VISHAY VIS LTO050F10R00 Datasheet

LTO 50

Vishay Sfernice

Power Resistor Thick Film Technology

LTO series are the extension of RTO types. We used the direct
ceramic mounting design (no metal tab) of our RCH power
resistors applied to semiconductor packages.

DIMENSIONS in millimeters

10.4

FEATURES

• 50 Watt at 25 °C Case Temperature Heatsink
Mounted

• Direct mounting ceramic on heatsink

• Broad Resistance Range: R010 to 550K

• Non Inductive

• TO-220 package: Compact and easy to mount

• RoHS compliant

• Isolated case

3.2

RoHS

COMPLIANT

Ø3.2

5.08

MECHANICAL SPECIFICATIONS

Mechanical Protection Molded

Resistive Element Thick Film

Substrate Alumina

Connections Tinned Copper

Weight 2 g max.

Mounting Torque 1 N-m

DIMENSIONS

Standard Package TO-220
Isolated case

ENVIRONMENTAL SPECIFICATIONS

Temperature Range - 55 °C to + 150 °C

Climatic Category 55/155/56

3.2

16.2

1.3

3.5

0.8

• Tolerance unless otherwise specifi ed: ± 0.3 mm

12.7

0.6

1.8

ELECTRICAL SPECIFICATIONS

Resistance Range 0.010 Ω to 550 kΩ

Tolerances (Standard) ± 1 % to ± 10 %

Dissipation and Associated Onto a heatsink

Power Rating 50 W at + 25 °C (case temperature)
and Thermal Resistance R
of the component free air:

2.5 W at + 25 °C

Temperature Coeffi cient See Performance table

Standard ± 150 ppm/°C

Limiting Element Voltage 250 V

Dielectric Strength
MIL STD 202

Insulation Resistance ≥ 104 MΩ

Inductance ≤ 0.1 µH

Critical Resistance 1.25 kΩ

1500 V

TH (j-c): 2.5 °C/W

RMS - 1 minute - 10 mA max.

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For technical questions, contact [e-mail]

Document Number: 50050

Revision 30-May-06

LTO 50

Power Resistor Thick Film Technology

PERFORMANCE

TESTS CONDITIONS TYPICAL DRIFTS

Momentary Overload

1.5 Pr/5 s
Us < 1.5 UL

EN60115-1

Rapid Temperature Change

5 cycles

- 55 °C to + 155 °C

Load Life

1000 h Pr at + 25 °C

Humidity (Steady State)

Method 103 B Cond. D

Vibration

Method 204 Cond. D

Terminal Strength

Method 211 Cond. A1

Shock

Method 213 Cond. I

EN60115-1

MIL STD 202

100G, MIL STD 202

EN60115-1

IEC 60068-2-14 Tests Na

MIL STD 202

MIL STD 202

± (0.5 % + 0.005 Ω)

± (0.5 % + 0.005 Ω)

± (1 % + 0.005 Ω)

± (0.5 % + 0.005 Ω)

± (0.2 % + 0.005 Ω)

± (0.2 % + 0.005 Ω)

± (0.5 % + 0.005 Ω)

Vishay Sfernice

SPECIAL FEATURES

Resistance Values ≥ 0.010 ≥ 0.015 ≥ 0.1 ≥ 0.5

Tolerances ± 1 % at ± 10 %

Typical Temperature

± 900 ppm/°C ± 700 ppm/°C ± 250 ppm/°C ± 150 ppm/°C

Coeffi cient
(- 55 °C/+ 150 °C)

CHOICE OF THE HEATSINK

The user must choose according to the working conditions of the component (power, room temperature).

Maximum working temperature must not exceed 155 °C. The dissipated power is simply calculated by the following ratio:

P =

[R

ΔT

TH (j-c) + RTH (c-a)]

P: expressed in W

ΔT: difference between maximum working temperature and room temperature.

TH: (j-c): thermal resistance value measured between resistive layer and outer side of the resistor. It is the thermal

R
resistance of the component.

TH: (c-a): thermal resistance value measured between outer side of the resistor and room temperature. It is the

R
thermal resistance of the heatsink itself (type, shape), the quality of the fastening device, and the thermal resistance of the
thermal compound.

Example:

TH: (c-a) for LTO50 power rating 10 W at ambient temperature + 30 °C.

R

Thermal resistance R

TH (j-c): 2.5 °C/W

Considering equation (1) we have:

R

with a thermal grease R

ΔT = 155 °C - 30 °C = 125 °C

TH (j-c) + RTH (c-a) = = = 12.5 °C/W

R

TH (c-a) = 12.5 °C/W - 2.5 °C/W = 10 °C/W

TH (c - h) = 1 °C/W, we need a heat sink with RTH (h - a) = 9 °C/W.

ΔTP125

10

(1)

Document Number: 50050
Revision 30-May-06

For technical questions, contact [e-mail]

www.vishay.com

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LTO 50

Vishay Sfernice

Power Resistor Thick Film Technology

OVERLOADS

In any case the applied voltage must be lower than the maximum overload voltage of 375V.
The values indicated on the graph below are applicable to resistors in air or mounted onto a heatsink.

ENERGY CURVE

10

1

ENERGY IN JOULES

0.1

0.01
10

-6

OVERLOAD DURATION IN SECONDS

10

-5

10-4 10

-3

10

-2

POWER RATING CHART

The temperature of the heatsink should be maintained within the limits specifi ed.
To improve the thermal conductivity, surfaces in contact should be coated with a silicone grease and the torque applied on the
screw for tightening should be around 1 Nm.

100

75

50

% RATED POWER

25

0

0 25 40 60 80 100 120 140 155

HEATSINK TEMPERATURE IN DEGREES CELSIUS

MARKING

Model, Style, Resistance Value (in Ω), Tolerance (in %), Manufacturing Date, VISHAY trademark.

PACKAGING

Tube of 50 units

ORDERING INFORMATION

LTO 50 F 100 kΩ ± 1 % xxx TU50 e3

MODEL STYLE CONNECTIONS RESISTANCE VALUE TOLERANCE CUSTOM DESIGN PACKAGING LEAD (Pb)-FREE

± 1 % Optional
± 2 % on request:
± 5 % special TCR,
± 10 % shape etc.

SAP PART NUMBERING GUIDELINES

L

SAP Part Number LTO050F10002FTE3

T

O

0

MODEL STYLE CONNECTIONS RESISTANCE

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5

0

F

1000

VALUE

For technical questions, contact [e-mail]

2

FT

TOL PACK

LEAD (Pb)-FREE

Document Number: 50050

Revision 30-May-06

E3

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Vishay

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or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.

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Document Number: 91000 www.vishay.com
Revision: 08-Apr-05 1