This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed
that basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and understood by the users, and have therefore not been restated.
WARNING :Failure to follow appropriate service and safety procedures when servicing this product may result in per-
IMPORTANT :This presentation or sale of this manual to any individual or firm does not constitute authorization certifi-
The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and
service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable
and changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to
exist, please contact the distributor’s Service Division.
WARNING :Static discharges can destroy expensive components. Discharge any static electricity your body may have
IMPORTANT :Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power
sonal injury, destruction of expensive components and failure of the product to perform as specified. For
these reasons, we advise all Yamaha product owners that all service required should be performed by an
authorized Yamaha Retailer or the appointed service representative.
cation, recognition of any applicable technical capabilities, or establish a principal-agent relationship of
any form.
accumulated by grounding yourself to the ground bus in the unit (heavy gauge black wires connect to
this bus.)
to the unit.
LITHIUM BA TTERY HANDLING
This product uses a lithium battery for memory back-up.
WARNING :Lithium batteries are dangerous because they can be exploded by improper handling. Observe the following pre-
Leave lithium battery replacement to qualified service personnel.
Always replace with batteries of the same type.
When installing on the PC board by soldering, solder using the connection terminals provided on the battery cells.
Never solder directly to the cells. Perform the soldering as quickly as possible.
Never reverse the battery polarities when installing.
Do not short the batteries.
Do not attempt to recharge these batteries.
Do not disasemble the batteries.
Never heat batteries or throw them into fire.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig handtering. Udskiftning ma kun ske med batteri af samme fabrikat og type. lever det brugte
batteri tilbage til leverandren.
VARNING
Explosionsfara vid felaktigt batteribyte.
Anvand samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren.
Kassera anvant batteri enligt fabrikantens instruktion.
VAROITUS
Paristo voi rajahtaa, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiiin.
Havita kaytetty paristo valmistajan ohjeiden mukaisesti.
The following information complies with Dutch official Gazette 1995. 45; ESSENTIALS OF ORDER ON THE COLLECTION OF BATTERIES.
• Please refer to the diassembly procedure for the removal of Back-up Battery.
• Leest u voor het verwijderen van de backup batterij deze beschrijving.
cautions when handling or replacing lithium batteries.
WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (Where
applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possibly
other entities) to cause cancer and/or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHAT
SO EVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose
eyes to solder/flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling
food.
WARNING
Components having special characteristics are marked and must be replaced with parts having specification equal to those
originally installed.
2
2
SPECIFICATIONS
KEYBOARDNumber of Keys
Touch
TONE GENERATION SYSTEM
VOICENumber of Voice
PERFORMANCEMulti-Timbres
PHRASE CLIPNumber of Clip
EFFECTReverb
SCENE
SEQUENCE PLAYFormat
ARPEGGIATORNumber of Arpebbios
CardFile Type
CONTROLS
CONNECTORS & TERMINALS
DISPLAY
INCLUDED ACCESSORIES
OPTIONAL ACCESSORIES
POWER CONSUMPTION
OUTPUT IMPEDANCE
DIMENSIONS
WEIGHT
Tone Generators
Polyphony
Wave ROM
Number of Performance
Master Keyboard Mode
Number of Clip Kits
Sampling
Memory
Chorus
Insertion
Number of Sequence Chains
Functions
CS6X
CS6x
61
Initial touch, Aftertouch
AWM2, Phrase Clip, Modular Synthesis Plug-in System
Remove the thirty-five (35) screws marked [104], the
two (2) corner plates, marked [102], and the two (2)
coin screws marked [106]. The botton assemb ly can
then be removed.
Circuit Board & Unit
PS Ass'y
PLG Support Brecket
SM
[102][106][102]
PNB
Ref No.
112
62
322
122
52
22
Ref No.
92
112
62
42
PARTS NAME
Bind Head Tapping Screw-B 3.0 X 6 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
Bonding Tapping Screw-B 3.0 X 10 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 6 MFZN2BL
Remove the DM circuit board with the DM sheeld plate.
Bind Head Tapping Screw-B 3.0 X 6 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 6 MFZN2BL
PARTS NAME
Bind Head Tapping Screw-B 3.0 X 6 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 6 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
PARTS No.
EP600230
EP600190
VQ049800
EP600230
EP600230
EP600230
PARTS No.
EP600230
EP600230
EP600190
EP600190
Q'ty
5
2
9
7
8
4
Q'ty
6
5
2
11
Fig.
2
2
2
3
4
4
Fig.
2
2
2
4
2.Circuit Boards and Units
After removing the bottom assembly, remove the
circuit board and unit, following the procedure in the
below table.
Bind Head Tapping Screw-B 3.0 X 6 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 6 MFZN2BL
PARTS NAME
Bonding Tapping Screw-B 3.0 X 10 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 6 MFZN2BL
Remove the DM circuit board with the DM sheeld plate.
Bind Head Tapping Screw-B 3.0 X 10 MFZN2BL
PARTS No.
EP600230
EP600190
EP600290
EP600230
PARTS No.
VQ049800
EP600230
EP600230
Q'ty
4
4
4
6
Q'ty
9
7
11
Fig.
2
2
2
2
Fig.
2
3
4
〈
REAR VIEW
〉
Fig.2
8
DM
[122][122]
CS6X
Fig.3
PNA
3.Keyboard Assembly
3-1Remove the bottom assembly. (See Procedure 1.)
3-2Remove the four(4) screws marked [72].
The keyboard Assembly can then be remo ved.(Fig.2)
[22]
LCD Assy
Fig.4
[42][32][52]
RV
PNB
SM
9
CS6X
LSI PIN DESCRIPTION
HD64F7045F28 (XW419A00) CPU
PIN
NO.
NAMEI/OFUNCTION
1/WRHHOHH write73D15I/O
2PE14I/OLCD data 6 input / output74D14I/OData bus
3/WRHLO75D13I/O
4PA21IMLAN insert detect76D12I/O
5PE15I/OLCD data 7 input / output77VCC77-Power supply
6VSS6-Ground78D11I/OData bus
7A0O79VSS79-Ground
8A1O80D10I/O
9A2OAddress bus81D9I/O
10A3O82D8I/OData bus
11A4O83D7I/O
12VCC12-Power supply84D6I/O
13A5OAddress bus85VCC85-Power supply
14VSS14-Ground86D5I/OData bus
15A6O87VSS87-Ground
16A7O88D4I/O
17A8O89D3I/O
18A9O90D2I/OData bus
19A10O91D1I/O
20A11OAddress bus92D0I/O
21A12O93VSS93-Ground
22A13O94XTALICrystal oscillator
23A14O95MD3IMode select
24A15O96EXTALICrystal oscillator
25A16O97MD2IMode select
62D24I/OData bus134TXD1OHOST output
63VCC63-Power supply135VCC135-Power supply
64D23I/O136/IRQ1IMLAN MIDI interrupt input
65D22I/O137PE7ISmart Vprt Input
66D21I/O138PE8I/OLCD data 0 input / output
67D20I/OData bus139PE9I/OLCD data 1 input / output
68D19I/O140PE10I/OLCD data 2 input / output
69D18I/O141VSS141-Ground
70D17I/O142PE11I/OLCD data 3 input / output
71VSS71-Ground143PE12I/OLCD data 4 input / output
72D16I/OData bus144PE13I/OLCD data 5 input / output
PIN
NO.
NAMEI/OFUNCTION
VCC99/FWP99
-Power supply
A/D jack insert detect interrupt request input
MLAN reset interrupt request input
Plug in sireal interrupt request input
10
HD63B01Y0RCE0F (XM234A00) CPU (PKS)
PIN
NO.
NAMEI/OFUNCTION
1/NMIINon-maskable interrupt33M1/S8IMake contact of key receive/
2EO34M0/S7I Switch receive
3D#O35Vs sGround
4DOKey scan drive36FO
5C# O37F# O
6CL O38G O
7PULL 139G#OKey scan drive
8PULL 240AO
9LC.AE//FSIconnected to ground41A#O
10/REPEATIAuto repeat (L:on, H:off)42BO
11/KOF-REQIKey off request43CO
12SW1ISwitch 1 (L: on, H: off)44LC//AEIconnected to +5V
13SW2ISwitch 2 (L: on, H: off)45B6/S6I
14/ISIInput strobe46B5/S5I
15/OSIOutput strobe47B4/S4IBreak contact of key receive/
16SW3ISwitch 3 (L: on, H: off)48B3/S3I Switch receive
17SW4ISwitch 4 (L: on, H: off)49B2/S2I
18DOUT0O50B1/S1I
19DOUT1O51B0/S0I
20DOUT2O52SeO
21DOUT3O53SdO
22DOUT4OData output54ScOSwitch drive
23DOUT5O55SbO
24DOUT6O56SaO
25DOUT7O57ENot used
26VccPower supply (+5V)58VssGround
27SfOSwitch drive59XTALNot used
28M5/S13I60EXTALI8 MHz clock
29M4/S12I61MP0IMode program 0
30M3/S10IMake contact of key receive/62MP1IMode program 1
31M2/S9I Switch receive63/RESIInitial clear
32M1/S8I64/STBYIStanby-mode signal
PIN
NO.
NAMEI/OFUNCTION
CS6X
µ
PD63200GS (XM145A00) DAC (Digital to Analog Converter)
PIN
NO.
NAMEI/OFUNCTION
PIN
NO.
NAMEI/OFUNCTION
14/8FI4/8 Fs selection9R. REFChannel R voltage reference
2D. GNDDigital ground10L. REFChannel L voltage reference
316 BITI16 bit/18 bit selection11L. OUTO
Channel L output
4D. V DDDigital power supply12A. GNDAnalog ground
5A. GNDAnalog ground13WDCKIWord clock
6R. OUTOChannel R output14RSIIChannel R series input
7A. VDDAnalog power supply15SI/LSII
8A. VDD16CLKIClock
Series input/Channel L series nput
JG710069 (XM326B00) DDE1 (DAC Dynamic Range Enhancer)
PIN
NO.
NAMEI/OFUNCTION
1CLKIMaster clock9SH 0ON.C.
2SYWISync signal10SH 1ON.C.
3MIN 1ISignal input11LEOLatch enable for DAC
4MIN 0ISignal input
5Vss13DACO 0OOutput (DAC)
Ground
6SEL 1IMode select14DACO 1OOutput (DAC)
7SEL 0IMode select15DCLKOClock for DAC
8S UPI1 bit shift up input16ICNIInitial clear
PIN
NO.
12V
NAMEI/OFUNCTION
DD
Power supply
11
CS6X
12
TC203C760HF-002 (XS725A00)
PIN
NAMEI/OFUNCTION
NO.
1Vss(Ground)121VSS(Ground)
2CA0I122HMD0I/O
3CA1I123HMD1I/O
4CA2I124HMD2I/O
5CA3I125HMD3I/O
6CA4I126HMD4I/O
7CA5IAddress bus of internal register127HMD5I/O
8CA6I128HMD6I/OW ave memory data bus (Upper 16 bits)
9CA7I129HMD7I/O
10CA8I130HMD8I/O
11CA9I131HMD9I/O
12CA10I132HMD10I/O
13CA11I133HMD11I/O
14VSS(Ground)134HMD12I/O
15CD0I/O135HMD13I/O
16CD1I/O136HMD14I/O
17CD2I/O137HMD15I/O
18CD3I/O138VSS(Ground)
19CD4I/O139HMA0O
20CD5I/O140HMA1O
21CD6I/O141HMA2O
22CD7I/O142HMA3O
23CD8I/OData bus of internal register143HMA4O
24CD9I/O144HMA5O
25CD10I/O145HMA6O
26CD11I/O146HMA7O
27CD12I/O147HMA8O
28CD13I/O148HMA9O
29CD14I/O149HMA10O
30VDD(Powe r supply)150VDD(Power supply)
31VSS(Ground)151VSS(Ground)
32CD15I/O152HMA11O
33CSNIChip select153HMA12OWave memory address bus
34WRNIWrite strobe154HMA13O
35RDNIRead strobe155HMA14O
36VDD(Powe r supply)156HMA15O
37SYSH0O157HMA16O
38SYSH1O158HMA17O
39SYSH2O159HMA18O
40SYSH3ONSYS/LNSYS upper 16 bits output160HMA19O
41SYSH4O161HMA20O
42SYSH5O162HMA21O
43SYSH6O163HMA22O
44SYSH7O164HMA23O
45KONO0O165HMA24O
46KONO1OKey on data166VSS(Ground)
47KONO 2O167MRASNORAS when DRAM(s) is connected to wave memory
48KONO3O168MCASNOCAS when DRAM(s) is connected to wave memory
49VSS(Ground)169MOENOWave memory output enable
50SYSL0I/O170MWENOWave memory write enable
51SYSL1I/O171VSS(G r ound)
52SYSL2I/O172LMD0I/O
53SYSL3I/ONSYS input/LNSYS output lower 8 bits173LMD1I/O
54SYSL4I/O174LMD2I/O
55SYSL5I/O175LMD3I/O
56SYSL6I/O176LMD4I/O
57SYSL7I/O177LMD5I/O
58KONI0I178LMD6I/O
59KONI1IKey on data input179LMD7I/OWave memory data bus (Lower 16 bits)
60VDDI(Power supply)180VDD(Power supply)
61VSS(Ground)181VSS(Ground)
62KONI2I182LMD8I/O
63KONI3I183LMD9I/O
64DAC0ODAC output184LMD10I/O
65DAC1O185LMD11I/O
66WCLKODAC0/DAC1 word clock186LMD12I/O
67MELO0O187LMD13I/O
68MELO1O188LMD14I/O
69MELO2O189LMD15I/O
70MELO3OMEL wave data output190VSS(Ground)
71MELO4O191LMA0O
72MELO5O192LMA1O
73MELO6O193LMA2O
74MELO7O194LMA3O
75VDD(Powe r supply)195LMA4O
76ADLROADC word clock196LMA5O
77MELI0I197LMA6O
78MELI1I198LMA7O
79MELI2I199LMA8O
80MELI3IMEL wave data input200LMA9O
81MELI4I201LMA10O
82MELI5I202LMA11O
83MELI6I203VSS(Ground)
84MELI7I204LMA12O
85VSS(Ground)205LMA13OWave memory address bus (Lower data memory)
86RCASNODRAM column address strobe (RAS signal)206LMA14O
87RA8O207LMA15O
88RA7O208LMA16O
89RA6O209LMA17O
90VDD(Powe r supply)210VDD(Power supply)
91VSS(Ground)211VSS(Ground)
92RA5ODRAM address bus212LMA18O
93RA4O213LMA19O
94RA3O214LMA20O
95RA2O215LMA21O
96RA1O216LMA22O
97RA0O217LMA23O
98RRASNODRAM row addre ss strobe (RAS signal)218LMA24O
99RWENODARM write enable219VSS(Ground)
100VSS(Ground)220SYOOSync. signal for master clock
101RD7I/O221SYODOSync. signal for HCLK/QCLK
102RD6I/O222QCLKO1/12 master clock (64Fs)
103RD5I/O223HCLKO1/6 master clock (128Fs)
104RD4I/O224CK256O1/3 master clock (256Fs)
105RD3I/O225SYSCLKO1/2 master clock (384Fs)
106RD2I/O226VDD(Power supply)
107RD1I/O227SYIISync. clock
108RD0I/O228MCLKIIMaster clock input
109VSS(Ground)229MCLKOOMaster clock output
110RD17I/O230VDD(Power supply)
111RD16I/ODRAM data bus231XINICrystal osc. input
112RD15I/O232XOUTOCrystal osc. output
113RD14I/O233VSS(Ground)
114RD13I/O234ICNIInitial clear
115RD12I/O235CHIP2I2 chips mode enable
116RD11I/O236SLAVEIMaster/Slave select when 2 chips mode
117RD10I/O237TESTONI
118RD9I/O238ACINITest pin
119RD8I/O239DCTESTI
120VDD(Powe r supply)240VDD(Power supply)
SWP30B AWM Tone Generator coped with MEG) Standard Wave Processor
PIN
NAMEI/OFUNCTION
NO.
MBCG46183-129
(XV833A00) Gate Array
PIN
NO
NAMEI/OFUNCTION
PIN
NO
NAMEI/OFUNCTION
1D5I/O25TX31OTransmit Data 31
2D6I/OData Bus26RX32IReceive Data 32
3D7I/O27TX32OTransmit Data 32
4/IRQ0I/OInterrupt Request Port 028RX33IReceive Data 33
5/IRQ1I/OInterrupt Request Port 129TX33I/OTransmit Data 33
6VSS-Ground30/ICIInitial Clear
7/IRQ2I/OInterrupt Request Port 231VSS-Ground
8/IRQ3I/OInterrupt Request Port 332XIIQuartz Crystal Input
9/RDIRead Signal Input33VSS-Ground
10/WRIWrite Signal Input34XOI/OQuartz Crystal Output
11/CEIChip Enable Input35A0I
12/ASTBIAddress Strobe
(Not used: to ground)
36A1I
13TESTSIOIInput with Pull-down Resistor (50k)37A2IAddress Bus
14RX0IReceive Data 038A3I
15TX0OTransmit Data 039A4I
16RX1IReceive Data 140A5I
17TX1OTransmit Data 141CPUCLKICPU Clock
18VSS-Ground42VSS-Ground
19VDD-Power Supply43VDD-Power Supply
20RX2IReceive Data 244D0I/O
21TX2/BO2OTransmit Data 245D1I/O
22RX30IReceive Data 3046D2I/OData Bus
23TX30OTransmit Data 3047D3I/O
24RX31IReceive Data 3148D4I/O
MN101C027YB
PIN
NO.
NAMEI/OFUNCTION
1S1I33S12I
2S2I34S13ISwitch matrix data
3S3ISwitch matrix data35S14I
4S4I36TXDOMIDI transmit data
5S5I37S15I
6VREF+-Power supply (+5V, analog)38S16ISwitch matrix data
7VDD-Power supply (+5V)39S17I
8OSC2OCrystal oscillator (8MHz)40S18I
9OSC1ICrystal oscillato r (8MHz)41L16O
10VSS-Ground42L17O
11XIINot used43L18O
12XOONot used44L19O
13MMODIMemory mode select (Grounded)45L8O
14RD0ORotary encoder data46L9OLED drive data
15RXDIMIDI receive data47L10O
16D0O48L11O
17D1O49L12O
18D2OLED and switch drive data50L13O
19D3O51L14O
20D4O52L15O
21/RSTIReset53L7O
22D5O54L6O
23D6O55L5O
24D7OLED and switch drive data56L4OLED and switch drive data
25D8O57L3O
26D9O58L2O
27S6I59L1O
28S7I60L0O
29S8ISwitch matrix data61VREF-Grounded
30S9I62AD0IAnalog input
31S10I63AD1IAnalog input
32S11I64S0ISwitch matrix data
(XS711200) CPU
PIN
NO.
NAMEI/OFUNCTION
CS6X
13
CS6X
PCM1800 (XU770A00) A/D Converter
PIN
NO.
NAMEI/OFUNCTION
1VINLIAnalog input (L ch.)13LRCKI/OSampling clock input/output
2VREF1-Reference 1 decoupling cap.14BCKI/OBit clock input/output
3REFCOM-Reference decoupling common15DOUTOAudio data output
4VREF2-Reference 2 decoupling cap.16SYSCKISystem clock input
5VINRIAnalog input (R ch.)17DGND-Digital ground
6RSTBIReset input active “L”18VDD-Power supply +5V
7BYPASILCF bypass control19CINNR-Anti-aliasing filter cap. (-) R ch.
8FMT0IAudio data format 020CINPR-Anti-aliasing filter cap. (+) R ch.
9FMT1IAudio data format 121CINNL-Anti-aliasing filter cap. (-) L ch.
10MODE0IMaster/Slave mode selection 022CINPL-Anti-aliasing filter cap. (+) L ch.
11MODE1IMaster/Slave mode selection 123VCC-Analog power supply
12FSYNCI/OFrame sync. input/output24AGND-Analog ground