, that is connected conductive
with the rack, interference currents are shunt via cable isolation to the ground. Here you
have to make sure, that the connection to the protected earth conductor is impedancelow, because otherwise the interference currents may appear as interference cause.
When isolating cables you have to regard the following:
n If possible, use only cables with isolation tangle.
n The hiding power of the isolation should be higher than 80%.
n Normally you should always lay the isolation of cables on both sides. Only by means
of the both-sided connection of the isolation you achieve high quality interference
suppression in the higher frequency area. Only as exception you may also lay the isolation one-sided. Then you only achieve the absorption of the lower frequencies. A
one-sided isolation connection may be convenient, if:
– the conduction of a potential compensating line is not possible.
– analog signals (some mV respectively µA) are transferred.
– foil isolations (static isolations) are used.
n With data lines always use metallic or metallised plugs for serial couplings. Fix the
isolation of the data line at the plug rack. Do not lay the isolation on the PIN 1 of the
plug bar!
n At stationary operation it is convenient to strip the insulated cable interruption free
and lay it on the isolation/protected earth conductor line.
n To fix the isolation tangles use cable clamps out of metal. The clamps must clasp the
isolation extensively and have well contact.
n Lay the isolation on an isolation rail directly after the entry of the cable in the cabinet.
Lead the isolation further on to your PLC and don't lay it on there again!
CAUTION!
Please regard at installation!
At potential differences between the grounding points, there may be a
compensation current via the isolation connected at both sides.
Remedy: Potential compensation line
Isolation of conductors
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Assembly and installation guidelines
Installation guidelines
HB140 | CPU | 317-4PN23 | en | 18-01 26
4 Hardware description
4.1 Properties
n SPEED7 technology and SPEED-Bus integrated
n 4Mbyte work memory integrated (2Mbyte code, 2Mbyte data)
n Work memory expandable to max. 8Mbyte (4Mbyte code, 4Mbyte data)
n 8Mbyte load memory
n X3: PROFIBUS DP/PtP interface: PROFIBUS DP master (DP-V0, DP-V1)
n X8: PROFINET IO controller: PROFINET in accordance with conformance class A
with integrated Ethernet CP
n X5: Ethernet PG/OP channel
n X2: MPI interface
n Slot for external memory cards (lockable)
n Status LEDs for operating state and diagnostics
n Real-time clock battery buffered
n I/O address range digital/analog 8191byte
n 2048 timer
n 2048 counter
n 16384 flag byte
Type Order number Description
CPU 317PN 317-4PN23 SPEED-Bus, MPI interface, card slot, real time clock, Ethernet
interface for PG/OP, PROFIBUS DP master, PROFINET IO controller
CPU 317-4PN23
Ordering data
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Hardware description
Properties
HB140 | CPU | 317-4PN23 | en | 18-01 27
4.2 Structure
4.2.1 General
1 LED status indication PROFIBUS DP master
2 Storage media slot (lockable)
3 LED status indication CPU part
4 LED status indication PROFINET IO controller
5 Operating mode switch CPU
6 X5: Ethernet PG/OP channel
7 X2: MPI interface
8 X3: PROFIBUS DP/PtP interface
9 X8: PROFINET IO controller
10 X1: Slot for DC 24V power supply
The components 6 - 10 are under the front flap!
4.2.2 Interfaces
The CPU has an integrated power supply:
n The power supply has to be provided with DC 24V. For this serves the double DC 24V
slot, that is underneath the flap.
n Via the power supply not only the internal electronic is provided with voltage, but by
means of the backplane bus also the connected modules.
n The power supply is protected against polarity inversion and overcurrent.
n The internal electronic is galvanically connected with the supply voltage.
CPU 317-4PN23
X1: Power supply
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Hardware description
Structure > Interfaces
HB140 | CPU | 317-4PN23 | en | 18-01 28
9pin SubD jack:
n The MPI interface serves for the connection between programming unit and CPU.
n By means of this the project engineering and programming happens.
n MPI serves for communication between several CPUs or between HMIs and CPU.
n Standard setting is MPI Address 2.
8pin RJ45 jack:
n The RJ45 jack serves the interface to the Ethernet PG/OP channel.
n This interface allows you to program res. remote control your CPU, to access the
internal web site or to connect a visualization.
n Configurable connections are not possible.
n For online access to the CPU via Ethernet PG/OP channel valid IP address parame-
ters have to be assigned to this.
9pin SubD jack:
The CPU has a PROFIBUS/PtP interface with a fix pinout. After an overall reset the interface is deactivated. By appropriate configuration, the following functions for this interface
may be enabled:
n PROFIBUS DP master operation
– Configuration via PROFIBUS sub module X1 (MPI/DP) with ‘Operation mode’
master in the hardware configuration.
n PROFIBUS DP slave operation
– Configuration via PROFIBUS sub module X1 (MPI/DP) with ‘Operation mode’
slave in the hardware configuration.
n PtP functionality
– Using the PtP functionality the RS485 interface is allowed to connect via serial
point-to-point connection to different source res. target systems.
– Here the following protocols are supported: ASCII, STX/ETX, 3964R, USS and
Modbus-Master (ASCII, RTU).
– The activation of the PtP functionality happens by embedding the
SPEEDBUS.GSD from VIPA in the hardware catalog. After the installation the
CPU may be configured in a PROFIBUS master system and here the interface
may be switched to PtP communication.
8pin RJ45 jack:
n PROFINET IO controller to connect PROFINET IO devices
n Ethernet PG/OP channel
n Ethernet Siemens S7 connection
n Ethernet open communication
X2: MPI interface
X5: Ethernet PG/OP
channel
X3: PROFIBUS/PtP interface with configurable
functionality
X8: PROFINET IO controller
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Hardware description
Structure > Interfaces
HB140 | CPU | 317-4PN23 | en | 18-01 29
4.2.3 Memory management
The CPU has an integrated memory. Information about the capacity of the memory may
be found at the front of the CPU. The memory is divided into the following parts:
n Load memory 8Mbyte
n Code memory (50% of the work memory)
n Data memory (50% of the work memory)
n Work memory 4Mbyte
– There is the possibility to extend the work memory to its maximum printed
capacity 8Mbyte by means of a memory extension card.
4.2.4 Slot for storage media
At this slot the following storage media can be plugged:
n SD respectively MCC (Multimedia card)
– External memory card for programs and firmware.
n MCC - Memory configuration card
– External memory card (MMC) for programs and firmware with the possibility to
unlock additional work memory.
– The additional memory can be purchased separately.
Ä
Chapter 5.17 ‘Deploy-
ment storage media - MMC, MCC’ on page 77
– To activate the corresponding card is to be installed and an Overall reset is to be
established.
Ä
Chapter 5.14 ‘Overall reset’ on page 73
4.2.5 Battery backup for clock and RAM
A rechargeable battery is installed on every CPU to safeguard the contents of the RAM
when power is removed. This battery is also used to buffer the internal clock. The
rechargeable battery is maintained by a charging circuit that receives its power from the
internal power supply and that maintain the clock and RAM for a max. period of 30 days.
– Please connect the CPU at least for 24 hours to the power supply, so
that the internal accumulator/battery is loaded accordingly.
– Please note that in case of repeated discharge cycles (charging/
buffering) can reduce the buffer time continuously. Only after a
charging time of 24 hours there is a buffer for max. 30 days.
CAUTION!
– After a power reset and with an empty battery the CPU starts with a
BAT error and executes an overall reset. The loading procedure is not
influenced by the BAT error.
– The BAT error can be deleted again, if once during power cycle the
time between switching on and off the power supply is at least 30sec.
and the battery is fully loaded. Otherwise with a short power cycle the
BAT error still exists and an overall reset is executed.
Memory
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Hardware description
Structure > Battery backup for clock and RAM
HB140 | CPU | 317-4PN23 | en | 18-01 30
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