Vishay SIR428DP Schematic [ru]

New Product
N-Channel 30-V (D-S) MOSFET
SiR428DP
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) R
30
0.0075 at V
0.0095 at V
DS(on)
(Ω)
GS
GS
= 10 V
= 4.5 V
a, g
g
g
Qg (Typ.)
9.5 nC
I
(A)
D
30
30
Halogen-free According to IEC 61249-2-21 Definition
• TrenchFET
• 100 % R
®
Power MOSFET
Tested
g
• 100 % UIS Tested
PowerPAK® SO-8
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
6.15 mm
D
8
D
7
D
6
5
Bottom View
Ordering Information: SIR428DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
1
D
5.15 mm
S
2
S
3
G
4
• Synchronous Rectification
•VRM
• Server
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (T
= 150 °C)
J
Pulsed Drain Current
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d, e
= 25 °C
T
C
= 70 °C
T
C
TA = 25 °C TA = 70 °C
T
= 25 °C
C
TA = 25 °C
L = 0.1 mH
= 25 °C
T
C
T
= 70 °C
C
T
= 25 °C
A
TA = 70 °C
V
DS
V
GS
I
D
I
DM
I
S
I
AS
E
AS
P
D
T
, T
J
stg
30
± 20
g
30
g
30
b, c
17.4
b, c
13.8 60
g
30
b, c
3.7 20
20
22.7
14.5
b, c
4.1
b, c
2.6
- 55 to 150 260
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, f
t 10 s
Maximum Junction-to-Case (Drain) Steady State
Notes: a. Based on T b. Surface Mounted on 1" x 1" FR4 board.
= 25 °C.
C
c. t = 10 s. d. See Solder Profile (www.vishay.com/ppg?73257
). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under Steady State conditions is 70 °C/W. g. Package limited.
Document Number: 64987 S09-1093-Rev. A, 15-Jun-09
R
thJA
R
thJC
22 30
4.5 5.5
°C/W
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1
New Product
SiR428DP
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
Temperature Coefficient ΔVDS/T
DS
V
Temperature Coefficient ΔV
GS(th)
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
b
a
a
a
Input Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Tur n -O n De l a y T i m e
Rise Time
Turn-Off Delay Time
Fall Time
Tur n -O n De l a y T i m e
Rise Time
Turn-Off Delay Time
Fall Time
V
DS
J
GS(th)/TJ
V
GS(th)
I
GSS
I
DSS
I
V
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
a
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
Notes: a. Pulse test; pulse width 300 µs, duty cycle 2 %. b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VGS = 0 V, ID = 250 µA
ID = 250 µA
V
= VGS, ID = 250 µA
DS
VDS = 0 V, VGS = ± 20 V
V
V
DS
= 30 V, V
DS
= 30 V, V
GS
5 V, V
DS
V
= 10 V, ID = 10 A
GS
V
= 4.5 V, ID = 10 A
GS
= 0 V
GS
= 0 V, TJ = 55 °C
= 10 V
GS
VDS = 10 V, ID = 10 A
VDS = 15 V, V
VDS = 15 V, V
= 15 V, V
V
DS
= 0 V, f = 1 MHz
GS
= 10 V, ID = 10 A
GS
= 4.5 V, ID = 10 A
GS
f = 1 MHz 0.2 0.5 1.0 Ω
V
= 15 V, RL = 1.5 Ω
DD
I
10 A, V
D
10 A, V
I
D
V
= 10 V, Rg = 1 Ω
GEN
= 10 V, RL = 1 Ω
DD
= 4.5 V, Rg = 1 Ω
GEN
TC = 25 °C
IS = 3 A
IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C
30 V
27
- 4.4
mV/°C
1.2 2.5 V
± 100 nA
1
10
30 A
0.0061 0.0075
0.0077 0.0095
46 S
1117
274
80
21 32
9.5 14.5
2.8
2.8
816
10 20
17 34
816
16 32
11 22
18 36
918
30
60
0.75 1.1 V
22 40 ns
15.5 28 nC
14
8
µA
Ω
pFOutput Capacitance
nC
ns
A
ns
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Document Number: 64987
S09-1093-Rev. A, 15-Jun-09
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
SiR428DP
Vishay Siliconix
60
VGS=10V thru 4 V
48
36
24
- Drain Current (A)I
D
12
0
0.0 0.5 1.0 1.5 2.0 2.5
V
- Drain-to-Source Voltage (V)
DS
Output Characteristics
0.010
0.009
W)
0.008
VGS=4.5V
VGS=3V
10
8
6
4
- Drain Current (A)I
D
2
0
TC= 125 °C
TC=25 °C
TC=--55 °C
012345
V
- Gate-to-Source Voltage (V)
GS
Transfer Characteristics
1500
C
1200
900
iss
0.007
- On-Resistance (R
DS(on)
0.006
0.005 0 12243648 60
ID- Drain Current (A)
On-Resistance vs. Drain Current and Gate Voltage
10
ID=10A
8
VDS=10V
6
VDS=15V
4
- Gate-to-Source Voltage (V)
GS
2
V
0
0.0 4.4 8.8 13.2 17.6 22.0
Qg- Total Gate Charge (nC)
VDS=20V
Gate Charge
VGS=10V
600
C
C - Capacitance (pF)
300
C
rss
0
0 6 12 18 24 30
oss
VDS - Drain-to-Source Voltage (V)
Capacitance
1.7
ID=10A
1.5
VGS=10V
1.3
- On-Resistance
(Normalized)
1.1
DS(on)
R
0.9
0.7
- 50 - 25 0 25 50 75 100 125 150
TJ- Junction Temperature (°C)
VGS=4.5V
On-Resistance vs. Junction Temperature
Document Number: 64987 S09-1093-Rev. A, 15-Jun-09
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