VISHAY VIS LTO050F10R00 Datasheet
LTO 50
Vishay Sfernice
Power Resistor Thick Film Technology
LTO series are the extension of RTO types. We used the direct
ceramic mounting design (no metal tab) of our RCH power
resistors applied to semiconductor packages.
DIMENSIONS in millimeters
10.4
FEATURES
• 50 Watt at 25 °C Case Temperature Heatsink
Mounted
• Direct mounting ceramic on heatsink
• Broad Resistance Range: R010 to 550K
• Non Inductive
• TO-220 package: Compact and easy to mount
• RoHS compliant
• Isolated case
3.2
RoHS
COMPLIANT
Ø3.2
5.08
MECHANICAL SPECIFICATIONS
Mechanical Protection Molded
Resistive Element Thick Film
Substrate Alumina
Connections Tinned Copper
Weight 2 g max.
Mounting Torque 1 N-m
DIMENSIONS
Standard Package TO-220
Isolated case
ENVIRONMENTAL SPECIFICATIONS
Temperature Range - 55 °C to + 150 °C
Climatic Category 55/155/56
3.2
16.2
1.3
3.5
0.8
• Tolerance unless otherwise specifi ed: ± 0.3 mm
12.7
0.6
1.8
ELECTRICAL SPECIFICATIONS
Resistance Range 0.010 Ω to 550 kΩ
Tolerances (Standard) ± 1 % to ± 10 %
Dissipation and Associated Onto a heatsink
Power Rating 50 W at + 25 °C (case temperature)
and Thermal Resistance R
of the component free air:
2.5 W at + 25 °C
Temperature Coeffi cient See Performance table
Standard ± 150 ppm/°C
Limiting Element Voltage 250 V
Dielectric Strength
MIL STD 202
Insulation Resistance ≥ 104 MΩ
Inductance ≤ 0.1 µH
Critical Resistance 1.25 kΩ
1500 V
TH (j-c): 2.5 °C/W
RMS - 1 minute - 10 mA max.
www.vishay.com
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For technical questions, contact sfer@vishay.com
Document Number: 50050
Revision 30-May-06
LTO 50
Power Resistor Thick Film Technology
PERFORMANCE
TESTS CONDITIONS TYPICAL DRIFTS
Momentary Overload
1.5 Pr/5 s
Us < 1.5 UL
EN60115-1
Rapid Temperature Change
5 cycles
- 55 °C to + 155 °C
Load Life
1000 h Pr at + 25 °C
Humidity (Steady State)
Method 103 B Cond. D
Vibration
Method 204 Cond. D
Terminal Strength
Method 211 Cond. A1
Shock
Method 213 Cond. I
EN60115-1
MIL STD 202
100G, MIL STD 202
EN60115-1
IEC 60068-2-14 Tests Na
MIL STD 202
MIL STD 202
± (0.5 % + 0.005 Ω)
± (0.5 % + 0.005 Ω)
± (1 % + 0.005 Ω)
± (0.5 % + 0.005 Ω)
± (0.2 % + 0.005 Ω)
± (0.2 % + 0.005 Ω)
± (0.5 % + 0.005 Ω)
Vishay Sfernice
SPECIAL FEATURES
Resistance Values ≥ 0.010 ≥ 0.015 ≥ 0.1 ≥ 0.5
Tolerances ± 1 % at ± 10 %
Typical Temperature
± 900 ppm/°C ± 700 ppm/°C ± 250 ppm/°C ± 150 ppm/°C
Coeffi cient
(- 55 °C/+ 150 °C)
CHOICE OF THE HEATSINK
The user must choose according to the working conditions of the component (power, room temperature).
Maximum working temperature must not exceed 155 °C. The dissipated power is simply calculated by the following ratio:
P =
[R
ΔT
TH (j-c) + RTH (c-a)]
P: expressed in W
ΔT: difference between maximum working temperature and room temperature.
TH: (j-c): thermal resistance value measured between resistive layer and outer side of the resistor. It is the thermal
R
resistance of the component.
TH: (c-a): thermal resistance value measured between outer side of the resistor and room temperature. It is the
R
thermal resistance of the heatsink itself (type, shape), the quality of the fastening device, and the thermal resistance of the
thermal compound.
Example:
TH: (c-a) for LTO50 power rating 10 W at ambient temperature + 30 °C.
R
Thermal resistance R
TH (j-c): 2.5 °C/W
Considering equation (1) we have:
R
with a thermal grease R
ΔT = 155 °C - 30 °C = 125 °C
TH (j-c) + RTH (c-a) = = = 12.5 °C/W
R
TH (c-a) = 12.5 °C/W - 2.5 °C/W = 10 °C/W
TH (c - h) = 1 °C/W, we need a heat sink with RTH (h - a) = 9 °C/W.
ΔTP125
10
(1)
Document Number: 50050
Revision 30-May-06
For technical questions, contact sfer@vishay.com
www.vishay.com
15
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