XILINX XC9572XL-7VQ64I, XC9572XL-7VQ64C, XC9572XL-7VQ44I, XC9572XL-7VQ44C, XC9572XL-7TQ100I Datasheet

DS057 (v1.1) August 28, 2000 www.xilinx.com 1
Preliminary Product Specification 1-800-255-7778

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All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

Features

• 5 ns pin-to-p in logic de la ys

• System frequency up to 178 MHz

• 72 macrocells with 1,600 usable gates

• Available in small footprint packages

- 44-pin PLCC (34 user I/O pins)

- 44-pin VQFP (34 user I/O pins)

- 48-pin CSP (38 user I/O pins)

- 64-pin VQFP (52 user I/O pins)

- 100-pin TQFP (72 user I/O pins)

• Optimized for high-per formance 3.3V systems

- Low power operation

- 5V tolerant I/O pins accept 5 V, 3.3V, and 2.5V
signals

- 3.3V or 2.5V output capabilit y

- Advanced 0.35 micron feature size CMOS
FastFLASH™ technology

• Advanced system features

- In-system programmable

- Superior pin-locking and routability with
FastCONNECT II™ switch matrix

- Extra wide 54-input Function Blocks

- Up to 90 product-term s per macroc ell with
individual product-term allocation

- Local clock inversion with three global and one
product-term clocks

- Individual output enable per output pin

- Input hysteresis on all user and boundary-scan pin
inputs

- Bus-hold circuitry on all user pin inputs

- Full IEEE Standard 1149.1 boundary-scan (JTAG)

• Fast concurrent programming

• Slew rate control on individual outputs

• Enhanced data security features

• Excellent quality and reliability

- Endurance exceeding 10,000 program/erase
cycles

- 20 year data retention

- ESD protection exceeding 2,000V

• Pin-compatible with 5V-core XC9572 device in the
44-pin PLCC package and the 100-pin TQFP package

Description

The XC9572XL is a 3.3V CPLD targeted for high-perfor­mance, low-voltage applications in leading-edge communi-

cations and computing systems. It is comprised of four
54V18 Function Blocks, providing 1,600 usable gates with
propagation delays of 5 ns. See Figure 2 for architecture
overview.

Power Estimation

Power dissipation in CPLDs can vary substantially depend­ing on the system frequency, design application and output
loading. To help reduce power dissipation, each macrocell
in a XC9500XL device may be configured for low-power
mode (from the default high-performance mode). In ad di­tion, unused product-terms and macrocells are automati­cally deactivated by the software to further conserve power.

For a general estimate of I

CC

, the following equation may be

used:
I

CC

(mA) = MCHP(0.5) + MCLP(0.3) + MC(0.0045 mA/MHz) f

Where:

MC

HP

= Macrocells in high-performance (default) mode

MC

LP

= Macrocells in low-power mode
MC = Total number of macrocells used
f = Clock frequency (MHz)

This calculation is based on typical operating conditions
using a pattern of 16-bit up/down counters in each Function
Block with no output loading. The actual I

CC

value varies
with the design application and should be verified during
normal system operation.

Figure 1 shows the above estimation in a graphical form.

0

XC9572XL High Performance
CPLD

DS057 (v1.1) August 28, 2000

05

Preliminary Product Specification

R

Figure 1: Typi cal ICC vs. Frequency for XC9572XL

Clock Frequency (MHz)

Typical I

CC

(mA)

0 100 200

DS057_01_08150

0

100

40

50 150

80

60

20

104 MHz

High Performance

178 MHz

Low Power

XC9572XL High Performance CPLD

2 www.xilinx.com DS057 (v1.1) Augus t 28, 2000

1-800-255-7778 Preliminary Product Specification

R

Figure 2: XC9572XL Architecture

Function Block outputs (indicated by the bold line) drive the I/O Blocks directly.

In-System Programming Controller

JTAG

Controller

I/O

Blocks

Function

Block 1

Macrocells

1 to 18

Macrocells

1 to 18

JTAG Port

3

54

I/O/GTS

I/O/GSR

I/O/GCK

I/O

I/O

I/O

I/O

2

1

I/O

I/O

I/O

I/O

3

DS057_02_082800

1

Function

Block 2

54

18

18

Function

Block 3

Macrocells

1 to 18

Macrocells

1 to 18

54

Function

Block 4

54

18

18

FastCONNECT II Switch Matrix

XC9572XL High Performance CPLD

DS057 (v1.1) August 28, 2000 www.xilinx.com 3
Preliminary Product Specification 1-800-255-7778

R

Absolute Maximum Ratings

Recommended Operation Conditions

Quality and Reliability Characteristics

DC Characteristic Over Recommended Operating Conditions

Symbol Description Value Units

V

CC

Supply voltage relative to GND –0.5 to 4.0 V

V

IN

Input voltage relative to GND

(1)

–0.5 to 5.5 V

V

TS

Voltage applied to 3-state output

(1)

–0.5 to 5.5 V

T

STG

Storage temperature (ambient) –65 to +150

o

C

T

SOL

Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm) +260

o

C

T

J

Junction temperature +150

o

C

Notes:

1. Maximum DC under shoot bel ow GND mus t be l imite d to ei ther 0 .5V or 10 mA, whiche ve r is e asi er to achie v e . During t ransi tio ns , the
device pins may undershoot to –2.0 V or overshoot to +7.0V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA.

2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operat ion of the device at these or any other condit ions beyon d those listed under Operat ing Conditions
is not implied. Exposure to Absolute Maximum Ratings condition s for ext ended periods of time may affect device reliabili ty.

Symbol Parameter Min Max Units

V

CCINT

Supply voltage for internal logic
and input buffers

Comme r c ial TA = 0oC to 70oC3.0 3.6 V
Industrial T

A

= –40oC to +85oC3.0 3.6 V

V

CCIO

Supply voltage for output drivers fo r 3.3V operation 3.0 3.6 V
Supply voltage for output drivers fo r 2.5V operation 2.3 2.7 V

V

IL

Low-level input voltage 0 0.80 V

V

IH

High-level input voltage 2.0 5.5 V

V

O

Output voltage 0 V

CCIO

V

Symbol Parameter Min Max Units

T

DR

Data Retention 20 - Years

N

PE

Program/Erase Cycles (Endurance) 10,000 - Cycles

V

ESD

Electrostatic Discharge (ESD) 2,000 - Volts

Symbol Parameter Test Conditions Min Max Units

V

OH

Output high voltage for 3.3V outputs IOH = –4.0 mA 2.4 V
Output high voltage for 2.5V outputs I

OH

= –500 µA90% V

CCIO

V

V

OL

Output low voltage for 3.3V outputs IOL = 8.0 mA - 0.4 V
Output low voltage for 2.5V outputs I

OL

= 500 µA-0.4V

I

IL

Input leakage current VCC = Max

V

IN

= GND or V

CC

-±10µA

I

IH

I/O high- Z leak age cu rrent VCC = Max

V

IN

= GND or V

CC

-±10µA

C

IN

I/O capacitance VIN = GND

f = 1.0 MHz

-10pF

I

CC

Operating supply current
(low power mode, active)

VI = GND, No load
f = 1.0 MHz

20 (Typical) mA