Datasheet EC1089 Datasheet (WJ Communications)

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EC1089
InGaP HBT Gain Block Product Information
Product Features
x 10 – 2500 MHz
x +24 dBm P1dB
x +41 dBm OIP3
x 15.5 dB Gain at 900 MHz
x 12.2 dB Gain at 1900 MHz
x Available in SOT-89 and
lead-free / green SOT-89 Package Styles
x Internally matched to 50 :
Applications
x Mobile Infrastructure
x Final stage amplifiers for
Repeaters
x Defense / Homeland Security
The EC1089 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance across a broad range with +41 dBm OIP3 and +24 dBm of compressed 1dB power. It is housed in an industry standard SOT-89 SMT package. The EC1089 is also available in a lead-free/green/RoHS­compliant SOT-89 package. All devices are 100% RF and DC tested.
The EC1089 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the EC1089 to maintain high linearity over temperature and operate directly off a single +5 V supply. This combination makes the device an excellent candidate for transceiver line cards in current and next generation multi-carrier 3G base stations.
Specifications
Parameters Units Min Typ Max
Operational Bandwidth MHz 10 2500
Test Frequency MHz 1900 Gain dB 10.5 12.2 Input Return Loss dB 15 Output Return Loss dB 10 Output P1dB dBm +23.5 Output IP3 IS-95A Channel Power
@ -45 dBc ACPR Noise Figure dB 5.9
Test Frequency MHz 2140 Gain dB 11.5 Output P1dB dBm +23.5 Output IP3
Operating Current Range mA 140 160 175 Device Voltage V +5
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, , in tuned application circuit.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
(2)
dBm +40 +41
(2)
dBm +40
(1)
dBm +17
Product Description
Typical Performance
Parameters Units Typical
Frequency MHz 900 1900 2140 S21 - Gain dB 15.5 12.2 11.5 S11 - Input R.L. dB -14 -15 -15 S22 - Output R.L. dB -10 -10 -10 Output P1dB dBm +24 +23.5 +23.5 Output IP3 dBm +40 +41 +40 Noise Figure dB 5.1 5.9 5.4 Supply Bias +5 V @ 160 mA
3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +5 V, I = 160 mA, +25
C
Functional Diagram
GND
1
RF IN GND
4
EC1089B / EC1089B-G
(3)
Absolute Maximum Rating
Parameter Rating
Operating Case Temperature Storage Temperature RF Input Power (continuous) +18 dBm Device Voltage +6 V Device Current 220 mA Junction Temperature
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004
-40 to +85 qC
-65 to +150 qC
+250 qC
Ordering Information
Part No. Description
EC1089B
EC1089B-G
EC1089B-PCB900 900 MHz Evaluation Board EC1089B-PCB1900 1900 MHz Evaluation Board EC1089B-PCB2140 2140 MHz Evaluation Board
InGaP HBT Gain Block
(leaded SOT-89 Pkg)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
Specifications and information are subject to change without notice
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TM
EC1089
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
S-Parameters (VDS = +5 V, Icc = 160 mA, T = 25C, unmatched 50 ohm system)
30
25
20
15
Gain (dB)
10
5
0
0 0.5 1 1.5 2 2.5
Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The return loss plots are shown from 50 – 3000 MHz, with markers placed at 0.5 – 3.0 GHz in 0.5 GHz increments.
S-Parameters (VDS = +5 V, IDS = 160 mA, T = 25C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
Gain / Maximum Stable Gain
DB(|S[2,1]|) DB(GMax)
Frequency (GHz)
50 -3.61 -169.14 23.08 149.67 -30.46 17.14 -7.74 -128.38 100 -3.31 -173.35 21.93 148.90 -29.57 14.05 -7.80 -143.29 200 -2.62 179.12 19.02 146.43 -27.97 9.40 -6.40 -169.43 400 -2.62 173.23 17.74 136.11 -27.96 10.86 -6.33 -179.95 600 -2.54 168.30 16.69 123.77 -27.96 10.86 -6.09 173.78 800 -2.39 163.31 15.62 111.53 -27.96 10.62 -5.86 168.37
1000 -2.27 158.06 14.57 101.13 -26.02 9.88 -5.68 163.12 1200 -2.21 152.89 13.55 91.40 -26.02 8.87 -5.58 157.73 1400 -2.16 147.55 12.54 82.69 -26.02 7.57 -5.37 152.46 1600 -2.05 142.54 11.65 74.35 -26.02 5.95 -5.20 147.09 1800 -1.99 137.85 10.70 66.99 -25.08 4.22 -5.20 141.71 2000 -1.84 133.47 9.91 59.96 -24.44 2.37 -5.05 136.43 2200 -1.68 129.41 9.13 53.84 -24.44 0.24 -5.01 131.29 2400 -1.46 125.20 8.46 47.68 -24.44 -2.39 -4.89 126.16 2600 -1.33 120.48 7.85 41.30 -23.27 -5.53 -4.88 121.19 2800 -1.20 115.03 7.22 34.74 -23.10 -9.13 -4.73 116.28 3000 -1.17 109.05 6.62 27.78 -23.10 -12.86 -4.66 111.40
Device S-parameters are available for download off of the website at: http://www.wj.com
Typical Device Data
S11
8
1.0-1.0
. 0
6 .
0
4
.
0
0.2
0
0.2
0.2
-
4
.
0
-
1.0
0.4
0.6
6 . 0
-
8 . 0
-
2.0
0.8
Swp Max
6GHz
0
.
2
0
.
3
0
.
4
.0
5
0
.
0
1
10.0
5.0
3.0
4.0
0
.
0
1
-
0
.
-5
0
.
4
-
0
.
3
-
0
.
2
-
Swp Min
0.1GHz
4
.
0
0.2
0
0.2
-0.2
4
.
0
-
S22
8
1.0-1.0
. 0
6
.
0
1.0
0.4
0.6
0.8
6
.
0
-
8 . 0
-
Swp Max
6GHz
0
.
2
0
.
3
0
.
4
5.0
0
.
0
1
10.0
5.0
2.0
3.0
4.0
0
.
0
1
-
-5.0
0
.
4
-
0
.
3
-
0
.
2
-
Swp Min
0.1GHz
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004
Application Circuit PC Board Layout
Circuit Board Material: .014” Getek, 4 layers (other layers added for rigidity), .062” total thickness, 1 oz copper Microstrip line details: width = .026”, spacing = .026”
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OIP3 vs. Frequency
OIP3 (dBm)
Average CDMA ACPR
ACPR (dBc)
Note: (IS95) ACPR1 measured at
OIP3 vs. Temperature vs. Frequency
dBm
Average CDMA ACPR
ACPR (dBc)
Note: (IS95) ACPR1 measured at
EC1089
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
900 MHz Application Circuit (EC1089B-PCB900)
Typical RF Performance
Frequency 900 MHz
S21 – Gain 15.5 dB
S11 – Input Return Loss -15dB
S22 – Output Return Loss -10 dB
Output IP3
(+11 dBm / tone, 1 MHz spacing)
Output P1dB +24 dBm
Noise Figure 5.1 dB
Supply Voltage +5 V
Supply Current 160 mA
Measured parameters were taken at 25 C.
+40 dBm
44 43 42 41 40 39 38 37
600 700 800 900 1000 1100
25°C -40°C +85°C
Frequency (.9 GHz Matching)
1900 MHz Application Circuit (EC1089B-PCB1900)
Typical RF Performance
Frequency 1900 MHz
S21 – Gain 12.2 dB
S11 – Input Return Loss -15 dB
S22 – Output Return Loss -10 dB
Output IP3
(+11 dBm / tone, 1 MHz spacing)
Output P1dB +23 dBm
Noise Figure 5.9 dB
Supply Voltage +5 V
Supply Current 160 mA
Measured parameters were taken at 25 C.
+41 dBm
All passive components are of size 0603 unless otherwise noted.
RES
ID=
L2
R=
2700 Ohm
CAP
PORT
1
Z=P=50 Ohm
ID=
C4
C=
56 pF
CAP
ID=
C12
C=
5.6 pF
RES
ID=
L3
R=
0 Ohm
C12 should be placed at the silk screen marker "F" on the WJ evaluation board.
The capacitor should be placed
14° @ 0.9GHz from pin 1.
40 45
750KHz, Forward 9 Channel
50 55 60 65 70 75 80 85
10 12 14 16 18
Average output power (dBm)
All passive components are of size 0603 unless otherwise noted.
RES
ID=
L2
R=
2700 Ohm
CAP
PORT
ID=
1
Z=P=50 Ohm
C4
C=
56 pF
C7 should be placed at the silk screen marker "A" on the WJ evaluation board.
The capacitor should be placed 5° @ 1.9GHz from pin 1.
IND
ID=
L3
L=
2.7 nH
CAP
ID=
C7
C=
2.4 pF
Vcc = +5 V
SUBCKT
ID=
U1
NET=
"EC1089B"
Vcc = +5 V
SUBCKT
ID=
U1
NET=
"EC1089B"
DIODE1
ID= D1
5.6 V
IND
ID=
L=
DIODE1
ID= D1
5.6 V
IND ID=
L=
L1 33 nH
L1 18 nH
CAP
ID=
C3
C=
1e5 pF
size 1206
CAP
ID=
C2
C=
1000 pF
size 0805
CAP
ID=
C1
C=
56 pF
CAP
PORT
ID=
C5
2
C=
56 pF
Z=P=50 Ohm
CAP
ID=
C13
C=
1.0 pF
C13 should be placed at the silk screen marker "8" on the WJ evaluation board.
The capacitor should be placed 19° @ 0.9GHz from pin 3.
CAP
ID=
C3
C=
1e5 pF
size 1206
CAP
ID=
C2
C=
1000 pF
size 0805
CAP
ID=
C1
C=
56 pF
CAP
ID=
C=
CAP
ID=
C13
C=
1.2 pF
C13 should be placed at the silk screen marker "7" on the WJ evaluation board.
The capacitor should be placed 34° @ 1.9GHz from pin 3.
C5 56 pF
PORT
2
Z=P=50 Ohm
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004
45
43
41
39
37
25°C -40°C 85°C
35
1600 1700 1800 1900 2000 2100
Frequency (MHz)
40 45
750KHz, Forward 9 Channel
50 55 60 65 70 75 80 85
10 12 14 16 18
Average output power (dBm)
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EC1089
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
2140 MHz Application Circuit (EC1089B-PCB2140)
Typical RF Performance
Frequency 2140 MHz
S21 – Gain 11.5 dB
S11 – Input Return Loss -15 dB
S22 – Output Return Loss -10 dB
Output IP3
(+10 dBm / tone, 1 MHz spacing)
Output P1dB +23 dBm
Noise Figure 5.4 dB
Supply Voltage +5 V
Supply Current 160 mA
Measured parameters were taken at 25 C.
+40 dBm
All passive components are of size 0603 unless otherwise noted.
RES
ID=
L2
R=
2700 Ohm
C6 should be placed 19.5° @ 2.14GHz
from pin 1.
PORT
1
Z=P=50 Ohm
CAP
ID=
C4
C=
56 pF
CAP
ID=
C6
C=
1.5 pF
CAP
ID=
C12
C=
1.5 pF
C12 should be placed at the silk screen marker "F" on the WJ evaluation board.
The capacitor should be placed 33° @ 2.14GHz from pin 1.
Vcc = +5 V
SUBCKT
ID=
U1
NET=
"EC1089B"
DIODE1
ID= D1
5.6 V
IND
ID=
L=
L1 18 nH
CAP
ID=
C=
CAP
ID=
C13
C=
0.8 pF
C13 should be placed at the silk screen marker "6" on the WJ evaluation board.
The capacitor should be placed 39° @ 2.14GHz from pin 3.
C5 56 pF
CAP
ID=
C3
C=
1e5 pF
size 1206
CAP
ID=
C2
C=
1000 pF
size 0805
CAP ID=
C1
C=
56 pF
PORT
2
Z=P=50 Ohm
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004
The Communications Edge
TM
EC1089
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
EC1089B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an
“1089” designator with an alphanumeric lot code on the top surface of the package.
Tape and reel specifications for this part are located on the website in the “Application Notes” section.
MSL / ESD Rating
Land Pattern
Thermal Specifications
Parameter Rating
Operating Case Temperature -40 to +85q C Thermal Resistance Junction Temperature
Notes:
1. The thermal resistance is referenced from the junction­to-case at a case temperature of 85 C.
2. This corresponds to the typical biasing condition of +5V, 160 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247
(1)
149q C / W
(2)
204q C
C.
1000.0
MTTF vs. GND Tab Temperature
100.0
10.0
1.0 60 70 80 90 100 110 120
Tab Temperature (°C)
ESD Rating: Class 1A Value: Passes between 250 and 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004
The Communications Edge
TM
EC1089
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
EC1089B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“ 1089G” designator with an alphanumeric lot code on the top surface of the package.
Tape and reel specifications for this part are located on the website in the “ Application Notes” section.
MSL / ESD Rating
Land Pattern
Thermal Specifications
Parameter Rating
Operating Case Temperature -40 to +85q C Thermal Resistance Junction Temperature
Notes:
1. The thermal resistance is referenced from the junction­to-case at a case temperature of 85 C.
2. This corresponds to the typical biasing condition of +5V,
160 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247
(1)
149q C / W
(2)
204q C
C.
1000.0
MTTF vs. GND Tab Temperature
100.0
10.0
1.0 60 70 80 90 100 110 120
Tab Temperature (°C)
ESD Rating: Class 1A Value: Passes between 250 and 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com December 2004
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