XILINX XC9572XV-5PC44C, XC9572XV-5CS48C, XC9572XV-4VQ44C, XC9572XV-4TQ100C, XC9572XV-4PC44C Datasheet

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DS052 (v2.2) August 27, 2001 www.xilinx.com 1 Advance Product Specification 1-800-255-7778
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
Features
72 macrocells with 1,600 usable gates
Available in small footprint packages
- 44-pin PLCC (34 user I/O pins)
- 48-pin CSP (38 user I/O pins)
- 100-pin TQFP (72-user I/O pins)
Optimized for high-perfo rmance 2.5V systems
- Low power operation
- Multi-voltage operation
Advanced system features
- In-system programmable
- Two separate output banks
- Superior pin-locking and routability with FastCONNECT II™ switch matrix
- Extra wide 54-input Function Blocks
- Up to 90 product-terms per macrocell with individual product-term allocation
- Local clock inversion with three global and one product-term clocks
- Individual output enable per output pin
- Input hysteresis on all user and boundary-scan pin inputs
- Bus-hold ciruitry on all user pin inputs
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
Fast concurrent programming
Slew rate control on individual outputs
Enhanced data security features
Excellent quality and reliability
- Endurance exceeding 10,000 program/erase cycles
- 20 year data retention
- ESD protection exceeding 2,000V
Description
The XC9572XV is a 2.5V CPLD targeted for high-perfor­mance, low-voltage applications in leading-edge communi­cations and computing systems. It is comprised of four 54V18 Function Blocks, providing 1,600 usable gates with propagation delays of 4 ns.
Power Estimation
Power dissipation in CPLDs can vary substantially depend­ing on the system frequency, design application and output loading. To help reduce power dissipation, each macrocell in a XC9500XV device may be configured for low-power mode (from the default high-performance mode). In ad di­tion, unused product-terms and macrocells are automati­cally deactivated by the software to further conserve power.
For a general estimate of I
CC
, the following equation may be
used: I
CC
(mA) =
MC
HP
(0.36) + MCLP(0.23) + MC(0.005 mA/MHz) f
Where:
MC
HP
= Macrocells in high-performance (default) mode
MC
LP
= Macrocells in low-power mode MC = Total number of macrocells used f = Clock frequency (MHz)
This calculation is based on typical operating conditions using a pattern of 16-bit up/down counters in each Function Block with no output loading. The actual I
CC
value varies with the design application and should be verified during normal system operation.
Figure 1 shows the above estimation in a graphical form.
0
XC9572XV High-performance CPLD
DS052 (v2.2) August 27, 2001
05
Advance Product Specification
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Figure 1: Typical ICC vs. Frequency for XC9572XV
Clock Frequency (MHz)
Typical I
CC
(mA)
0100200
DS052_01_012501
30
50
Lo
wPower
15050
10
70
90
High Performance
XC9572XV High-performance CPLD
2 www.xilinx.com DS052 (v2.2) Augus t 27, 2001
1-800-255-7778 Advance Product Specification
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Figure 2: X C9572XV Architecture
Function Block outputs (indicated by the bold line) drive the I/O Blocks directly.
In-System Programming Controller
JTAG
Controller
I/O
Blocks
Function
Block 1
Macrocells
1 to 18
Macrocells
1 to 18
Macrocells
1 to 18
Macrocells
1 to 18
JTAG Port
3
54
I/O/GTS
I/O/GSR
I/O/GCK
I/O
I/O
I/O
I/O
2
1
I/O
I/O
I/O
I/O
3
DS052_02_041200
1
Function
Block 2
54
Function
Block 3
54
Function
Block 4
54
18
18
18
18
FastCONNECT II Switch Matrix
XC9572XV High-performance CPLD
DS052 (v2.2) August 27, 2001 www.xilinx.com 3 Advance Product Specification 1-800-255-7778
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Absolute Maximum Ratings
Recommended Operation Conditions
Quality and Reliability Characteristics
Symbol Description Value Units
V
CC
Supply voltage relative to GND –0.5 to 2.7 V
V
CCIO
Supply voltage for output drivers –0.5 to 3.6 V
V
IN
Input voltage relative to GND
(1)
–0.5 to 3.6 V
V
TS
Voltage applied to 3-state output
(1)
–0.5 to 3.6 V
T
STG
Storage temperature (ambient) –65 to +150
o
C
T
SOL
Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm) +260
o
C
T
J
Junction temperature +150
o
C
Notes:
1. Maximum DC unders hoot bel ow GND must be l imit ed to ei ther 0. 5V or 10 mA , whi chever is easi er to a chie v e . During tr a nsitions , the device pins may undershoot to –2.0V or overshoot to +3.6V, provided this over- or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other cond itions beyond those listed under Oper ating Conditions is not implied. Exposure to Absolute Maximum Ratings condition s for ext ended periods of time may affect device reliability.
Symbol Parameter Min Max Units
V
CCINT
Supply voltage for internal logic and input buffers
Commercial TA = 0oC to +70oC2.372.62 V Industrial T
A
= –40oC to +85oC2.372.62
V
CCIO
Supply voltage for output drivers for 3.3V operation 3.13 3.46 V Supply voltage for output drivers for 2.5V operation 2.37 2.62 V Supply voltage for output drivers for 1.8V operation 1.71 1.89 V
V
IL
Low-level input volt ag e 0 0.8 V
V
IH
High-level input voltage 1.7 3.6 V
V
O
Output voltage 0 V
CCIO
V
Symbol Parameter Min Max Units
T
DR
Data retention 20 - Years
N
PE
Program/Erase cycles (endurance) 10,000 - Cycles
V
ESD
Electrostatic Discharge (ESD) 2,000 - Volts
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