TEMT7000X01 is a high speed silicon NPN epitaxial planar
phototransistor in a miniature 0805 package for surface
mounting on printed boards. The device is sensitive to visible
and near infrared radiation.
TEMT7000X01
Vishay Semiconductors
FEATURES
• Package type: surface mount
• Package form: 0805
• Dimensions (L x W x H in mm): 2 x 1.25 x 0.85
• AEC-Q101 qualified
• High photo sensitivity
• High radiant sensitivity
• Suitable for visible and near infrared radiation
• Fast response times
• Angle of half sensitivity: ϕ = ± 60°
• Package matched with IR emitter series VSMB1940X01
• Floor life: 168 h, MSL 3, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
• Find out more about Vishay’s Automotive Grade Product
requirements at: www.vishay.com/applications
APPLICATIONS
• Detector in automotive applications
• Light sensors
• Radiation sensors
PRODUCT SUMMARY
COMPONENTI
TEMT7000X01225 to 675± 60470 to 1090
Note
Test condition see table “Basic Characteristics”
(µA)ϕ (deg)λ
caE
0.1
(nm)
ORDERING INFORMATION
ORDERING CODEPACKAGINGREMARKSPACKAGE FORM
TEMT7000X01Tape and reelMOQ: 3000 pcs, 3000 pcs/reel0805
Fig. 6 - Relative Radiant Sensitivity vs. Angular Displacement
30°
40°
50°
60°
70°
80°
ϕ - Angular Displacement
0.8
0.6
0.4
- Relative Spectral Sensitivity
rel
0.2
S (λ)
0
400 500 600 700 800 900 1000 1100
21555
λ - Wavelength (nm)
Fig. 5 - Relative Spectral Sensitivity vs. Wavelength
REFLOW SOLDER PROFILE
300
255 °C
250
240 °C
217 °C
200
150
100
max. 120 s
Temperature (°C)
50
max. ramp up 3 °C/s
0
050100150200250300
19841
max. ramp down 6 °C/s
Time (s)
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
max. 260 °C
245 °C
max. 30 s
max. 100 s
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: T
< 30 °C, RH < 60 %
amb
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
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