VISHAY
TSOP62..
Document Number 82177
Rev. 3, 23-Jun-03
Vishay Semiconductors
www.vishay.com
1
16797
1
2
3
4
IR Receiver Modules for Remote Control Systems
Description
The TSOP62.. - series are miniaturized SMD-IR
Receiver Modules for infrared remote control systems. PIN diode and preamplifier are assembled on
lead frame, the epoxy package is designed as IR filter.
The demodulated output signal can directly be
decoded by a microprocessor. TSOP62.. is the standard IR remote control SMD-Receiver series, supporting all major transmission codes.
Features
• Photo detector and preamplifier in one package
• Internal filter for PCM frequency
• Continuous data transmission possible
• TTL and CMOS compatibility
• Output active low
• Low power consumption
• High immunity against ambient light
• Low power consumption
Special Features
• Improved immunity against ambient light
• Suitable burst length ≥ 10 cycles/burst
• Taping available for Topview and Sideview
assembly
Mechanical Data
Pinning:
1 = GND, 2 = GND, 3 = V
S
, 4 = OUT
Parts Table
Block Diagram
Application Circuit
Part Carrier Frequency
TSOP6230 30 kHz
TSOP6233 33 kHz
TSOP6236 36 kHz
TSOP6237 36.7 kHz
TSOP6238 38 kHz
TSOP6240 40 kHz
TSOP6256 56 kHz
30 kΩ
V
S
OUT
Demo-
GND
Pass
AGCInput
PIN
Band
dulator
Control
Circuit
3
4
1;2
16839
C1=
4.7 µF
TSOPxxxx
OUT
GND
Circuit
µC
R1=100Ω
+V
S
GND
Transmitter
with
TSALxxxx
V
S
R1+C1recommended to suppress power supply
disturbances.
V
O
The output voltage should not be hold continuously at
a voltage below V
O
=
3.3 V by the external circuit.
16842
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2
Document Number 82177
Rev. 3, 23-Jun-03
VISHAY
TSOP62..
Vishay Semiconductors
Absolute Maximum Ratings
T
amb
= 25 °C, unless otherwise specified
Electrical and Optical Characteristics
T
amb
= 25 °C, unless otherwise specified
Parameter Test condition Symbol Val ue Unit
Supply Voltage Pin 3 V
S
- 0.3 to 6.0 V
Supply Current Pin 3 I
S
5 mA
Output Voltage Pin 4 V
O
- 0.3 to 6.0 V
Output Current Pin 4 I
O
15 mA
Junction Temperature T
j
100 °C
Storage Temperature Range T
stg
- 40 to + 100 °C
Operating Temperature Range T
amb
- 25 to + 85 °C
Power Consumption T
amb
≤ 85 °C P
tot
50 mW
Parameter Test condition Symbol Min Ty p . Max Unit
Supply Current VS = 5 V, Ev = 0 I
SD
0.8 1.1 1.5 mA
VS = 5 V,
E
v
= 40 klx, sunlight
I
SH
1.4 mA
Supply Voltage V
S
4.5 5.5 V
Transmission Distance Ev = 0, test signal see fig.1,
IR diode TSAL6200,
I
F
= 400 mA
d 35 m
Output Voltage Low (Pin 4) I
OSL
= 0.5 mA,
E
e
= 0.7 mW/m2,
test signal see fig. 1
V
OSL
250 mV
Irradiance (30-40 kHz) Pulse width tolerance:
t
pi
- 5/fo < tpo < tpi + 6/fo,
test signal see fig.1
E
e min
0.35 0.5
mW/m
2
Irradiance (56 kHz) Pulse width tolerance:
t
pi
- 5/fo < tpo < tpi + 6/fo,
test signal see fig.1
E
e min
0.4 0.6
mW/m
2
Irradiance tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
E
e max
30
W/m
2
Directivity Angle of half transmission
distance
ϕ
1/2
± 50 deg
VISHAY
TSOP62..
Document Number 82177
Rev. 3, 23-Jun-03
Vishay Semiconductors
www.vishay.com
3
Typical Characteristics (T
amb
= 25 °C unless otherwise specified)
Figure 1. Output Function
Figure 2. Pulse Length and Sensitivity in Dark Ambient
Figure 3. Output Function
E
e
T
tpi *
t
* t
pi
w 10/fo is recommended for optimal function
V
O
V
OH
V
OL
t
16110
Optical Test Signal
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, T = 10 ms)
Output Signal
t
d
1)
t
po
2)
1)
7/f0< td< 15/f
0
2)
tpi–5/f0< tpo < tpi+6/f
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.1 1.0 10.0 100.0 1000.010000.0
Ee – Irradiance ( mW/m2 )
16908
Input Burst Duration
l = 950 nm,
optical test signal, fig.1
Output Pulse
t – Output Pulse Width ( ms )
po
E
e
t
V
O
V
OH
V
OL
t
600 ms 600 ms
T = 60 ms
T
on
T
off
94 8134
Optical Test Signal
Output Signal, ( see Fig.4 )
Figure 4. Output Pulse Diagram
Figure 5. Frequency Dependence of Responsivity
Figure 6. Sensitivity in Bright Ambient
T ,T – Output Pulse Width ( ms )
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.1 1.0 10.0 100.0 1000.010000.0
Ee – Irradiance ( mW/m2 )
16909
To ff
l = 950 nm,
optical test signal, fig.3
To n
on off
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.7 0.9 1.1 1.3
f/f0 – Relative Frequency
16925
f = f0"5%
Df ( 3dB ) = f
0
/10
E / E – Rel. Responsivity
e min e
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.01 0.10 1.00 10.00 100.00
E – Ambient DC Irradiance (W/m2)
16911
Correlation with ambient light sources:
10W/m
2
^1.4klx (Std.illum.A,T=2855K)
10W/m
2
^8.2klx (Daylight,T=5900K)
Ambient, l = 950 nm
E – Threshold Irradiance ( mW/m )
e min
2
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4
Document Number 82177
Rev. 3, 23-Jun-03
VISHAY
TSOP62..
Vishay Semiconductors
Figure 7. Sensitivity vs. Supply Voltage Disturbances
Figure 8. Sensitivity vs. Electric Field Disturbances
Figure 9. Max. Envelope Duty Cycle vs. Burstlength
0.0
0.5
1.0
1.5
2.0
0.1 1.0 10.0 100.0 1000.0
DV
sRMS
– AC Voltage on DC Supply Voltage (mV)
16912
f = f
o
f = 10 kHz
E – Threshold Irradiance ( mW/m )
e min
2
f = 1 kHz
f = 100 Hz
E – Threshold Irradiance ( mW/m )
0.0 0.4 0.8 1.2 1.6
0.0
0.4
0.8
1.2
2.0
E – Field Strength of Disturbance ( kV/m )
2.0
94 8147
1.6
e min
2
f(E) = f
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0 20 40 60 80 100 120
Burst Length ( number of cycles / burst )
16913
f = 38 kHz, Ee = 2 mW/m
2
Max. Envelope Duty Cycle
Figure 10. Sensitivity vs. Ambient Temperature
Figure 11. Relative Spectral Sensitivity vs. Wavelength
Figure 12. Directivity
0.0
0.1
0.2
0.3
0.4
0.5
0.6
–30–150 153045607590
T
amb
– Ambient Temperature ( qC )
16918
Sensitivity in dark ambient
E – Threshold Irradiance ( mW/m )
e min
2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
750 850 950 1050 1150
l – Wavelength ( nm )
16919
S ( ) – Relative Spectral Sensitivityl
rel
16801
0.4 0.2 0 0.2 0.4
0.6
0.6
0.9
0°
30°
10° 20°
40°
50°
60°
70°
80°
1.0
0.8
0.7
d
rel
- Relative Transmission Distance
VISHAY
TSOP62..
Document Number 82177
Rev. 3, 23-Jun-03
Vishay Semiconductors
www.vishay.com
5
Suitable Data Format
The circuit of the TSOP62.. is designed in that way
that unexpected output pulses due to noise or disturbance signals are avoided. A bandpass filter, an integrator stage and an automatic gain control are used
to suppress such disturbances.
The distinguishing mark between data signal and disturbance signal are carrier frequency, burst length
and duty cycle.
The data signal should fulfill the following conditions:
• Carrier frequency should be close to center fre-
quency of the bandpass (e.g. 38 kHz).
• Burst length should be 10 cycles/burst or longer.
• After each burst which is between 10 cycles and 70
cycles a gap time of at least 14 cycles is necessary.
• For each burst which is longer than 1.8 ms a corre-
sponding gap time is necessary at some time in the
data stream. This gap time should be at least 4 times
longer than the burst.
• Up to 800 short bursts per second can be received
continuously.
Some examples for suitable data format are: NEC
Code (repetitive pulse), NEC Code (repetitive data),
Toshiba Micom Format, Sharp Code, RC5 Code,
RC6 Code, R-2000 Code, Sony Code.
When a disturbance signal is applied to the TSOP62..
it can still receive the data signal. However the sensitivity is reduced to that level that no unexpected
pulses will occur.
Some examples for such disturbance signals which
are suppressed by the TSOP62.. are:
• DC light (e.g. from tungsten bulb or sunlight)
• Continuous signal at 38 kHz or at any other fre-
quency
• Signals from fluorescent lamps with electronic bal-
last with high or low modulation
(see Figure 13 or Figure 14).
Figure 13. IR Signal from Fluorescent Lamp with low Modulation
Figure 14. IR Signal from Fluorescent Lamp with high Modulation
0 5 10 15 20
Time ( ms )
16920
IR Signal
IR Signal from fluorescent
lamp with low modulation
0 5 10 15 20
Time ( ms )
16921
IR Signal
IR Signal from fluorescent
lamp with high modulation
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6
Document Number 82177
Rev. 3, 23-Jun-03
VISHAY
TSOP62..
Vishay Semiconductors
Package Dimensions in mm
Assembly Instructions
Reflow Soldering
• Reflow soldering must be done within 72 hours
stored under max. 30 °C, 60 % RH after opening
envelop
• Recommended soldering paste (composition: SN 63
%, Pb 37 %) Melting temperature 178 °C to 192 °C
• Apply solder paste to the specified soldering pads,
by using a dispenser or by screen printing.
16629
VISHAY
TSOP62..
Document Number 82177
Rev. 3, 23-Jun-03
Vishay Semiconductors
www.vishay.com
7
• Recommended thickness of metal mask is 0.2 mm
for screen printing.
• The recommended reflow furnace is a combination-
type with upper and lower heaters.
• Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
keep the maximum temperature below 230 °C. The
following temperature profile means the tempera ture
at the device surface. Since temperature differ ence
occurs between the work and the surface of the circuit
board depending on the pes of circuit board or reflow
furnace, the operating conditions should be verified
prior to start of operation.
• Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
• Use the 6/4 solder or the solder containing silver.
• Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 °C.
• Finish soldering within three seconds.
• Handle products only after the temperature is cooled
off.
Cleaning
• Perform cleaning after soldering strictly in conform-
ance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol)
Commercially available grades (industrial use) should
be used.
Demineralized or distilled water having a resistivity of
not less than 500 mΩ corresponding to a conductivity
of 2 mS/m.
• Temperature and time: 30 seconds under the tem-
perature below 50 °C or 3 minutes below 30 °C.
• Ultrasonic cleaning: Below 20 W.
Reflow Solder Profile
10 s max.
@ 230 qC
90 s max
0
20
40
60
80
100
120
140
160
180
200
220
240
0 50 100 150 200 250 300 350
Time ( s )
Temperature ( C )
16944
q
2 qC - 4 qC/s
120 s - 180 s
2 qC - 4 qC/s
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8
Document Number 82177
Rev. 3, 23-Jun-03
VISHAY
TSOP62..
Vishay Semiconductors
Taping Version TSOP..TT
16584
VISHAY
TSOP62..
Document Number 82177
Rev. 3, 23-Jun-03
Vishay Semiconductors
www.vishay.com
9
Taping Version TSOP..TR
16585
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10
Document Number 82177
Rev. 3, 23-Jun-03
VISHAY
TSOP62..
Vishay Semiconductors
Reel Dimensions
16734
VISHAY
TSOP62..
Document Number 82177
Rev. 3, 23-Jun-03
Vishay Semiconductors
www.vishay.com
11
Leader and Trailer
Cover Tape Peel Strength
According to DIN EN 60286-3
0.1 to 1.3 N
300 ± 10 mm/min
165 ° - 180 ° peel angle
Label
Standard bar code labels for finished goods
The standard bar code labels are product labels and
used for identification of goods. The finished goods
are packed in final packing area. The standard packing units are labeled with standard bar code labels
before transported as finished goods to warehouses.
The labels are on each packing unit and contain
Vishay Semiconductor GmbH specific data.
Trailer Leader
no devices no devices
min. 200 min. 400
StartEnd
devices
96 11818
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12
Document Number 82177
Rev. 3, 23-Jun-03
VISHAY
TSOP62..
Vishay Semiconductors
Dry Packing
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transportation and storage.
Final Packing
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping purposes.
Item-Description
Item-Number
Selection-Code
LOT-/ Serial-Number
Data-Code
Plant-Code
Quantity
Accepted by:
Packed by:
Mixed Code Indicator
Origin
INO
–
BATCH
SEL
COD
PTC
QTY
ACC
PCK
MIXED CODE
xxxxxxx
+
18
8
3
10
3 (YWW)
2
8
–
–
–
Company Logo
Plain Writing Abbreviation
Length
Item-Number
Sequence-Number
Plant-Code
Quantity
Total Length
N8
2
3
8
21
Long Bar Code Top Type
Length
N
X
N
–
Selection–Code
Batch-Number
Data-Code
Filter
Total Length
X3
3
10
1
17
Short Bar Code Bottom
Type
Length
N
X
–
–
16942
Vishay Semiconductor GmbH standard bar code product label (finished goods)
Aluminium bag
Label
Reel
15973
VISHAY
TSOP62..
Document Number 82177
Rev. 3, 23-Jun-03
Vishay Semiconductors
www.vishay.com
13
Recommended Method of Storage
Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will
recover to the former condition by drying under the
following condition:
192 hours at 40 °C + 5 °C/ -0 °C and < 5 % RH (dry
air/ nitrogen) or
96 hours at 60 °C +5 °C and < 5 % RH for all device
containers or
24 hours at 125 °C +5 °C not suitable for reel or
tubes.
An EIA JEDEC Standard JESD22-A112 Level 4 label
is included on all dry bags.
Example of JESD22-A112 Level 4 label
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices especially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warning labels are on the packaging.
Vishay Semiconductors Standard
Bar-Code Labels
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Telefunken
specific data.
16943
16962
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14
Document Number 82177
Rev. 3, 23-Jun-03
VISHAY
TSOP62..
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
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