XILINX XC95288XV Product Specification

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0
R
DS050 (v2.2) August 27, 2001
05
Features
288 macrocells with 6,400 usable gates
Available in small footprint packages
- 144-pin TQFP (117 user I/O pins)
- 280-pin CSP (192 user I/O pins)
Optimized for high-perfo rmance 2.5V systems
- Low power operation
- Multi-voltage operation
Advanced syste m features
- In-system programmable
- Four separate output banks
- Superior pin-locking and routability with FastCONNECT II™ switch matrix
- Extra wide 54-input Function Blocks
- Up to 90 product-terms per macrocell with individual product-term allocation
- Local clock inversion with three global and one product-term clocks
- Individual output enable per output pin
- Input hysteresis on all user and boundary-scan pin inputs
- Bus-hold ciruitry on all user pin inputs
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
Fast concurrent programming
Slew rate control on individual outputs
Enhanced data security features
Excellent quality and reliability
- Endurance exceeding 10,000 program/erase cycles
- 20 year data retention
- ESD protection exceeding 2,000V
Description
The XC95288XV is a 2.5V CPLD targeted for high-perfor­mance, low-voltage applications in leading-edge communi­cations and computing systems. It is comprised of 16 54V18 Function Blocks, providing 6,400 usable gates with propagation delays of 5 ns.
XC95288XV High-Performance CPLD
Advance Product Specification
Power Estimation
Power dissipation in CPLDs can vary substantially depend­ing on the system frequency, design application and output loading. To help reduce power dissipation, each macrocell in a XC9500XV device may be configured for low-power mode (from the default high-performance mode). In ad di­tion, unused product-terms and macrocells are automati­cally deactivated by the software to further conserve power.
For a general estimate of I used:
(mA ) =
I
CC
(0.36) + MCLP(0.23) + MC(0.005 mA/MHz) f
MC
HP
Where: MC
= Macrocells in high-performance (default) mode
HP
= Macrocells in low-power mode
MC
LP
MC = Total number of macrocells used f = Clock frequency (MHz) This calculation is based on typical operating conditions
using a pattern of 16-bit up/down counters in each Function Block with no output loading. The actual I with the design application and should be verified during normal system operation.
Figure 1 shows the above estimation in a graphical form.
450
400
350
300
(mA)
250
CC
200
Typical I
150
100
50
0
e
gh P
i
H
Low Powe
50 150
, the following equation may be
CC
value varies
CC
nce
a
form
r
120 MHz
r
100 200 250
Clock Frequency (MHz)
200 MHz
DS050_01_012501
Figure 1: Typical I
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS050 (v2.2) August 27, 2001 www.xilinx.com 1
Advance Product Specificati on 1-800-255-7778
vs. Frequency for XC95288XV
CC
XC95288XV High-Performance CPLD
R
JTAG Port
I/O/GCK I/O/GSR
I/O/GTS
I/O I/O I/O I/O
I/O I/O I/O I/O
3
1
JTAG
Controller
In-System Programming Controller
54
18
Function
Block 1
Macrocells
1 to 18
54
18
Function
Block 2
Macrocells
I/O
1 to 18
Blocks
54
18
Function
Block 3
Macrocells
FastCONNECT II Switch Matrix
1 to 18
3 1
18
4
54
Function
Block 4
Macrocells
1 to 18
54
18
Function Block 16
Macrocells
1 to 18
DS055_02_101300
Figure 2: XC9528 8X V Architecture
(Function Block outputs (indicated by the bold line) drive the I/O Blocks directly.)
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1-800-255-7778 Advance Product Specification
R
XC95288XV High-Performance CPLD
Absolute Maximum Ratings
Symbol Description Value Units
V
CC
V
CCIO
V
IN
V
TS
T
STG
T
SOL
T
J
Notes:
1. Maximum DC unders hoot bel ow GND must be l imit ed to ei ther 0. 5V or 10 m A, whi chever is easi er to a chie v e . Durin g tra nsitions , the device pins may undershoot to –2.0V or overshoot to +3.6V, provided this over- or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings onl y, and functional operation of t he device at these or any other condit ions beyond those list ed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliab ility.
Supply voltage relative to GND –0.5 to 2.7 V Supply voltage for output drivers –0.5 to 3.6 V Input voltage relative to GND Voltage applied to 3-state output Storage temperature (ambient) –65 to +150 Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm) +260 Junction temperature +150
(1)
(1)
0.5 to 3.6 V0.5 to 3.6 V
o o o
C C C
Recommended Operation Conditions
Symbol Parameter Min Max Units
V
CCINT
V
CCIO
Supply voltage for internal logic and input buffers
Supply voltage for output drivers for 3.3V operation 3.13 3.46 V Supply voltage for output drivers for 2.5V operation 2.37 2.62 V
Commercial TA = 0oC to +70oC2.372.62 V Industrial T
= –40oC to +85oC2.372.62
A
Supply voltage for output drivers for 1.8V operation 1.71 1.89 V
V
IL
V
IH
V
O
Low-level input volt ag e 0 0.8 V High-level input voltage 1.7 3.6 V Output voltage 0 V
CCIO
Quality and Reliability Characteristics
Symbol Parameter Min Max Units
V
T N
ESD
DR
PE
Data retention 20 - Years Program/Erase cycles (endurance) 10,000 - Cycles Electrostatic Discharge (ESD) 2,000 - Volts
V
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Advance Product Specificati on 1-800-255-7778
XC95288XV High-Performance CPLD
DC Characteristics Over Recommended Operating Conditions
Symbol Parameter Test Conditions Min Max Units
R
V
OH
Output high voltage for 3.3V outputs IOH = –4.0 mA 2.4 - V Output high voltage for 2.5V outputs I Output high voltage for 1.8V outputs I
V
OL
Output low voltage for 3.3V outputs IOL = 8.0 mA - 0.4 V Output low voltage for 2.5V outputs I Output low voltage for 1.8V outputs I Input leakagelow current VCC = 2.62V
Input leakage high current VCC = 2.62V
I/O capacitance VIN = GND
Operating Supply Current
C
I
I
I
CC
IL
IH
IN
(low power mode, active)
AC Characteristics
XC95288XV-5 XC95288XV-7 XC95288XV-10
Symbol Parameter
T
PD
T
SU
T
T
CO
f
SYSTEM
T
PSU
T
PH
T
PCO
T
OE
T
OD
T
POE
T
POD
T
AO
T
PAO
T
WLH
T
PLH
Notes:
1.
Please c on t ac t X ilin x for up- t o- da te informati o n o n a dvan c e specificat ions.
I/O to output valid - 5.0 - 7.5 - 10 ns I/O setup time before GCK 3.5 - 4.8 - 6.5 - ns I/O hold time after GCK 0 - 0 - 0 - ns
H
GCK to output valid - 3.5 - 4.5 - 5.8 ns Multiple FB internal operating
- 222.2 - 125.0 - 100.0 MHz
frequency I/O setup time before p-term clock
1.0 - 1.6 - 2.1 - ns
input I/O hold time after p-term clock input 2.5 - 3.2 - 4.4 - ns P-term clock output valid - 6.0 - 7.7 - 10.2 ns GTS to output valid - 4.0 - 5 .0 - 7.0 ns GTS to output disable - 4.0 - 5 .0 - 7.0 ns Product term OE to output enabled - 7.0 - 9.5 - 11.0 ns Product term OE to output disabled - 7.0 - 9.5 - 11.0 ns GSR to output valid - 10.0 - 12.0 - 14.5 ns P-term S/R to output valid - 10.7 - 12.6 - 15.3 ns GCK pulse width (High or Low) 2.2 - 4.0 - 5.0 - ns P-term clock pulse width (High or Low) 5.0 - 6.5 - 7.0 - ns
Advance Information Preliminary Information
= –1.0 mA 2.0 - V
OH
= –100 µA90%
OH
= 1.0 mA - 0.4 V
OL
= 100 µA-0.4V
OL
V
CCIO
-V
-10µA
V
= 3.6V
CCIO
V
= GND or 3.6V
IN
-10µA
V
= 3.6V
CCIO
V
= GND or 3.6V
IN
-10pF
f = 1.0 MHz VI = GND, No load
59 mA
f = 1.0 MHz
UnitsMin Max Min Max Min Max
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1-800-255-7778 Advance Product Specification
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