Wi2Wi WM825 Users Manual

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Wireless Module

WM825B00

Single-Band (2.4 GHz) Wi-Fi IEEE 802.11 b/g/n

module with integrated antenna

Datasheet

Revision 0.9

February 6, 2017

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Disclaimers

Wi2Wi, Inc. PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE MANAGING DIRECTOR OF Wi2Wi, Inc.

The definitions used herein are: a) Life support devices or systems are devices which (1) are intended for surgical implant into the body, or (2) support or sustain life and whose failure to perform when properly used in accordance with the instructions for use provided in the labeling can reasonably be expected to result in a significant injury to the user. b) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

Wi2Wi does not assume responsibility for use of any of the circuitry described, no circuit patent licenses are implied and Wi2Wi reserves the right at any time to change without notice said circuitry and specifications.

The content of this document is to be treated as strictly confidential and is not to be disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.

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Table of Contents

1. Overview ............................................................................................................................................................. 5

1.1 Features ................................................................................................................................ 5

1.2 IEEE 802.11 Standards............................................................................................................... 5

1.3 Packaging .............................................................................................................................. 6

1.4 Memory .................................................................................................................................. 6

1.5 WLAN MAC ........................................................................................................................... 6

1.6 WLAN Radio .......................................................................................................................... 6

1.7 Peripheral Bus Interfaces ....................................................................................................... 7

2. System Description ............................................................................................................................................. 7

2.1 Block Diagram ....................................................................................................................... 7

2.2 Pin Diagram and Description ................................................................................................. 8

2.3 Physical Dimensions and Pad Locations .............................................................................. 10

3. Electrical Characteristics ................................................................................................................................ 11

4. Voltage Domains .............................................................................................................................................. 12

5. WLAN External Host Interface ...................................................................................................................... 13

5.1 SDIO Timing Diagrams ........................................................................................................ 13

6. WLAN Power-Save Modes .............................................................................................................................. 14

6.1 Full Power-Down Mode2 ...................................................................................................... 14

6.2 IEEE Power Save ................................................................................................................ 14

6.3 Deep Sleep .......................................................................................................................... 15

7. Antenna and Clock .......................................................................................................................................... 15

8. Software Specifications .................................................................................................................................... 15

8.1 Host Processor .................................................................................................................... 17

9. Reference Schematics ...................................................................................................................................... 17

10. Manufacturing Notes ....................................................................................................................................... 18

10.1 Shield Marking ..................................................................................................................... 18

10.2 Storage and Baking Instructions .......................................................................................... 18

10.3 Recommended Reflow Profile .............................................................................................. 18

11. Ordering Information ...................................................................................................................................... 20

12. Data Sheet Status ............................................................................................................................................. 20

13. Certifications .................................................................................................................................................... 21

14. References ......................................................................................................................................................... 22

14.1 Specifications ....................................................................................................................... 22

14.2 Trademarks, Patents and Licenses ...................................................................................... 22

14.3 Disclosures .......................................................................................................................... 22

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Revision

Revision Date

Originator

Changes

0.4

10/13/2016

Initial version Datasheet

0.5

11/21/2016

Added Certification text under Section 13

0.6

12/11/2016

Added a note under Table 2: Electrical Characteristics

0.7

02/02/2017

Matched power numbers to certification testing in Table 2

0.9

02/06/2017

Noted under Certifications that any external antenna via u.FL Conn or RF Pad must be certified, Corrected avg and peak output TX power values in Table 2

List of Figures

Figure 1: Block Diagram ............................................................................................................................ 7

Figure 2 : WM825B00 Module Pin Diagram – Top View ......................................................................... 8

Figure 3: SDIO FS Timing ....................................................................................................................... 13

Figure 4: SDIO HS Timing ....................................................................................................................... 13

Figure 5: Stack Diagram ........................................................................................................................... 16

Figure 6: EVB Reference Schematics ....................................................................................................... 17

Figure 7: Shield Marking – Top View ...................................................................................................... 18

Figure 8: Recommended Reflow Profile .................................................................................................. 19

List of Tables:

Table 1: Pin Description ............................................................................................................................. 8

Table 2: Electrical Characteristics ............................................................................................................ 11

Table 3: 3.3V Voltage Domain Signal Limits .......................................................................................... 12

Table 4: 1.8V Voltage Domain Signal Limits .......................................................................................... 12

Table 5: SDIO Timing Data ...................................................................................................................... 14

Table 6: Ordering Information for Modules ............................................................................................. 20

Table 7: Ordering Information for Evaluation Kits .................................................................................. 20

Revision History:

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1. Overview

WM825B00 is a oplete ieless susyste ith idusty’s est itegatio i a sall fo fato, featuring full 802.11 b/g/n WLAN capabilities with excellent performance. WM825B00 is part of WiWi’s Maximum Performance (MX) series. It includes integrated MAC, baseband, RF front-end, PA, crystal, Tx/Rx switch, filter and OTP memory for calibration data and MAC address storage. This module also has an onboard chip antenna and u.Fl connector. This module is fully optimized to yield excellent throughput and receive sensitivity performance through careful design. It supports SDIO and USB host interfaces. This module is available in industrial, extended and commercial operating temperature variants.

1.1 Features

 Compact design for easy integration: 12.5mm x 16mm x 1.76mm  QFN module with 32pins  Single-band (2.4 GHz) Wi-Fi 802.11 b/g/n  20 MHz channel bandwidth, 1x1 SISO operation  Optimized RF and electrical design for better performance in co-existence with other wireless

standards

 Support for SDIO and USB host interfaces  SDIO HS up to 50 MHz, 4 bit  Antenna Options: Chip Antenna, u.FL Connector, RF Pad  Support for Antenna Diversity  Operating system support for Linux  Support for Station Mode, AP Mode, and Wi-Fi Direct Mode  WEP, WPA, WPA2 (Wi-Fi Protected Access)  Certifications: FCC, IC, CE  Green/ROHS compliant  Internal 38.4 MHz crystal clock  Low power operation: Deep Sleep and IEEE Power Save modes  OTP memory (eliminates need for external EEPROM)  Single power supply of 3.3V

1.2 IEEE 802.11 Standards

 802.11b data rates of 1, 2, 5.5 and 11 Mbps (DSSS/CCK Modulation)  802.11g data rates of 6, 9, 12, 18, 24, 36, 48 and54 Mbps (OFDM Modulation) for multimedia

 802.11g/b performance enhancements  802.11n compliant with maximum data rates up to72.2 Mbps (20 MHz channel)  802.11d international roaming

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content transmission

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 802.11e quality of service  802.11h transmit power control  802.11i enhanced security  802.11k radio resource measurement  802.11n block acknowledgement extension  802.11r fast hand-off for AP roaming  802.11w protected management frames  Fully supports clients (stations) implementing IEEE Power Save mode  Wi-Fi direct connectivity

1.3 Packaging

 32-pins with pads on 3 sides of the module and 4 ground pads in the middle of the module on

the bottom side.

1.4 Memory

 Internal SRAM for TX frame queues/RX data buffers  Boot ROM  OTP

1.5 WLAN MAC

 Simultaneous peer to peer and infrastructure modes  RTS/CTS for operating under DCF  Hardware filtering of 32 multicast addresses.  On-chip TX and RX FIFO for maximum throughput  Open system and shared key authentication services  A-MPDU RX (de-aggregation) and TX (aggregation)  Reduce Inter-Frame Spacing (RIFS) receive  Management information base counters  Radio resource measurement counters  Quality of Service queues  Block acknowledgement extension  Multiple BSSID and multiple station operation  Transmit rate adaption  Long and Short preamble generation on a frame by frame basis for 802.11b frames  Mobile Hotspot

1.6 WLAN Radio

 Integrated Direct Conversion Radio  Integrated T/R switch, PA, and LNA  Integrated Antenna and Antenna Connector

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1.7 Peripheral Bus Interfaces

 Clocked serial unit  UART (debug) interface

2. System Description

WM825B00 is a complete module, combination of the 88W8801 802.11b/g/n,1 x 1 SISO device and all the components needed to operate the radio. It preserves characteristics from the chipset while providing optimized system level functionality and performance.

2.1 Block Diagram

Figure 1 shows a block diagram of WM825B00 module.

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Figure 1: Block Diagram

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Number

Pin Name

Type

Supply

Description

Clock and Reset Signals

SD_CLK

VIO_SD

SDIO 4-bit Mode: Clock input

SDIO 1-bit Mode: Clock input

SDIO SPI Mode: Clock input

HOST_WAKE

AVDD18

Host-to-SoC Wakeup (input)

2.2 Pin Diagram and Description

Figure 2 shows the pin assignments for the 32-pin QFN package

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Figure 2 : WM825B00 Module Pin Diagram – Top View

Table 1: Pin Description

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5, 7

CON[1],

CON[0]

AVDD18

Host Interface Selection

CON[1]

CON[0]

Mode 0 0

UART debug

Reserved

SDIO 1 1

USB

PDN

3.3V

Full Power-Down (active low) 0 = full power-down mode 1 = normal mode Connect to power-down pin of host or 3.3V External host required to drive this pin low for shutdown

Interface Signals

USB_DMNS

I/O

3.3V

USB Serial Differential Data Negative

USB_DPLS

I/O

3.3V

USB Serial Differential Data Positive

SD_CMD

I/O

VIO_SD

SDIO 4-bit Mode: Command/response SDIO 1-bit Mode: Command line USB Mode: USB_VBUS_ON (input)

SD_D0

I/O

VIO_SD

SDIO 4-bit Mode: Data line Bit[0] SDIO 1-bit Mode: Data line

SD_D1

I/O

VIO_SD

SDIO 4-bit Mode: Data line Bit[1] SDIO 1-bit Mode: Interrupt SDO is tri-state when SCSn is inactive Enables multiple devices driving SDO line

SD_D2

I/O

VIO_SD

SDIO 4-bit Mode: Data line Bit[2] or read wait (optional) SDIO 1-bit Mode: Read wait (optional) SDIO SPI Mode: Reserved

SD_D3

I/O

VIO_SD

SDIO 4-bit Mode SDIO Data Line Bit[3] SDIO 1-bit Mode: Reserved SDIO SPI Mode: Card Select (active low)

RF Antenna

Wi-Fi RF PAD

RFSW_CTRL

I/O

VIO

Selects the external RF pad

GPIO Pins

GPIO0

I/O

VIO

*UART Mode: UART_SIN (input), debug only

GPIO1

I/O

VIO

*UART Mode: UART_SOUT (output), debug only Host Wakeup: SoC-to-Host wakeup (output)

GPIO2

I/O

VIO

*TWSI EEPROM Mode: SER_CLK Serial interface clock (input/output)

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GPIO3

I/O

VIO

*TWSI EEPROM Mode: SER_DAT Serial interface data (input/output)

Power

1 , 10, 18,

28, 29

+3.3V

Power

3.3V

3.3V 19

VIO-SD

Power

VIO_SD

Power 3.3V or 1.8V Digital I/O SDIO

VIO

Power

VIO

Power 3.3V or 1.8V Digital I/O SDIO

Ground Pins

2, 21, 22,

23,26, 27, 30

GND

Ground

GND

Ground

33, 34,

35, 36

GND EXPOSED

PADS

Ground

GND

Ground

Note: * marked is not available with the current software

2.3 Physical Dimensions and Pad Locations

 Module Physical Size: 12.5 x 16 x 1.76 mm (including shield)  Solder Pad Size: 0.5 x 0.65 mm  Pad to Pad Space: 0.4 mm  Pad Pitch: 0.9 mm  Last Pad to Module Edge: 0.375 mm  Pad Finish: ENIG (Electro-less Nickel Immersion Gold)  Pads: [ (Three sides (10 + 11 + 11) + 4 Ground Pads in the middle) ]

Note: For Hardware Application notes and module dimensions and symbol library files please contact Wi2Wi sales or send an email to

[email protected]

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Parameter

Test Condition

MIN

TYP

MAX

UNITS

Absolute Maximum Ratings

Storage Temperature

-40 - 85

°C

Supply Voltage +3V_IO

2.7

3.3

4.2

Recommended Operating Conditions

Operating Temperature

Commercial

0 - +70

°C

Extended

-30

+85

°C

Industrial

-40

+85

°C

Supply Voltage +3V_IO

3.0

3.3

3.6

Current Consumption USB Mode

Transmit Mode current

Consumption

Measurements during

Iperf TX with 11Mbps

data rate and max TX

power dBm

369

Receive Mode current

consumption

Measurements during

Iperf RX with 11Mbps

data rate

Current consumption in IEEE

802.11 Power Save Mode1

Deep Sleep Mode

238

Current consumption in MH

(Mobile Hotspot) mode

MH not beaconing and

deep sleep enabled

711

Current consumption in MH

External Station

connected to MH

870

802.11 RF System Specifications

Transmit Power Output

Average

17.64

dBm

Transmit Power Output

Peak

24.93

dBm

Receive Sensitivity

1 Mbps

-94

-97

dBm

Current Consumption SDIO Mode

Transmit Mode current

Consumption

Measurements during

Iperf TX with 11Mbps

data rate and 17.9 dBm

TX power

358

Receive Mode current

consumption

Measurements during

Iperf RX with 11Mbps

data rate

Current consumption in IEEE

802.11 Power Save Mode1

Deep Sleep Mode

Current consumption in MH

(Mobile Hotspot) mode

MH not beaconing and

deep sleep enabled

0.635

Current consumption in MH

External Station

connected to MH

3. Electrical Characteristics

Table 2: Electrical Characteristics

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Min

Typical

Max

Units

Vih 2 -

3.6 V Vil

-0.3

- 1 V

Vihys

300

Voh

2.3

- V Vol

0.4

Min

Typical

Max

Units

Vih

1.2

2.1 V Vil

-0.3

0.6 V Vihys

250

Voh

1.22

Vol

0.4

Note 1: VCC_IO, I VCC_SD are excluded from current measurement.

4. Voltage Domains

Voltage domains and limits of all the signal pins are listed in table 3 and table 4.

Table 3: 3.3V Voltage Domain Signal Limits

Table 4: 1.8V Voltage Domain Signal Limits

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5. WLAN External Host Interface

For connection to a host processor, supports the SDIO HS 4 bit.

5.1 SDIO Timing Diagrams

Figure 3: SDIO FS Timing

Figure 4: SDIO HS Timing

Note: The SDIO-SPI CS Signal timing is identical to all other SDIO inputs

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Symbol

Parameter

Condition

Min

Typical

Max

Units

fpp

Clock Frequency

Normal

MHz

High speed

MHz

TWL

Clock Low Time

Normal

High speed

TWH

Clock High Time

Normal

High speed

ISU

Input Setup Time

Normal

High speed

TIH

Input Hold Time

Normal

High speed

ODLY

Output Delay Time

-- 0 --

Table 5: SDIO Timing Data

Note: Over full range of values specified in the Recommended Operating Conditions, unless otherwise specified.

6. WLAN Power-Save Modes

Three types of power save modes can be used by the WM825B00. They are Full Power-Down mode, IEEE Power Save mode, and Deep Sleep mode. The key difference between the three modes is the current consumption, and the time it takes to the transition from the power save mode to normal WiFi operation.

6.1 Full Power-Down Mode2

In this mode all internal clocks are shutdown, register and memory states are not maintained. Upon exiting power down mode, a reset is automatically performed and a firmware re-download is required to re-enter any of the other modes.

6.2 IEEE Power Save

This mode puts sections of the Wi-Fi into sleep ith peiodi ake mode. This mode is entered when the appropriate command is sent by the host processor to the Wi-Fi.

The device automatically wakes up to receive beacons periodically, and if there is no traffic indicated for the device, it will go back to sleep. Power consumption is dependent on the DTIM value of the AP it is connected to.

When DTIM=1, the device wakes up every 100ms to receive and acknowledge the beacon from AP to maintain association.

Note 2: Power Down mode is for USB mode only.

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6.3 Deep Sleep

This mode puts the complete Wi-Fi section into deep sleep mode, which is the same as the IEEE mode above except there are no periodic wake-ups to receive beacons. Thus it offers lower power consumption than IEEE mode.

This mode is entered when the host processor sends the appropriate command. In deep sleep mode, the device is not listening for packets or beacons from the AP, so it cannot maintain an association with it.

When the host processor sends a command to take the device out of deep sleep mode, the device will have to re-associate with the AP.

7. Antenna and Clock

WM825B00 has an integrated chip antenna, a u.FL connector and an RF pad. WM825B00 has an internal crystal oscillator and requires no external clock source.

8. Software Specifications

Wi2Wi provides all the drivers needed for operating WM825B00. Wi2Wi provides drivers specific to operating systems in the form of source files, which can be cross compiled for different platforms. WiWi also poides usto die deelopet seies ased o ustoes’ euieets. Following is a brief description of the driver features along with the processors, operating systems and host buses. Please contact your sales representative for an up-to-date list of suppoted O“’s ad platforms.

Key Features:

 WEP encryption (64 bit/128 bit)  Simultaneous peer-to-peer and Infrastructure Modes  RTS/CTS for operation under DCF  Hardware filtering of 32 multicast addresses  On-chip Tx and Rx FIFO for maximum throughput  Open System and Shared Key Authentication Services  A-MPDU Rx (de-aggregation) and Tx (aggregation)  Reduced Inter-Frame Spacing (RIFS) receive  Management information base counters  Radio resource measurement counters  Quality of service queues  Block acknowledgement extension  Multiple-BSSID and Multiple-Station operation  Transmit rate adaptation

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 Transmit power control  Long and short preamble generation on a frame-by-frame basis  Mobile hotspot  IEEE power save mode  Deep sleep mode  Infrastructure and ad-hoc mode  Rate adaptation  WPA TKIP security  WPA2  Operating System Support  Driver available for Linux kernel 2.6.24 to 3.13.0

In addition to the end user driver, Wi2Wi also provides, engineering tools needed for production testing and certification.

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Figure 5: Stack Diagram

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8.1 Host Processor

The TCP/IP stack, Ethernet Driver, Security Supplicant, and the 802.11 extensions reside on the host processor. The Hardware Interface driver is partitioned between the host and the module. WLAN firmware for Wi-Fi is downloaded through the host interface (SDIO or USB) by the Hardware Interface Driver at power up. Once the firmware is downloaded, the Data Path and the Control Path between the host and Wi-Fi are established, and information can flow between the two devices.

9. Reference Schematics

The Figure 6 below shows the WM825B00's reference schematics.

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Figure 6: EVB Reference Schematics

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10. Manufacturing Notes

10.1 Shield Marking

Figure 7: Shield Marking – Top View

YY indicates Year WW indicates Work Week

 -I indicates Industrial operating temperature range (-40°C to +85°C)  -E indicates Extended operating temperature range (-30°C to +85°C)  -C indicates Commercial operating temperature range (0°C to +70°C)  3 indicates Chip Antenna and u.FL connector

10.2 Storage and Baking Instructions

WM825B00 is an MSL3 qualified package.

 After opening the bag, the parts should be stored as per J-STD-033 standard, and mounted

within 168 hous of fatoy oditios (≤ 0°C, 0% RH)

 If the parts have been exposed in transit, they need to be baked at 125°C for 16 hours

10.3 Recommended Reflow Profile

Assembly Guidelines:

1. Follow solder paste manufacturers recommended profile a. All RoHS solder pastes contain the same basic chemistry; however, each manufacturer may

have a recommended reflow profile that performs best for their product

2. The profile illustrated below is for reference only

a. There is no one profile that fits all scenarios

3. Profiles must be dialed in to the specific assembly type

4. ENIG finishes are more susceptible to voids and air entrapment a. Selecting a RoHS solder paste that is ENIG opatile is eoeded

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Figure 8: Recommended Reflow Profile

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Part Order Number

Operating Temperature Range

Packaging Method

WM825-B00-I3QT

Industrial: -40°C to +85°C

Tray

WM825-B00-I3QR

Industrial: -40°C to +85°C

Tape & Reel

WM825-B00-E3QT

Extended: -30°C to +85°C

Tray

WM825-B00-E3QR

Extended: -30°C to +85°C

Tape & Reel

WM825-B00-C3QT

Commercial: 0°C to +70°C

Tray

WM825-B00-C3QR

Commercial: 0°C to +70°C

Tape & Reel

Part Order

Number

Contents of the Evaluation Kit

Packaging

Method

WM825-B00-EVK3

WM825-B00-I3 Module on Evaluation Board,

2.4 GHz Rubber Duck Antenna, u.FL connector cable and USB-A / Micro-AB Cable

Box

WM825-B00-DVK3

WM825-B00-EVK3 and

i.MX6 development platform with

all software and collaterals

Box

11. Ordering Information

Table 6: Ordering Information for Modules

Table 7: Ordering Information for Evaluation Kits

12. Data Sheet Status

Wi2Wi, Inc. reserves the right to change the specification without prior notice in order to improve the design and supply the best possible product. Updated information, firmware and release notes will be made available on www.wi2wi.com. Please check with Wi2Wi Inc. for the most recent data before initiating or completing a design.

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13. Certifications

WM825B00 complies with the following standards:

FCC: 15C IC: RSS-247 CE: EN 300 328 v1.9.1, EN 301 489-1 v1.9.2

EN 301 489-17 v2.2.1, EN 60950-1

FCC Statement:

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

- Consult the dealer or an experienced radio/TV technician for help.

The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Wi2Wi ay oid the use’s authoity to opeate the euipent.

IC Statement:

English:

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:

1. This device may not cause harmful interference;

2. This device must accept any interference received, including interference that may cause undesired operation of the device.

Français:

Cet appareil est conforme à Industrie Canada une licence standard RSS exonérés (s). Son fonctionnement est soumis aux deux conditions suivantes:

1. Cet appareil ne doit pas provoquer d'interférences;

2. Cet appareil doit accepter toute interférence reçue, y compris les interférences pouvant provoquer un fonctionnement indésirable de l'appareil.

RF Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must be at least 20 cm from the user and must not be co-located or operating in

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conjunction with any other antenna or transmitter. The information in this guide may change without notice. The manufacturer assumes no responsibility for any errors that may appear in this guide.

Integrator Guidance:

 All certifications apply to the integrated chip antenna only. Customers using any optional

external antenna connecting via the onboard u.FL connector or the RF Pad must get their antenna certified themselves.

 Only the antenna(s) described in the filings under this FCC ID or equivalent antenna(s) with

equal or lesser gain may be used with this transmitter. Any new antenna type, or higher gain antenna would require a Class II permissive change.

 If the operation of the equipment is for portable use (within 20 cm of user), or where co-

location configuration use is required; the end product, including the transmitter will require re-evaluation in accordance to the FCC rules.

Labeling:

The final end product must be labeled in a visible area with the following text: Cotais FCC ID: URWM825, IC: 7089A-WM, where:

 U9RWM825is the approved FCC ID of this module  7089A-WM825 is the approved IC ID of this module

The grantee's FCC/IC ID can be used only when all FCC/IC compliance requirements are met.

14. References

14.1 Specifications

IEEE 802.11 b/g/n Wireless LAN Specification SDIO HS 4-bit Specification

14.2 Trademarks, Patents and Licenses

Trademarks: Wi-Fi

14.3 Disclosures

WM825-B00-EVK3:Evaluation Kit WM825-B00-DVK3: Development Kit

The specification maximum and minimum limits presented herein are those guaranteed when the unit is itegated ito the WiWi’s Development System. These limits are to serve as representative performance characteristics of the WM825B00 he popely desiged ito a ustoe’s podut. Wi2Wi makes no warranty, implied or otherwise specified, with respect to design and performance characteristics presented in this specification when used in customer designs.

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