VISHAY TFBS4650 Technical data

TFBS4650
Vishay Semiconductors
Infrared Transceiver
Description
The TFBS4650 is one of the smallest IrDA® compliant transceivers available. It supports data rates up to 115 kbit/s. The transceiver consists of a PIN photo­diode, infrared emitter, and control IC in a single pack­age.
Features
• Compliant with the IrDA physical layer IrPHY 1.4 (low power specification,
9.6 kbit/s to 115.2 kbit/s)
• Link distance: 30 cm/20 cm full 15° with standard or low power IrDA, respec­tively. Emission intensity can be set by an external resistor to increase the range for extended low power spec to > 50 cm
• Typical transmission distance to standard device: 50 cm
• Small package ­L 6.8 mm x W 2.8 mm x H 1.6 mm
• Low current consumption 75 µA idle at 3.6 V
cone
e4
20206
• Shutdown current 10 nA typical at 25 °C
• Operates from 2.4 V to 3.6 V within specification over full temperature range from - 25 °C to + 85 °C
• Split power supply, emitter can be driven by a sep­arate power supply not loading the regulated. U.S. Pat. No. 6,157,476
• Lead (Pb)-free device
• Qualified for lead (Pb)-free and Sn/Pb processing (MSL4)
• Device in accordance with RoHS 2002/95/EC and WEEE 2002/96/EC
Applications
• Mobile phone
• PDAs
Parts Table
Part Description Qty / Reel
TFBS4650-TR1 Oriented in carrier tape for side view surface mounting 1000 pcs
TFBS4650-TR3 Oriented in carrier tape for side view surface mounting 2500 pcs
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Document Number 84672
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Functional Block Diagram
A
r
TFBS4650
Vishay Semiconductors
V
CC
PD
mplifie
Comparator
Tri-State
Driver
RxD
IREDA
SD
TxD
Mode
Control
IRED Driver
IRED IREDC
ASIC
GND
19283
Pin Description
Pin Number Function Description I/O Active
1 IREDA IRED Anode, connected via a current limiting resistor to V
unregulated power supply can be used.
2 IREDC IRED Cathode, do not connect for standard operation
3 TXD Transmitter Data Input. Setting this input above the threshold turns on the
transmitter.
This input switches the IRED with the maximum transmit pulse width of
4 RXD Receiver Output. Normally high, goes low for a defined pulse duration with
the rising edge of the optical input signal. Output is a CMOS tri-state driver, which swings between ground and V
5 SD Shut Down. Logic Low at this input enables the receiver, enables the
transmitter, and un-tri-states the receiver output. It must be driven high for
shutting down the transceiver.
6V
7 GND Ground
CC
Power Supply, 2.4 V to 3.6 V. This pin provides power for the receiver and
transmitter drive section. Connect V
about 50 µs.
. Receiver echoes transmitter output.
cc
via an optional filter.
CC1
. A separate
CC2
IHIGH
OLOW
IHIGH
Pinout
TFBS4650, bottom view weight 0.05 g
19284
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TFBS4650
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin, GND unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter Test Conditions Symbol Min Ty p. Max Unit
Supply voltage range,
0 V < V
transceiver
Supply voltage range,
0 V < V
transmitter
Voltage at RXD All states V
Input voltage range, transmitter
Independent of V
TXD
< 6 V V
CC2
< 3.6 V V
CC1
or V
CC1
CC2
CC1
CC2
V
in
in
Input currents For all pins, except IRED anode
pin
Output sinking current 20 mA
Power dissipation P
Junction temperature T
Ambient temperature range (operating)
Storage temperature range T
D
J
T
amb
stg
Soldering temperature ***) see section Recommended
Solder Profile
Repetitive pulse output current < 90 µs, t
Average output current
< 20 % I
on
(RP) 500 mA
IRED
I
(DC) 100 mA
IRED
(transmitter)
Virtual source size Method: (1-1/e) encircled
d0.8 mm
energy
Maximum Intensity for Class 1 IEC60825-1 or
EN60825-1,
I
e
edition Jan. 2001
*)
Due to the internal limitation measures the device is a "class1" device.
**)
IrDA specifies the max. intensity with 500 mW/sr
***)
Sn/Pb-free soldering. The product passed VISHAY’s standard convection reflow profile soldering test.
- 0.5 6.0 V
- 0.5 6.0 V
- 0.5 VCC + 0.5 V
- 0.5 6.0 V
- 40 40 mA
250 mW
125 °C
- 25 + 85 °C
- 40 + 100 °C
*)
(500)
mW/sr
**)
°C
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhY 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhY 1.1, followed by IrPhY 1.2, adding the SIR Low Power Standard. IrPhY 1.3 extended the Low
Power Option to MIR and FIR and VFIR was added with IrPhY 1.4. A new version of the standard in any case obsoletes the former version.
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Document Number 84672
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Electrical Characteristics
Transceiver
T
= 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted.
amb
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter Test Conditions Symbol Min Ty p . Max Unit
Supply voltage range V
Dynamic supply current
Idle, dark ambient SD = Low (< 0.8 V),
E
= 0 klx,
eamb
< 4 mW/m
E
e
2
- 25 °C ≤ T ≤ + 85 °C
Idle, dark ambient SD = Low (< 0.8 V),
= 0 klx,
E
eamb
E
< 4 mW/m
e
2
T = + 25 °C
Peak supply current during
SD = Low, TXD = High I
transmission
Shutdown supply current dark ambient
SD = High (> V
- 0.5 V),
CC
T = 25 °C, Ee = 0 klx
Shutdown supply current, dark ambient
SD = High (> V
- 0.5 V),
CC
- 25 °C ≤ T ≤ + 85 °C
Operating temperature range T
Input voltage low (TXD, SD) V
Input voltage high V
Input voltage threshold SD V
Output voltage low V
= 2.4 V to 3.6 V V
CC
= 2.4 V to 3.6 V 0.9 1.35 1.8 V
CC
= 2.4 V to 3.6 V
CC
CLOAD = 15 pF
Output voltage high V
RXD to V
pull-up impedance SD = VCC
CC
= 2.4 V to 3.6 V
CC
= 15 pF
C
LOAD
= 2.4 V to 5 V
V
CC
R
Input capacitance (TXD, SD)
I
CC
I
CC
ccpk
I
SD
I
SD
V
V
RXD
C
CC
A
IL
IH
OL
OH
I
2.4 3.6 V
- 25 + 85 °C
- 0.5 0.5 V
VCC - 0.5 6.0 V
- 0.5 V
V
CC
TFBS4650
Vishay Semiconductors
90 130 µA
75 µA
23mA
0.1 µA
1.0 µA
x 0.15 V
CC
x 0.8 V
500 kΩ
+ 0.5 V
CC
6pF
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TFBS4650
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
T
= 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted.
amb
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter Test Conditions Symbol Min Ty p. Max Unit
Sensitivity: Minimum irradiance Ee in
9.6 kbit/s to 115.2 kbit/s λ = 850 nm to 900 nm
E
e
40
(4.0)
81
(8.1)
angular range *)**)
Maximum irradiance Ee in angular range ***)
No receiver output input irradiance
λ = 850 nm to 900 nm E
According to IrDA IrPHY 1.4, Appendix A1, fluorescent light
e
E
e
5
(500)
4
(0.4)
specification
Rise time of output signal 10 % to 90 %, C
Fall time of output signal 90 % to 10 %, C
RXD pulse width of output signal, 50%****)
Input pulse width
1.63 µs
= 15 pF t
L
= 15 pF t
L
r (RXD)
f (RXD)
t
PW
20 100 ns
20 100 ns
1.7 2.0 2.9 µs
Receiver start up time Power on delay 100 150 µs
Latency t
*)
This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent
L
50 200 µs
lamps
**)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification
while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length
***)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the max­imum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification.
****)
RXD output is edge triggered by the rising edge of the optical input signal. The output pulse duration is independent of the input pulse
duration.
mW/m
(µW/cm
kW/m
(mW/cm
mW/m
(µW/cm
2
2
)
2
2
2
2
)
)
For more definitions see the document “Symbols and Terminology” on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
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Document Number 84672
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Transmitter
T
= 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted.
amb
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter Test Conditions Symbol Min Ty p. Max Unit
IRED operating current, current controlled
The IRED current is internally controlled but also can be reduced by an external resistor R1
Output leakage IRED current Tamb = 85°C I
Output radiant intensity *) α = 0°, 15°, TXD = High, SD =
Low, V
= 3.0 V, V
CC1
CC2
= 3.0 V,
R1 = 30 Ω (resulting in about 50 mA drive current)
Output radiant intensity *) α = 0°, 15°, TXD = High, SD =
Low, V
= 3.0 V, V
CC1
CC2
= 3.0 V,
R1 = 0 Ω, If = 300 mA
Output radiant intensity *) V
= 5.0 V, α = 0°, 15°
CC1
TXD = Low or SD = High (Receiver is inactive as long as SD = High)
Saturation voltage of IRED driver
V
= 3.0 V, If = 50 mA V
CC
Peak - emission wavelength λ
Optical rise time, Optical fall time
Optical output pulse duration Input pulse width t < 30 µs
Input pulse width t 30 µs
Optical output pulse duration Input pulse width t = 1.63 µs t
I
D
IRED
I
e
I
e
I
e
CEsat
p
t
ropt
t
fopt
t
opt
t
opt
opt
,
TFBS4650
Vishay Semiconductors
200 400 mA
A
4 150 mW/sr
25 mW/sr
0.04 mW/sr
0.4 V
880 886 900 nm
20 100 ns
t
30
50 300
1.45 1.61 2.2 µs
µs µs
Optical overshoot 20 %
*)
The radiant intensity can be adjusted by the external current limiting resistor to adapt the intensity to the desired value. The given value is for minimum current consumption. This transceiver can be adapted to > 50 cm operation by increasing the current to > 200 mA, e.g. operating the transceiver without current control resistor (i.e. R1 = 0 Ω) and using the internal current control.
Table 1. Truth table
Inputs Outputs
SD TXD
Optical input Irradiance mW/m
high x x Tri-state floating with a weak
low high x low (echo on) I
low high > 50 µs x high 0
low low < 4 high 0 low low > Min. irradiance E
< Max. irradiance E
low low > Max. irradiance E
2
RXD Transmitter
0
pull-up to the supply voltage
e
e
e
e
low (active) 0
x0
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TFBS4650
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the TFBS4650 needs only one additional external com­ponent when the IRED drive current should be mini­mized for minimum current consumption according the low power IrDA standard. When combined opera­tion in IrDA and Remote Control is intended no cur­rent limiting resistor is recommended. However, depending on the entire system design and board layout, additional components may be required (see figure 1). When long wires are used for bench tests, the capacitors are mandatory for testing rise/fall time correctly.
V
CC2
V
CC1
GND
SD
Txd
Rxd
Figure 1. Recommended Application Circuit
C1
R1
R2
The capacitor C1 is buffering the supply voltage V and eliminates the inductance of the power supply line. This one should be a small ceramic version or other fast capacitor to guarantee the fast rise time of the IRED current. The resistor R1 is necessary for controlling the IRED drive current when the internally controlled current is too high for the application. Vishay transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout. The use of thin, long, resistive and inductive wiring should be avoided. The inputs (TXD, SD) and the output RXD should be directly (DC) coupled to the I/O circuit. The capacitor C2 combined with the resistor R2 is the low pass filter for smoothing the supply voltage. As already stated above R2, C1 and C2 are optional and depend on the quality of the supply voltages V and injected noise. An unstable power supply with dropping voltage during transmission may reduce the sensitivity (and transmission range) of the trans­ceiver. The placement of these parts is critical. It is strongly
C2
IRED Anode
IRED Cathode
V
CC
Ground
SD
Txd
Rxd
19286
cc2
CCx
recommended to position C2 as close as possible to the transceiver power supply pins. When connecting the described circuit to the power supply, low impedance wiring should be used.
In case of extended wiring the inductance of the power supply can cause dynamically a voltage drop at V
. Often some power supplies are not able to
CC2
follow the fast current is rise time. In that case another 10 µF cap at V
will be helpful.
CC2
Keep in mind that basic RF-design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termina­tion. See e.g. "The Art of Electronics" Paul Horowitz, Wienfield Hill, 1989, Cambridge University Press, ISBN: 0521370957.
Table 2. Recommended Application Circuit Components
Component Recommended Value
C1, C2 0.1 µF, Ceramic Vishay part#
VJ 1206 Y 104 J XXMT
R1 See table 3
R2 47 Ω, 0.125 W (V
CC1
= 3 V)
Table 3. Recommended resistor R1 [Ω]
V
CC2
[V]
2.7 24
3.0 30
3.3 36
Minimized current consumption,
IrDA Low power compliant
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Document Number 84672
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Recommended Solder Profiles
0
20
40
60
80
100
120
140
160
180
200
220
240
260
0 50 100 150 200 250 300 350
Time/s
Tem peratu re/°C
2...4 °C/s
2...4 °C/s
10 s max. at 230 °C
120 s...180 s
160 °C max.
240 °C max.
90 s max.
20
Solder Profile for Sn/Pb soldering
Figure 2. Recommended Solder Profile for Sn/Pb soldering
19431
TFBS4650
Vishay Semiconductors
Manual Soldering
Manual soldering is the standard method for lab use. However, for a production process it cannot be rec­ommended because the risk of damage is highly dependent on the experience of the operator. Never­theless, we added a chapter to the above mentioned application note, describing manual soldering and desoldering.
Storage
The storage and drying processes for all VISHAY transceivers (TFDUxxxx and TFBSxxx) are equiva­lent to MSL4. The data for the drying procedure is given on labels on the packing and also in the application note "Taping, Labeling, Storage and Packing" (http://www.vishay.com/docs/82601/82601.pdf).
Lead (Pb)-Free, Recommended Solder Profile
The TFBS4650 is a lead (Pb)-free transceiver and qualified for lead (Pb)-free processing. For lead (Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu, there are two standard reflow profiles: Ramp-Soak­Spike (RSS) and Ramp-To-Spike (RTS). The Ramp­Soak-Spike profile was developed primarily for reflow ovens heated by infrared radiation. With widespread use of forced convection reflow ovens the Ramp-To­Spike profile is used increasingly. Shown below in fig­ure 3 is VISHAY's recommended profiles for use with the TFBS4650 transceivers. For more details please refer to Application note: SMD Assembly Instruction.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices wave soldering is not recommended.
280
260
240
220
200
180
160
140
120
Temperature/°C
100
80
60
2 °C...4 °C/s
40
20
0
0 50 100 150 200 250 300 350
19261
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
90 s...120 s
Time/s
s
50 s max.
T
peak
= 260 °C max.
Figure 3. Solder Profile, RSS Recommendation
2 °C...4 °C/s
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TFBS4650
Vishay Semiconductors
Package Dimensions
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128
19322
Figure 4. TFBS4650 mechanical dimensions, tolerance ± 0.2 mm, if not otherwise mentioned
19729
Figure 5. TFBS4650 soldering footprint, tolerance ± 0.2 mm, if not otherwise mentioned
Document Number 84672
Rev. 1.1, 03-Jul-06
Reel Dimensions
TFBS4650
Vishay Semiconductors
Drawing-No.: 9.800-5090.01-4 Issue: 1; 29.11.05
14017
Tape Width A max. N W1 min. W2 max. W3 min. W3 max.
mm mm mm mm mm mm mm
16 330 50 16.4 22.4 15.9 19.4
Document Number 84672
Rev. 1.1, 03-Jul-06
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TFBS4650
Vishay Semiconductors
Tape Dimensions in mm
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19783
Document Number 84672
Rev. 1.1, 03-Jul-06
TFBS4650
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
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Document Number 84672
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Legal Disclaimer Notice
Vishay
Document Number: 91000 www.vishay.com Revision: 08-Apr-05 1
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.
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