VISHAY TNPU e3 Technical data

TNPU e3
P x R
Vishay Draloric
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
FEATURES
• Low temperature coefficient and tight tolerances (± 0.05 %; ± 5 ppm/K)
• Superior moisture resistivity 0.25 % (85 °C; 56 days; 85 % RH)
• Waste gas resistant
• AEC-Q200 qualified
• Compliant to RoHS directive 2002/95/EC
• Find out more about Vishay’s Automotive Grade Product requirements at: www.vishay.com/applications
APPLICATIONS
• Industrial equipment
• Telecommunication
• Medical equipment
• Instrumentation
• Test and measuring equipment
• Automotive
STANDARD ELECTRICAL SPECIFICATIONS
TNPU0603 e3 TNPU0805 e3 TNPU1206 e3
Metric size RR 1608M RR 2012M RR 3216M
Resistance range 100 Ω to 100 kΩ 100 Ω to 332 kΩ 100 Ω to 511 kΩ
Resistance tolerance ± 0.1 %; ± 0.05 %
Temperature coefficent ± 10 ppm/K; ± 5 ppm/K
Climatic category (LCT/UCT/days) 55/125/56 55/125/56 55/125/56
Rated dissipation, P
Operating voltage, U
Maximum permissible film temperature 125 °C 125 °C 125 °C
Thermal resistance
Max. resistance change at P
Insulation voltage:
FIT
observed
Weight/1000 pieces 2 g 5.5 g 10 g
(1)
70
AC/DC 75 V 150 V 200 V
max.
(2)
; |ΔR/R|
70
1000 h 0.05 % 0.05 % 0.05 %
8000 h 0.10 % 0.10 % 0.10 %
225 000 h 0.30 % 0.30 % 0.30 %
1 min 100 V 200 V 300 V
U
ins
Continuous 75 V 75 V 75 V
0.1 W 0.125 W 0.25 W
550 K/W 440 K/W 220 K/W
0.1 x 10-9/h 0.1 x 10-9/h 0.1 x 10-9/h
Notes
(1)
Rated voltage . The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded.
(2)
Measuring conditions in accordance with EN 140401-801.
www.vishay.com For technical questions, contact: thinfilmchip@vishay.com 314 Revision: 12-Aug-10
Document Number: 28779
TNPU e3
High Precision Thin Film Chip Resistors
Vishay Draloric
± 0.05 %; ± 5 ppm/K
DIMENSIONS
SIZE DIMENSIONS
INCH METRIC L W H T1 T2
0603 1608 1.6 ± 0.10 0.85 ± 0.10 0.45 ± 0.10 0.3 ± 0.20
0805 2012 2.0 ± 0.15 1.25 ± 0.15 0.45 ± 0.10 0.4 ± 0.20
1206 3216 3.2 ± 0.15 1.6 ± 0.15 0.55 ± 0.10 0.5 ± 0.25
SOLDER PAD DIMENSIONS
SIZE REFLOW SOLDERING WAVE SOLDERING
INCH METRIC a b l a b l
0603 1608 0.5 0.9 1.0 0.9 0.9 1.0
0805 2012 0.7 1.3 1.2 0.9 1.3 1.3
1206 3216 0.9 1.7 2.0 1.1 1.7 2.3
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE TCR TOLERANCE RESISTANCE VALUE E-SERIES
± 10 ppm/K ± 0.05 %
TNPU0603 e3
TNPU0805 e3
TNPU1206 e3
± 5 ppm/K
± 10 ppm/K ± 0.05 %
± 5 ppm/K
± 10 ppm/K ± 0.05 %
± 5 ppm/K
± 0.1 %
± 0.05 %
± 0.1 %
± 0.05 %
± 0.1 %
± 0.05 %
100 Ω to 100 kΩ
100 Ω to 332 kΩ
100 Ω to 511 kΩ
in millimeters
in millimeters
E24 to E192
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: TNPU12061K32AZEA00
TU120PN61K32AZEA00
EA EN
ET1 E52
(1)
(1)
SPECIAL
Up to 2 digits
00 = Standard
LEAD (Pb)-FREE
e3 = Pure tin
termination finish
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MODEL VALUE TOLERANCE TCR
TNPU0603 TNPU0805 TNPU1206
Product Description: TNPU1206 1K32 0.05 % T-16 ET1 e3
TNPU1206 1K32 0.05 % T-16 ET1 e3
MODEL
TNPU0603 TNPU0805 TNPU1206
Notes
Products can be ordered using either the PRODUCT DESCRIPTION or the PART NUMBER.
(1)
Please refer to PACKAGING table.
Document Number: 28779 For technical questions, contact: thinfilmchip@vishay.com Revision: 12-Aug-10 315
R = Decimal
K = Thousand
M = Million
(4 digits)
RESISTANCE
VAL UE
Examples:
1K32 = 1320 Ω
B = ± 0.1 %
A = ± 0.05 %
TOLERANCE TCR
± 0.05 %
± 0.1 %
Y = ± 10 ppm/K
Z = ± 5 ppm/K
T- 13 = ± 10 ppm/K
T- 1 6 = ± 5 ppm/K
PA CK A GI N G
PACKAGING
TNPU e3
Vishay Draloric
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
PACKAGING
MODEL
TNPU0603 e3 TNPU0805 e3 TNPU1206 e3
TAPE WIDTH
[mm]
8 4 180/7
DESCRIPTION
Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a high grade
ceramic substrate and conditioned to achieve the
AI
2O3
desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. A further conditioning is applied in order to stabilize the trimming result. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3
PITCH
[mm]
REEL DIAMETER
[mm/inch]
(3)
.
PACKAGING
PIECES PER
REEL
1000 E52 EN
5000 ET1 EA
CODE FOR
PRODUCT
DESCRIPTION
PACKAGING
CODE FOR PART
NUMBER
CARRIER TAPE
ASSEMBLY
The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapour phase as shown in IEC 61760-1. The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system.
The resistors are RoHS compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. The immunity of the plating against tin whisker growth has been proven under extensive testing.
All products comply with the GADSL
CEFIC-EECA-EICTA
hazardous substances. This includes full compliance with the following directives:
(2)
list of legal restrictions on
TYPE OF
Paper
(1)
and the
• 2000/53/EC End of Vehicle life Directive (ELV) and Annex II (ELV II)
• 2002/95/EC Restriction of the use of Hazardous Substances Directive (RoHS)
• 2002/96/EC Waste Electrical and Electronic Equipment Directive (WEEE)
Solderability is specified for 2 years after production or re-qualification. The permitted storage time is 20 years.
Notes
(1)
Global Automotive Declarable Substance List, see www.gadsl.org.
(2)
CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade organisation representing the information and communications technology and consumer electronics), see www.eicta.org environment policy chemicals chemicals for electronics.
(3)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
www.vishay.com For technical questions, contact: thinfilmchip@vishay.com 316 Revision: 12-Aug-10
Document Number: 28779
issue
TNPU e3
1
100 1K 10K 100K 1M
Current Noise
Current Noise in
µV/V
Resistance Value in Ω
TNPU0805
e3
0.1
0.01
TNPU0603
e3
TNPU1206
e3
High Precision Thin Film Chip Resistors
B d n i
A y t i r a e n i L - n o N
Non-Linearity
TNPU1206 e3
110
TNPU0805 e3
3
TNPU0603 e3
100
90
80
70
60
40
100 1K 10K 100K 1M
Resistance Value in Ω
120
100
Vishay Draloric
± 0.05 %; ± 5 ppm/K
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following specifications: EN 60115-1, generic specification (includes tests) EN 140 400, sectional specification (includes schedule for qualification approval) EN 140 401-801, detail specification (includes schedule for conformance inspection)
The following table contains only the most important tests. For the full test schedule refer to the documents listed above. The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5202. The tests are carried out in accordance with IEC 60068 and under standard atmospheric conditions in accordance with IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated temperature range: Lower category temperature, upper category temperature; damp heat, long term, 56 days) is valid. Unless otherwise specified
Document Number: 28779 For technical questions, contact: thinfilmchip@vishay.com Revision: 12-Aug-10 317
Rated Power in %
Derating
80
60
40
20
0
- 55 - 25 0 25 50 75 100 125 150 175
70
Ambient Temperature in °C
the following values apply: Temperature: 15 °C to 35 °C Relative humidity: 45 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in accordance with EN 60115-1, 4.31 unless otherwise specified. The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140 401-801. However, some additional tests and a number of improvements against those minimum requirements have been included.
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TNPU e3
P70 x R
P70 x R
P70 x R
Vishay Draloric
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1 CLAUSE
4.5 - Resistance ± 0.1 %; ± 0.05 %
4.8.4.2 -
4.25.1 -
4.25.3 -
4.24 78 (Cab)
4.23
4.23.2 2 (Ba) Dry heat UCT; 16 h
4.23.3 30 (Db)
4.23.4 1 (Aa) Cold LCT; 2 h
4.23.5 13 (M)
4.23.6 30 (Db)
4.23.7 - D.c. load
- 1 (Aa) Cold - 55 °C; 2 h ± (0.05 % R + 0.01 Ω)
4.19 14 (Na)
4.13 -
IEC 60068-2
TEST METHOD
TEST PROCEDURE
Stability for product types:
Temperature
coefficient
Endurance at
70 °C
Endurance at
upper
category
temperature
Damp heat,
steady state
Climatic
sequence:
Damp heat,
cyclic
Low air
pressure
Damp heat,
cyclic
Rapid change
of
temperature
Short time
overload
At (20/- 55/20) °C and
(20/125/20) °C
U = or
U = U
> 95 to 100 % RH; 5 cycles
U = U
LCT = - 55 °C; UCT = 125 °C;
U =2 x U
; whichever is the
max.
less severe;
1.5 h “ON”; 0.5 h “OFF”;
70 °C; 1000 h ± (0.05 % R +0.01Ω)
70 °C; 8000 h ± (0.1 % R +0.02Ω)
125 °C; 1000 h ± (0.05 % R + 0.01 Ω)
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
55 °C; 24 h; > 90 % RH;
1 cycle
8.5kPa; 2h; 25± 10 °C
55 °C; 5 days;
LCT = - 55 °C UCT = 125 °C
30 min at LCT and
30 min at UCT;
1000 cycles
U = 2.5 x or
max.
the less severe; 5 s
TNPU0603 e3
TNPU0805 e3
TNPU1206 e3
; 1 min
max.
; whichever is
REQUIREMENTS
PERMISSIBLE CHANGE
± 10 ppm/K; ± 5 ppm/K
± (0.1 % R + 0.01 Ω)
± (0.1 % R + 0.02 Ω)
± (0.1 % R + 0.01 Ω)
± (0.05 % R + 0.01 Ω)
www.vishay.com For technical questions, contact: thinfilmchip@vishay.com 318 Revision: 12-Aug-10
Document Number: 28779
TNPU e3
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1 CLAUSE
4.22 6 (Fc) Vibration
4.17.2 58 (Td) Solderability
4.18.2 58 (Td)
4.29 45 (XA)
4.32 21 (Ue
4.33 21 (Ue
4.7 - Voltage proof U
4.35 - Flammability
IEC 60068-2
TEST METHOD
)
3
)
1
- Damp heat
TEST PROCEDURE
Stability for product types:
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Solder bath method;
SnAg3Cu0,5 or SnAg3,5;
non-activated flux
(235 ± 3) °C; (2 ± 0.2) s
Resistance to
soldering heat
Component
solvent
resistance
Shear
(adhesion)
Substrate
bending
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
Isopropyl alcohol + 50 °C;
method 2
RR 1005M and RR 1608M;
RR 2012M and RR 3216M;
Depth 2 mm, 3 times
= U
RMS
IEC 60695-11-5,
needle flame test; 10 s
(85 ± 5) °C; 56 days
(85 ± 5) % RH
Vishay Draloric
REQUIREMENTS
PERMISSIBLE CHANGE
TNPU0603 e3
TNPU0805 e3
TNPU1206 e3
± (0.05 % R +0.01 Ω)
no visible damage
2
; 6 h
Good tinning ( 95 % covered);
no visible damage
± (0.02 % R +0.01 Ω)
No visible damage
9N
45 N
no visible damage, no open circuit in bent position
; 60 ± 5 s No flashover or breakdown
ins
No visible damage
± (0.05 % R +0.01 Ω)
No burning after 30 s
± (0.25 R + 0.05 Ω)
Document Number: 28779 For technical questions, contact: thinfilmchip@vishay.com Revision: 12-Aug-10 319
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