Wi2Wi W2CBW0015 Users Manual
Wi2Wi, Inc. Rev.1.51
Data Sheet, WLAN-Bluetooth SiP – W2CBW0015
July 26th, 2012
Preliminary Product Datasheet
Revision 1.51
July 26, 2012
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2012 Wi2Wi, Inc.
Page 1 of 25
Wi2Wi, Inc. Rev.1.51
Data Sheet, WLAN-Bluetooth SiP – W2CBW0015
July 26th, 2012
Table of Contents
1
General Description ........................................................................................................... 4
2
Features .............................................................................................................................. 4
3 System Description ............................................................................................................ 5
3.1
Block Diagram .......................................................................................................................... 5
3.2 Pad Description ........................................................................................................................ 5
4 Electrical Characteristics .................................................................................................. 8
5
WLAN External Host Interfaces .................................................................................... 11
5.1
SDIO Interface........................................................................................................................ 11
5.2 SDIO Protocol Timing Diagrams ............................................................................................ 12
6
Bluetooth Interfaces ........................................................................................................ 13
6.1
SDIO Interface........................................................................................................................ 13
6.2
PCM Interface ........................................................................................................................ 13
7
Antenna and Clock .......................................................................................................... 14
7.1
Wireless LAN.......................................................................................................................... 14
7.2
Bluetooth ................................................................................................................................ 14
8
WLAN Software Architecture ........................................................................................ 16
8.1
Host Processor ....................................................................................................................... 16
9 Reference Schematics ...................................................................................................... 17
10 Manufacturing Notes ....................................................................................................... 18
10.1
Physical SiP Dimensions and Pad Locations ........................................................................ 18
10.2 Physical Shield Dimensions
10.3 Shield Landing Pattern
10.4 Tray Orientation
10.5 Tape and Reel Orientation
10.6
Storage and Baking Instructions ............................................................................................ 23
10.7 Recommended Reflow Profile ................................................................................................ 23
...................................................................................................................... 20
11 Disclaimers ....................................................................................................................... 24
11.1
Data Sheet Status .................................................................................................................. 24
12
Ordering Information
12.1
Development Kit ..................................................................................................................... 24
13 Certifications .................................................................................................................... 25
14 References ......................................................................................................................... 25
14.1
Specifications ......................................................................................................................... 25
14.2 Trademarks, Patents and Licenses ....................................................................................... 25
................................................................................................... 19
......................................................................................................... 20
..................................................................................................... 22
................................................................................................... 24
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2012 Wi2Wi, Inc.
Page 2 of 25
Wi2Wi, Inc. Rev.1.51
Revision
Revision Date
Originator
Changes
0.1
10/24/2011
WJL
First production data-sheet version
0.11
11/07/2011
DDS
Updated Pin Description, Added Reference
Schematics
1.41
03/16/2012
DDS
Updated text and figures to remove all references to
UART and GSPI
1.42
03/16/2012
WJL
Removed references to GSPI and UART
1.43
03/23/2012
DDS
Updated Figure 8, by adding Top View of the SiP
1.44
05/01/2012
DDS
Updated 802.11n Receiver Sensitivity, Bluetooth
test parameters and Added Dev-Kit info.
1.45
05/15/2012
DDS
Updated Part Ordering Information, Added shield
dimensions and shield landing pattern
1.48
06/06/2012
DDS
Added Tray and Tape & Reel Orientation figures
1.5
06/13/2012
DDS
Updated block diagram and corrected text
1.51
07/26/2012
DDS
Updated dimensions for shield solder landing pads
Data Sheet, WLAN-Bluetooth SiP – W2CBW0015
July 26th, 2012
List of Figures:
Figure 1: Block Diagram ................................................................................................................ 5
Figure 2: SDIO Protocol Timing .................................................................................................. 12
Figure 3: Software Architecture.................................................................................................... 16
Figure 4: Box Diagram ................................................................................................................. 17
Figure 5: Top View of Pads .......................................................................................................... 17
Figure 6: Initialization Configuration ........................................................................................... 18
Figure 7: SDIO Interface .............................................................................................................. 18
Figure 8: Physical Dimensions and Pad Locations ....................................................................... 19
Figure 9: Physical Shield Dimensions .......................................................................................... 19
Figure 10: Shield Landing Pattern ................................................................................................ 20
Figure 11: IC Orientation on Tray ................................................................................................ 20
Figure 12: Carrier Tray Package Outline Drawing ....................................................................... 21
Figure 13: IC Orientation on Tape and Reel ................................................................................. 22
Figure 14: Leader and Trailer ....................................................................................................... 22
Figure 15: Carrier Tape Package Outline Drawing ...................................................................... 22
Figure 16: Recommended Reflow Profile .................................................................................... 23
List of Tables:
Table 1: Pad Description ................................................................................................................. 5
Table 2: Electrical Characteristics .................................................................................................. 8
Table 3: SDIO Pin Map ................................................................................................................ 11
Table 4: SDIO Timing Data .......................................................................................................... 13
Revision History:
Page 3 of 25
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2012 Wi2Wi, Inc.
Wi2Wi, Inc. Rev.1.51
Data Sheet, WLAN-Bluetooth SiP – W2CBW0015
July 26th, 2012
1
General Description
This specification provides a general guideline on the performance and integration of
W2CBW0015, a complete wireless subsystem featuring full 802.11 b/g/n WLAN as well as
Class 1.0/2.0/3.0 Bluetooth capabilities in a small form factor SiP solution. The W2CBW0015
device was designed to simplify the process of adding wireless access to systems without
lengthy design cycles or complex RF design. Both radios are fully tested for coexistence,
internally and with other external radio technologies. A set of regulatory certifications will
also be provided, simplifying the certification process for your end product and further
reducing valuable time-to-market. Based on world-class silicon from Wi2Wi partner
Marvell, the W2CBW0015 has been fully optimized for throughput and receive sensitivity via
careful design practices. State-of-the art software development resources are available to
create drivers for unique processors and operating systems if needed, or to optimize the
wireless subsystem to fit your application.
Specified maximum and minimum limits presented herein are those guaranteed when the unit is
integrated into Wi2Wi’s W2CBW0015-Dev(1/2) Development System. These limits are to
serve as representative performance characteristics of the W2CBW0015 when properly designed
into a customer’s product. Wi2Wi makes no warranty, implied or otherwise specified, with
respect to customer’s design and performance characteristics presented in this specification.
2
Features
Extended Temperature Operation: -30°C to +85°C
Compact design for easy integration: 9.5mm x 9.5mm x 1.4mm
81 Pad LGA surface mount package
WLAN technology based on Marvell’s 88W8787
Bluetooth technology based on Marvell’s 88W8787
Single antenna design for WLAN and Bluetooth
Operates in 2.4 GHz ISM band
ROHS Compliant
WLAN Specific Features
o
SDIO 1.1 Interfaces
o
802.11s Mesh Networking
o
802.11h Dynamic Frequency Selection
o
802.11e Quality of Service
o
50-Ohm antenna launch
o
Support for Linux and Android operating systems
o
1, 2, 5.5 and 11 Mbps data rates for 802.11b (DSSS/CCK modulation)
o
6, 9, 12, 18, 24, 36, 48 and 54 Mbps data rates for 802.11g (OFDM modulation)
o
72 Mbps, 150 Mbps data rates for 802.11n (OFDM modulation)
Bluetooth Specific Features
o
HCI Layer Support
o
GFSK modulation for Bluetooth version 2.1
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2012 Wi2Wi, Inc.
Page 4 of 25
Wi2Wi, Inc. Rev.1.51
Pin
Pin Name
Type Supply
Description
A1
BT_LED
O
VIO
LED Indicator for Bluetooth
A2
I2S_MCLK
I/O
VIO
I2S Master Clock (output)
A3
PCM_DOUT
I/O
VIO
PCM Data Output Signal
A4
RES_A4
NC
NC
Reserved Pin, No Connection Recommended
A5
GND_A5
Ground
Ground
A6
RES_A6
NC
NC
Reserved Pin, No Connection Recommended
A7
RES_A7
NC
NC
Reserved Pin, No Connection Recommended
A8
GND_A8
Ground
Ground
Data Sheet, WLAN-Bluetooth SiP – W2CBW0015
July 26th, 2012
o
Data rate up to 1 Mbps for Bluetooth version 2.1
o
Data rate up to 3 Mbps for Bluetooth EDR
o
Data rate up 24 Mbps for Bluetooth AMP
o
Support for Class 1.5 Bluetooth (i.e., Class 1 up to 10dBm)
3 System Description
W2CBW0015 is a complete SiP solution that uses Marvell 88W8787 to implement 802.11 b/g/n
and Bluetooth functions. It includes
preserves the characteristics from the Marvell chipset while providing optimized system level
functionality and performance.
all the components needed to operate both radios. It
3.1
Figure 1
Block Diagram
shows the block diagram of W2CBW0015
Figure 1: Block Diagram
.
3.2 Pad Description
Page 5 of 25
Table 1: Pad Description
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2012 Wi2Wi, Inc.
Wi2Wi, Inc. Rev.1.51
A9
RES_A9
NC
NC
Reserved Pin, No Connection Recommended
B1
3V_IN_B1
Power
HOST_PWR
Host Power (3.3V)
B2
3V_IN_B2
Power
HOST_PWR
Host Power (3.3V)
B3
3V_IN_B3
Power
HOST_PWR
Host Power (3.3V)
B4
PCM_DIN
I/O
VIO
PCM Data Input Signal
B5
I2S_LRCLK
I/O
VIO
I2S Audio left/right clock
Master mode: output
Slave mode: input
B6
GND_B6
Ground
Ground
B7
WF_LED
O
VIO
LED Indicator for Wi-Fi
B8
RES_B8
NC
NC
Reserved Pin, No Connection Recommended
B9
I2S_BCLK
I/O
VIO
I2S Audio bit clock
Master mode: output
Slave mode: input
C1
3V_IN_C1
Power
HOST_PWR
Host Power (3.3V)
C2
3V_IN_C2
Power
HOST_PWR
Host Power (3.3V)
C3
3V_IN_C3
Power
HOST_PWR
Host Power (3.3V)
C4
3V_IN_C4
Power
HOST_PWR
Host Power (3.3V)
C5
GND_C5
Ground
Ground
C6
PWDET_2G
I
VIO
2.4 GHz PA Power Detection Signal (analog input)
C7
RES_C7
NC
NC
Reserved Pin, No Connection Recommended
C8
CLK_REQ
I/O
VIO
Oscillator Mode (active low, output)
0: disable external oscillator
1: enable external oscillator
C9
RES_C9
NC
NC
Reserved Pin, No Connection Recommended
D1
3V_IN_D1
Power
HOST_PWR
Host Power (3.3V)
D2
3V_IN_D2
Power
HOST_PWR
Host Power (3.3V)
D3
GND_D3
Ground
Ground
D4
PCM_CLK
I/O
VIO
PCM Clock Signal
Output if PCM master, Input if PCM slave
D5
GND_D5
Ground
Ground
D6
GND_D6
Ground
Ground
D7
W1_CNTL
O
VIO
Power management device
programming interface control
D8
VIO_D8
Power VIO
3.3V or 1.8V Power Supply
D9
I2S_DOUT
I/O
VIO
I2S Data Output Signal
E1
3V_IN_E1
Power
HOST_PWR
Host Power (3.3V)
E2
LNA_EN_2
O
VDD30
RF Control 6: Power Down Output Low
E3
SD_D3
I/O
VIO
SDIO 4-bit mode: Data line bit [3]
SDIO 1-bit mode: Not used
SDIO SPI mode: Chip select (active low)
E4
PCM_SYNC
I/O
VIO
PCM Sync Pulse Signal
Output if PCM master, Input if PCM slave
E5
RES_E5
NC
NC
Reserved Pin, No Connection Recommended
E6
RES_E6
NC
NC
Reserved Pin, No Connection Recommended
E7
GND_E7
Ground
Ground
Data Sheet, WLAN-Bluetooth SiP – W2CBW0015
July 26th, 2012
Page 6 of 25
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2012 Wi2Wi, Inc.
Wi2Wi, Inc. Rev.1.51
E8
VIO_E8
Power VIO
3.3V or 1.8V Power Supply
E9
I2S_DIN
I/O
VIO
I2S Data Input Signal
F1
SW_TX2
O
VDD30
Transmit switch control, connected to
Tx/Rx/BT switch on board (if used)
F2
SW_RX2
O
VDD30
Receive switch control, connected to
Tx/Rx/BT switch on board (if used)
F3
RESETn
I
VIO
Reset (active low); Minimum pulse width of 100ns needed
to reset the device
F4
BT_GRANTn
O
VIO
BT_GRANTn (output) No Connect
F5
GND_F5
Ground
Ground
F6
SCLK
I/O
VIO
Serial interface clock output for EEPROM
F7
BT_FREQ
I
VIO
BT_FREQ (input) No Connect
F8
SD_D0
I/O
VIO
SDIO 4-bit mode: Data line bit [0]
SDIO 1-bit mode: Data line
SDIO SPI mode: Data output
F9
SD_D2
I/O
VIO
SDIO 4-bit mode: Data line bit [2] or Read Wait (optional)
SDIO 1-bit mode: Not used
SDIO SPI mode: Chip select (active low)
G1
SW_BT
O
VDD30
Bluetooth (BT) switch control, connected to
Tx/Rx/BT switch on board (if used)
G2
ECSn
O
VDD30
EEPROM chip select output,
active low for SPI EEPROM,
active high for Micro wire EEPROM
G3
I2C_CLK
I/O
VIO
I2C Slave-compatible interface clock signal
G4
RES_G4
NC
NC
Reserved Pin, No Connection Recommended
G5
RES_G5
NC NC
Reserved Pin, No Connection Recommended
G6
GND_G6
Ground
Ground
G7
BT_REQ
I
VIO
BT_REQ (input) No Connect
G8
SD_CLK
I/O
VIO
SDIO 4-bit mode: Clock input
SDIO 1-bit mode: Clock input
SDIO SPI mode: Clock input
G9
SD_CMD
I/O
VIO
SDIO 4-bit mode: Command/response(input/output)
SDIO 1-bit mode: Command line (input/output)
SDIO SPI mode: Data input
H1
GND_H1
Ground
Ground
H2
GND_H2
Ground
Ground
H3
GND_H3
Ground
Ground
H4
3V_IN_H4
Power
HOST_PWR
Host Power (3.3V)
H5
3V_IN_H5
Power
HOST_PWR
Host Power (3.3V)
H6
I2C_DAT
I/O
VIO
I2C Slave-compatible interface
data signal
H7
SDA
I/O
VIO
Serial interface data output for EEPROM
H8
VIO_H8
Power
VIO
3.3V or 1.8V Power Supply
H9
SLEEP_CLK
I
VIO
Sleep clock; Supply 32.768 kHz clock to this pin to avoid
hang-up
J1
GND_J1
Ground
Ground
Data Sheet, WLAN-Bluetooth SiP – W2CBW0015
July 26th, 2012
Page 7 of 25
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2012 Wi2Wi, Inc.
J2
2.4G_ANT
RF
VIO
2.4 GHz WLAN/BT Antenna
J3
GND_J3
Ground
Ground
J4
3V_IN_J4
Power
HOST_PWR
Host Power (3.3V)
J5
3V_IN_J5
Power
HOST_PWR
Host Power (3.3V)
J6
BT_STATE
I
VIO
BT_STATE (input) No Connect
J7
PDn
I
VIO
Full power down (active low)
0 for full power down
1 for normal mode
J8
GND_J8
Ground
Ground
J9
SD_D1
I/O
VIO
SDIO 4-bit mode: Data line bit [1]
SDIO 1-bit mode: Interrupt
SDIO SPI mode: Interrupt
Parameter
Test Condition
MIN
TYP
MAX
UNITS
Absolute Maximum Ratings
Storage Temperature
-40 85
°C
Supply Voltage
-
3.0
4.2
V
Recommended Operating Conditions
Operating Temperature
-30 85
°C
Supply Voltage
2.7
3.0
3.3
V
802.11b Current Consumption
Initialization Current
115
135
150
mA
Continuous Transmit Mode
@11Mbps
230
245
260
mA
Continuous Receive Mode
@11Mbps
120
130
145 mA
IEEE 802.11 Power Save
Mode
4 5 6
mA
Deep Sleep
1
1.3
1.5 mA
802.11b RF System Specifications
Transmit Power Output
14
15
16
dBm
Receive Sensitivity
1 Mbps, 8% PER
-
-96
-91
dBm
2 Mbps, 8% PER
-
-94
-89
dBm
5.5 Mbps, 8% PER
-
-91
-86
dBm
11 Mbps, 8% PER
-
-86
-82
dBm
Maximum Receive Level
PER<8%
-
IEEE
Compliant
-
dBm
Transmit Frequency Offset
Low, Middle, High
Channels
-
±15
-
Spectral Mask
Max. TX Power
-
-40@fc±11MHz
-
dBc
-
-60@fc±22MHz
-
Error Vector Magnitude
Max. TX Power @
11Mbps
-
-33
-25
dB
4 Electrical Characteristics
Table 2: Electrical Characteristics
Wi2Wi, Inc. Rev.1.51
Data Sheet, WLAN-Bluetooth SiP – W2CBW0015
July 26th, 2012
Page 8 of 25
The content of this document is to be treated as strictly confidential and is not to be
disclosed, reproduced or used, except as authorized in writing by Wi2Wi, Inc.
Copyright © 2012 Wi2Wi, Inc.
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