Wi2Wi W2CBW0016 Users Manual
Wi2Wi, Inc. Rev.1.21
Data Sheet, WLAN-Bluetooth SiP – W2CBW0016
May 17th, 2013
Preliminary Product Datasheet
Revision 1.21
May 17, 2013
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2013 Wi2Wi, Inc.
Page 1 of 27
Wi2Wi, Inc. Rev.1.21
Data Sheet, WLAN-Bluetooth SiP – W2CBW0016
May 17th, 2013
Table of Contents
1
General Description ........................................................................................................... 4
2
Features .............................................................................................................................. 4
3 System Description ............................................................................................................ 5
3.1
Block Diagram .......................................................................................................................... 5
3.2 Pad Description ........................................................................................................................ 5
4 Electrical Characteristics .................................................................................................. 8
5
WLAN External Host Interfaces .................................................................................... 11
5.1
SDIO Interface........................................................................................................................ 11
5.2 SDIO Protocol Timing Diagrams ............................................................................................ 12
6
Bluetooth Interfaces ........................................................................................................ 13
6.1
SDIO Interface........................................................................................................................ 13
6.2
PCM Interface ........................................................................................................................ 13
7
Antenna and Clock .......................................................................................................... 14
7.1
Wireless LAN.......................................................................................................................... 14
7.2
Bluetooth ................................................................................................................................ 14
8
WLAN Software Architecture ........................................................................................ 16
8.1
Host Processor ....................................................................................................................... 16
9 Reference Schematics ...................................................................................................... 17
10 Manufacturing Notes ....................................................................................................... 18
10.1
Physical SiP Dimensions and Pad Locations ........................................................................ 18
10.2 Physical Shield Dimensions
10.3 Shield Landing Pattern
10.4 Tray Orientation
10.5 Tape and Reel Orientation
10.6
Storage and Baking Instructions ............................................................................................ 23
10.7 Recommended Reflow Profile ................................................................................................ 23
...................................................................................................................... 20
11 Disclaimers ....................................................................................................................... 24
11.1
Data Sheet Status .................................................................................................................. 24
12
Ordering Information
12.1
Development Kit ..................................................................................................................... 24
................................................................................................... 24
13 Certifications .................................................................................................................... 26
14 References ......................................................................................................................... 27
14.1
Specifications ......................................................................................................................... 27
14.2 Trademarks, Patents and Licenses ....................................................................................... 27
................................................................................................. 19
......................................................................................................... 20
..................................................................................................... 22
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2013 Wi2Wi, Inc.
Page 2 of 27
Wi2Wi, Inc. Rev.1.21
Revision
Revision Date
Originator
Changes
0.1
05/01/2012
DDS
First production data-sheet version
0.2
06/05/2012
DDS
Updated part ordering information, shield
dimensions and shield landing pattern
0.3
06/06/2012
DDS
Added Tray and Tape & Reel Orientation figures
1.0
06/13/2012
DDS
Updated block diagram and corrected text
1.1
02/19/2013
DDS
Updated certifications: RoHS, GREEN, REACH
1.2
04/09/2013
DDS
Added ref. design for eval-board and dev-kit images
1.21
05/17/2013
DDS
Removed SDIO SPI references
Data Sheet, WLAN-Bluetooth SiP – W2CBW0016
May 17th, 2013
List of Figures:
Figure 1: Block Diagram ................................................................................................................ 5
Figure 2: SDIO Protocol Timing .................................................................................................. 12
Figure 3: Software Architecture.................................................................................................... 16
Figure 4: Box Diagram ................................................................................................................. 17
Figure 5: Top View of Pads .......................................................................................................... 17
Figure 6: Initialization Configuration ........................................................................................... 18
Figure 7: SDIO Interface .............................................................................................................. 18
Figure 8: Physical Dimensions and Pad Locations ....................................................................... 19
Figure 9: Physical Shield Dimensions .......................................................................................... 19
Figure 10: Shield Landing Pattern ................................................................................................ 20
Figure 11: IC Orientation on Tray ................................................................................................ 20
Figure 12: Carrier Tray Package Outline Drawing ....................................................................... 21
Figure 13: IC Orientation on Tape and Reel ................................................................................. 22
Figure 14: Leader and Trailer ....................................................................................................... 22
Figure 15: Carrier Tape Package Outline Drawing ...................................................................... 22
Figure 16: Recommended Reflow Profile .................................................................................... 23
Figure 17: W2CBW0016 Dev-1 ................................................................................................... 25
Figure 18: W2CBW0016 Dev-2 ................................................................................................... 25
List of Tables:
Table 1: Pad Description ................................................................................................................. 5
Table 2: Electrical Characteristics .................................................................................................. 8
Table 3: SDIO Pin Map ................................................................................................................ 11
Table 4: SDIO Timing Data .......................................................................................................... 13
Revision History:
Page 3 of 27
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2013 Wi2Wi, Inc.
Wi2Wi, Inc. Rev.1.21
Data Sheet, WLAN-Bluetooth SiP – W2CBW0016
May 17th, 2013
1
General Description
This specification provides a general guideline on the performance and integration of
W2CBW0016, a complete wireless subsystem featuring full 802.11 b/g/n WLAN as well as
Class 1.0/2.0/3.0 Bluetooth capabilities in a small form factor SiP solution. The W2CBW0016
device was designed to simplify the process of adding wireless access to systems without
lengthy design cycles or complex RF design. Both radios are fully tested for coexistence,
internally and with other external radio technologies. A set of regulatory certifications will
also be provided, simplifying the certification process for your end product and further
reducing valuable time-to-market. Based on world-class silicon from Wi2Wi partner
Marvell, the W2CBW0016 has been fully optimized for throughput and receive sensitivity via
careful design practices. State-of-the art software development resources are available to
create drivers for unique processors and operating systems if needed, or to optimize the
wireless subsystem to fit your application.
Specified maximum and minimum limits presented herein are those guaranteed when the unit is
integrated into Wi2Wi’s W2CBW0016-Dev(1/2) Development System. These limits are to
serve as representative performance characteristics of the W2CBW0016 when properly designed
into a customer’s product. Wi2Wi makes no warranty, implied or otherwise specified, with
respect to customer’s design and performance characteristics presented in this specification.
2
Features
Industrial Temperature Operation: -40°C to +85°C
Compact design for easy integration: 12mm x 12mm x 1.4mm
100 Pad LGA surface mount package
WLAN technology based on Marvell’s 88W8787
Bluetooth technology based on Marvell’s 88W8787
Single antenna design for WLAN and Bluetooth
Operates in 2.4 GHz ISM band
RoHS, GREEN, REACH Compliant
WLAN Specific Features
o
SDIO 1.1 Interfaces
o
802.11s Mesh Networking
o
802.11h Dynamic Frequency Selection
o
802.11e Quality of Service
o
50-Ohm antenna launch
o
Support for Linux and Android operating systems
o
1, 2, 5.5 and 11 Mbps data rates for 802.11b (DSSS/CCK modulation)
o
6, 9, 12, 18, 24, 36, 48 and 54 Mbps data rates for 802.11g (OFDM modulation)
o
72 Mbps, 150 Mbps data rates for 802.11n (OFDM modulation)
Bluetooth Specific Features
o
HCI Layer Support
o
GFSK modulation for Bluetooth version 2.1
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2013 Wi2Wi, Inc.
Page 4 of 27
Wi2Wi, Inc. Rev.1.21
Pin
Pin Name
Type Supply
Description
A1
GND_A1
Ground
Ground
A2
RES_A2
NC
NC
Reserved Pin, No Connection Recommended
A3
GND_A3
Ground
Ground
A4
PCM_DIN
I/O
VIO
PCM Data Input Signal
A5
GND_A5
Ground
Ground
A6
J1_NC_A6
NC
NC
Reserved Pin, No Connection Recommended
A7
GND_A7
Ground
Ground
Data Sheet, WLAN-Bluetooth SiP – W2CBW0016
May 17th, 2013
o
Data rate up to 1 Mbps for Bluetooth version 2.1
o
Data rate up to 3 Mbps for Bluetooth EDR
o
Data rate up to 24 Mbps for Bluetooth AMP
o
Support for Class 1.5 Bluetooth (i.e., Class 1 up to 10dBm)
3 System Description
W2CBW0016 is a complete SiP solution that uses Marvell 88W8787 to implement 802.11 b/g/n
and Bluetooth functions. It includes
preserves the characteristics from the Marvell chipset while providing optimized system level
functionality and performance.
all the components needed to operate both radios. It
3.1
Figure 1
Block Diagram
shows the block diagram of W2CBW0016
Figure 1: Block Diagram
.
3.2 Pad Description
Page 5 of 27
Table 1: Pad Description
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2013 Wi2Wi, Inc.
Wi2Wi, Inc. Rev.1.21
A8
J1_NC_A8
NC
NC
Reserved Pin, No Connection Recommended
A9
HOST_PWR_A9
Power
HOST_PWR
Host Power (3.3V)
A10
HOST_PWR_A10
Power
HOST_PWR
Host Power (3.3V)
B1
HOST_PWR_B1
Power
HOST_PWR
Host Power (3.3V)
B2
CLK_REQ
I/O
VIO
Oscillator Mode (active low, output)
0: disable external oscillator
1: enable external oscillator (Default)
B3
I2S_MCLK
I/O
VIO
I2S Master Clock (output)
B4
W1_CNTL
O
VIO
Power management device
programming interface control
B5
J1_NC_B5
NC
NC
Reserved Pin, No Connection Recommended
B6
J1_NC_B6
NC
NC
Reserved Pin, No Connection Recommended
B7
J1_NC_B7
NC
NC
Reserved Pin, No Connection Recommended
B8
GND_B8
Ground
Ground
B9
PWDET_2G
I
VIO
2.4 GHz PA Power Detection Signal (analog input)
B10
HOST_PWR_B10
Power
HOST_PWR
Host Power (3.3V)
C1
RES_C1
NC
NC
Reserved Pin, No Connection Recommended
C2
PCM_SYNC
I/O
VIO
PCM Sync Pulse Signal
Output if PCM master, Input if PCM slave
C3
PCM_DOUT
I/O
VIO
PCM Data Output Signal
C4
WF_LED
O
VIO
LED Indicator for Wi-Fi
C5
RES_C5
NC
NC
Reserved Pin, No Connection Recommended
C6
RES_C6
NC
NC
Reserved Pin, No Connection Recommended
C7
RES_C7
NC
NC
Reserved Pin, No Connection Recommended
C8
GND_C8
Ground
Ground
C9
GND_C9
Ground
Ground
C10
HOST_PWR_C10
Power
HOST_PWR
Host Power (3.3V)
D1
RES_D1
NC
NC
Reserved Pin, No Connection Recommended
D2
RES_D2
NC
NC
Reserved Pin, No Connection Recommended
D3
PCM_CLK
I/O
VIO
PCM Clock Signal
Output if PCM master, Input if PCM slave
D4
BT_LED
O
VIO
LED Indicator for Bluetooth
D5
GND_D5
Ground
Ground
D6
RES_D6
NC
NC
Reserved Pin, No Connection Recommended
D7
RES_D7
NC
NC
Reserved Pin, No Connection Recommended
D8
J1_NC_D8
NC
NC
Reserved Pin, No Connection Recommended
D9
GND_D9
Ground
Ground
D10
HOST_PWR_D10
Power
HOST_PWR
Host Power (3.3V)
E1
SD_D3
I/O
VIO
SDIO 4-bit mode: Data line bit [3]
SDIO 1-bit mode: Not used
E2
SD_CLK
I/O
VIO
SDIO 4-bit mode: Clock input
SDIO 1-bit mode: Clock input
E3
GND_E3
Ground
Ground
E4
GND_E4
Ground
Ground
Data Sheet, WLAN-Bluetooth SiP – W2CBW0016
May 17th, 2013
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Page 6 of 27
Copyright © 2013 Wi2Wi, Inc.
Wi2Wi, Inc. Rev.1.21
E5
I2S_DOUT
I/O
VIO
I2S Data Output Signal
E6
I2S_DIN
I/O
VIO
I2S Data Input Signal
E7
I2S_LRCLK
I/O
VIO
I2S Audio left/right clock
Master mode: output
Slave mode: input
E8
GND_E8
Ground
Ground
E9
GND_E9
Ground
Ground
E10
HOST_PWR_E10
Power
HOST_PWR
Host Power (3.3V)
F1
SD_D2
I/O
VIO
SDIO 4-bit mode: Data line bit [2] or Read Wait (optional)
SDIO 1-bit mode: Not used
F2
SD_D1
I/O
VIO
SDIO 4-bit mode: Data line bit [1]
SDIO 1-bit mode: Interrupt
F3
RES_F3
NC
NC
Reserved Pin, No Connection Recommended
F4
RES_F4
NC
NC
Reserved Pin, No Connection Recommended
F5
I2S_BCLK
I/O
VIO
I2S Audio bit clock
Master mode: output
Slave mode: input
F6
RESETn
I
VIO
Reset (active low); Minimum pulse width of 100ns needed
to reset the device
F7
SW_RX2
O
VDD30
Receive switch control, connected to
Tx/Rx/BT switch on board (if used)
F8
GND_F8
Ground
Ground
F9
HOST_PWR_F9
Power
HOST_PWR
Host Power (3.3V)
F10
HOST_PWR_F10
Power
HOST_PWR
Host Power (3.3V)
G1
SD_D0
I/O
VIO
SDIO 4-bit mode: Data line bit [0]
SDIO 1-bit mode: Data line
G2
SD_CMD
I/O
VIO
SDIO 4-bit mode: Command/response(input/output)
SDIO 1-bit mode: Command line (input/output)
G3
I2C_DAT
I/O
VIO
I2C Slave-compatible interface data signal
G4
BT_STATE
I
VIO
BT_STATE (input) No Connect
G5
PDn
I
VIO
Full power down (active low)
0 for full power down
1 for normal mode
G6
LNA_EN_2
O
VDD30
RF Control 6: Power Down Output Low
G7
SW_BT
O
VDD30
Bluetooth (BT) switch control, connected to
Tx/Rx/BT switch on board (if used)
G8
HOST_PWR_G8
Power
HOST_PWR
Host Power (3.3V)
G9
HOST_PWR_G9
Power
HOST_PWR
Host Power (3.3V)
G10
HOST_PWR_G10
Power
HOST_PWR
Host Power (3.3V)
H1
SLEEP_CLK
I
VIO
Sleep clock; Supply 32.768 kHz clock to this pin to avoid
hang-up
H2
I2C_CLK
I/O
VIO
I2C Slave-compatible interface clock signal
H3
BT_FREQ
I
VIO
BT_FREQ (input) No Connect
H4
SCLK
I/O
VIO
Serial interface clock output for EEPROM
H5
SDA
I/O
VIO
Serial interface data output for EEPROM
Data Sheet, WLAN-Bluetooth SiP – W2CBW0016
May 17th, 2013
Page 7 of 27
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2013 Wi2Wi, Inc.
Wi2Wi, Inc. Rev.1.21
H6
GND_H6
Ground
Ground
H7
GND_H7
Ground
Ground
H8
SW_TX2
O
VDD30
Transmit switch control, connected to
Tx/Rx/BT switch on board (if used)
H9
GND_H9
Ground
Ground
H10
GND_H10
Ground
Ground
J1
GND_J1
Ground
Ground
J2
BT_GRANTn
O
VIO
BT_GRANTn (output) No Connect
J3
+VIO_J3
Power VIO
3.3V or 1.8V Power Supply
J4
+VIO_J4
Power VIO
3.3V or 1.8V Power Supply
J5
BT_REQ
I
VIO
BT_REQ (input) No Connect
J6
ECSn
O
VDD30
EEPROM chip select output,
active low for SPI EEPROM,
active high for Micro wire EEPROM
J7
HOST_PWR_J7
Power
HOST_PWR
Host Power (3.3V)
J8
HOST_PWR_J8
Power
HOST_PWR
Host Power (3.3V)
J9
GND_J9
Ground
Ground
J10
2.4G_ANT
RF
VIO
2.4 GHz WLAN/BT Antenna
K1
HOST_PWR_K1
Power
HOST_PWR
Host Power (3.3V)
K2
HOST_PWR_K2
Power
HOST_PWR
Host Power (3.3V)
K3
+VIO_K3
Power VIO
3.3V or 1.8V Power Supply
K4
+VIO_K4
Power VIO
3.3V or 1.8V Power Supply
K5
GND_K5
Ground
Ground
K6
+VIO_K6
Power VIO
3.3V or 1.8V Power Supply
K7
+VIO_K7
Power VIO
3.3V or 1.8V Power Supply
K8
+VIO_K8
Power VIO
3.3V or 1.8V Power Supply
K9
GND_K9
Ground
Ground
K10
GND_K10
Ground
Ground
Parameter
Test Condition
MIN
TYP
MAX
UNITS
Absolute Maximum Ratings
Storage Temperature
-40 85
°C
Supply Voltage
-
3.0
4.2
V
Recommended Operating Conditions
Operating Temperature
-40 85
°C
Supply Voltage
2.7
3.0
3.3
V
802.11b Current Consumption
Initialization Current
115
135
150
mA
Continuous Transmit Mode
@11Mbps
230
245
260
mA
Continuous Receive Mode
@11Mbps
120
130
145 mA
Data Sheet, WLAN-Bluetooth SiP – W2CBW0016
May 17th, 2013
4 Electrical Characteristics
Page 8 of 27
Table 2: Electrical Characteristics
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2013 Wi2Wi, Inc.
Wi2Wi, Inc. Rev.1.21
IEEE 802.11 Power Save
Mode
4 5 6
mA
Deep Sleep
1
1.3
1.5 mA
802.11b RF System Specifications
Transmit Power Output
14
15
16
dBm
Receive Sensitivity
1 Mbps, 8% PER
-
-96
-91
dBm
2 Mbps, 8% PER
-
-94
-89
dBm
5.5 Mbps, 8% PER
-
-91
-86
dBm
11 Mbps, 8% PER
-
-86
-82
dBm
Maximum Receive Level
PER<8%
-
IEEE
Compliant
-
dBm
Transmit Frequency Offset
Low, Middle, High
Channels
-
±15
-
Spectral Mask
Max. TX Power
-
-40@fc±11MHz
-
dBc
-
-60@fc±22MHz
-
Error Vector Magnitude
Max. TX Power @
11Mbps
-
-33
-25
dB
Carrier Suppression
Max. TX Power
-28
-25
-21
dBc
Adjacent Channel
Rejection
Desired channel is 3dB
above sensitivity,
11 Mbps, PER<8%
-
48
-
dBc
802.11g Current Consumption
Initialization Current
115
135
150
mA
Continuous Transmit Mode
@54Mbps
225
240
255
mA
Continuous Receive Mode
@54Mbps
120
130
145
mA
IEEE 802.11 Power Save
Mode
4 5 6
mA
Deep Sleep
1
1.3
1.5 mA
802.11g RF System Specifications
Transmit Power Output
11
12
13
dBm
Receive Sensitivity
6 Mbps, 10% PER
-
-90
-86
dBm
9 Mbps, 10% PER
-
-88
-84
dBm
12 Mbps, 10% PER
-
-86
-82
dBm
18 Mbps, 10% PER
-
-84
-79
dBm
24 Mbps, 10% PER
-
-81
-77
dBm
36 Mbps, 10% PER
-
-78
-74
dBm
48 Mbps, 10% PER
-
-75
-71
dBm
54 Mbps, 10% PER
-
-72
-68
dBm
Maximum Receive Level
PER<10%
-
IEEE
Compliant
-
dBm
Transmit Frequency Offset
Low, Middle, High
Channels
-
±15
-
PPM
Spectral Mask
Max. TX Power
-
-30@fc±11MHz
-
dBc
-
-40@fc±20MHz
-
-
-50@fc±30MHz
-
Error Vector Magnitude
Max. TX Power @
54Mbps
-
-30
-25
dB
Data Sheet, WLAN-Bluetooth SiP – W2CBW0016
May 17th, 2013
Page 9 of 27
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2013 Wi2Wi, Inc.
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