VISHAY VIS CRCW06032K0 Datasheet

D/CRCW e3

Vishay

Standard Thick Film Chip Resistors

FEATURES

 Stability R/R = 1 % for 1000 h at 70 ° C

 2 mm pitch packaging option for 0603 size

 Pure tin solder contacts on Ni barrier layer

provides compatibility with lead (Pb)-free and lead
containing soldering processes

 Metal glaze on high quality ceramic

 AEC-Q200 qualified

 Material categorization: For definitions of compliance

please see www.vishay.com/doc?99912

STANDARD ELECTRICAL SPECIFICATIONS

SIZE RATED

MODEL

D10/CRCW0402 0402 RR 1005M

D11/CRCW0603 0603 RR 1608M

D12/CRCW0805 0805 RR 2012M

D25/CRCW1206 1206 RR 3216M

CRCW1210 1210 RR 3225M

CRCW1218 1218 RR 3246M

CRCW2010 2010 RR 5025M

CRCW2512 2512 RR 6332M

Notes

 These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over

operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.

 Marking: See data sheet “Surface Mount Resistor Marking” (document number 20020).

 Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.

INCH METRIC

DISSIPATION

P

70 °C

W

0.063 50

Zero-Ohm-Resistor: R

0.10 75

Zero-Ohm-Resistor: R

0.125 150

Zero-Ohm-Resistor: R

0.25 200

Zero-Ohm-Resistor: R

0.5 200

Zero-Ohm-Resistor: R

1.0 200

Zero-Ohm-Resistor: R

0.75 400

Zero-Ohm-Resistor: R

1.0 500

Zero-Ohm-Resistor: R

LIMITING

ELEMENT

VO LTAGE

U

AC/DC

max.

= 20 m, I

max.

= 20 m, I

max.

= 20 m, I

max.

= 20 m, I

max.

= 20 m, I

max.

= 20 m, I

max.

= 20 m, I

max.

= 20 m, I

max.

TEMPERATURE

COEFFICIENT

ppm/K

± 100
± 200

at 70 °C = 1.5 A

max.

± 100
± 200

at 70 °C = 2.0 A

max.

± 100
± 200

at 70 °C = 2.5 A

max.

± 100
± 200

at 70 °C = 3.5 A

max.

± 100
± 200

at 70 °C = 5.0 A

max.

± 100
± 200

at 70 °C = 7.0 A

max.

± 100
± 200

at 70 °C = 6.0 A

max.

± 100
± 200

at 70 °C = 7.0 A

max.

TOLERANCE

%

± 1
± 5

± 1
± 5

± 1
± 5

± 1
± 5

± 1
± 5

± 1
± 5

± 1
± 5

± 1
± 5

RESISTANCE

RANGE



1R0 to 10M

1R0 to 10M

1R0 to 10M

1R0 to 10M

1R0 to 10M

1R0 to 2M2

1R0 to 10M

1R0 to 10M

SERIES

E24; E96

E24

E24; E96

E24

E24; E96

E24

E24; E96

E24

E24; E96

E24

E24; E96

E24

E24; E96

E24

E24; E96

E24

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D/CRCW e3

Vishay

Standard Thick Film Chip Resistors

TECHNICAL SPECIFICATIONS

PARAMETER UNIT

(1)

Rated dissipation P

Limiting element voltage

U

AC/DC

max.

Insulation voltage

U

(1 min)

ins

Insulation resistance  > 10

Category temperature
range

Failure rate h

Weight mg 0.65 2 5.5 10 16 29.5 25.5 40.5

Note

(1)

The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.

70

W 0.063 0.1 0.125 0.25 0.5 1.0 0.75 1.0

°C - 55 to + 155

D10/

CRCW0402

V 50 75 150 200 200 200 400 500

V > 75 > 100 > 200 > 300 > 300 > 300 > 300 > 300

-1

D11/

CRCW0603

D12/

CRCW0805

D25/

CRCW1206

< 0.1 x 10

CRCW1210 CRCW1218 CRCW2010 CRCW2512

9

- 9

PART NUMBER AND PRODUCT DESCRIPTION

Part Number: CRCW0603562RFKEC

C R C W 0 6 0 3 5 6 2 R F K E C

MODEL VALUE TOLERANCE TCR

CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512

Product Description: D11/CRCW0603 100 562R 1 % ET6 e3

D11/CRCW0603 100 562R 1 % ET6 e3

MODEL TCR RESISTANCE VALUE TOLERANCE

D10/CRCW0402
D11/CRCW0603
D12/CRCW0805
D25/CRCW1206

CRCW1210
CRCW1218
CRCW2010
CRCW2512

R = Decimal

K = Thousand

M = Million

0000 = Jumper

± 200 ppm/K
± 100 ppm/K

F = ± 1.0 %
J = ± 5.0 %
Z = Jumper

10R = 10 

562R = 562 

10K = 10 k

1M0 = 1 M

0R0 = Jumper

K = ± 100 ppm/K
N = ± 200 ppm/K

0 = Jumper

± 5 %
± 1 %

PACKAGING

EA, EB,
EC, ED,

EE, EF,

EG, EH,

EI, EL,

EK

PA CK A GI N G

ET1, ET2,
ET3, ET4,
ET5, ET6,
ET7, ET8,
ET9, EF4,
E02, E67,

E82

SPECIAL

Up to 2 digits

LEAD (Pb)-FREE

e3 = Pure tin

termination finish

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Document Number: 20035

D/CRCW e3

Standard Thick Film Chip Resistors

Vishay

PACKAGI N G

MODEL CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER

CRCW0402

CRCW0603

CRCW0805

CRCW1206

CRCW1210

CRCW1218 EK = ET9 4000

CRCW2010 EF = E02 4000 12 mm 4 mm 180 mm/7"

CRCW2512

ED = ET7 10 000

EE = EF4 50 000 330 mm/13"

EI = ET2 5000

ED = ET3 10 000 180 mm/7"

EL = ET4 20 000 285 mm/11.25"

EE = ET8 50 000 330 mm/13"

EA = ET1 5000

EB = ET5 10 000 285 mm/11.25"

EC = ET6 20 000 330 mm/13"

EA = ET1 5000

EB = ET5 10 000 285 mm/11.25"

EC = ET6 20 000 330 mm/13"

EA = ET1 5000

EB = ET5 10 000 285 mm/11.25"

EC = ET6 20 000 330 mm/13"

EA = ET1 5000

EB = ET5 10 000 285 mm/11.25"

EC = ET6 20 000 330 mm/13"

EG = E67 2000

EH = E82 4000 4 mm

Paper tape acc.

to IEC 60068-3

Type I

Blister tape acc.

to IEC 60068-3

Type II

8 mm 2 mm

8 mm 2 mm

8 mm 4 mm

8 mm 4 mm

8 mm 4 mm

8 mm 4 mm

12 mm 4 mm 180 mm/7"

12 mm

8 mm

180 mm/7"

180 mm/7"

180 mm/7"

180 mm/7"

180 mm/7"

180 mm/7"

180 mm/7"

DIMENSIONS

SIZE DIMENSIONS in millimeters

INCH METRIC L W H T1 T2 a b l a b l

0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.1 0.4 0.6 0.5

0603 1608 1.55

0805 2012 2.0

1206 3216 3.2

1210 3225 3.2 ± 0.2 2.5 ± 0.2 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 2.5 2.0 1.1 2.5 2.2

1218 3246 3.2

2010 5025 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 2.5 3.9 1.2 2.5 3.9

2512 6332 6.3 ± 0.2 3.15 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 3.2 5.2 1.2 3.2 5.2

+ 0.10

0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.2 0.3 ± 0.2 0.5 0.9 1.0 0.9 0.9 1.0

- 0.05

+ 0.20

1.25 ± 0.15 0.45 ± 0.05 0.3

- 0.10

+ 0.10

1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3

- 0.20

+ 0.10

4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 1.05 4.9 1.9 1.25 4.8 1.9

- 0.20

+ 0.20

0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3

- 0.10

SOLDER PAD DIMENSIONS in millimeters

REFLOW SOLDERING WAVE SOLDERING

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D/CRCW e3

2000

200

0

10

- 6

10

- 5

10

- 4

10

- 3

10

- 2

10

- 1

110

Maximum pulse voltage, single and continuous pulses; applicable if

P ≤ P

max.

; for permissible resistance change equivalent to 8000 h operation

Pulse Duration i (s)

400

600

800

1000

1200

1400

1600

1800

Pulse Voltage

max.

(V)

2512

2010

1206/1210/1218

0805

0603

0402

t

Û

Vishay

FUNCTIONAL PERFORMANCE

Single Pulse

1000

(W)

max.

P

100

10

Pulse Load

1

0.1

0.01

-6

10

Continuous Pulse

1000

(W)

max.

P

100

10

Standard Thick Film Chip Resistors

-5

-4

-3

-2

10

10

10

10

Maximum pulse load, single pulse; applicable if P 0 and n < 1000 and Û ≤ Û

for permissible resistance change equivalent to 8000 h operation

10

-1

1 10 100

Pulse Duration i (s)

2512
1218
2010
1210
1206
0805
0603
0402

t

max.

2512
1218
2010
1210
1206
0805
0603
0402

;

1

Continuous Pulse Load

0.1

0.01

-6

-5

-4

-3

-2

10

10

10

10

Maximum pulse load, continuous pulses; applicable if P ≤ P (ϑ

for permissible resistance change equivalent to 8000 h operation

10

10

-1

1 10 100

Pulse Duration i (s)

) and Û ≤ Û

amb

max.

t

;

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Document Number: 20035

D/CRCW e3

- 50 0 50 100 150

0

Derating

Ambient Temperature

amb

Fraction of Rated Dissipation P

70

50

100

70

°C

%

ϑ

10

120

Resistance Value R in Ω

Attenuation of 3rd Harmonic A3 in dB

100

80

40

60

20

0

100 1K 10K 100K 1M 10M

1206, 2010
0805

0603
0402

100 1K 10K 100K 1M 10M

100

10

1

0.1

0.01

Current Noise A

1

in µV/V

2010

1206

0805

0603

0402

Resistance Value R in Ω

Standard Thick Film Chip Resistors

Vishay

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D/CRCW e3

P70 x R

P70 x R

P70 x R

Vishay

Standard Thick Film Chip Resistors

TEST PROCEDURES AND REQUIREMENTS

REQUIREMENTS

EN
60115-1
CLAUSE

4.5 - Resistance - ± 1 % ± 5 %

4.7 - Voltage proof U = 1.4 x U

4.13 - Short time overload

4.17.2 58 (Td) Solderability

4.8.4.2 -

4.32 21 (Uu

4.33 21 (Uu

4.19 14 (Na)

4.23 - Climatic sequence: -

4.23.2 2 (Ba) Dry heat 125 °C; 16 h

4.23.3 30 (Db) Damp heat, cyclic

4.23.4 1 (Aa) Cold - 55 °C; 2 h

4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h

4.23.6 30 (Db) Damp heat, cyclic

4.23.7 - DC load U =

4.25.1 -

IEC

60068-2

TEST

METHOD

)

3

) Substrate bending

1

TEST PROCEDURE

Stability for product types:

U = 2.5 x

duration: Acc. to style

Solder bath method;

non activated flux;

Solder bath method;

Sn96.5Ag3Cu0.5

non-activated flux;

Temperature

coefficient

Shear

(adhesion)

Rapid change of

temperature

Endurance

at 70 °C

(20/- 55/20) C and

(20/125/20) C

RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N

30 min. at - 55 °C;

30 min. at 125 °C

55 °C;  90 % RH;

55 °C;  90 % RH;

24 h; 5 cycles

U =  U

1.5 h on; 0.5 h off;

70 °C; 1000 h ± (1 % R + 0.05 )± (2 % R + 0.1 )
70 °C; 8000 h ± (2 % R + 0.1 )± (4 % R + 0.1 )

D/CRCW e3 1  to 10 M

; 60 s No flashover or breakdown

ins

max.

;

;

max.

 2 x U

Sn60Pb40

(235 ± 5) °C

(2 ± 0.2) s

(245 ± 5) C

(3 ± 0.3) s

Depth 2 mm;

3 times

5 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )

1000 cycles ± (1 % R + 0.05 )± (1 % R + 0.05 )

24 h; 1 cycle

±0.25 % R + 0.05)±0.5 % R + 0.05)

No visible damage, no open circuit in bent position

± (1 % R + 0.05 )± (2 % R + 0.1 )

PERMISSIBLE CHANGE (R)

SIZE 0402 to 2512

STABILITY

CLASS 1

OR BETTER

Good tinning ( 95 % covered)

no visible damage

Good tinning ( 95 % covered)

no visible damage

± 100 ppm/K ± 200 ppm/K

No visible damage

± (0.25 % R + 0.05 )

STABILITY

CLASS 2

OR BETTER

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Document Number: 20035

D/CRCW e3

15 x P70 x R

P70 x R

Standard Thick Film Chip Resistors

TEST PROCEDURES AND REQUIREMENTS

EN
60115-1
CLAUSE

4.18.2 58 (Td)

4.35 -

4.24 78 (Cab)

4.25.3 -

4.40 -

4.29 45 (XA)

4.30 45 (XA)

4.22 6 (Fc)

4.37 -

4.27 -

IEC

60068-2

TEST

METHOD

TEST PROCEDURE

Stability for product types:

Resistance to

soldering heat

Flamability,

needle flame test

Damp heat,
steady state

Endurance at

upper category

temperature

Electrostatic

discharge

(human body model)

Component solvent

resistance

Solvent resistance

of marking

Vibration, endurance

by sweeping

Periodic electric

overload

Single pulse high
voltage overload,

10 µs/700 µs

ESD voltage acc. to size

D/CRCW e3 1  to 10 M

Solder bath method

(260 ± 5) C;

(10 ± 1) s

IEC 60695-11-5;

10 s

(40 ± 2) °C;

(93 ± 3) % RH;

56 days

155 °C, 1000 h ± (1 % R + 0.05 )± (2 % R + 0.1 )

IEC 61340-3-1;
3 pos. + 3 neg.

discharges;

Isopropyl alcohol;

50 °C; method 2

Isopropyl alcohol;

50 °C; method 1,

toothbrush

f = 10 Hz to 2000 Hz;

x, y, z  1.5 mm;

A  200 m/s

10 sweeps per axis

U =

 2 x U

0.1 s on; 2.5 s off;

Û = 10 x

max.

1000 cycles

 2 x U

max.

10 pulses

Vishay

REQUIREMENTS

PERMISSIBLE CHANGE (R)

SIZE 0402 to 2512

STABILITY

CLASS 1

OR BETTER

± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )

No burning after 30 s

± (1 % R + 0.05 )

± (1 % R + 0.05 )

No visible damage

Marking legible,

no visible damage

2

;

;

;

± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )

± (1 % R + 0.05 )

± (1 % R + 0.05 )

STABILITY

CLASS 2

OR BETTER

All tests are carried out in accordance with the following specifications:

 EN 60115-1, generic specification

 EN 140400, sectional specification

 EN 140401-802, detail specification

 IEC 60068-2-x, environmental test procedures

Packaging of components is done in paper or blister tapes according to IEC 60286-3.

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

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
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