Datasheet EC1089 Datasheet (WJ Communications)

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EC1089

InGaP HBT Gain Block Product Information

Product Features

x 10 – 2500 MHz

x +24 dBm P1dB

x +41 dBm OIP3

x 15.5 dB Gain at 900 MHz

x 12.2 dB Gain at 1900 MHz

x Available in SOT-89 and

lead-free / green SOT-89
Package Styles

x Internally matched to 50 :

Applications

x Mobile Infrastructure

x Final stage amplifiers for

Repeaters

x Defense / Homeland Security

The EC1089 is a high dynamic range driver amplifier in a
low-cost surface mount package. The InGaP/GaAs HBT is
able to achieve high performance across a broad range with
+41 dBm OIP3 and +24 dBm of compressed 1dB power. It
is housed in an industry standard SOT-89 SMT package.
The EC1089 is also available in a lead-free/green/RoHS­compliant SOT-89 package. All devices are 100% RF and
DC tested.

The EC1089 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
EC1089 to maintain high linearity over temperature and
operate directly off a single +5 V supply. This combination
makes the device an excellent candidate for transceiver line
cards in current and next generation multi-carrier 3G base
stations.

Specifications

Parameters Units Min Typ Max

Operational Bandwidth MHz 10 2500

Test Frequency MHz 1900
Gain dB 10.5 12.2
Input Return Loss dB 15
Output Return Loss dB 10
Output P1dB dBm +23.5
Output IP3
IS-95A Channel Power

@ -45 dBc ACPR
Noise Figure dB 5.9

Test Frequency MHz 2140
Gain dB 11.5
Output P1dB dBm +23.5
Output IP3

Operating Current Range mA 140 160 175
Device Voltage V +5

1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, , in tuned application circuit.

2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.

(2)

dBm +40 +41

(2)

dBm +40

(1)

dBm +17

Product Description

Typical Performance

Parameters Units Typical

Frequency MHz 900 1900 2140
S21 - Gain dB 15.5 12.2 11.5
S11 - Input R.L. dB -14 -15 -15
S22 - Output R.L. dB -10 -10 -10
Output P1dB dBm +24 +23.5 +23.5
Output IP3 dBm +40 +41 +40
Noise Figure dB 5.1 5.9 5.4
Supply Bias +5 V @ 160 mA

3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +5 V, I =
160 mA, +25



C

Functional Diagram

GND

1

RF IN GND

4

EC1089B / EC1089B-G

(3)

Absolute Maximum Rating

Parameter Rating

Operating Case Temperature
Storage Temperature
RF Input Power (continuous) +18 dBm
Device Voltage +6 V
Device Current 220 mA
Junction Temperature

Operation of this device above any of these parameters may cause permanent damage.

WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: [phone]  e-mail: [e-mail]  Web site: www.wj.com December 2004

-40 to +85 qC

-65 to +150 qC

+250 qC

Ordering Information

Part No. Description

EC1089B

EC1089B-G

EC1089B-PCB900 900 MHz Evaluation Board
EC1089B-PCB1900 1900 MHz Evaluation Board
EC1089B-PCB2140 2140 MHz Evaluation Board

InGaP HBT Gain Block

(leaded SOT-89 Pkg)

InGaP HBT Gain Block

(lead-free/green/RoHS-compliant SOT-89 Pkg)

Specifications and information are subject to change without notice

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EC1089

¼ Watt, High Linearity InGaP HBT Amplifier Product Information

S-Parameters (VDS = +5 V, Icc = 160 mA, T = 25C, unmatched 50 ohm system)

30

25

20

15

Gain (dB)

10

5

0

0 0.5 1 1.5 2 2.5

Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency,
it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line.
The return loss plots are shown from 50 – 3000 MHz, with markers placed at 0.5 – 3.0 GHz in 0.5 GHz increments.

S-Parameters (VDS = +5 V, IDS = 160 mA, T = 25C, unmatched 50 ohm system, calibrated to device leads)

Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)

Gain / Maximum Stable Gain

DB(|S[2,1]|) DB(GMax)

Frequency (GHz)

50 -3.61 -169.14 23.08 149.67 -30.46 17.14 -7.74 -128.38
100 -3.31 -173.35 21.93 148.90 -29.57 14.05 -7.80 -143.29
200 -2.62 179.12 19.02 146.43 -27.97 9.40 -6.40 -169.43
400 -2.62 173.23 17.74 136.11 -27.96 10.86 -6.33 -179.95
600 -2.54 168.30 16.69 123.77 -27.96 10.86 -6.09 173.78
800 -2.39 163.31 15.62 111.53 -27.96 10.62 -5.86 168.37

1000 -2.27 158.06 14.57 101.13 -26.02 9.88 -5.68 163.12
1200 -2.21 152.89 13.55 91.40 -26.02 8.87 -5.58 157.73
1400 -2.16 147.55 12.54 82.69 -26.02 7.57 -5.37 152.46
1600 -2.05 142.54 11.65 74.35 -26.02 5.95 -5.20 147.09
1800 -1.99 137.85 10.70 66.99 -25.08 4.22 -5.20 141.71
2000 -1.84 133.47 9.91 59.96 -24.44 2.37 -5.05 136.43
2200 -1.68 129.41 9.13 53.84 -24.44 0.24 -5.01 131.29
2400 -1.46 125.20 8.46 47.68 -24.44 -2.39 -4.89 126.16
2600 -1.33 120.48 7.85 41.30 -23.27 -5.53 -4.88 121.19
2800 -1.20 115.03 7.22 34.74 -23.10 -9.13 -4.73 116.28
3000 -1.17 109.05 6.62 27.78 -23.10 -12.86 -4.66 111.40

Device S-parameters are available for download off of the website at: http://www.wj.com

Typical Device Data

S11

8

1.0-1.0

.
0

6
.

0

4

.

0

0.2

0

0.2

0.2

-

4

.

0

-

1.0

0.4

0.6

6
.
0

-

8
.
0

-

2.0

0.8

Swp Max

6GHz

0

.

2

0

.

3

0

.

4

.0

5

0

.

0

1

10.0

5.0

3.0

4.0

0

.

0

1

-

0

.

-5

0

.

4

-

0

.

3

-

0

.

2

-

Swp Min

0.1GHz

4

.

0

0.2

0

0.2

-0.2

4

.

0

-

S22

8

1.0-1.0

.
0

6

.

0

1.0

0.4

0.6

0.8

6

.

0

-

8
.
0

-

Swp Max

6GHz

0

.

2

0

.

3

0

.

4

5.0

0

.

0

1

10.0

5.0

2.0

3.0

4.0

0

.

0

1

-

-5.0

0

.

4

-

0

.

3

-

0

.

2

-

Swp Min

0.1GHz

Specifications and information are subject to change without notice

WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: [phone]  e-mail: [e-mail]  Web site: www.wj.com December 2004

Application Circuit PC Board Layout

Circuit Board Material: .014” Getek, 4 layers (other layers added for rigidity), .062” total thickness, 1 oz copper
Microstrip line details: width = .026”, spacing = .026”

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OIP3 vs. Frequency

OIP3 (dBm)

Average CDMA ACPR

ACPR (dBc)

Note: (IS95) ACPR1 measured at

OIP3 vs. Temperature vs. Frequency

dBm

Average CDMA ACPR

ACPR (dBc)

Note: (IS95) ACPR1 measured at

EC1089

¼ Watt, High Linearity InGaP HBT Amplifier Product Information

900 MHz Application Circuit (EC1089B-PCB900)

Typical RF Performance

Frequency 900 MHz

S21 – Gain 15.5 dB

S11 – Input Return Loss -15dB

S22 – Output Return Loss -10 dB

Output IP3

(+11 dBm / tone, 1 MHz spacing)

Output P1dB +24 dBm

Noise Figure 5.1 dB

Supply Voltage +5 V

Supply Current 160 mA

Measured parameters were taken at 25 C.

+40 dBm

44
43
42
41
40
39
38
37

600 700 800 900 1000 1100

25°C -40°C +85°C

Frequency (.9 GHz Matching)

1900 MHz Application Circuit (EC1089B-PCB1900)

Typical RF Performance

Frequency 1900 MHz

S21 – Gain 12.2 dB

S11 – Input Return Loss -15 dB

S22 – Output Return Loss -10 dB

Output IP3

(+11 dBm / tone, 1 MHz spacing)

Output P1dB +23 dBm

Noise Figure 5.9 dB

Supply Voltage +5 V

Supply Current 160 mA

Measured parameters were taken at 25 C.

+41 dBm

All passive components are of size 0603 unless otherwise noted.

RES

ID=

L2

R=

2700 Ohm

CAP

PORT

1

Z=P=50 Ohm

ID=

C4

C=

56 pF

CAP

ID=

C12

C=

5.6 pF

RES

ID=

L3

R=

0 Ohm

C12 should be placed at the silk screen
marker "F" on the WJ evaluation board.

The capacitor should be placed

14° @ 0.9GHz from pin 1.

40
45

750KHz, Forward 9 Channel

50
55
60
65
70
75
80
85

10 12 14 16 18

Average output power (dBm)

All passive components are of size 0603 unless otherwise noted.

RES

ID=

L2

R=

2700 Ohm

CAP

PORT

ID=

1

Z=P=50 Ohm

C4

C=

56 pF

C7 should be placed at the silk screen
marker "A" on the WJ evaluation board.

The capacitor should be placed
5° @ 1.9GHz from pin 1.

IND

ID=

L3

L=

2.7 nH

CAP

ID=

C7

C=

2.4 pF

Vcc = +5 V

SUBCKT

ID=

U1

NET=

"EC1089B"

Vcc = +5 V

SUBCKT

ID=

U1

NET=

"EC1089B"

DIODE1

ID= D1

5.6 V

IND

ID=

L=

DIODE1

ID= D1

5.6 V

IND
ID=

L=

L1
33 nH

L1
18 nH

CAP

ID=

C3

C=

1e5 pF

size 1206

CAP

ID=

C2

C=

1000 pF

size 0805

CAP

ID=

C1

C=

56 pF

CAP

PORT

ID=

C5

2

C=

56 pF

Z=P=50 Ohm

CAP

ID=

C13

C=

1.0 pF

C13 should be placed at the silk screen
marker "8" on the WJ evaluation board.

The capacitor should be placed
19° @ 0.9GHz from pin 3.

CAP

ID=

C3

C=

1e5 pF

size 1206

CAP

ID=

C2

C=

1000 pF

size 0805

CAP

ID=

C1

C=

56 pF

CAP

ID=

C=

CAP

ID=

C13

C=

1.2 pF

C13 should be placed at the silk screen
marker "7" on the WJ evaluation board.

The capacitor should be placed
34° @ 1.9GHz from pin 3.

C5
56 pF

PORT

2

Z=P=50 Ohm

Specifications and information are subject to change without notice

WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: [phone]  e-mail: [e-mail]  Web site: www.wj.com December 2004

45

43

41

39

37

25°C -40°C 85°C

35

1600 1700 1800 1900 2000 2100

Frequency (MHz)

40
45

750KHz, Forward 9 Channel

50
55
60
65
70
75
80
85

10 12 14 16 18

Average output power (dBm)

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EC1089

¼ Watt, High Linearity InGaP HBT Amplifier Product Information

2140 MHz Application Circuit (EC1089B-PCB2140)

Typical RF Performance

Frequency 2140 MHz

S21 – Gain 11.5 dB

S11 – Input Return Loss -15 dB

S22 – Output Return Loss -10 dB

Output IP3

(+10 dBm / tone, 1 MHz spacing)

Output P1dB +23 dBm

Noise Figure 5.4 dB

Supply Voltage +5 V

Supply Current 160 mA

Measured parameters were taken at 25 C.

+40 dBm

All passive components are of size 0603 unless otherwise noted.

RES

ID=

L2

R=

2700 Ohm

C6 should be placed 19.5° @ 2.14GHz

from pin 1.

PORT

1

Z=P=50 Ohm

CAP

ID=

C4

C=

56 pF

CAP

ID=

C6

C=

1.5 pF

CAP

ID=

C12

C=

1.5 pF

C12 should be placed at the silk
screen marker "F" on the WJ evaluation board.

The capacitor should be placed
33° @ 2.14GHz from pin 1.

Vcc = +5 V

SUBCKT

ID=

U1

NET=

"EC1089B"

DIODE1

ID= D1

5.6 V

IND

ID=

L=

L1
18 nH

CAP

ID=

C=

CAP

ID=

C13

C=

0.8 pF

C13 should be placed at the silk
screen marker "6" on the WJ evaluation board.

The capacitor should be placed
39° @ 2.14GHz from pin 3.

C5
56 pF

CAP

ID=

C3

C=

1e5 pF

size 1206

CAP

ID=

C2

C=

1000 pF

size 0805

CAP
ID=

C1

C=

56 pF

PORT

2

Z=P=50 Ohm

Specifications and information are subject to change without notice

WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: [phone]  e-mail: [e-mail]  Web site: www.wj.com December 2004

The Communications Edge

TM

EC1089

¼ Watt, High Linearity InGaP HBT Amplifier Product Information

EC1089B (SOT-89 Package) Mechanical Information

This package may contain lead-bearing materials. The plating material on the leads is SnPb.

Outline Drawing

Product Marking

The component will be marked with an

“1089” designator with an alphanumeric lot
code on the top surface of the package.

Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.

MSL / ESD Rating

Land Pattern

Thermal Specifications

Parameter Rating

Operating Case Temperature -40 to +85q C
Thermal Resistance
Junction Temperature

Notes:

1. The thermal resistance is referenced from the junction­to-case at a case temperature of 85 C.

2. This corresponds to the typical biasing condition of +5V,
160 mA at an 85 C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247

(1)

149q C / W

(2)

204q C



C.

1000.0

MTTF vs. GND Tab Temperature

100.0

10.0

1.0
60 70 80 90 100 110 120

Tab Temperature (°C)

ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +235 C convection reflow
Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm

(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).

2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.

3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material
and construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are
in degrees.

Specifications and information are subject to change without notice

WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: [phone]  e-mail: [e-mail]  Web site: www.wj.com December 2004

The Communications Edge

TM

EC1089

¼ Watt, High Linearity InGaP HBT Amplifier Product Information

EC1089B-G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded

(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Product Marking

The component will be marked with an

“ 1089G” designator with an alphanumeric lot
code on the top surface of the package.

Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.

MSL / ESD Rating

Land Pattern

Thermal Specifications

Parameter Rating

Operating Case Temperature -40 to +85q C
Thermal Resistance
Junction Temperature

Notes:

1. The thermal resistance is referenced from the junction­to-case at a case temperature of 85 C.

2. This corresponds to the typical biasing condition of +5V,

160 mA at an 85 C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247

(1)

149q C / W

(2)

204q C



C.

1000.0

MTTF vs. GND Tab Temperature

100.0

10.0

1.0
60 70 80 90 100 110 120

Tab Temperature (°C)

ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm

(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).

2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.

3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material
and construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are
in degrees.

Specifications and information are subject to change without notice

WJ Communications, Inc  Phone 1-800-WJ1-4401  FAX: [phone]  e-mail: [e-mail]  Web site: www.wj.com December 2004